JP2006303347A - Light-emitting device and wiring board therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board for a light-emitting device and the light-emitting device wherein in the light emitting device using a light-emitting element, when an electrode of a surface of the light-emitting element is connected to an electrode on a board side, color unevenness in an output light caused by the difference in color is suppressed of color between the board side electrode and the board. <P>SOLUTION: The light emitting device comprises a board 1 formed with a carrier 7 for carrying a light-emitting element 5, and a transparent electrode 3 provided, in a region where the exciting light emitted from the light-emitting element 5 carried on the carrier 7 is irradiated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device using light emitted from a light emitting element and a wiring board for a light emitting device suitably used for the light emitting device, and particularly suitable for a backlight power source for an electronic display or a fluorescent lamp. The present invention relates to a wiring board for a light emitting device and a light emitting device.

  A light-emitting element made of a semiconductor material (hereinafter referred to as an LED light-emitting element) emits light with a small color, high power efficiency, and vivid colors. LED light emitting devices have excellent features such as long product life, strong on / off lighting repeatability, and low power consumption, so they can be applied to backlight sources such as liquid crystals and lighting sources such as fluorescent lamps. Expected.

  The application of the LED light emitting element to the light emitting device is, for example, converting part of the light of the LED light emitting element with a phosphor, and mixing and emitting the wavelength-converted light and the light of the LED that is not wavelength-converted. Thus, a light emitting device that emits an emission color different from the light of the LED is already manufactured.

  Specifically, in order to emit white light, a light emitting device has been proposed in which a wavelength conversion layer including a phosphor capable of converting blue light into yellow light is provided on the surface of an LED light emitting element that emits blue light.

For example, in a light emitting device in which a wavelength conversion layer including a YAG phosphor represented by a composition formula of (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ is formed on a blue LED light emitting element using an nGaN-based material. Since blue light is emitted from the LED light emitting element and a part of the blue light is changed to yellow light in the wavelength conversion layer, a light emitting device that mixes blue and yellow light and presents white has been proposed (for example, Patent Document 1).

  An example of such a light emitting device is shown in FIG. According to FIG. 1, the light-emitting device includes a substrate 1 on which an electrode 2 is formed, an LED light-emitting element 5 including a semiconductor material that emits light having a central wavelength of 470 nm on the substrate 1, and a light-emitting element 5 on the substrate 1. The wavelength converter A is provided so as to cover the substrate, and the wavelength converter A contains the phosphors 5a, 5b, and 5c in the transparent matrix resin 4. If desired, a reflector 6 that reflects light may be provided on the side surfaces of the light emitting element 5 and the wavelength converter A, and the light escaping to the side surface may be focused forward to increase the intensity of the output light.

  In this light-emitting device, when light emitted from the light-emitting element 5 is irradiated onto the phosphor, the phosphor is excited to emit visible light, and this visible light is used as an output.

In the light emitting device having this configuration, in order to electrically connect the LED light emitting element and the substrate, a metal material such as silver, copper, or molybdenum is used as the electrode material on the substrate side.
JP 1999-261114 A

  However, when such an electrode material is used, when the electrode on the surface of the LED light emitting element and the electrode on the substrate side are connected, light emission unevenness or color unevenness occurs in the output light due to the difference in color between the substrate side electrode and the substrate. There is a problem that arises.

  A wiring board for a light-emitting device according to the present invention includes a substrate on which a mounting portion for mounting a light-emitting element is formed, and a transparent portion provided at a site irradiated with excitation light emitted from the light-emitting element mounted on the mounting portion. And an electrode.

  In the light emitting device wiring board of the present invention, it is preferable that the transparent electrode contains indium tin oxide or zinc oxide.

  In the light emitting device wiring board of the present invention, it is preferable that the total light transmittance of the transparent electrode is 80% or more.

  In the light emitting device wiring board of the present invention, it is preferable that the board is white.

  In the wiring board for a light emitting device of the present invention, it is preferable that the board is a ceramic sintered body.

