JP2006303360A - Through-wire board, composite board, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a through-wire board and a composite board with a high degree of designing a wire structure and provided with through-wires capable of highly dense three-dimensional mount, and to provide an electronic apparatus employing them. <P>SOLUTION: The through-wire board is provided with a base member (11) wherein a very small hole (12) tying at least two sides (11a or 11b and 11c) of the base member (11), and the through-wire (13) formed by filling a conductive substance in the very small hole (12), are provided, and at least part of the through-wire (13) is extended in a direction different from the thick direction of the base member (11) (all of the through-wire (13) in the case of Fig. 1). The composite board is disclosed, and the electronic apparatus is disclosed employing the through wire board and the composite board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a through-wiring board having a through-wiring that enables high-density mounting of electronic devices, optical devices, MEMS devices, etc., or SiP (system-in-package) for systematizing these devices in one package, The present invention relates to a composite substrate and an electronic device using these.

  In recent years, with the enhancement of functions of electronic devices such as mobile phones, electronic devices and the like used for them have been required to have higher speed and higher functions. In order to realize this, not only the speed of the device itself by miniaturization and the like, but also the development of technology for the speed and density of the device package is indispensable.

  In order to realize high-density mounting, three-dimensional mounting in which chips are stacked and mounted using fine through electrodes and SiP using a through wiring substrate on which through electrodes are formed have been proposed. The through electrode forming technology and the through wiring substrate forming technology have been actively researched and developed.

  FIG. 19 is a schematic cross-sectional view of a SiP (Single in line Package) using a rigid through wiring substrate such as ceramic or silicon. A plurality of devices 195 </ b> A and 195 </ b> B are mounted on the through wiring substrate 191 so as to be electrically connected to the through electrode 193, thereby forming a single package as a whole. At that time, as shown in FIG. 19, in the conventional through wiring substrate, through electrodes are provided perpendicular to the main plane so as to connect the main planes on the front and back sides with the shortest distance.

In SiP using such a through electrode and using a through wiring substrate, there are the following technical problems.
(1) In three-dimensional mounting, if the devices to be stacked are different devices, the number of electrodes required and the pitch of the electrodes differ from device to device, so surface wiring and wiring boards (interposers) to eliminate these differences ) Is required.
(2) Even in the through wiring substrate used in the SiP, there is a large difference between the electrode pitch of the device mounted on the substrate and the bump pitch when mounted on the mother board or the like. It is necessary to form a wiring for eliminating the difference.
(3) Although it is three-dimensional mounting using through wiring, since the through electrode basically penetrates the front and back of the board, it is reduced in size when electrically connecting adjacent through wiring boards. Etc. are limited.

  As an example to solve the above problems, a chip body in which a desired circuit is formed and a through electrode embedded in a plurality of through holes penetrating the front and back of the chip body, the through hole, An example of the semiconductor chip is a structure in which the chip body is inclined with respect to a direction perpendicular to the main plane of the chip body (Patent Document 1).

If the technology employed in the semiconductor chip, that is, a through electrode that obliquely penetrates the substrate, is applied to the wiring substrate, it is possible to simply change the pitch between the front and back sides of the substrate. However, even in this case, since the position of the through electrode is limited because it is a straight through electrode, the arrangement of the exposed portion of the through electrode serving as an electrical connection means is limited, and the wiring structure Since the degree of freedom in design is low, it is difficult to perform higher-density three-dimensional mounting.
JP 2003-347502 A

  The present invention has been made in view of the above circumstances, and has a high degree of freedom in designing a wiring structure, a through wiring substrate or a composite substrate having a through wiring that enables high-density three-dimensional mounting, and an electronic device using these. An object is to provide an apparatus.

