JP2006300566A - Evaluation method and container for evaluation of material for semiconductor wafer storage container, and evaluation method of resin material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaluation method of a material for a semiconductor wafer storage container capable of determining the kind of a resin causing a component adhering to the surface of a semiconductor wafer when preserved in a resin semiconductor wafer storage container formed by assembling a plurality of components having different materials, and acquiring data effective for development of a high-quality semiconductor wafer storage container. <P>SOLUTION: This evaluation method of the material for the resin semiconductor wafer storage container formed by assembling the plurality of components having different materials is characterized as follows: one resin used as the the material for the semiconductor wafer storage container is used, and a container for evaluation whose material comprises only the resin is manufactured; then, the semiconductor wafer is preserved in the container for evaluation; after elapse of a prescribed time, the semiconductor wafer is taken out, and a component adhering to the surface is analyzed; and thereby it is determined whether the resin is suitable for the material for the semiconductor wafer storage container or not. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin material evaluation method and an evaluation container used for handling a semiconductor wafer, and more particularly, to an evaluation method and evaluation material for a resin semiconductor wafer storage container in which a plurality of parts made of different materials are assembled. Concerning the container.

  When a device is manufactured using a semiconductor substrate cut out from a semiconductor ingot such as a silicon single crystal, a number of steps are involved from a processing process of the semiconductor substrate to an element formation process. With the recent miniaturization of devices, the device characteristics to be achieved are becoming more and more severe, and the semiconductor wafers are required to have more complete crystal quality and surface cleaning. In addition to fine particles, metal elements and halogen elements, which have been attracting attention in the past, organic substances are starting to be checked. This is because, for example, problems such as abnormal growth of an oxide film occur when organic substances adhere to the wafer.

  For example, when a storage container for storing a semiconductor wafer such as silicon is molded with a single resin, all the components are not fit properly, and the semiconductor wafer cannot be properly stored and held. Therefore, by calculating the shrinkage after molding, etc., each of the plurality of component parts is molded by selecting different materials, but even in such an existing storage container, the volatile component contained in the resin However, it becomes a cause of contamination of the semiconductor wafer to be stored, and is insufficient to have a storage function that satisfies the quality requirements of recent semiconductor wafers.

  Such existing storage containers, for example, are mainly made of polypropylene as a main raw material, and the harmfulness of such containers to silicon wafers is that after the heat treatment for a predetermined time, the silicon wafer is stored for a predetermined time at room temperature. After being held in step 1, there is a method of inspecting by a simple method of visually confirming the presence or absence of a surface altered layer of a silicon wafer (Patent Document 1).

  In addition, after holding the silicon wafer in such an existing storage container, the silicon wafer container can improve the quality of the silicon wafer by analyzing volatile components (ionic contamination, organic contamination, etc.) adhering to the wafer surface. The influence given can be investigated (Patent Document 2).

  However, since the resin-made silicon wafer storage container is formed by assembling a plurality of parts having different materials as described above, the altered layer or volatile component on the surface of the silicon wafer detected by the above-described method is used. If the data alone is contaminated, it is not possible to specify which resin the adhering component is caused by. Therefore, a silicon wafer storage container with a storage function that satisfies the quality requirements of recent silicon wafers cannot be specified. The data required for development, especially the selection of its materials, is insufficient.

JP-A-5-259254 Japanese Patent Laid-Open No. 2004-340685

  Therefore, the present invention has been made in view of the above problems, and the object of the present invention is, in particular, a semiconductor wafer when stored in a resin-made semiconductor wafer storage container in which a plurality of parts made of different materials are assembled. Method for evaluating materials for semiconductor wafer storage containers, which can determine which resin is responsible for the component adhering to the surface of the wafer, and can reliably obtain data effective for the development of high-quality semiconductor wafer storage containers And providing an evaluation container used therefor.

  In order to achieve the above object, according to the present invention, there is provided a method for evaluating a material used for a resin-made semiconductor wafer storage container in which a plurality of parts made of different materials are assembled, which is used as the material for the semiconductor wafer storage container. One of the resins used is made of an evaluation container made of only the resin, the semiconductor wafer is held in the evaluation container, and after a predetermined time has elapsed, the semiconductor wafer is taken out and placed on the surface. By analyzing the adhering component, it is determined whether or not the resin is suitable for the semiconductor wafer storage container material. A method for evaluating a semiconductor wafer storage container material is provided. ).

