JP2006297929A - Case for electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a case for an electronic device which can exhibit comprehensively excellent property by improving the adhesiveness between a metal layer and a fiber reinforced resin layer when the case for an electronic device is composed of a metal and a fiber reinforced resin. <P>SOLUTION: The case for an electronics device comprises a metal/fiber reinforced resin composite material which is unified by gluing the metal layer to the fiber reinforced resin layer through an intermediate resin layer, wherein the intermediate resin layer includes particles of a thermoplastic resin having an average particle diameter of 3-10 μm and an imidazole silane compound. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic device casing made of a metal / fiber reinforced resin composite material, and more particularly to an electronic device casing that can improve the adhesiveness between a metal layer and a fiber reinforced resin layer and can reliably exhibit target characteristics. About the body.

As the spread of electronic devices, especially portable electronic devices such as notebook computers, mobile phones, and portable information terminals, is promoted, thin and lightweight products are strongly demanded in the market. Along with this, there is a strong demand for an electronic device casing that constitutes a product to be thin and lightweight, and to satisfy high rigidity from the viewpoint of protecting internal electronic components. In addition, with the development of the IT industry, a wide variety of electronic devices have overflowed around us, and malfunctions of electronic devices caused by electromagnetic noise have become a serious problem. Is emphasized.

  Here, a composite material in which a metal (for example, a titanium alloy or an aluminum alloy) and a fiber reinforced resin are laminated and bonded together is an excellent impact resistance, conductivity, electromagnetic wave shielding property, etc. possessed by the metal, and a fiber reinforced resin. Is known as a material capable of exhibiting both excellent light weight and high mechanical properties.

  However, a metal / fiber reinforced resin composite material formed by simply laminating and bonding a metal layer and a fiber reinforced resin layer may cause delamination between the metal layer and the fiber reinforced resin layer. When used as a body, it is expected to cause damage in repeated opening / closing operations of electronic devices, usage environments such as dropping and collision, and portable environments. In particular, when the metal layer is made of a difficult-to-adhere metal such as a titanium alloy, delamination may occur frequently.

In order to improve the adhesion when the metal layer and the fiber reinforced resin layer are bonded and integrated, a method of performing a surface treatment such as chemical etching is known, but these treatment steps are generally produced. This results in deterioration of the property and an increase in manufacturing costs.
Moreover, in order to improve the adhesiveness of a metal layer, the surface treatment which forms an anodized film is also proposed (for example, patent document 1, patent document 2), but the adhesiveness of a metal and an adhesive agent is Although improved, the adhesiveness between the adhesive and the fiber reinforced resin is not necessarily improved. Furthermore, although a method for increasing the toughness of the adhesive itself has also been proposed (for example, Patent Document 3 and Patent Document 4), the adhesive layer and the fiber-reinforced resin layer are prevented from being destroyed in the adhesive layer. The peel strength at the interface with the film is not necessarily improved.
JP 2002-129387 A JP-A-7-252687 JP 58-189277 A JP 2004-263104 A

  Therefore, the object of the present invention is to improve the adhesion between the metal layer and the fiber reinforced resin layer, particularly when the casing for electronic equipment is composed of a metal / fiber reinforced resin composite material. It is an object of the present invention to provide an electronic device casing that can solve problems such as delamination between both layers while exhibiting both of the above, and can exhibit excellent characteristics as a whole.

  In order to solve the above problems, an electronic device casing according to the present invention is an electronic device composed of a metal / fiber reinforced resin composite material in which a metal layer and a fiber reinforced resin layer are bonded and integrated through an intermediate resin layer. A housing for equipment, wherein the intermediate resin layer contains thermoplastic resin particles having an average particle diameter of 3 to 10 μm and an imidazolesilane compound.

  In this electronic device casing, a boundary portion (interface vicinity portion) between the intermediate resin layer and the fiber reinforced resin layer is a mixture of the thermoplastic resin constituting the particles and the reinforced fibers of the fiber reinforced resin layer. It is preferable to form a mixed layer.

  The thermoplastic resin particles are preferably present in the intermediate resin layer at least partially in the form of a continuous phase due to fusion of particles or the like.

  The matrix resin of the fiber reinforced resin layer and the base resin of the intermediate resin layer are preferably made of the same kind of resin (preferably, the same resin). For example, the matrix resin of the fiber reinforced resin layer and the base resin of the intermediate resin layer are preferably made of the same type or the same thermosetting resin (for example, epoxy resin).

  Various metals can be adopted as the metal layer, but a titanium alloy is preferably used from the viewpoint of improving the rigidity of the housing. Thus, when it consists of a layer containing difficult-to-adhere metal, such as a titanium alloy, the effect by this invention is especially large. Since the titanium alloy has a high specific strength and a specific elastic modulus and is excellent in mechanical properties, the use of the titanium alloy can provide a lightening effect in addition to improving the rigidity. The shape of the metal layer is not particularly limited, and may be a simple layer shape (plate shape) or a complicated shape that conforms to the required shape of the casing. Is possible.

