JP2006269487A - Light-emitting device and lighting system - Google Patents

Light-emitting device and lighting system Download PDF

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JP2006269487A
JP2006269487A JP2005081462A JP2005081462A JP2006269487A JP 2006269487 A JP2006269487 A JP 2006269487A JP 2005081462 A JP2005081462 A JP 2005081462A JP 2005081462 A JP2005081462 A JP 2005081462A JP 2006269487 A JP2006269487 A JP 2006269487A
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light
light emitting
emitting device
emitting element
hole
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JP5085851B2 (en
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Shingo Matsuura
真吾 松浦
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Kyocera Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
    • H01L2924/15172Fan-out arrangement of the internal vias
    • H01L2924/15174Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device that can take out light emitted from a light-emitting element to the outside of the light-emitting device so that luminous intensity on a luminous surface becomes uniform, has high radiation light intensity and high luminance, and does not have any points where the luminous intensity is strong extremely. <P>SOLUTION: The light-emitting device includes a substrate 2 having a placement section 2a where the light-emitting element 4 is placed on the upper surface; a frame body 3 that is attached onto the upper surface of the substrate 2, so that the placement section 2a is surrounded with an inner-periphery surface 3a as a light reflection surface; the light-emitting element 4 placed at the placement section 2a; and a light-transmitting member 5 placed so that the upper section of the light-emitting element 4 is covered. In the light-emitting device, a hole 6 having an inclined surface is provided partially at a part positioned directly above the light-emitting element 4 on the upper surface of the light-transmitting member 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子を収納して成る発光装置およびそれを用いた照明装置に関する。   The present invention relates to a light emitting device in which a light emitting element is accommodated and an illumination device using the same.

発光ダイオード(LED)や半導体レーザ(LD)等の発光素子を用いた発光装置は、今後さらなる低消費電力化や長寿命化がすすむものと予測されていることから注目されており、近年、各種インジケーター、光センサー、ディスプレイ、ホトカプラ、バックライト、光プリンタヘッド等の種々の分野で使用され始めている。従来の、発光ダイオード(LED)等の発光素子から発光される近紫外光や青色光等の光を赤色,緑色,青色,黄色等の可視領域波長の光に変換する蛍光体により任意の色を発光する発光装置を図13に示す。図13において、12は基体、13は枠体、13aは枠体13の内周面、14は発光素子を示す。   Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their life in the future. It has begun to be used in various fields such as indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. A conventional phosphor that converts light such as near-ultraviolet light and blue light emitted from a light emitting element such as a light emitting diode (LED) into light having a visible region wavelength such as red, green, blue, yellow, etc. A light-emitting device that emits light is shown in FIG. In FIG. 13, 12 is a base body, 13 is a frame body, 13a is an inner peripheral surface of the frame body 13, and 14 is a light emitting element.

従来の発光装置11は、上面に発光素子14を載置するための載置部12aを有し、載置部12aおよびその周辺から発光装置11の内外を電気的に導通接続する配線導体12bが形成された絶縁体からなる基体12と、基体12の上側主面の外周部に接着固定され、上側開口が下側開口より大きい貫通孔が形成されているとともに、内周面13aが発光素子14から発光される光を反射する光反射面とされている枠体13と、載置部12aに載置固定された発光素子14とから主に構成されている。   The conventional light emitting device 11 has a placement portion 12a for placing the light emitting element 14 on the upper surface, and a wiring conductor 12b that electrically connects the inside and outside of the light emitting device 11 from the placement portion 12a and its periphery. The base body 12 made of an insulator and the outer peripheral portion of the upper main surface of the base body 12 are bonded and fixed, the upper opening is formed with a through hole larger than the lower opening, and the inner peripheral surface 13a is the light emitting element 14. It is mainly comprised from the frame 13 used as the light reflection surface which reflects the light radiated | emitted from, and the light emitting element 14 mounted and fixed to the mounting part 12a.

この発光装置は、外部電気回路から供給される駆動電流によって発光素子13を発光させることで可視光を放出することができる。近年、この発光装置を照明用として利用するようになってきており、高輝度、放熱性、視認性の点でより高特性のものが要求されている。
特開2003-298116号公報
This light-emitting device can emit visible light by causing the light-emitting element 13 to emit light by a drive current supplied from an external electric circuit. In recent years, this light-emitting device has been used for illumination, and a light-emitting device having higher characteristics in terms of high luminance, heat dissipation, and visibility is required.
JP 2003-298116 A

ところで、発光素子14の発光強度の分布は、発光素子14上方の同一平面で比較した場合、発光素子14の直上をピークとして、その周囲で発光強度が一般的に弱くなる。   By the way, when the light emission intensity distribution of the light emitting element 14 is compared on the same plane above the light emitting element 14, the light emission intensity generally decreases around the peak with the peak directly above the light emitting element 14.

このため、上記従来の発光装置の構成において発光装置の発光面となる透光性部材15の上面は、発光素子14の直上に位置する部位で発光強度をピークとして、発光素子14直上の位置から遠ざかるに従い発光強度が弱くなり、発光強度が均一にならないという問題点を有していた。   For this reason, in the structure of the conventional light emitting device, the upper surface of the translucent member 15 serving as the light emitting surface of the light emitting device has a light emission intensity peak at a position located immediately above the light emitting element 14 and from a position directly above the light emitting element 14. As the distance increases, the emission intensity becomes weak, and the emission intensity is not uniform.

従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、高い放射光強度および高輝度を有し、極端に発光強度が強い点のない発光装置を提供することである。   Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and an object of the present invention is to provide a light-emitting device that has high radiated light intensity and high luminance and has no extremely strong light emission intensity. It is.

本発明の発光装置は、上面に発光素子が載置される載置部を有した基体と、該基体の上面に前記載置部を取り囲むように取着された、内周面を光反射面とされた枠体と、前記載置部に載置された前記発光素子と、前記発光素子の上方を覆うように配置された透光性部材とを含んでなる発光装置において、前記透光性部材の上面の、前記発光素子の直上に位置する部位に傾斜面を有する穴部が部分的に設けられることを特徴とする。   The light emitting device of the present invention includes a base having a mounting portion on which a light emitting element is mounted on the upper surface, and an inner peripheral surface attached to the upper surface of the base so as to surround the mounting portion. In the light emitting device, the light transmitting device includes: the frame body configured as described above; the light emitting element placed on the placement portion; and a light transmissive member disposed to cover the light emitting element. A hole portion having an inclined surface is partially provided in a portion of the upper surface of the member located immediately above the light emitting element.

本発明の発光装置において、前記穴部は、逆円錐形状をなすことを特徴とする。   In the light emitting device of the present invention, the hole portion has an inverted conical shape.

本発明の発光装置は、前記穴部の上方に、前記発光素子からの光を波長変換する蛍光体層を形成したことを特徴とする。   The light-emitting device of the present invention is characterized in that a phosphor layer that converts the wavelength of light from the light-emitting element is formed above the hole.

本発明の発光装置は、前記光反射面に、前記発光素子からの光を波長変換する蛍光体層を形成したことを特徴とする。   The light emitting device of the present invention is characterized in that a phosphor layer that converts the wavelength of light from the light emitting element is formed on the light reflecting surface.

本発明の照明装置は、上記本発明の発光装置を光源として用いたことを特徴とする。   The illuminating device of the present invention is characterized by using the light emitting device of the present invention as a light source.