  The light emitting device of the present invention is characterized in that a light emitting element is mounted on the mounting portion of the wiring substrate for a light emitting device described above.

  In the light emitting device of the present invention, it is preferable that a difference between a peak wavelength of a transmission spectrum of the transparent electrode and a peak wavelength of excitation light emitted from the light emitting element is 30 nm or less.

  In the light emitting device of the present invention, the difference between the peak wavelength of the reflection spectrum of the transparent electrode and the peak wavelength of the reflection spectrum of the substrate surface formed by forming the transparent electrode on the surface is 30 nm or less. desirable.

  In the light emitting device of the present invention, it is preferable that the light emitting device includes a wavelength converter that absorbs at least a part of excitation light emitted from the light emitting element and uses visible light as output light.

  According to the wiring board for a light emitting device and the light emitting device of the present invention, by using a transparent electrode as an electrode irradiated with excitation light from the light emitting element, excitation light emitted from the light emitting element, an inner surface of the light emitting device, etc. The reflected light is transmitted through the transparent electrode, and the transmitted light is reflected by the substrate surface, so that the difference in color of reflected light between the substrate surface where the electrode is not formed and the portion where the electrode is formed is reduced. . As a result, the color unevenness of the output light caused by the difference in color between the substrate and the electrode of the light emitting device can be reduced.

  Further, according to the wiring board and the light emitting device for the light emitting device of the present invention, the transparency as the transparent electrode is maintained by using as the electrode material a material containing a material made of indium tin oxide or zinc oxide. However, since the electrical resistance can be lowered compared to tin oxide and indium oxide, which are conductive materials that exhibit the same transparency, the color tone between the substrate and the electrode is maintained while maintaining the low resistance characteristics as an electrode. The difference can be reduced, and the color unevenness of the output light can be reduced. In addition, it is known that the quantum efficiency of a light-emitting element is reduced due to heat generation of the element itself or heat generation of a substrate for fixing the element. When the electrical resistance of the electrode is high, there is a concern that the quantum efficiency of the light-emitting element is reduced due to the generation of heat due to the electrical resistance. By using a material containing indium tin oxide or zinc oxide as the electrode material, the reduction in luminous efficiency due to heat generation due to the electrical resistance of the electrode can be reduced, so that the original brightness as a light emitting device is kept constant. There is an effect that can be done. In addition, by using a low-resistance transparent electrode material, it is possible to reduce the generation of heat, which can cause cracks and peeling during long-term use due to differences in the thermal expansion coefficient between the light-emitting element, the transparent electrode, and the substrate. Can be prevented.

  In addition, according to the wiring board for a light emitting device and the light emitting device of the present invention, when the total light transmittance of the transparent electrode is 80% or more, the amount of transmitted light is increased, and the color difference between the electrode and the substrate is increased. In addition, the difference in brightness can be suppressed. Moreover, by transmitting 80% or more of light, absorption of light by the electrode material can be suppressed, and a decrease in light extraction efficiency can be prevented.

  In addition, according to the wiring board for a light emitting device and the light emitting device of the present invention, by making the color of the substrate white, the reflectance of light on the substrate surface can be made higher than other colors, and the substrate surface By suppressing the absorption of light, the output light is efficiently extracted and the light is extracted.

  In addition, according to the wiring board for a light emitting device and the light emitting device of the present invention, characteristic deterioration is caused by using a ceramic sintered body that is stable against heat and light and has a higher thermal conductivity than a resin as the substrate. The light emitting device wiring board and the light emitting device are suppressed.

  In addition, by setting the difference between the peak wavelength of the transmission spectrum of the transparent electrode and the peak wavelength of the excitation light emitted from the light emitting element to 30 nm or less, the light that passes through the transparent electrode and reaches the substrate surface on the lower surface of the electrode In the color of the light that the excitation light emitted from the light-emitting element reaches the substrate surface on which no electrode is formed, a significant difference that can be visually felt can be significantly reduced. Therefore, since there is no color difference between the light reflected on the substrate surface under the transparent electrode and the light reflected on the substrate surface other than the transparent electrode, the color difference between the electrode shape and the exposed portion of the substrate is eliminated. There is an effect that the difference in the shape of the light becomes difficult to be reflected in the color of the output light.

