JP2006303360A5 - - Google Patents

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Publication number
JP2006303360A5
JP2006303360A5 JP2005126244A JP2005126244A JP2006303360A5 JP 2006303360 A5 JP2006303360 A5 JP 2006303360A5 JP 2005126244 A JP2005126244 A JP 2005126244A JP 2005126244 A JP2005126244 A JP 2005126244A JP 2006303360 A5 JP2006303360 A5 JP 2006303360A5
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JP
Japan
Prior art keywords
wiring
base material
wiring board
exposed
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005126244A
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Japanese (ja)
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JP2006303360A (en
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Publication date
Application filed filed Critical
Priority to JP2005126244A priority Critical patent/JP2006303360A/en
Priority claimed from JP2005126244A external-priority patent/JP2006303360A/en
Publication of JP2006303360A publication Critical patent/JP2006303360A/en
Publication of JP2006303360A5 publication Critical patent/JP2006303360A5/ja
Pending legal-status Critical Current

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Claims (9)

基材を構成する少なくとも二面を結ぶように微細孔を配し、該微細孔に導電性物質を充填してなる貫通配線を備えた貫通配線基板であって、
前記貫通配線は、少なくとも一部に、前記基材の厚み方向とは異なる方向に延びる部分を有することを特徴とする貫通配線基板。 A through-wiring board provided with a through-hole formed by arranging a fine hole so as to connect at least two surfaces constituting a base material, and filling the fine hole with a conductive substance,
The penetration wiring board, wherein the penetration wiring has at least a portion extending in a direction different from a thickness direction of the base material. 前記貫通配線の一端は前記基材の主面に、前記貫通配線の他端は前記基材の側面に、それぞれ露呈されてなることを特徴とする請求項１に記載の貫通配線基板。   2. The through wiring board according to claim 1, wherein one end of the through wiring is exposed on a main surface of the base material, and the other end of the through wiring is exposed on a side surface of the base material. 前記貫通配線の一端は前記基材の一方の主面に、前記貫通配線の他端は前記基材の他方の主面に、それぞれ露呈されてなることを特徴とする請求項１に記載の貫通配線基板。   2. The penetration according to claim 1, wherein one end of the through wiring is exposed on one main surface of the base material, and the other end of the through wiring is exposed on the other main surface of the base material. Wiring board. 前記貫通配線は、前記基材内に分岐する部分を備えていることを特徴とする請求項１に記載の貫通配線基板。   The through wiring board according to claim 1, wherein the through wiring includes a portion branched into the base material. 前記貫通配線の一端及び／又は他端は、接合する他の基板の電極に対応する位置に配されていることを特徴とする請求項１に記載の貫通配線基板。   2. The through wiring board according to claim 1, wherein one end and / or the other end of the through wiring is arranged at a position corresponding to an electrode of another board to be joined. 請求項１乃至５のいずれか１項に記載の貫通配線基板を複数用い、互いの主面同士及び／又は側面同士を重ね合わせ、互いの貫通配線基板を構成する貫通配線を電気的に接続してなることを特徴とする複合基板。   A plurality of through wiring boards according to any one of claims 1 to 5, wherein the main surfaces and / or side surfaces of each other are overlapped, and the through wirings constituting each through wiring board are electrically connected. A composite substrate characterized by comprising 請求項１乃至５のいずれか１項に記載の貫通配線基板又は請求項６に記載の複合基板に電子部品を実装してなることを特徴とする電子装置。   An electronic device comprising an electronic component mounted on the through wiring substrate according to claim 1 or the composite substrate according to claim 6. 貫通配線基板の製造方法であって、A method of manufacturing a through wiring board,
基材の内部に、レーザーを用いて、少なくとも一部に前記基材の厚み方向とは異なる方向に延びる部分を有する改質部を形成する工程と、A step of forming a modified portion having a portion extending in a direction different from the thickness direction of the base material at least in part inside the base material using a laser;
前記改質部をエッチングにより除去し、微細孔を形成する工程と、Removing the modified portion by etching to form micropores;
前記微細孔に貫通配線を形成する工程と、Forming a through wiring in the fine hole;
を少なくとも有する貫通配線基板の製造方法。A method of manufacturing a through wiring board having at least 請求項８に記載の貫通配線基板の製造方法によって製造された複数の貫通配線基板を用意する工程と、Preparing a plurality of through wiring boards manufactured by the through wiring board manufacturing method according to claim 8;
前記複数の貫通配線基板の互いの主面同士及び／又は側面同士を重ね合わせ、互いの貫通配線基板を構成する貫通配線を電気的に接続する工程と、A step of superimposing main surfaces and / or side surfaces of the plurality of through wiring boards and electrically connecting through wirings constituting each through wiring board;
を少なくとも有する複合基板の製造方法。The manufacturing method of the composite substrate which has at least.
JP2005126244A 2005-04-25 2005-04-25 Through-wire board, composite board, and electronic apparatus Pending JP2006303360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005126244A JP2006303360A (en) 2005-04-25 2005-04-25 Through-wire board, composite board, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005126244A JP2006303360A (en) 2005-04-25 2005-04-25 Through-wire board, composite board, and electronic apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2010283801A Division JP5248590B2 (en) 2010-12-20 2010-12-20 Electronic equipment
JP2010283803A Division JP2011066449A (en) 2010-12-20 2010-12-20 Method for manufacturing passing wiring substrate, method for manufacturing complex substrate, and method for manufacturing electronic device using passing wiring substrate and complex substrate formed by those manufacturing methods

