JP2006318739A - Device of manufacturing display device - Google Patents

Device of manufacturing display device Download PDF

Info

Publication number
JP2006318739A
JP2006318739A JP2005139647A JP2005139647A JP2006318739A JP 2006318739 A JP2006318739 A JP 2006318739A JP 2005139647 A JP2005139647 A JP 2005139647A JP 2005139647 A JP2005139647 A JP 2005139647A JP 2006318739 A JP2006318739 A JP 2006318739A
Authority
JP
Japan
Prior art keywords
substrate
substrates
manufacturing apparatus
melt
connection material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005139647A
Other languages
Japanese (ja)
Other versions
JP4734023B2 (en
Inventor
Tsutae Shinoda
傳 篠田
Hiroshi Kajiyama
博司 梶山
Takashi Nishio
▲隆▼ 西尾
Toshiharu Kurauchi
倉内　　利春
Hisahiro Terasawa
寿浩 寺澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2005139647A priority Critical patent/JP4734023B2/en
Publication of JP2006318739A publication Critical patent/JP2006318739A/en
Application granted granted Critical
Publication of JP4734023B2 publication Critical patent/JP4734023B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a plasma display panel in a short time. <P>SOLUTION: A fused matter 32 of a connecting material 31 is arranged along edges of substrates 11, 21 on stuck-out parts 17, 27 of the first and the second substrates 11, 21, and the fused matter 32 is pulled in between the first and the second substrates 11, 21 by capillary force. If laser light 35 is used for fusion of the connecting material 31, the connecting material 31 is fused not only in a short time, but, only a limited range rises high in temperature around the irradiated position 36, not a whole part of a first and a second panels 10, 20 heated, so that there is little contaminated gas generated, and no time is needed for a degassing process of the contaminated gas. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明はＰＤＰやＦＥＤのような表示装置を製造する製造装置に関する。   The present invention relates to a manufacturing apparatus for manufacturing a display device such as a PDP or FED.

従来より、ＰＤＰ(Plasma Display Panel)やＦＥＤ(Field Emission Display)のような表示装置の製造には、２枚のパネルを接続材料で固定する方法が採用されている。   Conventionally, a method of fixing two panels with a connecting material has been adopted for manufacturing a display device such as a plasma display panel (PDP) or a field emission display (FED).

従来技術の表示装置の製造方法の一例について説明すると、先ず、第一、第二のパネルのうち、いずれか一方のパネルの基板表面に、接続材料をリング状に配置する。   An example of a conventional method for manufacturing a display device will be described. First, a connection material is arranged in a ring shape on the substrate surface of one of the first and second panels.

第一のパネルには隔壁が形成されており、接続材料の高さは、隔壁の高さよりも高いので、第一、第二のパネルを重ね合わせると、一方のパネル上の接続材料に、他方のパネルが載せられる。第一、第二のパネルを重ね合わせた状態で、全体を加熱しながら押圧すると、接続材料が加熱によって溶融し、押圧によって溶融した接続材料が第一、第二の基板の両方の表面に密着した状態で押しつぶされる。   A partition is formed on the first panel, and the height of the connection material is higher than the height of the partition. Therefore, when the first and second panels are overlapped, the connection material on one panel becomes the other. Panel is placed. When the whole is pressed while heating the first and second panels, the connecting material melts by heating, and the connecting material melted by pressing adheres to both surfaces of the first and second substrates. It is crushed in the state.

接続材料が押しつぶされ、接続材料の高さが隔壁と、第二のパネルの表面が第一のパネルの隔壁に密着し、第二のパネルが隔壁に載せられた状態になり、全体を冷却し、接続材料の温度を下げると接続材料が第一、第二の基板の表面に密着した状態で固化し、第一、第二のパネルの間の空間をリング状に取り囲む固化物が形成される。   The connecting material is crushed, the height of the connecting material is the partition wall, the surface of the second panel is in close contact with the partition wall of the first panel, the second panel is placed on the partition wall, and the whole is cooled When the temperature of the connection material is lowered, the connection material is solidified in close contact with the surfaces of the first and second substrates, and a solidified material is formed that surrounds the space between the first and second panels in a ring shape. .

第一、第二のパネルを加熱する時に、第一、第二のパネルの温度を急激に上昇させると、第一、第二のパネルに熱膨張に伴う歪みが生じ、その内部回路が破損する場合がある。従って、従来の製造方法では、第一、第二のパネルの加熱を長時間かけて接続材料が溶融する温度まで昇温させる必要があり、生産時間の増加と、加熱に要するエネルギーの量が問題であった。   When the first and second panels are heated rapidly when the first and second panels are heated, the first and second panels are distorted due to thermal expansion, and the internal circuit is damaged. There is a case. Therefore, in the conventional manufacturing method, it is necessary to heat the first and second panels to a temperature at which the connection material melts over a long period of time, which increases the production time and the amount of energy required for heating. Met.

上記接続方法では、接続材料をリング状に配置する容易性から有機材料が含有された接続材料が用いられるが、そのような接続材料は加熱されると有機材料が熱分解して汚染ガスが発生する。また、上記製造方法では接続材料以外も昇温するため、昇温によって他の部材（例えば第一、第二のパネル）から、Ｈ2Ｏガス、ＣＯガス、ＣＯ2ガス等の汚染ガスが発生することがあり、その汚染ガスがプラズマディスプレイパネルの性能に悪影響を与える。従って、従来のプラズマディスプレイパネルでは、加熱終了後に、汚染ガスを除去する脱ガスの工程が必要であり、その脱ガスの工程も生産時間が増加する要因であった。
特開２０００−５１０２８１号公報 特開２００２−０７５１９７号公報 特開２００２−２６５２３７号公報 In the above connection method, a connection material containing an organic material is used because of the ease of arranging the connection material in a ring shape. When such a connection material is heated, the organic material is thermally decomposed to generate a pollutant gas. To do. In the above manufacturing method, the temperature of materials other than the connecting material is also raised, so that polluted gases such as H 2 O gas, CO gas, and CO 2 gas are generated from other members (for example, the first and second panels) due to the temperature rise. The contaminated gas may adversely affect the performance of the plasma display panel. Therefore, in the conventional plasma display panel, a degassing process for removing the pollutant gas is necessary after the heating is completed, and the degassing process is a factor that increases the production time.
JP 2000-510281 A JP 2002-075197 JP 2002-265237 A

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、表示装置を短時間で汚染させずに製造することである。   The present invention was created in order to solve the above-described disadvantages of the prior art, and an object thereof is to manufacture a display device in a short time without being contaminated.