  In this way, after producing an evaluation container made only of a resin whose material is to be evaluated, a semiconductor wafer is held therein, and after a predetermined time has elapsed, the components adhering to the wafer surface are analyzed, whereby a plurality of different materials are obtained. It is possible to determine which resin is responsible for the component that adheres to the semiconductor wafer surface when it is stored in a resin-made semiconductor wafer storage container assembled with the above parts, and a material for the development of high-quality semiconductor wafer storage containers Data effective for selection can be obtained.

At this time, it is preferable to evaluate a silicon wafer storage container material as the semiconductor wafer storage container material.
As described above, by evaluating the silicon wafer storage container material as the semiconductor wafer storage container material, the data is effective for the development of a silicon wafer storage container having a sufficient storage function to satisfy the quality requirements of recent silicon wafers. Is to get.

  Further, the container for evaluation has a holding part for holding a semiconductor wafer at the upper part, and has a reverse saddle shape with the lower part opened, and after holding the semiconductor wafer in the holding part, It is preferable to hold the semiconductor wafer in the evaluation container by superimposing another evaluation container having the same shape from above.

  An evaluation container having a holding part for holding a semiconductor wafer at the upper part and having an inverted bowl shape with the lower part opened and made of only a resin to be evaluated is injection-molded using a set of molds. It is simple because it can be manufactured only, and after holding the semiconductor wafer in this holding part, another evaluation container of the same shape is overlapped from the upper part of the semiconductor wafer. Since the semiconductor wafer can be easily held and the container can be configured using substantially only one type of component, an efficient evaluation can be performed at low cost. Furthermore, when this evaluation container is used, even when different resins are evaluated, the shrinkage rate of the resin to be molded does not matter, and the same mold can be used. is there.

Furthermore, it is preferable to analyze the component adhering to the surface of the semiconductor wafer by gas chromatography, gas chromatography mass spectrometry or ion chromatography.
Thus, by analyzing the component adhering to the surface of the semiconductor wafer by gas chromatography, gas chromatograph mass spectrometry or ion chromatography, the component can be analyzed with high accuracy, and the evaluation resin to be analyzed is a semiconductor. It is possible to accurately determine whether or not the wafer storage container material is suitable.

Further, it is preferable that a predetermined time for holding the semiconductor wafer in the evaluation container is 6 hours or more.
Thus, by holding the semiconductor wafer in the evaluation container for 6 hours or more, the volatile component of the resin constituting the evaluation container is sufficiently volatilized in the evaluation container and adheres to the wafer surface. And can be expected to be detectable.

  Furthermore, according to the present invention, there is provided an evaluation container for evaluating a resin used as a material for a semiconductor wafer storage container, wherein the material is made of only the resin to be evaluated, and the holding portion that holds the semiconductor wafer on the upper part And holding the semiconductor wafer in the holding part, and then superimposing another evaluation container of the same shape from the upper part of the semiconductor wafer, An evaluation container characterized in that the semiconductor wafer is held in the evaluation container (claim 6).

  As described above, the evaluation container is an inverted container having a holding part for holding a semiconductor wafer at the upper part and having an open lower part, which is made of only a resin to be used as a semiconductor wafer storage container material. Since the resin to be evaluated can be injection-molded with a set of molds, it can be easily manufactured, and even when different resins are evaluated, the shrinkage rate of the resin to be molded does not matter. Since the same mold can be used, it is very economical. After holding the semiconductor wafer in the holding part of the evaluation container, the semiconductor wafer can be easily held in the evaluation container by stacking another evaluation container having the same shape from the upper part of the semiconductor wafer. Since the container can be configured using substantially only one type of component, the container can be efficiently evaluated at low cost.

  Further, according to the present invention, there is provided a method for evaluating a resin material used for handling a semiconductor wafer, wherein one of the resin materials is used to produce an evaluation container made of only the resin, and then the evaluation is performed. Whether the resin is suitable for the resin material used to handle the semiconductor wafer by holding the semiconductor wafer in a container and analyzing the components attached to the surface after taking out the semiconductor wafer after a predetermined time has passed A method for evaluating a resin material, characterized by determining whether or not, is provided (claim 7).