A through wiring board according to claim 1 of the present invention is a through wiring having a through hole in which a fine hole is arranged so as to connect at least two surfaces constituting a base material, and the fine hole is filled with a conductive substance. It is a board | substrate, Comprising: The said penetration wiring has a part extended in the direction different from the thickness direction of the said base material in at least one part, It is characterized by the above-mentioned.
The through wiring board according to claim 2 of the present invention is the through wiring substrate according to claim 1, wherein one end of the through wiring is on one side of the base material, and the other end of the through wiring is on the base material. It is characterized in that it is exposed on each side surface.
The through wiring board according to claim 3 of the present invention is the through wiring board according to claim 1, wherein one end of the through wiring is on one main surface of the base material, and the other end of the through wiring is on the other main surface of the base material. , Each of which is exposed.
According to a fourth aspect of the present invention, there is provided a through wiring substrate according to the first aspect, wherein the through wiring includes a portion branched into the base material.
The through wiring board according to claim 5 of the present invention is characterized in that, in claim 1, one end and / or the other end of the through wiring is arranged at a position corresponding to an electrode of another substrate to be joined. To do.
A composite substrate according to a sixth aspect of the present invention uses a plurality of the through wiring boards according to any one of the first to fifth aspects, and superimposes the main surfaces and / or the side surfaces to each other to form the through wirings. It is characterized in that the through wiring constituting the substrate is electrically connected.
An electronic device according to a seventh aspect of the present invention is characterized in that an electronic component is mounted on the through wiring board according to any one of the first to fifth aspects or the composite substrate according to the sixth aspect. .

  A through wiring board according to the present invention (Claim 1) includes a through wiring in which fine holes are arranged so as to connect at least two surfaces constituting a base material, and the fine holes are filled with a conductive substance. Since the through wiring has at least a part extending in a direction different from the thickness direction of the base material, the through wiring has one end on one surface of the base material and the other end on all other surfaces of the base material, respectively. It can be set as the structure to expose. In other words, the other surface that exposes the other end of the through wiring does not necessarily have to be in a position facing the one surface that exposes the other end. Therefore, according to the present invention, since all surfaces constituting the base material can be electrically connected to each other through the through wiring, the design freedom is high, and the penetration enabling high-density mounting or three-dimensional mounting is possible. A wiring board is obtained.

  The composite substrate according to the present invention (Claim 6) uses a plurality of through-wiring boards having the above-described configuration, and superimposes the main surfaces and / or side surfaces of each other to electrically connect the through-wirings constituting each through-wiring substrate. Connected. According to this configuration, a composite circuit board capable of appropriately increasing connection capability and diversifying connection functions by electrically connecting through wiring boards having the same or different functions as necessary. Can be provided. Therefore, the present invention provides a higher-functionality and higher-density package in three-dimensional mounting and SiP, and thus contributes to higher speed and higher functionality of the device.

  Since the electronic device according to claim 7 of the present invention is formed by mounting electronic components on the through wiring board or the composite substrate having the above-described configuration, the electronic device can be reduced in thickness, size, power consumption, and the like. It becomes possible.

Hereinafter, an embodiment of the present invention will be described.
1-7 is sectional drawing which shows an example of the penetration wiring board based on this invention. As shown in each drawing, each of the through wiring boards of the present invention has a through hole formed by arranging a fine hole so as to connect at least two surfaces constituting a base material and filling the fine hole with a conductive substance. Since the through wiring has at least a part extending in a direction different from the thickness direction of the base material, the through wiring has one end on one surface of the base material and the other end. It can be set as the structure exposed to (all) other surfaces of a base material, respectively. Thereby, it becomes possible to connect electrically between all the surfaces which comprise a base material through penetration wiring.
Specifically, there are the following four forms. In addition, the location of the through wiring expressed as a straight portion in the description of each embodiment is not limited to this (straight shape), and may be a curved shape or a bent shape, for example.

<First form>
In the first form, one end of the through wiring is exposed on the main surface of the base material, and the other end of the through wiring is exposed on the side surface of the base material.
As shown in FIG. 1, for example, the through wiring 13 is linear, and the through wiring 13 itself extends in a direction different from the thickness direction of the base material 11 (up and down direction on the paper surface).
1A shows a case where one end 13α and the other end 13β of the through wiring 13 are exposed on one surface (upper surface of the paper) 11a and the side surface 11c of the substrate, respectively, and FIG. 1B shows one end 13α of the through wiring 13 and The cases where the other end 13β is exposed on the other surface (lower surface of the paper surface) 11b and the side surface 11c of the substrate are respectively shown.

