JP2006261173A - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
JP2006261173A
JP2006261173A JP2005072560A JP2005072560A JP2006261173A JP 2006261173 A JP2006261173 A JP 2006261173A JP 2005072560 A JP2005072560 A JP 2005072560A JP 2005072560 A JP2005072560 A JP 2005072560A JP 2006261173 A JP2006261173 A JP 2006261173A
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Japan
Prior art keywords
bond
wire
electrode
semiconductor device
electrode pad
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Pending
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JP2005072560A
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Japanese (ja)
Inventor
Satoru Shibata
哲 柴田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2005072560A priority Critical patent/JP2006261173A/en
Publication of JP2006261173A publication Critical patent/JP2006261173A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a high connection reliability against heating. <P>SOLUTION: Two wires 8 electrically connect an electrode pad 10 formed on a photo detector 4 and an electrode pad 10 formed on a control element 5. The first wire 11 has its first bond 11a connected to the electrode pad 10 of the photo detector 4 while having its second bond 11b connected to the electrode pad 10 of the control element 5. The second wire 12 has its first bond 12a made into a security bond connected at the position of the second bond 11b of the first wire 11, and has its second bond 12b connected to a position different from the position of the first bond 11a of the first wire 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、半導体素子と、半導体素子を樹脂封止する樹脂パッケージと、半導体素子に設けられた電極および他の電極を接続するワイヤとを備えた半導体装置に関する。   The present invention relates to a semiconductor device including a semiconductor element, a resin package for resin-sealing the semiconductor element, and an electrode provided on the semiconductor element and a wire for connecting another electrode.

半導体素子が、他の半導体素子とともに、リードフレームや、配線パターンが形成された基板に搭載され、そしてこの半導体素子が樹脂封止部で封止された半導体装置がある。例えば、特許文献１に記載の半導体装置は、半導体素子に電極として設けられた電極パッドと、他の半導体素子に設けられた電極パッドとをワイヤで接続したものである。   There is a semiconductor device in which a semiconductor element is mounted together with other semiconductor elements on a substrate on which a lead frame or a wiring pattern is formed, and the semiconductor element is sealed with a resin sealing portion. For example, the semiconductor device described in Patent Document 1 is a device in which an electrode pad provided as an electrode on a semiconductor element and an electrode pad provided on another semiconductor element are connected by a wire.

このような半導体素子と、他の半導体素子とをワイヤで導通接続した従来の半導体装置を図９に基づいて説明する。図９は、従来の半導体装置を説明する図であり、半導体素子に設けられた電極パッドと、他の半導体素子に設けられた電極パッドとを接続した状態を示す図である。   A conventional semiconductor device in which such a semiconductor element and another semiconductor element are conductively connected with a wire will be described with reference to FIG. FIG. 9 is a diagram for explaining a conventional semiconductor device, and shows a state in which an electrode pad provided in a semiconductor element and an electrode pad provided in another semiconductor element are connected.

図９に示すように、半導体素子２０に設けられた電極パッド２０ａと、他の半導体素子２１に設けられた電極パッド２１ａとはワイヤ２２で導通接続されている。ワイヤ２２は、半導体素子２０側の電極パッド２０ａにはファーストボンド２２ａで接続されており、半導体素子２１側の電極パッド２１ａにはセカンドボンド２２ｂが接続されている。セカンドボンド２２ｂは、ワイヤ２２を電極パッド２１ａに配線する際に、ワイヤボンディング装置のキャピラリが電極パッド２１ａの上面にワイヤ２２を押しつけるようにして切断することで形成される。このようにセカンドボンド２２ｂは形成されるので、リフロー工程などで加熱されると、セカンドボンド２２ｂと電極パッド２１ａが剥離することが稀にある。これは、セカンドボンド２２ｂの周囲の樹脂が水分を含み、この水分がリフロー工程などの加熱で水蒸気化して膨張し、セカンドボンド２２ｂを電極パッド２１ａから剥離させるからである。   As shown in FIG. 9, the electrode pad 20 a provided in the semiconductor element 20 and the electrode pad 21 a provided in another semiconductor element 21 are conductively connected by a wire 22. The wire 22 is connected to the electrode pad 20a on the semiconductor element 20 side by a first bond 22a, and the second bond 22b is connected to the electrode pad 21a on the semiconductor element 21 side. The second bond 22b is formed by cutting the capillary of the wire bonding apparatus so as to press the wire 22 against the upper surface of the electrode pad 21a when wiring the wire 22 to the electrode pad 21a. Since the second bond 22b is formed in this manner, the second bond 22b and the electrode pad 21a rarely peel off when heated in a reflow process or the like. This is because the resin around the second bond 22b contains moisture, and this moisture is steamed and expanded by heating such as a reflow process, thereby peeling the second bond 22b from the electrode pad 21a.

