KR940006182Y1 - Structure of plcc mold package - Google Patents

Structure of plcc mold package Download PDF

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Publication number
KR940006182Y1
KR940006182Y1 KR2019910010961U KR910010961U KR940006182Y1 KR 940006182 Y1 KR940006182 Y1 KR 940006182Y1 KR 2019910010961 U KR2019910010961 U KR 2019910010961U KR 910010961 U KR910010961 U KR 910010961U KR 940006182 Y1 KR940006182 Y1 KR 940006182Y1
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KR
South Korea
Prior art keywords
plcc
mold
tray
mold package
protrusions
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KR2019910010961U
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Korean (ko)
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KR930003594U (en
Inventor
노용수
Original Assignee
금성일렉트론 주식회사
문정환
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Priority to KR2019910010961U priority Critical patent/KR940006182Y1/en
Publication of KR930003594U publication Critical patent/KR930003594U/en
Application granted granted Critical
Publication of KR940006182Y1 publication Critical patent/KR940006182Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음.No content.

Description

PLCC의 몰드패키지 구조Mold package structure of PLCC

제1도는 본고안의 일실시예를 나타낸 PLCC의 사시도.1 is a perspective view of a PLCC showing an embodiment of the present invention.

제2도는 제1도의 PLCC가 트레이에 담겨진 상태로 도시한 단면도.2 is a cross-sectional view showing the PLCC of FIG. 1 contained in a tray.

제3a, b도는 본고안의 다른 실시예를 나타낸 PLCC의 사시도.3A and 3B are perspective views of a PLCC showing another embodiment of the present invention.

제4도는 종래의 PLCC가 튜브내에 담겨진 상태로 도시한 단면도.4 is a cross-sectional view showing a conventional PLCC contained in a tube.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 몰드 3, 4 : 돌출부1: mold 3, 4: protrusion

5 : 홈부5 groove

본고안은 PLCC의 패키지 구조에 관한 것으로, 좀더 구체적으로는 반도체 제조공정중 개별 성형이후의 공정에서 기존튜브(Tube)의 사용을 배제하고 QEP(Quart Flat Package)에서 사용하는 트레이(Tray)를 PLCC에 적용할 수 있게 하며, PCB 실장시 패키지 저면과 보드(Board)사이 접착제의 접착력을 향상시킬 수 있게 한것이다.This paper is about the package structure of PLCC. More specifically, PLCC is a tray used in QEP (Quart Flat Package) without the use of existing tube in the process after individual molding in semiconductor manufacturing process. It can be applied to the PCB and improves the adhesive force between the bottom of the package and the board when mounting the PCB.

종래에 일반적으로 사용되어온 PLCC는 제4도에 도시한 바와 같은 몰드(Mode)(1)의 저면이 평평한 형상으로 되어 있으며, 상기한 종래의 PLCC는 개별 성형이후 튜브(7)에 담아서 핸드링(Handling)하게 되고 사용자에게 갈때까지 튜브에 담겨진 상태로 운반, 이송된다.PLCC, which has been generally used in the prior art, has a flat shape at the bottom of the mold (Mode) 1 as shown in FIG. 4, and the conventional PLCC is handled by handling the tube 7 after individual molding. It is transported and transported in a tube until it reaches the user.

따라서 운반이나 이송도중 서로 인접한 리드(2)끼리 서로 부딪쳐 리드휨등의 불량이 발생하기 쉽고 튜브(7)의 끝부분에 앤드 플러그(End Plug)(도시는 생략함)를 결합하여야 하기 때문에 공정 자동화에 제약요인이 됨은 물론 실장 및 테스트가 불가능하다.Therefore, it is easy to cause defects such as lead bending due to mutual collision between the leads 2 adjacent to each other during transportation or conveyance, and an end plug (not shown) must be coupled to the end of the tube 7 to automate the process. In addition to being a constraint, the implementation and testing are impossible.

또한 PLCC의 모든 검사와 실장시 QFP와 공용이 되지 않으므로 핸들러의 교체가 필요하며, 튜브의 형태가 다양하며 공장 표준화가 어려운 문제도 있다.In addition, all inspection and mounting of the PLCC is not shared with the QFP, so the handler needs to be replaced. There are also problems with various tube shapes and factory standardization.

본고안은 PLCC의 몰드 저면에 요철형상을 형성하고 트레이에 이와 대응하는 형상을 형성하는 수단에 의해 QFP용 트레이를 PLCC에 공용으로 사용할 수 있도록 한것인바, 본고안의 일실시예를 첨부된 도면 제1도 내지 제3도에 의해 상세하게 설명하면 다음과 같다.The present proposal allows the QFP tray to be commonly used in the PLCC by means of forming an uneven shape on the mold bottom of the PLCC and a corresponding shape on the tray. The detailed description with reference to FIGS. 1 to 3 is as follows.