As shown in FIG. 2, for example, the through wiring 23 is composed of a combination of two straight portions and one bent portion, and at least one straight portion is different from the thickness direction of the base material 21 (up and down direction on the paper surface). An example extending to
In FIG. 2A, two straight portions 23a and 23b constituting the through wiring 23 are connected at a bent portion 24, and the straight portion 23a extends in the thickness direction of the base material 21 and is exposed at one end 23α exposed on the upper surface 21a of the paper surface. The straight portion 23b has a second end 23β that extends in a direction perpendicular to the thickness direction of the substrate 21 and is exposed to the side surface 21c of the paper surface.
In FIG. 2B, two straight portions 23c and 23d forming the through wiring 23 are connected at the bent portion 24, and the straight portion 23c extends in the thickness direction of the base material 21 and is exposed at one end 23α exposed on the upper surface 21a of the paper surface. The straight portion 23d has the other end 23β that extends in a direction inclined with respect to the thickness direction of the base material 21 and is exposed to the side surface 21c of the paper surface.
In FIG. 2C, two straight portions 23e, 23f forming the through wiring 23 are connected at the bent portion 24, and the straight portion 23e extends in a direction that is inclined with respect to the thickness direction of the substrate 21, and is a lower surface 21b of the paper surface. The linear portion 23f has one end 23α that is exposed to the surface of the paper 21 and the other end 23β that extends in a direction perpendicular to the thickness direction of the substrate 21 and is exposed to the side surface 21c of the paper surface.

  In order to obtain the configuration example shown in FIG. 1 (FIG. 2), one main surface 11a (21a) or the other main surface 11b (21b) forming the base material 11 (21), and a side surface 11c (21c) The fine holes 12 (22) forming a straight line portion may be provided so as to connect the conductive holes, and the through holes 13 (23) may be formed by filling the fine holes 12 (22) with a conductive substance.

<Second form>
As shown in FIG. 3, the second form is a configuration in which one end of the through wiring is exposed on one main surface of the base material, and the other end of the through wiring is exposed on the other main surface of the base material. .
As shown in FIG. 3, for example, the through wiring 33 is composed of a combination of a plurality of straight portions and bent portions, and at least one straight portion extends in a direction different from the thickness direction of the base material 31 (up and down direction on the paper surface). An example is given. 3A to 3D show a state in which one end 33α and the other end 33β of the through wiring 33 are exposed on one surface (upper surface of the paper surface) 31a and the other surface (lower surface of the paper surface) 31b, respectively. Although common, each has the following features.
In the configuration example of FIG. 3A, two straight portions 33a and 33b are joined by a single bent portion, and only one straight portion 33b is different from the thickness direction of the base material 31 (vertical direction on the paper surface). It extends to.
In the configuration example of FIG. 3B, three straight portions 33c, 33d, and 33e are joined by two bent portions, and only the intermediate straight portion 33d is the thickness direction of the base material 31 (the vertical direction of the paper surface). It extends in different directions.
3C is the same as FIG. 2A in that the two straight portions 33f and 33g are joined by one bent portion, but both the straight portions 33f and 33g are base materials. It extends in a direction different from the thickness direction of 31 (the vertical direction of the paper).
In the configuration example of FIG. 3D, a portion 33j including three straight portions and two bent portions 33b and 33c is provided instead of one straight portion arranged in the middle of FIG. 3B. Different from 3 (b). 33h and 33j in FIG. 3 (d) correspond to 33c and 33e in FIG. 3 (b).
In order to obtain the configuration example shown in FIG. 3, the fine hole 32 formed by combining a plurality of linear portions and bent portions so as to connect one main surface 31 a forming the base material 31 and the other main surface 31 b. And the through hole 33 may be formed by filling the fine holes 32 with a conductive substance.

<Third form>
As shown in FIG. 4, the third embodiment is configured such that one end of the through wiring is exposed on one main surface of the base material, and the other end of the through wiring is exposed on the other main surface of the base material. .
As shown in FIG. 4, for example, the through wiring 43 is composed of a combination of a plurality of straight portions and branch portions, and at least one straight portion extends in a direction different from the thickness direction of the base material 41 (up and down direction on the paper surface). An example is given.
4 (a) to 4 (b), the end portions 43α to 43δ of the through wiring 43 extending from the branch portion are exposed on one surface (upper surface of the paper surface) 41a and the other surface (lower surface of the paper surface) 41b, respectively. Although they are common, they have their respective features in the following points.
In the configuration example of FIG. 4A, straight portions 43a to 43c individually extend from one branch portion 44 to one surface 41a or the other surface 41b.
In the configuration example of FIG. 4B, the straight portions 43d to 43g individually extend from the two branch portions 44a and 44b to the one surface 41a or the other surface 41b.
In order to obtain the configuration example shown in FIG. 4, the fine holes 42 formed by combining a plurality of linear portions and branch portions so as to connect one main surface 41 a forming the base material 41 and the other main surface 41 b. And the through hole 43 may be formed by filling the fine holes 42 with a conductive substance.