  Moreover, each surface which comprises a transparent electrode and a board | substrate by making the difference of the peak wavelength of the reflection spectrum in the said transparent electrode and the peak wavelength of the reflection spectrum of the board | substrate surface which forms a transparent electrode into 30 nm or less The difference in color tone can be reduced even in the light beam reflected by.

  The reflection spectrum on the transparent electrode surface is originally less due to the transmission of light, but by setting the difference between the reflection spectrum on the substrate surface and the peak wavelength of the reflection spectrum on the transparent electrode surface to 30 nm or less, Since the difference in color tone of the light reflected on all surfaces can be reduced, the color unevenness of the output light can be further reduced.

  Further, by providing the light-emitting device with a wavelength converter that absorbs at least a part of excitation light emitted from the light-emitting element and outputs visible light as output light, the light-emitting device has a higher efficiency without being limited to the quantum efficiency of the light-emitting element. An efficient light emitting element can be selected. The color of the output light can be freely controlled by selecting a light emitting element with higher quantum efficiency and selecting a phosphor that converts the excitation wavelength emitted from the light emitting element. Here, with respect to the phosphor, the spectrum of the wavelength-converted light can be controlled by mixing phosphors of various colors in arbitrary amounts. That is, when the excitation light is wavelength converted into output light, the spectrum structure of the output light can be controlled, and the uniformity of the reflection spectrum and absorption spectrum on the transparent electrode and the substrate is further improved. Effective in obtaining no output light.

  The light emitting device wiring board and the light emitting device of the present invention include, for example, a flat substrate 1 and a transparent electrode 3 formed on the substrate 1 as shown in FIGS. The substrate 1 has a mounting portion 7 on which the light emitting element 5 is mounted. The transparent electrode 3 formed on the substrate 1 is formed in a portion that is exposed to light such as excitation light emitted from the light emitting element 5.

  In addition, what is called LED is used suitably as a light emitting element used by this invention.

  The light-emitting device wiring substrate 9 may be provided with a through conductor 11 electrically connected to the transparent electrode 3 and a terminal electrode 13.

  For example, in the example shown in FIG. 1B, the light emitting element 5 is mounted on the mounting portion 7 of the wiring substrate 9 for the light emitting device via an adhesive 15 made of silver particles and an epoxy resin. The element 5 and the transparent electrode 3 are electrically connected by a wire 17.

  Furthermore, the light-emitting device 23 of the present invention is formed by the reflection plate 19 that surrounds the light-emitting element 5 and guides light in a predetermined direction and the wavelength conversion layer 21 that is formed so as to cover the light-emitting element 5.

  In such a light emitting device 23, for example, excitation power is emitted from the light emitting element 5 by supplying power to the light emitting element 5 through the wire 17, the transparent electrode 3, the through conductor 11, and the terminal electrode 13. The excitation light irradiated on the surface of the substrate 1, the transparent electrode 3, and the reflection plate 19 and reflected by the respective portions, or the excitation light that directly reaches the wavelength conversion layer 21 is wavelength-converted by the wavelength conversion layer 21 and output light. It becomes.

  In the present invention, it is important that at least the transparent electrode 3 is transparent among these electrodes.

  That is, in such a light emitting device, by supplying electric power to the light emitting element 5, the light emitting element 5 emits light, and the light is used as output light. Is a reflection of the light once irradiated on the reflecting plate 9, the surface of the substrate 1, or the transparent electrode 3.

  Conventionally, the electrode is formed of a material such as silver, copper, molybdenum, or tungsten, and has a color difference from the substrate. Moreover, although the electrode was covered with gold or silver, even in this case, the color tone difference between the substrate and the electrode was remarkably large. Therefore, a color tone difference has occurred in part of the output light.

  On the other hand, in the light emitting device of the present invention, by using the transparent electrode 3, the reflected light at the portion where the transparent electrode 3 is formed becomes substantially the same as the reflected light of the substrate 1. Can be reduced.