  In addition, various reinforcing fibers can be used as the reinforcing fiber of the fiber reinforced resin layer. In particular, the carbon fiber not only has high specific strength and specific elastic modulus and excellent mechanical properties, but also has conductivity. Therefore, if it is configured in a layer containing carbon fibers as reinforcing fibers, the fiber reinforced resin layer itself can also exhibit electromagnetic wave shielding properties, so that it is easy to obtain better characteristics as a whole housing for electronic devices, and the characteristics are also It becomes easier to control.

  The electronic device casing according to the present invention is not particularly limited as long as it is used for an electronic device casing, and includes any form of electronic device casing in any field.

  In such an electronic device casing according to the present invention, the intermediate resin layer contains thermoplastic resin particles having a particle diameter in a predetermined range, so that the thermoplastic resin particles ensure a predetermined thickness of the intermediate resin layer. Therefore, an intermediate resin layer having a predetermined thickness is reliably interposed between the metal layer and the fiber reinforced resin layer. In addition, since the thermoplastic resin particles are blended in the intermediate resin layer, the toughness of the intermediate resin layer itself can be increased.

  The metal layer and the fiber reinforced resin layer are bonded and integrated through this intermediate resin layer, but the intermediate resin layer contains an imidazole silane compound, thereby improving the adhesion to the metal and making it difficult to adhere to a metal. In contrast, good adhesiveness can be expressed, and the adhesiveness between the intermediate resin layer and the metal layer is greatly improved.

  Further, since the intermediate resin layer contains thermoplastic resin particles having a fine particle diameter within a predetermined range, in the vicinity of the interface with the fiber reinforced resin layer, more or less thermoplastic particles are present between the reinforced fibers of the fiber reinforced resin layer. An invading form can be easily formed. That is, the boundary portion between the intermediate resin layer and the fiber reinforced resin layer can be formed in a mixed layer in which the thermoplastic resin particles and the reinforced fibers of the fiber reinforced resin layer are mixed. In such a form, for example, if the intermediate resin layer and the fiber reinforced resin layer are simultaneously formed at a temperature equal to or higher than the melting point of the thermoplastic resin particles, the particles are easily at least partially in a continuous phase form by fusion or the like. It is a series. If such a form appears, the thermoplastic resin that is at least partially in the form of a continuous phase by fusion or the like is formed at the interface between the intermediate resin layer and the fiber reinforced resin layer. It exists across both layers, and the anchor effect will be exhibited from any layer. Due to this anchor effect, the adhesion between the intermediate resin layer and the fiber reinforced resin layer is also reliably and significantly improved.

  The metal layer and the fiber reinforced resin layer are bonded and integrated with a strong adhesive force that does not cause peeling through the intermediate resin layer, so that the metal layer has excellent impact resistance and the like. Both the excellent lightness and mechanical properties of the reinforced resin layer can be expressed stably, and excellent electromagnetic shielding properties can be expressed as a whole, ensuring the target predetermined properties are stable and reliable. Will be demonstrated. Furthermore, when the outermost layer is a fiber reinforced resin layer, it is preferable that the outermost layer of the fiber reinforced resin layer is subjected to water repellent treatment to form a water repellent layer. When the electronic device casing of the present invention is exposed to high humidity or warm water, there is a concern that the adhesion between the metal and the fiber reinforced resin may deteriorate due to moisture absorption or water absorption of the fiber reinforced resin layer. This is because by forming the layer, moisture absorption or water absorption can be suppressed, and deterioration of adhesiveness can be prevented.

  Furthermore, electronic device casings often have complex shapes such as bosses, ribs, and hinges, and it is disadvantageous in terms of labor and productivity to manufacture the metal / fiber reinforced resin composite material in a single molding process. It may become. In such a case, it is preferable to form parts and structures having complicated shapes with different materials and integrate them. That is, the member (II) made of the thermoplastic resin (A) is preferably joined to the fiber reinforced resin layer (I) of the metal / fiber reinforced resin composite material. Here, the thermoplastic resin (A) is preferably selected from the viewpoint of producing a member having a more complicated shape with high productivity by a molding method such as injection molding. Therefore, the member (I) preferably has a simple plate shape that can be easily manufactured, and the member (II) preferably has a complicated shape such as a frame, a standing wall, a boss, a rib, a hinge, and a pedestal.

  As a method for integrating the member (I) and the member (II), it is possible to adopt mechanical joining such as bolts, rivets and screws, and joining methods using an adhesive, but more mass production of electronic devices is possible. From the viewpoint of enhancing, it is preferable to use a so-called hot melt bonding method in which bonding is performed through an adhesive layer made of the thermoplastic resin (B). Here, from the viewpoint of further increasing the adhesive strength, the thermoplastic resin (B) is more preferably bonded to a fiber reinforced resin layer which is the outermost layer of the member (I). In the adhesive layer, the thermoplastic resin (B) is preferably bonded to the matrix resin constituting the fiber reinforced resin layer (I) so as to have an uneven shape, and the thermoplastic resin (B) is bonded to the matrix resin. It is more preferable that the reinforcing fiber bundle constituting the fiber reinforced resin layer (I) is impregnated, and the maximum impregnation length is more preferably 10 to 1000 μm.