As shown in FIG. 5, for example, the through wiring 53 includes a combination of a straight portion, a bent portion, and a branch portion, and at least one straight portion extends in a direction different from the thickness direction of the base material 51 (up and down direction on the paper surface). There are also examples. 5 (a) to 5 (c), one end or the other end 53α to 53δ of the through wiring 53 is exposed to either one surface (upper surface of the paper surface) 51a or the other surface (lower surface of the paper surface) 51b. Although they are common, they have their respective features in the following points.
In the configuration example of FIG. 5A, five straight portions 53a to 53e are connected by two bent portions 54b and 54c and one branch portion 54a, and a straight portion connecting the branch portion 54a and the bent portions 54b and 54c. Only 53b and 53c extend in a direction different from the thickness direction of the substrate 51 (up and down direction on the paper surface).
In the configuration example of FIG. 5B, a plurality of straight portions 53g and 53h branched from one straight portion 53f penetrating in the thickness direction of the substrate are included, and both of these two straight portions are in the thickness direction of the substrate 51 ( It extends in a direction different from the vertical direction). One straight line portion 53h is connected to another straight line portion 53i through a bent portion.
In the configuration example of FIG. 5C, a plurality of straight portions 53k and 53m branched from one straight portion 53j penetrating in the thickness direction of the substrate are included, and both of these two straight portions are in the thickness direction of the substrate 51 ( It extends in a direction different from the vertical direction). Further, both the straight portions 53k and 53m are connected to the other straight portions 53l and 53n through bent portions 54g and 54j, respectively.

Further, as shown in FIG. 6, for example, the through wiring 53 is composed of a combination of a straight portion, a bent portion, and a branch portion, and at least one straight portion is in a direction perpendicular to the thickness direction of the substrate 61 (up and down direction on the paper surface). An extended example is also given. 6 (a) to 6 (c) are any one of three or four surfaces (upper and lower surfaces, left and right surfaces) 61a to 61d of which one end or the other ends 63α to 63δ of the through wiring 63 constitute a base material. Although they are exposed in common, they have the following features.
In the configuration example of FIG. 6A, there is one straight line portion 63b branched from one straight line portion 63a penetrating in the thickness direction of the substrate, and only the latter straight line portion 63b is in the thickness direction of the base material 61 (the vertical direction of the paper surface). ) In a direction perpendicular to Accordingly, the through wiring 63 has end portions 63α to 63γ exposed on the upper and lower surfaces and one side surface of the base material.
In the configuration example of FIG. 6B, one straight portion 63d branched from one straight portion 63c penetrating in a direction perpendicular to the thickness direction of the substrate is provided, and only the latter straight portion 63d is in the thickness direction of the substrate 51. It extends in the vertical direction of the page. Accordingly, the through wiring 63 has end portions 63α to 63γ exposed on the upper surface and two side surfaces of the base material.
In the configuration example of FIG. 6C, three linear portions 63e, 63f, and 63g that are exposed to one side surface 61d of the base material 61 and that have a common end 63α and extend in a direction different from the thickness direction of the substrate. It has. The other ends of the three straight portions 63e, 63f, and 63g are exposed on different surfaces, respectively, and have end portions 63γ, 63β, and 63δ in order. Although FIG. 6C shows an example in which the branching portion 64 is located in the vicinity of the common end 63α, the present invention is not limited to this.

  In order to obtain the configuration example shown in FIG. 4 (FIGS. 5 and 6), one main surface 41a (51a, 61a) forming the base material 41 (51, 61) and the other main surface 41b (51b, 61b) are formed. ) And / or the side surfaces 41c (51c, 61c) are provided with fine holes 42 (52, 62) forming straight portions via bent portions or branch portions, and the fine holes 42 (52, 62) are provided in the fine holes 42 (52, 62). What is necessary is just to fill with an electroconductive substance and to form the penetration wiring 43 (53, 63).

