JP2006318738A - Device of manufacturing display device - Google Patents

Device of manufacturing display device Download PDF

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JP2006318738A
JP2006318738A JP2005139646A JP2005139646A JP2006318738A JP 2006318738 A JP2006318738 A JP 2006318738A JP 2005139646 A JP2005139646 A JP 2005139646A JP 2005139646 A JP2005139646 A JP 2005139646A JP 2006318738 A JP2006318738 A JP 2006318738A
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substrate
substrates
connection material
melt
manufacturing apparatus
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JP4757533B2 (en
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Tsutae Shinoda
傳 篠田
Hiroshi Kajiyama
博司 梶山
Takashi Nishio
▲隆▼ 西尾
Toshiharu Kurauchi
倉内　　利春
Hisahiro Terasawa
寿浩 寺澤
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Ulvac Inc
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Ulvac Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a plasma display panel with accuracy in a short time. <P>SOLUTION: When a first and a second substrates 11, 21 are superposed with positioning, the second substrate 21 is placed on a barrier rib 15, and a connecting material 31 is arranged on a stuck-out part 17 where one of the substrates is sticking out from the other to fuse the connecting material 31, a fused object 32 is pulled into a gap between the first and the second substrates 11, 21 by capillary force. If a superposed part of the first and the second substrates 11, 21 are surrounded by the pulled-in fused object 32, the superposed part of the first and the second substrates 11, 21 is sealed, and if the fused object 32 is solidified, the first and the second substrates 11, 21 are fixed. After the first and the second substrates 11, 21 are superposed, they are kept in a state of being loaded on the barrier rib 15, so that there is no fear of misregistration of the first and the second substrates 11, 21 in a process of fixing them. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明はＰＤＰやＦＥＤのような表示装置を製造する製造装置に関する。   The present invention relates to a manufacturing apparatus for manufacturing a display device such as a PDP or FED.

従来より、ＰＤＰ(Plasma Display Panel)やＦＥＤ(Field Emission Display)のような表示装置の製造には、２枚のパネルを接続材料で固定する方法が採用されている。   Conventionally, a method of fixing two panels with a connecting material has been adopted for manufacturing a display device such as a plasma display panel (PDP) or a field emission display (FED).

従来技術の表示装置の製造方法の一例について説明すると、先ず、第一、第二のパネルのうち、いずれか一方のパネルの基板表面に、接続材料をリング状に配置する。   An example of a conventional method for manufacturing a display device will be described. First, a connection material is arranged in a ring shape on the substrate surface of one of the first and second panels.

例えばＰＤＰを製造する場合には、第一のパネルには隔壁が形成されており、接続材料の高さは、隔壁の高さよりも高いので、第一、第二のパネルを重ね合わせると、一方のパネル上の接続材料に、他方のパネルが載せられる。第一、第二のパネルを重ね合わせた状態で、全体を加熱しながら押圧すると、接続材料が加熱によって溶融し、押圧によって溶融した接続材料が第一、第二の基板の両方の表面に密着した状態で押しつぶされる。   For example, when manufacturing a PDP, a partition is formed on the first panel, and the height of the connecting material is higher than the height of the partition. Therefore, when the first and second panels are overlapped, The other panel is placed on the connecting material on the other panel. When the whole is pressed while heating the first and second panels, the connecting material melts by heating, and the connecting material melted by pressing adheres to both surfaces of the first and second substrates. It is crushed in the state.

接続材料が押しつぶされ、接続材料の高さが隔壁と、第二のパネルの表面が第一のパネルの隔壁に密着し、第二のパネルが隔壁に載せられた状態になり、全体を冷却し、接続材料の温度を下げると接続材料が第一、第二の基板の表面に密着した状態で固化し、第一、第二のパネルの間の空間をリング状に取り囲む固化物が形成される。   The connecting material is crushed, the height of the connecting material is the partition wall, the surface of the second panel is in close contact with the partition wall of the first panel, the second panel is placed on the partition wall, and the whole is cooled When the temperature of the connection material is lowered, the connection material is solidified in close contact with the surfaces of the first and second substrates, and a solidified material is formed that surrounds the space between the first and second panels in a ring shape. .

第一、第二のパネルを加熱する時に、第一、第二のパネルの温度を急激に上昇させると、第一、第二のパネルに熱膨張に伴う歪みが生じ、その内部回路が破損する場合がある。従って、従来の製造方法では、第一、第二のパネルの加熱を長時間かけて接続材料が溶融する温度まで昇温させる必要があり、生産時間の増加と、加熱に要するエネルギーの量が問題であった。   When the first and second panels are heated rapidly when the first and second panels are heated, the first and second panels are distorted due to thermal expansion, and the internal circuit is damaged. There is a case. Therefore, in the conventional manufacturing method, it is necessary to heat the first and second panels to a temperature at which the connection material melts over a long period of time, which increases the production time and the amount of energy required for heating. Met.

上記接続方法では接続材料をリング状に配置する容易性から有機材料が含有された接続材料が用いられるが、そのような接続材料は加熱されると有機材料が熱分解して汚染ガスが発生する。また、上記製造方法では接続材料以外も昇温するため、昇温によって他の部材（例えば第一、第二のパネル）から、Ｈ2Ｏガス、ＣＯガス、ＣＯ2ガス等の汚染ガスが発生することがあり、その汚染ガスがプラズマディスプレイパネルの性能に悪影響を与える。従って、従来のプラズマディスプレイパネルでは、加熱終了後に、汚染ガスを除去する脱ガスの工程が必要であり、その脱ガスの工程も生産時間が増加する要因であった。 In the above connection method, a connection material containing an organic material is used because of the ease of arranging the connection material in a ring shape. When such a connection material is heated, the organic material is thermally decomposed to generate a pollutant gas. . In the above manufacturing method, the temperature of materials other than the connecting material is also raised, so that polluted gases such as H 2 O gas, CO gas, and CO 2 gas are generated from other members (for example, the first and second panels) due to the temperature rise. The contaminated gas may adversely affect the performance of the plasma display panel. Therefore, in the conventional plasma display panel, a degassing process for removing the pollutant gas is necessary after the heating is completed, and the degassing process is a factor that increases the production time.

更に、第一、第二のパネルを加熱押圧するときに、溶融した接続材料３１上で第二のパネルの位置ずれが起こることがあり、第一、第二のパネルを精度良く張り合わせることは困難であった。
特開２０００−５１０２８１号公報 特開２００２−０７５１９７号公報 特開２００２−２６５２３７号公報 Furthermore, when the first and second panels are heated and pressed, the second panel may be displaced on the melted connection material 31, and the first and second panels may be bonded together with high accuracy. It was difficult.
JP 2000-510281 A JP 2002-075197 JP 2002-265237 A

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、プラズマディスプイレイパネルを短時間で製造することである。   The present invention was created in order to solve the above-mentioned disadvantages of the prior art, and an object of the present invention is to manufacture a plasma display panel in a short time.

