JP2006264891A - Noncontact substrate conveying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably convey a substrate floating by air. <P>SOLUTION: A number of air blowout parts 2 are formed in a base 1 at mounting intervals L, and an upper face part 7 of each air blowout part 2 is in a shape of curved face corresponding to a projection part 8 of the substrate G which is deformed in a wave form curve by air blown out of each air blowout part 2, so as to prevent an leading edge part of the substrate G in a conveyance direction from hanging low. A constant floating distance δ1 between the substrate G and the upper face part 7 is maintained to keep a floating state of the substrate G constant and thereby stably convey the substrate G with a state where the possibility of contact of the substrate G with each corner part 7a of the air blowout part 8 is eliminated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, a large number of air ejection portions are arranged at predetermined intervals along a horizontal direction orthogonal to the substrate transport direction, and the substrate is floated by the pressure of air ejected from the air ejection holes of each air ejection portion. The present invention relates to a non-contact type substrate transport apparatus that transports them in a controlled manner.

  An apparatus for floating a glass substrate (hereinafter simply referred to as a substrate) used in a manufacturing process of a liquid crystal panel, a semiconductor, or the like and conveying it in a non-contact state is known (for example, see Patent Document 1). Further, recent substrates have a large size (for example, 1800 mm × 1600 mm × 0.7 mm).

  Patent Document 1 states that “the pressure of air ejected from the air ejection holes of each air ejection section, with a large number of air ejection sections arranged at predetermined intervals along a horizontal direction orthogonal to the substrate transport direction. In a device that floats and transports a substrate by air, the substrate is forcedly deformed into a convex shape that is convex upward or downward by an air levitation force, thereby increasing the bending strength (bending rigidity) along the transport direction. Thus, a technique is disclosed in which the tip of the substrate hangs down in a portion where the air ejection portion does not exist and is conveyed without being brought into contact with the air ejection portion. In order to realize the above-described technology, (a) the height and shape of the upper surface of each air ejection portion and the air ejection direction are changed as necessary while keeping the pressure and flow rate of the ejection air constant. And (b) changing the pressure and flow rate of the air ejected from each air ejecting portion while keeping the height of many air ejecting portions constant. There is a method of forcibly deforming the substrate into the above-described target shape.

For this reason, the technique of Patent Document 1 has the following drawbacks. (B) It is necessary to gradually change the height of the air ejection part or to change the pressure and flow rate of the air ejected from each air ejection part. The design and production of the part is troublesome, or the control of the pressure and flow rate of the blown air becomes troublesome. (B) Even if contact with the air ejection part due to the drooping of the substrate can be avoided, the substrate is forced to be deformed into a simple curved shape that is convex upward or downward, so that the substrate is stressed and residual strain is applied to the substrate. And the quality of the substrate itself is degraded.
JP 2004-244186 A

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a substrate that is stably conveyed without giving stress to the substrate that has been air-lifted or contacting and damaging the substrate. It is said.

  In the invention of claim 1 for solving the above-described problem, a large number of air ejection portions are arranged at predetermined intervals along a horizontal direction orthogonal to the substrate transport direction, and the air ejection holes of each air ejection portion are arranged. A non-contact type substrate transport apparatus that floats and transports a substrate by the pressure of air to be ejected, and the upper surface of each of the air ejection portions has a levitation force due to the pressure of air ejected from a number of air ejection holes, Corresponding to the shape of the convex part at least among the waveform curve shape that is the shape orthogonal to the substrate transport direction, which is naturally determined by the weight of the substrate, the mounting interval of the air ejection part, the characteristics of the substrate itself, etc. It is characterized by a curved surface.

  The deformed shape in the width direction of the substrate that is transported by being floated on air (in the direction orthogonal to the transport direction of the substrate) is a waveform curve shape that is naturally determined by the above-described multiple factors. The shape of the upper surface is made to correspond to the shape of at least the upwardly convex portion of the waveform curve shape of the substrate. In other words, the corrugated curve shape is substantially equivalent to the deformation of the substrate when the substrate is supported in a non-constrained state by a plurality of support portions having the same height, and each support portion (air ejection portion) ) Is deformed to be convex downward. The shape in the width direction of the substrate is deformed into a wave-like curve shape by natural deformation, so that the bending strength in the transport direction of the substrate can be increased, and the amount of sag at the tip of the substrate can be reduced. It is easy to avoid contact between the substrate and the air ejection portion while minimizing or hardly reducing degradation of quality.

