JP2001015026A - Manufacture of gas discharge panel and sealing device for gas discharge panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of stably manufacturing a gas discharge panel wherein the apex parts of barrier ribs are entirely tightly fitted to a panel substrate in manufacturing the gas discharge panel such as a PDP. SOLUTION: When an envelope 40 of a PDP is formed and thereafter entered into a heating furnace 51, and a process for sealing the circumferential parts of both panels 10, 20 together by the use of a sealing material is carried out, the process is carried out while adjusting the pressure so as to set the internal pressure of the envelope 40 lower than the external pressure thereof. The pressure adjustment is carried out, for instance, by exhausting gas inside the envelope 40 through a piping member 26 by a vacuum pump 52. Thereby, both panels are sealed in a form pressed from the outside, so that the apex parts of barrier ribs and the front panel 10 are sealed in a form entirely tightly fitted together.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a gas discharge panel, and more particularly to a process for sealing a front panel and a rear panel.

[0002]

2. Description of the Related Art In recent years, expectations for high-definition and large-screen televisions such as high-definition televisions have been increasing.
In the field of displays such as CRTs, liquid crystal displays (LCDs), and plasma display panels (PDPs), the development of displays suitable for them is underway.

Conventionally, CRTs, which have been widely used as television displays, are excellent in resolution and image quality, but have a large screen of 40 inches or more in that the depth and weight increase with the screen size. Is not suitable. In addition, LCDs have excellent performance of low power consumption and low driving voltage, but have technical difficulty in producing a large screen.

On the other hand, a PDP can realize a large screen with a small depth, and a 50-inch class product has already been developed. PDPs are roughly classified into a direct current type (DC type) and an alternating current type (AC type) according to a driving method. At present, an AC type suitable for forming a panel having a fine cell structure is mainly used. ing.

A typical AC surface discharge type PDP as an AC type
In general, a front plate on which discharge electrodes are arranged and a rear plate on which address electrodes are arranged are arranged in parallel with a gap so that both electrodes form a matrix, and the gap between both plates is a stripe shape. Partitioned by partition walls.
A red, green, and blue phosphor layer is formed in a groove between the partition walls, and a discharge gas is sealed therein. The drive circuit applies a voltage to each electrode. Upon discharge, ultraviolet rays are emitted, and the phosphor particles (red, green, and blue) of the phosphor layer receive the ultraviolet rays to excite and emit light, whereby an image is displayed.

In such a PDP, usually, a partition is provided on the back plate side, a phosphor layer is formed in a groove between the partitions, and a front plate is superposed on the phosphor layer to form an envelope (front). A plate and a back plate are overlapped to have an internal space.), The outer peripheral portions of both plates in the envelope are sealed with a sealing material, and the inside of the envelope is evacuated. It is manufactured by filling a discharge gas.

This sealing material is usually a low-melting glass which is softened by heat, and is provided on the outer peripheral portion of one of the plates before the front plate and the back plate are arranged to face each other to form an envelope. The low-melting glass is mixed with a binder and applied with a dispenser or the like.In the sealing process, the low-melting glass is softened while being fixed from the point where the sealing material is applied to the outer peripheral edge with a clip or the like. Sealing is performed by heating and baking to a temperature above the point.

[0008]

However, when the PDP is manufactured in this way, a gap is generated between the partition and the front panel in the completed PDP, and the gap is formed depending on the location of each partition or in each partition. There is variation. This is because the height of the partition wall material varies when the partition wall material is piled up on the back plate, and in the gas discharge panel manufacturing process, the partition wall firing, the phosphor firing, the electrode firing, Since steps involving heating, such as firing of the dielectric layer and temporary firing of the sealing glass layer, are performed before the sealing step, it is considered that the heating step causes distortion of the plates and partition walls.

In the PDP sealing process, the front plate and the rear plate are usually arranged facing each other while being aligned, and then the outer peripheral portions of both plates are tightened with a fastener such as a clip to prevent displacement. Wearing clothes. However, when the outer peripheral portion is pressed in this way, the “lever action” with the end of the partition as a fulcrum,
In the central part, the top of the partition wall and the front panel are separated from each other and a gap is easily formed, and the pressing force of the fastener often varies, so that the gap is easily formed unevenly.

[0010] If the sealing step is performed in a state where such a gap is formed, crosstalk may occur when the manufactured PDP is driven and displayed, or the panel may be discharged. The vibration causes noise between the partition wall and the panel substrate. By the way, actual Kaihei 1-1
No. 13948 discloses a technique in which a low-melting glass is applied to the top of a partition before the front plate and the back plate are opposed to each other, and the top of the partition and the front plate are joined. . If the entire top of the partition wall is adhered to the front panel using this technology, the envelope does not expand even if the discharge gas is sealed at a high pressure, and
Since the gap between the partition and the front panel can be filled with the bonding material, the problem of the vibration can be solved.

However, it is actually difficult to join the entire top of the partition wall to the front plate, and an unjoined portion often remains partially. Therefore, this technique alone may not sufficiently solve the problem of the withstand voltage. Particularly, when the height of the partition formed on the back plate is not uniform, many unjoined portions remain,
There is a tendency that sufficient pressure resistance cannot be obtained.

On the other hand, there is a method in which the front panel and the rear panel are overlapped, a weight is placed at the center of the front panel, and the envelope is heated while being pressed and sealed. Therefore, it is necessary to use a large amount of heating energy, and the heating temperature of the envelope is also likely to be non-uniform, and it is difficult to apply this technique, especially when manufacturing a large PDP. .

When evacuating or filling a discharge gas, a vacuum pump or a discharge gas cylinder is usually connected to an exhaust pipe attached to an envelope, and then the exhaust pipe uses a burner or a heater. However, there is a demand for a method of easily and surely tipping off the exhaust pipe. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a method of manufacturing a gas discharge panel including a PDP and a gas discharge panel in which a top of a partition wall and a panel substrate are stably manufactured on a whole surface. The main purpose is to provide.

[0014]

In order to achieve the above object, in the present invention, after forming an envelope of a gas discharge panel, a step of sealing the outer peripheral portions of both substrates with a sealing material is performed. At this time, the pressure was adjusted so that the internal pressure of the envelope became lower than the external pressure. As a result, the two substrates forming the envelope are sealed in a state where they are pressed from the outside, so that the top of the partition on one substrate and the other substrate are completely sealed in a tightly adhered state. Will be done.

In order to sufficiently obtain such effects, it is preferable that the pressure adjustment be started before the sealing material is cured. As a method for performing the above-described pressure adjustment, the following method may be used. A method in which a communication path for communicating the inside of the envelope with the outside is provided, and the gas inside the envelope is exhausted from the communication path to the outside.

A method for reducing the pressure in the internal space by using a low internal pressure container having an internal pressure lower than the pressure in the internal space of the envelope. A method in which gas flow between the inner space and the outer space of the envelope is shut off, and the pressure in the envelope after the shutoff is lower than the pressure in the envelope before the shutoff (specifically, Specifically, it is cooled to a lower temperature or the gas adsorbing function of the gas adsorbing member is used.)

A method of increasing the pressure in the outer space of the envelope by using a pressurizing device or the like later than before the outer peripheral portion of the envelope is sealed. In the above sealing step, further, before forming the envelope, a bonding material is provided on the top of the partition wall on one of the substrates, and the outer peripheral portions of both substrates are sealed together with the sealing material. If the top of the partition and the other substrate are joined by a material, the top of the partition and the other substrate are joined over the entire surface of the panel, and a gap therebetween can be almost eliminated.

In the sealing step or before and after the sealing step, the top of the partition is joined to the other substrate by a method of irradiating the top of the partition with energy such as laser light or ultrasonic waves. Similarly, the gap between the top of the partition and the other substrate can be eliminated over the entire panel. In addition, in order to surely perform this in the above-mentioned sealing step, it is preferable to perform sealing while pressing both substrates by sandwiching both substrates with fasteners. In this case, in order to prevent the substrate from being deformed due to the pressing by the fastener, it is preferable to dispose a member for preventing deformation at the pressed portion.

In addition, sealing is performed in a state in which the envelope is provided with a displacement preventing means for preventing relative displacement between the two substrates, or a sealing material is provided on the outer periphery of the substrate inside the envelope. It is also preferable to provide an inflow prevention member for preventing inflow. Further, in order to easily and surely chip off the exhaust pipe, the heating element may be held in a state where a distance from the exhaust pipe is secured by using a holding unit, and the heating element may be driven in this state.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [Overall Configuration and Manufacturing Method of PDP] FIG. 1 is a perspective view showing an AC surface discharge type PDP according to an embodiment, and FIG. 2 is a display in which circuit blocks are mounted on this PDP. It is a block diagram of an apparatus. This PDP has a discharge electrode 12 (scanning electrode 12a,
Front panel 10 having sustain electrodes 12b), dielectric layer 13 and protective layer 14, and rear panel 20 having address electrodes 22 and dielectric layer 23 on rear glass substrate 21
Are arranged in parallel with each other at an interval with the electrodes 12a and 12b and the address electrode 22 facing each other.

The central portion of the PDP is a region for displaying an image. Here, a gap between the front panel 10 and the back panel 20 is partitioned by stripe-shaped partitions 24 to form a discharge space 30, and the discharge space 30 is formed. A discharge gas is sealed in the space 30. In the discharge space 30, a phosphor layer 25 is provided on the back panel 20 side. The phosphor layers 25 are repeatedly arranged in the order of red, green, and blue.

The discharge electrode 12 and the address electrode 22 are both stripe-shaped, and the discharge electrode 12 is arranged in a direction orthogonal to the partition wall 24 and the address electrode 22 is arranged in parallel with the partition wall 24. Then, the discharge electrode 12 and the address electrode 22
Have a panel configuration in which cells that emit red, green, and blue light are formed at the intersections.

The dielectric layer 13 is a layer made of a dielectric material disposed over the entire surface of the front glass substrate 11 on which the discharge electrodes 12 are disposed. However, it may be formed of a bismuth-based low-melting glass or a laminate of a lead-based low-melting glass and a bismuth-based low-melting glass. The protection layer 14 is a thin layer made of magnesium oxide (MgO) and covers the entire surface of the dielectric layer 13. The dielectric layer 23 is mixed with TiO ₂ particles so as to also function as a visible light reflecting layer. The partition 24 is made of a glass material, and protrudes from the surface of the dielectric layer 23 of the back panel 20.

On the other hand, the front panel 1
0 and the back panel 20 are sealed with a sealing material. The top of the partition wall 24 and the front panel 10 are almost in contact with each other or are joined by a joining material. An example of a method for manufacturing such a PDP will be described below.

Preparation of front panel: A discharge electrode 12 is formed on a front glass substrate 11, a dielectric layer 13 is formed so as to cover the discharge electrode 12, and a vacuum deposition method, an electron It is manufactured by forming a protective layer 14 made of magnesium oxide (MgO) by a beam evaporation method or a CVD method.

The discharge electrode 12 can be formed by applying a silver electrode paste by screen printing and then firing the paste. In addition, after forming a transparent electrode with ITO (indium tin oxide) or SnO ₂ ,
A silver electrode may be formed thereon as described above, or a Cr-Cu-Cr electrode may be formed by photolithography.

The dielectric layer 13 is made of a lead-based glass material (the composition is, for example, 70% by weight of lead oxide [PbO], 15% by weight of boron oxide [B ₂ O ₃ ], 15% by weight of silicon oxide [SiO ₂ ]. %) Is applied by a screen printing method and fired. Fabrication of rear panel: Address electrodes 22 are formed on rear glass substrate 21 by using a screen printing method in the same manner as discharge electrodes 12.

Next, a dielectric material 23 is formed by applying a glass material mixed with TiO ₂ particles by using a screen printing method and firing it. Next, the partition 24 is formed. The partition walls 24 can be formed by applying a glass paste for partition walls by a screen printing method, followed by baking. In addition, the partition wall 24 can also be formed by applying a method of applying a glass paste for partition walls to the entire surface of the rear glass substrate 21 and then shaving off portions where the partition walls are not formed by sandblasting.