上記課題を解決するために請求項１記載の発明は、第一のパネルの第一の基板と、第二のパネルの第二の基板とが間隔保持部材を挟んで、前記第一、第二の基板の一方が他方からはみ出して重ね合わされ、前記第一の基板と前記第二の基板との間に位置する表示範囲が外部雰囲気から遮断された表示装置を製造する製造装置であって、前記第一、第二の基板のうち、一方の基板が他方の基板の縁からはみ出すように、前記第一、第二のパネルを重ね合わせ、前記第一、第二の基板のうち、前記間隔保持部材が配置されていない方の基板を前記間隔保持部材で支持させた時に、前記一方の基板の表面の、前記他方の基板の縁からはみ出したはみ出し部分上に配置された接続材料を溶融させる加熱手段を有する製造装置である。
請求項２記載の発明は、請求項１記載の製造装置であって、前記他方の基板の縁に沿って前記接続材料を配置するように構成された製造装置である。
請求項３記載の発明は、請求項１又は請求項２のいずれか１項記載の製造装置であって、前記第一、第二のパネルの重ね合わせが、前記第一、第二の基板が他方の基板の縁からはみ出すようにした時に、前記加熱手段は、前記第一の基板の前記はみ出し部分上で前記接続材料の溶融物を前記第一、第二の基板の間に引き込んだ後、前記第二の基板の前記はみ出し部分上で前記接続材料を溶融させ、その溶融物を第一、第二の基板の間の間隙に引き込ませ、先に引き込まれた前記溶融物に接続されるように構成された製造装置である。
請求項４記載の発明は、請求項１乃至請求項３のいずれか１項記載の製造装置であって、前記接続材料の底面が前記はみ出し部分に接触し、前記接続材料の表面の少なくとも一部が、前記はみ出し部分上の前記基板の縁に接触するように、前記接続材料が配置可能に構成された製造装置である。
請求項５記載の発明は、請求項１乃至請求項３のいずれか１項記載の製造装置であって、前記接続材料の底面が前記はみ出し部分に接触し、前記接続材料の表面が前記第二の基板から離間して、前記接続材料を配置可能に構成された製造装置である。
請求項６記載の発明は、請求項１乃至請求項５のいずれか１項記載の製造装置であって、前記加熱手段は、前記接続材料にレーザー光を照射するように構成された製造装置である。
請求項７記載の発明は、請求項６記載の製造装置であって、前記加熱手段は、前記レーザー光の照射位置を、前記はみ出し部分上の前記他方の基板の縁に沿って移動させるように構成された製造装置である。 In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that the first substrate of the first panel and the second substrate of the second panel sandwich the spacing member, and the first and second A manufacturing apparatus for manufacturing a display device in which one of the substrates protrudes from and overlaps the other, and a display range located between the first substrate and the second substrate is blocked from an external atmosphere, The first and second panels are overlapped so that one of the first and second substrates protrudes from the edge of the other substrate, and the spacing is maintained among the first and second substrates. Heating that melts the connecting material disposed on the protruding portion of the surface of the one substrate that protrudes from the edge of the other substrate when the substrate on which the member is not disposed is supported by the spacing member. A manufacturing apparatus having means.
A second aspect of the present invention is the manufacturing apparatus according to the first aspect, wherein the connecting material is arranged along an edge of the other substrate.
Invention of Claim 3 is a manufacturing apparatus of any one of Claim 1 or Claim 2, Comprising: Superposition of said 1st, 2nd panel is said 1st, 2nd board | substrate. When the heating means protrudes from the edge of the other substrate, the heating means draws the melt of the connection material between the first and second substrates on the protruding portion of the first substrate. The connecting material is melted on the protruding portion of the second substrate, the melt is drawn into the gap between the first and second substrates, and is connected to the previously drawn melt. It is the manufacturing apparatus comprised in this.
Invention of Claim 4 is a manufacturing apparatus of any one of Claim 1 thru | or 3, Comprising: The bottom face of the said connection material contacts the said protrusion part, At least one part of the surface of the said connection material However, the manufacturing apparatus is configured such that the connection material can be arranged so as to contact the edge of the substrate on the protruding portion.
Invention of Claim 5 is a manufacturing apparatus of any one of Claim 1 thru | or 3, Comprising: The bottom face of the said connection material contacts the said protrusion part, The surface of the said connection material is said 2nd. It is the manufacturing apparatus comprised so that the said connection material could be arrange | positioned apart from the board | substrate of this.
Invention of Claim 6 is a manufacturing apparatus of any one of Claim 1 thru | or 5, Comprising: The said heating means is a manufacturing apparatus comprised so that a laser beam might be irradiated to the said connection material. is there.
A seventh aspect of the present invention is the manufacturing apparatus according to the sixth aspect, wherein the heating means moves an irradiation position of the laser light along an edge of the other substrate on the protruding portion. It is the comprised manufacturing apparatus.

本発明によれば、第一、第二の基板を重ね合わせた時には、第二の基板が隔壁で支持された状態になっており、その状態を維持したまま接続材料の溶融物が第一、第二の基板の間の間隙に入り込むので、第一、第二の基板の位置ずれが起こり難い。接続材料の加熱にレーザー光を用いれば、接続材料だけを選択して加熱可能である上、無機材料のみからなる接続材料を用いることができるので、第一、第二の基板を貼り合せる工程で、汚染ガスの発生量が少なく、汚染ガスを除去する工程が不要になる。   According to the present invention, when the first and second substrates are overlaid, the second substrate is in a state of being supported by the partition walls, and the melt of the connecting material is maintained in that state, Since it enters the gap between the second substrates, the first and second substrates are unlikely to be misaligned. If laser light is used for heating the connection material, it is possible to select and heat only the connection material, and it is possible to use a connection material made of only an inorganic material, so in the process of bonding the first and second substrates together The amount of polluted gas generated is small, and the process of removing the pollutant gas is not necessary.

図１の符号１は表示装置の一例であるプラズマディスプレイパネルを示しており、プラズマディスプレイパネル１は第一、第二のパネル１０、２０を有している。第一、第二のパネル１０、２０は第一、第二の基板１１、２１と、前記第一、第二の基板１１、２１表面上にそれぞれ配置された第一、第二の電極（ここでは不図示）とを有している。   Reference numeral 1 in FIG. 1 indicates a plasma display panel which is an example of a display device. The plasma display panel 1 includes first and second panels 10 and 20. The first and second panels 10 and 20 include first and second substrates 11 and 21 and first and second electrodes (here, respectively) disposed on the surfaces of the first and second substrates 11 and 21. (Not shown).

第一のパネル１０は更に、第一の基板１１の表面上に形成された複数の隔壁１５を有しており、第二の基板２１は第一の基板１１の間隔保持部材（隔壁）１５が形成された面上に載せられている。   The first panel 10 further includes a plurality of partition walls 15 formed on the surface of the first substrate 11, and the second substrate 21 includes a spacing member (partition wall) 15 for the first substrate 11. It is placed on the formed surface.

隔壁１５は少なくとも先端が第一のパネル１０の表面で露出しており、隔壁１５の先端は、第二のパネル２０の第二の基板２１上に露出する面（例えば、第二の基板２１表面や、第二の電極表面や、第二の基板２１上の保護膜表面）に接触している。   At least the tip of the partition wall 15 is exposed on the surface of the first panel 10, and the tip of the partition wall 15 is a surface exposed on the second substrate 21 of the second panel 20 (for example, the surface of the second substrate 21). Or the surface of the second electrode or the surface of the protective film on the second substrate 21).

隔壁１５の先端は、第一のパネル１０表面に露出する他の表面（例えば第一の基板１１表面や、第一の電極の表面や、保護膜の表面）よりも高く突き出されているので、第二の基板２１は隔壁１５が高く突き出された分だけ持ち上げられ、第一、第二の基板１１、２１の間には間隙が形成されている。   Since the tip of the partition wall 15 protrudes higher than other surfaces exposed on the surface of the first panel 10 (for example, the surface of the first substrate 11, the surface of the first electrode, and the surface of the protective film), The second substrate 21 is lifted by the amount by which the partition wall 15 protrudes high, and a gap is formed between the first and second substrates 11 and 21.