本発明の発光装置は、透光性部材の上面の、発光素子の直上に位置する部位に傾斜面を有する穴部が部分的に設けられることにより、発光素子から発光された光の強度を均一な分布で放射することができる。すなわち、従来の発光装置は上面が平らな透光性部材から形成されていたため、発光強度が特に強い発光素子上面の法線方向に放射された光のほとんどが直接発光装置外部に放出されていたが、本発明の発光装置の構成によると、発光素子の直上に位置する透光性部材の上面に穴部の傾斜面が形成されるため、発光素子から発光素子上面の法線方向に出た光は、発光装置外部に放出される際に、一部の光はそのまま穴部を透過して発光装置外部へ進むが、残りの光は穴部の傾斜面で反射して発光装置内部に再び戻ることができる。そして、発光装置外部に放出されずに発光装置内に反射され戻った光は、その後、枠体の内周面に形成された光反射面でさらに反射されることによって、透光性部材に形成された上面の穴部の周囲から、発光装置外部へ放出される。これにより、透光性部材の上面の中央部から放出される光の強度を低減することができるとともに、穴部および光反射面で反射され、穴部の周囲から放出された光と、発光素子から発せられて、直接穴部の周囲から放出される光とがあわさることによって、透光性部材の上面の外周部から放出される光の強度を増加させることができる。その結果、発光装置外方から発光面を見た場合、発光強度を均一なものとすることができるとともに、視野の中で極端に発光強度が強い点などが形成され難い発光装置とすることができる。   The light-emitting device of the present invention has a uniform intensity of light emitted from the light-emitting element by partially providing a hole portion having an inclined surface in a portion of the upper surface of the translucent member located immediately above the light-emitting element. It can radiate with a simple distribution. That is, since the conventional light emitting device is formed of a translucent member having a flat upper surface, most of the light emitted in the normal direction of the upper surface of the light emitting element having a particularly strong light emission intensity is directly emitted to the outside of the light emitting device. However, according to the configuration of the light-emitting device of the present invention, the inclined surface of the hole is formed on the upper surface of the translucent member positioned immediately above the light-emitting element, so that the light-emitting element protrudes in the normal direction of the upper surface of the light-emitting element. When the light is emitted to the outside of the light emitting device, a part of the light passes through the hole as it is and travels to the outside of the light emitting device, but the remaining light is reflected by the inclined surface of the hole and again enters the light emitting device. You can go back. Then, the light that is reflected back into the light emitting device without being emitted to the outside of the light emitting device is then reflected on the light reflecting surface formed on the inner peripheral surface of the frame, thereby forming the light transmitting member. The light is emitted from the periphery of the hole on the upper surface to the outside of the light emitting device. Thereby, the intensity of light emitted from the central portion of the upper surface of the translucent member can be reduced, the light reflected by the hole and the light reflecting surface and emitted from the periphery of the hole, and the light emitting element The intensity of the light emitted from the outer peripheral portion of the upper surface of the translucent member can be increased by combining the light emitted from and directly emitted from the periphery of the hole. As a result, when the light emitting surface is viewed from the outside of the light emitting device, the light emitting intensity can be made uniform, and a light emitting device in which a point with extremely strong light emitting intensity is not easily formed in the field of view can be obtained. it can.

本発明の発光装置は、穴部が逆円錐形状をなすことにより、発光素子から出た光の強度をさらに均一なものとし、発光装置の発光面での強度ムラを抑制した発光装置とすることができる。これは、穴部を逆円錐形状とすることで発光素子の上面と平行になる面が穴部に形成されないためであり、発光素子の上面の法線方向に出射した光のほとんどが逆円錐に形成された穴部の側面に入射されるため、所望の光を発光装置外部へ透過し、残りの光を光反射面で反射させて、透光性部材の上面から放出される光の強度をさらに低減し調節できる。   The light emitting device of the present invention is a light emitting device in which the hole portion has an inverted conical shape so that the intensity of light emitted from the light emitting element is made more uniform, and intensity unevenness on the light emitting surface of the light emitting device is suppressed. Can do. This is because the hole is formed in an inverted conical shape so that a surface parallel to the upper surface of the light emitting element is not formed in the hole, and most of the light emitted in the normal direction of the upper surface of the light emitting element is an inverted cone. Since it is incident on the side surface of the formed hole, the desired light is transmitted to the outside of the light emitting device, the remaining light is reflected by the light reflecting surface, and the intensity of the light emitted from the upper surface of the translucent member is increased. It can be further reduced and adjusted.

本発明の発光装置は、穴部の上方に、発光素子からの光を波長変換する蛍光体層を形成したことにより、発光素子から出た光が穴部の傾斜面から出射する際、穴部の上方は屈折率のより低い空気層であるため、穴部の上面での光の屈折を大きくして、光を上側の広範囲に広げることができ、蛍光体層に光をまんべんなく均一に照射させることができる。さらに、蛍光体層の下面はより屈折率の低い空気層と接しているので、透光性部材の上面から広範囲に出射した光を蛍光体層の下面に入射する際屈折によって発光素子の上面の法線方向に進行させることができる。よって、蛍光体層を透過する行路長を蛍光体層全体において近似させて波長変換効率の差によって色むらが生じるのを有効に防止できる発光装置とすることができる。   In the light emitting device of the present invention, when the phosphor layer that converts the wavelength of light from the light emitting element is formed above the hole, the light emitted from the light emitting element is emitted from the inclined surface of the hole. Since the air layer above has a lower refractive index, the refraction of light on the upper surface of the hole is increased, and the light can be spread over a wide range on the upper side, so that the phosphor layer is evenly irradiated with light evenly. be able to. Furthermore, since the lower surface of the phosphor layer is in contact with the air layer having a lower refractive index, when light emitted in a wide range from the upper surface of the translucent member is incident on the lower surface of the phosphor layer, refraction is applied to the upper surface of the light emitting element. Can proceed in the normal direction. Therefore, it is possible to obtain a light emitting device that can effectively prevent color unevenness due to a difference in wavelength conversion efficiency by approximating the path length that passes through the phosphor layer in the entire phosphor layer.

本発明の発光装置は、光反射面に、発光素子からの光を波長変換する蛍光体層を形成したことにより、穴部で反射されて発光装置内部へ戻った光および発光素子から直接光反射面に進んで発光装置外部へと放出される光のいずれも光反射面に形成された蛍光体層で効率よく波長変換できるため、色むらの少ない発光面を有する発光装置とすることができる。よって、発光素子から出た光を所望の色に効率よく波長変換できる、極端に強度の強い点を有しない発光装置とすることができる。   In the light emitting device of the present invention, the phosphor layer that converts the wavelength of light from the light emitting element is formed on the light reflecting surface, so that the light reflected by the hole and returned to the inside of the light emitting device and the light reflected directly from the light emitting element. Since any of the light that travels to the surface and is emitted to the outside of the light emitting device can be efficiently wavelength-converted by the phosphor layer formed on the light reflecting surface, a light emitting device having a light emitting surface with less color unevenness can be obtained. Therefore, a light-emitting device that can efficiently convert the wavelength of light emitted from the light-emitting element into a desired color and does not have an extremely strong point can be obtained.

本発明の照明装置は、上記本発明の発光装置を光源として用いたことから、放射光強度および輝度が高く、極端に発光強度の強い点などを有しない均一な光強度分布の発光面を持つ照明装置とすることができる。   Since the illumination device of the present invention uses the light-emitting device of the present invention as a light source, it has a light-emitting surface with a uniform light intensity distribution that has high radiated light intensity and brightness, and does not have an extremely strong point of light emission intensity. It can be set as a lighting device.