  In addition, the distance between the air levitation substrate and the upper surface of each air ejection portion (hereinafter referred to as “the levitation interval”) is kept constant, and the flow rate of the substrate in each air ejection portion including the flow of pressure air after ejection is maintained. The floating state is constant, and the substrate can be transported in the most stable air floating state without contacting the substrate at the corner portion in the width direction of the air ejection portion. Here, “the most stable air levitation state” means that the above-mentioned “levitation interval” can be made constant without controlling the pressure and flow rate of the air blown at each air jetting part individually. That is, the substrate can be transported with air floating. Further, since the distance between the substrate that has been air-floated and the upper surface of each air ejection portion is kept constant, the amount of floating of the substrate, and the pressure and flow rate of air required for flying can be minimized. On the other hand, when the upper surface of the air ejection portion is planar, the substrate is lifted by the same amount from both ends of the air ejection portion in order to avoid contact, compared with the case of the present invention. It is necessary to significantly increase the floating interval of the substrate at the center of the part. This means that if the upper surface of the air ejection portion is planar, the same effect as the present invention can be obtained only when at least one of the pressure and flow rate of air is significantly increased compared to the present invention. To do. And in this invention, if the attachment space | interval of each air ejection part is constant, while the upper surface shape of each air ejection part can be made the same, the pressure and flow volume of the ejection air in each air ejection part are controlled separately. Therefore, the substrate can be floated and transported with air kept constant.

  Furthermore, since the substrate is deformed into a waveform curve shape that is a natural shape determined by the above-described plurality of factors, stress is reduced, and after transportation, the substrate is easily restored to the original flat shape. There is little risk of harming the characteristics of the substrate.

  According to a second aspect of the present invention, on the premise of the first aspect of the present invention, the upper surfaces of the plurality of air ejection portions are provided continuously in the substrate transport direction. Since the corner portion is not formed in the air ejecting portion except for the front end portion and the rear end portion in the transport direction of the substrate, it is possible to reliably prevent the front end portion of the substrate and the air ejecting portion from colliding with each other.

  According to a third aspect of the present invention, on the premise of the first or second aspect of the invention, each of the air ejection portions has a cavity serving as an air passage inside. Air for levitating the substrate is ejected from a cavity provided inside. For this reason, it is only necessary to supply air to the cavity, and a complicated air passage is unnecessary.

  According to a fourth aspect of the invention, on the premise of any one of the first to third aspects, the curved shape of the upper surface of each of the air ejection portions can be finely adjusted. For this reason, it is not necessary to obtain the curved surface shape of the air ejection portion by experiments and calculations in advance, and it is possible to easily cope with substrates having different thicknesses and characteristics.

  According to a fifth aspect of the present invention, on the premise of any one of the first to fourth aspects, an elastic plate member is attached to the upper surface of each of the air ejection portions. When the air that has been ejected and hits the substrate escapes from the lateral sides of the air ejection portion, the plate-like member is elastically deformed. Thereby, the upper surface part of a plate-shaped member becomes a shape corresponding to the waveform curve shape of a board | substrate. In the present invention, since the curved surface shape of the air ejection portion is automatically adjusted, the labor of adjustment can be saved.

  In the present invention, a large number of air ejection portions are arranged at predetermined intervals along a horizontal direction orthogonal to the substrate transport direction, and the substrate is air-conditioned by the pressure of air ejected from the air ejection holes of each air ejection portion. A non-contact type substrate transport apparatus that floats and transports, wherein the upper surface of each air ejection section has a levitation force due to the pressure of air ejected from a number of air ejection holes, the weight of the substrate, and the mounting interval of the air ejection section And a curved surface corresponding to at least the shape of the upwardly convex portion of the waveform curve shape which is a shape perpendicular to the substrate transport direction, which is naturally determined by the characteristics of the substrate itself, etc. . For this reason, the board | substrate in conveyance becomes a waveform curve shape which is a natural shape, and the floating space | interval of a board | substrate and many air ejection parts is kept constant. This prevents the tip of the substrate from sagging during transportation without giving a large stress to the substrate or changing the pressure or flow rate of the ejected air, and stably floating the substrate. It can be conveyed with.