そこで、ワイヤの接続信頼性を向上させるために、図１０に示すように、セカンドボンド２２ｂが設けられた位置にセキュリティボンド２３を設けた従来の半導体装置がある。   Therefore, in order to improve the connection reliability of wires, there is a conventional semiconductor device in which a security bond 23 is provided at a position where a second bond 22b is provided, as shown in FIG.

セカンドボンド２２ｂの位置にセキュリティボンド２３を設けることで、加熱されたときに樹脂に含まれる水分が水蒸気化しても、セカンドボンド２２ｂの上からセキュリティボンド２３がセカンドボンド２２ｂを電極パッド２１ａに挟み込むように固定しているので、接続がより強固なものとなる。
特開２０００−１８３３９１号公報 By providing the security bond 23 at the position of the second bond 22b, the security bond 23 sandwiches the second bond 22b between the second bond 22b and the electrode pad 21a even if the moisture contained in the resin is steamed when heated. Since the connection is fixed, the connection becomes stronger.
JP 2000-183391 A

セキュリティボンド２３は、セカンドボンド２２ｂの接続をより確実なものとして機能しているが、セキュリティボンド２３がセカンドボンド２２ｂの位置に対して、極まれに少しずれることがある。セキュリティボンド２３が、ワイヤ２２から遠ざかる方向ではそう問題とならない。しかし、セキュリティボンド２３が、セカンドボンド２２ｂの上に乗り上げ、ワイヤ２２が電極パッド２１ａから離れる部分までに到達すると、ワイヤ２２を傷つけることがある。そうなるとリフロー工程などでの加熱により、今度はワイヤ２２が断線するという問題が極まれではあるが発生する。   The security bond 23 functions as a more reliable connection of the second bond 22b. However, the security bond 23 may slightly deviate slightly from the position of the second bond 22b. The security bond 23 is not so problematic in the direction away from the wire 22. However, when the security bond 23 rides on the second bond 22b and reaches the portion where the wire 22 is away from the electrode pad 21a, the wire 22 may be damaged. If so, the problem that the wire 22 is disconnected this time due to heating in the reflow process or the like is rarely generated.

半導体装置は、益々小型化が進み、ワイヤの線幅も非常に細くなっている。従って、少しのずれもワイヤの切断となる可能性があるので、更なる接続信頼性の高い半導体装置が望まれている。   Semiconductor devices are becoming more and more miniaturized, and the line width of wires is becoming very narrow. Therefore, even a slight deviation may cause the wire to be cut, and thus a semiconductor device with higher connection reliability is desired.

そこで本発明においては、加熱に対して接続信頼性の高い半導体装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a semiconductor device with high connection reliability against heating.

本発明の半導体装置は、半導体素子と、前記半導体素子を樹脂封止する樹脂パッケージと、前記半導体素子に設けられた電極および他の電極を接続するワイヤとを備えた半導体装置において、前記ワイヤは、前記半導体素子の電極と前記他の電極との間に、複数本配線されていることを特徴とする。   The semiconductor device of the present invention is a semiconductor device comprising a semiconductor element, a resin package for resin-sealing the semiconductor element, and a wire for connecting an electrode provided on the semiconductor element and another electrode. A plurality of wirings are provided between the electrode of the semiconductor element and the other electrode.

本発明の半導体装置によれば、ワイヤが、半導体素子の電極と他の電極との間の接続に、複数本配線されているので、１本のワイヤが未接続状態となっても、残りのワイヤで導通が確保できるので、接続信頼性の高い半導体装置とすることができる。   According to the semiconductor device of the present invention, since a plurality of wires are wired for connection between the electrode of the semiconductor element and the other electrode, even if one wire is not connected, the remaining wire is not connected. Since conduction can be ensured with a wire, a semiconductor device with high connection reliability can be obtained.