本発明の発光装置について以下に詳細に説明する。図1は本発明の発光装置について実施の形態の一例を示す断面図で、図2は図1の発光装置の分解図である。図1と図2において、2は基体、2bは配線導体、3は枠体、4は発光素子、5は透光性部材、6は穴部であり、これらで発光素子4を収容した発光装置1が主に構成されている。   The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting device of the present invention, and FIG. 2 is an exploded view of the light emitting device of FIG. 1 and FIG. 2, 2 is a base, 2 b is a wiring conductor, 3 is a frame body, 4 is a light emitting element, 5 is a translucent member, and 6 is a hole, and a light emitting device in which the light emitting element 4 is accommodated 1 is mainly composed.

本発明の発光装置1は、上面に発光素子4が載置される載置部2aを有した基体2と、基体2の上面に載置部2aを取り囲むように取着された、内周面3aが光反射面とされた枠体3と、載置部2aに載置された発光素子4と、発光素子4の上方を覆うように配置された透光性部材5とを具備しており、透光性部材5の上面の、発光素子4の直上に位置する部位に傾斜面を有する穴部6が設けられている。   The light-emitting device 1 of the present invention includes a base 2 having a mounting portion 2a on which the light-emitting element 4 is mounted on the upper surface, and an inner peripheral surface attached to the upper surface of the base 2 so as to surround the mounting portion 2a. 3a includes a frame 3 having a light reflecting surface, a light emitting element 4 mounted on the mounting portion 2a, and a translucent member 5 disposed so as to cover the upper side of the light emitting element 4. A hole 6 having an inclined surface is provided in a portion of the upper surface of the translucent member 5 located immediately above the light emitting element 4.

本発明の基体2は、例えば酸化アルミニウム質焼結体(アルミナセラミックス)、窒化アルミニウム質焼結体、ガラスセラミックス等のセラミックス等から成り、発光素子4を支持し載置するための支持部材および発光素子4の熱を放熱させるための放熱部材として機能する。   The substrate 2 of the present invention is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, glass ceramics, and the like, and a support member for supporting and placing the light emitting element 4 and a light emitting element. It functions as a heat radiating member for radiating the heat of the element 4.

また、基体2には発光素子4の載置部2aが設けられおり、この載置部2aには、発光素子4が樹脂接着剤や錫(Sn)−鉛(Pb)半田、金(Au)−Sn等の低融点ロウ材等を介して取着される。   The base 2 is provided with a mounting portion 2a for the light emitting element 4. The light emitting element 4 is provided with a resin adhesive, tin (Sn) -lead (Pb) solder, gold (Au) on the mounting portion 2a. -It is attached via a low melting point brazing material such as Sn.

また、基体2の載置部2aの近傍からは、発光装置1の外側にかけて導出する配線導体2bが形成されている。   Further, a wiring conductor 2 b led out from the vicinity of the mounting portion 2 a of the base body 2 to the outside of the light emitting device 1 is formed.

配線導体2bは、例えば、タングステン(W),モリブデン(Mo),マンガン(Mn),銅(Cu)等のメタライズ層で形成されており、W等の粉末に有機溶剤、溶媒を添加混合して得た金属ペーストを、所定パターンに印刷塗布等することによって基体2に形成する。   The wiring conductor 2b is formed of, for example, a metallized layer such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu). An organic solvent or a solvent is added to and mixed with powder such as W. The obtained metal paste is formed on the substrate 2 by printing and applying it in a predetermined pattern.

また、配線導体2bの表面には、酸化防止の目的、あるいは発光素子4と電気的に接続する際に半田等を強固に接続する目的のために、厚さ0.5〜9μmのNi層や厚さ0.5〜5μmのAu層等の金属層をメッキ法により被着させておくと良い。   Further, on the surface of the wiring conductor 2b, for the purpose of preventing oxidation or for the purpose of firmly connecting solder or the like when electrically connected to the light emitting element 4, a Ni layer having a thickness of 0.5 to 9 μm or A metal layer such as an Au layer having a thickness of 0.5 to 5 μm is preferably deposited by a plating method.

枠体3は、アルミニウム(Al),ステンレス(SUS),銀(Ag),鉄(Fe)−ニッケル(Ni)−コバルト(Co)合金,Fe−Ni合金等の金属や樹脂、セラミックス等から成る。なお、枠体3が金属からなる場合、内周面3aを研磨等の方法で鏡面化することにより、内周面3aを発光素子4から発せられる光を良好に反射できる反射面とすることができ、その製造方法は、上記のような材料のインゴットに切削加工、圧延加工や打ち抜き加工等の従来周知の金属加工を施すことによって、所定形状に形成されることによる。なお、発光素子4から発せられる光を高効率で反射する内周面3aを、より簡単に製造することができ、さらに酸化等により腐食することを防止できるため、枠体3はAlやSUSから成ることが好ましい。   The frame 3 is made of metal such as aluminum (Al), stainless steel (SUS), silver (Ag), iron (Fe) -nickel (Ni) -cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, or the like. . In addition, when the frame 3 is made of metal, the inner peripheral surface 3a is made a mirror surface by a method such as polishing, so that the inner peripheral surface 3a can be a reflective surface that can favorably reflect light emitted from the light emitting element 4. The manufacturing method can be obtained by forming a predetermined shape by subjecting the ingot of the material as described above to metal processing such as cutting, rolling and punching. In addition, since the inner peripheral surface 3a that reflects light emitted from the light emitting element 4 with high efficiency can be more easily manufactured, and further, it can be prevented from corroding due to oxidation or the like, the frame 3 is made of Al or SUS. Preferably it consists of:

また、枠体3が樹脂やセラミックスからなる場合、内周面3aにメッキや蒸着等で金属層を形成することにより、内周面3aを発光素子4から発せられる光を良好に反射できる反射面とすることができる。   Further, when the frame 3 is made of resin or ceramics, the inner peripheral surface 3a is formed with a metal layer by plating, vapor deposition, or the like, so that the inner peripheral surface 3a can reflect light emitted from the light emitting element 4 well. It can be.

そして、枠体3は、基体2にシリコーン系やエポキシ系等の樹脂接着剤や、Ag−Cuロウ等の金属ロウ材やPb−Au−Sn,Au−Sn−ケイ素(Si),Sn−Ag−Cu等の半田等で接合される。なお、このような接着剤や半田等の接合材は、基体2や枠体3の材質や熱膨張係数等を考慮して適宜選定すればよく、特に限定されるものではない。また、基体2と枠体3との接合の高信頼性が必要とされる場合、好ましくは金属ロウ材や半田により接合するのがよい。   The frame 3 is formed on the base 2 with a resin adhesive such as silicone or epoxy, a metal brazing material such as Ag-Cu brazing, Pb-Au-Sn, Au-Sn-silicon (Si), Sn-Ag. -Joined with solder such as Cu. Such a bonding material such as adhesive and solder may be appropriately selected in consideration of the material of the base 2 and the frame 3, the thermal expansion coefficient, and the like, and is not particularly limited. Further, when high reliability of bonding between the base body 2 and the frame body 3 is required, it is preferable to bond them with a metal brazing material or solder.