隔壁１５と隔壁１５との間の空間には放電ガスが充填されており、第一、第二の電極に電圧を印加すると、電圧が印加された第一、第二の電極の間の領域（発光領域）で放電ガスがプラズマ化して励起光（例えば紫外線）が発生し、発光領域に配置された蛍光体材料に励起光が当たって可視光が発生する。   The space between the barrier ribs 15 is filled with a discharge gas. When a voltage is applied to the first and second electrodes, a region between the first and second electrodes to which the voltage is applied ( In the emission region), the discharge gas is turned into plasma and excitation light (for example, ultraviolet rays) is generated, and excitation light strikes the phosphor material disposed in the emission region to generate visible light.

隔壁１５と隔壁１５との間の空間は第二のパネル２０で蓋をされており、所望の発光領域で放電ガスをプラズマ化させる時には、隔壁１５を挟んで隣接する発光領域にはプラズマが伝わらないので、所望の発光領域だけから可視光を発生させることができる。   The space between the barrier ribs 15 is covered with a second panel 20, and when the discharge gas is turned into plasma in a desired light emitting region, the plasma is transmitted to the adjacent light emitting regions across the barrier rib 15. Therefore, visible light can be generated only from a desired light emitting region.

第一、第二の基板１１、２１のうち、少なくとも一方は透明基板で構成されているので、発光領域で発生した可視光は、透明基板を通って外部に放出される。従って、所望の発光領域だけを発光させることで、このプラズマディスプレイパネル１は図形や文字等の画像情報を表示することができる。   Since at least one of the first and second substrates 11 and 21 is made of a transparent substrate, visible light generated in the light emitting region is emitted to the outside through the transparent substrate. Therefore, the plasma display panel 1 can display image information such as figures and characters by emitting light only in a desired light emitting region.

図１の符号１９は、第一、第二の基板１１、２１との間の空間のうち、発光領域が配置された範囲である表示範囲を示している。表示範囲１９の周囲にはリング状の封止部材３３が配置されており、表示範囲１９は封止部材３３と第一、第二の基板１１、２１とで取り囲まれ、表示範囲１９に外部雰囲気の大気が浸入しないようになっている。   Reference numeral 19 in FIG. 1 indicates a display range that is a range in which a light emitting region is arranged in a space between the first and second substrates 11 and 21. A ring-shaped sealing member 33 is disposed around the display range 19. The display range 19 is surrounded by the sealing member 33 and the first and second substrates 11 and 21, and the display range 19 has an external atmosphere. The atmosphere does not enter.

第一、第二の基板１１、２１は少なくとも一部分が封止部材３３よりも外側にはみ出し、そのはみ出した部分の表面には接続端子が露出している。接続端子は第一、第二の電極に接続されているので、第一、第二の電極に電圧を印加するため、接続端子に外部回路の端子を接続すれば、外部回路の電圧を電極に印加することができる。   At least a part of the first and second substrates 11 and 21 protrudes outside the sealing member 33, and a connection terminal is exposed on the surface of the protruding part. Since the connection terminal is connected to the first and second electrodes, in order to apply a voltage to the first and second electrodes, if the terminal of the external circuit is connected to the connection terminal, the voltage of the external circuit is applied to the electrode. Can be applied.

次に、このプラズマディスプレイパネル１を製造する工程の一例について説明する。
第一、第二の基板１１、２１を、第一の基板１１の隔壁１５及び第一の電極が配置された側の面と、第二の基板２１の第二の電極が配置された側の面とが対向するように配置し、第一、第二の電極が互いに対向するように位置合わせし、第一、第二の基板１１、２１の放電ガスを封止すべき領域（例えば、第一、第二の電極が位置する領域）を対向させ、第一、第二の基板１１、２１を重ね合わせて、隔壁１５に第二の基板２１を載せる。 Next, an example of a process for manufacturing the plasma display panel 1 will be described.
The first and second substrates 11 and 21 are arranged on the side of the first substrate 11 on which the partition wall 15 and the first electrode are disposed, and on the side of the second substrate 21 on which the second electrode is disposed. It arrange | positions so that a surface may oppose, it positions so that a 1st, 2nd electrode may mutually oppose, and the area | region (for example, 1st, 2nd) which should seal the discharge gas of the 2nd board | substrates 11 and 21 The first and second substrates 11 and 21 are overlapped with each other, and the second substrate 21 is placed on the partition wall 15.

ここでは、第一、第二の基板１１、２１の平面形状は四角形であって、第一、第二の基板１１、２１を重ね合わせた時に、四辺のうち互いに平行な二辺が、他方の基板１１、２１の二辺と平行になるようになっている。   Here, the planar shape of the first and second substrates 11 and 21 is a quadrangle, and when the first and second substrates 11 and 21 are overlapped, two sides that are parallel to each other of the four sides are the other side. The two sides of the substrates 11 and 21 are parallel to each other.

図３の符号Ｘは、第一の基板１１の互いに平行な二辺と、その二辺と平行な第二の基板２１の二辺が伸びる方向を示しており、同図の符号Ｙは第一の基板１１の他の二辺と、その二辺と平行な第二の基板２１の二辺が伸びる方向を示している。   3 indicates a direction in which two sides of the first substrate 11 are parallel to each other and two sides of the second substrate 21 parallel to the two sides extend, and the symbol Y in FIG. The other two sides of this substrate 11 and the direction in which the two sides of the second substrate 21 parallel to the two sides extend are shown.

ここでは、第一の基板１１のＸ方向の長さは、第二の基板２１のＸ方向の長さよりも短く、第一の基板１１のＹ方向の長さは、第二の基板２１のＹ方向の長さよりも長くされており、第一、第二の基板１１、２１は位置合わせによって、平面形状の略中央部分が重なり合うようになっているので、第一の基板１１のＸ方向の両端部は第二の基板２１からはみ出し、第二の基板２１のＹ方向の両端部は第一の基板１１からはみ出している。従って、第一、第二の基板１１、２１の表面には他方の基板１１、２１からはみ出した部分が２つずつ形成されている。   Here, the length of the first substrate 11 in the X direction is shorter than the length of the second substrate 21 in the X direction, and the length of the first substrate 11 in the Y direction is Y of the second substrate 21. Since the first and second substrates 11 and 21 are aligned with each other so that the substantially central portions of the planar shape are overlapped with each other, both ends of the first substrate 11 in the X direction are overlapped. The portion protrudes from the second substrate 21, and both end portions in the Y direction of the second substrate 21 protrude from the first substrate 11. Accordingly, two portions protruding from the other substrates 11 and 21 are formed on the surfaces of the first and second substrates 11 and 21, respectively.

図３の符号１７は第一の基板１１の表面のうち、第二の基板２１の外周よりも外側に位置するはみ出し部分を示しており、同図の符号２７は第二の基板２１の表面のうち、第一の基板１１の外周よりも外側に位置するはみ出し部分を示している。   Reference numeral 17 in FIG. 3 indicates a protruding portion located outside the outer periphery of the second substrate 21 in the surface of the first substrate 11, and reference numeral 27 in FIG. 3 indicates the surface of the second substrate 21. Of these, the protruding portion located outside the outer periphery of the first substrate 11 is shown.