첨부도면 제1도는 본고안의 일실시예를 나타낸 사시도로서, PLCC는 몰드(1)와 리드(2)로 구성되어 있으며, 몰드(1)의 저면에는 사각형상의 내측 돌출부(3)와 외측 돌출부(4)가 형성되어 있고, 내, 외측 돌출부 사이에 홈부(5)가 형성되어 있다.1 is a perspective view showing an embodiment of the present invention, the PLCC is composed of a mold (1) and a lead (2), the bottom of the mold (1) of the rectangular inner protrusions 3 and the outer protrusions (4) Is formed, and the groove part 5 is formed between inner and outer protrusion parts.

제2도는 본고안의 구조로 된 PLCC가 트레이(6)에 담겨진 상태로 도시한 단면도로서, 트레이(6)에는 몰드(1)에 형성된 돌출부(3)와 홈부(5)에 형합될 수 있는 형상의 돌출부와 홈부가 형성되어 있다.2 is a cross-sectional view showing the PLCC having the structure of the present invention contained in the tray 6, the tray 6 of the shape that can be joined to the protrusions 3 and the grooves 5 formed in the mold (1) Protrusions and grooves are formed.

즉, 몰드(1)의 돌출부와 대응하는 위치에는 홈부가 형성되고 몰드(1)의 홈부(5)와 대응하는 위치에서 돌출부가 형성되어 있다.That is, a groove is formed at a position corresponding to the protrusion of the mold 1 and a protrusion is formed at a position corresponding to the groove 5 of the mold 1.

따라서 제2도와 같이 트레이(6)에 PLCC를 얹어 결합하면 리드(2)가 트레이(6)의 바닥면에 닿지 않고 PLCC가 전, 후, 좌, 우 방향으로 이동하지 않게 된다.Therefore, as shown in FIG. 2, when the PLCC is mounted on the tray 6, the lid 2 does not touch the bottom surface of the tray 6, and the PLCC does not move forward, backward, left and right.

제3도는 본고안의 다른 실시예를 나타낸 사시도로서, 3a도는 몰드(1)에 하나의 돌출부(3)가 형성되어 있고, 3b도는 몰드(1)의 저면에 동심원상으로 된 두개의 돌출부(3)(4)가 형성되어 있다.3 is a perspective view showing another embodiment of the present invention, in which FIG. 3a shows one protrusion 3 formed on the mold 1, and FIG. 3b shows two protrusions 3 concentrically formed on the bottom of the mold 1. (4) is formed.

제3도 실시예에 적용되는 트레이는 각 돌기부와 홈부에 형합될 수 있는 형상의 돌기부와 홈부를 가져야 한다.The tray applied to the third embodiment should have protrusions and grooves of a shape that can be mated to each of the protrusions and the grooves.

이상에서와 같이 본고안은 PLCC의 패키지 구조를 개선하여 트레이에 넣을수 있게 함으로서 리드를 안전하게 보호할 수 있고, 튜브 사용시와 같이 앤드플러그를 끼우거나 빼낼 필요가 없어져 공정의 자동화가 가능해짐은 물론 트레이에 넣은 상태로 실장 및 테스트가 가능해진다.As described above, this paper improves the PLCC package structure so that it can be placed in a tray, and thus leads can be safely protected, and the process can be automated as well as the need for inserting and removing end plugs as in the case of using a tube. It can be mounted and tested.

또한, PCB에 실장시 솔더(Solder)를 하기전에 접착제를 사용하여 자재를 보드에 접착한 후 솔더를 하게 되는데 이때 자재와 보드와의 접착력을 증대시킬 수 있게 되며, 모든 검사나 테스트 또는 실장시 트레이와의 외곽치수만 같게하면 패키지의 크기나 핀수에 따라 핸들러를 교체할 필요가 없게 되므로 공장 표준화가 가능해지는등의 효과가 있다.In addition, when soldering to PCB, the adhesive is used to attach the material to the board before soldering. At this time, the adhesive force between the material and the board can be increased. If only the outer dimensions of the and the same, there is no need to replace the handler depending on the size of the package or the number of pins, there is an effect such as factory standardization is possible.

Claims (3)

몰드(1)의 저면에 트레이와의 결합을 위한 돌출부와 홈을 형성하여서 됨을 특징으로 하는 PLCC의 몰드 패키지 구조.Mold package structure of the PLCC, characterized in that to form a protrusion and a groove for coupling with the tray on the bottom of the mold (1). 제1항에 있어서, 요철형상의 하나의 돌출부(3)로된 PLCC의 몰드패키지 구조.The mold package structure according to claim 1, wherein the PLCC has one protrusion (3) of irregularities. 제1항에 있어서, 요철형상의 복수개의 돌출부(3)(4)와 홈부(5)로 된 PLCC의 몰드패키지 구조.2. The mold package structure according to claim 1, wherein the plurality of protrusions (3) and grooves (5) of the concave-convex shape are formed.
KR2019910010961U 1991-07-15 1991-07-15 Structure of plcc mold package KR940006182Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910010961U KR940006182Y1 (en) 1991-07-15 1991-07-15 Structure of plcc mold package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910010961U KR940006182Y1 (en) 1991-07-15 1991-07-15 Structure of plcc mold package

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KR930003594U KR930003594U (en) 1993-02-26
KR940006182Y1 true KR940006182Y1 (en) 1994-09-10

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