JP2006265599A - Oblique vapor deposition tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an oblique vapor deposition tool capable of solving a problem caused by the oblique vapor deposition. <P>SOLUTION: The oblique vapor deposition tool comprises at least a base, a table on which a work is fixed, a bearing to rotatably fix the table to the base, a scale to check the rotational angle of the table, a means to fix the table, a mask for regulating vapor deposition, and a deposition preventive member to cover portions other than a surface for vapor deposition. In addition, magnets are fixed to a plurality of parts of a work fixing surface of the table, the mask for regulating the vapor deposition is formed of a magnetic material, and a reinforcing ring is provided on the outer circumference. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an oblique deposition jig.

  A liquid crystal panel is formed by bonding two substrates together with a sealant having a spacer, injecting liquid crystal from a liquid crystal injection port formed by a part of the sealant, and sealing the liquid crystal injection port. ing.

  In the structure of the liquid crystal panel, an alignment film is required to align the liquid crystal. The alignment film is composed of either an organic alignment film or an inorganic alignment film. The organic alignment film is usually formed by printing a polyimide liquid on a work (substrate) or by a spinner. In the case of an inorganic alignment film, for example, an SiO film is formed on the work by a vacuum deposition method. Further, the liquid crystal is not aligned only by forming the alignment film. For this reason, in the case of an organic alignment film, the alignment angle is set by rubbing the surface of the alignment film. In the case of an inorganic alignment film, the alignment film is formed by fixing the workpiece at an alignment angle (θ) required during vacuum deposition.

The alignment film and oblique deposition are disclosed in detail. (For example, Patent Document 1)
The description described in Patent Document 1 is cited below. 9 is a schematic cross-sectional view at the time of orientation treatment, FIG. 10 is a schematic front view (A) and a side view (B) showing the arrangement state of the substrate at the time of vapor deposition, and FIG. A sectional view, FIG. 12 is an enlarged view of the substrate of FIG. 10B and its holder, FIG. 13 is a schematic front view (A) and plan view (B) showing the orientation processing direction by vapor deposition, and FIG. FIG. 15 is a schematic front view showing the arrangement state of the substrate at the time of alignment processing on the substrate, FIG. 15 is a schematic front view showing the alignment processing direction, a plan view (B), and FIGS. 16A and 16B are antiparallel. FIG. 17A and FIG. 17B are explanatory diagrams of parallel alignment cells.

  As clearly shown in FIGS. 9 and 10A, the substrate 1 is held in a holder so that the direction 4 of the substrate 1 makes an angle θ, that is, substantially 22.5 degrees in advance with respect to the deposition direction 3 of SiO. 5 is fixed. 7 is a boat, 6 is SiO powder, 8 is a vertical line of the vapor deposition source, and 9 is a normal line of the substrate 1.

  A plurality of substrates 1 are fixed to the inclined bottom surface side of the holder 5 as shown in FIG. Further, the holder 5 is attached to the guide rail 12 along the inner wall of the vacuum chamber 10 with a connecting rod 11 so that it can circulate at any position along the guide rail 12. Reference numeral 13 denotes a power source.

  As described above, the orientation of the substrate 1 is inclined at an angle θ (= 22.5 degrees) with respect to the deposition direction, and the oblique orientation deposition of SiO is performed, whereby the orientation direction of the obtained SiO orientation film 15 is obtained. As shown in FIG. 13, 14 is deviated by an angle θ counterclockwise with respect to the vapor deposition direction. This alignment direction 14 corresponds to the bisector of the angle formed by the two switch states of the liquid crystal director described above.

  Similarly, as shown in FIG. 14, the other substrate 2 is fixed to the holder 5 so as to have a mirror image positional relationship with that of the substrate 1, and SiO oblique deposition is performed. As shown in FIG. 15, the alignment direction 14 ′ of the obtained SiO alignment film 16 is shifted clockwise by an angle θ with respect to the Y direction.