Then, the phosphor layer 25 is formed in the groove between the partition walls 24.
To form The phosphor layer 25 is generally formed by applying a phosphor paste containing phosphor particles of each color by a screen printing method and baking the phosphor paste. It can also be formed by applying by a method of scanning along, followed by baking to remove the solvent and binder contained in the phosphor ink after the application. In this phosphor ink, phosphor particles of each color are dispersed in a mixture of a binder, a solvent, a dispersant, and the like, and adjusted to an appropriate viscosity.

Specific examples of the phosphor particles include: blue phosphor: BaMgAl ₁₀ O ₁₇ : Eu 2 ⁺ green phosphor: BaAl ₁₂ O ₁₉ : Mn or Zn ₂ S
iO ₄ : Mn Red phosphor: (Y _x Gd _{1 -x} ) BO ₃ : Eu ³⁺ or Y
BO ₃ : Eu ³⁺ can be mentioned.

In this embodiment, a 40-inch class VG
A and high-definition TV, the height of the partition wall is 0.
1 to 0.15 mm, partition pitch 0.15 to 0.36
mm. Sealing step, exhaust step, discharge gas sealing step: Next, the front panel and the rear panel thus manufactured are sealed.

In this sealing step, the front panel 10
Then, the back panel 20 is overlapped with an outer peripheral portion with a sealing material interposed therebetween to form an envelope, and sealing is performed with the sealing material.
At this time, a bonding material is applied to the top of the partition wall 24 of the back panel 20 as needed. As the sealing material, a material that is softened by externally applying energy such as heat, usually a low-melting glass is used. The sealing material is heated to be softened, and then cured to be sealed.

In performing the sealing step, a pressure difference is formed between the inside and the outside of the envelope so that the panels 10 and 20 are pressed uniformly from the outside.
Thereby, the sealing is performed in a state where the top of the partition wall 24 and the front panel 10 are entirely in contact with or close to each other. When the sealing step is completed, the internal space is evacuated to a high vacuum (for example, 8 × 10 ⁻⁷ Torr) in order to drive out the impurity gas or the like adsorbed inside the envelope (vacuum evacuation step).

Thereafter, a discharge gas (for example, a He-Xe-based or Ne-Xe-based inert gas) is sealed in the envelope at a predetermined pressure (discharge gas sealing step), thereby forming a PDP.
Is prepared. In the present embodiment, the content of Xe in the discharge gas is about 5% by volume, and the sealing pressure is 500 to
Set to the range of 800 Torr.

When driving and displaying a PDP, a circuit block is mounted and driven as shown in FIG. Hereinafter, the sealing step, the exhausting step, and the discharge gas filling step will be described in detail in Embodiments 1 to 10. [Embodiment 1] In this embodiment, a sealing step is performed while evacuating the internal space of an envelope by a vacuum pump.

FIG. 3 is a diagram schematically showing a cross section of the sealing device 50 used in the sealing step of the present embodiment, and FIG. 4 is a schematic perspective view thereof. The sealing device 50 includes an envelope 40 in which the front panel 10 and the rear panel 20 are overlapped.
And a heating pump 51 for heating the heating furnace 51 and a vacuum pump 52 provided outside the heating furnace 51.

The heating furnace 51 can be heated by a heater 55, and the internal temperature can be controlled to a desired set temperature. Using this sealing device 50, a sealing step is performed as follows. As shown in FIGS. 3 and 4,
The rear panel 20 is provided with a vent hole 21a at an outer peripheral portion outside the display area.

A sealing material layer 41 is formed by applying a paste containing a sealing material to the outer peripheral portion of one or both of the opposing surfaces of the front panel 10 and the rear panel 20 and firing the paste. Here, a low-melting glass having a softening temperature lower than that of the material of the partition 24 and the dielectric layer 23 is used as the sealing material. Specific examples of the low-melting glass paste include a mixture of 80 parts of a low-melting glass frit (softening point: 370 ° C.), 5 parts of an ethylcellulose-based binder, and 15 parts of isoamyl acetate. The sealing material layer 41 can be formed.

Next, the envelope 40 is formed by overlapping the front panel 10 and the rear panel 20 while aligning them. Then, the outer edge of the envelope 40 is fastened with the clip 42 and fixed so that the aligned front panel 10 and rear panel 20 do not shift. The envelope 40 is set in a heating furnace 51. And the envelope 4
The piping member 26 connecting the vent hole 21a of the No. 0 and the vacuum pump 52 is attached. The piping member 26 is preferably fixed to the back panel 20 with a fastener (not shown) such as a clip.

In this embodiment, the front panel 10 is set to the lower side and the rear panel 20 is set to the upper side in order to easily attach the piping member 26. However, the set may be set upside down. . In addition, both panels 10.2
As long as 0 is fixed so as not to be displaced, the envelope 40 may be set upright in the heating furnace. The pipe member 26 is formed of glass having heat resistance equal to or higher than the sealing temperature, has a bent shape in the middle, and extends upward from the vent hole 21a of the envelope 40 set as described above. Through hole 51a provided on the wall surface of heating furnace 51
The tip projects out of the heating furnace 51 through the heating furnace 51. The end (connection end) of the pipe member 26 on the side connected to the ventilation hole 21a is widened and has a diameter larger than the diameter of the ventilation hole 21a.

In order to hermetically seal the space between the pipe member 26 and the back panel 20, an adhesive layer 26a is inserted between the connection end of the pipe member 26 and the back panel 20 in advance. In the present embodiment, the same material is used for the adhesive layer 26a and the sealing material layer 41. The tip of the piping member 26 is connected to the vacuum pump 52.

Then, the inside of the heating furnace 51 is heated to a sealing temperature slightly higher than the softening temperature of the sealing material (for example, 450 ° C.), maintained at the sealing temperature for about 10 to 30 minutes, and then again. By lowering the temperature below the softening point, both panels 10
20 is sealed, while the vacuum pump 52 evacuates the inside of the envelope 40 to perform sealing. This exhaust gas is supplied to the heating furnace 51.
It is desirable to start after the inside reaches the softening temperature of the sealing material. Until the softening temperature of the sealing material is reached, both panels 10
・ Enclosure 4
Although the inside of the inner space cannot be attained a high degree of vacuum even when exhausted from the inner space of the air conditioner, the outer peripheral portion between the panels 10 and 20 is hermetically sealed after the sealing material is softened, and the adhesive layer is formed. This is because the connection portion between the pipe member 26 and the vent hole 21a is also hermetically sealed, so that when the inside of the envelope 40 is evacuated, the pressure is reduced to a high degree of vacuum (about several Torr).

By exhausting air from the inner space of the envelope 40, the panels 10 and 20 are uniformly pressed from the outside. Evacuation by the vacuum pump 52
What is necessary is just to perform so that the inside of the envelope 40 may be set at a slow pressure reduction rate of about 5 Torr per minute. Both panels 10.2
When 0 is uniformly pressed from the outside, as shown in FIG.
The top of the partition on the rear panel 20 and the front panel 10 are in a state of being in close contact with each other as a whole. Then, when the temperature is lowered in this state, the temperature of the sealing material becomes lower than the softening temperature and the sealing material is hardened, whereby the envelope 40 is sealed. Therefore,
In the envelope 40 after the sealing, the state in which the top of the partition wall and the front panel 10 are in close contact with each other as a whole is maintained.

The space between the pipe member 26 and the back panel 20 is also hermetically sealed by the cured adhesive layer 26a. After the sealing of the envelope 40 is completed in this way, the clip 42 is removed, and the process proceeds to the next evacuation step. In the evacuation step, the envelope 40 is put into a heating furnace for evacuation, a vacuum pump is connected to the piping member 26, and the evacuation temperature in the heating furnace is slightly lower than the softening temperature of the sealing material (for example, about 350 ° C.). ) For a predetermined time (for example, 1 hour)
Do by maintaining.

Subsequently, in the discharge gas filling step, a cylinder containing the discharge gas is connected to the pipe member 26 and the discharge gas is filled into the inner space of the envelope 40 at a predetermined filling pressure (for example, 4 ° C.).
00 Torr). Then, the ventilation hole 21a is sealed by melting and sealing off the root portion of the pipe member 26 with a burner or a heater (see Embodiment 14) (chip-off).

As described above, in addition to the method of evacuating the envelope after the sealing step using another heating furnace for evacuating, the envelope 40 is enclosed in one heating device. A method in which the sealing step, the evacuation step, and the discharge gas sealing step are sequentially performed may be employed. For example, in the sealing device 50,
The cylinder for supplying the discharge gas is connectable to the piping member 26, and the envelope 40 is connected to the heating furnace 5 even after the sealing step.
While set in 1, the temperature of the heating furnace 51 is reduced to the exhaust temperature, an exhaust process is performed using the vacuum pump 52, and further, a discharge gas can be supplied by connecting a cylinder to the piping member 26. .

Further, the envelope 4 is formed using a continuous heating device.
It is also possible to continuously perform a sealing step, a vacuum evacuation step, and a discharge gas sealing step on 0. For example, a vacuum pump and a discharge gas cylinder may be mounted together with the envelope 40 on a cart moving in a continuous furnace, and the vacuum pump and the discharge gas may be filled while the envelope 40 is heated in the continuous furnace. It is possible.

[Effects of the Manufacturing Method of the Present Embodiment] In the case where the outer edge portion is tightened with a clip or the like without providing a pressure difference between the inside and outside of the envelope 40 as in the prior art,
0 is not pressed, so that the top of the partition wall on the back panel 20 and the front panel 10 are easily or totally and partially separated from each other, as described above.
The envelope 40 is connected to both panels 10.2 by the pressure difference between the inside and outside.
Since the sealing material layer 41 is hardened and sealed in a state where 0 is uniformly pressed from the outside, the sealing is performed in a state where there is almost no gap between the top of the partition wall and the front panel 10.

Therefore, according to the manufacturing method of this embodiment,
It is possible to easily produce a PDP which is less likely to generate vibration during PDP driving and has good display quality. In order to obtain such an effect, at least at the time when the softened sealing material layer 41 is hardened, it is necessary to drive the vacuum pump 52 so that a pressure difference between the inside and outside of the envelope 40 occurs. However, it is not necessary to drive the vacuum pump 52 continuously from the beginning to the end of the sealing process. For example, even if the operation of the vacuum pump 52 is started after the sealing material layer 41 is softened, the effect due to the difference between the inside and outside pressures of the panels 10 and 20 can be sufficiently obtained.

Further, since the sealing is performed in a state where the pressure difference between the inside and outside of the envelope 40 is provided, the two panels 10 and 20 are pressed against each other by the difference between the inside and outside pressures. Even if the pressing force is smaller than that of the clip used in the sealing step, the displacement can be sufficiently prevented. It is to be noted that the displacement of the panels 10 and 20 during sealing can be prevented without necessarily using the clip 42. However, if the clips 42 are fixed as in the present embodiment, the panels 10 and 20 Since the displacement can be more reliably prevented, and the outer peripheral portions of both panels 10 and 20 are pressed by the clips 42, the sealing material layer 41 interposed between the outer peripheral portions is pressed. Layer 4
When 1 softens, the pressing force spreads the sealing material layer 41 uniformly over the entire outer peripheral portion, and the outer peripheral portion can be more airtightly sealed.

The material of the adhesive layer 26a and the material of the sealing material layer 41 may be different from each other. However, if the same low-melting glass is used as in the present embodiment, the sealing material layer 41 is formed. As the envelope 40 is sealed by being softened and hardened, the adhesive material layer 26a is also softened and hardened, so that the piping member 26 is formed.
And the air hole 21a of the rear panel 20 are automatically connected and hermetically sealed.

[Modification of this embodiment] In this embodiment,
Although an example in which low-melting glass is used as the adhesive layer 26a has been described, in this case, the pressure inside the envelope 40 is reduced when the adhesive layer 26a is softened. When the layer 26a flows out toward the ventilation hole 21a, the piping member 26 and the ventilation hole 21
The seal with a may be broken.

On the other hand, crystallized glass that crystallizes at a lower temperature than the sealing material layer 41 may be used as the adhesive layer 26a. As the crystallized glass, PbO—ZnO—B
₂ O ₃ frit glass is typical. The crystallized glass has a property of being crystallized and solidified after being heated to be in a fluidized state, and then not softening even when heated to the initial crystallization temperature. Therefore, crystallized glass is used as the adhesive layer 26a. , If the envelope 40 is slowly heated and heated,
Since the crystallized glass is solidified when the sealing material layer 41 softens, the problem of poor sealing due to the outflow of the adhesive material layer 26a can be solved.