1 to 6 show an example in which one fine hole is provided in one base material, the fine hole is filled with a conductive material, and one through wiring is formed.
However, as shown in FIG. 7, a plurality of independent fine holes are provided in one base material 71, and these fine holes are filled with a conductive material, and a plurality of independent through wirings 73 (73a to 73e) are provided. May be formed. Although FIG. 7 shows an example in which through wirings having different patterns as viewed from the cross-sectional direction of the base material are combined, the present invention is not limited to this, and the same through wiring with the same pattern may be provided in one base material. . In particular, it is possible to adopt a form in which one of the end portions of the through wirings 73a and 73e disposed near the side surface of the base material is exposed on the side surface.

<Fourth form>
In the fourth embodiment, as shown in FIG. 8, one end and / or the other end of the through wiring is arranged at a position corresponding to the electrode of another substrate to be joined.
8 (a) and 8 (b), as in FIG. 7, a plurality of independent micropores are provided in each of the base materials 81A and 81B, and these micropores are filled with a conductive substance and independent. A plurality of through wirings (for example, 83A and 83B) are formed. The two base materials 81A and 81B are configured such that the positions of the electrodes 81Ab and 81Ba that join the base materials coincide with the electrodes of the mating substrate to be joined.
FIG. 8C shows a state in which the two base materials 81A and 81B are joined. For example, the other end 83Aβ of the through wiring 83A provided in the base material 81A and one end of the through wiring 83B provided in the base material 81B. When the positions of 83Bα coincide with each other, the other end portions provided on both the substrates also coincide with each other in the same manner, indicating a state in which electrical conduction is possible.
Adoption of such an arrangement is not limited to the case where two base materials are overlapped, but can also be applied to a form in which three or more base materials are overlapped and joined (hereinafter also referred to as a composite substrate).

  9 differs from the base material 71 of FIG. 7 only in that the functional element 95 is embedded in one surface 91A of the base material 91. FIG. As shown in FIG. 9, the base material 91 has a configuration in which a functional element 95 is arranged so as not to be directly electrically connected to the through wiring 93 (hereinafter also referred to as a composite substrate containing the functional element). It is good. Examples of a functional element (hereinafter also simply referred to as a device) 95 suitable for such a configuration include passive elements such as capacitors and resistors, or MEMS devices such as various sensors.

  In FIG. 10, similarly to FIG. 8, the base material 101B including the functional element 105 is used as one substrate, and one end and / or the other end of the through wiring provided in the base material is joined to another substrate (base The material 101A) is arranged at a position corresponding to the electrode. FIG. 10A shows the other substrate, FIG. 10B shows the one substrate, and FIG. 10C shows a state where the two base materials 101A and 101B are joined. According to this configuration, the positions of the end portions provided on both the substrates match each other and electrical conduction is possible, and the functional element 105 is sandwiched between the two base materials 101A and 101B or sealed. Therefore, a configuration having excellent durability against external force can be obtained. Further, since there is no possibility that the functional element 105 is exposed to the external environment, the environmental resistance can be improved.

  As described above, the through wiring substrate according to the present invention has a basic structure of a through electrode that enables three-dimensional free wiring inside the substrate. Below, the manufacturing method of the penetration wiring board which consists of various structures mentioned above is described in detail based on the case where a penetration wiring board consists of a single board based on FIGS. 11-14. Next, some specific modes will be described as Examples 1 to 3.

  11 to 14 are schematic cross-sectional views showing a method of manufacturing a through wiring board according to the present invention in the order of steps. In the present embodiment, a glass (quartz) substrate having a thickness of 500 μm is used as the base material. In addition, the method for producing a microscopic hole in the present embodiment is to modify a part of a quartz substrate using a laser and then remove the modified part by etching.

  First, as shown in FIG. 11, a laser beam 118 is irradiated to at least a portion of the substrate 111 made of quartz where a fine hole is to be formed, thereby forming a modified portion 114 in the substrate 111. In the present embodiment, a femtosecond laser is used as a light source of the laser beam 118, and a laser beam is irradiated so as to form a focal point 113 inside the substrate 111, thereby obtaining a modified portion 114 having a diameter of several μm to several tens of μm, for example. . At that time, by controlling the focal point 113 and the substrate position, the modified portions 114 having various shapes can be formed as illustrated in FIG. The substrate 111 for forming the fine holes is not limited to a quartz substrate, and for example, an insulating substrate such as sapphire or another component glass substrate containing an alkali component or the like can be used, and its thickness is also It can set suitably to about 150 micrometers-1 mm.

