TWI220289B - Wafer clamping apparatus for wet etching - Google Patents

Abstract

The present invention discloses a wafer clamping apparatus for wet etching, comprising: a substrate (10), providing an outer slot (12) with a reversed Omega section; an inner slot (11) with a reversed Omega section; an outer sealing O-ring (13); an inner sealing O-ring (14); an upper cover (20) which is in annular shape, providing an upper slot (21) with reversed Omega section; an upper sealing O-ring (22) opposite to said inner sealing O-ring on said substrate seats on said upper slot and can contact with the rim of the back side of a wafer; a probe (45) contacted with the center of a wafer applies bias to a wafer and also to be an electrode of a monitor capacitor; a metal plate cavity seats on the center of said substrate opposite to the wafer for receiving said metal plate to form another electrode of said monitor capacitor; a monitor unit including said probe and said metal plate on said substrate are connected to a monitor by conducting wire (42); a plurality of fixing unit is used to fix said upper cover to said substrate.

Description

1220289 V. Description of the invention (1) 1 · Technical field to which the invention belongs Crystal protector. The present invention relates to a wafer etch misalignment round front surface component and an etching jig on the back surface, especially a kind of wafer holding and holding wafer. 2. The prior art is because semiconductor technology is applied to the detector (sens 〇r ) Or other micro-machining, micro-electromechanical system (micro-mechanical system) manufacturing has many advantages, such as small size, can be manufactured in large quantities, inexpensive, suitable for small space applications, especially in medicine It can save test samples, such as the amount of blood, etc. There are many steps in the manufacture of such microsystems, which require etching to remove most of the silicon substrate, and hope to obtain a fast and uniform time etch, wet engraving is exactly required. In order to protect one side of the wafer and etch the other side, wax or photoresist film is often used to protect one side, and then the wafer is immersed in an etching solution for etching. However, it is not easy to remove when wax is used, it is easy to contaminate the wafer, and the protection is not sure; using a photoresist film to ensure that δ 蒦 cannot block the etching solution corrosion for a long time. Therefore, there is a demand that the wafer can be clamped on a jig with a kind of jig, and then immersed in the engraving solution for #etching. One side of the wafer can be protected by the jig and the other side can be etched. At present, there are many 'tools for holding wafers for etching, such as 1220289 V. Description of the invention (2) Placing the wafer in a body only exposes the wafer to be etched and fixed' and components. However, conventionally, it is sealed, using the after-treatment solution ', and the product yield is clamped. The result is even worse. In addition, between the 0-rings, the available area of the famous wafers, on the other hand, is biased to the wafers by defects on the wafers, but in addition, the traditional need to connect the wires to the windings, which hinders the operation of the prior technology, which cannot block the etching. LCD round area. therefore

The periphery is provided with a 0-ring or a box-engraved surface with a vacuum extraction device. It is expected that 0-ring or vacuum suction will simultaneously prevent the etching solution from invading and damage the front side of the wafer. After a period of time, a single q-shaped ring will still leak from the thread groove or the peripheral edge of the wafer. The higher holding stress is likely to cause the wafer to crack. Therefore, the vacuum suction method is used to find the sealing effect of the traditional tool when holding the wafer. Because the probe is placed inside and outside t, it needs to occupy an edge width of at least 7mm to 10mm, which greatly reduces. With traditional clamping tools, it is necessary to wait for the etching to be completed before discovering that the wafer is not properly clamped and fails to be etched for 1 minute after the etching is completed. It is often too late to find out. After the biasing wire of the clamping tool is led to the upper end of the grip, the power supply is easy to use when the mechanical arm moves the clamping tool. It is not suitable for automated operation. f Wet etching using a jig to hold the wafer, but still damage the components, reduce the yield, and waste. A wafer etching jig can actually prevent

Page 8 1220289 V. Description of the invention (3)-Etching solution leaks during wet etching, reduces waste of wafer surface area, and timely detects whether the wafer is fixed properly, and makes sure that the wafer is actually connected when biased to the wafer. And no wires are exposed, suitable for automated operation. 3. Summary of the Invention The main purpose of the present month is to provide a wafer etching that can be used to fix a circle. It can be obtained from a gate, and it can be used to etch the back of the wafer.

The bread is ancient; the component can be protected when there is a component from the WU Tiantian WU. Another object of the present invention is to increase the available area of the wafer etching misalignment fixture, which is not easy. Pinch.