本願の第１の発明は、半導体素子と、半導体素子を樹脂封止する樹脂パッケージと、半導体素子に設けられた電極および他の電極を接続するワイヤとを備えた半導体装置において、ワイヤは、半導体素子の電極と他の電極との間に、複数本配線されていることを特徴としたものである。   A first invention of the present application is a semiconductor device including a semiconductor element, a resin package for resin-sealing the semiconductor element, and an electrode provided on the semiconductor element and a wire for connecting another electrode. A plurality of wirings are provided between the electrode of the element and another electrode.

ワイヤが、半導体素子の電極と他の電極との間の接続に、複数本配線されているので、樹脂が加熱され樹脂が含んだ水分が水蒸気化して、１本のワイヤを切断したり、または電極から剥離させて未接続状態としたりしても、残りのワイヤで導通が確保できるので、接続信頼性の高い半導体装置とすることができる。   Since a plurality of wires are wired for connection between the electrode of the semiconductor element and another electrode, the resin is heated and the moisture contained in the resin is vaporized, or one wire is cut, or Even if it is peeled off from the electrode to be in an unconnected state, the remaining wires can ensure conduction, so that a semiconductor device with high connection reliability can be obtained.

本願の第２の発明は、ワイヤは、半導体素子の電極と他の電極との間に２本配線され、第１のワイヤは、ファーストボンドが一方の電極に接続され、かつセカンドボンドが他方の電極に接続され、第２のワイヤは、第１のワイヤのセカンドボンドとした位置にセキュリティボンドとしたファーストボンドが接続され、かつ一方の電極の第１のワイヤのファーストボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴としたものである。   In the second invention of the present application, two wires are wired between the electrode of the semiconductor element and the other electrode, and the first wire has the first bond connected to one electrode and the second bond connected to the other electrode. The second wire is connected to the electrode, and a position where the first bond of the first wire of one electrode is connected to the position where the second wire of the first wire is the second bond is connected Are characterized in that second bonds are connected to different positions.

第２のワイヤは、第１のワイヤのセカンドボンドとした位置に、セキュリティボンドとしたファーストボンドを接続しているので、第１のワイヤのセカンドボンドを確実に接続しつつ、第２のワイヤの配線を開始することができ、配線作業を効率的に行うことができる。   Since the second wire is connected to the first bond as the security bond at the position of the second wire as the second bond, the second wire is securely connected to the second wire while the second wire is securely connected. Wiring can be started and wiring work can be performed efficiently.

本願の第３の発明は、第２のワイヤのセカンドボンドにセキュリティボンドが設けられていることを特徴としたものである。   The third invention of the present application is characterized in that a security bond is provided in the second bond of the second wire.

第２のワイヤのセカンドボンドにセキュリティボンドを設けることで、セカンドボンドが電極から剥離することが防止できるので、更に接続信頼性の向上を図ることができる。   By providing a security bond to the second bond of the second wire, it is possible to prevent the second bond from being peeled off from the electrode, so that the connection reliability can be further improved.

本願の第４の発明は、ワイヤは、半導体素子の電極と他の電極との間に２本配線され、第１のワイヤは、一方の電極にファーストボンドが接続され、かつ他方の電極にセカンドボンドが接続され、第２のワイヤは、他方の電極の第１のワイヤのセカンドボンドが接続された位置とは異なる位置にファーストボンドが接続され、かつ一方の電極の第１のワイヤのファーストボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴としたものである。   In the fourth invention of the present application, two wires are wired between the electrode of the semiconductor element and the other electrode, the first wire has a first bond connected to one electrode, and a second to the other electrode. A bond is connected, the second wire has a first bond connected to a position different from the position where the second wire of the first electrode of the other electrode is connected, and the first wire of the first wire of one electrode The second bond is connected to a position different from the position where the is connected.