上記課題を解決するために請求項１記載の発明は、第一のパネルの第一の基板と、第二のパネルの第二の基板とが、間隔保持部材を挟んで、前記第一、第二の基板の一方を他方からはみ出して重ね合わされ、前記第一、第二の基板の間に位置する表示範囲が外部雰囲気から遮断された表示装置を製造する製造装置であって、前記第一、第二の基板を前記間隔保持部材を挟んで重ね合わせた時に、前記第一、第二の基板のうち、一方の基板表面の他方の基板の縁からはみ出したはみ出し部分上に、前記他方の基板の縁に沿って接続材料を供給する供給手段と、前記はみ出し部分上に供給された前記接続材料を溶融させる加熱手段とを有する製造装置である。
請求項２記載の発明は、第一のパネルの第一の基板と、第二のパネルの第二の基板とが、前記第一の基板の縁の少なくとも一部と、前記第二の基板の縁の少なくとも一部が、互いにはみ出ないように揃えられた状態で、間隔保持部材を挟んで重ね合わされ、前記第一、第二の基板の間に位置する表示装置が外部雰囲気から遮断された表示装置を製造する製造装置であって、前記第一、第二の基板を重ね合わせた時に、前記第一、第二の基板の揃えられた前記縁に接続材料を供給する供給手段と、前記縁に供給された前記接続材料を溶融させる加熱手段とを有する製造装置である。
請求項３記載の発明は、請求項１又は請求項２のいずれか１項記載の製造装置であって、前記加熱手段は、固体の前記接続材料にレーザー光を照射し、前記溶融物を生成するように構成された製造装置である。
請求項４記載の発明は、請求項３記載の製造装置であって、前記接続材料は棒状であって、前記加熱手段は前記接続材料の先端に前記レーザー光を照射させるように構成された製造装置である。
請求項５記載の発明は、請求項３記載の製造装置であって、前記供給手段は粉体の前記接続材料を噴射するノズルを有し、前記加熱手段は、前記ノズルから噴射される前記接続材料に前記レーザー光を照射するように構成された製造装置である。
請求項６記載の発明は、請求項３乃至請求項５のいずれか１項記載の製造装置であって、前記加熱手段は、前記はみ出し部分と、前記他方の基板の縁のいずれか一方又は両方にレーザー光を照射して昇温させ、前記供給手段は、前記はみ出し部分の昇温した部分と、前記他方の基板の縁の昇温した部分のいずれか一方又は両方に固体の前記接続材料を接触させるように構成された製造装置である。
請求項７記載の発明は、請求項６記載の製造装置であって、前記接続材料は棒状であって、前記供給手段は前記接続材料の先端を前記昇温した部分に接触させるように構成された製造装置である。
請求項８記載の発明は、請求項６記載の製造装置であって、前記接続材料は粉体であって、前記供給手段は前記接続材料を前記ノズルから前記昇温した部分に向けて噴射するように構成された製造装置である。
請求項９記載の発明は、前記第一の基板の前記第二の基板からはみ出した部分上に前記溶融物を供給した後、前記第二の基板の前記第一の基板からはみ出した部分上に前記溶融物を供給する請求項１乃至請求項８のいずれか１項記載の製造装置であって、前記第二の基板上への前記溶融物の供給は、前記第二の基板上の前記第一の基板に供給された前記溶融物に接触する位置から、前記第一の基板の縁に沿って前記溶融物を供給可能に構成された製造装置である。
請求項１０記載の発明は、請求項１乃至請求項８のいずれか１項記載の製造装置であって、前記第一の基板の前記第二の基板からはみ出した部分上に前記溶融物を供給すると同時に、前記第二の基板の前記第一の基板からはみ出した部分上に前記溶融物を供給可能に構成された製造装置である。 In order to solve the above-mentioned problem, in the first aspect of the present invention, the first substrate of the first panel and the second substrate of the second panel sandwich the spacing member, and A manufacturing apparatus for manufacturing a display device in which one of the two substrates protrudes from the other and is overlapped, and the display range located between the first and second substrates is blocked from the external atmosphere, When the second substrate is overlapped with the spacing member interposed therebetween, the other substrate on the protruding portion of the first and second substrates that protrudes from the edge of the other substrate on the one substrate surface. And a heating means for melting the connecting material supplied on the protruding portion.
According to a second aspect of the present invention, the first substrate of the first panel and the second substrate of the second panel include at least a part of an edge of the first substrate and the second substrate. A display in which at least a part of the edges are aligned so as not to protrude from each other, and the display device located between the first and second substrates is shielded from the external atmosphere with the spacing member interposed therebetween. A manufacturing apparatus for manufacturing an apparatus, wherein when the first and second substrates are overlapped, supply means for supplying a connection material to the aligned edges of the first and second substrates, and the edge And a heating means for melting the connecting material supplied to the manufacturing apparatus.
Invention of Claim 3 is a manufacturing apparatus of any one of Claim 1 or Claim 2, Comprising: The said heating means irradiates the solid said connection material with a laser beam, and produces | generates the said melt It is the manufacturing apparatus comprised so that.
Invention of Claim 4 is a manufacturing apparatus of Claim 3, Comprising: The said connection material is rod shape, The said heating means is comprised so that the said laser beam may be irradiated to the front-end | tip of the said connection material Device.
Invention of Claim 5 is a manufacturing apparatus of Claim 3, Comprising: The said supply means has a nozzle which injects the said connection material of powder, The said heating means is the said connection injected from the said nozzle A manufacturing apparatus configured to irradiate a material with the laser beam.
Invention of Claim 6 is a manufacturing apparatus of any one of Claim 3 thru | or 5, Comprising: The said heating means is either one or both of the said protrusion part and the edge of said other board | substrate. The supply means is configured to apply the solid connection material to one or both of the heated portion of the protruding portion and the heated portion of the edge of the other substrate. A manufacturing device configured to contact.
A seventh aspect of the present invention is the manufacturing apparatus according to the sixth aspect, wherein the connecting material is rod-shaped, and the supply means is configured to bring the tip of the connecting material into contact with the heated portion. Manufacturing equipment.
Invention of Claim 8 is a manufacturing apparatus of Claim 6, Comprising: The said connection material is powder, The said supply means injects the said connection material toward the said temperature rising part from the said nozzle. It is the manufacturing apparatus comprised as follows.
According to the ninth aspect of the present invention, the molten material is supplied onto the portion of the first substrate that protrudes from the second substrate, and then the portion of the second substrate that protrudes from the first substrate. 9. The manufacturing apparatus according to claim 1, wherein the melt is supplied onto the second substrate by supplying the melt on the second substrate. 10. The manufacturing apparatus is configured to be able to supply the melt along an edge of the first substrate from a position in contact with the melt supplied to one substrate.
Invention of Claim 10 is a manufacturing apparatus of any one of Claim 1 thru | or 8, Comprising: The said melt is supplied on the part which protruded from said 2nd board | substrate of said 1st board | substrate. At the same time, the manufacturing apparatus is configured such that the melt can be supplied onto a portion of the second substrate that protrudes from the first substrate.

本発明は、第一、第二のパネルの全体を加熱せず、接続材料を第一、第二の基板のいずれかに接触させながら溶融する場合であっても、限られた領域しか昇温させず、また、無機材料のみからなる接続材料を用いることができるので、第一、第二の基板を貼り合せる工程で、汚染ガスの発生量が少なく、脱ガス工程が不要、又は脱ガス工程を行う場合であっても、その工程に要する時間が短くてすむ。   The present invention does not heat the entire first and second panels, and raises the temperature only in a limited region even when the connection material is melted while being in contact with either the first or second substrate. In addition, since a connection material made only of an inorganic material can be used, in the process of bonding the first and second substrates, the generation amount of pollutant gas is small and the degassing process is unnecessary, or the degassing process Even if it is performed, the time required for the process can be shortened.

図１の符号１は表示装置の一例であるプラズマディスプレイパネルを示しており、プラズマディスプレイパネル１は第一、第二のパネル１０、２０を有している。第一、第二のパネル１０、２０は第一、第二の基板１１、２１と、前記第一、第二の基板１１、２１表面上にそれぞれ配置された第一、第二の電極（ここでは不図示）とを有している。   Reference numeral 1 in FIG. 1 indicates a plasma display panel which is an example of a display device. The plasma display panel 1 includes first and second panels 10 and 20. The first and second panels 10 and 20 include first and second substrates 11 and 21 and first and second electrodes (here, respectively) disposed on the surfaces of the first and second substrates 11 and 21. (Not shown).

第一のパネル１０は更に、第一の基板１１の表面上に形成された複数の隔壁１５を有しており、第二の基板２１は第一の基板１１の間隔保持部材（隔壁）１５が形成された面上に載せられている。   The first panel 10 further includes a plurality of partition walls 15 formed on the surface of the first substrate 11, and the second substrate 21 includes a spacing member (partition wall) 15 for the first substrate 11. It is placed on the formed surface.

隔壁１５は少なくとも先端が第一のパネル１０の表面で露出しており、隔壁１５の先端は、第二のパネル２０の第二の基板２１上に露出する面（例えば、第二の基板２１表面や、第二の電極表面や、第二の基板２１上の保護膜表面）に接触している。   At least the tip of the partition wall 15 is exposed on the surface of the first panel 10, and the tip of the partition wall 15 is a surface exposed on the second substrate 21 of the second panel 20 (for example, the surface of the second substrate 21). Or the surface of the second electrode or the surface of the protective film on the second substrate 21).