The invention can detect contact in time. Another purpose is to provide a wafer etching clamping fixture, whether the wafer is properly fixed, and the bias voltage is applied to the wafer. The actual test table is immersed in the fixture, and a wafer name clip is provided. Holding fixture

Circle, do n’t need another ’when the bias is automatically turned on and the bias is

The use of a separate wire is convenient for automated operation. U includes a description of the base, the wafer etching holding fixture of the present invention mainly includes a cover, a probe, a metal sheet slot, 1 m ^ several fixed orders 亓 — — Sheet metal and complex. The base has an annular groove with an inverted Ω-shaped cross section,

----- Page 9 1220289 V. Description of the invention (4) An inner seal ring is embedded in contact with the Ω-shaped cross section; the upper cover is one of the upper circular section of the cross section at the center of the upper ring groove circle; A metal sheet is connected with a probe lead of the base to a base between the metal sheet and the upper cover. The front and back surfaces are immersed in contact pads, and the bottom piece is passed through. A ring-shaped groove is provided in the inner pair of corresponding grooves, which can be contacted with the upper density. The groove is located in the monitoring electrode and a gold monitor to form a capacitor so that the inner periphery of the inner density is tightly inserted into the groove of the groove. The wafer on the back of the ring base that is embedded in the sealing ring, the center surface is an electrode, the probe needle can be fixed to the upper dense handle, and the liquid level is from the outer tight ring groove base. The sealing ring and the wafer are biased to another wafer contained in the wafer, enabling the probe. A plurality of sealing rings and contacts; when exposed, the grooves are provided in the crystal and the peripheral edge of the inner seal is also used as a monitor. In contrast, the wafer and the wafer unit are monitored and the sealing ring is divided into the bottom and the probe. The outer side of the outer-circle-shaped circle has a ring opposite to each other; the unit package on the base of the detection capacitor is connected to a sub-surface used to fix the power supply groove that is out of one of the seat; the periphery is inverted Ω, and the pin and the The electrode of the crystal is to include a portion provided on the bottom wafer through contact, and the lead connection contact base can also have a wafer slot, which is used to accommodate the wafer. The following preferred explanation is disclosed. Figure 丨 A daily example of the smoke and its related diagrams, can be shown as follows: Λ: Λ The appearance of the holding fixture engraved with the wafer surname. See the clothes-like upper plate 20 exposed on the upper cover 2. Central and concentric

Page 10 1220289 V. Description of the invention (5) Part of the base 10 and a plurality of fixed single openings, the figure shown in the figure of the cicada set on the upper cover 20 and the base = the fixed unit is a circle etch The decomposing two-spiral of Shuangzhi fixture = 1 The third picture shows that the crystal of the present invention has-oblique ... to reduce the dead angle or; The upper screw hole 24 on the side is tightly screwed with the screw hole 18 below the base 10. The monitoring unit passes through this embodiment of the upper plate 20 and has a monitoring unit. ). The wire 42 is connected to the contact pad 43 on the front side of the upper side of (19) for connection to (not shown in the figure). The probe 45 can contact the core of the wafer. ^ = Metal 4 to form a capacitor. This design can not only be detected Probe 45 disk metal sheet jl and crystal 60, whether the capacitance formed by the chip 60 is greater than a fixed value and timely detect whether the wafer 60 is properly fixed, and then connect the conductive pad 44 to the contact pad 46 on the top and bottom of the handle to make the etching groove The power contact pad 502 (see Figure 5) provides a stable voltage to the module from the voltage source, so that the back surface 62 of the wafer 60 does provide a constant voltage to the wafer during the etching process. The bias voltage during etching (but the etching can be performed without bias voltage) to obtain a uniform etching surface. The ring-shaped metal piece 4 in this embodiment is fixed in the center of the base 10 with a screw member 3 2 and has a The spring probe 45 is located in the center of the metal sheet 41. The wire 42 can be accommodated in the base 10 The inside of the arm 50 is shown by the dashed line in Fig. 1. This design of placing the monitoring unit in the center of the wafer can avoid the waste of the surface area around the wafer ', and make the electric field evenly distributed around the wafer when the bias voltage is applied. Carved uniformity.