一方の電極に、第１のワイヤのファーストボンドと第２のワイヤのセカンドボンドが接続され、他方の電極に、第１のワイヤのセカンドボンドと第２のワイヤのファーストボンドが接続されているので、どちらか一方のワイヤが切断や、セカンドボンドが電極から剥離しても、他方のワイヤが導通を確保しているので、接続信頼性の高い半導体装置とすることができる。   Because the first bond of the first wire and the second bond of the second wire are connected to one electrode, and the second bond of the first wire and the first bond of the second wire are connected to the other electrode Even if one of the wires is cut or the second bond is peeled off from the electrode, the other wire ensures electrical conduction, so that a semiconductor device with high connection reliability can be obtained.

本願の第５の発明は、ワイヤは、半導体素子の電極と他の電極との間に２本配線され、第１のワイヤは、一方の電極にファーストボンドが接続され、かつ他方の電極にセカンドボンドが接続され、第２のワイヤは、一方の電極の第１のワイヤのファーストボンドが接続された位置とは異なる位置にファーストボンドが接続され、かつ他方の電極の第１のワイヤのセカンドボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴としたものである。   In the fifth invention of the present application, two wires are wired between the electrode of the semiconductor element and the other electrode, the first wire has a first bond connected to one electrode, and a second to the other electrode. The bond is connected, the second wire has a first bond connected to a position different from the position where the first bond of the first wire of one electrode is connected, and the second bond of the first wire of the other electrode The second bond is connected to a position different from the position where the is connected.

一方の電極に２本のワイヤのそれぞれのファーストボンドが接続され、他方の電極にそれぞれのセカンドボンドが接続されているので、どちらか一方のワイヤが切断したり、セカンドボンドが電極から剥離したりしても、他方のワイヤが導通を確保しているので、接続信頼性の高い半導体装置とすることができる。   Since the first bond of each of the two wires is connected to one electrode and the second bond is connected to the other electrode, either one of the wires is cut or the second bond is peeled off from the electrode. Even so, since the other wire ensures conduction, a semiconductor device with high connection reliability can be obtained.

本願の第６の発明は、第１のワイヤまたは第２のワイヤの少なくとも一方または両方のセカンドボンドにセキュリティボンドが設けられていることを特徴としたものである。   The sixth invention of the present application is characterized in that a security bond is provided in a second bond of at least one or both of the first wire and the second wire.

第１のワイヤおよび第２のワイヤの少なくとも一方または両方のセカンドボンドにセキュリティボンドを設けることで、セカンドボンドが電極から剥離することを防止することができるので、更に接続信頼性の向上を図ることができる。   By providing a security bond to the second bond of at least one or both of the first wire and the second wire, it is possible to prevent the second bond from peeling from the electrode, thereby further improving the connection reliability. Can do.

（実施の形態）
本発明の実施の形態に係る半導体装置を、光半導体装置を例に、図に基づいて説明する。図１および図４は、本発明の実施の形態に係る半導体装置を説明する平面図である。図２，図５および図７は、本発明の実施の形態に係る半導体装置を説明する部分拡大断面図である。図３，図６および図８は、セカンドボンドにセキュリティボンドを設けた状態を示す図である。なお、図１および図４においては、樹脂封止部は省略している。 (Embodiment)
A semiconductor device according to an embodiment of the present invention will be described with reference to the drawings, taking an optical semiconductor device as an example. 1 and 4 are plan views illustrating a semiconductor device according to an embodiment of the present invention. 2, 5 and 7 are partially enlarged cross-sectional views for explaining the semiconductor device according to the embodiment of the present invention. 3, 6 and 8 are views showing a state in which a security bond is provided in the second bond. In FIG. 1 and FIG. 4, the resin sealing portion is omitted.

図１に示すように、光半導体装置１は、第１の発光素子２と、第２の発光素子３と、受光素子４と、制御素子５と、これらの半導体素子６を搭載するとともに、外部との接続に使用される接続端子７ａが形成されたリードフレーム７と、半導体素子６とリードフレーム７との間や、半導体素子同士を導通接続するワイヤ８と、これらを封止して保護する樹脂封止部（図示せず）とから構成される。   As shown in FIG. 1, an optical semiconductor device 1 includes a first light emitting element 2, a second light emitting element 3, a light receiving element 4, a control element 5, and these semiconductor elements 6, and an external device. The lead frame 7 in which the connection terminal 7a used for the connection is formed, the wire 8 between the semiconductor element 6 and the lead frame 7, and the semiconductor element are electrically connected to each other, and these are sealed and protected. It is comprised from the resin sealing part (not shown).