上記図３に示した第一、第二の基板１１、２１の位置関係を維持したまま、第一、第二の基板１１、２１を、第一の基板１１のはみ出し部分１７を上側に向け、２つのはみ出し部分１７上に、細長の接続材料３１をそれぞれ第二の基板２１の縁２８に沿って配置し（図４）、次いで、製造装置の加熱手段（ここでは不図示）を２つのはみ出し部分１７のうち、一方のはみ出し部分１７上に位置させる。   While maintaining the positional relationship between the first and second substrates 11 and 21 shown in FIG. 3, the first and second substrates 11 and 21 face the protruding portion 17 of the first substrate 11 upward, On each of the two protruding portions 17, an elongated connecting material 31 is arranged along the edge 28 of the second substrate 21 (FIG. 4), and then the heating means (not shown here) of the manufacturing apparatus is set to the two protruding portions. One of the portions 17 is positioned on the protruding portion 17.

図６（ａ）の符号３６は、加熱手段の光源からレーザー光が照射される範囲のうち、接続材料３１を溶融させる強度を持つ範囲を示している。
一般的には照射範囲３６は円形であって、ここでは接続材料３１の幅は照射範囲３６の直径よりも小さくされ、その長さは照射範囲３６の直径の数倍から数十倍の長さになっている。従って、接続材料３１全てを溶融させるためには、照射範囲３６を接続材料３１上で移動させる必要がある。具体的には、接続材料３１の一端を照射範囲３６の移動開始位置として、レーザー光の照射を開始する。 Reference numeral 36 in FIG. 6A indicates a range having a strength for melting the connection material 31 in a range irradiated with laser light from the light source of the heating unit.
In general, the irradiation range 36 is circular, and here, the width of the connecting material 31 is made smaller than the diameter of the irradiation range 36, and the length thereof is several times to several tens of times the diameter of the irradiation range 36. It has become. Therefore, in order to melt all the connection material 31, it is necessary to move the irradiation range 36 on the connection material 31. Specifically, laser light irradiation is started with one end of the connection material 31 as a movement start position of the irradiation range 36.

ここでは、接続材料３１は、側面が第二の基板２１の縁２８に接触するように配置され、その底面がはみ出し部分１７で第一のパネル１０の露出する表面（例えば、第一の基板１１表面の露出部分や、第一の基板１１上の保護膜の表面）に接触している（図５（ａ））。   Here, the connection material 31 is disposed such that the side surface contacts the edge 28 of the second substrate 21, and the bottom surface of the connection material 31 is an exposed surface of the first panel 10 at the protruding portion 17 (for example, the first substrate 11). It is in contact with the exposed portion of the surface and the surface of the protective film on the first substrate 11 (FIG. 5A).

接続材料３１の一端部にレーザー光３５が照射され、昇温すると、接続材料３１が第二の基板２１の縁２８と、第一のパネル１０の露出する表面に接触した状態で溶融する。   When one end of the connection material 31 is irradiated with the laser beam 35 and the temperature is raised, the connection material 31 is melted in contact with the edge 28 of the second substrate 21 and the exposed surface of the first panel 10.

接続材料３１は、溶融した時に、第一、第二のパネル１０、２０の第一、第二の基板１１、２１が重なり合った部分で露出する表面（例えば電極表面、第一、第二の基板１１，２１の表面、発光層表面、保護膜表面）に対する濡れ性が高い材料で構成されている。   When the connecting material 31 is melted, the surface exposed at the portion where the first and second substrates 11 and 21 of the first and second panels 10 and 20 overlap (for example, electrode surfaces, first and second substrates). 11, 21, light emitting layer surface, protective film surface).

第一のパネル１０の露出する表面から第二のパネル２０の露出する表面までの距離は短いので（例えば５０μｍ以上３００μｍ以下）、接続材料３１が第二の基板２１の縁２８と第一のパネル１０の露出する表面の両方に接触した状態で溶融すると、毛細管現象によって溶融物３２が第一、第二の基板１１、２１の間の間隙に引き込まれ、溶融物３２が第一のパネル１０の露出する表面と、第二のパネル２０の露出する表面の両方に接触する（図５（ｂ））。   Since the distance from the exposed surface of the first panel 10 to the exposed surface of the second panel 20 is short (for example, not less than 50 μm and not more than 300 μm), the connecting material 31 is formed between the edge 28 of the second substrate 21 and the first panel. When melted in contact with both of the 10 exposed surfaces, the melt 32 is drawn into the gap between the first and second substrates 11, 21 by capillarity, and the melt 32 is brought into contact with the first panel 10. It contacts both the exposed surface and the exposed surface of the second panel 20 (FIG. 5B).

接続材料３１のうち、照射範囲３６の外側の部分は溶融しておらず固体状であるが、レーザー光を断続的又は連続して照射しながら、接続材料３１の他端に向かって照射範囲３６を移動させると、その移動先にある固体状の接続材料３１が新に溶融し、第一、第二の基板１１、２１の間の間隙に引き込まれる。   Of the connection material 31, the portion outside the irradiation range 36 is not melted and is solid, but the irradiation range 36 is directed toward the other end of the connection material 31 while irradiating laser light intermittently or continuously. Is moved, the solid connection material 31 at the destination is newly melted and drawn into the gap between the first and second substrates 11 and 21.

固体状の接続材料３１は、先に溶融した溶融物３２と連続しており、新たに溶融した溶融物は、先に溶融した溶融物３２と連続したまま第一、第二の基板１１、２１の間に引き込まれる。また、先に溶融した溶融物３２が、固体状の接続材料３１から分断されたとしても、接続材料３１が新たに溶融し、第一、第二の基板１１、２１の間に引き込まれると、先に引き込まれた溶融物３２と接触し、一体化する。従って、いずれの場合も、第一、第二の基板１１、２１の間の間隙には連続する溶融物３２が形成される（図６（ｂ））。   The solid connection material 31 is continuous with the previously melted melt 32, and the newly melted melt continues to the previously melted melt 32 while the first and second substrates 11, 21. Drawn in between. Moreover, even if the melt 32 previously melted is separated from the solid connection material 31, when the connection material 31 is newly melted and drawn between the first and second substrates 11 and 21, It comes into contact with the previously drawn melt 32 and is integrated. Therefore, in any case, a continuous melt 32 is formed in the gap between the first and second substrates 11 and 21 (FIG. 6B).

従って、製造装置の移動手段によって（ここでは不図示）、照射範囲３６が接続材料３１の他端まで移動するように、第一、第二の基板１１、２１を照射範囲３６に対して相対的に移動させれば、接続材料３１が一端から他端まで溶融して引き込まれ、第一、第二の基板１１、２１の間の間隙に連続する１本の溶融物３２が形成される。   Accordingly, the first and second substrates 11 and 21 are relative to the irradiation range 36 so that the irradiation range 36 moves to the other end of the connection material 31 by the moving means of the manufacturing apparatus (not shown here). , The connecting material 31 is melted and drawn from one end to the other end, and a single melt 32 is formed continuously in the gap between the first and second substrates 11 and 21.

照射範囲３６が接続材料３１の他端まで到達したところで、レーザー光の照射を停止し、第一、第二の基板１１、２１を相対的に固定した状態で、第一の基板１１の他方のはみ出し部分１７上に光源が位置するように第一、第二の基板１１、２１を移動させ、他方のはみ出し部分１７上の接続材料３１を上述した工程で溶融させる。   When the irradiation range 36 reaches the other end of the connection material 31, the irradiation of the laser beam is stopped, and the first and second substrates 11 and 21 are relatively fixed, and the other of the first substrate 11 is fixed. The first and second substrates 11 and 21 are moved so that the light source is positioned on the protruding portion 17, and the connection material 31 on the other protruding portion 17 is melted in the above-described process.