隔壁１５の先端は、第一のパネル１０表面に露出する他の表面（例えば第一の基板１１表面や、第一の電極の表面や、保護膜の表面）よりも高く突き出されているので、第二の基板２１は隔壁１５が高く突き出された分だけ持ち上げられ、第一、第二の基板１１、２１の間には間隙が形成されている。   Since the tip of the partition wall 15 protrudes higher than other surfaces exposed on the surface of the first panel 10 (for example, the surface of the first substrate 11, the surface of the first electrode, and the surface of the protective film), The second substrate 21 is lifted by the amount by which the partition wall 15 protrudes high, and a gap is formed between the first and second substrates 11 and 21.

隔壁１５と隔壁１５との間の空間には放電ガスが充填されており、第一、第二の電極に電圧を印加すると、電圧が印加された第一、第二の電極の間の領域（発光領域）で放電ガスがプラズマ化して励起光（例えば紫外線）が発生し、発光領域に配置された蛍光体材料に励起光が当たって可視光が発生する。   The space between the barrier ribs 15 is filled with a discharge gas. When a voltage is applied to the first and second electrodes, a region between the first and second electrodes to which the voltage is applied ( In the emission region), the discharge gas is turned into plasma and excitation light (for example, ultraviolet rays) is generated, and excitation light strikes the phosphor material disposed in the emission region to generate visible light.

隔壁１５と隔壁１５との間の空間は第二のパネル２０で蓋をされており、所望の発光領域で放電ガスをプラズマ化させる時には、隔壁１５を挟んで隣接する発光領域にはプラズマが伝わらないので、所望の発光領域だけから可視光を発生させることができる。   The space between the barrier ribs 15 is covered with a second panel 20, and when the discharge gas is turned into plasma in a desired light emitting region, the plasma is transmitted to the adjacent light emitting regions across the barrier rib 15. Therefore, visible light can be generated only from a desired light emitting region.

第一、第二の基板１１、２１のうち、少なくとも一方は透明基板で構成されているので、発光領域で発生した可視光は、透明基板を通って外部に放出される。従って、所望の発光領域だけを発光させることで、このプラズマディスプレイパネル１は図形や文字等の画像情報を表示することができる。   Since at least one of the first and second substrates 11 and 21 is made of a transparent substrate, visible light generated in the light emitting region is emitted to the outside through the transparent substrate. Therefore, the plasma display panel 1 can display image information such as figures and characters by emitting light only in a desired light emitting region.

図１の符号１９は、第一、第二の基板１１、２１との間の空間のうち、発光領域が配置された範囲である表示範囲を示している。表示範囲１９の周囲にはリング状の封止部材３３が配置されており、表示範囲１９は封止部材３３と第一、第二の基板１１、２１とで取り囲まれ、表示範囲１９に外部雰囲気の大気が浸入しないようになっている。   Reference numeral 19 in FIG. 1 indicates a display range that is a range in which a light emitting region is arranged in a space between the first and second substrates 11 and 21. A ring-shaped sealing member 33 is disposed around the display range 19. The display range 19 is surrounded by the sealing member 33 and the first and second substrates 11 and 21, and the display range 19 has an external atmosphere. The atmosphere does not enter.

第一、第二の基板１１、２１は少なくとも一部分が封止部材３３よりも外側にはみ出し、そのはみ出した部分の表面には接続端子が露出している。接続端子は第一、第二の電極に接続されているので、第一、第二の電極に電圧を印加するため、接続端子に外部回路の端子を接続すれば、外部回路の電圧を電極に印加することができる。   At least a part of the first and second substrates 11 and 21 protrudes outside the sealing member 33, and a connection terminal is exposed on the surface of the protruding part. Since the connection terminal is connected to the first and second electrodes, in order to apply a voltage to the first and second electrodes, if the terminal of the external circuit is connected to the connection terminal, the voltage of the external circuit is applied to the electrode. Can be applied.

次に、このプラズマディスプレイパネル１を製造する工程の一例について説明する。第一の基板１０の隔壁１５が配置された側の面を上側に向けて配置し、第二のパネル２０の電極が配置された側の面を下側に向けた状態で第一のパネル１０上に配置し、第一の基板１１の表面の接続端子が露出する部分が第二の基板２１から露出し、第二の基板２１の表面の接続端子が露出する部分が第一の基板１１から露出するように位置合わせをし、第二のパネル２０を第一のパネル１０上に載せる。   Next, an example of a process for manufacturing the plasma display panel 1 will be described. The first panel 10 is arranged with the surface of the first substrate 10 on which the partition wall 15 is disposed facing upward, and the surface of the second panel 20 on which the electrode is disposed is directed downward. The portion where the connection terminal on the surface of the first substrate 11 is exposed is exposed from the second substrate 21, and the portion where the connection terminal on the surface of the second substrate 21 is exposed is from the first substrate 11. The second panel 20 is placed on the first panel 10 after being aligned so as to be exposed.

図２の符号１７は第一の基板１１の表面のうち、第二の基板２１の外周よりも外側に位置するはみ出し部分を示し、同図の符号２７は第二の基板２１の表面の第一の基板１１の外周よりも外側に位置するはみ出し部分を示している。   Reference numeral 17 in FIG. 2 indicates a protruding portion located outside the outer periphery of the second substrate 21 in the surface of the first substrate 11, and reference numeral 27 in FIG. 2 indicates the first of the surface of the second substrate 21. The protrusion part located in the outer side rather than the outer periphery of the board | substrate 11 is shown.

ここでは、第一の基板１１のはみ出し部分１７が上側に向けられており、そのはみ出し部分１７上に製造装置の加熱手段（ここでは不図示）を配置する。
はみ出し部分１７の第二の基板２１の縁２８の真下位置と、はみ出し部分１７の第二の基板２１の縁２８よりも外側の位置と、第二の基板２１の縁２８のはみ出し部分１７上の位置と、第一の基板１１表面の縁２８よりも内側の位置の、いずれかに光軸が当たるように加熱手段の光源からレーザー光３５を照射する。 Here, the protruding portion 17 of the first substrate 11 is directed upward, and heating means (not shown here) of the manufacturing apparatus is disposed on the protruding portion 17.
The position immediately below the edge 28 of the second substrate 21 of the protruding portion 17, the position outside the edge 28 of the second substrate 21 of the protruding portion 17, and the protruding portion 17 of the edge 28 of the second substrate 21. The laser light 35 is irradiated from the light source of the heating means so that the optical axis hits either the position or a position inside the edge 28 on the surface of the first substrate 11.

レーザー光３５は光軸が当たる部分だけでなく、光軸が当たる位置が最も照射強度が高いが、その周囲にも照射されるので、光軸の当たる部分の周囲も昇温する。従って、上記いずれの位置に光軸を当てた場合でも、レーザー光３５は、はみ出し部分１７と第二の基板２１の縁２８の両方に照射され、結局、はみ出し部分１７と第二の基板２１の縁２８の両方が昇温する。   The laser light 35 has the highest irradiation intensity not only at the portion where the optical axis hits, but also at the position where the optical axis hits. Therefore, even when the optical axis is applied to any of the above positions, the laser beam 35 is irradiated to both the protruding portion 17 and the edge 28 of the second substrate 21, and eventually, the protruding portion 17 and the second substrate 21. Both edges 28 rise in temperature.