この光半導体装置１は、家電用の遠隔操作装置（以下、リモコンと称す。）が使用する波長と、パーソナルコンピュータやその周辺機器などの通信に用いる波長を送受信することができる。   The optical semiconductor device 1 can transmit and receive a wavelength used by a remote control device for home appliances (hereinafter referred to as a remote controller) and a wavelength used for communication of a personal computer and its peripheral devices.

第１の発光素子２は、家電用リモコンの赤外線ＬＥＤ（Light Emitting Diode）であり、波長が９４０ｎｍを中心波長とする赤外線を発光する。第２の発光素子３は、ＩｒＤＡの規格により赤外線通信をする赤外線ＬＥＤであり、８５０ｎｍ〜９００ｎｍを中心波長とする赤外線を発光する。受光素子４は、相手機器から送信された赤外線を受光して電気信号へ変換する機能を有する。制御素子５は、受光素子４からのアナログ信号をデジタル信号に変換する機能を有している。   The first light emitting element 2 is an infrared LED (Light Emitting Diode) of a home appliance remote controller, and emits infrared light having a wavelength of 940 nm as a center wavelength. The second light emitting element 3 is an infrared LED that performs infrared communication according to the IrDA standard, and emits infrared light having a center wavelength of 850 nm to 900 nm. The light receiving element 4 has a function of receiving infrared rays transmitted from the counterpart device and converting them into electrical signals. The control element 5 has a function of converting an analog signal from the light receiving element 4 into a digital signal.

第１の発光素子２、第２の発光素子３、受光素子４および制御素子５の半導体素子６
は、銀ペーストなどの接着剤を介在させてリードフレーム７に搭載されている。 Semiconductor element 6 of first light emitting element 2, second light emitting element 3, light receiving element 4 and control element 5
Are mounted on the lead frame 7 with an adhesive such as silver paste interposed therebetween.

第１の発光素子２、第２の発光素子３は、底面を電極としてリードフレーム７と導通接続している。また、半導体素子６の上面に電極パッド１０がそれぞれ設けられている。   The first light emitting element 2 and the second light emitting element 3 are electrically connected to the lead frame 7 with the bottom surface as an electrode. Electrode pads 10 are provided on the upper surface of the semiconductor element 6.

リードフレーム７は、金属合金をメッキ処理したものであり、また、半導体素子に設けられた電極パッド１０と接続するための電極７ｂが設けられている。リードフレーム７の電極７ｂは、ワイヤ８を配線する際に接続するために確保された領域である。   The lead frame 7 is obtained by plating a metal alloy, and is provided with an electrode 7b for connecting to an electrode pad 10 provided in the semiconductor element. The electrode 7b of the lead frame 7 is an area secured for connection when the wire 8 is wired.

ワイヤ８は、金で形成されており、線幅は２５μｍ程度である。ワイヤ８は、半導体素子６に設けられた電極パッド１０同士、または電極パッド１０とリードフレーム７の電極７ｂを導通接続するものである。電極パッド１０とリードフレーム７の電極７ｂとを接続する場合には、半導体素子６の電極パッド１０の方はファーストボンドで接続され、リードフレーム７の電極７ｂの方はセカンドボンドで接続されている。また、電極パッド１０同士を接続する場合には、どちらの電極パッド１０をファーストボンドとするかは、ワイヤボンディングの作業性を勘案して適宜決められる。   The wire 8 is made of gold and has a line width of about 25 μm. The wire 8 is used to electrically connect the electrode pads 10 provided on the semiconductor element 6 or the electrode pad 10 and the electrode 7 b of the lead frame 7. When the electrode pad 10 and the electrode 7b of the lead frame 7 are connected, the electrode pad 10 of the semiconductor element 6 is connected by a first bond, and the electrode 7b of the lead frame 7 is connected by a second bond. . Further, when the electrode pads 10 are connected to each other, which electrode pad 10 is used as the first bond is appropriately determined in consideration of workability of wire bonding.

