JPH04107948A - Semiconductor chip jig - Google Patents

Abstract

PURPOSE:To make inspection easy by constituting an apparatus in such manner that the apparatus is composed of a jig body having a part-mounting hole, a thin plate formed from a transparent material and a holding member for holding the thin plate and the lower part of the jig body comes into contact with the thin plate and the holding member is fitted to hold the thin plate in the jig body. CONSTITUTION:A semiconductor chip jig is composed of a body 1, thin plate 2 and stopper 3. The principal plane of the body 1 is provided with holes 4 for mounting semiconductor chips being a plurality of parts and respective holes 4 are divided by partitions 5. A part constituting a frame is formed on the surface on the side opposite to that of the surface where the holes 4 are formed, and the thin plate 2 being a transparent material composed of quartz, glass or plastic is fitted in that part. A stopper 3 forming the holding member of this thin plate 2 is further mounted under the thin plate 2. The stopper 3 is formed in the manner of corresponding to the part being to form the frame and holds the thin plate 2 by elastic force when it is fitted. Thus, even after the semiconductor chips have been mounted on the jig, the occurrence of a crack, breaking, etc., can be inspected from the rear surface of the semiconductor chip jig.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a jig used for manufacturing and shipping semiconductor devices, and particularly to a technique that is effective when applied to a jig for mounting a semiconductor chip.

[Prior Art 1] Generally, in the manufacture of semiconductor devices, semiconductor chips are sometimes temporarily mounted on a jig for verent bonding. Further, as a manufacturing and shipping form, semiconductor chips may be mounted on a jig and shipped as they are.

Colored jigs made of hakelite or the like are generally used for such items.

Unexamined Japanese Patent Publication No. 58-1 showing a jig for semiconductor devices
There is No. 11339.

[Problem to be solved by the invention]

However, since the jig for semiconductor chips as described above is colored, it is difficult to detect cracks or chips when a semiconductor chip is mounted on the semiconductor chip. In addition, if there are cracks or chips as mentioned above, the semiconductor chip mounted in the jig is often misaligned, so visually observe the mounted state.
There is also a method of selecting items that are in a different state from the surrounding items and checking the back side, but this does not guarantee that cracks or chips will be found. In addition, if a jig has many semiconductor chips with cracks or chips, it is likely that there are many undetected cracks or chips, so taking out all the chips and inspecting them is a good method. It will need to be reloaded onto the tool, at which point it may crack and chip again. Therefore, with the current jigs, it is impossible to find and reliably eliminate completely cracked or chipped semiconductor chips.

SUMMARY OF THE INVENTION An object of the present invention is to provide a jig for a semiconductor chip device that allows inspection of cracks and chips in a semiconductor chip without removing the chip from the jig.

[Means to solve the problem]

Representative means of the invention disclosed in this application will be described below.

That is, it consists of a jig main body having a hole for mounting components such as semiconductor chips, a lower plate made of a transparent material, and a holding member for holding the lower plate. This jig for semiconductor chips includes a holding member fitted to hold a lower plate in the jig main body. Further, in a jig for a semiconductor chip having a hole for mounting a component such as a semiconductor chip, the jig is a jig for a semiconductor chip formed of a transparent material.

[For use]

According to the above-mentioned means, since the semiconductor chip jig is formed using a transparent material, it is possible to inspect the semiconductor chip for cracks or chips without removing the semiconductor chip from the jig.

[Example 1] Fig. 1 is a front view showing the bottom surface of a semiconductor chip jig according to the first embodiment of the present invention, and Fig. 2 is an exploded view of the semiconductor chip jig shown in Fig. 1. FIG.

As shown in FIGS. 1 and 2, in this embodiment, the semiconductor chip jig consists of a main body 1, a lower plate 2, and a stopper 3.

The main surface of the main body 1 is provided with holes 4 for mounting semiconductor chips as a plurality of components, and each hole 4 is separated by a partition 5. A frame portion is formed in the direction opposite to the surface of the main body 10 in which the hole portion 4 is formed, into which a lower plate 2 made of a transparent material made of quartz, glass, or plastic is fitted. A stopper 3 serving as a holding member for fitting and holding the low plate 2 is further attached below the low plate 2. This stopper 3 is formed to correspond to the part that is to become the frame, and when fitted, holds the lower plate 2 by elastic force.