The effect of suppressing the outflow of the adhesive layer 26a can also be expected by using glass whose softening temperature is slightly higher than the material of the sealing layer 41 as the material of the adhesive layer 26a. In addition, instead of using a low-melting glass as the adhesive layer 26a, a material that does not soften at the sealing temperature (a glass or a ceramic-based adhesive whose softening point is considerably higher than the material of the sealing material layer 41) is used. Piping member 2 in advance
This problem can also be solved by attaching 6 to the ventilation hole 21a of the back panel 20.

[Embodiment 2] This embodiment is the same as Embodiment 1 described above, except that a sealing step shown in FIG.
As shown in (a) and (b), both panels 10 and 20
Are disposed opposite to each other to form an envelope 40, and then the sealing material layer 41 interposed between the outer peripheral portions of both panels 10 and 20 is formed.
Further, a sealing material layer 43 is formed outside the substrate.

As described above, by further forming the sealing material layer 43 separately from the sealing material layer 41, even if the sealing by the sealing material layer 41 is incomplete, the two panels 10
Since the outer peripheral portion of the sealing member 20 is sealed by the sealing material layer 43, the sealing can be performed more reliably, and the gap between the top of the partition and the front panel 10 can be further reduced.

In addition, by forming the sealing material layer 43, the panels 10 and 20 are fixed to each other by the sealing material layer 43 before the sealing material layer 43 is softened. 20 is prevented from shifting. Further, before the sealing material layer 41 and the sealing material layer 43 are softened, a certain degree of airtightness is ensured by the sealing material layer 43, so that pressing the vacuum pump 52 applies a pressing force to both panels 10 and 20. Can be added.

In order to achieve such an effect,
As a material for forming the sealing material layer 43, the sealing material layer 41 is used.
It is desirable to use the same material as the material of the above. For example, a paste containing the same sealing material (low-melting glass) used to form the sealing material layer 41 may be used as the sealing material of the envelope 40. Layer 4
1 can be formed by applying the composition to the outside.

In addition, the sealing material layer 41 can be formed by applying a ceramic adhesive. [Embodiment 3] This embodiment is the same as Embodiment 1 described above, but before entering the sealing step, as shown in FIG. The difference lies in that a sealing material inflow prevention rib 44 is formed on one or both outer peripheral surfaces along the inside of the region where the sealing material layer 41 is formed.

By forming the sealing material inflow prevention ribs 44 in advance, the sealing material layer 4 can be formed in the sealing step.
It is possible to prevent the sealing material layer 41 from flowing into the display area when the internal pressure of the envelope 40 becomes lower than the external pressure in a state where 1 is softened. The height of the sealing material inflow prevention rib 44 is preferably formed to be substantially the same as the height of the partition wall 24 when the panels 10 and 20 are arranged to face each other. If the sealing material inflow prevention rib 44 is higher than the partition wall 24, a gap is formed between the top of the partition wall 24 and the front panel 10, and the sealing material inflow prevention rib 44 is separated from the partition wall 2.
If it is too low as compared with 4, the effect of preventing the inflow of the sealing material layer 41 cannot be expected much.

For example, as shown in FIG. 6B, the sealing material inflow prevention ribs 44 are used when the partition walls 24 are formed on the rear glass substrate 21 on the rear panel 20.
If they are formed simultaneously using the same material, they can be easily formed. [Embodiment 4] This embodiment is the same as Embodiment 1 described above, except that in the sealing step, a pressure difference is provided so that the pressure inside the envelope 40 is lower than that outside. In the first embodiment, a method of depressurizing the inside by evacuating the inside of the envelope 40 is used, whereas in the present embodiment, a method of pressurizing the outside of the envelope 40 is used in the present embodiment. The points are different.

Therefore, in the sealing device 50 of this embodiment, as shown in FIG. 7, the vacuum pump 52 is not provided, and the heating furnace 51 is pressurized so that the inside of the heating furnace 51 can be pressurized.
Has a sealable structure, and a pressurizing pump 53 is attached thereto. In the sealing step of the present embodiment, the tip of the pipe member 26 is opened to the atmosphere outside the heating furnace 51, and the inside of the heating furnace 51 is pressurized by the pressure pump 53. The vessel 40 is heated for sealing.

According to such a sealing method, the envelope 40
While the internal space is kept substantially at atmospheric pressure, the external space of the envelope 40 is at a high pressure, so that the envelope 40 is sealed while being pressed from the outside. Therefore, the same effects as those of the first embodiment can be obtained. [Embodiment 5] In this embodiment, the envelope 40 is sealed using the same sealing device 50 as in Embodiment 4 above, but as shown in FIG. Reference numeral 26 denotes a straight line, and the tip is closed inside the heating furnace 51.

FIGS. 9A and 9B show a state in which the envelope 40 is sealed with the sealing material layer 41, wherein FIG. 9A shows a state before the sealing material layer 41 is softened, and FIG. It is a figure showing the state after softening. The sealing step of the present embodiment will be described with reference to FIG. In the sealing step of the present embodiment, first, the envelope 40 is heated by keeping the inside of the heating furnace 51 at atmospheric pressure without operating the pressure pump 53, and
1 is softened.

As shown in FIG. 9A, before the sealing material layer 41 is softened, the internal space and the external space of the envelope 40 are not in a state where the gas flow is shut off. Gas circulation is possible. Therefore, the pressure in the internal space of the envelope 40 at the time when the sealing material layer 41 is softened becomes substantially the atmospheric pressure. Then, after the sealing material layer 41 and the adhesive material layer 26a have softened, the inside of the heating furnace 51 is pressurized by operating the pressure pump 53.

As shown in FIG. 9B, after the sealing material layer 41 and the adhesive material layer 26a are softened, the gas flow between the inner space and the outer space of the envelope 40 is cut off. When the inside of the furnace 51 is pressurized, the internal space of the envelope 40 has a pressure close to the atmospheric pressure, while the external space of the envelope 40 has a higher pressure. And, as described above, the heating furnace 51
If the temperature inside the heating furnace 51 is lowered and the sealing material layer 41 is cured while the inside is pressurized, the envelope 40 is sealed while being pressed from the outside.

Therefore, the same effect as in the first embodiment can be obtained by the sealing method of the present embodiment. After such a sealing step, in a vacuum evacuation step, the end of the pipe member 26 is cut and opened, and then a vacuum pump is connected to the pipe member 26 to perform vacuum evacuation. [Embodiment 6] This embodiment is basically the same as Embodiment 5 described above, except that in the sealing step, Embodiment 5 is applied.
In the embodiment, the inside of the envelope 40 is set to a pressure close to the atmospheric pressure, and the outside is set to a high pressure to provide a pressure difference between the inside and the outside. In the present embodiment, the inside of the envelope 40 is depressurized and the outside is set to the atmospheric pressure. The difference is that an internal and external pressure difference is provided.

The sealing device 50 used in this embodiment is shown in FIG.
In the sealing device 50 shown in FIG. 1, a vacuum pump is provided instead of the pressure pump 53. In the sealing step of the present embodiment, first, the envelope 40 is heated to soften the sealing material layer 41 while operating the vacuum pump to keep the inside of the heating furnace 51 at a reduced pressure. Before the sealing material layer 41 is softened,
Since the gas can flow between the inner space and the outer space of the envelope 40, the envelope 40 at the time when the sealing material layer 41 is softened.
Is in a reduced pressure state.

Then, the sealing material layer 41 and the adhesive material layer 26a
Is softened, the vacuum pump is stopped to bring the inside of the heating furnace 51 to atmospheric pressure. After the sealing material layer 41 and the adhesive material layer 26a are softened, the gas flow between the inner space and the outer space of the envelope 40 is shut off in an airtight manner. While the internal space of 40 is in a reduced pressure state, the external space of envelope 40 has a higher pressure.

In this state, if the temperature in the heating furnace 51 is lowered and the sealing material layer 41 is cured, the envelope 40 is sealed while being pressed from the outside. Therefore, the same effect as in the fifth embodiment can be obtained by the sealing method of the present embodiment. [Embodiment 7] In this embodiment, in the sealing step,
An example in which a container having a low internal pressure is connected to an envelope and exhausted from inside the envelope to perform sealing while lowering the pressure in the envelope will be described.

FIG. 10 is a perspective view showing a state in which the envelope 40 is sealed by the sealing method of the present embodiment. In the first embodiment, the ventilation hole 21a is provided in the outer peripheral portion outside the display area of the back panel 20 in advance, but in the present embodiment, the ventilation hole 21b is provided in the outer peripheral portion in addition to the ventilation hole 21a.

As in the first embodiment, a sealing material layer 41 is formed on the outer peripheral portion of one or both of the opposing surfaces of the front panel 10 and the rear panel 20, and the front panel 10 and the rear panel 20 are combined. The envelope 40 is formed by being overlapped while being positioned, and its outer edge is fastened and fixed by the clip 42. A low internal pressure container 70 is attached to the vent hole 21a of the envelope 40, and the pipe member 2 having a closed end similar to that used in the fifth embodiment is attached to the vent hole 21b.
6 is attached.

This low internal pressure container 70 is made of glass having heat resistance higher than the sealing temperature, like the pipe member 26.
It is composed of a container body 71 and a connection pipe 72 protruding from the container body 71 so as to be connected to the vent hole 21a. The inside of the container body 71 is kept in a reduced pressure state by gas-tightly shutting off gas flow with the outside by a gas flow blocking layer 73 (see FIG. 13A) provided in the connection pipe 72.

When attaching the low internal pressure container 70 and the pipe member 26 to the ventilation holes 21a and 21b, the connection pipe 72 is connected to the low internal pressure container 70 and the pipe member 26 so that the space between the rear panel 20 and the low internal pressure container 70 and the pipe member 26 can be hermetically sealed. An adhesive layer 74 is formed between the back panel 20 and the piping member 26 and the back panel 20.
An adhesive material layer 26a is formed between them. In the present embodiment, the adhesive layer 26a and the adhesive layer 74 are
The same material as that of No. 1 is used.

The gas flow blocking layer 73 is formed so that the sealing material layer 41 and the adhesive layers 26a and 74 are softened later or almost simultaneously with the softening of the sealing material layer 41 in the sealing step. It is formed using low-melting glass having a slightly higher softening point than the material of the layer 41, or is formed using the same material as the material of the sealing material layer 41. Here, the low internal pressure container 70
An example of a manufacturing method of the method will be described with reference to FIG.

The container main body 71 and the connection pipe 72 are manufactured by using a glass processing technique for manufacturing a flask or the like.
The container body 71 is provided with an exhaust pipe 72a for evacuating separately from the connection pipe 72. FIG. 11 (a)
As shown in FIG.
Is filled with a paste containing a low-melting-point glass, which is heated using a heater such as a gas burner, and then softened once and hardened again, so that the gas flow blocking layer 7 is formed.
Form 3

Next, as shown in FIG. 11B, a vacuum pump is connected to the exhaust pipe 72a, and the inside of the container body 71 is evacuated until the inside of the container body 71 reaches a predetermined degree of vacuum. Next, as shown in FIG. 11C, while the vacuum pump is connected, the inside of the container body 71 is maintained at a predetermined degree of vacuum,
The exhaust pipe 72a is chipped off by a gas burner.

Thus, a low internal pressure container 70 in which the inside of the container body 71 is maintained at a predetermined degree of vacuum is completed. FIG. 12 is a schematic configuration diagram showing a belt-type heating device used for sealing the envelope 40 in the present embodiment. The heating device 60 includes a heating furnace 61 for heating the substrate, a conveyance belt 62 for conveying the envelope 40 so as to pass through the inside of the heating furnace 61, and a plurality of heaters provided in the heating furnace 61 along the conveyance direction. 63 and the like.

By setting the temperature of each portion from the inlet 64 to the outlet 65 of the heating furnace 61 by each heater 63, the temperature of the envelope 40 can be raised and lowered with a desired temperature profile. ing. FIG. 13 is an explanatory diagram showing a state change in the sealing process of the envelope 40. The envelope 40 to which the low internal pressure container 70 and the pipe member 26 are attached as described above is connected to the heating device 60 as follows.
Seal using.