Hereinafter, the present invention will be described in more detail with reference to the best examples of the present invention. The non-contact type substrate transfer apparatus according to the present embodiment has a configuration in which a substrate is floated and transferred, and is hereinafter simply referred to as “substrate transfer apparatus”. 1 is an overall perspective view of the substrate transfer apparatus A ₁ of the first embodiment, FIG. 2 is a plan view of the same, FIG. 3 is a cross-sectional view taken along the line XX of FIG. 2, and FIG. It is a figure which shows the floating state of the convex part 8 of the board | substrate G, and (b) is a figure which shows the pressure distribution curve 12 of the ejection air 11 similarly.

First, the substrate transfer apparatus A _{1 according to} the first embodiment will be described. As shown in FIGS. 1 and 2, the substrate transfer apparatus A ₁ of the first embodiment includes a rectangular plate-like base 1 that is slightly smaller than the substrate G in plan view, and an upper surface of the base 1. It is composed of a plurality of (four in the case of this embodiment) air ejection portions 2 attached at a fixed attachment interval L in the width direction Q (horizontal direction orthogonal to the transport direction R of the substrate G). Yes. A plurality of first air flow paths 3 a and 3 b are provided along the width direction Q of the base 1 at a predetermined center in the transport direction R of the substrate G at a substantially central portion in the height direction of the base 1. It has been. Further, in the base 1, each second air flow path 4 is provided at a position corresponding to each air ejection portion 2 along the depth direction of the base 1 (the transport direction R of the substrate G). Further, each air ejection portion 2 is provided with a large number of air ejection holes 5a and 5b along the height direction. In the case of the present embodiment, each of the air ejection holes 5a, 5b is one first air ejection provided in the substantially central portion of each air ejection portion 2 in the left-right direction (the direction along the width direction Q of the base 1). It consists of a hole 5a and two second air ejection holes 5b that are provided in the left-right direction at a predetermined interval from the central part, both of which are in the longitudinal direction of the air ejection part 2 (the transport direction R of the substrate G) ) Are alternately provided at regular intervals. Of the first air flow paths 3a and 3b described above, the air flow path 3a and the first air ejection hole 5a communicate with each other, and the air flow path 3b and the second air ejection hole 5b communicate with each other. . Further, the first air flow paths 3a, 3b and the second air flow path 4 are communicated with each other. For this reason, the compressed air (indicated by arrows 6 in FIG. 2) supplied from the port 4a provided at the end of the base 1 to each second air channel 4 passes through each first air channel 3a, 3b. It flows and is ejected upward from the air ejection holes 5a and 5b, and the substrate G is levitated.

Next, the air ejection part 2 will be described. As shown in FIG. 1, each air ejection part 2 constituting the substrate transfer apparatus A ₁ of the first embodiment is made of an extruded material of aluminum (aluminum), and the upper surface part 7 is air-lifted and corrugated ( It is a curved surface shape corresponding to the convex portion 8 of the substrate G that bends to a (waveform curve shape). As shown in FIG. 3, air is ejected from the air ejection holes 5 a and 5 b provided in the upper surface portion 7 of each air ejection section 2, and pushes up the substrate G disposed immediately above them. Thereby, the board | substrate G is levitated. The portion immediately above each air ejection portion 2 in the substrate G is pushed up by the air to form a convex portion 8 (a portion convex upward), and the portion immediately above each air ejection portion 2 has its own weight. As a result, the concave portion 9 is formed by bending downward. As a result, the substrate G has a waveform curve shape in cross-sectional view. The waveform curve shape is determined by the levitation force due to the pressure of the air ejected from the air ejection section 2, the weight of the substrate G, the mounting interval L of each air ejection section 2, the characteristics of the substrate G itself, and the like. The upper surface part 7 of each air ejection part 2 mentioned above respond | corresponds to the convex part 8 of the board | substrate G used as the waveform curve shape. In the present specification, the case where the substrate G is pushed up by the air ejected from the first air ejection holes 5a in each air ejection section 2 will be described. In this embodiment, the actual flying interval of the substrate G is several tens to several hundreds of microns. Therefore, in the figure, the ratio is much larger than the ratio of the actual deflection amount to the deformation pitch of the substrate G deformed into the waveform curve shape (equal to the mounting interval L of each air ejection part 2).