Page 11 l22〇289 V. Description of the invention (6) A — ^ Figure 2 shows the wafer etching clamping fixture of the present invention, and the f block 10 is produced. The base 10 is provided with a concentric circular outer seal, 1 4 'This embodiment is shown in Figures 3 and 4 of the seal ring eight = the inner ring 10 and the upper cover 20 are tightly sealed 6 The peripheral edges of the front surface 61 and the back surface 62 are tightly in contact with the upper cover 20 when the seal 13 is broken. In addition, the outer seal 2 ring 14 and the upper seal ring 22 are respectively embedded in the Q-shaped section «p, the inner ring groove 12 and the upper ring groove 2 丨, and the reduced seal rings 1 3, 1 4, 2 2 is not easy to fall off. As shown in FIG. 2 and FIG. 3 of this embodiment, in order to avoid damaging the components of 61 and accommodating the metal sheet 41, the base 10 forms a wafer $ chip slot 16. The shape of the wafer slot 15 can fix the wafer 60 depending on the wafer size and external needs. The probe holes 17 are provided in the metal sheet grooves so that the probe 45 can be extended to contact the wafer 60. The configuration of the sealing ring in the above embodiment can also be changed to the upper inner sealing ring and an outer sealing ring, and only a sealing ring corresponding to the upper ring at the base 10 is set; that is, the sealing ring is inserted into the above embodiment 1 3 Changed to the upper cover 2 0. There is no material used for the wafer etching clamping jig of the present invention-generally the material is resistant to corrosion and will not be damaged in the etchant. In addition, the material of the sealing ring 1 3, 1, 4, 2 2 must have an appropriate I 2 Seen after 0, 1 3, and 22 of the inner seal cross-section are corresponding and in contact, while the outer ring 13, the inner ring surface and the outer ring-shaped slot make the embedding and the front surface groove of the wafer 15 and a gold edge, but 1 6 In the center, cover 2 0 is set inside a cover 20 outside the dense base 1 0

Special restrictions, such as PTfe. Flexibility

1220289 V. Description of the invention (7) The upper cover 20 and the base 10 can be tightly pressed. According to the present invention, the two sealing rings 1 q of the base 10 and the clothes 丄 d 丄 4 not only have the effect of ϋ lacquer lacquer, but because there is no monitoring between the inner and outer sealing rings, the single open sand bit NR is flat, so a circle β η can be reduced.

The width of the masked edge can range from more than 10mm to 1M W bU to 3mm. In addition, because the upper seal ring (22, | allow ~ / mm, even τ ^^ 2) and the inner seal ring (1 4) are oppositely disposed, the clamping stress is reduced, and the sealing effect is increased. ^ Double fruit reduces the chance of wafer cracking and increases process yield. A preferred embodiment of the present invention is to provide a method for etching and clamping, and a method for immersing the clamping fixture into the remaining groove. Please refer to FIG. 5. A plurality of power sources 5 are provided on the etching ~ groove 5 01. 0 2. When the misplacement fixture is positioned, the contact pad 4 5 ′ on the holding fixture is automatically in contact with the contact pad 5 0 2 on the etching tank, and the bias power 5 5 5 is automatically connected to the crystal. On the circle, it can be used for multiple moments of dislocation fixtures. At the same time, because no wires are exposed, when the robotic arm moves the grip fixtures, it will not be entangled with wires, and it is easy to carry and facilitates automatic operation. During etching, the wafer on the base is placed in the etching solution, which is below the liquid surface of 503, and the handle is exposed above the liquid surface of 503. Another / preferred embodiment of the present invention is to provide a dual-wafer rest holding fixture. As shown in FIG. 6, the same outer ring grooves 1 2, 1 2, and inner ring grooves 1 1, 11 ', and outer seals are provided on the upper side of the base and the lower side opposite to the upper side. The ring 1 4, 1 4 ', the inner sealing ring 1 3, 1 3', and the wafer slot 2 and 21 ', and are provided with > top covers 20, 20', two probes 45, 45 'each with a crystal

Page 13 1220289 V. Description of the invention (8) The center point of the circle is in contact to bias the wafer, and it is also used as one of the electrodes of the monitoring capacitor. The two metal plate slots 16, 16 'are located opposite the central surface of the wafer. On the base, another electrode of the monitoring capacitor is formed by accommodating a metal sheet 4b 4 Γ; two monitoring units. Hold two wafers at the same time for etching; to increase throughput. The above-mentioned embodiments are merely preferred embodiments of the present invention, and other devices derived from the spirit of the present invention and the scope of patent application shall also fall within the scope of the present invention.

Claims (1)