The envelope 40 is connected to the conveyor belt 6 of the heating device 60.
2, the envelope 40 is conveyed in the heating furnace 61, and is heated to a sealing temperature set slightly higher than the softening temperature of the gas flow blocking layer 73. The heating rate is, for example, 10 ° C./min. When the envelope 40 is lower than the softening temperature of the sealing material layer 41, the envelope 4 is passed through the sealing material layer 41.
Gas flow is possible between the inside and the outside of the zero. on the other hand,
As shown in FIG. 13 (a), the inside of the container main body 71 cannot perform gas communication with the outside due to the gas flow blocking layer 73,
The degree of vacuum is maintained.

When the temperature of the envelope 40 is raised to the softening temperature of the sealing material layer 41, the sealing material layer 41 is softened and both panels 10
The space between the outer peripheral portions of the seal 20 is hermetically sealed by the sealing material layer 41. Further, since the adhesive layer 26a and the adhesive layer 74 are also softened, the space between the low internal pressure container 70 and the piping member 26 and the back panel 20 is hermetically sealed. by this,
Gas flow between the inner space of the envelope 40 and the outer space is shut off. That is, in more detail, gas flow is blocked between the inside and the outside of the container complex in which the envelope 40 and the low internal pressure container 70 are combined.

Then, almost simultaneously with or slightly after the time when the sealing material layer 41 softens, the gas flow blocking layer 73 also softens. At this time, since the degree of vacuum is maintained in the container body 71, as shown in FIG. 13 (b), the gas flow blocking layer 73 is broken by the pressure difference to allow gas flow, and the inside of the envelope 40 is opened. Is drawn into the container body 71.

Accordingly, the inside of the envelope 40 is decompressed, so that both panels 10 and 20 are pressed from the outside by the pressure difference between the inside and the outside of the envelope 40. With this pressing force, as shown in FIG. 13C, the gap between the top of the partition wall 24 and the front panel 10 is reduced. The envelope 40 is
After being kept at the sealing temperature for a while (for example, for 30 minutes), the temperature is lowered and discharged from the heating furnace 61.

When the temperature of the envelope 40 is lowered to a temperature lower than the softening temperature of the sealing material layer 41, the sealing material layer 41 is hardened while both panels 10 and 20 are pressed from the outside.
The sealing is performed in a state where the gap between the top of the front panel 10 and the front panel 10 is small. After the sealing process is completed in the heating device 60 in this manner, the connection tube 72 is burned off with a burner to seal the ventilation hole 21b. Further, after the tip of the piping member 26 is cut and opened, a vacuum pump is connected to the piping member 26 to perform evacuation.

[Effects of the Sealing Method of the Present Embodiment] According to the sealing method of the present embodiment, as in the first embodiment, both panels 10 and 20 are pressed uniformly from the outside. Since the sealing is performed, the top of the partition wall on the back panel 20 and the front panel 10 are sealed in a state of being in close contact with each other as a whole. Further, in the sealing step of the present embodiment, it is necessary to connect a vacuum pump to the envelope 40 as in Embodiment 1, or to pressurize or depressurize the inside of the heating furnace as in Embodiments 3 to 5. Therefore, it is easy to continuously perform the sealing step using a continuous heating device such as the heating device 60 described above.

When the low internal pressure container 70 is manufactured, the volume and the degree of vacuum of the container main body 71 are determined by adjusting the pressure in the envelope 40 after the gas flow blocking layer 73 is ruptured to 10 to 600 Torr.
Is preferably set within the range. This is because when the pressure in the envelope 40 becomes low pressure of less than 10 Torr, the sealing of the sealing material layer 41 may be broken due to the pressure difference, while when it exceeds 600 Torr, the pressing force is weak and the effect is not so expected. That's why.

[Modification of this Embodiment] In this embodiment, an example is shown in which the gas flow blocking layer 73 is formed of low-melting glass so as to be softened by heat during the sealing step. The gas flow blocking layer 73 may be formed using a material that melts or decomposes by applying energy such as ultrasonic waves, and energy such as light or ultrasonic waves may be applied to this during the sealing step.

For example, the same effect can be obtained by forming the gas flow blocking layer 73 using a novolak resin and irradiating it with light during the sealing step to decompose it. To play. [Embodiment 8] In the present embodiment, in the sealing step, after blocking the gas from flowing between the internal space and the external space of the envelope 40 heated to a high temperature, the temperature is lowered to reduce the internal space. An example in which an internal / external pressure difference is formed by lowering the pressure of the above.

FIG. 14 is a schematic configuration diagram showing a belt-type heating device used for sealing the envelope 40 in the present embodiment, and FIG. 15 shows a case where the envelope 40 is provided in the belt-type heating device. It is a figure which shows a mode that a sealing process is performed by being put. In the sealing step of the present embodiment, similarly to the fifth embodiment, an envelope 40 in which a linear pipe member 26 (the end of which is open) is attached to the ventilation hole 21a is formed (see FIG. 15). 14), the formed envelope 40 is sealed using a belt-type heating device 80 as shown in FIG.

The heating device 80 has the same configuration as the heating device 60 described in the seventh embodiment, except that a burner 81 for heating and sealing the distal end of the pipe member 26 is provided inside the heating furnace 61. is set up. The mounting position of the burner 81 in the heating furnace 61 is set within a range where the envelope 40 which is carried on the conveyance belt 62 and conveyed in the heating furnace 61 has the highest temperature (peak temperature).

By using this heating device 80, the piping member 26
Is sealed as follows. When the envelope 40 is placed on the transport belt 62 of the heating device 80, the envelope 40 is transported in the heating furnace 61 and is set to be higher than the softening temperature (for example, 380 ° C.) of the sealing material layer 41. The temperature is raised to a peak temperature (for example, 500 ° C.). The heating rate at this time is, for example, 10 ° C./min.

Then, at a peak temperature for a while (for example, 1
(About 0 minutes), the tip of the pipe member 26 is
1 and melted by heating. At this time, the state of the envelope 40 is the same as the state shown in FIG. 9B of the fifth embodiment, since the sealing material layer 41 and the adhesive layer 26a are softened. The internal space and the external space of 40 are sealed spaces in which gas flow is shut off.

After passing through the burner 81, the temperature of the envelope 40 conveyed in the heating furnace 61 is lowered and discharged from the heating furnace 61. Since the pressure in the closed space is proportional to the absolute temperature (Boile-Charles law), the pressure in the internal space of the envelope 40 decreases as the temperature of the envelope 40 decreases. Therefore, a pressure difference from the external space is generated, and both panels 10 and 20 are pressed from the outside. Then, in this state, the envelope 40
When the temperature is lowered to the softening temperature of the sealing material layer 41, the sealing material layer 41 and the adhesive material layer 26a are hardened, so that the sealing is performed with a small gap between the top of the partition wall 24 and the front panel 10. Will be. Also, the rear panel 20 of the piping member 26
Sticking on is also done.

After the sealing step is completed, the end of the piping member 26 is cut and opened, and then a vacuum pump is connected to the piping member 26 to perform vacuum exhaust. [Effects of the sealing method of the present embodiment] According to the sealing method of the present embodiment, as in the seventh embodiment, the top of the partition on the back panel 20 and the front panel 10 are entirely flush with each other. It is easy to perform the sealing step continuously by using a continuous heating device such as the heating device 80 while being sealed in a close contact state.

In order to obtain a sufficient effect in the sealing step of this embodiment, it is necessary that a sufficient pressure difference between the inside and outside of the envelope 40 is provided when the sealing material layer 41 is cured. It is. Therefore, the temperature (peak temperature) at which the tip of the pipe member 26 is sealed should be set to be higher than the softening temperature of the sealing material layer 41 by 10 ° C. or more, and preferably higher by several tens degrees or more.

[Modification of this Embodiment] In this embodiment, as a method of shutting off the gas flow between the inner space of the envelope 40 and the outer space, the tip of the pipe member 26 is connected to the burner 8.
Although the example of sealing with 1 has been shown, the following can be performed in addition to this. When the envelope 40 is formed, if the tip of the pipe member 26 is previously filled with low-melting glass whose softening temperature is slightly lower than the peak temperature, the tip of the pipe member 26 is sealed with the burner 81. Even if this is not the case, when the envelope 40 reaches the peak temperature, the low-melting glass softens and the tip of the pipe member 26 is sealed. And the envelope 4
As soon as 0 is lowered from the peak temperature, the piping member 26
The low melting point glass at the tip of is hardened. Further, the sealing material layer 4
When the temperature is lowered to the softening temperature of 1, a pressure difference between the inside and outside occurs in the envelope 40, so that the same effect as that of the present embodiment is exerted.

Alternatively, when forming the envelope 40, similarly to the seventh embodiment, the vent holes 21 are formed in the rear glass substrate 21 in advance.
A ventilation hole 21b different from a is provided, and a pipe member 26 having a sealed distal end is attached to the ventilation hole 21b. However, the air hole 21a is left open without attaching anything.
Then, when the envelope 40 reaches the peak temperature, low-melting glass having a softening temperature slightly lower than the peak temperature is dropped on the vent 21a to seal the vent 21a. Also in this case, when the temperature of the envelope 40 is decreased from the peak temperature, the low-melting glass is hardened, and when the temperature of the glass is further decreased to the softening temperature of the sealing material layer 41, the pressure difference between the inside and outside of the envelope 40 is reduced. As a result, the same effect as in the present embodiment is achieved.

[Embodiment 9] In this embodiment, in a sealing step, a container is connected to an envelope to form a container composite, and the connected container is heated at a high temperature. An example in which sealing is performed while lowering the pressure in the envelope by lowering the temperature after shutting off the gas flow between the internal space and the external space will be described.

FIG. 16 is a diagram showing a state in which the envelope 40 is sealed in the sealing step of the present embodiment. FIG.
As shown in (a), in the sealing step of the present embodiment, similarly to the first embodiment, the front panel 1 is interposed via the sealing material layer 41.
0 and the back panel 20 are overlapped, and the envelope 40 is
1, the air holes 21 in the rear glass substrate 21.
A container member 90 having an open end is attached to a in place of the piping member 26.

The container member 90 has a container body 91, a connecting pipe 92 protruding from the container body 91 so as to be connected to the vent hole 21a, and a pipe extending from the container body 91 to the opposite side to the connecting pipe 92 and having an open end. And an extended pipe 93 formed. When attaching the container member 90 to the ventilation hole 21 a, the container body 91 is attached while being exposed to the outside of the heating furnace 51. Also, the connection pipe 92 and the rear panel 2 are connected so that the space between the container member 90 and the rear panel 20 can be hermetically sealed.
An adhesive layer 94 is formed between the two. In the present embodiment, the same material as the sealing material layer 41 is used for the adhesive layer 94.

An electric heater 95 is attached to the container body 91 so that the container body 91 can be heated and heated. After setting in this manner, the envelope 40 is heated and heated in the heating furnace 51 until a sealing temperature (for example, 480 ° C.) equal to or higher than the softening temperature of the sealing material layer 41 (the temperature rising rate is, for example, 10 ° C. /
Minutes). At the same time, the container body 91 is heated and heated to the set temperature (for example, 200 ° C.) by the electric heater 95. Then, the distal end of the extension pipe 93 is sealed with a burner.

At this time, as shown in FIG. 16B, the distal end of the extension pipe 93 is closed, and the sealing material layer 41 and the adhesive material layer 94 are softened. The space, the inside of the container body 91, and the external space (the space inside the heating furnace 51) are in a state where gas flow is shut off. Next, as shown in FIG. 16C, while the envelope 40 is kept at a temperature equal to or higher than the softening temperature of the sealing material layer 41 in the heating furnace 51, the electric heater 95 is turned off to cool the container body 91. .

As the temperature of the container body 91 decreases, the pressure in the container body 91 decreases, and accordingly, the pressure in the envelope 40 also decreases. Therefore, similarly to the eighth embodiment, a pressure difference occurs between the internal space and the external space of the envelope 40, and the panels 10 and 20 are pressed from the outside. Then, in this state, the temperature inside the heating furnace 51 is lowered, and the temperature of the envelope 40 is lowered to the softening temperature of the sealing material layer 41.
Since the adhesive layer 94 is cured, the sealing is performed in a state where the gap between the top of the partition wall 24 and the front panel 10 is small. Further, the container member 90 is also fixed on the back panel 20.