発光素子4は、放射するエネルギーのピーク波長が紫外線域から赤外線域までのいずれのものでもよいが、白色光や種々の色の光を視感性よく放出させるという観点から300乃至500nmの近紫外系から青色系で発光する素子であるのがよい。例えば、サファイア基板上にガリウム(Ga)−窒素(N),Al−Ga−N,インジウム(In)−GaN等から構成されるバッファ層,N型層,発光層,P型層を順次積層した窒化ガリウム系化合物半導体やシリコンカーバイト系化合物半導体が用いられる。   The light emitting element 4 may have any peak wavelength of energy to be emitted from the ultraviolet region to the infrared region. However, from the viewpoint of emitting white light and light of various colors with good visibility, a near ultraviolet system of 300 to 500 nm is used. To an element that emits blue light. For example, a buffer layer composed of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, etc., an N-type layer, a light-emitting layer, and a P-type layer are sequentially stacked on a sapphire substrate. A gallium nitride compound semiconductor or a silicon carbide compound semiconductor is used.

透光性部材5は、紫外光領域から可視光領域の光に対して透過率の高いシリコーン樹脂,エポキシ樹脂,ユリア樹脂等の透明樹脂や、低融点ガラス,ゾル−ゲルガラス等の透明ガラス等から成り、枠体3の内側に発光素子4を被覆するように充填される。透光性部材5を充填することにより、発光素子4の内側と外側との屈折率差が小さくなり、発光素子4から透光性部材5に効率よく光を取り出すことができるとともに、発光素子4の保護部材として機能させることができる。   The translucent member 5 is made of a transparent resin such as a silicone resin, an epoxy resin, or a urea resin that has a high transmittance with respect to light in the ultraviolet light region to the visible light region, a transparent glass such as a low-melting glass, a sol-gel glass, or the like. It fills so that the light emitting element 4 may be coat | covered inside the frame 3. FIG. By filling the translucent member 5, the difference in refractive index between the inner side and the outer side of the light emitting element 4 is reduced, and light can be efficiently extracted from the light emitting element 4 to the translucent member 5. It can be made to function as a protective member.

また、透光性部材5の上面の、発光素子4の直上に位置する部位に傾斜面を有する穴部6が設けられている。ここで発光強度が特に強い発光素子上面の法線方向に放射された光が発光装置外部に放出されるまでの経路について着目すると、従来の発光装置では図13に示すように、上面が平らな透光性部材15から直接発光装置11の外部に放出されるため、発光装置の外方から発光面を見ると、発光素子14の直上に位置する部位で発光強度をピークとして、発光素子14直上の位置から遠ざかるに従い発光強度が弱くなって、発光強度が均一にならない。しかしながら、本発明の発光装置1の構成では、透光性部材5の上面の発光素子4の直上に位置する部位に傾斜面を有する穴部6を設けるため、発光素子4から発光素子4上面の法線方向に出た光は、発光装置1の外部に放出される際に、一部の光はそのまま穴部6を透過して発光装置1の外部へ進むが、残りの光は穴部6の傾斜面で反射して発光装置1の内部に再び戻ることができる。そして、発光装置1の外部に放出されずに発光装置1の内部に反射され戻った光は、その後、枠体3の内周面3aに形成された光反射面でさらに反射されることによって、穴部6の周囲に位置する透光性部材5の上面から、発光装置1の外方へ放出される。これにより、透光性部材5の上面の中央部から放出される光の強度を低減することができるとともに、穴部6および光反射面で反射され、穴部6の周囲から放出された光と、発光素子4から発せられて、直接穴部6の周囲から放出される光とがあわさることによって、透光性部材5の上面の外周部から放出される光の強度を増加させることができる。その結果、発光装置1の外方から発光面を見た場合、発光強度を均一なものとすることができるとともに、視野の中で極端に発光強度が強い点などが形成され難い発光装置1とできる。   In addition, a hole 6 having an inclined surface is provided in a portion of the upper surface of the translucent member 5 located immediately above the light emitting element 4. Here, when attention is paid to the path through which light emitted in the normal direction of the upper surface of the light emitting element having particularly high emission intensity is emitted to the outside of the light emitting device, the upper surface of the conventional light emitting device is flat as shown in FIG. Since the light emitting surface is directly emitted from the translucent member 15 to the outside of the light emitting device 11, when the light emitting surface is viewed from the outside of the light emitting device, the light emission intensity reaches a peak at a portion located directly above the light emitting element 14 and immediately above the light emitting element 14. As the distance from the position increases, the emission intensity decreases and the emission intensity does not become uniform. However, in the configuration of the light emitting device 1 according to the present invention, since the hole 6 having the inclined surface is provided in the portion located immediately above the light emitting element 4 on the upper surface of the translucent member 5, the light emitting element 4 to the upper surface of the light emitting element 4 are provided. When the light emitted in the normal direction is emitted to the outside of the light emitting device 1, a part of the light passes through the hole 6 as it is and proceeds to the outside of the light emitting device 1. It is possible to return to the inside of the light emitting device 1 by being reflected by the inclined surface. Then, the light reflected and returned to the inside of the light emitting device 1 without being emitted to the outside of the light emitting device 1 is then further reflected by the light reflecting surface formed on the inner peripheral surface 3a of the frame 3, The light is emitted from the upper surface of the translucent member 5 positioned around the hole 6 to the outside of the light emitting device 1. Thereby, while being able to reduce the intensity | strength of the light discharge | released from the center part of the upper surface of the translucent member 5, it reflects with the hole 6 and the light reflection surface, and the light discharge | released from the circumference | surroundings of the hole 6 The intensity of the light emitted from the outer peripheral portion of the upper surface of the translucent member 5 can be increased by the light emitted from the light emitting element 4 and directly emitted from the periphery of the hole 6. . As a result, when the light-emitting surface is viewed from the outside of the light-emitting device 1, the light-emitting intensity can be made uniform, and the light-emitting device 1 that is difficult to form a point where the light-emission intensity is extremely strong in the field of view. it can.

また、穴部6の傾斜面の接線と発光素子4の上面の法線とのなす角をθとすると、正弦値は0.5≦sinθ≦0.8とするのが好ましい。正弦値が0.8より大きいと、穴部6の傾斜面が、発光素子4の上面に対して平行に近づき、発光素子4の上面から法線方向に出た光を十分に発光装置内部に反射できず、ほとんどの光が発光装置外部へ直接穴部6から放出されるため、光の強度ムラを抑制し難い。また、穴部6の傾斜面の接線と発光素子4の上面の法線とのなす角θが90度より小さく正弦値が0.5未満の場合は、発光素子4から出た光のほとんどが傾斜面で全反射するため発光面で発光強度ムラが生じやすくなる。   Further, when the angle formed by the tangent line of the inclined surface of the hole 6 and the normal line of the upper surface of the light emitting element 4 is θ, the sine value is preferably 0.5 ≦ sin θ ≦ 0.8. If the sine value is larger than 0.8, the inclined surface of the hole 6 approaches the upper surface of the light emitting element 4 in parallel, and the light emitted in the normal direction from the upper surface of the light emitting element 4 is sufficiently introduced into the light emitting device. Since most of the light cannot be reflected and is emitted directly from the hole 6 to the outside of the light emitting device, it is difficult to suppress unevenness of the light intensity. When the angle θ formed by the tangent to the inclined surface of the hole 6 and the normal line of the upper surface of the light emitting element 4 is smaller than 90 degrees and the sine value is less than 0.5, most of the light emitted from the light emitting element 4 is obtained. Since the light is totally reflected on the inclined surface, unevenness in light emission intensity is likely to occur on the light emitting surface.

