JP2006261547A - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate processing equipment having a first processing section for processing a plurality of sheets of substrate collectively, and a second processing section for processing the substrates sheet by sheet and capable of processing the substrate in any processing section. <P>SOLUTION: The substrate processing equipment comprises a section 1 for containing a hoop F which contains a plurality of sheets of substrate W, a first processing section 3 for processing a plurality of sheets of substrate W collectively, and a second processing section 5 for processing the substrates W sheet by sheet. The substrate W can be processed by any one of a system for processing a plurality of sheets of substrate W collectively or a system for processing the substrates W sheet by sheet. Since the substrate is carried between the first processing section 3 and the second processing section 5 through the containing section 1, the first processing section 3 and the second processing section 5 can be controlled independently from each other. Even in this case, both processing sections can be cooperated through control of the containing section 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus for processing a substrate (hereinafter simply referred to as a substrate) such as a semiconductor wafer or a glass substrate for liquid crystal display.

  In various substrate processing apparatuses, the processing method can be broadly divided into a method of processing a plurality of (for example, 25) substrates at once and a method of processing the substrates one by one.

  In the method of collectively processing substrates, substrate processing is performed by immersing a plurality of substrates in a processing tank that stores a processing solution. For this reason, the mass productivity of substrate processing is excellent, and the processing quality between the substrates is uniform (see, for example, Patent Document 1).

  On the other hand, the method of processing substrates one by one performs substrate processing by supplying a processing liquid to a single substrate that rotates in a horizontal posture. For this reason, the substrate processing accuracy is relatively high (see, for example, Patent Document 2).

  Further, both of these methods are appropriate / inappropriate depending on the processing contents, and each method is adopted according to necessity.

JP 2001-196342 A JP 2000-070873 A

However, the conventional example having such a configuration has the following problems.
According to the batch processing method, the finish of the substrate and the processing quality of the substrate may not be sufficient. In particular, when the substrate is not sufficiently cleaned, it is necessary to further improve the processing quality by performing a cleaning process on the substrates that have been processed by the batch processing method by a method of processing one by one.

  In addition, when it is necessary to perform processing on a substrate using both methods in a series of processing steps, each type of substrate processing apparatus must be provided. This causes inconveniences such as an increase in installation space and an increase in cost. In addition, when a substrate is transported between the substrate processing apparatuses, the substrate once comes out of any one of the substrate processing apparatuses, so that the substrate may be contaminated.

  The present invention has been made in view of such circumstances, and includes a first processing unit that collectively processes a plurality of substrates, and a second processing unit that processes the substrates one by one, It is an object of the present invention to provide a substrate processing apparatus capable of processing a substrate in any processing unit.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the substrate processing apparatus for processing a substrate, a storage unit that stores a storage device that stores a plurality of substrates, and a first process that processes a plurality of substrates collectively. And a second processing unit for processing the substrates one by one, wherein the storage unit is a first mounting unit for mounting a container for the first processing unit, and for the second processing unit A second mounting unit for mounting a storage unit; and a transport unit for transporting the storage unit between the first mounting unit and the second mounting unit, wherein the first processing unit includes: A storage unit mounted on the second mounting unit, the first processing unit including a first transport mechanism for loading and unloading a substrate from the storage unit mounted on the first mounting unit; And a second transport mechanism for carrying in and out the substrate.

  According to the first aspect of the present invention, by providing the first processing unit and the second processing unit, either of a method of processing a plurality of substrates at once or a method of processing the substrates one by one Also, the substrate can be processed. Moreover, the atmosphere in a storage part can be kept normal by providing the storage part which accommodates a storage device.

  Further, by providing the first placement unit and the second placement unit, the transfer of the substrate between the first processing unit and the second processing unit is performed once through the storage unit. Accordingly, since the substrate is not directly transferred between the first processing unit and the second processing unit, the control of the first processing unit and the second processing unit does not need to be coordinated with each other, and is independent. It does not matter. Further, even when the first processing unit and the second processing unit are controlled independently of each other, it is possible to coordinate and adjust both by controlling the storage unit.

  In addition, a 1st process part and a 2nd process part are respectively provided with a 1st conveyance mechanism and a 2nd conveyance mechanism, and between an accommodating part and a 1st process part, an accommodating part and a 2nd process part are provided. The substrate can be transported in between.

  In the above-described invention, it is preferable that the transport unit transports a container that stores a substrate processed in the second processing unit from the second mounting unit to the first mounting unit. Item 2).

  By transporting the substrate in this way, the first processing unit can perform processing on the substrate processed by the second processing unit.

  In the above-described invention, it is also preferable that the transport unit transports a container that stores a substrate processed in the first processing unit from the first mounting unit to the second mounting unit. (Claim 3).

  If the substrate is transported in this manner, the second processing unit can perform processing on the substrate processed by the first processing unit.

  A preferable example of each of the above-described inventions is that the first processing unit and the second processing unit are arranged side by side on one side of the storage unit (claim 4).

  According to this, it is possible to easily transfer the substrate between the storage unit and the first processing unit and between the storage unit and the second processing unit.

  Moreover, another preferable example of each invention mentioned above is that the said 1st process part and the said 2nd process part are opposingly arranged (Claim 5).

  According to this, it is possible to easily transport the substrate to the first and second processing units from the storage unit disposed between the first processing unit and the second processing unit.

  In each of the above-described inventions, it is preferable that the storage unit includes a shelf on which a plurality of storage devices are placed, and the transport unit further transports the storage device to the shelf.

  According to this, a storage part can accommodate a container suitably by providing the shelf which a conveyance part can access.

  In this case, it is preferable that the shelf is arranged in a transport path of a container between the first placement unit and the second placement unit (Claim 7).

  According to this, a conveyance part can access a shelf easily.

  In this case, it is preferable that a plurality of storage devices are placed side by side along the transport path of the storage device by the transport unit.

  According to this, the conveyance unit can improve the conveyance amount by accessing more containers. In addition, since all of these containers are arranged on the conveyance path, the conveyance efficiency can be improved.

  In this case, the transport unit further includes a third transport mechanism that transports the storage device between the first placement unit and the shelf, and a storage device between the second placement unit and the shelf. And a fourth transport mechanism for transporting the vehicle (claim 9).

  By providing separate third and fourth transport mechanisms, the transport of the container between the first placement unit and the shelf and the transport of the container between the second placement unit and the shelf can be performed independently. It can be carried out. Thereby, conveyance efficiency can be improved.

In this case, the third transport mechanism is movable along one side of the shelf, and the container is loaded and unloaded from one side of the shelf, and the fourth transport mechanism is connected to the shelf. It is preferable that the container is movable along the other side and the container is carried in and out from the other side of the shelf.

  Since the transport paths of the third transport mechanism and the fourth transport mechanism are different, the operations of the third transport mechanism and the fourth transport mechanism are not buffered. In addition, since the shelf can be accessed from two sides, both the third transport mechanism and the transport path of the fourth transport mechanism can be formed along the shelf. Therefore, the conveyance efficiency does not decrease.

  In this case, there are a plurality of the second placement units, and each of the second placement units is disposed on an extension line of the shelf, and the fourth transport mechanism is along a side opposite to the first processing unit side of the shelf. (Claim 11).

  By arrange | positioning a 2nd mounting part on the extension line | wire of a shelf, the conveyance path | route of a 4th conveyance mechanism can be made into a straight line. Moreover, the conveyance amount of the board | substrate between an accommodating part and a 2nd process part can be improved by using two or more 2nd mounting parts.