  In addition to being transparent and low resistance, it is desirable that the transparent electrode 3 can be formed thin. The transparent electrode 3 on the substrate 1 is preferably formed of a transparent electrode 3 made of a compound of indium oxide and tin oxide or zinc oxide.

In addition, it is a compound of indium oxide and tin oxide in that the electrical resistance is lower than the composition of only indium oxide or tin oxide, and the transparency is maintained, or
More preferably, it is made of a material containing zinc oxide.

  Moreover, when the transparent electrode 3 is formed of a compound of indium oxide and tin oxide, the mixing ratio of tin oxide in indium oxide can achieve both transparency and low resistance at 20% by mass or less, More desirably, the content is 5 to 10% by mass.

  Further, in the light emitting device 23 of the present invention, it is desirable that the total light transmittance of the transparent electrode 3 is 80% or more, and the light passes through the transparent electrode with a high transmittance of 80% or more. In the light reaching the surface of the substrate 1, the difference in spectrum between the light beam that reaches the surface of the substrate 1 that is not formed and the light beam that passes through the transparent electrode 3 and reaches the substrate 1 is reduced. This has the effect of suppressing uneven color. Further, light absorption by the transparent electrode 3 can be suppressed, and a decrease in light extraction efficiency can be prevented.

  Further, in order to increase the total light transmittance, it is desirable to form a denser crystal structure when forming the transparent electrode 3. As a method for obtaining a dense crystal structure, a method of increasing the heat treatment temperature of the transparent electrode 3 is conceivable.

  Further, in the light emitting device 23 of the present invention, it is desirable that the difference between the peak wavelength of the transmission spectrum of the transparent electrode 3 and the peak wavelength of the excitation light emitted from the light emitting element is 30 nm or less. That is, in the present invention, by using the transparent electrode 3, the light reaching the surface of the substrate 1 is covered with the electrode on the surface portion of the substrate 1 on which the transparent electrode 3 is formed and the surface of the other substrate 1. It is possible to suppress the occurrence of a difference in the spectrum of reflected light between the unexposed portion. That is, the excitation light can reach the surface of the substrate 1 underlying the transparent electrode 3 without making a significant change in color tone by reducing the change in peak wavelength due to absorption by the transparent electrode 3. On the other hand, excitation light that reaches and reflects the surface of the substrate 1 that is not covered by the transparent electrode 3 reaches the surface of the substrate 1 with the same peak wavelength. Therefore, by reducing the difference between the peak wavelength of the transmission spectrum of the transparent electrode 3 and the peak wavelength of the excitation light, the change in spectrum due to the location of the substrate 1 surface is small in the light reaching the surface of the substrate 1. Therefore, by setting the difference in peak wavelength to 30 nm or less, preferably 20 nm or less, there is no color difference that can be clearly confirmed visually, and as a result, it is possible to reduce color unevenness as output light of the lighting device. .

  Further, the light emitting device 23 of the present invention has uneven color of light reflected from the surface of the transparent electrode 3 and the surface of the substrate 1 among the excitation light from the light emitting element 5 and the light converted in wavelength by the wavelength conversion layer 21. It is intended to reduce this. Therefore, it is desirable that the difference between the peak wavelength of the reflection spectrum of the transparent electrode 3 and the peak wavelength of the reflection spectrum on the surface of the substrate 1 is 30 nm or less. By setting the difference between the reflection spectrum of the transparent electrode 3 and the reflection spectrum on the surface of the substrate 1 to 30 nm or less, color unevenness can be suppressed to the extent that it cannot be visually confirmed. By setting the difference in the reflection spectrum to 30 nm or less, preferably 20 nm or less over the entire surface, the color difference by visual observation becomes very small, and it cannot be recognized as color unevenness by visual observation, and is recognized as uniform output light. Become. The difference in the spectrum of visible light from which the difference in color can be confirmed visually is approximately 30 nm or more, although there are individual differences.