  Thus, according to the electronic device casing of the present invention, the metal layer and the fiber reinforced resin layer are bonded and integrated through the intermediate resin layer containing the thermoplastic resin particles having a predetermined particle diameter and the imidazolesilane compound. As a result, it is possible to realize a housing for an electronic device made of a metal / fiber reinforced resin composite material that can greatly improve adhesiveness and exhibit characteristics such as excellent mechanical properties and electromagnetic wave shielding properties without causing delamination.

  In addition, excellent adhesion can be expressed without applying special surface treatment such as chemical etching or anodizing treatment to the adhesion surface of metal. And it becomes possible to manufacture easily.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a housing for electronic equipment according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes an entire electronic device casing. The electronic device casing 1 includes a frame body 21 and a top plate 22. In this embodiment, the top plate 22 is a metal / fiber. It is composed of a reinforced resin composite material. The top plate 22 is configured, for example, as shown in FIGS. In the structure shown in FIG. 2, the metal layer 2 is disposed on both surfaces, the fiber reinforced resin layer 3 is disposed on the inner layer, and the metal layer 2 and the fiber reinforced resin are interposed between the metal layer 2 and the fiber reinforced resin layer 3. An intermediate resin layer 4 for bonding and integrating the layer 3 is interposed. In the structure shown in FIG. 3, the metal layer 2 is disposed on the inner layer, the fiber reinforced resin layer 3 is disposed on both surfaces, and the metal layer 2 and the fiber are disposed between the metal layer 2 and the fiber reinforced resin layer 3. An intermediate resin layer 4 that bonds and integrates the reinforced resin layer 3 is interposed. Further, in the structure shown in FIG. 4, the metal layer 2 is disposed on one surface, the fiber reinforced resin layer 3 is disposed on the other surface, and the metal layer is interposed between the metal layer 2 and the fiber reinforced resin layer 3. An intermediate resin layer 4 for interfacing and integrating 2 and the fiber reinforced resin layer 3 is interposed. Especially, the form of FIG. 3 and FIG. 4 by which the fiber reinforced resin layer 3 is arrange | positioned in the outermost layer is preferable from a viewpoint of joining with another member by a post process.

  The intermediate resin layer 4 contains thermoplastic resin particles having a predetermined particle size (average particle size of 3 to 10 μm) and an imidazole silane compound. The fiber reinforced resin layer 3 is composed of a composite material composed of reinforced fibers and a matrix resin (for example, a thermosetting resin such as an epoxy resin).

  In the present invention, the thermoplastic resin particles are selected from the group of polyamide resin, polyester resin, polycarbonate resin, styrene resin, EVA resin, urethane resin, acrylic resin, polyolefin resin, and PPS resin. It is preferable that it is at least one kind of resin. In particular, a polyamide-based resin is more preferable because it has excellent adhesion to a thermosetting resin.

  Examples of such an adhesive structure between the intermediate resin layer 4, the metal layer 2, and the fiber reinforced resin layer 3 are shown in FIGS. FIG. 6 is a more preferable example.

  In the example shown in FIG. 5, a thermoplastic resin is used as a base resin between the metal layer 2 and the fiber reinforced resin layer 3 including the reinforcing fiber (group) 5 and the thermosetting matrix resin 6. An intermediate resin layer 4 serving as an adhesive resin layer including the resin 8 (the thermoplastic resin continuous phase 8a and the thermoplastic resin particle phase 8b) is interposed. When the thermoplastic resin particles having a predetermined particle diameter are blended in the intermediate resin layer 4, the particles serve as a spacer to ensure a desired thickness of the intermediate resin layer 4, and the metal layer 2 and the fiber reinforced resin layer 3. A desirable interlayer thickness can be ensured between Moreover, the intermediate resin layer 4 can be toughened by blending the thermoplastic resin particles, and the contained particles can also exhibit a pinning effect against cracks, for example. The thermoplastic resin particles having the predetermined particle diameter contained in the intermediate resin layer 4 are at least partially in the form of a continuous phase (linear or film-like continuous phase form), for example, by fusion as shown in the figure. The thermoplastic resin continuous phase portion 8a and the thermoplastic resin particle phase portion 8b that are substantially left in the form of particles are mixed. Thus, the thermoplastic resin particles are contained in the intermediate resin layer 4 in the form of a continuous phase, whereby the adhesion between the metal layer 2 and the fiber reinforced resin layer 3 is improved. In particular, when a stress in a peeling mode such as peeling from the fiber reinforced resin layer 3 is applied to the metal layer 2, the thermoplastic resin particles in the intermediate resin layer 4 have the form of the continuous phase 8a. It is considered that it acts as an anchor for the thermosetting base resin 7 that constitutes and improves the adhesion. Here, the thermosetting matrix resin 6 constituting the fiber reinforced resin layer 3 and the thermosetting matrix resin 7 constituting the intermediate resin layer 4 may have the same resin composition or different thermosetting resins. It may be.