  Moreover, in each invention mentioned above, in the substrate processing apparatus in any one of Claims 1-11, while separating the said accommodating part and the said 1st process part, the said 1st mounting part A first partition having a first passage through which a substrate is passed to face the container placed on the first container, a first shutter member that opens and closes the first passage of the first partition, and the housing A second partition that is spaced apart from the first processing unit and has a second passage opening that allows the substrate to pass through the container placed on the second placement unit; and the second partition A second shutter member that opens and closes the second passage opening, and the first transport mechanism has a plurality of sheets via the first passage opening with respect to the container placed on the first placement portion. The substrate is carried in and out, and the second transport mechanism is placed on the second placement portion. It carries the substrate one by one through the second passage opening with respect to the vessel, and it is preferable to carry-out (claim 12).

  By providing the first and second partition walls and the first and second shutter members, the atmosphere of the housing portion does not reach the first and second processing portions. Therefore, in the first and second processing units where the substrate is taken out from the container, the substrate is not contaminated by the atmosphere of the container.

  In this case, the storage device has an opening formed on one side surface and includes a lid that closes the opening, and the first shutter member has a first attachment / detachment holding mechanism that attaches / detaches and holds the lid of the storage device. Preferably, the second shutter member includes a second attachment / detachment holding mechanism that attaches / detaches / holds the lid of the container.

  By providing the first and second attachment / detachment holding mechanisms, the lid of the container is detached by the first and second shutter members that open and close the first and second passage ports, so that the interior of the container is the first and second. Only open to two processing units. Therefore, since the atmosphere of the storage portion that stores the storage device does not enter the storage device, the substrate in the storage device is not contaminated.

  Further, in each of the above-described inventions, the first processing unit collectively performs cleaning processing and drying processing on a plurality of substrates, and the second processing unit performs cleaning processing and drying processing on a substrate basis. Preferred (claim 14).

  According to this, the cleaning process and the drying process can be performed on the substrate by either a method of processing a plurality of substrates at once or a method of processing the substrates one by one.

  In this case, it is preferable that the cleaning process performed by the second processing unit cleans at least the peripheral edge of the back surface of the substrate.

  According to the substrate processing apparatus of the present invention, by providing the first processing unit and the second processing unit, either a method of processing a plurality of substrates at a time or a method of processing a substrate one by one Also, the substrate can be processed. Moreover, the atmosphere in a storage part can be kept normal by providing the storage part which accommodates a storage device. Further, by providing the first placement unit and the second placement unit, the transfer of the substrate between the first processing unit and the second processing unit is performed once through the storage unit. Thereby, since the substrate is not directly transferred between the first processing unit and the second processing unit, the control of the first processing unit and the second processing unit may be controlled independently. Both can be coordinated and adjusted by the control of the housing.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment.

  The substrate processing apparatus according to the first embodiment is an apparatus that performs a predetermined process on a substrate W (for example, a semiconductor wafer), and is a hermetically sealed container that stores a plurality of substrates W (so-called FOUP (front opening unified pod)). (Hereinafter referred to simply as “hoop”), a storage unit 1 that can store F, a first processing unit 3 that processes a plurality of substrates W at once, and a substrate W processed one by one. The second processing unit 5 can be broadly divided. In addition, the hoop F is equivalent to the container in this invention.

  As shown in FIG. 1, the first processing unit 3 and the second processing unit 5 are arranged side by side on one side of the storage unit 1. As a result, the storage unit 1 directly faces the first processing unit 3 and the second processing unit 5.

  In addition, a mounting table 9 on which four FOUPs F are mounted is attached to the side of the storage unit 1 opposite to the first processing unit 3 and the second processing unit 5. On the mounting table 9, a hoop F that is carried into the housing unit 1 and a hoop F that is carried out from the housing unit 1 are placed.

  Please refer to FIG. FIG. 2 is a perspective view of the hoop F. FIG. The hoop F includes a casing 11 having an opening formed on one side surface thereof, and a lid 13 that is detachably fitted into the opening. Horizontal grooves 15 are formed in multiple stages on the inner wall 11a of the housing 11, and by placing the end portions of the respective substrates W on these grooves 15, a plurality of (for example, 25) substrates W are placed in a horizontal posture. Support with. The lid 13 is provided with a fixing mechanism 17 for the housing 11, and the lid 13 is fixed to the housing 11 in a state where the lid 13 is fitted into the opening.

  Specifically, the rack includes two racks 17a and 17b with teeth at the base end, and a pinion 17c that is disposed between the racks 17a and 17b and meshes with the teeth of the racks 17a and 17b. By rotation, the two racks 17a and 17b are configured to protrude from the upper end or the lower end of the lid 13, respectively. Thereby, the lid 13 is fixed to the housing 11 and the inside of the hoop F is sealed. The lid 13 corresponds to the lid in the present invention.

  Please refer to FIG. 3, FIG. 4 and FIG. FIG. 3 is a plan view of the storage unit 1, FIG. 4 is a front view of the shelf 19, and FIG. 5 is a side view showing a part of the storage unit 1 and the first processing unit 3. The housing unit 1 for housing the hoop F includes a shelf 19 on which the hoop F is placed, a first stage 21 on which the hoop F on which the substrate is transferred between the first processing unit 3 and a second stage 21. Three second stages 23 on which the FOUP F for transferring the substrate to and from the processing unit 5 is placed, and a first FOUP transport mechanism 25 for transporting the FOUP F between the shelf 19 and the first stage 21. And a second hoop transport mechanism 27 that transports the hoop F between the mounting table 9, the shelf 19, and the second stage 23. Further, a side wall 31 is provided around the housing portion 1, and the inside of the housing portion 1 is shielded from the external atmosphere. In the present specification, a surface of the side wall 31 that separates the storage unit 1 from the first processing unit 3 is particularly referred to as a first partition wall 31 a, and the storage unit 1 and the second processing unit 5 are separated from each other. This surface is particularly referred to as a second partition wall 31b.

  The shelf 19 is provided at four positions in the vertical direction at a position facing the first processing unit 3 in the approximate center of the storage unit 1 described above. The shelf 19 includes five side plates 19a erected at equal intervals in parallel to the vertical direction, and 16 pairs of receiving members 19b provided to face the side plates 19a. The FOUP F is placed by hanging both ends of the FOUP F on the set of receiving members 19b. Therefore, the shelf 19 can place four hoops F side by side, and can place 16 hoops F as a whole. Further, the distance between the pair of receiving members 19b is wider than the width of the hoop arms 26a, 28a of the first and second hoop transport mechanisms 25, 27 and narrower than the width of the hoop F. Therefore, each hoop arm 26a, 28a can pass vertically between the pair of receiving members 19b.

  The first stage 21 is provided in the vicinity of the first partition wall 31a and places a single hoop F thereon. The first stage 21 has a “C” shape (or a U shape) in plan view, and a hoop arm 26 a can pass vertically through the center of the first stage 21. In addition, a slide mechanism 22 is provided on the side of the first stage 21 and can move forward and backward with respect to the first partition wall 31a.

  The slide mechanism 22 is a screw feed that drives the first stage 21 forward and backward by rotating a screw shaft 22a that is screwed into a convex portion 21a provided on the side of the first stage 21 with an electric motor (not shown). Mechanism. The first stage 21 corresponds to the first placement portion in the present invention.

  The three second stages 23 are provided side by side in the horizontal direction on the second partition wall 31b, and each has one hoop F mounted thereon. Each second stage 23 has a shape of a letter “C” in plan view, and a hoop arm 28 a can pass through the center in the vertical direction. A slide mechanism (not shown) is provided below the second stage 23, and is configured to be movable back and forth with respect to the second partition wall 31b. This slide mechanism is also a screw feeding mechanism, like the slide mechanism 22. The second stage 23 corresponds to the second placement portion in the present invention.