また、図8のような穴部6の形状の場合、穴部6の傾斜面の接線と発光素子4の上面の法線とのなす角θが90度より大きくなる場合が考えられるが、この場合も正弦値を0.5以上とするのがよい。正弦値が0.5未満の場合は、穴部6で反射して発光装置内に戻った光が内周面3aから発光装置外部へ出る際にさらに全反射が生じやすくなり、発光装置内に多くの光が閉じ込められて発光強度が小さくなりやすいためである。   In the case of the shape of the hole 6 as shown in FIG. 8, the angle θ formed by the tangent to the inclined surface of the hole 6 and the normal to the upper surface of the light emitting element 4 may be larger than 90 degrees. Even in this case, the sine value should be 0.5 or more. When the sine value is less than 0.5, total reflection is more likely to occur when the light reflected from the hole 6 and returned to the light emitting device exits from the inner peripheral surface 3a to the outside of the light emitting device. This is because much light is confined and the emission intensity tends to be small.

また、穴部6の最大内径は、透光性部材5の最大外径の10%以上70%以下とするのが好ましい。70%より大きいと、穴部6の開口径が大きくなりすぎて、発光素子4の直上の周囲に位置する穴部6から発光装置外部へ放出される強度の強い光が減少し、発光面での強度ムラが生じやすくなる。また、10%より小さいと、発光素子4の上面の法線方向に出射された強度の強い光が十分に穴部6に入射せずに直接、穴部6の周囲に位置する発光素子4の上面に対して平行に近い透光性部材5の上面に入射し、発光装置外部へ放出される。よって発光素子4の上面の法線方向に出射された光の強度を弱めることができず、発光面での強度ムラを有効に抑制し難い。   The maximum inner diameter of the hole 6 is preferably 10% or more and 70% or less of the maximum outer diameter of the translucent member 5. If it is larger than 70%, the aperture diameter of the hole 6 becomes too large, and light with strong intensity emitted from the hole 6 positioned immediately above the light emitting element 4 to the outside of the light emitting device is reduced. The unevenness of strength is likely to occur. On the other hand, if it is smaller than 10%, the light of strong intensity emitted in the normal direction of the upper surface of the light emitting element 4 does not sufficiently enter the hole 6 and the light emitting element 4 positioned directly around the hole 6 The light enters the upper surface of the translucent member 5 that is nearly parallel to the upper surface and is emitted to the outside of the light emitting device. Therefore, the intensity of the light emitted in the normal direction of the upper surface of the light emitting element 4 cannot be reduced, and it is difficult to effectively suppress the intensity unevenness on the light emitting surface.

また、穴部6の深さは、穴部6と発光素子4との距離の10%以上90%以下とするのがよい。   Further, the depth of the hole 6 is preferably 10% or more and 90% or less of the distance between the hole 6 and the light emitting element 4.

またさらに、枠体3の内側に発光素子4を覆うようにして充填した透光性部材5は、発光素子4から出た光が、屈折率差が小さい経路を通って発光装置外部へ放出されるように、発光素子4,透光性部材5の順に屈折率を順次小さくするのが好ましい。   Further, the translucent member 5 filled inside the frame 3 so as to cover the light emitting element 4 emits light emitted from the light emitting element 4 to the outside of the light emitting device through a path having a small refractive index difference. As described above, it is preferable to sequentially reduce the refractive index in the order of the light emitting element 4 and the translucent member 5.

また、穴部6の内周面は凹状であっても図3に示すように凸状であってもよく、図6に示すようにその内部はシリコーン樹脂やフッ素系樹脂などの透光性部材5より屈折率の小さい部材8で充填されていてもよい。部材8で穴部6を充填することにより、発光素子4の作動時に生じた熱で透光性部材5が歪もうとしても部材8が歪みを有効に抑制し、さらに、透光性部材5よりも屈折率の小さい部材8を用いることで、透光性部材5から穴部6へ光が出射する際、穴部6の内面での光の屈折を大きくして、光を上側の広範囲に広げ、発光素子4直上に位置する透光性部材5の上面の発光強度が周囲に比べて強くなることを抑制し、発光強度にむらが生じるのを有効に防止できる。   Further, the inner peripheral surface of the hole 6 may be concave or convex as shown in FIG. 3, and the inside thereof is a translucent member such as silicone resin or fluorine resin as shown in FIG. It may be filled with a member 8 having a refractive index lower than 5. By filling the hole 6 with the member 8, the member 8 effectively suppresses the distortion even if the light transmissive member 5 tries to distort due to the heat generated during the operation of the light emitting element 4. In addition, by using the member 8 having a small refractive index, when light is emitted from the translucent member 5 to the hole 6, the light refraction at the inner surface of the hole 6 is increased, and the light is spread over a wide range on the upper side. Further, it is possible to suppress the emission intensity of the upper surface of the translucent member 5 positioned immediately above the light emitting element 4 from becoming stronger than the surroundings, and to effectively prevent unevenness in the emission intensity.

また、発光素子4から出た光と蛍光体層で波長変換された光とを混色する場合には、所望の比率で光を混色するために、蛍光体層の大きさを調整する場合がある。特に穴部6の径よりも大きさが小さい蛍光体層を発光装置の上方に設ける場合には、上記のように穴部6を部材8で充填して配置することで、均一な発光強度を有するとともに、所望の比率で光を混色できる発光装置とすることができる。このような部材8は、紫外光領域から可視光領域の光に対して透過率の高いシリコーン樹脂,エポキシ樹脂,ユリア樹脂等の透明樹脂や、低融点ガラス,ゾル−ゲルガラス等の透明ガラス等から成るのがよい。   In addition, when the light emitted from the light emitting element 4 and the light whose wavelength is converted by the phosphor layer are mixed, the size of the phosphor layer may be adjusted in order to mix the light at a desired ratio. . In particular, when a phosphor layer having a size smaller than the diameter of the hole 6 is provided above the light emitting device, the hole 6 is filled with the member 8 as described above, thereby providing a uniform emission intensity. And a light emitting device capable of mixing light at a desired ratio. Such a member 8 is made of a transparent resin such as a silicone resin, an epoxy resin, or a urea resin having a high transmittance with respect to light in the ultraviolet light region to the visible light region, a transparent glass such as a low melting glass, a sol-gel glass, or the like. It is good to be.

また、穴部6の製造方法は、例えば、穴部6の形状に成形された型に、熱硬化性の液状の透明部材を充填し、その後加熱硬化して得る。また穴部6を製造する別の方法としては、透光性部材を枠体の内側に充填し、半硬化状態のうちに穴部6を形成する位置に穴部6の成形型を押し当て、透光性部材5を硬化後、型を引き剥がすことにより、所望の形状の穴部6を形成する等の方法がある。   Moreover, the manufacturing method of the hole part 6 is obtained by, for example, filling a mold formed in the shape of the hole part 6 with a thermosetting liquid transparent member and then heat-curing the mold. Moreover, as another method of manufacturing the hole 6, the translucent member is filled inside the frame, and the mold of the hole 6 is pressed to the position where the hole 6 is formed in the semi-cured state. There is a method of forming the hole 6 having a desired shape by peeling the mold after the light-transmitting member 5 is cured.