  Moreover, since the light emitting device 23 of the present invention can efficiently reflect light even on the surface of the substrate 1 covered with the transparent electrode 3, it is desirable that the surface of the substrate 1 has high reflectivity. Specifically, the reflectance is desirably 60% or more, particularly 70% or more, and more desirably 90% or more.

  Further, by making the color tone of the substrate 1 white, it is possible to prevent light absorption on the substrate surface as compared with other colors such as black and brown, and by efficiently reflecting light, The brightness of the output light can be maintained. That is, when the white substrate 1 is used, the light emitting device 23 has a high light extraction efficiency in addition to the reduction in color unevenness.

  An example of such a white substrate 1 is an alumina sintered body. It goes without saying that a ceramic sintered body other than the alumina sintered body may be used.

  Further, when a ceramic sintered body is used as the substrate 1, the durability of the substrate 1 against light and heat is significantly improved as compared with the case where the resin substrate 1 is used.

  Further, according to the light emitting device 23 of the present invention, for example, when white light is to be used as output light, the wavelength of ultraviolet excitation light is converted into each color of red, green, and blue and mixed to output white light. It is also possible to convert the wavelength of blue excitation light with a yellow phosphor and mix it with the excitation light to output as white light. In order to perform such wavelength conversion of excitation light, the light emitting device of the present invention preferably includes a wavelength conversion layer 21 containing a wavelength conversion substance. The wavelength conversion layer 21 is configured, for example, by dispersing a fluorescent material having an average particle size of 0.1 μm or more and semiconductor ultrafine particles having an average particle size of 20 nm or less in a transparent resin or glass. These particles are used, for example, by mixing red, green, blue, and yellow particles as desired.

  Below, the manufacturing method of the transparent electrode 3 which is an important component of this invention is demonstrated.

  The transparent electrode 3 can be formed, for example, by forming a transparent conductive thin film by a method such as a vapor deposition method or a sputtering method, and then patterning it by a photolithography method or the like to process it into an electrode shape.

  When patterning is performed by the photolithography method, a fine and complicated wiring shape can be easily formed, and the degree of freedom in the mounting form of the light emitting element 5 is widened. The photolithographic method is effective in terms of mass productivity because patterning can be performed for a large number of pieces at once.

  For forming the transparent electrode 3, a conductive paste using fine particles having an average particle diameter of 0.5 μm or less, preferably 0.1 μm or less, made of a compound containing indium oxide and tin oxide or zinc oxide is used. It can also be patterned by a printing method.

  At this time, by setting the particle diameter of the transparent electrode material in the conductor paste to 0.5 μm or less, irregularities in the shape of the printed pattern can be prevented. Neck growth is easy and resistance can be reduced. Further, by setting the particle diameter to 0.1 μm or less, the particles can be connected at a lower temperature, so that the resistance as an electrode can be reduced. Further, by patterning by a printing method, an electrode can be formed by a simple process, so that the yield can be improved and an inexpensive process can be realized. Regarding the ITO paste (ITO: Indium Tin Oxide), in addition to the fine particle dispersion type, a thermal decomposition type using organic indium, organic tin, etc. as a raw material may be used. Since the degree of freedom is high, printability is good, and a dense and highly translucent film can be manufactured.

  Note that the light-emitting device wiring board 9 and the light-emitting device 23 of the present invention are not limited to the examples described above, and may include other forms, for example, the light-emitting element 5 and the transparent electrode 3. May be an electrical connection by flip-chip connection.

  The light emitting device of FIG. 1 was produced. First, an LED (light emitting element) emitting near ultraviolet light having a peak wavelength of 365 nm was prepared as a light emitting element.

Next, a wiring board for a light emitting device in which a transparent electrode was formed on the surface of a substrate made of a white alumina sintered body (bulk density: 3.6 g / cm ³ ) having a total light reflectance of 70% was prepared. This transparent electrode uses commercially available ITO paste (DX-400 series manufactured by Sumitomo Metal Mining), screen-printed using plate making, and after patterning, heat treatment was performed at 450 ° C. in an oven to remove the solvent content in the ITO paste. It was volatilized and the particles in the paste were formed by sintering and crystallization.