図３の符号３１は棒状に成形された接続材料を示している。接続材料３１は熱伝導によってもレーザー光３５の照射によっても溶融するので、接続材料３１の先端をレーザー光３５で昇温した部分に接触させた場合もその先端部分が溶融し、接続材料３１の先端をレーザー光３５が照射される場所に配置した場合もその先端部分が溶融する。   Reference numeral 31 in FIG. 3 indicates a connecting material formed into a rod shape. Since the connection material 31 is melted by heat conduction or by irradiation with the laser beam 35, even when the tip of the connection material 31 is brought into contact with the portion heated by the laser beam 35, the tip of the connection material 31 is melted. Even when the tip is disposed at a place where the laser beam 35 is irradiated, the tip is melted.

接続材料３１は製造装置の供給手段（ここでは不図示）に保持されており、接続材料３１の先端がはみ出し部分１７と第二の基板２１の縁２８の両方に接触し、その溶融物がはみ出し部分１７と第二の基板２１の縁２８の両方に接触するように供給手段を設定すれば、第一、第二の基板１１、２１の間は狭いので、毛細管現象によって溶融物は第一、第二の基板１１、２１の間に引き込まれる（図４）。   The connecting material 31 is held by a supply means (not shown here) of the manufacturing apparatus, and the tip of the connecting material 31 comes into contact with both the protruding portion 17 and the edge 28 of the second substrate 21, and the molten product protrudes. If the supply means is set so as to contact both the portion 17 and the edge 28 of the second substrate 21, the gap between the first and second substrates 11, 21 is narrow, so that the melt is first, It is drawn between the second substrates 11 and 21 (FIG. 4).

接続材料３１の先端が、第二の基板２１の縁２８だけに接触する場合、又は、はみ出し部分１７だけに接触する場合であっても、その溶融物の底面がはみ出し部分１７に接触し、溶融物の上部が第二の基板２１の縁２８に接触すれば、溶融物が第一、第二の基板１１、２１の間に引き込まれる。   Even when the tip of the connecting material 31 contacts only the edge 28 of the second substrate 21 or only the protruding portion 17, the bottom surface of the melt contacts the protruding portion 17 and melts. If the top of the object contacts the edge 28 of the second substrate 21, the melt is drawn between the first and second substrates 11, 21.

尚、溶融物の上部を第二の基板２１の縁２８に接触させるためには、溶融物３２の底面の一部が第一、第二の基板１１、２１の間に位置するように接続材料３１の先端位置を設定し、溶融物３２の上端の高さが第二の基板２１の表面よりも高くなるように、接続材料３１を溶融させる量を設定すればよい。   In order to bring the upper part of the melt into contact with the edge 28 of the second substrate 21, the connecting material is such that a part of the bottom surface of the melt 32 is located between the first and second substrates 11 and 21. The tip position of 31 is set, and the amount by which the connecting material 31 is melted may be set so that the upper end height of the melt 32 is higher than the surface of the second substrate 21.

図５の符号３６はレーザー光３５の光軸が当たる位置である照射位置を示しており、レーザー光３５を連続的又は断続的に照射させながら、照射位置３６が第二の基板２１の縁２８に沿って、はみ出し部分１７上の所定の開始位置から所定の停止位置まで移動させ、先端が照射位置３６の移動に追従するように接続材料３１を移動させる。   Reference numeral 36 in FIG. 5 indicates an irradiation position that is the position where the optical axis of the laser beam 35 hits. The irradiation position 36 is irradiated on the edge 28 of the second substrate 21 while the laser beam 35 is irradiated continuously or intermittently. , The connecting material 31 is moved so that the tip follows the movement of the irradiation position 36 from the predetermined start position on the protruding portion 17 to the predetermined stop position.

具体的には、レーザー光３５の照射により接続材料３１を溶融させる場合には、接続材料３１の先端にレーザー光３５が照射されるように加熱手段を設定し、照射位置３６の移動に接続材料３１を追従するように保持手段を第一、第二の基板１１、２１に対して相対的に移動させれば、移動方向に沿って溶融物３２が次々形成される。   Specifically, when the connection material 31 is melted by irradiation with the laser beam 35, a heating means is set so that the tip of the connection material 31 is irradiated with the laser beam 35, and the connection material is moved to move the irradiation position 36. If the holding means is moved relative to the first and second substrates 11 and 21 so as to follow 31, the melt 32 is successively formed along the moving direction.

また、照射位置３６よりも停止位置側は昇温していないので、熱伝導により接続材料３１を溶融させる場合には、接続材料３１の先端を、照射位置３６又は照射位置３６よりも開始位置側で、照射位置３６の移動に追従させれば、移動方向に沿って溶融物３２が次々形成される。   Further, since the temperature at the stop position side from the irradiation position 36 is not raised, when the connection material 31 is melted by heat conduction, the tip of the connection material 31 is placed at the start position side from the irradiation position 36 or the irradiation position 36. Thus, if the movement of the irradiation position 36 is followed, the melt 32 is formed one after another along the movement direction.

溶融物３２が第一、第二の基板１１、２１の間に新たに引き込まれる場所を供給場所とすると、供給場所よりも上記開始位置側には、既に溶融物３２が第一、第二の基板１１、２１の間に引き込まれているので、新たに引き込まれた溶融物３２と、既に引き込まれた溶融物３２とが一体化し、第一、第二の基板１１、２１の間に連続する溶融物３２が形成される。   When a place where the melt 32 is newly drawn between the first and second substrates 11 and 21 is a supply place, the melt 32 is already on the start position side from the supply place. Since it has been drawn between the substrates 11 and 21, the newly drawn melt 32 and the already drawn melt 32 are integrated and are continuous between the first and second substrates 11 and 21. A melt 32 is formed.

照射位置３６がはみ出し部分１７上の所定の停止位置に達したところで、レーザー光３５の照射を停止し、溶融物３２の供給を停止する。
ここでは、第一の基板１１は互いに対向する２つの端部が第二の基板２１の縁２８からはみ出し、第一の基板１１の表面にはみ出し部分１７が２つ形成されており、第一、第二の基板１１、２１を互いに固定した状態で、第一、第二の基板１１、２１と光源とを相対的に移動させ、他方のはみ出し部分１７上に光源を位置させた後、上述した工程で他方のはみ出し部分１７上に連続する溶融物３２を形成する。 When the irradiation position 36 reaches a predetermined stop position on the protruding portion 17, the irradiation of the laser beam 35 is stopped and the supply of the melt 32 is stopped.
Here, the first substrate 11 has two opposite ends protruding from the edge 28 of the second substrate 21, and two protruding portions 17 are formed on the surface of the first substrate 11. In the state where the second substrates 11 and 21 are fixed to each other, the first and second substrates 11 and 21 and the light source are relatively moved, the light source is positioned on the other protruding portion 17, and then the above-mentioned. In the process, a continuous melt 32 is formed on the other protruding portion 17.

図６は第一の基板１１の２つのはみ出し部分１７にそれぞれ溶融物３２が供給された状態を示している。ここでは、第一、第二の基板１１、２１は長方形であって、第一、第二の基板１１、２１は長手方向の両端部が他方の基板の長辺からはみ出すように交差して重なり合っている。   FIG. 6 shows a state in which the melt 32 is supplied to the two protruding portions 17 of the first substrate 11. Here, the first and second substrates 11 and 21 are rectangular, and the first and second substrates 11 and 21 intersect and overlap so that both ends in the longitudinal direction protrude from the long side of the other substrate. ing.

従って、第一、第二の基板１１、２１が重なり合った時の投影図では、第一、第二の基板１１、２１の外周が４つの交点Ｃで交わり、１つのはみ出し部分１７、２７は、他方の基板１１、２１の２つのはみ出し部分１７、２７とそれぞれ交点Ｃで接する。   Therefore, in the projection view when the first and second substrates 11 and 21 overlap, the outer peripheries of the first and second substrates 11 and 21 intersect at four intersections C, and one protruding portion 17 and 27 is The two protruding portions 17 and 27 of the other substrate 11 and 21 are in contact with each other at an intersection C.