また、穴部6の上方に蛍光体層7bを設けても良い。穴部6の上方に蛍光体層7bを設けることで、発光素子4から出た光が穴部6の傾斜面から出射する際、穴部6の上方は屈折率のより低い空気層であるため、穴部6の上面での光の屈折を大きくして、光を上側の広範囲に広げることができ、蛍光体層7bに光をまんべんなく均一に照射させることができる。さらに、蛍光体層7bの下面は、より屈折率の低い空気層と接しているので、透光性部材5の上面から広範囲に出射した光を蛍光体層7bの下面に入射する際屈折によって発光素子4の上面の法線方向に進行させることができる。よって、蛍光体層7bを透過する行路長を蛍光体層7b全体において近似させて波長変換効率の差によって色むらが生じるのを有効に防止できる発光装置1とすることができる。   Further, the phosphor layer 7 b may be provided above the hole 6. By providing the phosphor layer 7b above the hole portion 6, when the light emitted from the light emitting element 4 is emitted from the inclined surface of the hole portion 6, the upper portion of the hole portion 6 is an air layer having a lower refractive index. The refraction of the light on the upper surface of the hole 6 can be increased to spread the light over a wide range on the upper side, and the phosphor layer 7b can be evenly irradiated with light evenly. Furthermore, since the lower surface of the phosphor layer 7b is in contact with the air layer having a lower refractive index, light emitted from a wide range from the upper surface of the translucent member 5 is emitted by refraction when entering the lower surface of the phosphor layer 7b. It can progress in the normal direction of the upper surface of the element 4. Therefore, it is possible to make the light emitting device 1 that can effectively prevent color unevenness due to the difference in wavelength conversion efficiency by approximating the path length that transmits the phosphor layer 7b in the entire phosphor layer 7b.

ここで蛍光体層7bは、紫外光領域から可視光領域の光に対して透過率の高いシリコーン樹脂,エポキシ樹脂,ユリア樹脂等の透明樹脂や、低融点ガラス,ゾル−ゲルガラス等の透明ガラス等の透明部材に、発光素子4の光で励起され電子の再結合により青色,赤色,緑色等に発光する、例えば、アルカリ土類アルミン酸塩蛍光体や、希土類元素から選択された少なくとも一種の元素で付活されたイットリウム・アルミニウム・ガーネット系蛍光体等の蛍光体や顔料等の蛍光体が含有されている。そして、蛍光体や顔料を任意の割合で配合することにより、所望の発光スペクトルと色を有する光を出力する。   Here, the phosphor layer 7b is made of a transparent resin such as a silicone resin, an epoxy resin, or a urea resin having a high transmittance with respect to light in the ultraviolet light region to the visible light region, a transparent glass such as a low-melting glass, a sol-gel glass, or the like. At least one element selected from, for example, alkaline earth aluminate phosphors and rare earth elements, which is excited by the light of the light emitting element 4 and emits blue, red, green, etc. by recombination of electrons. Phosphors such as yttrium, aluminum, and garnet phosphors activated in the above, and phosphors such as pigments. And the light which has a desired light emission spectrum and a color is output by mix | blending fluorescent substance and a pigment in arbitrary ratios.

またさらに、枠体3の光反射面とされた内周面3aに蛍光体層7aを設けても良い。内周面3aに蛍光体層7aを設けることで、穴部6で反射されて発光装置1内部へ戻った光および発光素子4から直接内周面3aに進んで発光装置1の外部へと放出される光のいずれも内周面3aに形成された蛍光体層7aで効率よく波長変換できるため、色ムラの少ない発光面を有する発光装置1とすることができる。   Furthermore, the phosphor layer 7 a may be provided on the inner peripheral surface 3 a that is the light reflecting surface of the frame 3. By providing the phosphor layer 7 a on the inner peripheral surface 3 a, the light reflected by the hole 6 and returned to the inside of the light emitting device 1 and the light emitted from the light emitting element 4 directly to the inner peripheral surface 3 a and emitted to the outside of the light emitting device 1. Since any of the emitted light can be efficiently wavelength-converted by the phosphor layer 7a formed on the inner peripheral surface 3a, the light emitting device 1 having a light emitting surface with little color unevenness can be obtained.

また、特に、図4と図4の分解図である図5に示すように穴部6の上方と内周面3aとの両方に蛍光体層7a,7bが設けられるのが好ましい。なぜなら、穴部6を透過した光を穴部6の上方に設けた蛍光体層7bで波長変換し、また、穴部6で反射されて発光装置1の内部へ戻った光および発光素子4から直接内周面3aに進んで発光装置1の外部へと放出される光のいずれも内周面3aに形成された蛍光体層7aで効率よく波長変換できるため、均一な強度の発光面を有する発光装置1とすることができるためである。これは、一般的に入射光に対して蛍光体層で波長変換できる光の割合には限界があるためであり、仮に強度が強すぎる光が蛍光体層7bに入射すると、入射光に対して波長変換できる光の量が飽和し波長変換効率が悪くなる。しかしながら、本発明のように透光性部材5の上面の発光素子4の直上に位置する部位に傾斜面を有する穴部6が設けられることで、法線方向に出た強度の強い光の一部を穴部6の傾斜面で発光装置1の内部へ反射させて蛍光体層7bに入射する光の量を調節できるため、蛍光体層7bでは光を効率よく波長変換することができる。そして、前述のように穴部6で反射された光および発光素子4から直接内周面3aに進んだ光も蛍光体層7aで波長変換できるため、発光素子4から出た光を所望の色に効率よく波長変換できる、極端に発光強度の強い点を有しない発光装置1とすることができる。   In particular, as shown in FIG. 5 which is an exploded view of FIGS. 4 and 4, it is preferable that phosphor layers 7a and 7b are provided both above the hole 6 and on the inner peripheral surface 3a. This is because the wavelength of the light transmitted through the hole 6 is converted by the phosphor layer 7 b provided above the hole 6, and the light reflected from the hole 6 and returned to the inside of the light emitting device 1 and the light emitting element 4 are used. Since any of the light that travels directly to the inner peripheral surface 3a and is emitted to the outside of the light emitting device 1 can be efficiently wavelength-converted by the phosphor layer 7a formed on the inner peripheral surface 3a, the light emitting surface has a uniform intensity. This is because the light emitting device 1 can be obtained. This is because the ratio of light that can be wavelength-converted by the phosphor layer with respect to the incident light is generally limited, and if light with too high intensity is incident on the phosphor layer 7b, The amount of light that can be wavelength-converted is saturated and the wavelength conversion efficiency deteriorates. However, since the hole 6 having the inclined surface is provided in the portion located on the upper surface of the translucent member 5 just above the light emitting element 4 as in the present invention, one of the strong light emitted in the normal direction is provided. Since the amount of light incident on the phosphor layer 7b can be adjusted by reflecting the portion to the inside of the light emitting device 1 with the inclined surface of the hole 6, the phosphor layer 7b can efficiently convert the wavelength of light. As described above, the light reflected from the hole 6 and the light directly traveling from the light emitting element 4 to the inner peripheral surface 3a can be wavelength-converted by the phosphor layer 7a, so that the light emitted from the light emitting element 4 can be converted into a desired color. Therefore, the light emitting device 1 can be efficiently wavelength-converted and has no extremely strong light emission intensity.

また、図7(a)に示すように、透光性部材5の上面全体を窪ませて、発光素子4の直上に位置する部位に傾斜面を有する穴部6を設けてもよい。なぜなら、発光素子4の上面の法線方向に出た強度の強い光は、透光性部材5の上方は屈折率のより低い空気層であるため、穴部6の内周面で光の屈折を大きくして、光を上側の広範囲に広げることができ、さらに穴部6の周囲に進んだ光も透光性部材5の上面全体に設けられた窪みによって、広範囲に広げることができる。よって、発光装置の発光強度が一点で極端に強くなることをさらに有効に抑制できるとともにさらに広範囲に光を放出できる発光装置とすることができる。   Further, as shown in FIG. 7A, the entire upper surface of the translucent member 5 may be recessed, and a hole 6 having an inclined surface may be provided at a portion located directly above the light emitting element 4. This is because the strong light emitted in the normal direction of the upper surface of the light emitting element 4 is refracted on the inner peripheral surface of the hole 6 because the upper part of the translucent member 5 is an air layer having a lower refractive index. Can be expanded to spread light over a wide range on the upper side, and the light that has traveled around the hole 6 can also be spread over a wide range by the depression provided on the entire top surface of the translucent member 5. Therefore, it is possible to further effectively suppress the light emission intensity of the light emitting device from becoming extremely strong at one point, and to obtain a light emitting device capable of emitting light over a wider range.