  As shown in FIG. 5, the first hoop transport mechanism 25 includes a horizontal driving unit 25a, a base 25b mounted on the horizontal driving unit 25a, a lifting shaft 25c that moves up and down with respect to the base 25b, and a lifting shaft 25c. And an articulated robot 26 provided at the upper end of the robot. In addition, a screw shaft 29 a and a guide shaft 29 b are laid between the shelf 19 and the first processing unit 3 and in a direction along the shelf 19 in the storage unit 1. One ends of the screw shaft 29a and the guide shaft 29b extend to the vicinity of the first stage 21. The horizontal drive unit 25a moves horizontally along the screw shaft 29a and the guide shaft 29b. The articulated robot 26 has a substantially triangular shape in plan view from the tip side thereof, and a hoop arm 26a on which the hoop F is placed, and a first link 26b that rotatably holds the hoop arm 26a in a horizontal plane. And a second link 26c that rotatably holds the first link 26b in a horizontal plane. Further, the second link 26c is held so as to be rotatable within the upper end portion of the elevating shaft 25c and a horizontal plane.

  The hoop arm 26a moves forward and backward with respect to the lifting shaft 25c when the first link 26b and the second link 26c bend and extend. The second link 26c further rotates with respect to the lifting shaft 25c, so that the hoop arm 26a pivots around the lifting shaft 25c. Further, the elevating shaft 25c moves up and down with respect to the base 25b, and the horizontal driving unit 25a moves horizontally along the screw shaft 29a, so that the hoop arm 26a faces the shelf 19 or the first stage 21. Move freely.

  When the first hoop transport mechanism 25 places the hoop F on the shelf 19, the hoop arm 26a holding the hoop F is lowered between the pair of receiving members 19b from above to below. Thereby, when the hoop arm 26a passes between the pair of receiving members 19b, the hoop F is transferred from the hoop arm 26a to the shelf 19. Conversely, when the hoop F is taken out from the shelf 19, the hoop arm 26a is raised from below to above between the pair of receiving members 19b on which the hoop F is placed. Thereby, when the hoop arm 26 a passes between the pair of receiving members 19 b of the shelf 19, the hoop F placed on the shelf 19 is received.

  Also, when the first hoop transport mechanism 25 places the hoop F on the first stage 21 or when the hoop F is taken out from the first stage 21, the hoop arm 26a is moved as in the case of the shelf 19 described above. What is necessary is just to make it move up and down. The 1st hoop conveyance mechanism 25 is equivalent to the 3rd conveyance mechanism in this invention.

  The second hoop conveyance mechanism 27 has the same configuration as the first hoop conveyance mechanism 25. That is, as shown in parentheses in FIG. 5, the horizontal drive unit 27a, the base 27b mounted on the horizontal drive unit 27a, the lifting shaft 27c that moves up and down relative to the base 27b, and the lifting shaft 27c And an articulated robot 28 provided at the upper end. In addition, a hoop arm 28a on which the hoop F is placed is attached to the tip of the articulated robot. The hoop arm 28a is configured to be movable back and forth and swivel with respect to the lifting shaft 27c, and to be movable up and down with respect to the base 27b.

  The screw shaft 30a and the guide shaft 30b forming the transport path of the second hoop transport mechanism 27 are on the opposite side of the shelf 19 from the first processing unit 3 side (or the second processing unit 5 side) and on the shelf 19. It is laid along the direction. Further, it extends from a position facing the mounting table 9 to a position facing the second processing unit 5. Therefore, the screw shaft 29a and the like forming the transport path of the first hoop transport mechanism 25 are on the opposite side with the shelf 19 in between.

  Then, the second hoop transport mechanism 27 transports the hoop F among the placement unit 9, the shelf 19, and the second stage 23. When the FOUP F is delivered to the placement unit 9, the shelf 19, and the second stage 23, as in the case of the first FOUP transport mechanism 25, the FOUP arm 28a is moved up and down. The second hoop transport mechanism 27 corresponds to the fourth transport mechanism in the present invention.

  In the side wall 31 provided between the storage unit 1 and the mounting table 9, four openings are provided at positions facing the hoop F mounted on the mounting table 9. These openings are formed to be slightly larger than the hoop F and allow the hoop F to pass therethrough. Further, four blocking plates 33 that close each opening are provided so as to be movable up and down. These blocking plates 33 move up and down only when the second hoop transport mechanism 27 accesses the mounting table 9 to open the opening. Thereby, the hoop arm 28a can convey the hoop F to the mounting table 9 through the opened opening, and normally seals the inside of the accommodating portion 1.

  In addition, the first partition wall 31 a is provided with a single first passage opening substantially the same size as the FOUP F at a position facing the FOUP F placed on the first stage 21. The first passage opening is an opening through which the substrate W transported between the FOUP F and the first processing unit 3 passes. When the hoop F is not placed on the first stage 21, the first passage port is closed by the first shutter member 35.

  Please refer to FIG. FIG. 6 is a perspective view of the first shutter member 35. The first shutter member 35 has a convex portion that is substantially the same size as the first passage opening, and is fitted into the first passage opening to close the first passage opening. Near the center of the first shutter member 35, a first connecting member 35a corresponding to the fixing mechanism 17 provided on the lid 13 of the container is provided. The first connecting member 35a has a shape connectable to the pinion 17c constituting the lock mechanism, and rotationally drives the connected pinion 17c. As a result, the lid 13 can be fixed to the housing 11 and the lid 13 can be detached from the housing 11. When the lid 13 can be detached from the housing 11, the first shutter member 35 holds the lid 13 as it is. The first shutter member 35 and the first connecting member 35a correspond to the first shutter member and the first attachment / detachment holding mechanism in the present invention, respectively.

  The first shutter member 35 is supported by the shutter drive unit 39 via an L-shaped arm 37. The shutter drive unit 39 includes a horizontal drive unit 39a that drives the arm 37 in the horizontal direction and a vertical drive unit 39b that drives the arm 37 in the vertical direction. Both the horizontal drive unit 39a and the vertical drive unit 39b are A screw feed mechanism is used. By the shutter drive unit 39, the first shutter member 35 moves forward and backward with respect to the first partition wall 31a and moves up and down in the vertical direction.

  With reference to FIG. 7, the operation of the first shutter member 35 for opening and closing the first passage port will be specifically described. FIG. 7 is a side view for explaining the operation of the first shutter member 35. When the hoop F is placed on the first stage 21, the hoop F is driven forward together with the first stage 21, and the lid 13 of the hoop F contacts the first shutter member 35 that closes the first passage port. Touch. At this time, the first connecting member 35 a operates the fixing mechanism 17 provided on the lid 13 to allow the lid 13 to be detached from the housing 11, and the first shutter member 35 holds the lid 13. After that, the shutter drive unit 39 once retracts the first shutter member 35 holding the lid 13 and then lowers it. Thereby, the lid 13 of the hoop F on the first stage 21 is removed, and the inside of the hoop F is opened to the first processing unit 3 through the first passage port.

  When closing the first passage port, the first shutter member 35 holding the lid 13 is again lifted and moved forward and fitted into the first passage port. At this time, the lid 13 held by the first shutter member 35 is also fitted into the opening of the housing 11 of the hoop F placed on the first stage 21. Then, the first connecting member 35 a operates the fixing mechanism 17 to fix the lid 13 to the housing 11. As a result, the first passage port is closed again and the lid 13 is attached to the hoop F.

  In the second partition wall 31 b, three second passage openings having substantially the same size as the FOUP F are provided at positions facing the FOUP F placed on the second stage 23. The second passage opening is an opening through which the substrate W transported between the FOUP F and the second processing unit 5 passes. When the hoop F is not placed on the second stage 23, each second passage port is closed by the three second shutter members 36.

  The second shutter member 36 has the same configuration as the first shutter member 35. That is, as shown in parentheses in FIG. 6, each second shutter member 36 includes a second connecting member 36 a that operates the fixing mechanism 17 at the approximate center thereof. Further, each second shutter member 36 is supported by a shutter driving unit (not shown) via an L-shaped arm 38, and is configured to be movable in the horizontal direction and the vertical direction independently of each other. Then, when the second shutter member 36 moves forward and backward and moves up and down, the second passage port corresponding to the second shutter member 36 is opened and closed. At this time, the lid 13 of the hoop F corresponding to the second passage port is attached or removed. The second shutter member 36 and the second connecting member 36a correspond to the second shutter member and the second attachment / detachment holding mechanism in the present invention, respectively.