ここでは、上記供給場所は第一の基板１１の各はみ出し部分１７上を一方の交点Ｃから他方の交点Ｃまで移動し、その結果溶融物３２は、一端が一方の交点Ｃに到達し、他端が他方の交点Ｃに到達するように形成されている。従って、第二の基板２１の各はみ出し部分２７には、交点Ｃに第一の基板１１の２つのはみ出し部分１７上の溶融物３２の一端部がそれぞれ位置している。   Here, the supply location moves on each protruding portion 17 of the first substrate 11 from one intersection C to the other intersection C. As a result, one end of the melt 32 reaches one intersection C, and the other. The end is formed so as to reach the other intersection C. Therefore, one end portion of the melt 32 on the two protruding portions 17 of the first substrate 11 is located at the intersection C in each protruding portion 27 of the second substrate 21.

第一、第二の基板１１、２１を相対的に固定した状態で、第二の基板２１の表面を上側に向け、そのはみ出し部分２７を光源に向ける。
上述したように、はみ出し部分２７の交点Ｃには溶融物３２の端部が位置しているので、はみ出し部分２７の１交点Ｃの近傍を開始位置としてレーザー光３５の照射を開始すると共に、接続材料３１の先端を溶融させ、交点Ｃで第一、第二の基板１１、２１の間に溶融物を引き込ませると、引き込まれた溶融物３２は、既に引き込まれた溶融物３２の端部に接触する。 In a state where the first and second substrates 11 and 21 are relatively fixed, the surface of the second substrate 21 faces upward, and the protruding portion 27 faces the light source.
As described above, since the end of the melt 32 is located at the intersection C of the protruding portion 27, the irradiation of the laser beam 35 is started with the vicinity of one intersection C of the protruding portion 27 as a starting position, and the connection is established. When the tip of the material 31 is melted and the melt is drawn between the first and second substrates 11 and 21 at the intersection C, the drawn melt 32 is at the end of the already drawn melt 32. Contact.

既に引き込まれた溶融物３２は溶融状態ではなく、固体状態の場合もありうるが、交点Ｃの近傍にレーザー光３５が照射されると、その交点Ｃに位置する端部は軟化又は溶融するので、新たに引き込まれた溶融物３２は、既に引き込まれた溶融物３２の端部に接続され、一体化する。   The melt 32 that has already been drawn may be in a solid state rather than in a molten state, but when the laser beam 35 is irradiated in the vicinity of the intersection C, the end located at the intersection C is softened or melted. The newly drawn melt 32 is connected to and integrated with the end of the already drawn melt 32.

はみ出し部分２７上を第一の基板１１の縁１８に沿って供給場所を移動させ、他方の交点Ｃまで溶融物３２を供給すると、既に引き込まれた溶融物３２と接続された連続する溶融物３２が形成され、更に、他方の交点Ｃまで供給場所を移動すると、溶融物３２はその交点Ｃで既に引き込まれた他の溶融物３２の端部にも接続されて一体化し、コの字状の溶融物３２が形成される。   When the supply location is moved on the protruding portion 27 along the edge 18 of the first substrate 11 and the melt 32 is supplied to the other intersection C, the continuous melt 32 connected to the already drawn melt 32 is provided. When the supply location is moved to the other intersection C, the melt 32 is connected to the end of the other melt 32 already drawn at the intersection C, and is integrated. A melt 32 is formed.

レーザー光３５の照射を終了後、第一、第二の基板１１，２１を相対的に固定した状態で、第一、第二の基板１１、２１と光源とを相対的に移動させ、第二の基板２１の他方のはみ出し部分２７を光源に向ける。上述した工程で、そのはみ出し部分２７の一方の交点Ｃから他方の交点Ｃまで溶融物３２を供給すると、新たに供給された溶融物３２の両端がコの字状の溶融物３２と接続されて一体化し、結局、重なり部分の全外周を取り囲むリング状の溶融物３２が形成されている。   After the irradiation of the laser beam 35 is completed, the first and second substrates 11 and 21 and the light source are relatively moved while the first and second substrates 11 and 21 are relatively fixed, and the second The other protruding portion 27 of the substrate 21 is directed to the light source. In the above-described process, when the melt 32 is supplied from one intersection C of the protruding portion 27 to the other intersection C, both ends of the newly supplied melt 32 are connected to the U-shaped melt 32. As a result, a ring-shaped melt 32 surrounding the entire outer periphery of the overlapping portion is formed.

上述したように、溶融物３２の上端と底面はそれぞれ第一、第二の基板１１、２１に密着しているので、第一、第２の基板１１、２１の間の空間は、第一、第二の基板１１、２１の表面と溶融物３２とで取り囲まれている。   As described above, since the upper end and the bottom surface of the melt 32 are in close contact with the first and second substrates 11 and 21, respectively, the space between the first and second substrates 11 and 21 is the first, It is surrounded by the surface of the second substrate 11, 21 and the melt 32.

その状態で、溶融物３２の温度が下がると溶融物３２が第一、第二の基板１１、２１の表面に密着した状態で固化し、第一、第二のパネル１０、２０は、第一、第二の基板１１、２１の間の空間が固化物３３で取り囲まれた状態で、固化物３３で固定される（図７）。   In this state, when the temperature of the melt 32 is lowered, the melt 32 is solidified in close contact with the surfaces of the first and second substrates 11 and 21, and the first and second panels 10 and 20 are In the state where the space between the second substrates 11 and 21 is surrounded by the solidified material 33, the substrate is fixed by the solidified material 33 (FIG. 7).

第一、第二の基板１１、２１の間の空間に上記放電ガスを配置すれば、上述したプラズマディスプレイパネル１が得られる。放電ガスの封止方法としては、例えば、放電ガスが充填された真空槽内部に第一、第二のパネル１０、２０を搬入して、第一、第二のパネル１０、２０を放電ガス雰囲気に置き、上述した工程で溶融物３２を供給し、固化物３３で第一、第二のパネル１０、２０を固定する工程を放電ガス雰囲気で行えば、第一、第二の基板１１、２１の間の空間は放電ガスが充填された状態で外部からから遮断される。   If the discharge gas is disposed in the space between the first and second substrates 11 and 21, the above-described plasma display panel 1 is obtained. As a discharge gas sealing method, for example, the first and second panels 10 and 20 are carried into a vacuum chamber filled with a discharge gas, and the first and second panels 10 and 20 are placed in a discharge gas atmosphere. If the step of supplying the melt 32 in the above-described process and fixing the first and second panels 10 and 20 with the solidified product 33 in the discharge gas atmosphere is performed, the first and second substrates 11 and 21 are performed. The space between is blocked from the outside in a state filled with the discharge gas.

また、他の方法としては、第一、第二の基板１１、２１のいずれか一方又は両方に、表面から裏面までを貫通する貫通孔３８を設けておき、上述した工程で、リング状の固化物３３を形成した後、貫通孔３８を通して第一、第二の基板１１、２１の間の空間に放電ガスを供する。第一、第二の基板１１、２１の間の空間に、所定量の放電ガスを供給後、その貫通孔３８を封止材料３９で封止すれば、第一、第二の基板１１、２１の間の空間は外部から遮断される（図８）。   As another method, either one or both of the first and second substrates 11 and 21 are provided with a through hole 38 penetrating from the front surface to the back surface, and in the above-described step, the ring-shaped solidification is performed. After the object 33 is formed, a discharge gas is supplied to the space between the first and second substrates 11 and 21 through the through hole 38. If a predetermined amount of discharge gas is supplied to the space between the first and second substrates 11, 21 and then the through hole 38 is sealed with a sealing material 39, the first and second substrates 11, 21 are provided. The space between is blocked from the outside (FIG. 8).

以上は、棒状の接続材料３１が供給手段に保持される場合について説明したが、本発明はこれに限定されるものではない。
図９の符号４１は供給手段の他の例である噴射装置のノズルを示しており、噴射装置には粉体の接続材料が収容され、そのノズルの先端から粉体の接続材料が噴射されるようになっている。 The case where the rod-shaped connecting material 31 is held by the supply means has been described above, but the present invention is not limited to this.
Reference numeral 41 in FIG. 9 denotes a nozzle of an injection device which is another example of the supply means. The injection device accommodates a powder connection material, and the powder connection material is injected from the tip of the nozzle. It is like that.