  An aluminum frame-like reflective member is attached to the light emitting device wiring board, and a die attach adhesive (Kyocera Chemical: CT284R made of silver particle filler and epoxy resin) is mounted on the mounting portion of the light emitting device wiring board. The LED (light emitting element) that emits the near ultraviolet light described above was mounted.

  Then, the light emitting element and the transparent electrode are connected with a gold wire, and the reflective member is filled with a transparent silicone resin (GE Toshiba Silicone XE14-C0447) to cover the light emitting element. The silicone resin was cured by heating for a time to form an inner layer. A dispenser was used for filling the silicone resin.

  Next, a resin composed of a dimethyl silicone skeleton containing a phosphor having a fluorescence spectrum in the visible range was applied and formed on a smooth substrate with a dispenser, and was cured by heating to form a thick film. The thick film was peeled off from the substrate to form a film-like wavelength conversion layer, and this wavelength conversion layer was attached to the upper surface of the inner layer to obtain the light emitting device of the present invention.

Incidentally, the phosphor as the average particle size is more than 0.1μm fluorescent _{substance, (Sr, Ca, Ba,} Mg) 10 (PO 4) 6 C l2: Eu, BaMgAl 10 O 17: Eu, Mn, LiEuW 2 O ₈ was used. The semiconductor nanoparticles having an average particle size of 10 nm or less were appropriately selected from nanoparticles composed of InN, AgInS ₂ , CuInS ₂ , and CdSe. The semiconductor nanoparticles were synthesized by a hot soap method by a method described in the literature.

  Further, as a comparative example, a sample in which an electrode is formed of molybdenum on the surface of a substrate on which output light of a light emitting element and scattered light from a wavelength conversion layer are reflected was manufactured. The electrodes were formed by applying a molybdenum paste and firing simultaneously when firing the alumina insulating substrate. The issuing element mounted on the substrate, the form of mounting, and the wavelength conversion layer were the same as in the example.

  The produced light-emitting device was evaluated by projecting output light onto white paper and visually confirming the presence or absence of color unevenness.

  In the light emitting device according to the example, the projected light having no color unevenness could be visually confirmed on the white paper. On the other hand, in the light emitting device of the comparative example, it was confirmed that the color unevenness as if part of the electrode pattern was reflected in a partially undulating shape.

(A) is sectional drawing of the wiring board for light-emitting devices of this invention, (b) is sectional drawing of the light-emitting device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 3 ... Transparent electrode 5 ... Light emitting element 7 ... Mounting part 9 ... Wiring board 21 for light emitting devices ... Wavelength conversion layer 23 ... Light emitting device

Claims (9)

A substrate on which a mounting portion for mounting a light emitting element is formed, and a transparent electrode provided at a site irradiated with excitation light emitted from the light emitting element mounted on the mounting portion, A wiring board for a light emitting device. The wiring board for a light-emitting device according to claim 1, wherein the transparent electrode contains indium tin oxide or zinc oxide. The wiring board for a light-emitting device according to claim 1, wherein the transparent electrode has a total light transmittance of 80% or more. The wiring board for a light-emitting device according to claim 1, wherein the board is white. The wiring board for a light emitting device according to claim 1, wherein the substrate is a ceramic sintered body. A light emitting device comprising a light emitting element mounted on the mounting portion of the wiring substrate for a light emitting device according to claim 1. The light emitting device according to claim 6, wherein a difference between a peak wavelength of a transmission spectrum of the transparent electrode and a peak wavelength of excitation light emitted from the light emitting element is 30 nm or less. The difference between the peak wavelength of the reflection spectrum of the transparent electrode and the peak wavelength of the reflection spectrum of the substrate surface formed by forming the transparent electrode on the surface is 30 nm or less. The light-emitting device of description. The light emitting device according to any one of claims 6 to 8, wherein the light emitting device includes a wavelength converter that absorbs at least part of excitation light emitted from the light emitting element and uses visible light as output light. apparatus.

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