Next, as shown in FIG. 13, the substrate 111 on which the modified portion is formed is immersed in a predetermined chemical solution 115 placed in the container 116. Thereby, the modified portion is wet-etched with the chemical solution 115 and removed from the substrate 111. As a result, the fine hole 112 is formed in the portion where the modified portion is present. In the present embodiment, an acid solution containing hydrofluoric acid as a main component is used as the chemical solution 115.
This etching utilizes the phenomenon that the modified portion 114 is etched much faster than the portion where the modified portion 114 is not modified, and as a result, the fine hole 112 having a shape caused by the modified portion 114 is formed. Can do. In the present embodiment, the hole diameter of the fine hole 112 is 50 μm. Note that the chemical solution 115 is not limited to hydrofluoric acid, and for example, a hydrofluoric acid-based mixed acid obtained by adding an appropriate amount of nitric acid or the like to hydrofluoric acid can be used. Moreover, the hole diameter of the fine hole 112 can be appropriately set from about 10 μm to about 300 μm depending on the use of the through electrode. Furthermore, the fine holes to be formed may be either those that penetrate the substrate or those that do not penetrate.

  By the above-described method, a fine hole having a three-dimensional free structure can be formed inside a quartz substrate. Hereinafter, a manufacturing method according to some embodiments of the through electrode will be described.

(Embodiment 1)... Implementation with a single plate In this example, a method for manufacturing a through wiring substrate in which through wiring is arranged on a single substrate will be described in detail with reference to FIG.
First, as shown in FIG. 14A, fine holes 142 having various forms are formed in a substrate 141 made of quartz by the fine hole forming method described above. Here, the substrate 141 has a thickness of 500 μm, and the hole diameter of the fine holes 142 is 50 μm. As described above, the thickness of the substrate is not limited to the hole diameter.
Next, as shown in FIG. 14B, the conductive material 143 is filled into the micro holes 142. In this example, gold tin (Au—Sn) was used as the conductive material 143, and the inside of the fine holes was filled by a molten metal filling method. The molten metal filling method is a method in which the inside of a fine hole can be filled with good airtightness in a short time using a pressure difference. In this example, gold tin (Au—Sn) is used as the filling metal. However, the present invention is not limited to this, and gold tin alloys having different compositions, tin (Sn), indium (In), etc. Metals, tin-lead (Sn-Pb), tin (Sn) group, lead (Pb) group. A solder such as a gold (Au) group, an indium (In) group, or an aluminum (Al) group can be used. Also, although the molten metal suction method is used as the filling method, the present invention is not limited to this, and metal filling by plating method, filling of conductive paste by printing method, and filling of carbon nanotubes by CVD or the like can be used. Can do.
By the above method, a through wiring substrate having a three-dimensional free through electrode can be provided.
In this example, the fine hole 142 penetrates the main surface or side surface of the substrate. However, the present invention is not limited to this, and the fine hole is formed non-through, and after filling the metal, It is also possible to form the through electrode by polishing the substrate.

Example 2 Example of Composite Substrate In this example, a method for manufacturing a composite substrate in which a plurality of through wiring substrates are stacked will be described in detail with reference to FIG. Here, three types of manufacturing methods are illustrated.
The first manufacturing method (FIG. 15) is a method of stacking through wiring substrates produced by the method described in the first embodiment. First, as shown in FIG. 15A, the through wiring boards 151A and 151B on which the through electrodes 153 (153a and 153b) are already formed are opposed to each other, and the positions of the end portions of the through electrodes 153a and 153b are aligned. Align. Then, as shown in FIG.15 (b), two penetration wiring boards 151A and 151B were stacked. In this example, the substrates are bonded using the anisotropic conductive adhesive 157. However, the present invention is not limited to this, and other methods such as bonding using solder bumps may be used.
In the second manufacturing method (FIG. 16), first, as shown in FIG. 16A, substrates 161A and 161B in which only micro holes 162a and 162b are formed are joined via an insulating resin 163. At this time, the resin at the position where the micro holes 162a and 162b overlap may be removed in advance (before bonding), or may be removed by etching or the like after bonding. Next, as shown in FIG. 16 (b), the fine holes 162a, 162b, and 162c formed after the bonding are filled with metal at a time to produce a through electrode. In this example, both substrates are bonded using the insulating resin 163. However, the present invention is not limited to this, and other methods such as anodic bonding may be used.
In the third manufacturing method (FIG. 17), first, as shown in FIG. 17A, substrates 171A and 171B are prepared and bonded using a low-melting glass 177. Next, fine holes 172 are formed in the bonded substrates. Thereafter, the fine holes 172 are filled with metal. In this example, the low melting point glass 177 is used to bond both substrates, but the present invention is not limited to this, and other methods such as anodic bonding may be used.
By the above method, a through wiring substrate having a three-dimensional free through electrode can be laminated.