ノズル４１の噴出孔をはみ出し部分１７に向け、接続材料の粉体を、はみ出し部分１７と縁２８のいずれか一方又は両方に噴射しながら、上述したレーザー光３５の照射を行えば、接続材料の溶融物３２が形成され、上述したようにその溶融物３２が第一、第二の基板１１、２１の間に引き込まれる。ノズル４１の噴出孔の向き又は位置を変え、粉体が吹き付けられる位置を照射位置３６の移動に追従させれば、溶融物３２を連続して形成することができる。   If the laser beam 35 is irradiated while the nozzle 41 is directed to the protruding portion 17 and the powder of the connecting material is sprayed to one or both of the protruding portion 17 and the edge 28, the connecting material A melt 32 is formed, and the melt 32 is drawn between the first and second substrates 11 and 21 as described above. If the direction or position of the ejection hole of the nozzle 41 is changed and the position where the powder is sprayed follows the movement of the irradiation position 36, the melt 32 can be formed continuously.

放電ガスは特に限定されず、ＰＤＰに用いられる周知ガスを広く用いることができる。具体的には、Ｎｅガス、Ａｒガス、Ｋｒガス、Ｘｅガス、Ｈｅガス等を用いることができ、それらのガスは１種類を単独で用いてもよいし、２種類以上を混合して用いてもよい。   The discharge gas is not particularly limited, and a wide variety of well-known gases used for PDPs can be used. Specifically, Ne gas, Ar gas, Kr gas, Xe gas, He gas, etc. can be used, and these gases may be used alone or in combination of two or more. Also good.

接続材料３１は常温で固体であって、第一、第二の基板１１、２１よりも融点が低い低融点材料であれば特に限定されるものではないが、軟化溶融した時に、第一、第二の基板の表面に濡れ性が高いものが好ましい。また、第一、第二の基板１１、２１の間の間隙に確実に溶融物を引き込ませるためには、溶融した時の粘度が１０3ポアズ以下になるものが好ましい。 The connection material 31 is not particularly limited as long as the connection material 31 is a solid at room temperature and has a lower melting point than the first and second substrates 11 and 21. It is preferable that the surface of the second substrate has high wettability. In order to ensure that the melt is drawn into the gap between the first and second substrates 11 and 21, it is preferable that the viscosity when melted is 10 3 poise or less.

具体的には、第一、第二の基板１１、２１がガラス基板で構成される時には、ガラスのような無機材料、又はガラス基板に対する接着性の高い樹脂材料等を用いることができるが、長期間に亘って気密性を維持し、高い信頼性を保持するために、ＰＤＰやＦＥＤを製造する時には無機材料のみからなる接続材料３１を用いることが好ましい。   Specifically, when the first and second substrates 11 and 21 are formed of a glass substrate, an inorganic material such as glass or a resin material having high adhesion to the glass substrate can be used. In order to maintain hermeticity over a period and maintain high reliability, it is preferable to use the connection material 31 made of only an inorganic material when manufacturing a PDP or FED.

以上は、本発明の製造装置を用いて、表示範囲１９に放電ガスを充填されたプラズマディスプレイパネル１を製造する場合について説明したが、本発明はこれに限定されるものではなく、例えば、表示範囲１９に有機層が配置され、第一、第二の電極間に電圧を印加すると有機層が発光するように構成された有機ＥＬ装置や、表示範囲１９に液晶材料が配置された液晶パネル（ＬＣＤ）の製造に、本発明の製造装置を用いることもできる。   The above has described the case of manufacturing the plasma display panel 1 in which the display range 19 is filled with the discharge gas using the manufacturing apparatus of the present invention. However, the present invention is not limited to this, and for example, a display An organic EL device in which an organic layer is arranged in the range 19 and the organic layer emits light when a voltage is applied between the first and second electrodes, or a liquid crystal panel in which a liquid crystal material is arranged in the display range 19 ( The production apparatus of the present invention can also be used for the production of LCD).

更に、表示範囲１９に真空雰囲気が形成され、第一、第二のパネルのうち、一方のパネルに設けられた電子放出源から真空雰囲気中に電子が放出されると、その電子が他方のパネルに設けられた蛍光体膜に入射して光が発生するように構成されたＦＥＤの製造に、本発明の製造装置を用いることもできる。   Further, when a vacuum atmosphere is formed in the display range 19 and electrons are emitted from the electron emission source provided in one of the first and second panels into the vacuum atmosphere, the electrons are emitted from the other panel. The manufacturing apparatus of the present invention can also be used for manufacturing an FED that is configured to generate light by being incident on the phosphor film provided on the substrate.

本発明の製造装置、及びこれを用いた製造方法は、封止に必要な部分だけを加熱可能であり、不純ガスの発生量が少ないので、不純ガスの影響を受けやすいＦＥＤやＰＤＰの製造に特に適している。   The manufacturing apparatus of the present invention and the manufacturing method using the same can heat only the portions necessary for sealing, and the amount of impure gas generated is small, so that the FED and PDP that are easily affected by the impure gas are manufactured. Especially suitable.

第一、第二の基板１１、２１の平面形状や、第一、第二の基板１１、２１の重ね合わせ方法も特に限定されず、はみ出し部分の数も特に限定されない。図１０は第一、第二の基板１１、２１にはみ出し部分１７、２７が１つずつ形成されるように重ね合わせた例である。図１１は第一の基板１１だけにはみ出し部分１７が形成された例であり、この場合ははみ出し部分１７上で接続材料３１を溶融させた後、第一、第二の基板１１，２１をひっくり返す必要がない。   The planar shape of the first and second substrates 11 and 21 and the method for overlaying the first and second substrates 11 and 21 are not particularly limited, and the number of protruding portions is not particularly limited. FIG. 10 shows an example in which the first and second substrates 11 and 21 are overlapped so that the protruding portions 17 and 27 are formed one by one. FIG. 11 shows an example in which the protruding portion 17 is formed only on the first substrate 11. In this case, after the connecting material 31 is melted on the protruding portion 17, the first and second substrates 11 and 21 are turned over. There is no need.

上記いずれの場合も、第一、第二の基板１１、２１の間の封止すべき領域（例えば表示範囲）の周囲を全て取り囲むように、はみ出し部分が配置されており、各はみ出し部分１７、２７に溶融物３２を供給し、その溶融物を第一、第二の基板１１、２１の間に引き込ませることで、封止すべき領域を取り囲む固化物３３を形成することができる。   In any of the above cases, the protruding portions are arranged so as to surround all of the area to be sealed (for example, the display range) between the first and second substrates 11 and 21, and each protruding portion 17, By supplying the melt 32 to 27 and drawing the melt between the first and second substrates 11 and 21, a solidified product 33 surrounding the region to be sealed can be formed.

以上は、第一、第二の基板１１、２１の封止すべき部分の周囲をすべてはみ出し部分１７、２７で取り囲む場合について説明したが、本発明はこれに限定されるものではない。第一の基板１１の縁の少なくとも一部と、第二の基板２１の縁の少なくとも一部が互いにはみ出さないように揃えられ、封止すべき領域の周囲の一部又は全部にはみ出し部分が無い場合も本発明には含まれる。   Although the above has described the case where all of the periphery of the portions to be sealed of the first and second substrates 11 and 21 are surrounded by the protruding portions 17 and 27, the present invention is not limited to this. At least a part of the edge of the first substrate 11 and at least a part of the edge of the second substrate 21 are aligned so that they do not protrude from each other. The case where it does not exist is also included in the present invention.