After the sealing step is completed, the distal end of the extension pipe 93 is cut and opened, and then a vacuum pump is connected thereto to perform vacuum exhaust. [Effects of the sealing method of the present embodiment] According to the sealing method of the present embodiment, the top of the partition wall on the back panel 20 and the front panel 10 are entirely in the same manner as in the eighth embodiment. Sealed in close contact.

In this embodiment, the pressure is not lowered by the temperature drop of the envelope 40 itself as in the eighth embodiment, but the container member 90 whose temperature can be adjusted separately therefrom.
, The pressure in the inner space of the envelope 40 is reduced by lowering the temperature of the envelope 40, so that the temperature of the envelope 40 is substantially higher than the softening temperature of the sealing material layer 41 as in the eighth embodiment. It is not necessary to raise the temperature to a temperature equal to or higher than the softening temperature of the sealing material layer 41.

[Embodiment 10] In this embodiment, a container member 90 is connected to an envelope 40 in the same manner as in Embodiment 9 by using a continuous heating device, so that the internal space of the composite container is reduced. An example is shown in which sealing is performed while lowering the pressure in the envelope by lowering the temperature after shutting off the external space. FIG.
FIG. 18 is a schematic configuration diagram showing a belt-type heating device used for sealing the envelope 40 in the present embodiment. FIG. 18 shows a state in which the envelope 40 is placed in the belt-type heating device for sealing. It is a figure showing signs that a process is performed.

In the sealing step according to the present embodiment, the eighth embodiment is used.
In the same manner as described above, the envelope 40 is formed, and the container member 90 is connected to the vent hole 21 a of the envelope 40 via the adhesive layer 94.
To the heating device 10 as shown in FIG.
Seal by passing through 0. This heating device 1
Reference numeral 00 denotes a configuration similar to that of the heating device 80 described in the eighth embodiment, and a burner 101 for heating and sealing the distal end of the extension pipe 93 of the container member 90 is installed inside the heating furnace 61. Have been. The burner 1 in the heating furnace 61
The mounting position of 01 is set in a range where the envelope 40 transported in the heating furnace 61 on the transport belt 62 has a sealing temperature or higher (above the softening temperature of the sealing material layer 41).

In the heating device 100, on the outlet side from the burner 101, the height of the ceiling plate 61a of the heating furnace 61 is set to be low, and the ceiling plate 61a has a connecting pipe for the container member 90 along the conveying direction. A groove 61b through which 92 penetrates, and a passage window 61c through which the container body 91 passes are opened. When the envelope 40 to which the container member 90 is attached is set and distributed on the transport belt 62 of the heating device 100, the envelope 40 is heated to the sealing temperature, Kept together with the container member 90
Of the extension pipe 93 is heated and melted by the burner 101 and sealed.

The envelope 40 at this time is the same as the state shown in FIG. 16B of the ninth embodiment, the distal end of the extension pipe 93 is closed, and the sealing material layer 41 and the adhesive Since the layer 94 is softened, the inner space of the envelope 40 and the container body 9 are removed.
1 and the external space are in a state where the gas flow is shut off. The envelope 40 after passing through the burner 101 is kept at a temperature equal to or higher than the softening temperature of the sealing material layer 41 by passing through the inside of the heating furnace 61 even on the outlet side from the burner 101. After passing through the passage window 61c, it goes out of the heating furnace 61 (above the ceiling plate 61a) and is cooled.

At this time, as in the state of FIG. 16 (c) of the ninth embodiment, the pressure in the container body 91 and the pressure in the envelope 40 is reduced as the temperature of the container body 91 decreases. , The pressure difference between the internal space and the external space of the envelope 40 occurs, and both panels 10 and 20 are pressed from the outside.
When the temperature of the envelope 40 is lowered to the softening temperature of the sealing material layer 41 in this state, the sealing material layer 41 and the adhesive material layer 94 are hardened, so that the gap between the top of the partition wall 24 and the front panel 10 is small. Sealing is performed in the state. At the same time, the container member 90 is fixed on the back panel 20, and the envelope 40 is discharged from the heating furnace 61.

After the sealing step is completed, the distal end of the extension pipe 93 is cut and opened, and then a vacuum pump is connected thereto to perform vacuum evacuation. Although not shown, the passing window 6
It is preferable to provide an opening / closing shutter at 1c and open the shutter only when the container main body 91 passes, in order to keep the inside of the heating furnace 61 warm.

(Modification of Method for Depressurizing Internal Space of Enclosure 40) In the above-described ninth and tenth embodiments,
Initially, the distal end of the extension pipe 93 is opened, the container body 91 is heated, and then the distal end of the extension pipe 93 is sealed with a burner. Although the gas flow between the inside and the outside space is cut off, even if the distal end of the extension pipe 93 is closed from the beginning, the container body 91 is heated before the sealing material layer 41 is softened. If the temperature is raised, if the temperature of the container body 91 is lowered after the sealing material layer 41 is softened, the inside is similarly depressurized.

In the above-described Embodiments 8 to 10, when the internal space of the envelope 40 is decompressed,
The container member 90 connected to the envelope 40 is cooled down.
Was carried out by lowering the temperature, but in addition to the above, there may be a modified example in which the pressure is reduced by reducing the number of gas molecules sealed inside as follows. For example, oxygen gas is sealed in advance in the envelope 40 or in the container member 90 connected to the envelope 40, and the sealing material layer 4
When 1 is in a softened state, it is also possible to reduce the internal space of the envelope 40 by irradiating a laser beam to convert oxygen into ozone and reducing the number of gas molecules sealed therein. It is.

A gas adsorbent (for example, a getter) activated by applying a stimulus such as heat or light to the interior of the envelope 40 or the interior of the container member 90 connected to the envelope 40 in advance. The gas adsorbed when the gas adsorbent is activated is sealed, and the gas adsorbent is activated when the sealing material layer 41 is in a softened state. It is possible to reduce the number of gas molecules and reduce the pressure in the internal space of the envelope 40.

Therefore, as the gas adsorbent, the sealing material layer 4
A material that is activated at a temperature equal to or higher than the softening temperature of 1 may be used, or when the sealing material layer 41 is in a softened state, the gas adsorbent is irradiated with laser light to activate the gas adsorbent. Is also good. [Embodiment 11] This embodiment is the same as Embodiment 1, but as shown in FIG. 19, before forming the envelope 40, the entire top portion of the partition wall 24 of the back panel 20 is The difference is that a bonding material layer 45 for bonding the partition wall 24 and the front glass substrate 10 is formed.

As a bonding material for forming the bonding material layer 45, a material which has a capability of bonding the partition wall 24 and the front glass substrate 10 and which does not adversely affect the operation of the PDP may be used. The same low melting point glass as that of the sealing material layer 41 is used. The bonding material layer 45 can be formed by applying a paste containing this bonding material (low-melting glass) to the top of the partition wall 24 using screen printing or the like and baking it.

After the bonding material layer is formed on the top of the partition wall 24 in this manner, as in the first embodiment, when the sealing material layer 41 and the bonding material layer 45 are softened in the sealing process. If a pressure difference is provided so that the pressure inside the envelope 40 is lower than the pressure outside, both panels 10.2
Since 0 is uniformly pressed from the outside, the bonding material layer 45 surely contacts the front glass substrate 10 as a whole. Therefore, when the sealing material layer 41 and the bonding material layer are cured in this state, the top of the partition wall 24 and the front glass substrate 10 are securely bonded by the bonding material layer 45 over the entirety.

In the PDP manufactured by the manufacturing method of the present embodiment, since the partition wall 24 and the front glass substrate 10 are entirely bonded, the discharge gas can be sealed at a high pressure and the PDP can be driven at a high speed. The effect of suppressing vibration and the effect of improving display quality in are better than those in the first embodiment. Note that, in the present embodiment, a technique in which the bonding material layer 45 is provided in advance on the top of the partition wall 24 in the manufacturing method of the first embodiment has been described. it can. That is, in the examples shown in Embodiments 2 to 10, if the bonding material layer 45 is provided in advance on the tops of the partition walls 24, the manufactured PDP can be separated from the partition walls 24 and the front glass substrate 1.
Since the discharge gas is bonded to the entire area between 0 and 0, the discharge gas can be sealed at a high pressure, and the vibration suppressing effect and the display quality improving effect at the time of driving the PDP are improved in the second embodiment.
It becomes more excellent as compared with.

[Twelfth Embodiment] This embodiment is the same as the first embodiment, but before the sealing step is started, as shown in FIGS. On one or both outer peripheral surfaces of the rear panel 10 and the rear panel 20, substrate deformation regulating ribs 46 are formed in the vicinity of the region where the sealing material layer 41 is formed.

In the example of FIG. 20A, a substrate deformation regulating rib 46 is formed along the outside of the sealing material layer 41,
In the example of (b), substrate deformation regulating ribs 46a and 46b are formed along the outside and inside of the sealing material layer 41. If the substrate deformation restricting ribs 46 are formed in this manner, deformation of both panels 10 and 20 can be prevented even if the clips 42 press the outer peripheral portions of both panels 10 and 20.

That is, as shown in FIG. 20D, when no rib for preventing substrate deformation is formed near the sealing material layer 41, the sealing material layer 41 is softened in the sealing step. Then, the envelope 40 is pressed by the pressing force of the clip 42.
At the outer peripheral portion of the enclosure 40, the panels 10 and 20 tend to deform in the direction (arrow A) approaching each other, and the envelope 40
At the center of the panel, the two panels 10 and 20 tend to be deformed in the direction away from each other (arrow B) by leverage with the end of the partition wall 24 as a fulcrum. Such an operation is performed by the partition 24.
It is not preferable because the gap between the top of the panel and the front panel 10 is increased.

On the other hand, if the substrate deformation restricting ribs 46 are formed as described above, even if the sealing material layer 41 is softened in the sealing step, even if the sealing material layer 41 is softened, 20 does not occur. Therefore, the effect of suppressing the gap between the top of the partition wall 24 and the front panel 10 can be enhanced by providing the substrate deformation regulating rib 46.

As described above, in addition to the method of providing the substrate deformation regulating rib 46 different from the partition wall 24, FIG.
As shown in FIG.
By pressing the image display area with the clip 42, the deformation of the panels 10 and 20 due to the pressing force of the clip 42 is also prevented. can do.

In the example shown in FIG. 10B, the sealing material layer 4
Since the substrate deformation regulating rib 46b is also formed along the inner side of the package 1, the sealing material layer 41 is softened and the envelope 40 is formed.
Also, when the internal pressure becomes lower than the external pressure, the sealing material layer 41 is prevented from flowing into the display area. That is, the substrate deformation regulating rib 46b on the inner side in FIG.
Of the sealing material inflow prevention rib 44 described in the third embodiment.

It is preferable that the height of the ribs 46 when forming the substrate deformation regulating ribs 46 is substantially the same as the height of the partition walls 24 when the panels 10 and 20 are arranged to face each other. This is because if the height of the substrate deformation restricting rib 46 is higher than the height of the partition wall 24, a gap is formed between the top of the partition wall 24 and the front panel 10, while the substrate deformation restricting rib 46 is If it is too low as compared with 24, the effect of preventing deformation of both panels 10 and 20 cannot be expected much.

The method of forming the substrate deformation regulating ribs 46 is similar to the method of forming the sealing material inflow preventing ribs 44 in the third embodiment, when forming the partition walls 24 on the rear glass substrate 21. If the substrate deformation regulating ribs 46 are formed at the same time using the same material, they can be easily formed. FIGS. 21A to 21F are partial top views showing specific examples of the shape of the substrate deformation regulating rib 46 provided on the back panel 20. In the drawing, a region C indicated by oblique lines is a region where the sealing material layer 41 is formed.

In (a), substrate deformation regulating ribs 46a and 46b are formed in a continuous line along the outside and inside of the region C where the sealing material layer 41 is formed. In (b), the substrate deformation regulating ribs 46 are distributed at regular intervals across the region C where the sealing material layer 41 is formed. In (c), in the region C where the sealing material layer 41 is formed,
Short substrate deformation regulating ribs 46 are randomly dispersed.