  As shown in FIGS. 16 and 17, the alignment processing directions 14 and 14 ′ of the alignment films 14 and 15 obtained above are mirror images (FIG. 17) or orthogonal to the wobbling direction with respect to the axis (Y) of the wobbling direction. A mirror image relationship (FIG. 16) is formed with respect to the direction axis (X).

  Then, the substrates 1 and 2 are arranged so that the heads a and a ′ and the tails of the alignment processing directions 14 and 14 ′ of the alignment films 15 and 16 overlap each other as shown in FIG. When facing each other, an antiparallel oriented cell can be produced. On the contrary, when the heads a and a 'are overlapped with each other as shown in FIG.

JP 7-13163 A

  Regarding the formation of the inorganic alignment film, it is necessary to change the alignment angle depending on the characteristics of the liquid crystal panel, and the alignment angle of the alignment film also needs to be formed in a mirror image state on the upper and lower substrates. A holder that matches the orientation angle to be formed was necessary.

  A fine conductive pattern is formed on the substrate of the liquid crystal panel, and a large number of substrates are formed on a mother substrate which is a work for forming an alignment film. It is common to cover the mother substrate with a mask that hides the area where the alignment film is not to be formed. However, there is a gap between the work and the mask, the edges of the deposited alignment film are blurred, or the gap is on the work. The conductive pattern is deposited and must be removed later. If the mask floats, the mask is shaded, resulting in poor deposition. Since the alignment film is oblique deposition, the influence of the gap is particularly large.

  When setting a workpiece in the holder, the workpiece and the holder are easily scratched and scratched. Also, if the holder is mirror-finished, the workpiece and the holder will stick together due to atomic attraction, which hinders alignment and removal work. The workpiece receiving surface must be cleaned each time.

  The mask is thin, easily deformed, and difficult to handle such as alignment. In particular, when a mask is attracted using a magnet, the operation is difficult.

  An oblique vapor deposition treatment comprising at least a base, a table for fixing the workpiece, a bearing for rotatably fixing the table to the base, a scale for confirming the rotation angle of the table, and a means for fixing the table. Use tools.

  At least the base, the table for fixing the workpiece, the bearing for rotatably fixing the table to the base, the scale for checking the rotation angle of the table, the means for fixing the table, and the area other than the deposition surface are covered. An oblique vapor deposition jig having an adhesion preventing member is provided.

  At least a base, a table for fixing the workpiece, a bearing for rotatably fixing the table to the base, a scale for checking the rotation angle of the table, a means for fixing the table, and a mask for vapor deposition regulation An oblique vapor deposition jig is provided.

  An oblique vapor deposition jig in which magnets are fixed to a plurality of positions on the work fixing surface of the table, and a vapor deposition regulating mask formed of a magnetic material is disposed on the work upper surface.

  An oblique deposition jig in which a film (not scratched on the workpiece) such as Teflon (registered trademark) processing is formed on the workpiece receiving surface provided on the table.

  The oblique deposition jig is provided with a reinforcing ring on the outer periphery of the mask.

  The reinforcing ring is an oblique deposition jig having means for positioning the mask on the table.

  An oblique deposition jig in which dummy patterns for film thickness measurement are formed at a plurality of locations on the mask.

  Since the table for fixing the workpiece is fixed to the base via the bearing, the table can be set to a necessary orientation angle, and various holders as in the prior art are not required. Since the scale for checking the table rotation angle is provided, the position of the table relative to the base can be easily set.

  Since the deposition member that covers other than the vapor deposition surface is provided, maintenance of the oblique vapor deposition jig is easy.

  Since a plurality of magnets are fixed to the work fixing surface and the mask is made of a magnetic material, the mask adheres to the work, there is no gap between the work and the mask, and the edge of the deposited film does not blur. It is not necessary to remove the deposited film in the subsequent work by depositing the conductive pattern on the workpiece from the gap, and it is possible to prevent the occurrence of deposition failure due to the mask floating.

  By applying Teflon (registered trademark) processing to the workpiece receiving surface provided on the table, unevenness is formed on the processed surface, reducing the contact area between the workpiece and the workpiece receiving surface, and when setting the workpiece on the table, The sticking due to the thinning force can be prevented and the work becomes easy. Moreover, even if the work is rubbed due to Teflon (registered trademark) processing or the like, it is not damaged. The work receiving surface must be cleaned each time, but it is easy to clean because dust and dirt do not adhere to it.