  The thermosetting resin 7 constituting the intermediate resin layer 4 contains an imidazole silane compound. By including this imidazolesilane compound, the adhesiveness between the intermediate resin layer 4 and the metal layer 2, particularly the metal layer 2 containing a difficult-to-bond metal such as an aluminum alloy is improved. In addition, a decrease in adhesiveness after exposure to high temperature and high humidity is suppressed, and the resistance to environmental exposure can be improved. The blending amount of the imidazole silane compound in the thermosetting resin is preferably 0.1% by weight or more and 2.0% by weight or less with respect to the weight of the resin composition. That is, when the amount of the imidazole silane compound is less than 0.1% by weight, the effect of improving adhesiveness is small, which is not preferable. If it exceeds 2.0% by weight, especially when an epoxy resin is used as the thermosetting resin, the imidazole silane compound also acts as a curing agent or a curing accelerator, so that curing is excessively accelerated. Therefore, it is not preferable. In this case, it is also one of preferable usage forms that a solution obtained by melting an imidazolesilane compound in an organic solvent such as ethanol is applied to a metal adhesion surface, dried and subjected to a surface treatment. Thus, the purpose of use of the imidazolesilane compound in the present invention is to improve the adhesion to the metal layer 2 in particular, and is used as a curing agent or curing accelerator for a thermosetting resin or as a rust preventive for metals. is not.

  FIG. 6 shows a more preferable embodiment. That is, in the electronic device casing 11 shown in FIG. 6, the intermediate resin layer 12 is continuous with the reinforcing fiber 5 of the fiber reinforced resin layer 3 and the thermoplastic resin particles, particularly at the boundary with the fiber reinforced resin layer 3. The mixed layer 12b in which the phase thermoplastic resin 8a is mixed is formed unevenly. The portion closer to the metal layer 2 than the mixed layer 12b has substantially the same form as the intermediate resin layer 4 shown in FIG. Thus, by mixing the reinforcing fiber 5 and the thermoplastic resin continuous phase 8a, the thermoplastic resin continuous phase 8a acts as an anchor for the reinforcing fiber group 5, and the intermediate resin layer 12 and the fiber reinforced resin layer 3 Adhesion is greatly improved. It is more preferable that each thermoplastic resin continuous phase 8a is in contact with a plurality of reinforcing fibers 5.

  The thickness of the intermediate resin layer 12 is preferably 15 μm or more and 150 μm or less, for example, and the maximum thickness of the mixed layer 12b is preferably 10 μm or more and 100 μm or less. FIG. 5 shows the thickness of the intermediate resin layer 12 as Ta and the thickness of the mixed layer 12b with the thermoplastic resin continuous phase 8a as the reinforcing fiber group 5 as Tpf. Ta and Tpf can be measured by observing the cross section of the composite material with an optical microscope, a microscope using a CCD, SEM, and TEM.

  If the thickness Ta of the intermediate resin layer 12 is less than 15 μm, the intermediate resin layer 12 is too thin and the layer is easily broken, which is not preferable. On the other hand, when the thickness is larger than 150 μm, the intermediate resin layer 12 is too thick, so that the weight of the intermediate resin layer 12 increases and the weight reduction as a composite material is impaired.

  Furthermore, the thickness Tpf of the mixed layer 12b in which the reinforcing fiber 5 and the thermoplastic resin continuous phase 8a are mixed may be less than 10 μm, but is preferably 10 μm or more because the adhesiveness is further improved. On the other hand, if it is thicker than 100 μm, it is not preferable because it is too thick and the weight of the intermediate resin layer 12 increases. Moreover, it is not preferable to mix the thermoplastic resin continuous phase 8a thicker than 100 μm between the reinforcing fibers because it may be very difficult from the viewpoint of molding.

  Regarding the thermoplastic resin particles blended in the intermediate resin layer 12, it is preferable that a continuous phase having a continuous shape as described above and a particle shape having an average particle diameter of 3 μm or more and 10 μm or less are mixed. The intermediate resin layer 12 is composed of a base resin 7 made of a thermosetting resin and thermoplastic resin particles. The thermoplastic resin particles have a particle shape with an average particle diameter of 3 μm or more and 10 μm or less, and the thermosetting resin. Is mixed. By making the particle shape 3 μm or more and 10 μm or less, it is easy to process the intermediate resin layer 12 into a film shape or the like before molding. Further, in the curing and molding process, the thermoplastic resin particles are interposed between the reinforcing fibers. It becomes easy to form, and it becomes easy to form the layer 12b in which the reinforced fiber and the thermoplastic resin particles are mixed after molding. For this reason, it is preferable to make it the coexistence state with which the mixed thermoplastic resin particle forms a continuous phase of a continuous shape, and the remainder remains a particle shape.

In addition, the resin composition itself constituting the intermediate resin layer 12 in the present invention is measured based on ASTM D 5045-96 “Standard Test Methods for Plane-Strain Fracture Toughness and Strain Energy Rate of Matter Release”. The rate (Strain Energy Release Rate) G _IC is preferably 400 J / m ² or more and 1000 J / m ² or less. A G _IC of less than 400 J / m ² is not preferable because the strain energy release rate is too low and the destruction of the intermediate resin layer 12 proceeds relatively easily. G _IC can be improved by mixing the thermoplastic resin particles in the intermediate resin layer 12 in a continuous continuous phase. Further, it is possible to improve G _IC by increasing the amount of the thermoplastic resin particles mixed with the thermosetting resin. On the other hand, in order to make G _IC larger than 1000 J / m ^2, it is necessary to mix more thermoplastic resin particles. However, if the amount of the thermoplastic resin particles is too large, the film shape of the resin composition It is not preferable because it may be difficult to process the material, and the heat resistance or the elastic modulus of the intermediate resin layer may be lowered.