第一、第二の基板１１、２１の縁１８、２８が揃えられた部分の封止方法を説明すると、例えば棒状の接続材料３１の先端を、第一、第二の基板１１、２１の揃えられた縁１８、２８の両方に接触するように押し当てると共に、接続材料３１の先端に加熱手段からレーザー光３５を照射する（図１２）。   The sealing method of the portion where the edges 18 and 28 of the first and second substrates 11 and 21 are aligned will be described. For example, the tip of the rod-shaped connecting material 31 is aligned with the first and second substrates 11 and 21. While pressing so that both the edges 18 and 28 contacted, the front-end | tip of the connection material 31 is irradiated with the laser beam 35 from a heating means (FIG. 12).

接続材料３１の先端は第一のレーザー光３５で加熱され、第一、第二の基板１１、２１の縁１８、２８の両方に接触した状態で溶融し、その溶融物は第一、第二の基板１１、２１の縁１８、２８から、第一、第二の基板１１、２１の間に毛細管力で引き込まれる。   The tip of the connection material 31 is heated by the first laser beam 35 and melts in contact with both the edges 18 and 28 of the first and second substrates 11 and 21, and the melt is first and second. The first and second substrates 11 and 21 are pulled by the capillary force from the edges 18 and 28 of the substrates 11 and 21.

レーザー光の３５を断続的又は連続的に照射しながら、照射位置３６を上記揃った縁１８、２８に沿って移動させると共に、照射位置３６の移動に接続材料３１を追従させれば、その移動方向に沿って溶融物３２が次々形成され、第一、第二の基板１１、２１の間に連続する溶融物３２が形成される。   If the irradiation position 36 is moved along the aligned edges 18 and 28 while irradiating the laser beam 35 intermittently or continuously, and the connection material 31 follows the movement of the irradiation position 36, the movement is performed. A melt 32 is successively formed along the direction, and a continuous melt 32 is formed between the first and second substrates 11 and 21.

連続する溶融物３２を、はみ出し部分１７、２７上から第一、第二の基板１１、２１の間に引き込まれた溶融物３２又は、他の揃った縁１８、２８から第一、第二の基板１１、２１の間に引き込まれた溶融物３２と接続し、接続された溶融物で上記封止すべき領域を取り囲めば、封止すべき領域を外部雰囲気から遮断するリング状の固化物３３が形成される。   A continuous melt 32 is drawn from between the first and second substrates 11, 21 from above the protruding portions 17, 27, or from the other aligned edges 18, 28 to the first, second A ring-shaped solidified material that cuts off the region to be sealed from the external atmosphere by connecting to the melt 32 drawn between the substrates 11 and 21 and surrounding the region to be sealed with the connected melt. 33 is formed.

尚、上記図１０〜１２に示したいずれの場合も、第一、第二の基板１１，２１を重ね合わせた後は、第二の基板２１が隔壁１５で支持された状態が維持されるので、第一、第二の基板１１、２１を重ね合わせた時の第一、第二の基板１１、２１の位置関係は動かない。   In any of the cases shown in FIGS. 10 to 12, after the first and second substrates 11 and 21 are overlapped, the state where the second substrate 21 is supported by the partition wall 15 is maintained. When the first and second substrates 11 and 21 are overlapped, the positional relationship between the first and second substrates 11 and 21 does not move.

本発明により製造されたプラズマディスプレイパネルの一例を説明する断面図Sectional drawing explaining an example of the plasma display panel manufactured by this invention 第一、第二のパネルを重ね合わせた状態を説明する平面図A plan view explaining a state in which the first and second panels are overlapped 第一、第二のパネルを重ね合わせた状態を説明する斜視図The perspective view explaining the state which piled up the 1st and 2nd panel 溶融物が第一、第二の基板の間に引き込まれた状態を説明する断面図Sectional drawing explaining the state by which the molten material was drawn between the 1st, 2nd board | substrates 溶融物の供給場所の移動を説明する平面図Plan view explaining the movement of the melt supply location 第一の基板のはみ出し部分に溶融物が配置された状態を説明する平面図The top view explaining the state by which the melt is arrange | positioned in the protrusion part of the 1st board | substrate. リング状の固化物が形成された状態を説明する平面図The top view explaining the state in which the ring-shaped solidified material was formed 本発明により製造されたプラズマディスプレイパネルの他の例を説明する断面図Sectional drawing explaining the other example of the plasma display panel manufactured by this invention 溶融物の供給方法の他の例を説明する断面図Sectional drawing explaining the other example of the supply method of a melt 第一、第二の基板の重ね合わせ方法の第二例を説明する平面図The top view explaining the 2nd example of the superposition method of the 1st and 2nd substrate 第一、第二の基板の重ね合わせ方法の第三例を説明する平面図The top view explaining the 3rd example of the superposition method of the 1st and 2nd substrate 第一、第二の基板の揃った縁に溶融物を供給する工程を説明する拡大断面図Enlarged sectional view for explaining the process of supplying the melt to the aligned edges of the first and second substrates

符号の説明Explanation of symbols

１……プラズマディスプレイパネル １０……第一のパネル １１……第一の基板 １５……隔壁 １７、２７……はみ出し部分 ２０……第二のパネル ２１……第二の基板 ３１……接続材料 ３２……溶融物 ３３……固化物 ３５……レーザー光   DESCRIPTION OF SYMBOLS 1 ... Plasma display panel 10 ... 1st panel 11 ... 1st board | substrate 15 ... Bulkhead 17, 27 ... Overhang | projection part 20 ... 2nd panel 21 ... 2nd board | substrate 31 ... Connection material 32 ... Melt 33 ... Solidified product 35 ... Laser light

Claims (10)