In (d), in the region C where the sealing material layer 41 is formed, short substrate deformation regulating ribs 46 are inclined and dispersed at regular intervals. In (e), a substrate deformation regulating rib 46a is formed in a broken line along the outside of the region C where the sealing material layer 41 is formed,
A substrate deformation regulating rib 46b is formed in a continuous line along the inside.

In (f), the substrate deformation restricting ribs 46a are dispersed at regular intervals across the region C where the sealing material layer 41 is formed, and extend in a continuous line along the inside. Are formed. [Modification Example of the Present Embodiment] The technique of providing the substrate deformation regulating ribs 46 and the technique of pressing the image display area with the clip 42 as described above make the pressure inside the envelope 40 lower than that outside. The present invention can be applied not only to the case where the sealing step is performed by providing a pressure difference but also to a general sealing step of a PDP, and the same effect can be obtained.

[Embodiment 13] In this embodiment, after the sealing step is performed as described in the first to tenth embodiments, the top of the partition is irradiated with energy intensively, thereby obtaining the top of the partition. The example which joins with a front panel is shown. FIG. 22 is a view showing a step of joining the top of the partition wall and the front panel by laser beam irradiation.

First, as in the first to tenth embodiments,
The front panel 10 and the rear panel 20 are overlapped to form an envelope 40, and sealing is performed by softening and curing the sealing material layer 41 (FIG. 22A). Next, FIG.
As shown in (b), a laser beam is radiated from the front panel 10 side of the sealed envelope 40 to the top of the partition wall by using a laser beam machine 200 to join them.

The laser processing machine 200 irradiates the laser head 203 with a laser beam emitted from the YAG laser oscillator 201 in the form of a pulse from the laser head 203 to the work (envelope 40), as will be described in detail later. The laser head 203 is provided with a condensing lens 204, and the laser beam is focused on the surface of the workpiece as an elliptical spot. It is designed to be irradiated with light.

When the top of the partition wall is irradiated with the laser beam, the top surface is intensively heated to a high temperature. Then, the partition wall material is heated to a temperature higher than the softening temperature (for example, 500 to 600 ° C.) to be softened (melted), and then cooled and hardened. At this time, since the top of the partition and the front panel 10 are in close contact with each other, the partition 24 and the front panel 10
Are joined.

Thus, by irradiating the laser beam to the top of the partition wall while scanning the position along the longitudinal direction of the partition wall in the direction of the arrow in the figure, the top of the partition wall 24 and the front panel 10 are formed over the entire panel. Are joined (the shaded portion in the figure is the joined portion). FIG. 22 (c)
In this case, by scanning while intermittently irradiating a laser beam, a portion (a hatched portion in the figure) of a partition wall irradiated with a laser spot is connected in a dot-like manner to form a front panel 10.
Although it is shown that the laser beam is radiated or the laser beam is continuously radiated, the laser beam can be linearly bonded.

When the step of joining the partition wall 24 and the front panel 10 by irradiating the laser beam as described above is performed, the envelope 4
Although the bonding can be performed without providing a pressure difference between the internal space of 0 and the external space, the internal space of the envelope 40 described in the sealing process of the first to fifth and seventh to tenth embodiments with respect to the external space. It is desirable to perform the process while maintaining the reduced pressure as it is because the top of the partition wall and the front panel 10 are more closely bonded.

FIG. 23 is a schematic perspective view showing a specific example of the laser beam machine 200. As shown in FIG. Laser processing machine 200 shown in FIG.
Is a laser processing machine called a gantry type. A table 202 is supported so as to be movable in an x direction, and an arch 210 is provided so as to straddle the table 202. The arch 210 causes a laser torch 211 to move in a y direction. It is supported so that it can move to. And the laser torch 21
1 and the table 202 are precisely driven by a stepping motor (not shown).

On the table 202, the envelope 40 can be fixed by a vacuum chuck mechanism. The laser head 203 is fixed to the laser torch 211, and laser light oscillated from the laser oscillator 201 is guided to the laser head 203 through an optical fiber cable 212 made of quartz glass. As the laser oscillator 201, it is preferable to use a YAG laser oscillator or a carbon dioxide laser which can oscillate strong light in a short time,
The output is, for example, 10 mW.

The table 202 of the laser beam machine 200
First, the envelope 40 is set. At this time, the partition 24
Are set so that the longitudinal direction of the pair is along the x direction. And
By scanning in the x direction while irradiating the top of the partition wall 24 with the laser beam, the joining of one partition wall 24 is performed. Next, the same operation is performed by shifting in the y direction by a distance corresponding to the partition pitch. By repeating such an operation, bonding is performed over the entire panel.

(Effects of this Embodiment) According to the method of this embodiment, since the partition wall 24 and the front panel 10 are joined over the entire surface of the envelope 40, the discharge gas can be sealed at a high pressure, and the PDP can be filled. The vibration suppressing effect and the display quality improving effect at the time of driving are excellent as in the eleventh embodiment.

PDP manufactured by using the method of this embodiment
As a result, the resonance between the partition and the front panel did not occur, the noise level was reduced to less than one-tenth of the conventional level, and no crosstalk between cells was observed. Did not. Further, according to the method of the present embodiment, the joining can be performed without applying the joining material to the tops of the partition walls as in the eleventh embodiment, so that the process is simple in that respect.

In the PDP manufactured by the method of the present embodiment, the top of the partition wall 24 of the back panel 20 and the front panel 10 are not joined by a joining material different from the partition wall. Are fused. P
If a bonding material is present in the image display area of the DP, impurities may be mixed into the discharge gas from the bonding material. However, the PDP manufactured by the method of the present embodiment is also capable of eliminating such a possibility. It is advantageous.

However, similar to the eleventh embodiment, the partition walls 2
4, a bonding material layer 45 is formed on the top of the envelope 40.
After the formation, the method of irradiating the bonding material layer 45 with a laser beam and bonding it to the front panel 10 as in the present embodiment can be adopted. In this case, the above advantage cannot be obtained. Bonding can be performed reliably. When the bonding material layer 45 is formed, if a material that improves the absorption of laser light, such as a black filler, is mixed into the bonding material,
It is possible to more reliably join.

(Modification of this Embodiment) The laser processing machine 200 as described above can generally perform a precise two-dimensional laser processing on a work in a micro order. By providing the device 200 with a device for observing the surface of the work, more precise joining can be performed as described below.

In the laser beam machine 200 shown in FIG. 24, an observation head 205 is provided separately from the laser head 203. The observation head 205 has a probe light generator 206 for irradiating the work surface with probe light.
And a detector 207 for detecting light reflected on the work surface
As with the laser head 203, scanning can be performed in the vertical and horizontal directions (xy directions in the figure) relative to the work (the envelope 40).

Prior to the irradiation with the laser beam, the controller 208 receives a signal from the detector 207 while scanning the observation head 205,
Monitor the shape of the partition 24 (x on the table 202)
In the y coordinate, the position where the partition wall top exists is stored). Next, the laser head 20 is irradiated with the laser light.
3 is scanned in the X direction. At this time, the controller 208
The laser head 203 is finely adjusted in the Y direction so that the spot of the laser beam is applied to the center of the top of the partition wall 24 by using the position information of the monitored partition top.

As a result, even if the partition wall 24 is curved (meandering) or partially chipped, the laser is reliably irradiated to the central portion of the partition wall, and high-precision bonding is performed. In addition, the laser processing machine 2 shown in FIG.
It is also possible to monitor the width and light reflectance of each partition top portion using 00, and adjust the intensity of laser light irradiation accordingly.

For example, when the top of the partition wall is irradiated with laser light to be softened, the junction area is large because the temperature of the top of the partition wall where the width is large or the light reflectance is large is hard to rise even when the laser light is irradiated. It is thought to be smaller. On the other hand, when the joining material layer is formed on the top of the partition wall, there is a possibility that the joining area may increase because the amount of the joining material is large where the width of the top of the partition wall is large. Therefore, in the case where the width and the light reflectance of the top of the partition wall vary, if the irradiation intensity of the laser beam is fixed, the bonding state of each part (the area where the top of the partition wall melts) is likely to vary.

On the other hand, if the irradiation intensity and the irradiation angle of the laser beam are controlled in accordance with the width and the light reflectance of each of the monitored partition top portions, the variation in the bonding state due to the variation in the top portions of the partition can be obtained. Can be eliminated. In the present embodiment, the bonding process of the partition wall 24 and the front panel 10 by laser light irradiation is performed after performing the sealing process in a state where the internal space of the envelope 40 is at a low pressure with respect to the external space. Although an example is shown, this joining step can be performed after a conventional sealing step. However, in this case, the bonding state is considered to be inferior because the gap between the partition wall 24 and the front panel 10 is larger than in the present embodiment.

In the present embodiment, an example has been described in which the joining step of the partition wall 24 and the front panel 10 by laser light irradiation is performed after the sealing step. However, this joining step is performed prior to the sealing step. It is also possible, and it is also possible to carry out in parallel with this while performing the sealing step. In the case where this bonding step is performed prior to the sealing step, the outer peripheral portion of the envelope 40 is sealed with a sealing material layer, for example, as in the second embodiment, so that the entire panel is satisfactorily bonded. It is desirable to perform the joining step while reducing the pressure by exhausting air from the internal space of the vessel 40.

In the present embodiment, the laser beam is applied to the partition wall 2.
4 shows an example in which the top of the partition 24 and the bonding material are softened (melted) by irradiating the top of the partition 4, but it is sufficient that the top of the partition 24 can be intensively heated, and energy such as ultrasonic waves is applied to the top of the partition 24. It is also possible to soften the top of the partition wall and the bonding material by intensively heating the front panel 10 with a heater.

When forming the envelope 40, the partition 2
It is also considered that the top part of the partition wall 24 and the bonding material that are in close contact with the front panel 10 can be softened and joined by superimposing the front panel 10 on the back panel 20 in a state where the front panel 10 is heated to a temperature at which the material 4 softens. Can be [Embodiment 14] In this embodiment, when manufacturing a PDP, an exhaust pipe (for example, a pipe member 2 shown in the above-described embodiment 1) attached to an envelope is provided after a discharge gas sealing step or the like.
An exhaust pipe sealing device that can easily chip off 6) will be described.

FIG. 25 is a perspective view showing how the exhaust pipe sealing device 310 is attached to the exhaust pipe 300.
6 is a schematic sectional view of the exhaust pipe sealing device 310 attached to the exhaust pipe 300. Although the envelope is not shown in FIGS. 25 and 26, the lower end side of the exhaust pipe 300 in the figure is the root, and this root is connected to the ventilation hole on the rear panel (see FIG. 5).

The exhaust pipe sealing device 310 is composed of a heat generating unit 311 for heating the exhaust pipe 300 and a regulating member 315 for restricting the mounting position of the heat generating unit 311 with respect to the exhaust pipe 300. Heating unit 31
Reference numeral 1 denotes a cylindrical support member 312 having a diameter considerably larger than the outer diameter of the exhaust pipe 300, and a coil-shaped electric heater 31 stretched over the entire inner peripheral surface of the support member.
And 3.

The regulating member 315 is a columnar member having a hole for inserting the exhaust pipe 300 formed along the central axis, and has a heat generating unit 311 on one end (lower side in the figure).
A small-diameter insertion portion 316 is formed so that one end portion (upper end portion in the drawing) is inserted. The restricting member 315 can be divided into two restricting member pieces 315a and 315b on a plane passing through the central axis.

As a material of the regulating member 315, a ceramic or the like having a high insulating property and not melting even at a temperature at which the exhaust pipe 300 melts is desirable. The diameter of the hole of the regulating member 315 is desirably slightly larger than the outer shape of the exhaust pipe 300. This is because if the diameter of the hole is too large, the position of the restricting member 315 will rattle, and the position cannot be restricted.

The loading section 316 includes the heat generating unit 31.
It is desirable that the diameter be slightly smaller than the diameter of 1. This is because, if it is too large, it contacts the heater and hinders temperature rise. On the other hand, if it is too small, the position of the electric heater 313 fluctuates and the position cannot be regulated. Using the exhaust pipe sealing device 310 having the above configuration, the exhaust pipe 300 is sealed as follows.