Publications (2)

Publication Number Publication Date
JP2006303360A JP2006303360A (en) 2006-11-02
JP2006303360A5 true JP2006303360A5 (en) 2010-06-24

Family

ID=37471262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005126244A Pending JP2006303360A (en) 2005-04-25 2005-04-25 Through-wire board, composite board, and electronic apparatus

Country Status (1)

Country Link
JP (1) JP2006303360A (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203336A (en) * 2007-02-16 2008-09-04 Fujikura Ltd Opto-electric composite substrate, manufacturing method thereof and electronic equipment
JP2008288577A (en) * 2007-04-18 2008-11-27 Fujikura Ltd Substrate treatment method, through-wire substrate and its manufacturing method, and electronic component
JP5078509B2 (en) * 2007-09-04 2012-11-21 三洋電機株式会社 Solar cell
KR100866577B1 (en) * 2007-09-28 2008-11-03 삼성전기주식회사 Electro-path opening of pcb
JP5478009B2 (en) * 2007-11-09 2014-04-23 株式会社フジクラ Manufacturing method of semiconductor package
JP2009176926A (en) * 2008-01-24 2009-08-06 Fujikura Ltd Through wiring substrate and manufacturing method thereof
JP2009246271A (en) * 2008-03-31 2009-10-22 Tdk Corp Method of wiring to electronic element built-in substrate, and method of manufacturing electronic element built-in substrate
JP5264333B2 (en) * 2008-07-09 2013-08-14 株式会社フジクラ Through wiring board
JP5289874B2 (en) * 2008-09-16 2013-09-11 日本特殊陶業株式会社 Manufacturing method of ceramic parts
CN102379038B (en) 2009-04-14 2014-07-30 株式会社藤仓 Electronic device mounting structure and electronic device mounting method
CN102422414A (en) * 2009-04-28 2012-04-18 株式会社藤仓 Device mounting structure and device mounting method
CN102474982A (en) * 2009-07-06 2012-05-23 株式会社藤仓 Through-wiring board and method of manufacturing same
WO2011004559A1 (en) * 2009-07-10 2011-01-13 株式会社フジクラ Through-wiring board and method of manufacturing same
US20140254120A1 (en) * 2009-10-23 2014-09-11 Fujikura Ltd. Device packaging structure and device packaging method
CN102577637A (en) * 2009-10-23 2012-07-11 株式会社藤仓 Device-mounting structure and device-mounting method
EP2493272A1 (en) * 2009-10-23 2012-08-29 Fujikura, Ltd. Device mounting structure and device mounting method
JP5600427B2 (en) * 2009-12-25 2014-10-01 株式会社フジクラ Material substrate for through wiring board
CN102741010A (en) * 2010-02-05 2012-10-17 株式会社藤仓 Surface microstructure formation method and substrate having surface microstructure
JP5513227B2 (en) 2010-04-08 2014-06-04 株式会社フジクラ Fine structure forming method, laser irradiation apparatus, and substrate
JP2011218398A (en) * 2010-04-08 2011-11-04 Fujikura Ltd Method for forming microstructure, laser irradiation device, and substrate