  Next, the first processing unit 3 will be described. The first processing unit 3 includes a first transfer mechanism 41 that loads and unloads the substrates W in and out of the FOUP F placed on the first stage 21, and a substrate between the first transfer mechanism 41 and the first transfer mechanism 41. A substrate placement unit 43 that delivers the W group, a pusher 44 that delivers the substrate W group at a time between the substrate placement unit 43, and a batch that delivers the substrate W group between the pusher 44. The substrate W group is transferred between the processing unit transport mechanism (hereinafter simply referred to as “fifth transport mechanism”) 45 and the fifth transport mechanism 45, and the substrate W group in a vertical posture is collectively processed. And a batch processing unit 47. Here, the substrate platform 43 further collectively converts the posture of the substrate W group between the horizontal posture and the vertical posture. Further, the fifth transport mechanism 45 further changes the pitch of the substrate W. Hereinafter, each part will be described.

  As shown in FIG. 7, the first transport mechanism 41 includes a base 41a that is fixedly installed at a position facing the first stage 21 across the first partition wall 31a, and a multiplicity provided on the base 41a. It has a joint robot 41b. The articulated robot 41b includes a transfer arm 42 on the tip side. The transfer arm 42 is configured to be capable of moving forward and backward and turning with respect to the base 41a by the articulated robot 41b. The transfer arm 42 is provided with a set of two hands 42a extending in parallel in the horizontal direction in multiple stages, and a plurality of substrates W (hereinafter referred to as a group of substrates W as appropriate) are placed in a horizontal posture. . The number of steps of the hand 42a is preferably the number of steps corresponding to the number of sheets in which the FOUP F stores the substrate W, and is 25 in this embodiment.

  In the first transport mechanism 41, when the lid 13 of the hoop F placed on the first stage 21 is removed by the first shutter member 35, the transport arm 42 moves forward and enters the first passage port. Then, the substrate W group is carried into or out of the FOUP F at a time. In addition, the transport arm 42 turns to deliver the substrate W group in a lump in a horizontal posture to the substrate platform 43 disposed beside the first transport mechanism.

  The substrate platform 43 is disposed beside the first transport mechanism 41. Please refer to FIG. 8A is a plan view (upper stage) and a side view (lower stage) of the substrate platform 43 when the support base 43a is in a horizontal posture, and FIG. 8B is a view when the support base 43a is in a vertical posture. They are a top view (upper stage) and a side view (lower stage) of the substrate mounting part 43 of FIG. The substrate platform 43 is provided with a support base 43a, and a plurality of (for example, four) holders 43b that are provided on the support base 43a and hold a plurality of (for example, 25) substrates W in multiple stages. Is provided. The support base 43a is rotationally driven around the horizontal axis P at the base end portion of the support base 43a by a drive mechanism (not shown). Thereby, the support base 43a takes a horizontal posture as shown in FIG. 8A and a vertical posture as shown in FIG. 8B. At this time, the holders 43b are also rotated in conjunction with the support base 43a, so that the substrate W group held by these holders is also changed in posture between the horizontal posture and the vertical posture.

  Further, in order to deliver the substrate W group to and from the pusher 44, the substrate platform 43 is configured to be rotatable around the vertical axis when the support base 43a is in a horizontal posture.

  A pusher 44 is disposed beside the substrate platform 43. The pusher 44 is configured to be movable up and down by a drive mechanism (not shown) and horizontally movable between the substrate platform 43 and the fifth transport mechanism 45. The upper end of the pusher 44 has a plurality of grooves formed in parallel to each other, and the substrate W can be held together by bringing the substrate W into contact with each groove. In this embodiment, the pusher 44 can hold a group of substrates W that is twice (for example, 50) the number of substrates W placed on the substrate platform 43, and the pitch of the substrate platform 43 is determined by the substrate platform 43. The half of the pitch of the substrate to be placed (hereinafter referred to as “half pitch” as appropriate).

  Please refer to FIG. FIG. 9 is a front view of the pusher 44 and the substrate platform 43, and FIGS. 9A and 9B show how the substrate is transferred. When the substrate W group is transferred between the pusher 44 and the substrate platform 43, as shown in FIG. 9A, the support base 43a of the substrate platform 43 is in a vertical posture. The pusher 44 is located below the substrate platform 43. Then, as shown in FIG. 9B, the pusher 44 rises in the vertical direction so as to push up the lower end of the group of substrates W placed on the substrate platform 43, and the substrate W from the substrate platform 43. Receive a group at once.

  The fifth transport mechanism 45 is configured to be movable in the horizontal direction along the batch processing unit 47 by a driving mechanism (not shown). The fifth transport mechanism 45 includes a pair of holding rods 45a extending horizontally, and holds the substrate W group together on the holding rods 45a. The transfer of the substrate W group between the fifth transport mechanism 45 and the pusher 44 is performed at a standby position that does not face the batch processing unit 47.

  The holding rod 45a has a substantially pentagonal cross section, and predetermined grooves are formed on each surface. The holding rod 45a itself is rotatably supported, and at least three substrate holding states can be obtained by changing the arrangement of the opposing grooves. That is, in the first substrate holding state Q1, the holding rod 45a does not act on the substrate W group passing between the holding rods 45a, and the passage of the substrate W group is allowed as it is. The second substrate holding state Q2 is received by the holding rod 45a when the substrate W group (particularly referred to as “substrate W1 group”) having the same pitch as the substrate platform 43 descends between the holding rods 45a. However, it does not act on the half-pitch substrate W group (particularly referred to as “substrate W2 group”) and is allowed to pass through as it is. The third substrate holding state Q3 is a state to be received when the substrate W group (particularly referred to as “substrate W3 group”), which is a combination of the substrate W1 group and the substrate W2 group, descends between the holding rods 45a.

  A state of transferring the substrate W group between the fifth transport mechanism 45 including the holding rod 45a and the pusher 44 will be specifically described with reference to FIG. FIG. 10 is a side view showing how the substrate W group is transferred between the pusher 44 and the fifth transport mechanism 45.

  First, the holding rod 45a is in the first substrate holding state Q1, and the pusher 44 is positioned at a predetermined position below the holding rod 45a with the substrate W group placed thereon. In addition, this board | substrate W group is the same number as the board | substrate W mounted in the board | substrate mounting part 43, and a pitch. Then, it passes between the holding rods 45a and rises upward. At this time, the group of substrates W placed on the pusher 44 does not receive an action from the holding rod 45a, and thus remains placed on the pusher 44 (see FIG. 10A).

  Next, the holding rod 45a is changed to the second substrate holding state Q2, and the pusher 44 is lowered. When the pusher 44 passes through the holding rod 45a, the substrate W group placed on the pusher 44 is received by the holding rod 45a (see FIG. 10B).

  When the pusher 44 collectively receives separate substrates W from the substrate platform 43, the pusher 44 is positioned at a position shifted from the predetermined position below the holding rod 45a by a half pitch in the direction of the holding rod 45a. It should be noted that the separate substrate W group itself placed on the pusher 44 has the same number and pitch as the substrate W placed on the substrate platform 43. When the space between the holding rods 45a rises, the substrate W group placed on the pusher 44 rises so as to interrupt between the substrate W groups held by the holding rod 45a. Then, when the pusher 44 passes the holding rod 45a, the pusher 44 receives the substrate W group held by the holding rod 45a so as to push up. As a result, a group of substrates W corresponding to twice the number of substrates W placed on the substrate platform 43 is placed on the pusher 44 at a half pitch (see FIG. 10C).