  In order to at least partially make the thermoplastic resin into a continuous phase by fusion or the like, it is preferable to mold at a temperature equal to or higher than the melting point (or softening point) of the thermoplastic resin particles. When the intermediate resin layer 12 and the fiber reinforced resin layer 3 are molded simultaneously in order to allow the particles to enter between the reinforced fibers, or when a cured fiber reinforced resin is used, the surface roughness is equal to or larger than the particle diameter of the particles. A method of blasting the adhesive surface can also be adopted.

  The melting point or softening point of the thermoplastic resin is preferably 200 ° C. or lower. In the present invention, the thermoplastic resin in the intermediate resin is once melted or softened by molding a composite material at a temperature equal to or higher than the melting point or softening point of the thermoplastic resin and an appropriate pressure condition. A thermoplastic resin can be easily mixed in the form of a continuous phase. When the melting point or softening point of the thermoplastic resin is higher than 200 ° C., the molding temperature of the composite material needs to be higher than 200 ° C., which is not preferable because the molding temperature becomes too high. The molding temperature here means a temperature at which the thermosetting resin constituting the fiber reinforced resin layer and the intermediate resin layer is cured.

  In the present invention, the metal constituting the metal layer is not particularly limited as long as it exhibits predetermined characteristics while maintaining the light weight of the electronic device casing, and may be selected according to various required characteristics. However, a titanium alloy or an aluminum alloy is preferable from the viewpoint of achieving both lightweight, high rigidity, and high strength.

  In the present invention, the reinforcing fibers constituting the reinforcing fiber group include inorganic fibers such as carbon fibers, glass fibers, and alumina fibers, organic fibers such as aramid fibers and polyamide synthetic fibers, and two or more kinds thereof. Although it can be used in combination, carbon fiber is particularly preferable as such a reinforcing fiber. Since carbon fiber has low specific gravity, high strength, and high elastic modulus, the specific strength and specific elastic modulus are large, and the composite material of the electronic device casing according to the present invention is reduced in weight, strength, and elasticity. Therefore, not only can it be used preferably, but because carbon fiber has conductivity, it can also provide electromagnetic shielding properties to the fiber reinforced resin layer itself, and also improve the rigidity and electromagnetic shielding properties of the entire housing. This is preferable because it is possible.