  The above operation will be described in more detail. As shown in FIG. 4A, the substrate G is levitated by the air (ejection air 11) ejected from the first air ejection holes 5a. At this time, when the mounting interval L of each air ejection part 2 exceeds a certain value, the part of the substrate G that is not exposed to air (the part between the air ejection parts 2) bends by its own weight, and has a waveform curve shape. Presents. Here, it is assumed that the concave portion 9 (downward convex portion) of the substrate G in the bent state does not contact the base 1. The bending shape of the board | substrate G at this time is a waveform curve shape determined naturally. That is, the substrate G is substantially bent and substantially in a state of supporting the substrate G in an unconstrained state by a support portion (not shown) provided at the same height corresponding to the mounting interval L of each air ejection portion 2. Are equivalent. The board | substrate G is conveyed with a waveform curve shape. Thereby, the bending strength of the conveyance direction R of the board | substrate G becomes high, the drooping amount of the front-end | tip part of the board | substrate G decreases, and a contact with each air ejection part 2 becomes easy to be avoided. In addition, since the wavy curve shape is a bent shape due to the natural deformation of the substrate G, the stress acting on the substrate G is reduced compared with the case where the substrate G is forcibly deformed, and the deterioration of the quality of the substrate G is minimized. It is suppressed or hardly lowered. Furthermore, there is an advantage that the substrate G is easily restored to the original shape (planar shape) after the conveyance.

And the upper surface part 7 of each air ejection part 2 is provided corresponding to the bending shape (waveform curve shape) of the board | substrate G. As shown in FIG. That is, as shown in FIG. 4A, the upper surface portion 7 of each air ejection portion 2 has a curved surface shape that follows the convex portion 8 of the substrate G pushed up by air, and each air in the floating state. The flying interval δ ₁ from the upper surface portion 7 of the ejection portion 2 to the convex portion 8 of the substrate G is substantially the same in the upper surface portion 7 of each air ejection portion 2.

When the substrate G bent in a waveform curve shape is conveyed in a state where the air is floated, the flying interval δ ₁ between the upper surface portion 7 of each air ejection portion 2 and the portion directly above the substrate G is always kept constant. . That is, the floating state of the substrate G in each air ejection portion 2 including the flow of air after ejection becomes constant, and the upper surface portion 7 including the corner portion 7a of each air ejection portion 2 and the substrate G come into contact with each other. Without being transported in the most stable air levitation state. The “most stable air levitation state” means that the flying interval δ ₁ can be made constant while keeping the pressure and flow rate of the air blown out in each air jetting part 2 individually, and keeping them constant. It is that G can be conveyed by air. In addition, since the flying distance δ ₁ between the substrate G that has been air-floated and the upper surface portion 7 of each air ejection portion 2 is kept constant, the flying height of the substrate G and the pressure and flow rate of air required for flying are minimized. That's it. The substrate G that has been floated on air is transported along the transport direction R while maintaining a certain floating state by a transport means (not shown) and in a non-contact manner with the upper surface portion 7 of each air ejection section 2. Note that as a means for transporting the substrate G, air is ejected obliquely with respect to the substrate G so that a component force can be generated in a method of pushing or pulling an end surface portion of the substrate G or in the transport direction R of the substrate G. Then, there is a method of moving the substrate G by the pressure of the air.

On the other hand, in order to avoid contact between the substrate G and the air ejection part 2 when the upper surface part 7 'of the air ejection part 2 is planar as shown by the alternate long and short dash line in FIG. In order to float the substrate G by the same amount (floating interval δ ₁ ) from each corner portion 7 a of the air ejection portion 2, the floating interval δ ₁ ′ of the substrate G at the substantially central portion in the width direction Q of the air ejection portion 2. Needs to be greatly increased (δ ₁ '> δ ₁ ). This means that when the upper surface portion 7 'of the air ejection portion 2 is planar, the same effect as the present invention can be obtained only when at least one of the pressure and flow rate of air is significantly increased compared to the present invention. Means that

As described above, since the flying distance δ ₁ between the upper surface portion 7 of the air ejection portion 2 and the convex portion 8 of the substrate G is uniform, the amount of air escaping to the left and right sides of the air ejection portion 2 is small. Therefore, less air consumption is required. In addition, the pressure of the jet air 11 in the air jet part 2 during the transfer of the substrate G is kept constant. In FIG. 4B, the pressure distribution curve 12 of the jet air 11 is indicated by a one-dot chain line.

  And if the attachment space | interval L of each air ejection part 2 is constant, while being able to make all the upper surface parts 7 of each air ejection part 2 into the same shape, the pressure and flow volume of the ejection air in each air ejection part 2 Without separately controlling the substrate G, the substrate G can be floated and conveyed. In addition, since the left and right corner portions 7a of the air ejection portion 2 are also curved, the degree of damage to the substrate G when contacting is less than that of the respective corner portions 7a 'of the conventional air ejection portion 2'. Become.