  Finally, the holding rod 45a is changed to the third substrate holding state P3, and the pusher 44 is lowered. When the pusher 44 passes through the holding rod 45a, the group of substrates W placed on the pusher 44 is received by the holding rod 45a (see FIG. 10D).

  With the above operation, the substrate W group is transferred between the fifth transport mechanism 45 and the pusher 44, and the pitch of the substrate W group is also changed.

  The batch processing unit 47 of this embodiment includes a single drying processing unit 49 and three sets of cleaning processing units 51. Each cleaning processing unit 51 is provided with a single pure water cleaning processing unit 53 and a single chemical cleaning processing unit 55. Note that such a configuration of the batch processing unit 47 is merely an example, and the processing content of the batch processing unit 47 can be changed as appropriate, for example, by performing a resist stripping process.

  Please refer to FIG. FIG. 11 is a schematic configuration diagram of the drying processing unit 49. The drying processing unit 49 is a spin dryer, and includes a drying container 49a having an opening formed at an upper portion thereof capable of transporting the substrate W group, and a slide lid 49b that opens and closes the opening by sliding movement. In the drying container 49a, there are provided a rotation holding portion 49c that holds the substrate W group in a vertical posture so that the substrate W group can rotate, and a drying pusher 49d that holds the substrate W group in a vertically movable manner. Further, a nozzle 49e for supplying nitrogen gas and a rinsing liquid is provided on the side wall of the drying container 49a. Furthermore, it communicates with a vacuum suction source for depressurizing the inside of the drying container 49a and a drainage processing unit for processing drainage discharged from the drying container 49a.

  The transfer of the substrate W group to and from the fifth transport mechanism 45 is performed above the drying container 49a when the drying pusher 49d is raised (in FIG. 11, the substrate W group is transferred to and from the fifth transport mechanism 45). The drying pusher 49d is indicated by a dotted line). Further, the drying pusher 49d transfers the substrate W group to and from the rotation holding unit 49c in the drying container 49a. When performing the drying process, the drying pusher 49d is lowered to the bottom of the drying container 49a so as not to be buffered with the rotating rotation holding part 49c and the like (in FIG. (Indicated by a solid line).

  Please refer to FIG. The pure water cleaning processing unit 53 is provided at the bottom of the pure water tank 53a for storing the cleaning liquid, the injection pipe 53b for supplying pure water, and the upper opening of the pure water tank 53a, and overflows. And an outer tank 53c for collecting pure water.

Since the chemical solution cleaning unit 55 has a configuration similar to that of the pure water cleaning processing unit 53, the illustration thereof is omitted, but a chemical solution tank that stores the chemical solution and an injection that is provided at the bottom of the chemical solution tank and supplies a resist stripping solution. It has a tube and an outer tank for collecting the processing liquid. Examples of chemicals include APM (Ammonia-Hydrogen Peroxide Mixture), HPM (Hydrochloric acid-Hydrogen Peroxide Mixture), FPM (Hydrofluoric acid-Hydrogen Peroxide Mixture), DHF (Diluted Hydrofluoric acid), O ₃ / DIW (ozone water), and the like. Are appropriately selected.

  In addition, each cleaning processing unit 51 includes a single lifter 57 configured to be movable between the pure water cleaning processing unit 53 and the chemical cleaning processing unit 55. The lifter 57 includes a plurality (three) of holding rods 57a extending in the horizontal direction, and can collectively abut and support the substrate W group on the holding rod 57a. In the present embodiment, the holding rod 57a abuts and supports a group of substrates W, which is twice the number of substrates W placed on the substrate platform 43, at a half pitch.

  In the transfer of the substrate W group between the lifter 57 and the fifth transport mechanism 45, as shown in FIG. 12B, the lifter 57 moves up between the holding rods 45a from below to hold the substrate W group up. The rod 57a is contacted and supported. Thereafter, after the holding rod 45a is changed to the first substrate holding state P1, the lifter 57 is lowered while holding the substrate W group, whereby the reception of the substrate W group by the lifter 57 is completed.

  In the present embodiment, the lifter 57 receives the substrate W group before the batch processing unit 47 performs processing, above the chemical solution cleaning processing unit 55. In addition, the group of substrates W processed by the cleaning processing unit 51 is transferred to the fifth transport mechanism 45 above the pure water cleaning processing unit 53.

  Next, the second processing unit 5 will be described. The second processing unit 5 includes a second transport mechanism 61 that loads and unloads the substrates W one by one with respect to the FOUP F placed on the second stage 23, and the second transport mechanism 61 and the substrate W 1 A single wafer processing section transport mechanism (hereinafter simply referred to as a “sixth transport mechanism”) 67 that delivers the sheets one by one, and a single wafer processing section that cleans and dries the substrates W loaded from the sixth transport mechanism 67 one by one. 71. Hereinafter, each part will be described.

  Please refer to FIG. FIG. 13 is a side view of the second transport mechanism 61. The second transport mechanism 61 includes a horizontal driving unit 62a, a base 62b mounted on the horizontal driving unit 62a, a lifting shaft 62c that moves up and down with respect to the base 62b, and a multi-joint provided at the upper end of the lifting shaft 62c. And a robot 63. In the second processing unit 5, a screw shaft 65 a and a guide shaft 65 b are laid along the second partition wall 31 b at a position facing the housing unit 1. The screw shaft 65 a and the guide shaft 65 b extend in a range facing the three second stages 23. The horizontal drive unit 62a moves horizontally along the screw shaft 65a and the guide shaft 65b.

  A holding arm 63 a that has an “I” shape and holds a single substrate W is attached to the tip side of each articulated robot 63. The holding arm 63a can be moved back and forth and turned by the multi-joint robot 63. The holding arm 63a can be moved up and down and moved horizontally by the horizontal drive unit 62a and the lifting shaft 62c.

  With the above-described configuration, the second transport mechanism 61 operates as follows. First, the second shutter member 36 removes the lid 13 of the hoop F placed on any one of the second stages 23. After the second transport mechanism 61 moves horizontally to a position facing the FOUP F, the holding arm 63a moves up and down according to the height of the substrate W in the FOUP F. Then, when entering the second passage port and moving forward to below the single substrate W accommodated in the FOUP F, the substrate W is held on the holding arm 63a. Thereafter, the substrate W moves backward and unloads the substrate W from the hoop F. When the substrate W is unloaded, the second transport mechanism 61 moves horizontally to a position facing a sixth transport mechanism 67 described later, and delivers the unloaded substrate W to the sixth transport mechanism 67.

  When receiving the substrate W from the sixth transport mechanism 67, the second transport mechanism 61 transports the substrate W into the FOUP F.

  The sixth transport mechanism 67 includes two articulated robots that are independently driven by a movable base that can be moved up and down. Holding arms 70a and 70b for holding a single substrate W are attached to the tip side of each articulated robot. The holding arms 70 a and 70 b have a “U” shape, and can suitably transfer the substrate W to and from the holding arm 63 a having a “I” shape. These holding arms 70a and 70b can move forward and backward and swivel independently of each other. The holding arms 70a and 70b can be moved up and down in synchronization with each other.

  The sixth transport mechanism 67 delivers the substrates W to the second transport mechanism 61 one by one, and loads / unloads the substrates W to / from the single wafer processing unit 71.

  In the present embodiment, one of the holding arms 70a and 70b of the sixth transport mechanism (for example, the holding arm 70a) holds only a single substrate W before processing is performed in the single wafer processing unit 71, The other (for example, the holding arm 70b) holds only the single substrate W after the processing is performed by the single wafer processing unit 71, and separates the holding arm 70 to be used according to the substrate W to be held. Yes.

  When the single wafer processing unit 71 does not need to distinguish between the four processing units 72a, 72b, 72c, 72d (hereinafter, each processing unit 72a, 72b,...) Disposed around the sixth transport mechanism. Are collectively referred to as “processing unit 72”.