第一のパネルの第一の基板と、第二のパネルの第二の基板とが、間隔保持部材を挟んで、前記第一、第二の基板の一方を他方からはみ出して重ね合わされ、
前記第一、第二の基板の間に位置する表示範囲が外部雰囲気から遮断された表示装置を製造する製造装置であって、
前記第一、第二の基板を前記間隔保持部材を挟んで重ね合わせた時に、前記第一、第二の基板のうち、一方の基板表面の他方の基板の縁からはみ出したはみ出し部分上に、前記他方の基板の縁に沿って接続材料を供給する供給手段と、前記はみ出し部分上に供給された前記接続材料を溶融させる加熱手段とを有する製造装置。 The first substrate of the first panel and the second substrate of the second panel are overlapped with one of the first and second substrates protruding from the other across the spacing member,
A manufacturing apparatus for manufacturing a display device in which a display range located between the first and second substrates is blocked from an external atmosphere,
When the first and second substrates are overlapped with the spacing member between them, the first and second substrates, on the protruding portion that protrudes from the edge of the other substrate on the one substrate surface, The manufacturing apparatus which has a supply means which supplies connection material along the edge of said other board | substrate, and a heating means which fuses | melts the said connection material supplied on the said protrusion part. 第一のパネルの第一の基板と、第二のパネルの第二の基板とが、前記第一の基板の縁の少なくとも一部と、前記第二の基板の縁の少なくとも一部が、互いにはみ出ないように揃えられた状態で、間隔保持部材を挟んで重ね合わされ、
前記第一、第二の基板の間に位置する表示装置が外部雰囲気から遮断された表示装置を製造する製造装置であって、
前記第一、第二の基板を重ね合わせた時に、前記第一、第二の基板の揃えられた前記縁に接続材料を供給する供給手段と、
前記縁に供給された前記接続材料を溶融させる加熱手段とを有する製造装置。 The first substrate of the first panel and the second substrate of the second panel are at least part of the edge of the first substrate and at least part of the edge of the second substrate are mutually In a state where they are aligned so as not to protrude, they are overlapped with the interval holding member interposed therebetween,
A manufacturing apparatus for manufacturing a display device in which a display device positioned between the first and second substrates is shielded from an external atmosphere,
Supply means for supplying a connection material to the aligned edges of the first and second substrates when the first and second substrates are overlaid;
The manufacturing apparatus which has a heating means which fuses the connection material supplied to the edge. 前記加熱手段は、固体の前記接続材料にレーザー光を照射し、前記溶融物を生成するように構成された請求項１又は請求項２のいずれか１項記載の製造装置。   The manufacturing apparatus according to claim 1, wherein the heating unit is configured to irradiate the solid connection material with laser light to generate the melt. 前記接続材料は棒状であって、前記加熱手段は前記接続材料の先端に前記レーザー光を照射させるように構成された請求項３記載の製造装置。   The manufacturing apparatus according to claim 3, wherein the connection material is rod-shaped, and the heating unit is configured to irradiate the tip of the connection material with the laser light. 前記供給手段は粉体の前記接続材料を噴射するノズルを有し、
前記加熱手段は、前記ノズルから噴射される前記接続材料に前記レーザー光を照射するように構成された請求項３記載の製造装置。 The supply means has a nozzle for injecting the connecting material in powder form,
The said heating means is a manufacturing apparatus of Claim 3 comprised so that the said laser beam might be irradiated to the said connection material injected from the said nozzle. 前記加熱手段は、前記はみ出し部分と、前記他方の基板の縁のいずれか一方又は両方にレーザー光を照射して昇温させ、
前記供給手段は、前記はみ出し部分の昇温した部分と、前記他方の基板の縁の昇温した部分のいずれか一方又は両方に固体の前記接続材料を接触させるように構成された請求項３乃至請求項５のいずれか１項記載の製造装置。 The heating means irradiates either one or both of the protruding portion and the edge of the other substrate with a laser beam to raise the temperature,
The said supply means is comprised so that the said connection material of a solid may be made to contact any one or both of the temperature-rise part of the said protrusion part, and the temperature-rise part of the edge of said other board | substrate. The manufacturing apparatus of any one of Claim 5. 前記接続材料は棒状であって、前記供給手段は前記接続材料の先端を前記昇温した部分に接触させるように構成された請求項６記載の製造装置。   The manufacturing apparatus according to claim 6, wherein the connection material is rod-shaped, and the supply unit is configured to bring a tip of the connection material into contact with the heated portion. 前記接続材料は粉体であって、前記供給手段は前記接続材料を前記ノズルから前記昇温した部分に向けて噴射するように構成された請求項６記載の製造装置。   The manufacturing apparatus according to claim 6, wherein the connection material is powder, and the supply unit is configured to inject the connection material from the nozzle toward the heated portion. 前記第一の基板の前記第二の基板からはみ出した部分上に前記溶融物を供給した後、前記第二の基板の前記第一の基板からはみ出した部分上に前記溶融物を供給する請求項１乃至請求項８のいずれか１項記載の製造装置であって、
前記第二の基板上への前記溶融物の供給は、前記第二の基板上の前記第一の基板に供給された前記溶融物に接触する位置から、前記第一の基板の縁に沿って前記溶融物を供給可能に構成された製造装置。 The molten material is supplied onto a portion of the second substrate that protrudes from the first substrate, and then the molten material is supplied to a portion of the second substrate that protrudes from the first substrate. The manufacturing apparatus according to any one of claims 1 to 8,
The supply of the melt onto the second substrate is performed along the edge of the first substrate from a position in contact with the melt supplied to the first substrate on the second substrate. A manufacturing apparatus configured to be able to supply the melt. 前記第一の基板の前記第二の基板からはみ出した部分上に前記溶融物を供給すると同時に、前記第二の基板の前記第一の基板からはみ出した部分上に前記溶融物を供給可能に構成された請求項１乃至請求項８のいずれか１項記載の製造装置。   The melt is supplied onto the portion of the first substrate that protrudes from the second substrate, and at the same time, the melt can be supplied to the portion of the second substrate that protrudes from the first substrate. The manufacturing apparatus according to any one of claims 1 to 8.
JP2005139647A 2005-05-12 2005-05-12 Display device manufacturing equipment Active JP4734023B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005139647A JP4734023B2 (en) 2005-05-12 2005-05-12 Display device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005139647A JP4734023B2 (en) 2005-05-12 2005-05-12 Display device manufacturing equipment

Publications (2)

Publication Number Publication Date
JP2006318739A true JP2006318739A (en) 2006-11-24
JP4734023B2 JP4734023B2 (en) 2011-07-27

Family

ID=37539231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005139647A Active JP4734023B2 (en) 2005-05-12 2005-05-12 Display device manufacturing equipment

Country Status (1)

Country Link
JP (1) JP4734023B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002072921A (en) * 2000-08-29 2002-03-12 Matsushita Electric Ind Co Ltd Display panel and producing method thereof
JP2003162964A (en) * 2001-11-28 2003-06-06 Mitsubishi Electric Corp Plasma display panel and manufacturing method therefor, and plasma display device
JP2004200150A (en) * 2002-12-06 2004-07-15 Canon Inc Method of manufacturing airtight container and method of manufacturing image display device
JP2005000797A (en) * 2003-06-11 2005-01-06 Nippon Sheet Glass Co Ltd Nozzle for coating frit paste, and coater and coating method using the nozzle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002072921A (en) * 2000-08-29 2002-03-12 Matsushita Electric Ind Co Ltd Display panel and producing method thereof
JP2003162964A (en) * 2001-11-28 2003-06-06 Mitsubishi Electric Corp Plasma display panel and manufacturing method therefor, and plasma display device
JP2004200150A (en) * 2002-12-06 2004-07-15 Canon Inc Method of manufacturing airtight container and method of manufacturing image display device
JP2005000797A (en) * 2003-06-11 2005-01-06 Nippon Sheet Glass Co Ltd Nozzle for coating frit paste, and coater and coating method using the nozzle

Also Published As

Publication number Publication date
JP4734023B2 (en) 2011-07-27

Similar Documents

Publication Publication Date Title
CN102666416B (en) Glass welding method and glass layer fixing method
JP4825448B2 (en) Manufacturing equipment for manufacturing display devices
KR101117732B1 (en) Laser beam irradiation apparatus for substrate sealing and manufacturing method of organic light emitting display device using the same
TWI331398B (en) Method of making electronic device with frit seal and frit sealing apparatus
TWI342078B (en) Organic light emitting display of mother substrate unit and method of fabricating the same
US8864543B2 (en) Sealing apparatus and method of manufacturing flat display device using the same
KR100525500B1 (en) Low temperature glass frit sealing for thin computer displays
US9045365B2 (en) Fusion-bonding process for glass
US7125306B2 (en) Sealing method and apparatus for manufacturing high-performance gas discharge panel
JP2008527657A (en) System and method for frit sealing a glass package
JP2009104841A (en) Sealing device, sealing method, electronic device, and manufacturing method of electronic device
KR20020065934A (en) Image display device, method of manufacture thereof, and apparatus for charging sealing material
JP4933715B2 (en) Flat panel device sealing method
US20090277887A1 (en) Joint method using laser beam and manufacturing method of airtight container
KR100910047B1 (en) A Sealing Method of FPD using Flexible Irradiating Area of Laser
JP2008059781A (en) Sealing method
KR20130016245A (en) Electric device and production method therefor
JP4734023B2 (en) Display device manufacturing equipment
JP4757533B2 (en) Display device manufacturing apparatus and display device manufacturing method
JP2006318862A (en) Manufacturing method of vacuum display panel
JP2020518103A (en) METHOD FOR FORMING SEAL, METHOD FOR MANUFACTURING SEALING UNIT, SEALING UNIT, AND DEVICE FOR FORMING SEAL
JP4791321B2 (en) Manufacturing method of display device
KR100707055B1 (en) Gas discharge panel production method and exhaust pipe sealing off apparatus
KR20080023485A (en) Method of encapsulating organic electro-luminescence device and organic electro-luminescence device
JP2001015026A (en) Manufacture of gas discharge panel and sealing device for gas discharge panel

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060905

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7426

Effective date: 20060905

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080417

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101025

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20110111

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20110328

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110328

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110412

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110425

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4734023

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250