また、図7(b)に示すように透光性部材5の上方に蛍光体層7cを設ける場合、発光素子4から出た光は、穴部6の傾斜面および透光性部材5の上面に設けられた窪みから出射する際に広範囲に広げられているため、蛍光体層7cにまんべんなく照射される。さらに、蛍光体層7cの下面は、より屈折率の低い空気層と接しているので、穴部6の傾斜面および透光性部材5の上面に設けられた窪みから広範囲に出射した光は、蛍光体層7cの下面に入射する際屈折によって発光素子4の上面の法線方向に進行させることができる。よって、蛍光体層7c全体にまんべんなく光を入射させるとともに透過する光の行路長を蛍光体層7c全体において近似させて波長変換効率の差によって色むらが生じるのを有効に防止できる発光装置1とすることができる。   Further, when the phosphor layer 7 c is provided above the translucent member 5 as shown in FIG. 7B, the light emitted from the light emitting element 4 is emitted from the inclined surface of the hole 6 and the upper surface of the translucent member 5. Since the light is spread over a wide range when emitted from the recess provided in the fluorescent material, the phosphor layer 7c is evenly irradiated. Further, since the lower surface of the phosphor layer 7c is in contact with the air layer having a lower refractive index, the light emitted in a wide range from the depression provided on the inclined surface of the hole 6 and the upper surface of the translucent member 5 is: When entering the lower surface of the phosphor layer 7c, it can be advanced in the normal direction of the upper surface of the light emitting element 4 by refraction. Therefore, the light emitting device 1 can uniformly prevent the occurrence of color unevenness due to the difference in wavelength conversion efficiency by making the entire phosphor layer 7c have light incident uniformly and approximating the path length of the transmitted light in the entire phosphor layer 7c. can do.

また、発光素子4から出た光を反射して外部に放射できる枠体3の内周面3aは、基体2の上面に対して35〜70度の角度で傾斜しているのが好ましい。なぜなら、35度未満であると、発光素子4から蛍光体層6への入射角度が45度を超え、透光性部材5と蛍光体層6との界面で全反射される光の量が多くなるからである。一方、内周面3aは、基体2の上面となす角度が70度を超えると、透光性部材5と蛍光体層6との界面で全反射される光の量が多くなる。これらの結果、上記のような範囲に枠体3の内周面3aを傾斜させると、透光性部材5から蛍光体層6への透過率が増加するとともに、蛍光体層6に発光素子4の光が良好に入射されやすくなるため好ましい。   The inner peripheral surface 3 a of the frame 3 that can reflect the light emitted from the light emitting element 4 and emit the light to the outside is preferably inclined at an angle of 35 to 70 degrees with respect to the upper surface of the base 2. This is because if the angle is less than 35 degrees, the incident angle from the light emitting element 4 to the phosphor layer 6 exceeds 45 degrees, and the amount of light totally reflected at the interface between the translucent member 5 and the phosphor layer 6 is large. Because it becomes. On the other hand, when the angle between the inner peripheral surface 3a and the upper surface of the substrate 2 exceeds 70 degrees, the amount of light totally reflected at the interface between the translucent member 5 and the phosphor layer 6 increases. As a result, when the inner peripheral surface 3a of the frame 3 is tilted within the range as described above, the transmittance from the translucent member 5 to the phosphor layer 6 increases and the phosphor layer 6 has the light emitting element 4 on it. This is preferable because it is easy to make good incident light.

また、枠体3の内周面3aの形状が四角錐状である場合は、少なくとも一対の対向する内面が基体2の上面に対して35〜70度で傾斜しているのがよい。好ましくは、枠体3の内周面3aの全面が基体2の上面に対して35〜70度で傾斜しているのがよい。これにより、発光装置1は、発光効率をきわめて高いものとすることができる。   When the shape of the inner peripheral surface 3 a of the frame 3 is a quadrangular pyramid, it is preferable that at least a pair of opposed inner surfaces be inclined at 35 to 70 degrees with respect to the upper surface of the base 2. Preferably, the entire inner peripheral surface 3 a of the frame 3 is inclined at 35 to 70 degrees with respect to the upper surface of the base 2. Thereby, the light-emitting device 1 can make luminous efficiency very high.

次に、本発光装置の製造方法例を示す。まず、基体2と枠体3との接着面に接着剤を塗布し、基体2の上面に枠体3を載置した後、接着剤を完全に硬化させることで基体2および枠体3とを強固に接着し、発光素子収納パッケージを作製する。   Next, an example of a method for manufacturing the light emitting device will be described. First, an adhesive is applied to the bonding surface between the base 2 and the frame 3, the frame 3 is placed on the upper surface of the base 2, and then the base 2 and the frame 3 are bonded by completely curing the adhesive. Adhering firmly, a light emitting element storage package is manufactured.

その後、基体2の上面の発光素子の載置部2aに発光素子4を載置し、発光素子4と配線導体2bとをロウ材や半田、または金属等を用いた導電性部材を介して電気的に接続し、熱硬化性の透光性部材5を発光素子4を被覆するように枠体3に流し込んだ後、液状で未硬化の透光性部材5の上に、穴部6の形状に成形された型を載置し、その後透光性部材5を加熱し、完全に硬化させた後、型を引き剥がすことによって所望の形状の穴部6を有する、本発明の発光装置となる。   Thereafter, the light emitting element 4 is mounted on the light emitting element mounting portion 2a on the upper surface of the base 2, and the light emitting element 4 and the wiring conductor 2b are electrically connected via a conductive member using brazing material, solder, metal, or the like. After the thermosetting translucent member 5 is poured into the frame 3 so as to cover the light emitting element 4, the shape of the hole 6 is formed on the liquid uncured translucent member 5. The light-emitting device of the present invention having the hole 6 having a desired shape is obtained by placing the mold formed on the substrate, then heating and completely curing the translucent member 5, and then removing the mold. .

また、本発明の発光装置は、1個のものを光源として所定の配置となるように設置したことにより、または複数個を、例えば、格子状や千鳥状,放射状,複数の発光装置から成る、円状や多角形状の発光装置群を同心状に複数群形成したもの等の所定の配置となるように設置したことにより、照明装置とすることができる。   In addition, the light emitting device of the present invention is provided by arranging one light source as a predetermined light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. A lighting device can be obtained by installing the light emitting device groups in a circular shape or a polygonal shape so as to have a predetermined arrangement such as a plurality of concentric groups.

また、本発明の発光装置を光源として所定の配置に設置するとともに、これらの発光装置の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射できる照明装置とすることができる。   In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

そして、複数の発光装置1を所定の配置に設置したことにより、発光面を外方から見た場合に、発光強度を均一なものとでき、視野の中で極端に発光強度の高い点を有し難い照明装置とすることができる。その結果、本発明の照明装置は、安定した放射光強度かつ放射光角度で光を照射することができるとともに、照射面における色むらや照度分布の偏りが抑制された光源と成り得る。これにより、従来の照明装置よりも強度ムラの抑制されたものとすることができる。   Further, by installing the plurality of light emitting devices 1 in a predetermined arrangement, when the light emitting surface is viewed from the outside, the light emission intensity can be made uniform, and there is a point where the light emission intensity is extremely high in the field of view. It can be set as a difficult lighting device. As a result, the illuminating device of the present invention can irradiate light with a stable radiated light intensity and a radiated light angle, and can be a light source in which unevenness in color and uneven illuminance distribution are suppressed. Thereby, intensity unevenness can be suppressed as compared with the conventional lighting device.