  Refer to FIG. FIG. 14 is a perspective view showing an outline of the processing unit 72. The processing unit 72 is disposed so as to be displaceable above the substrate W, a substrate holding unit 73a that holds the substrate W in a horizontal posture, a motor 73b that rotationally drives the substrate holding unit 73a, and discharges a cleaning liquid onto the surface of the substrate W. And a back rinse nozzle 73d that is disposed below the substrate W and discharges the cleaning liquid to the back surface of the substrate W. In the present embodiment, the back rinse nozzle 73d is disposed so as to face the end portion of the lower surface of the substrate W, and in particular, cleans the peripheral portion of the back surface of the substrate W. A cup (not shown) that prevents the cleaning liquid from splashing is disposed around the substrate W. Further, a blowing unit (not shown) is provided above the substrate W, and clean gas can flow down to the substrate surface.

  An example of the operation of the substrate processing apparatus configured as described above will be described with reference to FIG.

<Step S1> The substrate W is transported from the storage unit to the second processing unit.
The second hoop transport mechanism 27 transports the hoop F storing the unprocessed substrate W group from the shelf 19 to any one of the second stages 23. After the hoop F placed on the second stage 23 slides, the lid 13 is removed by the second shutter member 36 corresponding to the second stage 23. The holding arm 63a of the second transport mechanism 61 takes out the substrates W in the FOUP F one by one through the second passage port.

  After the second transport mechanism 61 repeats this operation and takes out all the substrates W from the FOUP F, the second shutter member 36 moves forward and rises again and is fitted into the second passage opening. A lid 13 is attached and fixed to the housing 11. Thereby, the transfer of the substrate W from the storage unit 1 to the second processing unit 5 is completed.

  Note that the substrates W carried out one by one from the FOUP F by the second transport mechanism 61 are transferred from the second transport mechanism 61 to the sixth transport mechanism 67 one by one. When the sixth transport mechanism 67 receives the substrate W by the holding arm 70 a, the sixth transport mechanism 67 transports the single substrate W to the processing unit 72.

<Step S2> Processing the substrates W one by one in the second processing unit When the substrate holding unit 73a in the processing unit 72 holds the loaded substrate W in a horizontal posture, the substrate holding unit 73a is driven by the motor 73b. Rotate. The cleaning liquid is discharged from the nozzle 73c to clean the surface of the substrate W, and the cleaning liquid is discharged from the back rinse nozzle 73d to clean the peripheral edge of the back surface of the substrate W. When the predetermined cleaning process is completed, the substrate W is further rotated at a higher speed, a clean gas is caused to flow from the blow-out unit (not shown) to the substrate W, and the moisture on the surface of the substrate W is shaken off and dried. .

<Step S3> The substrate W is transferred from the second processing unit to the storage unit.
When the predetermined processing is completed for the single substrate W in the processing unit 72, the sixth transport mechanism 67 places the single substrate W on the holding arm 70b and transports the substrate W from the processing unit 72. To do.

  When the second transport mechanism 61 receives the substrate W, the second transport mechanism 61 horizontally moves to a position facing the second stage 23 again. On the second stage 23, the hoop F not containing the substrate W is placed, and the lid 13 of the hoop F is removed by the second shutter member 36. The second transport mechanism 61 carries the substrate W group one by one into the FOUP F through the second passage port. When the substrate W is placed in all the grooves 15 of the hoop F, the second shutter member 36 advances and rises again to close the second passage port, and the lid 11 is attached to the casing 11 of the hoop F. Install and fix. Thereby, the transfer of the substrate W from the second processing unit 5 to the storage unit 1 is completed.

<Step S <b>4> The second hoop transport mechanism 27 that transports the hoop F from the second stage to the first stage stores the hoop F storing the substrate W processed in the second processing unit 5 from the second stage 23. It is conveyed to 19.

  When the hoop F is placed on the shelf 19, the first hoop conveyance mechanism 25 conveys the hoop F from the shelf 19 to the first stage 21. When the hoop F is placed on the first stage 21, the first stage 21 slides toward the first partition wall 31 a, and the lid 13 of the hoop F contacts the first shutter member 35.

<Step S5> The first shutter member 35 that transports the substrate W from the storage unit to the first processing unit moves backward and downward, removes the lid 13 of the hoop F placed on the first stage 21, and Open the first passage. The transport arm 42 of the first transport mechanism 41 takes out a plurality of substrates W in the FOUP F through the first passage port.

  After the substrate W group is taken out from the FOUP F, the first shutter member 35 is fitted into the first passage port again, and the lid 13 is attached and fixed to the housing 11 of the FOUP F. Thereby, the transfer of the substrate W from the storage unit 1 to the first processing unit 3 is completed.

  In the first processing unit 3, the group of substrates W carried out by the first transport mechanism 41 is delivered to the batch processing unit 47. The flow will be briefly described below.

  When the first transport mechanism 41 unloads the substrate W group from the FOUP F, the first transport mechanism 41 turns in the direction facing the substrate platform 43 as it is, and then moves forward toward the substrate platform 43. Then, the substrate W group is placed on the substrate platform 43 in a horizontal posture.

  The substrate platform 43 rotates around the vertical axis. Then, it rotates around the axis P of the base end portion of the support base 43a to take a vertical posture. Along with this operation, the 25 substrates W held in the holder 43b (in the following description of operation, simply referred to as “substrate W group”) also rotate together and are converted from a horizontal posture to a vertical posture.

  The pusher 44 moves upward from below between the holders 43b of the substrate platform 43, and receives the substrate W group from the substrate platform 43 in a lump. Then, it moves to a predetermined position below the fifth transport mechanism 45 in the standby position.

  The pusher 44 moves up and down between the holding rods 45 a of the fifth transport mechanism 45 to transfer the substrate W group from the pusher 44 to the fifth transport mechanism 45.

  Further, the pusher 44 receives another group of substrates W from the substrate platform 43 again. Then, the separate substrate W group is transferred to the fifth transport mechanism 45 so as to be interrupted between the already transferred substrate W groups. Thereby, the pitch of the substrate W held by the fifth transport mechanism 45 is converted from the pitch of the substrate W placed on the substrate platform 43 to a half pitch that is half of the pitch.

  The fifth transport mechanism 45 that holds the substrate W group moves horizontally above the chemical cleaning unit 55 where the lifter 57 waits.

  The lifter 57 ascends and supports the substrate W group in contact with the holding rod 57a. Thereafter, the lifter 57 descends between the holding rods 45a in the first substrate holding state P1, and receives the substrate W group from the fifth transport mechanism 45 at once.

<Step S6> The plurality of substrates W are collectively processed in the first processing unit. The lifter 57 descends into the chemical tank in which the chemical solution is stored while holding the substrate W group, and collects the substrate W group all together. Soak. As a result, the chemical cleaning process is performed collectively on the substrate W group.

  When the predetermined chemical cleaning process is completed, the lifter 57 moves up to pull up the substrate W group from the chemical tank. Subsequently, the lifter 57 moves horizontally to the pure water tank 53a and descends, and the substrate W group is immersed in the pure water tank 53a at once. Thereby, the pure water cleaning process is performed collectively on the substrate W group.

  When the cleaning process is completed, the lifter 57 rises and pulls up the substrate W group from the pure water tank 53a all at once. The lifter 57 ascends directly above the pure water cleaning processing unit 53 and transfers the substrate W group to the fifth transport mechanism 45.

  The fifth transport mechanism 45 moves horizontally above the drying processing unit 49. The slide lid 49b of the drying processing unit 49 slides and the drying pusher 49d rises from the drying container 49a. When the drying pusher 49d holds the substrate W group in a lump, the drying pusher 49d descends again and transfers the substrate W group to the rotation holding unit 49c. The drying pusher 49d retracts to the drying container 49a, and the slide lid 49b slides to block the opening of the drying container 49a. Thereafter, a predetermined drying process is performed while rotating the substrate W group in a vertical posture.