  Thus, the evaluation method of the present invention is not limited to semiconductor wafer storage container materials, and can be applied to the evaluation of resin materials used to handle semiconductor wafers. By producing a container for evaluation consisting of only the resin to be evaluated used for handling semiconductor wafers, holding the semiconductor wafer in it and analyzing the components attached to the wafer surface after a predetermined time Therefore, it can be determined whether or not the volatile component of the resin material is acceptable for handling the semiconductor wafer, and data effective for selecting the resin material used for handling the semiconductor wafer can be obtained.

  Furthermore, according to the present invention, there is provided an evaluation container for evaluating a resin material used for handling a semiconductor wafer, the material is made of only the resin to be evaluated, and has a holding portion for holding the semiconductor wafer on the upper portion. In addition, the evaluation is performed by stacking another evaluation container having the same shape from the upper part of the semiconductor wafer after holding the semiconductor wafer in the holding part, and having the inverted bottom shape with the lower part opened. An evaluation container characterized in that the semiconductor wafer is held in a container for use (claim 8).

  Thus, the evaluation object of the present invention is not limited to the semiconductor wafer storage container material, and the resin material used for handling the semiconductor wafer is also the evaluation object. An evaluation container with an inverted saddle shape having a holding part for holding a semiconductor wafer in the upper part and having a lower part opened is made of only a resin to be evaluated used for handling a semiconductor wafer. Since it can be injection-molded with a set of molds, it can be easily manufactured, and even when different resins are evaluated, the shrinkage rate of the molded resin does not matter and the same mold is used. It can be very economical. After holding the semiconductor wafer in the holding part of the evaluation container, the semiconductor wafer can be easily held in the evaluation container by stacking another evaluation container having the same shape from the upper part of the semiconductor wafer. Since the container can be configured using substantially only one type of component, efficient evaluation can be performed at low cost.

In this way, according to the present invention, for example, it is possible to determine which resin is caused by the component adhering to the semiconductor wafer surface stored in the resin-made semiconductor wafer storage container in which a plurality of parts having different materials are assembled, It has become possible to obtain effective data for the development of high-quality semiconductor wafer storage containers, especially for material selection. Moreover, it can be evaluated at a low cost.
In addition, the present invention is not limited to semiconductor wafer storage container materials, but can also be used for evaluation of resin materials used for handling semiconductor wafers, and is expected to contribute to an increase in cleanliness in semiconductor manufacturing processes and the like. it can.

  Regarding problems in the development of semiconductor wafer storage containers that have storage functions that meet the quality requirements of semiconductor wafers such as silicon wafers in recent years, semiconductor wafers are placed in resin-made semiconductor wafer storage containers in which multiple parts of different materials are assembled. By simply analyzing the wafer surface after holding it, it was not possible to determine which resin caused the component adhering to the wafer surface.

  Therefore, the present inventors have conducted extensive research and are a method for evaluating a material used for a resin-made semiconductor wafer storage container in which a plurality of parts having different materials are assembled, and is used as the material for the semiconductor wafer storage container. After producing an evaluation container made of only the resin using one of the resins, the semiconductor wafer is held in the evaluation container, and after a predetermined time has elapsed, the semiconductor wafer is taken out and attached to the surface When the resin is stored in a resin-made semiconductor wafer storage container in which multiple parts of different materials are assembled by determining whether the resin is suitable for the semiconductor wafer storage container material by analyzing the components It is possible to determine which resin is responsible for the components adhering to the surface of semiconductor wafers, which is effective for the development of high-quality semiconductor wafer storage containers. Data has been found that can be obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the tables and the drawings, but the present invention is not limited thereto.
In the present invention, for example, materials used for a resin-made semiconductor wafer storage container in which a plurality of parts having different materials as shown in Table 1 and FIG. 3 are assembled are evaluated.
Table 1 shows an example of parts and materials (trade names: MW300F, MW300G) of commercially available semiconductor wafer storage containers.

  On the other hand, FIG. 3 shows an example of a semiconductor wafer storage container, in which a body 13 of an insert part for housing a semiconductor wafer is inserted into a body 15 of a main body part, a gasket 14 and a front retainer 12 are attached, and a door 11 Is used in such a way as to store a semiconductor wafer, and the materials of the respective parts are usually different in composition as shown in Table 1.