  Since the reinforcing ring is provided on the outer periphery of the mask, the deformation of the mask can be prevented and operations such as alignment can be easily performed. In particular, it is effective when a mask is attracted using a magnet.

  Further, since the reinforcing ring is provided with positioning means for the table, the positioning portion is reinforced by positioning only with the mask, the deformation and deterioration of the mask can be prevented, and the work can be facilitated.

Since film thickness measurement dummy patterns are provided at a plurality of locations on the mask, the film thickness distribution can be easily managed. In particular, the oblique deposition is effective in managing the film thickness distribution because the position of the workpiece cannot be a fixed distance from the deposition source.

  At least a base, a table for fixing the workpiece, a bearing for rotatably fixing the table to the base, a scale for confirming the rotation angle of the table, a means for fixing the table, and a mask for vapor deposition regulation An oblique vapor deposition jig provided with an adhesion preventing member that covers other than the vapor deposition surface.

  FIG. 1 is a schematic view of an embodiment of the oblique vapor deposition jig of the present invention, (A) is a top view, (B) is a side cross-sectional view, and (C) is a side cross-sectional view showing a relationship with a vapor deposition source. The board is mounted. 2A is a top view, FIG. 2B is a front sectional view, FIG. 2C is a left side view, and FIG. 2D is a right side sectional view. 3A and 3B are diagrams of a workpiece mounted on the oblique vapor deposition jig of the present invention and a mask. FIG. 3A is a top view, FIG. 3B is a front sectional view, FIG. It is front sectional drawing of a mask. A reinforcing ring is fixed to the mask.

  The oblique vapor deposition jig 20 includes a base 21, a table 22 on which a workpiece receiving surface 22a is formed, a bearing 23, a scale plate 24, a table fixing means 25, a vapor deposition regulating mask 26, a reinforcing ring 27, a magnet 28, and the like. Yes. The base 21 and the table 22 are fixed via a bearing 23, and the table 22 has a structure that can rotate with respect to the base 21. As shown in FIG. 1C, the oblique vapor deposition jig 20 is fixed in a vapor deposition machine (not shown) to a vapor deposition source so as to have a predetermined vapor deposition angle (for example, 22.5 degrees).

  A plurality of magnets 28 (48 pieces in FIG. 2) are embedded in the workpiece receiving surface 22 a, and a scale plate 24 (two pieces in the figure) is fixed to the base 21 near the outer periphery of the table 22. On the table 22, confirmation lines 22b (in this embodiment, two locations) for alignment with the scale of the scale plate 24 are formed. The table fixing means 25 is a screw engaged with the scale plate 24 for fixing the table after rotating and positioning the table.

  The vapor deposition regulating mask 26 is for covering a non-deposition film forming portion of the work 30 which is a mother substrate on which a plurality of image areas 30a (89 in FIG. 3) are formed. In this embodiment, the vapor deposition regulating mask 26 is made of magnetic stainless steel. Is formed. A thin plate having a thickness of 0.1 mm, a plurality of windows 26a for forming an alignment film are formed corresponding to the image area 30a. As can be seen in FIG. 3, the window 26a is thin and is easily bent and easily deformed.

  In the present invention, a reinforcing ring 27 is fixed to the outer periphery of the vapor deposition regulating mask 26. Guide pins 22c-22f are implanted in the table 22, and guide holes 27a, 27b and guides 27c, 27d are formed in the reinforcing ring 27 corresponding to the guide pins 22c-22f. The vapor deposition regulating mask 26 is not deformed by the reinforcing ring 27 and is easy to handle and can be positioned and fixed to the table 22 by the strong reinforcing ring 27 portion, which makes the operation extremely easy. The lifetime of the evaporation control mask 26 is also greatly extended.