第一の基板１１の各はみ出し部分１７上で接続材料３１の溶融が終了し、その溶融物３２が第一、第二の基板１１、２１の間に引き込まれたところで、後述する溶融物３２の固化物で第一、第二の基板１１、２１を固定するか、不図示の固定器具で第一、第二の基板１１、２１を相対的に固定した状態で、第一、第二の基板１１、２１をひっくり返し、第二の基板２１のはみ出し部分２７を上側に向ける。   When the melting of the connection material 31 is completed on each protruding portion 17 of the first substrate 11 and the melt 32 is drawn between the first and second substrates 11 and 21, The first and second substrates 11 and 21 are fixed with a solidified product, or the first and second substrates 11 and 21 are relatively fixed with a fixing device (not shown). 11 and 21 are turned over so that the protruding portion 27 of the second substrate 21 faces upward.

このとき、溶融物３２が完全に固化していなくても、溶融物３２は第一、第二の基板１１、２１の間で毛細管力によって保持されるので、溶融物３２の位置がずれたり、溶融物３２が流出することがない。   At this time, even if the melt 32 is not completely solidified, the melt 32 is held by the capillary force between the first and second substrates 11, 21. The melt 32 does not flow out.

図７は、第二の基板２１のはみ出し部分２７を上側に向けた状態の投影図であり、第一、第二の基板１１、２１の各はみ出し部分１７、２７は、第一、第二の基板１１、２１の外周が交わる交点Ｃで他方の基板１１、２１のはみ出し部分１７、２７と接している。   FIG. 7 is a projection view of the state in which the protruding portion 27 of the second substrate 21 faces upward. The protruding portions 17 and 27 of the first and second substrates 11 and 21 are the first and second protruding portions, respectively. At the intersection C where the outer peripheries of the substrates 11 and 21 intersect, they are in contact with the protruding portions 17 and 27 of the other substrates 11 and 21.

第一の基板１１の各はみ出し部分１７上で溶融した接続材料３１は、溶融物３２の一端が第二の基板２１の１つのはみ出し部分２７と接する交点Ｃに到達し、他端が第二の基板２１の他のはみ出し部分２７と接する交点Ｃに到達するように、第一、第二の基板１１、２１の間に引き込まれている。   The connection material 31 melted on each protruding portion 17 of the first substrate 11 reaches the intersection C where one end of the melt 32 contacts one protruding portion 27 of the second substrate 21 and the other end is the second. The substrate 21 is drawn between the first and second substrates 11 and 21 so as to reach the intersection C that contacts the other protruding portion 27 of the substrate 21.

従って、第二の基板２１のはみ出し部分２７が、第一の基板１１のはみ出し部分１７と接する２つの交点Ｃには、第一の基板１１のはみ出し部分１７上で溶融し、引き込まれた溶融物３２の端部がそれぞれ位置している。   Therefore, the melted material drawn into the two intersecting points C where the protruding portion 27 of the second substrate 21 is in contact with the protruding portion 17 of the first substrate 11 is drawn on the protruding portion 17 of the first substrate 11. 32 ends are located respectively.

細長の接続材料を、一端と他端がそれぞれ交点Ｃの近傍に位置するように、第二の基板２１のはみ出し部分２７上に配置する。その接続材料３１の量と配置場所を溶融して第一、第二の基板１１、２１の間の間隙に引き込まれた時に、溶融物３２の一端と他端がそれぞれ先に引き込まれた溶融物３２の端部と接触するように設定しておき、上述した工程で接続材料３１を溶融させ、第一、第二の基板１１、２１の間に引き込まれた溶融物３２の両端部を、先に引き込まれた２つの溶融物３２の一端部にそれぞれ接触させる。   The elongated connection material is arranged on the protruding portion 27 of the second substrate 21 so that one end and the other end are located in the vicinity of the intersection C. When the amount and location of the connecting material 31 are melted and drawn into the gap between the first and second substrates 11 and 21, the melt 32 has its one end and the other end drawn earlier. 32 is set so as to be in contact with the end portion of 32, the connecting material 31 is melted in the above-described process, and both ends of the melt 32 drawn between the first and second substrates 11 and 21 are Are brought into contact with one end portions of the two melts 32 drawn in, respectively.

先に引き込まれた溶融物３２は溶融状態に限らず、固体状態の場合もありうるが、第二の基板２１上で接続材料３１を溶融させる時に、交点Ｃの近傍が加熱されると、接続材料３１だけではなく、先に引き込まれた溶融物３２の端部も昇温し、再溶融する。   The melt 32 drawn in first is not limited to a molten state but may be in a solid state. However, when the vicinity of the intersection C is heated when the connection material 31 is melted on the second substrate 21, the connection is established. Not only the material 31 but also the end portion of the melt 32 drawn earlier is heated and remelted.

溶融物３２同士は接触によって容易に一体化するので、新たに引き込まれた溶融物３２の両端部には、先に引き込まれた２つの溶融物３２の端部にそれぞれ接続されて一体化し、２つの溶融物３２は新たに引き込まれた溶融物３２を介して互いに接続され、コの字状の溶融物３２が形成される。   Since the melts 32 are easily integrated with each other by contact, both ends of the newly drawn melt 32 are connected to and integrated with the ends of the two melts 32 drawn earlier. The two melts 32 are connected to each other via the newly drawn melt 32, and a U-shaped melt 32 is formed.

第一、第二の基板１１、２１を相対的に固定した状態で、第二の基板２１の他方のはみ出し部分２７上に光源が位置するように、第一、第二の基板１１，２１を移動させる。   With the first and second substrates 11 and 21 relatively fixed, the first and second substrates 11 and 21 are placed so that the light source is positioned on the other protruding portion 27 of the second substrate 21. Move.

そのはみ出し部分２７が、第一の基板１１の２つのはみ出し部分１７と接する２つの交点Ｃには、上述したコの字状の溶融物３２の両端部がそれぞれ位置するので、はみ出し部分２７上の接続材料３１を上述した工程で溶融させると、第一、第二の基板１１、２１の間の間隙に引き込まれた溶融物３２は、両端部がコの字状の溶融物３２の両端部とそれぞれ接触して一体化し、第一、第二の基板１１、２１の間にリング状の１つの溶融物３２が形成される。   Since the protruding portions 27 are located at the two intersections C where the protruding portions 27 are in contact with the two protruding portions 17 of the first substrate 11, both ends of the above-described U-shaped melt 32 are located on the protruding portions 27. When the connecting material 31 is melted in the above-described process, the melt 32 drawn into the gap between the first and second substrates 11 and 21 has both ends of the melt 32 having a U-shape at both ends. A single ring-like melt 32 is formed between the first and second substrates 11 and 21 by bringing them into contact with each other.

リング状の溶融物３２は、第一、第二の基板１１、２１の重なり合う部分で、上述した第一のパネル１０の露出する部分と、第二のパネル２０の露出する部分の両方に密着しており、溶融物３２の温度が下がると、溶融物が第一、第二のパネル１０、２０の露出する部分に密着したまま固化し、その固化物３３によって第一、第二のパネル１０、２０は互いに固定される（図８）。   The ring-shaped melt 32 is a portion where the first and second substrates 11 and 21 overlap each other, and is in close contact with both the exposed portion of the first panel 10 and the exposed portion of the second panel 20 described above. When the temperature of the melt 32 is lowered, the melt is solidified while being in close contact with the exposed portions of the first and second panels 10 and 20, and the first and second panels 10 and 20 are solidified by the solidified product 33. 20 are fixed to each other (FIG. 8).