  In addition, in polypropylene (PP) containers, for example, polypropylene is used for the main body, while polycarbonate (PC) is used for the lid (door), polybutyl terephthalate (PBT) is used for the wafer holder, and silicone rubber is used for the gasket (packing). Polyolefin elastomers and polyester elastomers may be used. Moreover, even if the same polycarbonate or the like is used, the blending or polymerization degree may be different.

  As mentioned above, considering the shrinkage after molding of the component material, when all the component parts are molded with a single resin, the fitting does not work, so each component part is calculated by calculating the shrinkage after molding, etc. A plurality of different materials are selected and molded for each. In addition, each part has its own purpose of use, and it is virtually impossible to configure the container so that all the purposes are achieved with the same material. For example, packing for sealing purposes is required to be flexible, and the body of the insert must be supported while not damaging the wafer, and requires a certain degree of strength and appropriate softness. On the other hand, the body of the main body is required to have strength to withstand external impacts.

  Therefore, in the present invention, in order to evaluate the influence of each of the resins used as the semiconductor wafer storage container material on the semiconductor wafer to be stored, first, for each evaluation resin, the evaluation is made of only a single material. Make a container. Since this evaluation container is used for analysis of the volatile components of the resin, it is important that it only consists of the resin to be evaluated, and it is not intended for storage or transportation of wafers. Need not be the same as the container actually used, but may be of a simpler shape.

  As shown in FIG. 2, the evaluation container 1 produced in the present invention is made of only a resin whose material is evaluated, and has a holding part 2 that holds a semiconductor wafer in the upper part, and has an inverted bowl shape in which the lower part is opened. Is. With such a shape, a plurality of molds can be easily manufactured by a single mold by injection molding, and after holding the semiconductor wafer W in the holding portion 2, the upper portion of the semiconductor wafer W The other evaluation containers having the same shape are overlapped with each other so that the evaluation container can be surrounded by the inverted saddle-shaped side portion 3 and the inverted saddle-shaped ceiling portion 4 and is substantially made of a single material. This is very preferable because the container can be configured by using only one type of upper part. Further, in this case, even when a plurality of different resins are evaluated, the shrinkage rate of the resin to be molded does not matter and the same mold can be used, which is very economical.

Here, as long as the holding part 2 has a structure that can support the peripheral part of the semiconductor wafer W in a ring shape as shown in FIG. 2A, the sealing degree may be high, but the structure that supports the semiconductor wafer W at three points. Any structure may be used as long as the semiconductor wafer W can be stably supported.
The inverted side-shaped side portion 3 and the ceiling portion 4 are preferably a structure that can completely seal the semiconductor wafer W to be held, because volatile components can be efficiently attached to the semiconductor wafer W. Even if it is not the structure sealed in, it is sufficient if the evaluation container 1 has a structure with many portions close to the semiconductor wafer W.

  Further, even if the evaluation container is formed by combining a plurality of separate members, for example, a member that holds and accommodates a wafer and a member that is a lid, separately, these materials are evaluated. As long as it consists only of resin to be used. However, in this case, a plurality of types of molds are required, and it may be necessary to manufacture a mold for each resin to be evaluated.

The molding of the evaluation container made of only the resin to be evaluated is preferably injection molding performed by heating a resin raw material called a pellet into a fluid and pressurizing it into a mold.
This is because a resin-made semiconductor wafer storage container in which a plurality of parts made of different materials are assembled, each member is generally formed by injection molding, and is caused by a resin raw material that is a pellet. Because the component adhering to the wafer surface and the component adhering to the wafer surface due to the injection molded resin may differ depending on the same resin, it is better to evaluate the resin after injection molding This is because accurate data can be obtained because it is close to the actual use state.

  The semiconductor wafer to be held is preferably the same as that stored in the semiconductor wafer storage container using the semiconductor wafer storage container material to be evaluated. When evaluating a silicon wafer storage container material as the semiconductor wafer storage container material, it is preferable to hold the same silicon wafer.

  One of the prepared evaluation containers, after the cleaned semiconductor wafer is held in the semiconductor wafer holding portion, another same evaluation container is overlaid from the upper part of the semiconductor wafer, so that the inside of the evaluation container is Holding the semiconductor wafer.