  Since a large number of magnets 28 are embedded in the workpiece receiving surface 22a, the vapor deposition regulating mask 26 formed of a magnetic material is attracted and is in close contact with the workpiece 30, so that there is no gap. For this reason, the blur of the edge of the vapor deposition film and the vapor deposition failure due to the gap between the work 30 and the vapor deposition regulating mask 26 can be prevented.

  4A and 4B are diagrams for explaining the arrangement of the image area 30a with respect to the work 30 and the orientation angle of the alignment film to be formed. FIG. 4A is a top view of the upper substrate, and FIG. 4B is a top view of the lower substrate. The workpiece is mounted on the workpiece receiving surface 22a of the table 22, and is positioned and fixed with reference to the notch shape shown in FIG. (A) and the orientation flat shape shown in (B). During this positioning operation, the workpiece receiving surface 22a and the surface of the workpiece 30 are rubbed and easily damaged, but in the present invention, a scratch is generated by forming a thin film by Teflon (registered trademark) processing or the like on the workpiece receiving surface 22a. Is suppressed. In addition, the work receiving surface 22a and the surface of the work 30 are prevented from coming into close contact with each other and being peeled off. This is because a thin film having unevenness is formed on the surface of the workpiece receiving surface 22a by Teflon (registered trademark) processing or the like, thereby creating a state in which it is easy to slip and peel. In addition, the work receiving surface 22a is cleaned with an organic solvent or the like at every work, but there is also an effect that dirt is easily removed.

  In the liquid crystal panel, the alignment angle of the alignment film differs between the upper substrate and the lower substrate. In FIG. 4 (A), it is oriented at an angle of 45 degrees from the lower left to the upper right, and in FIG. 4 (B), it is oriented at an angle of 45 degrees from the upper left to the lower right.

  5A and 5B are diagrams showing a state in which the upper substrate and the lower substrate are bonded together, in which FIG. 5A is a top view, FIG. 5B is a side view, and FIG. 5C is an enlarged view showing a vapor deposition state. The upper substrate and the lower substrate are attached as shown in FIG. 5, but the vapor deposition angle (for example, 22.5 degrees) is opposite as shown in FIG.

  6A and 6B are views showing a fixed state of the workpiece and the deposition angle with respect to the oblique deposition jig, wherein FIG. 6A is a top view and FIG. 6B is a side sectional view. As shown in FIG. (B), the vapor deposition angle is determined by the arrangement angle with respect to the vapor deposition source, while the orientation angle is determined by positioning the table 22 with respect to the base 21 as shown in (A). In FIG. (A), it is fixed by rotating 45 degrees counterclockwise. As described in the problem to be solved by the invention, regarding the formation of the inorganic alignment film, it is necessary to change the alignment angle depending on the characteristics of the liquid crystal panel, and the alignment angle of the alignment film is formed in a mirror image state on the upper and lower substrates. It is necessary, and when forming the alignment film, a holder matched to the orientation angle to be formed is necessary, but the oblique deposition jig of the present invention can rotate the table 22 with respect to the base 21, It can cope with any change in the orientation angle depending on the characteristics of the liquid crystal panel.

  FIG. 7 includes a top view (A) and a front cross-sectional view (B) in which a deposition member that covers other than the deposition surface is provided on the oblique deposition jig. The adhesion-preventing member 29 is for covering the portion other than the upper surface of the vapor deposition restriction mask 26 and preventing the vapor deposition film from being formed on the other surface of the vapor deposition restriction mask 26, and facilitates the maintenance of the oblique vapor deposition jig.

  FIG. 8 is a top view in which a plurality of (in the figure, four) film thickness measurement dummy patterns 31 are formed on the vapor deposition restriction mask. By forming the thickness measurement dummy pattern 31 wound at a position where the distance from the vapor deposition source is different, the film thickness of the entire workpiece can be easily managed. In particular, in the structure in which the table can be rotated and the fixed position is variable like the oblique vapor deposition jig of the present invention, it is effective to form a plurality of dummy patterns 31, as shown in FIG. Management is facilitated by providing them at 90 ° intervals on the outer edge of the evaporation control mask.

