JP2006274248A5 - - Google Patents

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Publication number
JP2006274248A5
JP2006274248A5 JP2006052449A JP2006052449A JP2006274248A5 JP 2006274248 A5 JP2006274248 A5 JP 2006274248A5 JP 2006052449 A JP2006052449 A JP 2006052449A JP 2006052449 A JP2006052449 A JP 2006052449A JP 2006274248 A5 JP2006274248 A5 JP 2006274248A5
Authority
JP
Japan
Prior art keywords
semiconductor device
tape according
pattern processing
processing tape
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006052449A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006274248A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006052449A priority Critical patent/JP2006274248A/ja
Priority claimed from JP2006052449A external-priority patent/JP2006274248A/ja
Publication of JP2006274248A publication Critical patent/JP2006274248A/ja
Publication of JP2006274248A5 publication Critical patent/JP2006274248A5/ja
Withdrawn legal-status Critical Current

Links

JP2006052449A 2005-03-03 2006-02-28 半導体装置用接着剤付きテープおよびその製造方法、それを用いたパターン加工テープ Withdrawn JP2006274248A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006052449A JP2006274248A (ja) 2005-03-03 2006-02-28 半導体装置用接着剤付きテープおよびその製造方法、それを用いたパターン加工テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005059023 2005-03-03
JP2006052449A JP2006274248A (ja) 2005-03-03 2006-02-28 半導体装置用接着剤付きテープおよびその製造方法、それを用いたパターン加工テープ

Publications (2)

Publication Number Publication Date
JP2006274248A JP2006274248A (ja) 2006-10-12
JP2006274248A5 true JP2006274248A5 (enExample) 2009-01-08

Family

ID=37209293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006052449A Withdrawn JP2006274248A (ja) 2005-03-03 2006-02-28 半導体装置用接着剤付きテープおよびその製造方法、それを用いたパターン加工テープ

Country Status (1)

Country Link
JP (1) JP2006274248A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY180785A (en) * 2015-07-23 2020-12-09 Mitsui Mining & Smelting Co Ltd Resin-clad copper foil, copper-clad laminated plate, and printed wiring board
JP7203481B2 (ja) * 2015-08-28 2023-01-13 株式会社レゾナック 電子部品装置の製造方法

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