  When the drying process is completed, the slide lid 49b is opened. Then, when the drying pusher 49d collectively receives the substrate W group from the rotation holding portion 49c, the drying pusher 49d is lifted and transferred to the fifth transport mechanism 45.

  When the drying process is completed, the process performed on the substrate W group in the first processing unit 3 is completed. Thereafter, the substrate W group is transferred from the fifth transport mechanism 45 to the first transport mechanism 41 via the pusher 44 and the substrate platform 43. Note that when the substrate W group is transferred from the fifth transport mechanism 45 to the pusher 44, the pitch of the substrates W is converted from the half pitch to the pitch of the substrates W placed on the substrate platform 43.

<Step S <b>7> The first transport mechanism 41 transports the substrate W from the first processing unit to the storage unit. When the first transport mechanism 41 receives the group of substrates W processed in the first processing unit 3, the first transport mechanism 41 turns in the direction of the first stage 21. Moving. At this time, the hoop F that does not store the substrate W is placed on the first stage 21, and the lid 13 of the hoop F is removed by the first shutter member 35. The first transport mechanism 41 collectively loads the substrate W group into the FOUP F through the first passage port of the first partition wall 31a.

  Thereafter, the first shutter member 35 is lifted and moved forward to close the first passage opening, and the lid 13 is attached and fixed to the housing 11 of the hoop F.

  The first FOUP transport mechanism 25 and the second FOUP transport mechanism 27 are configured to transfer the FOUP F containing the substrate W processed in the first processing unit 3 from the first stage 21 via the shelf 19 to the mounting table 9. Transport to.

  As described above, the substrate processing apparatus according to the first embodiment includes the first processing unit 3 and the second processing unit 5, and is selective from the storage unit 1 to the first processing unit 3 or the second processing unit 5. The substrate W can be transferred to the substrate. Therefore, the processing can be performed also on the substrate W by a method of processing a plurality of substrates W at once or a method of processing the substrates W one by one.

  Since the transfer of the substrate W between the first processing unit 3 and the second processing unit 5 is performed once through the storage unit 1, the substrate W is transferred between the first processing unit 3 and the second processing unit 5. Is not passed directly. Therefore, the overall control of the first processing unit 3 and the second processing unit 5 does not need to be coordinated with each other and can be controlled independently. Moreover, both control and coordination can be achieved by control related to the conveyance of the hoop F of the storage unit 1.

  Further, by arranging the first processing unit 3 and the second processing unit 5 on one side of the storage unit 1, between the storage unit 1 and the first processing unit 3 and between the storage unit 1 and the first processing unit 3. The substrate W can be easily transferred between the two.

  Moreover, the 1st process part 3 and the 2nd process part 5 are respectively provided with the 1st conveyance mechanism 41 and the 2nd conveyance mechanism 61, and between the accommodating part 1 and the 1st process part 3, the accommodating part 1 is provided. The substrate W can be transported between the first processing unit 3 and the first processing unit 3.

  Further, the number of the second stages 23 on which the FOUP F that transfers the substrate W to and from the second processing unit 5 is set to three so that the substrate W is transferred between the second processing unit 5 and the storage unit 1. The amount can be improved.

  Moreover, the accommodating part 1 can accommodate the several hoop F suitably by providing the shelf 19. FIG. Further, the shelf 19 can be accessed from both, and the first hoop transport mechanism 25 and the second hoop transport mechanism 27 are configured to horizontally move along both sides of the shelf 19, The shelf 19 can be accessed efficiently without the operation of the second hoop transport mechanisms 25 and 27 being buffered. Further, the first and second hoop transport mechanisms 25 and 27 can transport the hoop F independently of each other.

  Furthermore, by arranging the second stage 23 on the extended line of the shelf 19, the conveyance path of the second hoop conveyance mechanism 27 can be made a straight line, and the conveyance efficiency can be further increased. Further, by arranging the first stage 21 at one end of the conveyance path of the first hoop conveyance mechanism 25, the conveyance efficiency of the first hoop conveyance mechanism 25 can also be improved.

  In the present embodiment, the first processing unit 3 and the second processing unit 5 are both configured to perform the cleaning process on the substrate W, thereby further improving the processing quality (finish) while ensuring the throughput of the substrate cleaning process. be able to.

  Further, in the processing unit 72 included in the second processing unit 5 that processes the substrates W one by one, a part of the substrate W (for example, the peripheral portion of the back surface of the substrate W) is processed by including the back rinse nozzle 73d. be able to. As a result, the second processing unit 5 can improve the throughput of the second processing unit 5 by performing only the necessary cleaning process on the necessary part in addition to cleaning the entire substrate W.

  Further, when the hoop F is placed on or taken out from the shelf 19, the hoop arms 26a and 28a are configured to be moved up and down between the pair of receiving members 19b, whereby the storage portion 1 can be made compact.

  In addition, since the sealed FOUP F is used as a container for storing the substrate W, there is no possibility that the substrate W is contaminated by the atmosphere around the FOUP F. Moreover, the inside of the hoop F can be more reliably sealed by providing the fixing mechanism 17 in the lid 13.

  The first and second partition walls 31a and 31b, and the first and second shutter members 35 and 36 for closing the first and second passage openings formed in the partition walls 31a and 31b, can be accommodated. Since the atmosphere of the part 1 does not reach the first processing part 3 and the second processing part 5, the substrate W taken out from the FOUP F is not contaminated.

  In addition, the opening in the side wall 31 that is separated from the mounting table 9 is also closed by the blocking plate 33, so that the atmosphere in the housing portion 1 can be kept clean.

Next, Embodiment 2 of the present invention will be described.
FIG. 16 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by giving the same code | symbol.

  As shown in FIG. 16, similarly to the first embodiment, the first processing unit 3 and the second processing unit 5 are arranged so as to be arranged on one side of the housing unit 1. However, the width of the second processing unit 5 is shortened compared to the first embodiment. For this reason, the storage unit 1 reduces the number of second stages 23 to two.

  In the second processing unit 5, the holding arm 66a of the second transport mechanism 66 can access the FOUP F placed on each second stage 23 only by the operation of the articulated robot. 66 does not need to move horizontally in the direction along the second partition wall 31b.

  In the present embodiment, the second transport mechanism 66 horizontally moves in a direction perpendicular to the second partition wall 31b in order to transfer the substrate W to and from the sixth transport mechanism 67.

  In the single wafer processing section 71, the processing units 72 are arranged in two rows and two stages.

  According to the second embodiment, the footprint of the substrate processing apparatus can be further reduced.

  In addition, the second transport mechanism 66 can be omitted from a configuration that moves horizontally in the direction along the second partition wall 31b.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In each of the embodiments described above, the first processing unit 3 and the second processing unit 5 are arranged on one side of the housing unit 1, but the arrangement is not limited thereto. For example, you may arrange | position so that the 1st process part 3 and the 2nd process part 5 may oppose on both sides of the accommodating part 1. FIG. In this case, the 1st process part 3 is arrange | positioned at the one side of the accommodating part 1, and the 2nd process part 5 is arrange | positioned at the other side. Even with such an arrangement, the storage unit 1 can preferably transfer the substrate W between the first and second processing units 3 and 5.

  (2) In each of the embodiments described above, the FOUP F is transported to the mounting table 9 by the second FOUP transport mechanism 27. However, the present invention is not limited to this, and the first FOUP transport mechanism 25 is transported by the mounting table 9. However, the configuration may be such that the hoop F is conveyed. In this case, the transport path of the first hoop transport mechanism 25 is on the mounting table 9 side of the shelf 19, and the first stage 21 is disposed on the extended line of the shelf 19. Further, the transport path of the second hoop transport mechanism 27 is on the second processing unit 5 side of the shelf 19, and the second stage 23 is arranged at one end or both ends of the transport path.