例えば、図9,図10に示す平面図,断面図のように複数個の発光装置101が発光装置駆動回路基体102に複数列に配置され、発光装置101の周囲に任意の形状に光学設計した反射治具103が設置されて成る照明装置の場合、隣接する一列上に配置された複数個の発光装置101において、隣り合う発光装置101との間隔が最短に成らないような配置、いわゆる千鳥状とすることが好ましい。即ち、発光装置101が格子状に配置される際には、光源となる発光装置101が直線上に配列されることによりグレアが強くなり、このような照明装置が人の視覚に入ってくることにより、不快感や目の障害を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人間の目に対する不快感や目に及ぼす障害を低減することができる。さらに、隣り合う発光装置101間の距離が長くなることにより、隣接する発光装置101間の熱的な干渉が有効に抑制され、発光装置101が実装された発光装置駆動回路基体102内における熱のこもりが抑制され、発光装置101の外部に効率よく熱が放散される。その結果、人の目に対しても障害の小さく、長期間にわたって光学特性の安定した長寿命の照明装置を作製することができる。   For example, a plurality of light-emitting devices 101 are arranged in a plurality of rows on the light-emitting device driving circuit base 102 as shown in the plan view and the cross-sectional views shown in FIGS. 9 and 10 and optically designed in an arbitrary shape around the light-emitting device 101. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on an adjacent row, an arrangement in which the interval between adjacent light emitting devices 101 is not shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 101 are arranged in a grid pattern, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Further, since the distance between the adjacent light emitting devices 101 is increased, thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and the heat in the light emitting device driving circuit substrate 102 on which the light emitting devices 101 are mounted is reduced. Clouding is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device that has little obstacle to human eyes and has stable optical characteristics over a long period of time.

また、照明装置が、図11,図12に示す平面図,断面図のような発光装置駆動回路基体102上に複数の発光装置101から成る円状や多角形状の発光装置101群を、同心状に複数群形成した照明装置の場合、1つの円状や多角形状の発光装置101群における発光装置101の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置101同士の間隔を適度に保ちながら発光装置101をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置101の密度を低くして発光装置駆動回路基体102の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基体102内における温度分布が一様となり、照明装置を設置した外部電気回路基体やヒートシンクに効率よく熱が伝達され、発光装置101の温度上昇を抑制することができる。その結果、発光装置101は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。   In addition, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit base 102 as shown in the plan view and the sectional view shown in FIGS. In the case of a plurality of lighting devices formed in a group, it is preferable to increase the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group toward the outer peripheral side from the center side of the lighting device. As a result, more light emitting devices 101 can be arranged while maintaining an appropriate interval between the light emitting devices 101, and the illuminance of the lighting device can be further improved. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit base 102. Therefore, the temperature distribution in the light emitting device driving circuit base 102 is uniform, heat is efficiently transmitted to the external electric circuit base or heat sink where the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装,展示用照明器具、街路用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide lights and signaling devices, stage and studio lighting, advertising lights, lighting poles, underwater lighting, strobe lights, spotlights, security lights embedded in power poles, emergency lighting, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行うことは何等支障ない。例えば、枠体3の上面に発光素子4より出射される光を任意に集光し、また拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接着剤等で接合することにより、所望する放射角度で光を取り出すことができるとともに発光装置1の内部への耐浸水性が改善され長期信頼性が向上する。また、枠体3の内周面3aは、その断面形状が平坦(直線状)であってもよく、また、円弧状(曲線状)であってもよい。円弧状とする場合、発光素子4の光を万遍なく反射させて指向性の高い光を外部に均一に放射することができる。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, an optical lens for arbitrarily collecting and diffusing the light emitted from the light emitting element 4 on the upper surface of the frame body 3 or a flat light-transmitting lid body is joined with solder or a resin adhesive. In addition, the light can be extracted at a desired radiation angle, and the water resistance to the inside of the light emitting device 1 is improved, thereby improving the long-term reliability. Further, the inner peripheral surface 3a of the frame 3 may have a flat (straight) cross-sectional shape or an arc (curved). In the case of the circular arc shape, the light of the light emitting element 4 can be uniformly reflected, and light with high directivity can be uniformly emitted to the outside.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 図1の発光装置の分解図である。It is an exploded view of the light-emitting device of FIG. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 図4の発光装置の分解図である。It is an exploded view of the light-emitting device of FIG. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. (a)(b)はそれぞれ本発明の発光装置の実施の形態の他の各種例を示す断面図である。(A) (b) is sectional drawing which shows the other various examples of embodiment of the light-emitting device of this invention, respectively. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の照明装置の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図9の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図11の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. (a)は従来の発光装置の断面図であり、(b)は従来の発光装置を縦に分割したものの斜視図である。(A) is sectional drawing of the conventional light-emitting device, (b) is a perspective view of what divided the conventional light-emitting device vertically.

符号の説明Explanation of symbols

1:発光装置
2:基体
3:枠体
4:発光素子
5:透光性部材
6:穴部
7a,7b,7c:蛍光体層
1: Light emitting device 2: Base body 3: Frame body 4: Light emitting element 5: Translucent member 6: Holes 7a, 7b, 7c: Phosphor layer

Claims (5)

上面に発光素子が載置される載置部を有した基体と、該基体の上面に前記載置部を取り囲むように取着された、内周面を光反射面とされた枠体と、前記載置部に載置された前記発光素子と、前記発光素子の上方を覆うように配置された透光性部材とを含んでなる発光装置において、前記透光性部材の上面の、前記発光素子の直上に位置する部位に傾斜面を有する穴部が部分的に設けられることを特徴とする発光装置。 A base body having a mounting portion on which the light emitting element is mounted on the upper surface, and a frame body that is attached so as to surround the mounting portion on the upper surface of the base body, and whose inner peripheral surface is a light reflecting surface; In the light emitting device including the light emitting element placed on the mounting portion and a light transmissive member arranged to cover the light emitting element, the light emission on the upper surface of the light transmissive member. A light-emitting device, wherein a hole portion having an inclined surface is partially provided in a portion located immediately above an element. 前記穴部は、逆円錐形状をなすことを特徴とする請求項1記載の発光装置。 The light emitting device according to claim 1, wherein the hole has an inverted conical shape. 前記穴部の上方に、前記発光素子からの光を波長変換する蛍光体層を形成したことを特徴とする請求項1または請求項2に記載の発光装置。 The light emitting device according to claim 1, wherein a phosphor layer that converts the wavelength of light from the light emitting element is formed above the hole. 前記光反射面に、前記発光素子からの光を波長変換する蛍光体層を形成したことを特徴とする請求項1乃至請求項3のいずれかに記載の発光装置。 The light-emitting device according to claim 1, wherein a phosphor layer that converts the wavelength of light from the light-emitting element is formed on the light reflecting surface. 請求項1乃至請求項4のいずれかに記載の発光装置を光源として用いたことを特徴とする照明装置。 An illuminating device using the light-emitting device according to claim 1 as a light source.
JP2005081462A 2005-03-22 2005-03-22 Light emitting device and lighting device Expired - Fee Related JP5085851B2 (en)

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