第一、第二の基板１１、２１の間の間隙は、固化物３３で取り囲まれており、その取り囲まれた空間に放電ガスを封止すれば、図１に示すようなプラズマディスプレイパネル１が得られる。   The gap between the first and second substrates 11 and 21 is surrounded by a solidified material 33. If discharge gas is sealed in the enclosed space, the plasma display panel 1 as shown in FIG. can get.

放電ガスの封止方法としては、例えば、第一、第二のパネル１０、２０のいずれか一方又は両方に、第一、第二の基板１１、２１の間の間隙と、外部空間とを接続する貫通孔３８を設けておき、その貫通孔３８を通して第一、第二の基板１１、２１と固化物３３とで取り囲まれた空間に所定量の放電ガスを供給した後、貫通孔３８を封止材料３９で塞げば、放電ガスが封止される（図９）。   As a discharge gas sealing method, for example, the gap between the first and second substrates 11 and 21 and the external space are connected to one or both of the first and second panels 10 and 20. A predetermined amount of discharge gas is supplied to the space surrounded by the first and second substrates 11, 21 and the solidified material 33 through the through hole 38, and then the through hole 38 is sealed. If it is closed with the stop material 39, the discharge gas is sealed (FIG. 9).

また、貫通孔３８を設けなくても、放電ガスが充填された真空槽内部に、第一、第二のパネル１０、２０を搬入し、少なくとも接続材料３１を溶融させる工程から、リング状の溶融物が形成されるまでの工程を真空槽内部の放電ガス雰囲気で行えば、第一、第二の基板１１、２１の間の放電ガスは、リング状の固化物３３によって外部から遮断される。   Even if the through hole 38 is not provided, the first and second panels 10 and 20 are carried into the vacuum chamber filled with the discharge gas, and at least the connection material 31 is melted. If the process until the product is formed is performed in the discharge gas atmosphere inside the vacuum chamber, the discharge gas between the first and second substrates 11 and 21 is blocked from the outside by the ring-shaped solidified product 33.

以上は、接続材料３１を側面が基板１１の縁２８に接触するように配置する場合について説明したが、本発明はこれに限定されるものではなく、接続材料３１が第二の基板２１の縁２８に接触しなくても、接続材料３１の位置や量が、溶融した時に溶融物３２が第二の基板２１の縁２８に接触するように設定しておけば、溶融物３２が第一、第二の基板１１、２１の間の間隙に引き込まれる。   The above has described the case where the connection material 31 is disposed so that the side surface contacts the edge 28 of the substrate 11, but the present invention is not limited to this, and the connection material 31 is not limited to the edge of the second substrate 21. If the position and amount of the connecting material 31 are set so that the melt 32 comes into contact with the edge 28 of the second substrate 21 when melted, the melt 32 is first, It is drawn into the gap between the second substrates 11 and 21.

また、接続材料３１の一部の厚みが、第一、第二の基板１１、２１の間の隙間よりも薄い場合には、その厚みの薄い部分が、第一、第二の基板１１、２１の間の間隙に入り込むように、接続材料３１を配置してもよい（図１０）。   Further, when the thickness of a part of the connection material 31 is thinner than the gap between the first and second substrates 11 and 21, the thin portion is the first and second substrates 11 and 21. The connection material 31 may be disposed so as to enter the gap between the two (FIG. 10).

接続材料３１は、溶融物３２が第一、第二の基板１１、２１の間の間隙に引き込まれた時に、表面と底面が第一、第二のパネル１０、２０の露出する部分と密着するのであれば、溶融物３２全部が引き込まれる量を配置しても良いし、溶融物３２の一部分だけが引き込まれ、他の部分がはみ出し部分１７、２７上に残る量を配置してもよい。   When the melt 32 is drawn into the gap between the first and second substrates 11 and 21, the connecting material 31 has a surface and a bottom that are in close contact with the exposed portions of the first and second panels 10 and 20. In such a case, an amount of the entire melt 32 may be drawn, or only a part of the melt 32 may be drawn and the other portions may be placed on the protruding portions 17 and 27.

接続材料３１を溶融させる工程は、同時に２つ以上の照射範囲３６にレーザー光が照射するようにしてもよい。接続材料３１の溶融は、２つ以上のはみ出し部分１７上で同時に行うことも可能であり、上述したようにはみ出し部分１７上の接続材料３１を１つずつ溶融させることも可能であり、特に限定されるものではないが、一方の基板１１が有する全てのはみ出し部分１７上で接続材料３１の溶融を行った後、他方の基板２１のはみ出し部分２７上の接続材料３１を溶融させるようにすれば、第一、第二の基板１１、２１をひっくり返す工程が一度ですむ。   In the step of melting the connection material 31, two or more irradiation ranges 36 may be irradiated with laser light at the same time. The melting of the connecting material 31 can be performed simultaneously on two or more protruding portions 17, and the connecting material 31 on the protruding portion 17 can be melted one by one as described above. Although not necessarily performed, after the connecting material 31 is melted on all the protruding portions 17 of the one substrate 11, the connecting material 31 on the protruding portion 27 of the other substrate 21 is melted. The process of turning over the first and second substrates 11 and 21 is only once.

以上は、レーザー光３５の照射によって接続材料３１を加熱する場合について説明したが、本発明はこれに限定されるものではなく、レーザー光を第一、第二の基板１１、２１のいずれか一方又は両方に照射して基板を昇温させ、基板上に配置された接続材料を熱伝導で加熱する方法や、加熱手段の光源である赤外線ランプから赤外線を接続材料３１に放射する方法や、昇温した加熱手段を第一、第二の基板１１、２１に押し当て、熱伝導で接続材料を加熱する方法がある。   The case where the connection material 31 is heated by irradiation with the laser beam 35 has been described above. However, the present invention is not limited to this, and either one of the first and second substrates 11 and 21 is used as the laser beam. Alternatively, the temperature of the substrate is raised by irradiating both, and the connection material disposed on the substrate is heated by heat conduction, the infrared light is emitted from the infrared lamp as the light source of the heating means, There is a method in which the heated heating means is pressed against the first and second substrates 11 and 21 and the connection material is heated by heat conduction.

加熱手段からの熱伝導で加熱する場合には、第一、第二の基板１１，２１のいずれか一方又は両方を、基板１１、２１全体が加熱されるような加熱手段を用いてもよいし、基板１１、２１の接続材料３１が配置された部分だけを加熱するような加熱手段を用いてもよい。   When heating by heat conduction from the heating means, one or both of the first and second substrates 11 and 21 may be heated so that the entire substrates 11 and 21 are heated. A heating means that heats only the portion of the substrates 11 and 21 where the connection material 31 is disposed may be used.

しかしながら、熱伝導で加熱する方法は、第一、第二の基板１１，２１を不必要に加熱するため、レーザー光３５を用いて接続材料３１又は接続材料３１の周囲の部分だけを昇温させることが好ましい。   However, in the method of heating by heat conduction, since the first and second substrates 11 and 21 are unnecessarily heated, the temperature of only the connection material 31 or a portion around the connection material 31 is raised using the laser light 35. It is preferable.