Next, as shown in FIG. 5A, the upper surface portion 7 ′ is a flat air ejection portion 2 ′, and the flying interval of the concave portion 9 of the substrate G by the ejection air 11 is the air ejection portion 2 described above. Is the same (δ ₁ ). In this case, a gap V larger than the central portion is formed in each of the left and right side portions of the air ejection portion 2 ′, and the floating interval δ ₂ of the substrate G in each corner portion 7a ′ is the floating interval δ in the central portion. Greater than _one . After the blown air 11 blown out from the air blowout part 2 ′ hits the recess 9 of the substrate G, it becomes easy to escape from the large gap V formed on the left and right sides. For this reason, the pressure of the blown air 11 at the side portion of the substrate G is much smaller than the pressure at the central portion, and a large amount of air is required as compared with the case of the present invention. In FIG. 5B, the pressure distribution curve 13 of the jet air 11 is indicated by a one-dot chain line.

Next, the substrate transfer apparatus A _{2 according to} the second embodiment will be described. As shown in FIGS. 6 (a) and 6 (b), each air ejection portion 14 of the second embodiment is obtained by extruding an aluminum hollow material in the first embodiment described above. It differs from each air ejection part 2. That is, the cavity part 15 which follows the longitudinal direction in each air ejection part 14 is provided. Compressed air (indicated by arrow 16) supplied to each air ejection portion 14 is once stored in the cavity 15 and then ejected from each air ejection hole 5a, 5b. In the case of the substrate transfer apparatus A ₂ of the second embodiment, since air can be directly supplied to the cavity 15, it is not necessary to provide each air flow path 3 a, 3 b, 4 in the base 1, and air There is an advantage that the flow path is shortened and clogging is difficult. In addition, (a) of FIG. 6 shows a form in which compressed air is supplied from the front side of each air ejection portion 14.

Next, the substrate transfer apparatus A ₃ of the third embodiment will be described. As shown in FIGS. 7A and 7B, the air ejection portion 17 of the third embodiment includes a base section 18 having a rectangular cross section and an elastic wand attached to the upper portion of the base section 18. It is comprised from the music part 19. FIG. The elastic bent portion 19 is made of an elastically deformable bent member, and has an upper surface portion corresponding to the convex portion 8 of the substrate G in a floating state. The base portion 18 and the elastic bending portion 19 are connected by a connecting means (not shown). As shown in FIG. 7B, when the elastic bending portion 19 is attached to the base portion 18 as it is, the upper surface portion of the elastic bending portion 19 and the convex portion 8 of the substrate G in the floating state are formed. There is a case where it does not correspond (a state where the flying distance between the elastic bent portion 19 and the convex portion 8 of the substrate G is not constant). This state is indicated by a two-dot chain line in FIG. If air is spouted as it is, the amount of air escape increases and the amount of air consumption increases.

  In order to prevent this, a shim plate 21 is sandwiched between the base portion 18 and the elastic bending portion 19 so that both are connected. Thereby, the elastic bending portion 19 is elastically deformed, and the floating interval between the deformed upper surface portion and the convex portion 8 of the substrate G can be made constant. In the shim plate 21, since each through hole 21a is provided in a portion corresponding to the air ejection hole 5a, there is no problem in the passage of air. In the case of the air ejection portion 17 of the third embodiment, the shape of the upper surface portion of the elastic bending portion 19 can be finely adjusted, so that the air ejection portion 17 is more accurately associated with the convex portion 8 of the substrate G. It is possible to deal with substrates G having different thicknesses and characteristics. In addition, it is not necessary to obtain a curved surface shape of the upper surface portion of the air ejection portion 17 by performing calculations and experiments in advance, and the thickness and characteristics of the substrate G can be dealt with in the field.

Next, the substrate transfer apparatus A ₄ of the fourth embodiment will be described. As shown in FIGS. 8A and 8B, the air ejection part 22 of the fourth embodiment is attached to a base part 23 having a curved upper surface part and an upper part of the base part 23. And an elastic plate portion 24. The upper surface portion of the base portion 23 has a curved surface shape corresponding to the convex portion 8 of the floating substrate G. The elastic plate portion 24 is made of an elastically deformable thin plate.