  (3) In each of the above-described embodiments, the second processing unit 5 includes the second transport mechanism 61 and the sixth transport mechanism 67, but is not limited thereto. For example, the sixth transport mechanism 67 is omitted, and the second transport mechanism 61 is configured to transport the substrate W directly between the FOUP F placed on the second stage 23 and the single wafer processing unit 71. May be.

  Further, the second transport mechanism 61 is transported for each single substrate W, but may be changed so that a plurality of substrates W are transported in a lump.

  Furthermore, the second processing unit 5 may newly provide a placement unit that temporarily places the substrate W transported by the second transport mechanism 61. Accordingly, the second transport mechanism 61 can transport the substrate W more smoothly.

  (4) In each of the above-described embodiments, the batch processing unit 47 and the single wafer processing unit 71 are configured to perform the cleaning and drying process, but the present invention is not limited thereto. For example, the resist stripping process or the like may be performed in the batch processing unit 47. Further, the single wafer processing unit 71 may be configured to perform an etching process or a developing process.

  In the operation example, the order in which the substrate W is first transported to the second processing unit 5 and then transported to the first processing unit 3 is exemplified, but the present invention is not limited thereto. It is freely selected according to the processing to be performed on the substrate W.

  (5) In each of the embodiments described above, the batch processing unit 47 and the single wafer processing unit 71 each have a plurality of processing units. However, these numbers are merely examples, and may be appropriately selected and changed. Can do. Further, the number of substrates W and other numerical values shown in the description are also examples, and can be appropriately selected and changed in the same manner.

  (6) In Example 1 mentioned above, although the accommodating part 1 was the structure provided with the single 1st stage 21 and several 2nd stage, it is not restricted to this. For example, the first stage 21 may be added to a plurality, or the second stage 23 may be one.

  (7) In each of the embodiments described above, a spin dryer is used for the drying processing unit 49. However, a drying apparatus that pulls up the substrate W from pure water while supplying IPA (isopropyl alcohol) may be used.

1 is a plan view showing a schematic configuration of a substrate processing apparatus according to Embodiment 1. FIG. It is a perspective view which shows a hoop. It is a top view of an accommodating part. It is a front view of a shelf. It is a side view which shows a accommodating part and a part of 1st process part. It is a perspective view of a shutter member. It is a side view explaining operation | movement of a shutter member. (A) is the top view (upper stage) and side view (lower stage) of a substrate mounting part when a support stand is a horizontal attitude | position, (b) is a substrate mounting part when a support stand is a vertical attitude | position. These are a plan view (upper stage) and a side view (lower stage). It is a front view of a pusher and a board | substrate mounting part, (a), (b) has shown the mode of delivery of a board | substrate. It is a side view which shows the mode of the delivery of the board | substrate W group of a pusher and a 5th conveyance mechanism. It is a schematic block diagram of a drying process part. (A) is a schematic diagram of a pure water cleaning processing unit, and (b) is a schematic diagram showing how a substrate W group is transferred between a lifter and a fifth transport mechanism. It is a side view of a 2nd conveyance mechanism. It is a perspective view which shows the outline of a processing unit. It is a flowchart which shows an example of operation | movement of a substrate processing apparatus. 6 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to Embodiment 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Accommodating part 3 ... 1st process part 5 ... 2nd process part 13 ... Lid 19 ... Shelf 21 ... 1st stage 23 ... 2nd stage 25 ... 1st hoop conveyance mechanism 27 ... 2nd hoop conveyance mechanism 31a ... 1st Partition wall 31b ... Second partition wall 35 ... First shutter member 35a ... Connecting member 36 ... First shutter member 36a ... Connecting member 41 ... First transport mechanism 61, 66 ... Second transport mechanism W ... Substrate F ... Hoop

Claims (15)

In a substrate processing apparatus for processing a substrate,
An accommodating portion for accommodating a container for accommodating a plurality of substrates;
A first processing unit that collectively processes a plurality of substrates;
A second processing unit for processing the substrates one by one,
The accommodating portion is
A first placement portion for placing the container for the first processing portion;
A second mounting unit for mounting the container for the second processing unit;
A transport unit for transporting a container between the first placement unit and the second placement unit;
With
The first processing unit includes a first transport mechanism that carries the substrate into and out of the container placed on the first placement unit,
The substrate processing apparatus, wherein the second processing unit includes a second transport mechanism that carries the substrate in and out of the container placed on the second placement unit. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the transport unit transports a container that stores a substrate processed in the second processing unit from the second mounting unit to the first mounting unit. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the transport unit transports a container that stores a substrate processed in the first processing unit from the first mounting unit to the second mounting unit. In the substrate processing apparatus in any one of Claims 1-3,
The substrate processing apparatus, wherein the first processing unit and the second processing unit are arranged side by side on one side of the housing unit. In the substrate processing apparatus in any one of Claims 1-3,
The substrate processing apparatus, wherein the first processing unit and the second processing unit are arranged to face each other. In the substrate processing apparatus in any one of Claims 1-5,
The container includes a shelf on which a plurality of containers are placed,
The substrate processing apparatus, wherein the transfer unit further transfers a container to the shelf. The substrate processing apparatus according to claim 6,
The substrate processing apparatus, wherein the shelf is disposed in a transport path of a container between the first placement unit and the second placement unit. In the substrate processing apparatus of Claim 6 or Claim 7,
The substrate processing apparatus according to claim 1, wherein the shelf places a plurality of containers side by side along a conveyance path of the containers by the conveyance unit. In the substrate processing apparatus in any one of Claims 6-8,
The transport unit is
A third transport mechanism for transporting a container between the first placement unit and the shelf;
A fourth transport mechanism for transporting a container between the second placement unit and the shelf;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 9,
The third transport mechanism is movable along one side of the shelf and carries in and out a container from one side of the shelf.
The substrate transport apparatus, wherein the fourth transport mechanism is movable along the other side of the shelf and carries in and out a container from the other side of the shelf. The substrate processing apparatus according to claim 10, wherein
A plurality of the second placement portions, and each of the second placement portions is disposed on an extension line of the shelf;
The substrate processing apparatus, wherein the fourth transport mechanism moves along a side of the shelf opposite to the first processing unit side. The substrate processing apparatus according to any one of claims 1 to 11,
Further, the first partition wall is formed with a first passage opening that separates the housing portion and the first processing portion and allows the substrate to pass through the container placed on the first placement portion. When,
A first shutter member that opens and closes a first passage port of the first partition;
A second partition wall that separates between the storage unit and the first processing unit and has a second passage port that allows a substrate to pass through the storage unit mounted on the second mounting unit;
A second shutter member for opening and closing the second passage opening of the second partition;
With
The first transport mechanism carries in and out a plurality of substrates through the first passage port with respect to the container placed on the first placement unit,
The substrate processing apparatus, wherein the second transport mechanism loads and unloads substrates one by one through the second passage port with respect to a container placed on the second placement unit. The substrate processing apparatus according to claim 12, wherein
The container includes an opening formed on one side surface and a lid that closes the opening.
The first shutter member includes a first attachment / detachment holding mechanism that attaches / detaches and holds the lid of the container.
The substrate processing apparatus, wherein the second shutter member includes a second attachment / detachment holding mechanism that attaches / detaches and holds the lid of the container. In the substrate processing apparatus in any one of Claims 1-13,
The first processing unit collectively performs a cleaning process and a drying process on a plurality of substrates,
The substrate processing apparatus, wherein the second processing unit performs a cleaning process and a drying process in units of substrates. The substrate processing apparatus according to claim 14, wherein
The substrate processing apparatus characterized in that the cleaning process performed by the second processing unit cleans at least a peripheral portion of the back surface of the substrate.

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