As shown in FIG. 1, the electronic device casing 1 of the present invention includes a member (top plate) 22 made of a metal / fiber reinforced resin composite material and another member (frame body) 21. Here, in order to manufacture a complicated shape with high productivity, the member 22 has a planar shape, and the member 21 has a three-dimensional shape. Here, the surface shape means that the majority of the projected area is a planar shape or a gentle curved surface shape. On the other hand, the three-dimensional shape means a shape with a thickness change in each of the vertical, horizontal, and height directions. The structural part of the structure, the geometric part of the design, and the protrusion formed intentionally. Including dents. A frame (frame) typified by the molded body of FIG. 1, a standing wall, a hinge, a boss, a rib, a pedestal (a foundation on which a component, a logo, etc.) are not shown correspond to this, and the member 22 Manufactured by a method with excellent mass productivity.
The material of the member 21 is not particularly limited, and thermosetting resin, thermoplastic resin, cement, concrete, or fiber reinforced products thereof, wood, metal material, paper material, and the like can be used. From the viewpoint, a molding material using a thermoplastic resin (A) as a matrix resin is preferably used, and for the purpose of further improving mechanical properties, a thermoplastic resin composition in which short reinforcing fibers are uniformly dispersed in a thermoplastic resin group It is more preferable to use a product because it is possible to achieve both mass productivity, moldability, light weight, and mechanical properties.
The thermoplastic resin (A) used here is, for example, a polyester resin such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PENp), or liquid crystal polyester. In addition to polyolefins such as polyethylene (PE), polypropylene (PP), and polybutylene, styrene resins, urethane resins, polyoxymethylene (POM), polyamide (PA), polycarbonate (PC), polymethyl methacrylate (PMMA) ), Polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified PPE, polyimide (PI), polyamideimide (PAI), polyetherimide (PEI), police Hong (PSU), modified PSU, polyethersulfone (PES), polyketone (PK), polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), polyarylate (PAR), poly Fluorine resins such as ether nitrile (PEN), phenolic resin, phenoxy resin, polytetrafluoroethylene, copolymers thereof, modified products, and resins obtained by blending two or more types may be used. In particular, PPS resins are used from the viewpoints of heat resistance and chemical resistance, polycarbonate resins and styrene resins are used from the viewpoint of the appearance and dimensional stability of the molded body, and polyamide resins are used from the viewpoint of the strength and impact resistance of the molded body. More preferably used. Furthermore, it is preferable to use two or more of these as a polymer alloy or a polymer blend since both rigidity and toughness can be achieved and impact resistance is excellent.
In the electronic device casing of the present invention, it is preferable to obtain an excellent adhesive effect when the member 22 and the member 21 are joined and integrated. Therefore, the member (II) made of the thermoplastic resin (A) is used as the member 21, and the member 22 and the member (II) made of the thermoplastic resin (A) are joined to each other via an adhesive layer. Is preferred. Here, as the adhesive layer, generally known adhesives such as acrylic, epoxy, and styrene can be used, but a thermoplastic resin can be used for the purpose of increasing productivity. Therefore, the outermost layer, which is the bonding surface of the fiber reinforced resin layer (I), of the member 22 is formed with the thermoplastic resin (B) having a good affinity with the thermoplastic resin (A) constituting the member 21. Therefore, an adhesive is not required, and high adhesive strength can be obtained by heat fusion, which is preferable.
Here, it is preferable that the outermost layer of the member 22 is the fiber reinforced resin layer (I) because higher adhesive strength than the metal layer can be expected. For that purpose, it is preferable that the matrix resin (thermosetting resin) of the fiber reinforced resin and the thermoplastic resin (B) of the adhesive layer are bonded with an uneven shape at the interface. In particular, in the case of a bonding configuration in which a large number of reinforcing fiber groups in the reinforcing fiber bundle are included in the adhesive layer formed from the thermoplastic resin (B), excellent adhesive strength is obtained, which is more preferable.
In FIG. 7, the image figure of the preferable joining form of the member (II) which consists of the fiber reinforced resin layer (I) and thermoplastic resin (A) in this invention is shown. FIG. 7 is a cross-sectional view of the joint surface cut in the thickness direction. The adhesive layer is formed by impregnating the reinforcing fiber bundle with the thermoplastic resin (B). Among these irregularities, the maximum thickness 36 of the adhesive layer is preferably 10 to 1,000 μm, more preferably 20 to 200 μm, and still more preferably 40 to 100 μm. The maximum thickness of the adhesive layer including the reinforcing fibers, that is, the maximum impregnation length 37 is a distance based on the outermost reinforcing fiber outer line 35 in contact with the thermoplastic resin (B) of the adhesive layer 33. From the viewpoint of adhesive strength, it is preferably 10 to 1000 μm, more preferably 20 to 200 μm, and particularly preferably 40 to 100 μm.
The joining structure of the member 22 and the member 21 and the thickness of the adhesive layer can be measured by observing the cross section of the joining portion with an optical microscope, a microscope using a CCD, SEM, and TEM. In this operation, some of the reinforcing fibers of the reinforcing fiber bundle may drop off, but there is no problem as long as the observation is not affected. The test piece may be dyed as necessary in order to adjust the contrast of observation.
There is no particular limitation on the integration method when manufacturing the integrated molded body of the present invention, a method using an adhesive, a method using bolts or screws, and heat welding when integrating with a thermoplastic member, Vibration welding, ultrasonic welding, laser welding, insert injection molding, outsert injection molding and the like are preferably used, and outsert molding and insert molding are preferably used from the viewpoint of the molding cycle.
A specific example will be described with reference to FIG. According to the present invention, the top plate 22 obtained by bonding and integrating the metal layer and the fiber reinforced resin layer through the intermediate resin layer whose sectional view is shown in FIG. A member made of the thermoplastic resin (A) on the top plate 22 by setting the reinforcing resin layer (I) and injection-molding a thermoplastic resin (for example, polyamide resin) containing short fiber-like reinforcing fibers. It is possible to form and integrate the frame body 21 which is (II). In this example, when the top plate 22 is molded, high adhesive strength can be expressed by impregnating the reinforcing fiber resin layer with a low melting point polyamide resin. The injection molding temperature for forming the frame body 21 which is the member (II) made of the thermoplastic resin (A) may be 200 ° C. or higher.

  FIG. 8 shows a cross-sectional view of the electronic device casing of the above example thus formed. A part of the fiber reinforced resin layer (I) 3 is omitted between two parallel lines in the center in the thickness direction. In this figure, the fibers of the fiber reinforced resin layer (I) 3 are shown in only one direction. However, the fibers may be woven fabrics, or layers that are aligned in one direction may be laminated with different orientation directions. Or a sandwich structure having a lightweight core material such as foamed resin between the layers. Thus, the metal layer 2 is joined to one side of the fiber reinforced resin layer (I) 3, and the other side is joined to a frame (frame), standing wall, hinge, boss, rib, pedestal ( This is a structure in which a member (II) 21 made of a thermoplastic resin (A) such as a base on which a component, a logo, etc. is mounted is joined. In this structure, as described above, the intermediate layer 12 is disposed between the metal layer 2 and the fiber reinforced resin layer (I) 3, and is composed of the fiber reinforced resin layer (I) 3 and the thermoplastic resin (A). An adhesive layer having an adhesive thickness indicated by reference numeral 36 is disposed between the members (II) 21 so that each of them can be strongly bonded, so that the adhesiveness can be greatly improved and delamination does not occur. Therefore, it is possible to realize a housing for an electronic device made of a metal / fiber reinforced resin composite material capable of exhibiting excellent mechanical properties and electromagnetic shielding properties.

