JP2006278578A5 - - Google Patents

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Publication number
JP2006278578A5
JP2006278578A5 JP2005093234A JP2005093234A JP2006278578A5 JP 2006278578 A5 JP2006278578 A5 JP 2006278578A5 JP 2005093234 A JP2005093234 A JP 2005093234A JP 2005093234 A JP2005093234 A JP 2005093234A JP 2006278578 A5 JP2006278578 A5 JP 2006278578A5
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JP
Japan
Prior art keywords
semiconductor laser
laser element
substrate
semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005093234A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006278578A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005093234A priority Critical patent/JP2006278578A/ja
Priority claimed from JP2005093234A external-priority patent/JP2006278578A/ja
Priority to US11/219,875 priority patent/US7512167B2/en
Priority to CN 200510105528 priority patent/CN1753261B/zh
Priority to CN201010164149A priority patent/CN101826703A/zh
Publication of JP2006278578A publication Critical patent/JP2006278578A/ja
Publication of JP2006278578A5 publication Critical patent/JP2006278578A5/ja
Priority to US12/256,854 priority patent/US7961768B2/en
Priority to US13/100,720 priority patent/US20110211609A1/en
Pending legal-status Critical Current

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JP2005093234A 2004-09-24 2005-03-28 集積型半導体レーザ素子およびその製造方法 Pending JP2006278578A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005093234A JP2006278578A (ja) 2005-03-28 2005-03-28 集積型半導体レーザ素子およびその製造方法
US11/219,875 US7512167B2 (en) 2004-09-24 2005-09-07 Integrated semiconductor laser device and method of fabricating the same
CN 200510105528 CN1753261B (zh) 2004-09-24 2005-09-23 集成型半导体激光元件及其制造方法
CN201010164149A CN101826703A (zh) 2004-09-24 2005-09-23 集成型半导体激光元件及其制造方法
US12/256,854 US7961768B2 (en) 2004-09-24 2008-10-23 Integrated semiconductor laser device and method of fabricating the same
US13/100,720 US20110211609A1 (en) 2004-09-24 2011-05-04 Integrated semiconductor laser device and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005093234A JP2006278578A (ja) 2005-03-28 2005-03-28 集積型半導体レーザ素子およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006278578A JP2006278578A (ja) 2006-10-12
JP2006278578A5 true JP2006278578A5 (https=) 2007-07-19

Family

ID=37213042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005093234A Pending JP2006278578A (ja) 2004-09-24 2005-03-28 集積型半導体レーザ素子およびその製造方法

Country Status (1)

Country Link
JP (1) JP2006278578A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4882681B2 (ja) * 2006-11-09 2012-02-22 ソニー株式会社 半導体レーザ、光ピックアップおよび光ディスク装置
WO2020174949A1 (ja) * 2019-02-26 2020-09-03 パナソニックセミコンダクターソリューションズ株式会社 半導体レーザ装置及び半導体レーザ素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357536A (en) * 1993-05-07 1994-10-18 Xerox Corporation Method and apparatus for the positioning of laser diodes
JP3419930B2 (ja) * 1994-12-21 2003-06-23 三菱電機株式会社 半導体レーザ装置とこの半導体レーザ装置を備えた光ディスク装置
JP3093646B2 (ja) * 1996-08-09 2000-10-03 日本電気株式会社 半導体レーザ装置
US6136623A (en) * 1998-05-06 2000-10-24 Xerox Corporation Multiple wavelength laser arrays by flip-chip bonding
JP3486900B2 (ja) * 2000-02-15 2004-01-13 ソニー株式会社 発光装置およびそれを用いた光装置
JP2001332805A (ja) * 2000-05-24 2001-11-30 Samsung Electro Mech Co Ltd ２波長レーザーダイオード及びその製造方法
JP2004207479A (ja) * 2002-12-25 2004-07-22 Pioneer Electronic Corp 半導体レーザ装置及びその製造方法

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