It is the schematic of the Example of the oblique vapor deposition jig | tool of this invention, (A) is a top view, (B) is side surface sectional drawing, (C) is side surface sectional drawing which shows the relationship with a vapor deposition source. (A) is a top view, (B) is a front sectional view, (C) is a left side view, and (D) is a right side sectional view. FIG. 1A is a top view, FIG. 1B is a front cross-sectional view, FIG. 1C is a top view of the mask, and FIG. 3D is a front view of the mask. Cross section 4A and 4B are diagrams for explaining the arrangement of the image area 30a with respect to the work 30 and the orientation angle of the alignment film to be formed, where FIG. 5A is a top view of the upper substrate, and FIG. It is a figure which shows the state which bonded the upper board | substrate and the lower board | substrate, (A) is a top view, (B) is a side view, (C) is an enlarged view which shows a vapor deposition state. The figure which shows the fixed state of a workpiece | work with respect to an oblique vapor deposition jig | tool, and a vapor deposition angle, (A) is a top view, (B) is side sectional drawing. Top view (A) and front cross-sectional view (B) in which a deposition member that covers other than the deposition surface is provided on the oblique deposition jig Top view with a plurality of film thickness measurement dummy patterns formed on the evaporation control mask Schematic cross-sectional view during orientation treatment The schematic front view (A) and side view (B) which show the arrangement | positioning state of the board | substrate at the time of the vapor deposition AA sectional view of the vapor deposition apparatus in FIG. 10B is an enlarged view of the substrate and its holder. Schematic front view (A) and plan view (B) showing the orientation processing direction by vapor deposition The schematic front view which shows the arrangement | positioning state of the board | substrate at the time of the orientation process with respect to another board | substrate Schematic front view (A) and plan view (B) showing the same orientation treatment direction Illustration of anti-parallel alignment cell Illustration of parallel alignment cell

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Substrate 3 Vapor deposition direction 4 Substrate orientation 5 Holder 6 SiO powder 7 Boat 8 Vapor deposition source vertical line 9 Substrate normal 10 Vacuum chamber 11 Connecting rod 12 Guide rail 13 Power supply 14 Orientation direction 14 'Orientation direction 15 SiO orientation Film 16 SiO alignment film 20 Oblique deposition jig 21 Base 22 Table 22a Work receiving surface 22b Confirmation line 22c Guide pin 22d Guide pin 22e Guide pin 22f Guide pin 23 Bearing 24 Scale 25 Screw 26 Deposition restriction mask 26a Window 27 Reinforcement ring 27a guide hole 27b guide hole 27c guide 27d guide 28 magnet 29 adhesion preventing member 30 work 30a image area 31 dummy pattern

Claims (8)

    And at least a base, a table for fixing the workpiece, a bearing for rotatably fixing the table to the base, a scale for confirming a rotation angle of the table, and means for fixing the table. Oblique deposition jig.   At least the base, the table for fixing the workpiece, the bearing for rotatably fixing the table to the base, the scale for checking the rotation angle of the table, the means for fixing the table, and the area other than the deposition surface are covered. An oblique deposition jig comprising an adhesion preventing member.   At least a base, a table for fixing the workpiece, a bearing for rotatably fixing the table to the base, a scale for checking the rotation angle of the table, a means for fixing the table, and a mask for vapor deposition regulation The oblique vapor deposition jig according to claim 1 or 2, further comprising:   4. The oblique vapor deposition jig according to claim 3, wherein a magnet is fixed to a plurality of positions on the work fixing surface of the table, and a vapor deposition regulating mask formed of a magnetic material is disposed on the upper surface of the work.   5. The oblique vapor deposition jig according to claim 1, wherein a film made of Teflon or the like (the work is not damaged) is formed on the work receiving surface provided on the table.   5. The oblique vapor deposition jig according to claim 3, wherein a reinforcing ring is provided on the outer periphery of the mask.   The oblique vapor deposition jig according to claim 6, wherein the reinforcing ring has positioning means for positioning the mask on a table.   5. The oblique deposition jig according to claim 3, wherein dummy patterns for film thickness measurement are formed at a plurality of locations on the mask.

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