Based on an Example, this invention is demonstrated further more concretely. Unless otherwise specified, the blending ratio (%) shown in the examples is a value based on% by weight. The components used in the examples of the present invention are shown below.
Reference example 1
"Epicoat (registered trademark) 828" (bisphenol A type epoxy resin) 40% by weight manufactured by Japan Epoxy Resin Co., Ltd., "Sumi-Epoxy (registered trademark)" ELM-434 (tetrafunctional glycidylamine) manufactured by Sumitomo Chemical Co., Ltd. Type epoxy resin) 40 parts by weight of “SumiCure (registered trademark)” S (4,4′-diaminodiphenylsulfone) manufactured by Sumitomo Chemical Co., Ltd. is used as a curing agent for 100 parts by weight of epoxy resin comprising 60% by weight. Then, the matrix of the epoxy resin was adjusted. Furthermore, with respect to 100 parts by weight of the adjusted epoxy resin, 1 part by weight of imidazole silane manufactured by Nikko Materials Co., Ltd. and 20 parts by weight of “Trepearl (registered trademark)” SP-500 (polyamide resin particles) manufactured by Toray Industries, Inc. The kneader was mixed at 70 ° C. for 1 hour to take out the epoxy resin composition. The obtained resin composition was applied onto release paper using a reverse roll coater to produce a resin film (S). The basis weight (the amount of resin per unit area) of the resin film was 50 g / m 2.
Reference example 2
Processing pellets of polyamide resin (Toray Industries, Ltd. CM8000, 4-copolymerized polyamide 6/66/610/12, melting point 130 ° C.) into a resin film (P) having a size of 350 × 350 mm and a basis weight of 50 g / m ^2. did.
(Example)
By describing with reference to FIG. 1, this embodiment can be described more clearly.
A prepreg impregnated with carbon fiber groups arranged in one direction with an epoxy resin (thermosetting resin) ("Torayca (registered trademark)" prepreg P3052S-12 manufactured by Toray Industries, Inc. "Torayca (registered trademark)" (Trademark) "T700S was used, carbon fiber content 67 wt%, fiber weight 125 g / m2), and a prepreg sheet having a size of 350 x 350 mm was cut out in a predetermined shape. Similarly, the resin film (S) was cut into a predetermined shape, and the release paper was removed and used as a resin film in the following lamination process.
Lamination using prepreg was carried out in order so that 0 ° / 90 ° / film (S) / metal sheet / film (S) / 90 ° / 0 ° / film (P) based on the fiber direction. . “Kobe titanium” KS15-3-3-3 (titanium alloy, thickness 0.13 mm) manufactured by Kobe Steel Ltd. was used as the metal sheet. Next, “Tedlar (registered trademark)” films manufactured by Toray DuPont Co., Ltd. as release films are placed on the top and bottom of the laminate and set on a flat plate for press molding made of SUS, at 180 ° C. for 2 hours, The epoxy resin was cured by applying a surface pressure of 0.5 MPa. After curing, after cooling at room temperature, the “Tedlar®” film was removed and a metal / fiber reinforced resin composite sandwich plate was molded. From this sandwich plate, a predetermined size (300 × 280 mm top plate 22 with the fiber direction as the longitudinal direction) was cut out.
The obtained sandwich structure was inserted by placing the side where the film (P) is present on the side of the injection mold resin injection, and long fiber pellets (TLP1146S manufactured by Toray Industries, Inc., carbon fiber content 20 Outsert injection molding was performed so as to form a frame body 21 having a boss rib part and a hinge part on the outer periphery of the sandwich structure using a weight% polyamide resin matrix). Injection molding was performed using a J350EIII injection molding machine manufactured by Nippon Steel Works, and the cylinder temperature was 280 ° C. In the obtained electronic device casing 1, the member (II) made of the thermoplastic resin (A) was firmly integrated.
When the thickness of the sandwich structure as the top surface is 0.8 mm, the density is measured based on the method A (underwater substitution method) described in 5 of JIS K 7112 (1999), the tensile strength is 2.0 based on ISO 178. With a test apparatus “Instron” (registered trademark) 5565 type universal material testing machine (Instron Japan Co., Ltd.), the test speed was 1.27 mm / min, and the flexural modulus was measured to be 75 GPa. there were.
The resulting integrated molded product is a thin and highly rigid casing for electronic equipment, and interfacial delamination occurs between metal / fiber reinforced resin composite materials and between fiber reinforced resin composite materials / injection molded materials. It does not occur, and exhibits a strong adhesive strength of base material destruction (recognized in a state where carbon fibers are exposed on the fracture surface). A joint portion between the sandwich structure and the injection molding was cut out from the integrated molded body, and the cross section was observed with a scanning electron microscope (SEM). First, it was confirmed that the thermoplastic resin particles entered between the reinforcing fibers of the fiber reinforced resin layer between the metal / fiber reinforced resin composite materials and partially formed a continuous layer. Next, between the fiber reinforced resin composite material / injection molding material layer, the interface between the matrix resin reinforced with the continuous reinforcing fiber group and the adhesive layer made of the thermoplastic resin has an uneven shape. Admitted. When the thickness of the carbon fiber group contained in the thermoplastic resin layer was measured, it was 30 μm. From this, it was confirmed that the integrally molded product has a joining form as shown in FIG.
(Comparative example)
In the lamination using the prepreg of the example, a sandwich plate of a metal / fiber reinforced resin composite material was molded under the same conditions except that the film (S) was not used. When a predetermined size (300 × 280 mm top plate 22 with the fiber direction as the longitudinal direction) is cut out from the sandwich plate, some of the molded products are peeled off between the layers of the metal / fiber reinforced resin composite material. Could not be used.
Also, the sandwich structure without peeling was inserted into an injection mold, and a long fiber pellet (TLP1146S manufactured by Toray Industries, Inc., carbon fiber content 20% by weight, polyamide resin matrix) was similarly used as an integrated molded body. It was. The obtained integrally molded product also easily peeled off between the layers of the metal / fiber reinforced resin composite material, and could not be used as a housing for electronic equipment.