  The elastic plate portion 24 attached to the base portion 23 bends following the upper surface portion of the base portion 23. In this state, the curved shape of the elastic plate portion 24 does not correspond to the bent shape (waveform curve shape) of the convex portion 8 of the substrate G. In other words, the flying distance between the upper surface portion of the elastic plate portion 24 and the convex portion 8 of the substrate G is not constant. This state is indicated by a two-dot chain line in FIG. However, when the air ejected from each air ejecting portion 22 strikes the substrate G and tries to escape from the left and right sides, the side end portion of the elastic plate portion 24 is pushed down. Thereby, the floating interval between the elastic plate portion 24 and the substrate G becomes constant. In the case of the air ejection part 22 of the fourth embodiment, since the upper surface part of the elastic plate part 24 is automatically adjusted so as to follow the waveform curve shape of the substrate G, there is an advantage that the labor of adjustment can be saved.

  In this specification, each air ejection part 2,14,17,22 is the form provided corresponding to the upward convex part (convex part 8) in the board | substrate G. FIG. However, each of the air ejection portions 2, 14, 17, and 22 corresponds to the entire substrate G having a waveform curve shape (in other words, not only a convex portion on the substrate G but also a convex portion on the lower side). It may be provided in a manner corresponding to the part). In this case, the upper surface portion 7 of each of the air ejection portions 2, 14, 17, 22 also exhibits a continuous waveform curve shape corresponding to the substrate G.

  The air ejection portions 2, 14, 17, and 22 in each of the above-described embodiments are made of an extruded aluminum material. For this reason, it is easy to form the curved surface shape of the upper surface portion 7 of each air ejection portion 2, 14, 17, 22 continuously in the longitudinal direction. However, it may be made of an extruded material of a metal other than aluminum or a resin material.

_{1 is} an overall perspective view of a substrate transfer apparatus A _{1 according to} a first embodiment. It is also a plan view. FIG. 3 is a sectional view taken along line XX in FIG. 2. (A) is a figure which shows the floating state of the convex part 8 of the board | substrate G in the air ejection part 2, (b) is a figure which shows the pressure distribution curve 12 of the ejection air 11. FIG. (A) is a figure which shows the floating state of the recessed part 9 of the board | substrate G in the conventional air ejection part 2 ', (b) is a figure which shows the pressure distribution curve 13 of the ejection air 11. FIG. (A) is a whole perspective view of board | substrate conveyance apparatus A2 of _2nd Example, (b) is front sectional drawing. (A) is a whole perspective view of substrate conveying apparatus A3 of _3rd Example, (b) is front sectional drawing. (A) is a whole perspective view of board | substrate conveyance apparatus A4 of _4th Example, (b) is front sectional drawing.

Explanation of symbols

A _{1 to} A ₄ : substrate transfer device
G: Substrate
L: Mounting interval (predetermined interval)
Q: Width direction (horizontal direction orthogonal to the conveyance direction)
R: Transport direction
δ ₁ : Levitation interval 2, 14, 17, 22: Air ejection part
5a, 5b: Air ejection holes
7: Upper surface (upper surface)
8: Convex part (protruding part upward)
15: Cavity (Cavity)
19: Elastic bent portion (upper surface of air ejection portion)
24: Elastic plate (plate member)

Claims (5)

A large number of air ejection portions are arranged at predetermined intervals along a horizontal direction orthogonal to the substrate transport direction, and the substrate is air-lifted and transported by the pressure of air ejected from the air ejection holes of each air ejection portion. A non-contact type substrate transfer device,
The upper surface of each of the air ejection portions is a substrate transport direction that is naturally determined by the levitation force due to the pressure of air ejected from a number of air ejection holes, the weight of the substrate, the mounting interval of the air ejection portions, and the characteristics of the substrate itself. A non-contact type substrate transfer apparatus characterized in that it is a curved surface corresponding to the shape of at least the upwardly convex portion of the waveform curve shape which is a shape in a direction orthogonal to the shape. 2. The non-contact type substrate transfer apparatus according to claim 1, wherein upper surfaces of the plurality of air ejection portions are continuously provided in a substrate transfer direction. Each non-contact-type board | substrate conveyance apparatus of Claim 1 or 2 with which each said air ejection part has the cavity used as an air passage inside. 4. The non-contact type substrate transfer apparatus according to claim 1, wherein the curved shape of the upper surface of each air ejection part can be finely adjusted. The non-contact type substrate transfer apparatus according to any one of claims 1 to 4, wherein a plate-like member having elasticity is attached to an upper surface of each of the air ejection portions.

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