受光素子４の電極パッド１０と、制御素子５の電極パッド１０とは、２本のワイヤ８で接続されている。   The electrode pad 10 of the light receiving element 4 and the electrode pad 10 of the control element 5 are connected by two wires 8.

樹脂封止部は、図示しないが、第１の発光素子２と、第２の発光素子３との光出射面上および受光素子４の受光面上に、半円球状のレンズ部が設けられており、樹脂で形成されている。第１の発光素子２と、第２の発光素子３とは赤外線を発光する素子なので、樹脂封止部を形成する樹脂は、赤外線透過性の樹脂である。   Although the resin sealing portion is not shown, a semispherical lens portion is provided on the light emitting surface of the first light emitting element 2 and the second light emitting element 3 and on the light receiving surface of the light receiving element 4. And formed of resin. Since the first light emitting element 2 and the second light emitting element 3 are elements that emit infrared rays, the resin forming the resin sealing portion is an infrared transmitting resin.

ここで、受光素子４の電極パッド１０と、制御素子５の電極パッド１０とを接続する２本のワイヤ８について図２に基づいて詳細に説明する。   Here, the two wires 8 connecting the electrode pad 10 of the light receiving element 4 and the electrode pad 10 of the control element 5 will be described in detail with reference to FIG.

受光素子４の電極パッド１０と、制御素子５の電極パッド１０とを接続する２本のワイヤ８は、まず受光素子４から制御素子５へ配線される第１のワイヤ１１と、制御素子５から受光素子４へ配線される第２のワイヤ１２からなる。   The two wires 8 connecting the electrode pad 10 of the light receiving element 4 and the electrode pad 10 of the control element 5 are the first wire 11 wired from the light receiving element 4 to the control element 5 and the control element 5. It consists of a second wire 12 wired to the light receiving element 4.

第１のワイヤ１１は、受光素子４の電極パッド１０にファーストボンド１１ａが接続し、制御素子５の電極パッド１０にセカンドボンド１１ｂが接続している。   In the first wire 11, the first bond 11 a is connected to the electrode pad 10 of the light receiving element 4, and the second bond 11 b is connected to the electrode pad 10 of the control element 5.

第２のワイヤ１２は、第１のワイヤ１１のセカンドボンド１１ｂとした位置に、セキュリティボンドとしたファーストボンド１２ａが接続し、受光素子４の電極パッド１０にセカンドボンド１２ｂが接続している。   In the second wire 12, a first bond 12 a as a security bond is connected to the position of the first wire 11 as a second bond 11 b, and a second bond 12 b is connected to the electrode pad 10 of the light receiving element 4.

このように、電極パッド１０間を２本のワイヤ８で接続しているので、樹脂が加熱され樹脂が含んだ水分が水蒸気化して、１本のワイヤ８を切断したり、または電極から剥離させて未接続状態としたりしても、残りの１本のワイヤ８で導通が確保できるので、接続信頼性の高い半導体装置１とすることができる。また、第２のワイヤ１２は、第１のワイヤ１１のセカンドボンド１１ｂとした位置に、セキュリティボンドとしたファーストボンド１２ａを接続しているので、第１のワイヤ１１のセカンドボンド１１ｂを確実に接続しつつ、第２のワイヤ１２の配線を開始することができ、配線作業を効率的に行うことができる。   As described above, since the electrode pads 10 are connected by the two wires 8, the resin is heated and the moisture contained in the resin is vaporized, so that one wire 8 is cut or peeled off from the electrode. Even if it is in an unconnected state, since the continuity can be secured with the remaining one wire 8, the semiconductor device 1 with high connection reliability can be obtained. In addition, since the second wire 12 is connected to the first bond 12a as the security bond at the position where the second bond 11b of the first wire 11 is connected, the second bond 11b of the first wire 11 is securely connected. However, the wiring of the second wire 12 can be started, and the wiring work can be performed efficiently.

本実施の形態では、受光素子４から制御素子５へ配線されるワイヤを第１のワイヤ１１とし、制御素子５から受光素子４へ配線されるワイヤを第２のワイヤ１２としたが、制御素子５から受光素子４へ、そして制御素子５と配線するようにしてもよい。   In the present embodiment, the wire wired from the light receiving element 4 to the control element 5 is the first wire 11, and the wire wired from the control element 5 to the light receiving element 4 is the second wire 12. 5 may be wired to the light receiving element 4 and to the control element 5.