  In this way, by holding the semiconductor wafer in the evaluation container for 6 hours or more, the volatile component of the resin constituting the evaluation container is sufficiently volatilized in the evaluation container, and the wafer surface Can be expected to adhere to. It is more preferable to hold for 3 days or more, and if it is within 10 days, the time and cost are small, and more preferable.

Thereafter, the semiconductor wafer is taken out and analyzed for components adhering to the surface to determine whether or not the resin is suitable for the semiconductor wafer storage container material.
Analysis of components adhering to the surface of the semiconductor wafer is preferable because it can be performed with high accuracy by gas chromatography or gas chromatography mass spectrometry, so that the evaluation resin to be analyzed is suitable as a material for a semiconductor wafer storage container. It is possible to accurately determine whether or not. In particular, it is more preferable to evaluate by a thermal desorption gas chromatograph mass spectrometry (TD-GC-MS) apparatus that measures the gas component generated by applying heat by mass spectrometry. And the difference in adhesion amount can be understood, and the characteristics of the influence on the semiconductor wafer can be grasped for each type of resin. It should be noted that other techniques such as ion chromatography may be used as long as they can analyze components adhering to the surface of the semiconductor wafer.

  By the method of the present invention as described above, it is determined which resin is caused by the component adhering to the semiconductor wafer surface when storing in a resin-made semiconductor wafer storage container in which a plurality of parts of different materials are assembled. In addition, by conducting the analysis of the present invention on a plurality of resins under the same conditions and comparing the results, it is expected to make a significant contribution to the development of high-quality semiconductor wafer storage containers, especially the selection of their materials. it can.

  In addition, the resin used as the material for the semiconductor wafer storage container has been described so far. However, the evaluation method and the evaluation container of the present invention are not limited to this, and the resin material used for handling the semiconductor wafer. Applicable to evaluation. For example, all the resin materials used in the clean room in the wafer manufacturing process, such as jigs such as boats for placing wafers, members for holding wafers such as robots for handling wafers, etc. Applicable for evaluation. That is, an evaluation container made only of the resin to be evaluated may be manufactured, a semiconductor wafer may be held in the container, and the surface adhesion component may be analyzed.

Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.
(Example)
Three types of polypropylene (PP-A, PP-B, PP-C) were prepared as resins to be evaluated. PP-A is a polypropylene that is currently used as a material for semiconductor wafer storage containers, PP-B is an improved polypropylene that has undergone a change in the formulation of PP-A additives, and PP-C , Polypropylene from another manufacturer.

  First, as shown in FIG. 2, each of the three types of polypropylene is made of only the polypropylene resin, and has a holding portion 2 for holding a semiconductor wafer at the top, and an inverted saddle shape with the bottom open. Four evaluation containers 1 were prepared by injection molding (each two sets (one set two), a total of six sets).

  The cleaned silicon wafers (2 sets each, 6 sets in total) are held for one week in each set of evaluation containers, and then the attached components on the silicon wafer surface are subjected to thermal desorption gas chromatograph mass spectrometry (TD- (GC-MS) apparatus. The GC spectrum is shown in FIG. The spectrum patterns of PP-A, PP-B, and PP-C (2 sets each) are shown from the top, and each one of each peak represents an organic species, and the peak intensity represents the amount of adhesion. In addition, although the silicon wafer surface was evaluated in advance with a heated desorption gas chromatograph mass spectrometer immediately after washing, no peak was detected at all in all silicon wafers.

First, by comparing these results with the spectrum pattern of an existing polypropylene container that is actually used by assembling multiple parts of different materials, the species of organic matter adhering to the silicon wafer caused by polypropylene is identified. I was able to.
Next, comparing the spectral patterns of PP-A, PP-B, and PP-C shown in FIG. 1, peaks appearing in current PP-A and PP-C made by another manufacturer (for example, arrows) In the improved PP-B, it can be seen that it does not appear or is very small.
From this, it could be judged that the improved PP-B is more suitable as a material for a silicon wafer storage container than the current PP-A or PP-C manufactured by another manufacturer.
In addition, A-1 and A-2, B-1 and B-2, and C-1 and C-2 respectively molded with the same resin of PP-A, PP-B, and PP-C have the same results. It was confirmed that this method is a reproducible method.