It is a disassembled perspective view of the housing | casing for electronic devices which concerns on one embodiment of this invention. It is an expanded partial sectional view which shows an example of the cross-sectional structure of the top plate of FIG. It is an expanded partial sectional view which shows another example of the cross-sectional structure of the top plate of FIG. It is an expanded partial sectional view which shows another example of the cross-sectional structure of the top plate of FIG. It is an expanded partial sectional view which shows the structural example of the adhesion part of the metal layer of a housing | casing for electronic devices, and a fiber reinforced resin layer. It is an expanded partial sectional view which shows another structural example of the adhesion part of the metal layer of a housing | casing for electronic devices, and a fiber reinforced resin layer. It is an expanded partial sectional view which shows the structural example of the adhesion part of the fiber reinforced resin layer of the housing | casing for electronic devices, and the member which consists of thermoplastic resins. It is an expanded partial sectional view which shows the structural example of the adhesion part of each layer of the housing | casing for electronic devices.

Explanation of symbols

1, 11, 11a Electronic device casing 2 Metal layer 3 Fiber reinforced resin layer 4, 12 Intermediate resin layer 5 Reinforcing fiber (group)
6 Matrix resin of fiber reinforced resin layer 7 Base resin of intermediate resin layer 8 Thermoplastic resin 8a Thermoplastic resin continuous phase 8b Thermoplastic resin particle phase 12a Middle resin layer portion 12b near metal layer Mixed layer 21 Frame body 22 Top plate 31a Reinforcing fiber 31b included in matrix resin (thermosetting resin) 31b Reinforcing fiber included in adhesive layer (thermoplastic resin (B)) 32 Matrix resin (thermosetting resin)
33 Adhesive layer (thermoplastic resin (B))
34 Interface between matrix resin (thermosetting resin) and thermoplastic resin (B) 35 Outline 36 Maximum thickness of adhesive layer 37 Maximum impregnation length

Claims (13)

  A casing for an electronic device composed of a metal / fiber reinforced resin composite material in which a metal layer and a fiber reinforced resin layer are bonded and integrated through an intermediate resin layer, wherein the intermediate resin layer has an average particle size of 3 to 3 A housing for electronic equipment, characterized by containing 10 μm thermoplastic resin particles and an imidazolesilane compound.   The boundary part of the said intermediate | middle resin layer and the said fiber reinforced resin layer forms the mixed layer in which the thermoplastic resin which comprises the said particle | grain, and the reinforced fiber of the said fiber reinforced resin layer were mixed. Housing for electronic devices.   3. The electronic device casing according to claim 1, wherein the thermoplastic resin particles are present in the intermediate resin layer at least partially in the form of a continuous phase by fusion or the like.   The housing | casing for electronic devices in any one of Claims 1-3 in which the matrix resin of a fiber reinforced resin layer and the base material resin of an intermediate | middle resin layer consist of the same kind of resin.   The electronic device casing according to claim 4, wherein the same type of resin is made of a thermosetting resin.   The electronic device casing according to claim 1, wherein the fiber reinforced resin layer is formed of a layer containing carbon fibers.   The electronic device casing according to claim 1, wherein the metal layer is made of a metal containing titanium.   The case for electronic devices according to any one of claims 1 to 7, wherein a water repellent layer is formed on the surface of the outermost fiber reinforced resin layer.   The electronic device housing according to any one of claims 1 to 8, wherein a member (II) made of a thermoplastic resin (A) is joined to a fiber reinforced resin layer (I) of the metal / fiber reinforced resin composite material. body.   The electronic device casing according to claim 9, wherein the member (II) is bonded to the outermost layer of the fiber reinforced resin layer (I) via an adhesive layer made of a thermoplastic resin (B). 11. The electronic device casing according to claim 10, wherein in the adhesive layer, the thermoplastic resin (B) and the matrix resin constituting the fiber reinforced resin layer (I) are joined with an uneven shape.   The thermoplastic resin (B) constituting the adhesive layer is impregnated into a reinforcing fiber bundle constituting the fiber reinforced resin layer, and the maximum impregnation length is 10 to 1000 µm. The electronic device casing described. The electronic device housing according to any one of claims 9 to 12, wherein the member (II) is any one of a frame, a standing wall, a boss, a rib, a hinge, and a pedestal.

Images