また、図３に示すように、第２のワイヤ１２のセカンドボンド１２ｂにセキュリティボンド１２ｃを設けることもできる。第２のワイヤ１２のセカンドボンド１２ｂにセキュリティボンド１２ｃを設けることで、セカンドボンド１２ｂが受光素子４の電極パッド１０から剥離することが防止できるので、更に接続信頼性の向上を図ることができる。   In addition, as shown in FIG. 3, a security bond 12 c can be provided on the second bond 12 b of the second wire 12. By providing the security bond 12 c on the second bond 12 b of the second wire 12, it is possible to prevent the second bond 12 b from peeling from the electrode pad 10 of the light receiving element 4, so that the connection reliability can be further improved.

この第１のワイヤと、第２のワイヤとは、図４に示すようにセキュリティボンドを省略するように、別々に配線してもよい。第１のワイヤと第２のワイヤを別々に配線した実施例を図５および図６に基づいて詳細に説明する。   The first wire and the second wire may be separately wired so as to omit the security bond as shown in FIG. An embodiment in which the first wire and the second wire are separately wired will be described in detail with reference to FIGS.

図５に示すように、受光素子４の電極パッド１０と、制御素子５の電極パッド１０とを接続する２本のワイヤ８は、まず受光素子４から制御素子５へ配線される第１のワイヤ１３と、制御素子５から受光素子４へ配線される第２のワイヤ１４からなる。   As shown in FIG. 5, the two wires 8 that connect the electrode pad 10 of the light receiving element 4 and the electrode pad 10 of the control element 5 are first wires wired from the light receiving element 4 to the control element 5 first. 13 and a second wire 14 wired from the control element 5 to the light receiving element 4.

第１のワイヤ１３は、受光素子４の電極１０にファーストボンド１３ａが接続され、かつ制御素子５の電極パッド１０にセカンドボンド１３ｂが接続されている。   In the first wire 13, the first bond 13 a is connected to the electrode 10 of the light receiving element 4, and the second bond 13 b is connected to the electrode pad 10 of the control element 5.

第２のワイヤ１４は、制御素子５の電極パッド１０の第１のワイヤ１３のセカンドボンド１３ｂが接続された位置とは異なる位置に、ファーストボンド１４ａが接続されている。また第２のワイヤ１４は、受光素子４の電極パッド１０の第１のワイヤ１３のファーストボンド１３ａが接続された位置とは異なる位置に、セカンドボンド１４ｂが接続されている。   The second wire 14 is connected to the first bond 14a at a position different from the position where the second bond 13b of the first wire 13 of the electrode pad 10 of the control element 5 is connected. The second wire 14 is connected to a second bond 14b at a position different from the position where the first bond 13a of the first wire 13 of the electrode pad 10 of the light receiving element 4 is connected.

このように、受光素子４の電極パッド１０に、第１のワイヤ１３のファーストボンド１３ａと第２のワイヤ１４のセカンドボンド１４ｂが接続され、制御素子５の電極パッド１０に、第１のワイヤ１３のセカンドボンド１３ｂと第２のワイヤ１４のファーストボンド１４ａが接続されているので、どちらか一方のワイヤが切断や、セカンドボンドが電極から剥離しても、他方のワイヤが導通を確保しているので、接続信頼性の高い光半導体装置とすることができる。   As described above, the first bond 13 a of the first wire 13 and the second bond 14 b of the second wire 14 are connected to the electrode pad 10 of the light receiving element 4, and the first wire 13 is connected to the electrode pad 10 of the control element 5. Since the second bond 13b and the first bond 14a of the second wire 14 are connected, even if one of the wires is cut or the second bond is peeled off from the electrode, the other wire is kept conductive. Therefore, an optical semiconductor device with high connection reliability can be obtained.