First, the heat generating unit 311 is arranged at a position where the tip of the exhaust pipe 300 is to be turned off. Next, the exhaust pipe 3
The insertion portion 316 of the regulating member 315 is inserted between the 00 and the heat generating unit 311. Then, electricity is supplied to the electric heater 313 to heat the exhaust pipe 300 and chip off. (Effects of the present embodiment) If the exhaust pipe 300 is chipped off only by the heat generating unit 311 without using the regulating member 315, the electric heater 313 easily contacts the exhaust pipe 300, and the melted exhaust pipe 300 is electrically heated. Heater 31
3, the exhaust pipe 300 may be broken,
If chip-off is performed using the regulating member 315 as described above, this can be performed without the electric heater 313 and the exhaust pipe 300 coming into contact with each other.

Further, since the regulating member 315 has a split shape cut along a plane including the axis of the exhaust pipe 300, after the heating unit 311 is inserted into the exhaust pipe 300, the regulating member 3
15 can be easily mounted between the exhaust pipe 300 and the electric heater 313. (Regarding Modification of the Present Embodiment) In the present embodiment, the regulating member 315 is
Although it can be divided into 5a and 315b, the regulating member 315 does not necessarily have to be a dividable configuration.

In the exhaust pipe sealing device 310 shown in FIG. 26, the heat generating unit 311 is provided outside the charging portion 316 of the regulating member 315.
27, the exhaust pipe sealing device 310 of FIG.
One end of the heat generating unit 311 fits inside the inside. In this case, the same effect can be obtained.

In the exhaust pipe sealing device 310 of FIG. 26, one end of the heat generating unit 311 is fitted into the regulating member 315, but the exhaust pipe sealing device 310 shown in FIG.
In this configuration, both ends of the heat generating unit 311 fit into the regulating member 315. If the restriction is performed at two places in this way, the position of the electric heater 313 and the exhaust pipe 300 can be restricted more reliably to prevent mutual contact.

In the exhaust pipe sealing device 310, the regulating member 315 and the heat generating unit 311 are separately provided.
As in an exhaust pipe sealing device 320 shown in FIG. 29, a configuration in which the support member 312 and the regulating member 315 are integrated may be employed. That is, the exhaust pipe sealing device 320 of FIG. 29 has an integral structure in which an electric heater 322 is disposed on the inner peripheral surface of a cylindrical regulating member 321 having a lid 321a formed on one side. Exhaust pipe 30 in the center of the
There is a hole that fits into zero.

The exhaust pipe sealing device 330 of FIG. 30 also has a support member for supporting the heater and a restricting member integrated with each other, and has a cylindrical restricting member having lid portions 331a and 331b formed on both sides. In this configuration, an electric heater 332 is provided on the inner peripheral surface of the 331. The exhaust pipe sealing device 330 has a cylindrical shape, but can be divided by a plane including the central axis. The exhaust pipe sealing device 330 can be divided into two parts, and FIG. 30 shows only one of the two parts.

Such exhaust pipe sealing devices 320, 330
Even if is used, the exhaust pipe 300 can be chipped off as in the case of the exhaust pipe sealing device 310 by being inserted into the exhaust pipe 300 and operating the electric heater. [Modifications of Embodiments 1 to 14] In the above embodiment, the PDP in which the partition wall 24 is provided on the back panel 20 side is illustrated. However, the same applies to the case where the partition wall is provided on the front panel 10 side. Can be implemented.

In the above embodiment, an AC-type PDP has been described as an example. However, the present invention is not limited to the AC-type PDP, and another substrate is superposed and sealed on a substrate provided with partition walls. Therefore, it can be widely applied to manufacture a gas discharge panel to be manufactured.

[0165]

As described above, according to the present invention, after forming the envelope of the gas discharge panel, when performing the step of sealing the outer peripheral portions of the two substrates with the sealing material, the outer envelope is formed. By performing while adjusting the pressure so that the internal pressure of the container is lower than the external pressure, it becomes possible to seal the top of the partition wall on one substrate and the other substrate in a state of being completely in close contact with each other. Thus, the occurrence of vibration and crosstalk during PDP driving is suppressed.

Here, before forming the envelope, a bonding material is provided on the top of the partition on one of the substrates, and the sealing material is used to seal the outer peripheral portions of both substrates together with the bonding material. If the top of the partition and the other substrate are joined together, the top of the partition and the other substrate are joined over the entire panel, so that the discharge gas can be sealed at a high pressure, and vibration and crosstalk occur. Becomes more remarkable.

In the sealing step, or before and after the sealing step, the top of the partition is bonded to the other substrate by a method of irradiating the top of the partition with energy such as laser light or ultrasonic waves. Similarly, the gap between the top of the partition and the other substrate can be eliminated over the entire panel. Also, when the exhaust pipe is chipped off, the heating element is held in a state where the distance from the exhaust pipe is secured by using the holding means, and the heating element is driven in this state, so that the exhaust pipe can be easily and reliably inserted. You can chip off.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an AC surface discharge type PDP according to an embodiment.

FIG. 2 is a configuration diagram of a display device in which a circuit block is mounted on the PDP of FIG.

FIG. 3 is a diagram schematically showing a cross section of a sealing device used in a sealing step of the first embodiment.

4 is a schematic perspective view of the sealing device shown in FIG.

FIG. 5 is a diagram illustrating a sealing step according to the second embodiment.

FIG. 6 is a diagram illustrating a sealing step according to a third embodiment.

FIG. 7 is a diagram illustrating a sealing step according to a fourth embodiment.

FIG. 8 is a diagram illustrating a sealing step according to a fifth embodiment.

FIG. 9 is a diagram showing a sealing process according to the fifth embodiment.

FIG. 10 is a perspective view illustrating a sealing step according to a seventh embodiment.

FIG. 11 is a diagram illustrating a method for manufacturing a low internal pressure container used in a sealing step according to a seventh embodiment.

FIG. 12 is a schematic configuration diagram illustrating a belt-type heating device used in a sealing step according to a seventh embodiment.

FIG. 13 is an explanatory diagram showing a state change in a sealing step according to the seventh embodiment.

FIG. 14 is a schematic configuration diagram showing a belt-type heating device used in a sealing step in Embodiment 8.

FIG. 15 is a view showing a state in which a sealing step is performed by the belt-type heating device of FIG. 14;

FIG. 16 is a diagram showing a state of a sealing step in the ninth embodiment.

FIG. 17 is a schematic configuration diagram showing a belt-type heating device used in the tenth embodiment.

FIG. 18 is a view showing a state in which a sealing step is performed by the belt-type heating device.

FIG. 19 is a diagram showing a state in which a sealing step according to an eleventh embodiment is performed.

FIG. 20 is a diagram illustrating a state in which a sealing step according to a twelfth embodiment is performed.

FIG. 21 is a partial top view showing a specific example of the shape of the substrate deformation regulating rib according to the twelfth embodiment.

FIG. 22 is a diagram showing a step of bonding the top of the partition wall and the front panel by laser light irradiation in the thirteenth embodiment.

FIG. 23 is a schematic perspective view showing a specific example of a laser beam machine used in Embodiment 13.

FIG. 24 is a diagram illustrating an example of a laser processing machine used in Embodiment 13.

FIG. 25 is a perspective view showing an exhaust pipe sealing device used in the fourteenth embodiment.

FIG. 26 is a schematic sectional view of the exhaust pipe sealing device.

FIG. 27 is a diagram showing a modification of the exhaust pipe sealing device according to the fourteenth embodiment.

FIG. 28 is a view showing a modified example of the exhaust pipe sealing device according to the fourteenth embodiment.

FIG. 29 is a view showing a modification of the exhaust pipe sealing device according to the fourteenth embodiment.

FIG. 30 is a view showing a modification of the exhaust pipe sealing device according to the fourteenth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Front panel 11 Front glass substrate 12 Discharge electrode 13 Dielectric layer 14 Protective layer 20 Back panel 21 Back glass substrate 21a, 21b ventilation hole 22 Address electrode 23 Dielectric layer 24 Partition wall 25 Phosphor layer 26 Piping member 26a Adhesive layer 30 Discharge space 40 Enclosure 41 Sealing material layer 42 Clip 43 Sealing material layer 44 Sealing material inflow preventing rib 45 Bonding material layer 46 Substrate deformation regulating rib 50 Sealing device 70 Low internal pressure container 74 Adhesive material layer 90 Container member 100 Heating Apparatus 200 Laser processing machine 202 Table 203 Laser head 205 Observation head 206 Probe light generator 207 Detector 310 Exhaust pipe sealing device 311 Heating unit 312 Support member 313 Electric heater 315 Control member

 ──────────────────────────────────────────────────続 き Continued on the front page (31) Priority claim number Japanese Patent Application No. Hei 11-66407 (32) Priority date March 12, 1999 (March 12, 1999) (33) Priority claim country Japan (JP) (31) Priority claim number Japanese Patent Application No. 11-119446 (32) Priority date April 27, 1999 (April 27, 1999) (33) Priority claim country Japan (JP) (31) Priority claim number Japanese Patent Application No. 11-122106 (32) Priority Date April 28, 1999 (April 28, 1999) (33) Priority Country Japan (JP) (72) Inventor Junichi Hibino 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Nobuyuki Kirihara 1006 Kadoma, Kazuma, Osaka Inside Shimo Denki Sangyo Co., Ltd. (Reference) 5C012 AA09 BC03 BC04 5C040 FA01 HA01 HA05 HA06 LA17 MA23

Claims (59)