また、第一、第二の基板１１、２１の全てのはみ出し部分１７、２７上の接続材料３１を同時に溶融させることもできる。具体的には、各はみ出し部分１７、２７上に接続材料３１を仮固定しておけば、下側に向けられたはみ出し部分１７、２７上の接続材料３１が脱落せず、各はみ出し部分１７、２７上に仮固定された接続材料３１を一度に溶融させることができる。この場合も、各はみ出し部分１７、２７上で溶融した溶融物３２が第一、第二の基板１１、２１の間に引き込まれた時に、その両端が、隣接する他のはみ出し部分１７、２７上で溶融し、引き込まれた溶融物の一端部と接触するようにすれば、リング状の溶融物３２が形成される。   Further, the connection material 31 on all the protruding portions 17 and 27 of the first and second substrates 11 and 21 can be melted simultaneously. Specifically, if the connecting material 31 is temporarily fixed on the protruding portions 17 and 27, the connecting material 31 on the protruding portions 17 and 27 directed downward is not dropped off, and the protruding portions 17 and 27 The connection material 31 temporarily fixed on the surface 27 can be melted at a time. Also in this case, when the melt 32 melted on the protruding portions 17 and 27 is drawn between the first and second substrates 11 and 21, both ends thereof are on the other protruding portions 17 and 27 adjacent to each other. The ring-shaped melt 32 is formed if it is melted and brought into contact with one end of the drawn melt.

接続材料３１の仮固定の方法としては、他の接着剤を介して接続材料３１をはみ出し部分１７、２７上に固定する方法や、接続材料３１のはみ出し部分１７、２７と接触する底面か、基板１１、２１の縁１８、２８と接触する側面を部分的に溶融させて接着力を発現させ、接着材料３１自身ではみ出し部分１７、２７上に固定する方法がある。   As a method of temporarily fixing the connection material 31, a method of fixing the connection material 31 on the protruding portions 17 and 27 via another adhesive, a bottom surface of the connection material 31 that contacts the protruding portions 17 and 27, or a substrate There is a method in which the side surfaces in contact with the edges 18 and 28 of the parts 11 and 21 are partially melted to develop an adhesive force, and the adhesive material 31 itself is fixed on the protruding parts 17 and 27.

第一、第二の基板１１、２１の平面形状や、第一、第二の基板１１、２１の重ね合わせ方法も特に限定されず、はみ出し部分の数も特に限定されない。図１１は第一、第二の基板１１、２１にはみ出し部分１７、２７が１つずつ形成されるように重ね合わせた例である。図１２は第一の基板１１だけにはみ出し部分１７が形成された例であり、この場合ははみ出し部分１７上で接続材料３１を溶融させた後、第一、第二の基板１１，２１をひっくり返す必要がない。   The planar shape of the first and second substrates 11 and 21 and the method for overlaying the first and second substrates 11 and 21 are not particularly limited, and the number of protruding portions is not particularly limited. FIG. 11 shows an example in which the first and second substrates 11 and 21 are overlapped so that the protruding portions 17 and 27 are formed one by one. FIG. 12 shows an example in which the protruding portion 17 is formed only on the first substrate 11. In this case, after the connecting material 31 is melted on the protruding portion 17, the first and second substrates 11 and 21 are turned over. There is no need.

いずれの場合も、第一、第二の基板１１，２１を重ね合わせた後は、第二の基板２１が隔壁１５で支持された状態が維持されるので、第一、第二の基板１１、２１を重ね合わせた時の第一、第二の基板１１、２１の位置関係は動かない。   In any case, after the first and second substrates 11 and 21 are overlaid, the state in which the second substrate 21 is supported by the partition wall 15 is maintained, so the first and second substrates 11 and 11, The positional relationship between the first and second substrates 11 and 21 when 21 is overlapped does not move.

放電ガスは特に限定されず、ＰＤＰに用いられる周知ガスを広く用いることができる。具体的には、Ｎｅガス、Ａｒガス、Ｋｒガス、Ｘｅガス、Ｈｅガス等を用いることができ、それらのガスは１種類を単独で用いてもよいし、２種類以上を混合して用いてもよい。   The discharge gas is not particularly limited, and well-known gases used for PDP can be widely used. Specifically, Ne gas, Ar gas, Kr gas, Xe gas, He gas, etc. can be used, and these gases may be used alone or in combination of two or more. Also good.

接続材料３１は常温で固体であって、第一、第二の基板１１、２１よりも融点が低い物であれば特に限定されるものではないが、軟化溶融した時に、第一、第二の基板の表面に濡れ性が高いものが好ましい。また、第一、第二の基板１１、２１の間の間隙に確実に溶融物を引き込ませるためには、溶融した時の粘度が１０3ポアズ以下になるものが好ましい。 The connection material 31 is not particularly limited as long as it is solid at room temperature and has a melting point lower than those of the first and second substrates 11 and 21. Those having high wettability on the surface of the substrate are preferred. In order to ensure that the melt is drawn into the gap between the first and second substrates 11 and 21, it is preferable that the viscosity when melted is 10 3 poise or less.

具体的には、第一、第二の基板１１、２１がガラス基板で構成される時には、ガラスのような無機材料、又はガラス基板に対する接着性の高い樹脂材料等を用いることができるが、長時間に亘って気密性を維持し、高い信頼性を保持するために、ＰＤＰやＦＥＤを製造する時には無機材料のみからなる接続材料３１を用いることが好ましい。   Specifically, when the first and second substrates 11 and 21 are formed of a glass substrate, an inorganic material such as glass or a resin material having high adhesion to the glass substrate can be used. In order to maintain hermeticity over time and maintain high reliability, it is preferable to use the connection material 31 made of only an inorganic material when manufacturing a PDP or FED.

接続材料３１をはみ出し部分１７、２７上に配置する方法は特に限定されないが、例えば、予め細長に成形された接続材料３１をはみ出し部分１７、２７上に載置したり、型転写、スクリーン印刷、インクジェット印刷等の印刷方法で、細長の接続材料３１をはみ出し部分１７、２７上に印刷してもよい。   The method for disposing the connecting material 31 on the protruding portions 17 and 27 is not particularly limited. For example, the connecting material 31 formed in advance in an elongated shape may be placed on the protruding portions 17 and 27, or may be transferred by a mold, The elongated connection material 31 may be printed on the protruding portions 17 and 27 by a printing method such as ink jet printing.

以上は、本発明の製造装置を用いて、表示範囲１９に放電ガスを充填されたプラズマディスプレイパネル１を製造する場合について説明したが、本発明はこれに限定されるものではなく、例えば、表示範囲１９に有機層が配置され、第一、第二の電極間に電圧を印加すると有機層が発光するように構成された有機ＥＬ装置や、表示範囲１９に液晶材料が配置された液晶パネル（ＬＣＤ）の製造に、本発明の製造装置を用いることもできる。   The above has described the case of manufacturing the plasma display panel 1 in which the display range 19 is filled with the discharge gas using the manufacturing apparatus of the present invention. However, the present invention is not limited to this, and for example, a display An organic EL device in which an organic layer is arranged in the range 19 and the organic layer emits light when a voltage is applied between the first and second electrodes, or a liquid crystal panel in which a liquid crystal material is arranged in the display range 19 ( The production apparatus of the present invention can also be used for the production of LCD).