JP5585204B2 (en) * 2010-05-18 2014-09-10 大日本印刷株式会社 Microchip and manufacturing method thereof
WO2012017857A1 (en) * 2010-08-05 2012-02-09 株式会社フジクラ Electronic circuit chip and method of manufacturing electronic circuit chip
WO2012067177A1 (en) * 2010-11-17 2012-05-24 株式会社フジクラ Wiring board and method for producing same
WO2012108316A1 (en) * 2011-02-08 2012-08-16 株式会社フジクラ Method for manufacturing substrate having micropore, and substrate
TW201304107A (en) * 2011-05-12 2013-01-16 Fujikura Ltd Interposer substrate, electronic device package, and electronic component
JP5873488B2 (en) * 2011-05-25 2016-03-01 株式会社フジクラ Manufacturing method of substrate having micropores, and substrate having micropores
JP5679579B2 (en) * 2011-07-26 2015-03-04 京セラサーキットソリューションズ株式会社 Wiring board
JP2012004601A (en) * 2011-10-03 2012-01-05 Fujikura Ltd Method for manufacturing semiconductor package
EP2762264A4 (en) * 2011-11-04 2015-12-16 Fujikura Ltd Method of manufacturing substrate provided with micropores
US9129843B1 (en) * 2014-06-12 2015-09-08 Globalfoundries Inc. Integrated inductor
JP6633979B2 (en) * 2016-06-20 2020-01-22 株式会社フジクラ Waveguide and method of manufacturing waveguide
JP7302318B2 (en) * 2019-06-13 2023-07-04 セイコーエプソン株式会社 Wiring board, wiring board manufacturing method, inkjet head, MEMS device, and oscillator
JP2021118341A (en) * 2020-01-21 2021-08-10 軍生 木本 Semiconductor device and inspection device thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994441A (en) * 1982-11-19 1984-05-31 Nippon Denso Co Ltd Semiconductor device
JPH05259599A (en) * 1992-03-13 1993-10-08 Matsushita Electric Works Ltd Printed wiring board
JP2000216514A (en) * 1999-01-27 2000-08-04 Matsushita Electric Ind Co Ltd Wiring board and its manufacture
JP4347483B2 (en) * 2000-01-18 2009-10-21 イビデン株式会社 Multilayer wiring board interlayer connection structure
JP4880820B2 (en) * 2001-01-19 2012-02-22 株式会社レーザーシステム Laser assisted machining method
JP2003020257A (en) * 2001-07-04 2003-01-24 Hitachi Ltd Wiring board, semiconductor device and method for manufacturing these
JP2003197811A (en) * 2001-12-27 2003-07-11 Hitachi Ltd Glass substrate, manufacturing method thereof, wiring base board and semiconductor module
JP2004160618A (en) * 2002-11-15 2004-06-10 Seiko Epson Corp Micro machine and method for manufacturing the same
JP2004311720A (en) * 2003-04-07 2004-11-04 Fujikura Ltd Multilayer wiring board, base material therefor and its manufacturing method
JP2004363212A (en) * 2003-06-03 2004-12-24 Hitachi Metals Ltd Wiring board with through-hole conductor
JP2005019576A (en) * 2003-06-25 2005-01-20 Hitachi Metals Ltd Wiring board having through hole conductor

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