[Claims] An envelope forming step of forming an envelope by disposing a second substrate on a partition-side surface of a first substrate having a main surface on which a partition separating light-emitting cells is formed, A method for manufacturing a gas discharge panel, comprising: a sealing step of sealing the outer peripheral portions of both substrates in the envelope with a sealing material; and a sealing step of sealing a discharge gas inside the envelope. The method of manufacturing a gas discharge panel according to claim 1, wherein the sealing step includes a pressure adjusting sub-step of adjusting a pressure so that an internal pressure of the envelope is lower than an external pressure. 2. The method according to claim 1, wherein in the sealing step, the pressure adjusting sub-step is started before the sealing material is cured. 3. The sealing material is made of a material that is softened by externally applied energy, and in the sealing step, the sealing is performed by softening and then hardening the sealing material. The method for manufacturing a gas discharge panel according to claim 2, wherein 4. The envelope formed in the envelope forming step is provided with a communication path for communicating the inside and the outside of the envelope with each other. The method for manufacturing a gas discharge panel according to claim 2 or 3, wherein gas inside the enclosure is exhausted to the outside from the communication path. 5. The envelope formed in the envelope forming step has a through-hole for communicating between the inside and the outside of the envelope, and is connected to the through-hole. The method for manufacturing a gas discharge panel according to claim 4, wherein a pipe is bonded via crystallized glass, and in the pressure adjusting sub-step, a gas inside the envelope is exhausted from the pipe to the outside. . 6. The sealing step includes a hermetic sealing sub-step for shutting off gas flow between an inner space and an outer space of the envelope, and the pressure adjusting sub-step includes: 2. The gas discharge panel according to claim 1, wherein the pressure in the envelope after the sealing sub-step is performed is lower than the pressure in the envelope before the hermetic sealing sub-step is performed. Method. 7. The pressure adjusting sub-step, wherein the pressure in the internal space is reduced by using a low internal pressure vessel having an internal pressure lower than the pressure in the internal space of the envelope. Method for manufacturing a gas discharge panel. 8. The envelope formed in the envelope forming step, wherein the low internal pressure container is connected, and the internal space of the external container and the internal space of the low internal pressure container have a gas flow through a shielding material. 8. The gas discharge according to claim 7, wherein in the pressure adjusting sub-step, the pressure in the internal space of the envelope is reduced by canceling an interruption of gas flow by the shielding material. 9. Panel manufacturing method. 9. The shielding material is a material that melts or decomposes by applying a stimulus, and in the pressure adjustment sub-step, a gas flow is enabled by applying a stimulus to the shielding material to melt or decompose the shielding material. 9. The method according to claim 8, wherein
A method for manufacturing the gas discharge panel according to the above. 10. A container having an internal space communicating with an internal space of the envelope is connected to the envelope formed in the envelope forming step, and in the pressure adjusting sub-step, By cooling the interior space of the container to a lower temperature than before the hermetic sealing sub-step was performed,
7. The method according to claim 6, wherein the pressure is reduced. 11. The pressure adjusting sub-step includes reducing a pressure by cooling an inner space of the envelope to a lower temperature than before the hermetic sealing sub-step is performed. A method for manufacturing a gas discharge panel according to claim 6. 12. In the hermetic sealing sub-step, the inner space and the outer space of the envelope are heated by heating the envelope to soften a sealing material to seal an outer peripheral portion of the envelope. 7. The method for manufacturing a gas discharge panel according to claim 6, wherein a gas flow between the gas discharge panel and the gas discharge panel is cut off. 13. The envelope formed in the envelope forming step is provided with a communication path for communicating an inner space and an outer space of the envelope, and in the hermetic sealing sub-step, A state in which gas flow between the internal space and the external space of the envelope is shut off by softening the sealing material to seal the outer peripheral portion of the envelope and sealing the communication path. The method for manufacturing a gas discharge panel according to claim 12, wherein: 14. A gas adsorbing member is provided in the envelope formed in the envelope forming step or in a container having an internal space communicating with the internal space of the envelope. 7. The method according to claim 6, wherein in the adjusting sub-step, the pressure of the internal space is reduced by a gas adsorbing action of the gas adsorbing member. 15. A gas adsorbing member which exerts a gas adsorbing effect in response to a stimulus applied from the outside is used, and in the pressure adjusting sub-step, the gas adsorbing member exerts a gas adsorbing effect. To
2. A stimulus is applied to the gas adsorption member.
5. The method for manufacturing a gas discharge panel according to 4. 16. The pressure adjusting sub-step includes applying a stimulus to the gas adsorbing member so that the gas adsorbing function of the gas adsorbing member is exerted after the start of the airtight sealing sub-step. A method for manufacturing a gas discharge panel according to claim 15. 17. A gas capable of molecular bonding is filled in the inside of the envelope formed in the envelope forming step or in a container having an internal space communicating with the internal space of the envelope. 7. The method according to claim 6, wherein in the pressure adjusting sub-step, the pressure of the internal space is reduced by molecular bonding of gas in the envelope. 18. The gas capable of molecular bonding is one in which the molecular bonding is performed in response to a stimulus applied from the outside, and in the pressure adjusting sub-step, the gas in the envelope includes a gas for molecular bonding. 18. The method according to claim 17, wherein the pressure in the inner space is reduced by applying a stimulus to the gas discharge panel. 19. The method according to claim 18, wherein in the pressure adjusting sub-step, the gas is stimulated after the airtight sealing sub-step is started. 20. The sealing step, further comprising: a hermetic sealing sub-step for shutting off a gas flow between the inner space and the outer space of the envelope. 2. The method as claimed in claim 1, wherein the pressure in the outer space of the vessel is increased later than before the hermetic sealing sub-step is performed. 21. The sealing material is made of a material that is softened by an external stimulus. In the hermetic sealing sub-step, the sealing material is softened so that the space between the inner space and the outer space of the envelope is reduced. 21. The method according to claim 6, further comprising: performing a pressure adjusting step after the airtight sealing sub-step is started.
The method for manufacturing a gas discharge panel according to any one of the above. 22. The sealing step, wherein the sealing material is sealed between the outer peripheral portions of both substrates of the envelope formed in the envelope forming step before the sealing is performed by the sealing material. The method for manufacturing a gas discharge panel according to any one of claims 6 to 20, further comprising a pre-sealing sub-step of sealing with a sealing material different from the above. 23. The sealing method according to claim 1, wherein in the sealing step, the two substrates are sandwiched by fasteners to perform sealing while pressing the two substrates. A method for manufacturing a gas discharge panel according to any one of the above. 24. The method according to claim 23, wherein, in the sealing step, an area where the partition walls are formed on the two substrates is sandwiched by the fasteners. 25. A method according to claim 25, wherein the first step is performed in the step of forming the envelope.
At least one of the outer periphery of the substrate and the second substrate is provided with a deformation preventing member that prevents the first substrate or the second substrate from being deformed due to the pressing by the fastener. The method for manufacturing a gas discharge panel according to claim 23, wherein 26. The method according to claim 25, wherein the deformation preventing member is formed of the same material as the partition. 27. The method according to claim 25, wherein the deformation preventing member is provided so as to prevent the sealing material from flowing into the inside of the envelope. 28. The method according to claim 25, wherein the deformation preventing member is formed at a height equal to the height of the partition wall. 29. In the sealing step, the sealing is performed in a state where the envelope formed in the envelope forming step is provided with a displacement preventing means for preventing a relative displacement between the two substrates. The method for manufacturing a gas discharge panel according to claim 1, wherein: 30. The method according to claim 30, wherein the first step is a step of forming an envelope.
The gas according to claim 1, wherein an inflow prevention member for preventing the sealing material from flowing into the envelope is provided on at least one outer peripheral portion of the substrate and the second substrate. A method for manufacturing a discharge panel. 31. The method according to claim 30, wherein the sealing material is disposed outside the inflow prevention member in the envelope forming step. 32. A bonding material disposing step of disposing a bonding material for bonding the partition top and the second substrate to the top of the partition of the first substrate before the envelope forming step, In the sealing step, the top of the partition wall and the second substrate are bonded by the bonding material together with the sealing of the outer peripheral portions of both substrates by the sealing material. 20. The method for manufacturing a gas discharge panel according to any one of 20. 33. The method according to claim 3, wherein in the sealing step, the pressure adjusting sub-step is started before the sealing material and the bonding material are hardened.
3. The method for manufacturing a gas discharge panel according to 2. 34. The manufacturing of the gas discharge panel according to claim 32, wherein in the sealing step, the sealing material and the bonding material are softened and then cured to perform sealing and bonding. Method. 35. The gas according to claim 34, wherein the sealing material and the bonding material are low-melting glass, and the softening temperature of the bonding material is equal to or lower than the softening temperature of the sealing material. A method for manufacturing a discharge panel. 36. An envelope forming step of forming an envelope by disposing a second substrate on a partition-side surface of a first substrate having a main surface on which a partition separating light emitting cells is formed, and A sealing step of sealing the outer peripheral portions of both substrates in the envelope with a sealing material, and irradiating energy to the tops of the partitions of the envelope to soften the tops of the partitions and join them to the second substrate A method of manufacturing a gas discharge panel. 37. The method according to claim 37, wherein a top of the partition wall of the envelope formed in the envelope forming step is formed of a material having a property of absorbing energy irradiated in the joining step. 36. The method for producing a gas discharge panel according to 36. 38. The partition wall top of the envelope formed in the envelope forming step is formed of a black material.
A method for manufacturing the gas discharge panel according to the above. 39. A bonding material arranging step of arranging a bonding material on a top portion of a partition wall of a first substrate having partition walls separating light emitting cells formed on a main surface, and a surface of the first substrate on which the bonding member is provided. An envelope forming step of forming an envelope by disposing a second substrate on the upper side, a sealing step of sealing outer peripheral portions of both substrates in the envelope with a sealing material, A step of irradiating energy to a bonding material disposed on the top of the partition wall of the enclosure to soften the bonding material and bond the bonding material to the second substrate. 40. The bonding material according to claim 39, wherein the bonding material provided in the bonding material providing step is formed of a material having a property of absorbing energy applied in the bonding step. Manufacturing method of gas discharge panel. 41. The bonding material provided in the bonding material providing step is made of a black material.
A method for manufacturing the gas discharge panel according to the above. 42. The method according to claim 42, wherein at least the first of the sealing step and the joining step includes a pressure adjusting sub-step of adjusting the internal pressure of the envelope to be lower than the external pressure. The method for manufacturing a gas discharge panel according to any one of claims 36 to 41. 43. The sealing step according to claim 36, wherein the shape of the partition wall in the envelope is observed, and the condition for irradiating the energy is controlled based on the observed result. Method for manufacturing a gas discharge panel. 44. A bonding material arranging step of arranging a bonding material on top of a partition wall of a first substrate on which a partition wall separating light emitting cells is formed on a main surface; and a surface of the first substrate on which the bonding material is provided. An envelope forming step of forming an envelope by disposing a second substrate on the upper side; and a bonding step of heating the second substrate to soften the bonding material and bond the first substrate. A method for manufacturing a gas discharge panel, comprising: 45. An envelope forming step of forming an envelope by arranging a second substrate on a partition-side surface of a first substrate having a main surface on which a partition for separating the light emitting cells is formed; A sealing step of sealing the outer peripheral portions of both substrates in the envelope with a sealing material, and a bonding step of heating the second substrate to soften the top of the partition wall and bond the first substrate to the first substrate. A method for manufacturing a gas discharge panel, comprising: 46. A method for manufacturing a gas discharge panel, comprising a sealing step of melting and sealing an exhaust pipe attached to an envelope in which a pair of substrates are opposed to each other, wherein A gas discharge, comprising: a first sub-step around which a heating element is mounted while keeping a distance from the exhaust pipe; and a second sub-step of heating the exhaust pipe with the disposed heating element. Panel manufacturing method. 47. In the first sub-step, a heating element is mounted in a state where a distance from the exhaust pipe is secured by interposing a regulating member between the exhaust pipe and the heating element. The method for manufacturing a gas discharge panel according to claim 46. 48. An exhaust pipe sealing device for melting and sealing an exhaust pipe attached to an envelope in which a pair of substrates are opposed to each other, wherein the exhaust pipe is attached to the exhaust pipe, An exhaust pipe sealing device, comprising: a heating element holding means for holding the heating element at a distance from the heating element. 49. An exhaust pipe sealing device for sealing by melting an exhaust pipe attached to an envelope in which a pair of substrates are arranged to face each other, wherein a heating element is formed from an outside of the exhaust pipe. A heating unit that is held in a cylindrical shape having a large diameter; and a regulating member that regulates a mounting position of the heating unit with respect to the exhaust pipe so that the heating element is arranged at a distance around the exhaust pipe. An exhaust pipe sealing device comprising: 50. The exhaust pipe sealing device according to claim 49, wherein at least one of the regulating member and the heat generating unit is dividable along a plane including an axis of the exhaust pipe. 51. The control device according to claim 49, wherein the restricting member is interposed at two or more positions between the heat generating unit and the exhaust pipe.
The exhaust pipe sealing device as described in the above. 52. The exhaust pipe sealing device according to claim 49, wherein in the heat generating unit, the heat generating element is held by an insulator in a state of being formed in a coil shape. 53. A gas discharge panel manufactured by the manufacturing method according to any one of claims 1 to 3 and 6 to 20. 54. A gas discharge panel in which a second substrate is disposed to face a first substrate having a main surface on which a partition wall separating light emitting cells is formed, and a second substrate is disposed opposite to the outer peripheral portions of both substrates. The top of the partition wall of the first substrate and the second substrate are fused by a material forming the partition wall. 55. A partition for separating the light emitting cells is formed by disposing a second substrate on the outer peripheral portion of the first substrate having a main surface formed on the partition side, with a sealing material interposed therebetween. An outer container housing portion for housing the outer container, and sealing the outer peripheral portions of both substrates in the outer container housed in the outer container housing portion by softening and then hardening the sealing material. A sealing device for a gas discharge panel, comprising: a sealing means for performing the pressure control; 56. The gas discharge according to claim 55, wherein the sealing material is a low-melting glass, and the sealing means is formed of a heating element that heats and softens the sealing material. Panel sealing device. 57. The envelope accommodated in the envelope accommodating portion, wherein a bonding material made of low-melting glass is provided on the top of the partition wall of the first substrate. The sealing device for a gas discharge panel according to claim 56, wherein the bonding material is heated and softened together with the material. 58. An envelope housed in the envelope housing portion, wherein a bonding material is provided on a top of the partition wall of the first substrate, and the bonding material is softened and then cured. The sealing device for a gas discharge panel according to claim 55, further comprising a joining unit that joins the top of the partition wall and the second substrate. 59. The bonding material according to claim 58, wherein the bonding material provided at the top of the partition wall is made of a low-melting glass, and the bonding means is made of a laser light irradiation device for irradiating a laser beam. Sealing device for gas discharge panel.