1220289 VI. Application Patent Scope 1. A wafer etching clamping fixture for fixing a wafer to facilitate etching on the back surface of the wafer, and the front surface of the wafer may include components; the wafer etching clamping fixture The at least includes: a base, an outer ring groove with an inverted Ω-shaped cross section, an inner ring groove with an inverted Ω cross section, and an outer seal ring embedded in the outer ring groove; an inner seal ring embedded In the inner ring groove and can be in contact with the peripheral edge of the front surface of the wafer; a wafer slot to accommodate the wafer; an upper cover, a pair of rings corresponding to the periphery of the base, with an inverted Ω-shaped upper ring A groove, an upper sealing ring is opposite to the inner sealing ring of the base, is embedded in the upper ring groove and can be in contact with the peripheral edge of the back of the wafer; a probe is in contact with the center point of the wafer for biasing On the wafer, it is also used as one of the electrodes of the monitoring capacitor. A metal plate slot is located on the base opposite to the central surface of the wafer to accommodate a metal plate to form another electrode of the monitoring capacitor. A monitoring unit includes A probe of the base and a metal sheet, the probe And the metal sheet is respectively connected to a monitor via a wire, so that the probe can contact the surface of the wafer to form a capacitance with the metal sheet; a plurality of fixing units for fixing the base and the upper cover, The inner sealing ring and the upper sealing ring are brought into close contact with the peripheral edges of the front surface and the back surface of the wafer, respectively; a grip is a part of the base, and the liquid surface is exposed when the holding fixture is dipped into the #notch groove, and the probe The lead-out wire is connected to the contact pad, and when the handle is placed on the etching tank, it is automatically contacted with the bias power source for conduction. Page 16 1220289 VI. Application for Patent Scope 2. If the wafer etch holder of item “Scope of patent application” is in item ", the fixing unit in the bean is a plurality of screws, and the base and the upper cover α 鹿 are provided with A plurality of lower screw holes and upper screw holes can be screwed with the screw member. ° ν 3 3. If the wafer etching loss basin of the patent application No. 丨, the base has a wafer slot for accommodating the components of the wafer; 18-4. The wafer is etched and clamped, and wherein the base has a probe hole for accommodating the probe. " VIII. 5 · If the wafer etching clip of item 丨 of the patent application scope ▲ Πί seat has a connection line through hole for receiving the probe and :: belongs to the piece, 6 · If the patent application scope of item 丨The wafer is etched and clamped. In addition, the probe and the wire of the metal sheet form an electrode connection base to connect a ς to measure whether the probe is in contact with the wafer. The probe can be connected to one to provide bias. The wafer is biased as a bias during etching. ιhazard 7: If the wafer is etched and clamped in the first range of the patent application, the outer ring groove and the outer sealing ring of the inverted Ω-shaped cross section in the bean may be provided on the upper cover 8 ', 8 kinds of wafers Etching clamping jig for fixing a wafer so that the back surface of the wafer can be engraved. # The front surface of the wafer may include components; Page 17 1220289 6. Scope of patent application-The wafer etching clamping jig includes at least:-the bottom side has an inverted Ω-shaped cross section, an inner ring-shaped groove and an outer seal ring. Set in the groove of the outer ring ": The sealing ring is embedded in the inner ring groove and can be 'peripheral to the wafer' with a wafer groove 'u to accommodate a round groove; opposite to the upper side, the lower side Also, the same outer ring groove, inner ring groove 'outer seal ring, inner seal ring and wafer groove are provided on the upper side; Two upper covers are a pair of rings that should be around the periphery of the base. They have an upper groove with an inverted cross section, and an upper seal ring is opposite to the inner seal ring of the base and is embedded in the upper ring groove. It is in contact with the peripheral edge of the back of the wafer; each top cover is fixedly connected to the upper and lower sides of the base to seal two wafers; two probes are in contact with the center point of each wafer to bias the wafer 'Also used as one of the electrodes of the monitoring capacitor; two metal plate slots located on the base opposite to the central surface of the wafer' to accommodate the metal plate to form another electrode of the monitoring capacitor; The two monitoring units include a probe and a metal piece provided on the base. The probe and the metal piece are connected to a standby controller through a wire, respectively, so that the probe can contact the surface of the wafer and A capacitor 'plurality 1 fixed connection unit' is formed between the metal pieces for fixing the base and the upper cover, so that the inner seal ring and the upper seal ring are in tight contact with the front and back peripheral edges of the wafer, respectively; A handle is a part of the base. The liquid surface is exposed when the holding fixture is immersed in the money engraving slot. The two wires drawn from the probe are connected to the two contact pads. Contact is on. Page 18 · 1220289 —___ VI. Patent Application Scope 9. If the wafer etch and clamping of item 8 of the patent application scope is applied, the fixing unit in A is a plurality of screws', and the base and the peripheral edge of the upper cover correspond. A plurality of lower screw holes and upper screw holes are provided for screwing with the screw member. ^ 10. If the wafer is etched and clamped according to item 8 of the scope of the patent application, the base has a wafer slot for receiving components of the wafer. ', 11. If the wafer in the patent application No. 8 is used for treatment, the base has a probe hole in which the probe is accommodated. 8 /, 1 2. If the last name of the wafer in item 8 of the patent application is inconsistent, the base has a through-hole for receiving the probe and the metal wire. 13. If the wafer name of the patent application item No. 8 is absent, the needle and the wire of the metal sheet form an electrode connection ... Test whether the probe is in contact with the wafer. The circle serves as a bias during etching. Connected to an electric power source 14. If the inverted Ω-shaped wearing surface is inscribed in the patent application No. 8 and the last name is engraved with the holding fixture, its top can be set on the cover. Page 19