更に、表示範囲１９に真空雰囲気が形成され、第一、第二のパネルのうち、一方のパネルに設けられた電子放出源から真空雰囲気中に電子が放出されると、その電子が他方のパネルに設けられた蛍光体膜に入射して光が発生するように構成されたＦＥＤの製造に、本発明の製造装置を用いることもできる。   Further, when a vacuum atmosphere is formed in the display range 19 and electrons are emitted from the electron emission source provided in one of the first and second panels into the vacuum atmosphere, the electrons are emitted from the other panel. The manufacturing apparatus of the present invention can also be used for manufacturing an FED that is configured to generate light by being incident on the phosphor film provided on the substrate.

本発明の製造装置、及びこれを用いた製造方法は、封止に必要な部分だけを加熱し、不純ガスの発生量が少ないので、不純ガスの影響を受けやすいＦＥＤやＰＤＰの製造に特に適している。   The manufacturing apparatus of the present invention and the manufacturing method using the same are particularly suitable for manufacturing FEDs and PDPs that are easily affected by impure gas because only the portion necessary for sealing is heated and the amount of impure gas generated is small. ing.

本発明により製造されたプラズマディスプレイパネルの一例を説明する断面図Sectional drawing explaining an example of the plasma display panel manufactured by this invention 第一、第二の基板を重ね合わせた状態を説明する断面図Sectional drawing explaining the state which accumulated the 1st and 2nd board | substrate 第一、第二の基板を重ね合わせた状態を説明する平面図A plan view explaining a state in which the first and second substrates are overlapped 接続材料をはみ出し部分上に配置した状態を説明する平面図Plan view explaining the state where the connecting material is placed on the protruding part （ａ）接続材料を配置した状態を示す断面図、（ｂ）溶融物が引き込まれた状態を示す断面図(A) Cross-sectional view showing a state where the connection material is arranged, (b) Cross-sectional view showing a state in which the melt is drawn （ａ）接続材料を配置した状態を示す平面図、（ｂ）接続材料が溶融させる途中の状態を示す平面図(A) Plan view showing a state in which the connection material is arranged, (b) Plan view showing a state in the middle of melting the connection material 第一、第二の基板を重ね合わせた状態の投影図Projection view with first and second substrates superimposed リング状の固化物が形成された状態を示す平面図The top view which shows the state in which the ring-shaped solidified material was formed 本発明により製造されたプラズマディスプレイパネルの他の例を説明する断面図Sectional drawing explaining the other example of the plasma display panel manufactured by this invention 接続材料の他の例を説明する断面図Sectional drawing explaining the other example of a connection material 第一、第二の基板の重ね合わせ方法の第二例を説明する平面図The top view explaining the 2nd example of the superposition method of the 1st and 2nd substrate 第一、第二の基板の重ね合わせ方法の第三例を説明する平面図The top view explaining the 3rd example of the superposition method of the 1st and 2nd substrate

符号の説明Explanation of symbols

１……プラズマディスプレイパネル １０……第一のパネル １１……第一の基板 １５……隔壁 １７、２７……はみ出し部分 ２０……第二のパネル ２１……第二の基板 ３１……接続材料 ３２……溶融物 ３３……固化物 ３５……レーザー光   DESCRIPTION OF SYMBOLS 1 ... Plasma display panel 10 ... 1st panel 11 ... 1st board | substrate 15 ... Bulkhead 17, 27 ... Overhang | projection part 20 ... 2nd panel 21 ... 2nd board | substrate 31 ... Connection material 32 ... Melt 33 ... Solidified product 35 ... Laser light

Claims (7)

第一のパネルの第一の基板と、第二のパネルの第二の基板とが間隔保持部材を挟んで、前記第一、第二の基板の一方が他方からはみ出して重ね合わされ、
前記第一の基板と前記第二の基板との間に位置する表示範囲が外部雰囲気から遮断された表示装置を製造する製造装置であって、
前記第一、第二の基板のうち、一方の基板が他方の基板の縁からはみ出すように、前記第一、第二のパネルを重ね合わせ、前記第一、第二の基板のうち、前記間隔保持部材が配置されていない方の基板を前記間隔保持部材で支持させた時に、
前記一方の基板の表面の、前記他方の基板の縁からはみ出したはみ出し部分上に配置された接続材料を溶融させる加熱手段を有する製造装置。 The first substrate of the first panel and the second substrate of the second panel sandwich the spacing member, and one of the first and second substrates protrudes from the other and is overlaid,
A manufacturing apparatus for manufacturing a display device in which a display range located between the first substrate and the second substrate is blocked from an external atmosphere,
The first and second panels are overlapped so that one of the first and second substrates protrudes from the edge of the other substrate, and the distance between the first and second substrates is the same. When the substrate on which the holding member is not arranged is supported by the interval holding member,
The manufacturing apparatus which has a heating means which fuses the connection material arrange | positioned on the protrusion part which protruded from the edge of the said other board | substrate of the surface of said one board | substrate. 前記他方の基板の縁に沿って前記接続材料を配置するように構成された請求項１記載の製造装置。   The manufacturing apparatus according to claim 1, wherein the connection material is arranged along an edge of the other substrate. 前記第一、第二のパネルの重ね合わせが、前記第一、第二の基板が他方の基板の縁からはみ出すようにした時に、
前記加熱手段は、前記第一の基板の前記はみ出し部分上で前記接続材料の溶融物を前記第一、第二の基板の間に引き込んだ後、
前記第二の基板の前記はみ出し部分上で前記接続材料を溶融させ、その溶融物を第一、第二の基板の間の間隙に引き込ませ、先に引き込まれた前記溶融物に接続されるように構成された請求項１又は請求項２のいずれか１項記載の製造装置。 When the first and second panels overlap so that the first and second substrates protrude from the edge of the other substrate,
The heating means draws the melt of the connection material between the first and second substrates on the protruding portion of the first substrate,
The connecting material is melted on the protruding portion of the second substrate, the melt is drawn into the gap between the first and second substrates, and is connected to the previously drawn melt. The manufacturing apparatus of any one of Claim 1 or Claim 2 comprised by these. 前記接続材料の底面が前記はみ出し部分に接触し、前記接続材料の表面の少なくとも一部が、前記はみ出し部分上の前記基板の縁に接触するように、前記接続材料が配置可能に構成された請求項１乃至請求項３のいずれか１項記載の製造装置。   The connection material is configured to be arranged so that a bottom surface of the connection material is in contact with the protruding portion, and at least a part of a surface of the connection material is in contact with an edge of the substrate on the protruding portion. The manufacturing apparatus according to any one of claims 1 to 3. 前記接続材料の底面が前記はみ出し部分に接触し、前記接続材料の表面が前記第二の基板から離間して、前記接続材料を配置可能に構成された請求項１乃至請求項３のいずれか１項記載の製造装置。   The bottom surface of the connecting material is in contact with the protruding portion, and the surface of the connecting material is separated from the second substrate so that the connecting material can be arranged. The manufacturing apparatus according to item. 前記加熱手段は、前記接続材料にレーザー光を照射するように構成された請求項１乃至請求項５のいずれか１項記載の製造装置。   The manufacturing apparatus according to claim 1, wherein the heating unit is configured to irradiate the connection material with a laser beam. 前記加熱手段は、前記レーザー光の照射位置を、前記はみ出し部分上の前記他方の基板の縁に沿って移動させるように構成された請求項６記載の製造装置。   The manufacturing apparatus according to claim 6, wherein the heating unit is configured to move an irradiation position of the laser light along an edge of the other substrate on the protruding portion.
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JP2005000797A (en) * 2003-06-11 2005-01-06 Nippon Sheet Glass Co Ltd Nozzle for coating frit paste, and coater and coating method using the nozzle

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