(Example 3) ... Application example to package By appropriately using the through electrode described in Example 1 and Example 2 and the through wiring substrate using the through electrode, a plurality of devices as shown in FIG. (Electronic component) A functional cube (electronic device) in which 185A to 185D are three-dimensionally combined and mounted can be realized.
In FIG. 18, reference numerals 181A to 181D denote substrates. In particular, when composite mounting is performed, 181A has two devices 185A and 185B on the outer surface, 181B has device 185D on the inner surface, and 181C has device 185C on the inner surface. It is location.

According to the present invention, the interior of the substrate is freely wired three-dimensionally, and electrical wiring is made not only on the front and back sides of the substrate, but also on the side surfaces. And high-density mounting is possible.
In addition, by providing the through wiring board of the present invention, it is possible to realize a package with higher functionality and higher density in three-dimensional mounting and SiP, thereby contributing to higher speed and higher functionality of the device.

It is sectional drawing which shows an example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows another example of the penetration wiring board which concerns on this invention. It is sectional drawing which shows the process of the manufacturing method of the penetration wiring board which concerns on this invention. FIG. 12 is a cross-sectional view showing a next step of FIG. 11. It is sectional drawing which shows the next process of FIG. It is sectional drawing which shows the next process of FIG. It is sectional drawing which shows the preparation methods in an example of the composite substrate which concerns on this invention. It is sectional drawing which shows the preparation methods in another example of the composite substrate which concerns on this invention. It is sectional drawing which shows the preparation methods in another example of the composite substrate which concerns on this invention. It is sectional drawing which shows the preparation methods in an example of the electronic device which concerns on this invention. It is sectional drawing which shows an example of the conventional penetration wiring board.

Explanation of symbols

10, 20, 30, 40, 50, 60, 70 Penetration wiring board,
11, 21, 31, 41, 51, 61, 71 base material,
12, 22, 32, 42, 52, 62, 72
13, 23, 33, 43, 53, 63, 73 Through wiring,
81A, 81B base material, 83A, 83B through wiring,
91 base material, 93 through wiring, 95 functional elements,
101A, 101B base material, 105 functional elements,
111 substrate, 112 fine hole, 113 focal point, 114 modifying part, 115 chemical solution, 116 container, 118 laser beam,
141 substrate, 142 micropores, 143 conductive material,
151A, 151B through wiring board, 153a, 153b through electrode, 157 anisotropic conductive adhesive,
161A, 161B substrate, 162a, 162b micropore, 163 insulating resin,
171A, 171B substrates, 172 micropores, 177 low melting glass,
181A to 181D substrate, 185A to 185D device (electronic component).

Claims (7)

A through-wiring board provided with a through-hole formed by arranging a fine hole so as to connect at least two surfaces constituting a base material, and filling the fine hole with a conductive substance,
The penetration wiring board, wherein the penetration wiring has at least a portion extending in a direction different from a thickness direction of the base material.   2. The through wiring board according to claim 1, wherein one end of the through wiring is exposed on a main surface of the base material, and the other end of the through wiring is exposed on a side surface of the base material.   2. The penetration according to claim 1, wherein one end of the through wiring is exposed on one main surface of the base material, and the other end of the through wiring is exposed on the other main surface of the base material. Wiring board.   The through wiring board according to claim 1, wherein the through wiring includes a portion branched into the base material.   2. The through wiring substrate according to claim 1, wherein one end and / or the other end of the through wiring is arranged at a position corresponding to an electrode of another substrate to be joined.   A plurality of through wiring boards according to any one of claims 1 to 5, wherein the main surfaces and / or side surfaces of the through wiring boards are overlapped to electrically connect the through wirings constituting each through wiring board. A composite substrate characterized by comprising An electronic device comprising an electronic component mounted on the through wiring substrate according to claim 1 or the composite substrate according to claim 6.

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