  As described above, according to the present invention, it is possible to determine which resin is caused by a component adhering to the semiconductor wafer surface when stored in a resin-made semiconductor wafer storage container in which a plurality of parts of different materials are assembled. The development of high-quality semiconductor wafer storage containers, especially data useful for material selection, was obtained.

  The present invention is not limited to the above embodiment. The above embodiment is merely an example, and the present invention has the same configuration as that of the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

It is the figure which showed GC spectrum when three types of polypropylene (PP-A, PP-B, PP-C, 2 sets each) are evaluated by the evaluation method of this invention. It is the schematic which showed an example of the container for evaluation of this invention, and its usage. (A) It is a schematic plan view of an example of the container for evaluation. (B) It is a schematic sectional drawing of an example of the container for evaluation. (C) It is a schematic sectional drawing which shows an example of the usage method of the container for evaluation. It is an example of the existing semiconductor wafer storage container. (A) It is a perspective view at the time of opening a container a little. (B) It is a perspective view at the time of opening a container and taking out a component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container for evaluation, 2 ... Holding part, 3 ... Side part of inverted saddle shape, 4 ... Ceiling part of inverted saddle shape,
10 ... Semiconductor wafer storage container, 11 ... Door, 12 ... Front retainer,
13 ... Body of insert part, 14 ... Gasket, 15 ... Body of body part,
W: Semiconductor wafer.

Claims (8)

  A method for evaluating a material used for a semiconductor wafer storage container made of a resin in which a plurality of parts having different materials are assembled, wherein one of the resins used as the material for the semiconductor wafer storage container is used, and the material is only from the resin. After producing a container for evaluation, the semiconductor wafer is held in the container for evaluation, and after a predetermined time has elapsed, the semiconductor wafer is taken out and analyzed for components adhering to the surface, whereby the resin becomes the semiconductor. A method for evaluating a semiconductor wafer storage container material, comprising: determining whether the material is suitable for a wafer storage container material.   The method for evaluating a semiconductor wafer storage container material according to claim 1, wherein a silicon wafer storage container material is evaluated as the semiconductor wafer storage container material.   The container for evaluation has a holding part for holding a semiconductor wafer in the upper part, and uses an inverted bowl shape with the lower part opened, and after holding the semiconductor wafer in the holding part, from the upper part of the semiconductor wafer 3. The semiconductor wafer storage container material according to claim 1, wherein the semiconductor wafer is held in the evaluation container by superimposing another evaluation container having the same shape. 4. Evaluation method.   The material for a semiconductor wafer storage container according to any one of claims 1 to 3, wherein the component adhering to the surface of the semiconductor wafer is analyzed by gas chromatography, gas chromatography mass spectrometry, or ion chromatography. Evaluation method.   The method for evaluating a material for a semiconductor wafer storage container according to any one of claims 1 to 4, wherein a predetermined time for holding the semiconductor wafer in the evaluation container is 6 hours or more. .   An evaluation container for evaluating a resin used as a material for a semiconductor wafer storage container, the material is made of only the resin to be evaluated, has a holding part for holding a semiconductor wafer at the upper part, and the lower part is opened. After holding the semiconductor wafer in the holding portion, by overlapping another evaluation container of the same shape from the top of the semiconductor wafer, the evaluation container An evaluation container characterized by holding a semiconductor wafer.   A method for evaluating a resin material used for handling a semiconductor wafer, wherein one of the resin materials is used, and an evaluation container made of only the resin is manufactured, and then the semiconductor wafer is placed in the evaluation container. After a predetermined time has passed and the semiconductor wafer is taken out, it is determined whether or not the resin is suitable for the resin material used for handling the semiconductor wafer by analyzing the components adhering to the surface. Evaluation method of resin material.   An evaluation container for evaluating a resin material used for handling a semiconductor wafer, wherein the material is made of only the resin to be evaluated, and has a holding portion for holding the semiconductor wafer in the upper portion and the lower portion is opened. After the semiconductor wafer is held in the holding portion, the semiconductor wafer is placed in the evaluation container by superimposing another evaluation container having the same shape from the upper part of the semiconductor wafer. The container for evaluation characterized by holding.

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