According to this embodiment, even after the semiconductor chip is mounted on the jig, it is possible to inspect the occurrence of cracks, chips, etc. from the back side of the jig for semiconductor chips. Further, according to this embodiment, since the jig can be disassembled, it is possible to easily remove dirt from the mounting portion of the semiconductor chip.

[Embodiment 2] FIG. 3 is an exploded side view showing a semiconductor chip jig according to a second embodiment of the present invention.

As shown in FIG. 3, in the present invention, the semiconductor chip jig includes a main body 6 having a plurality of semiconductor chip mounting holes 9 separated by partitions 8 as shown in the first embodiment, and a quartz or glass substrate. Alternatively, the lower plate member 7 may be formed from a transparent member made of plastic or the like.

- A lower plate member 7 is fitted into the lower part of the main body 6 to form a lower jig and is held by the main body 6 by being elastically deformed.

In this embodiment as well, as in the first embodiment, the jig can be disassembled, making it possible to easily remove dirt from the semiconductor chip mounting area.

[Embodiment 3] FIG. 4 is a side view showing a semiconductor chip jig according to a third embodiment of the present invention.

In this embodiment, the semiconductor chip jig 10 has a plurality of semiconductor chip mounting holes 12 formed on its main surface, and the bottomed out part 11 is also integrally molded of plastic.

According to this embodiment, since it can be manufactured by integral molding, the jig can be supplied at low cost.

[Embodiment 4] FIG. 5 is a diagram showing a semiconductor chip jig according to a fourth embodiment of the present invention. As shown in FIG. 5, in this embodiment, the jig body 11 is made of a transparent member and has a plurality of semiconductor chip mounting holes formed on its main surface, and a lid 14 that covers the top surface of the jig body 11. As for the jig main body 11, the same one as shown in the third embodiment can be used.

In this embodiment, the depth 1 of the lid part is set to 1=1/2 L relative to the depth L of the semiconductor chip mounting part of the jig main body, and each part is partitioned off by a partition 15.

According to this embodiment, not only can inspection be performed even after the semiconductor chip is mounted on the jig, but also the semiconductor chip can be covered with a lid after the semiconductor chip is mounted on the jig body, so that it is possible to inspect the semiconductor chip even when it is shipped in the semiconductor chip state. This has the advantage that it can be shipped as is.

In addition, when inspecting the back side of a semiconductor chip, it is possible to place the semiconductor chip on the lid, directly inspect the back side of the semiconductor chip, and then stack the lid on the jig body and mount it. can get.

〔Effect of the invention〕

The effects obtained by typical inventions disclosed in this application are as follows.

That is, even after a semiconductor chip is mounted on a jig for semiconductor chips, it is possible to inspect for cracks and chips without taking out the semiconductor chip from the jig.

Furthermore, since semiconductor chips are not unnecessarily taken out from the semiconductor chip jig, work efficiency is greatly improved.

Although the invention made by the present inventor has been described above based on the above-mentioned embodiments, it goes without saying that the present invention can be modified in various ways without departing from the gist thereof. For example, if the bottom part of the jig is made of a transparent material, the other parts may be colored, and the transparent material may be made of something other than quartz, glass, or plastic. .

[Brief explanation of the drawing]

FIG. 1 is a front view showing the bottom surface of the semiconductor chip jig according to the first embodiment of the present invention, FIG. 2 is an exploded side view of the semiconductor chip jig shown in FIG. FIG. 3 is an exploded side view showing a semiconductor chip jig according to a second embodiment of the present invention, and FIG. 4 is a side view showing a semiconductor chip jig according to a third embodiment of the present invention. , FIG. 5 is a diagram showing a semiconductor chip jig according to a fourth embodiment of the present invention. 1.6 Main body, 2 Bottom plate, 3 Stopper, 4°9.12 Hole, 7 Bottom plate member, 5, 8.13 Partition, 10 Semiconductor chip jig , 11・Bottom plate part, 14
... Lid No. 1, No. 2, Exit 221,

Claims (1)

[Claims] 1. Consisting of a jig main body having a hole for mounting parts, a lower plate made of a transparent material, and a holding member for holding the lower plate, the jig main body has a lower part attached to the lower plate. A jig for a semiconductor chip, comprising a holding member that is fitted into the jig main body so as to abut and hold the lower plate in the jig main body. 2. A semiconductor chip jig having a component mounting hole, characterized in that the jig is made of a transparent member. 3. The semiconductor device jig according to claims 1 and 2, wherein the transparent member is made of glass, quartz, or plastic.