また、図６に示すように、第１のワイヤ１３および第２のワイヤ１４のセカンドボンド１３ｂ，１４ｂにセキュリティボンド１３ｃ，１４ｃを設けることもできる。第１のワイヤ１３および第２のワイヤ１４のセカンドボンド１３ｂ，１４ｂにセキュリティボンド１３ｃ，１４ｃを設けることで、セカンドボンドが電極から剥離することが防止できるので、更に接続信頼性の向上を図ることができる。本実施の形態では、第１のワイヤ１３および第２のワイヤ１４の両方にセキュリティボンドを設けたが、どちらか一方だけでも信頼性を向上させることができる。   In addition, as shown in FIG. 6, security bonds 13 c and 14 c can be provided on the second bonds 13 b and 14 b of the first wire 13 and the second wire 14. By providing the security bonds 13c and 14c on the second bonds 13b and 14b of the first wire 13 and the second wire 14, it is possible to prevent the second bond from being peeled off from the electrode, thereby further improving the connection reliability. Can do. In this embodiment, the security bond is provided on both the first wire 13 and the second wire 14, but the reliability can be improved by using only one of them.

また、図７に示すように、受光素子４の電極パッド１０と、制御素子５の電極パッド１０とを接続する２本のワイヤ８は、まず受光素子４から制御素子５へ配線される第１のワイヤ１５と、同様に受光素子４から制御素子５へ配線される第２のワイヤ１６からなる。   Further, as shown in FIG. 7, the two wires 8 connecting the electrode pad 10 of the light receiving element 4 and the electrode pad 10 of the control element 5 are first wired from the light receiving element 4 to the control element 5. And a second wire 16 similarly wired from the light receiving element 4 to the control element 5.

第１のワイヤ１５は、受光素子４の電極１０にファーストボンド１５ａが接続され、かつ制御素子５の電極パッド１０にセカンドボンド１５ｂが接続されている。   In the first wire 15, the first bond 15 a is connected to the electrode 10 of the light receiving element 4, and the second bond 15 b is connected to the electrode pad 10 of the control element 5.

第２のワイヤ１６は、受光素子４の電極パッド１０の第１のワイヤ１５のファーストボンド１５ａが接続された位置とは異なる位置に、ファーストボンド１６ａが接続され、かつ制御素子５の電極パッド１０の第１のワイヤ１５のセカンドボンド１５ｂが接続された位置とは異なる位置に、セカンドボンド１６ｂが接続されている。   The first wire 16 is connected to the second wire 16 at a position different from the position where the first bond 15 a of the first wire 15 of the electrode pad 10 of the light receiving element 4 is connected, and the electrode pad 10 of the control element 5 is connected. The second bond 16b is connected to a position different from the position where the second bond 15b of the first wire 15 is connected.

受光素子４の電極パッド１０に２本のワイヤ８のそれぞれのファーストボンド１５ａ，１６ａが接続され、制御素子５の電極パッド１０にそれぞれのセカンドボンド１５ｂ，１６ｂが接続されているので、どちらか一方のワイヤ８が切断したり、セカンドボンド１５ｂ，１６ｂが電極から剥離したりしても、他方のワイヤ８が導通を確保しているので、接続信頼性の高い光半導体装置とすることができる。   Since the first bonds 15 a and 16 a of the two wires 8 are connected to the electrode pad 10 of the light receiving element 4 and the second bonds 15 b and 16 b are connected to the electrode pad 10 of the control element 5, either one of them. Even if the wire 8 is cut or the second bonds 15b and 16b are peeled off from the electrodes, the other wire 8 ensures conduction, so that an optical semiconductor device with high connection reliability can be obtained.

また、図８に示すように、第１のワイヤ１５および第２のワイヤ１６のセカンドボンド１５ｂ，１６ｂにセキュリティボンド１５ｃ，１６ｃを設けることもできる。第１のワイヤ１５および第２のワイヤ１６のセカンドボンド１５ｂ，１６ｂにセキュリティボンド１５ｃ，１６ｃを設けることで、セカンドボンドが電極から剥離することが防止できるので、更に接続信頼性の向上を図ることができる。本実施の形態では、第１のワイヤ１５および第２のワイヤ１６の両方にセキュリティボンドを設けたが、どちらか一方だけでも信頼性を向上させることができる。   In addition, as shown in FIG. 8, security bonds 15c and 16c can be provided on the second bonds 15b and 16b of the first wire 15 and the second wire 16, respectively. By providing the security bonds 15c and 16c to the second bonds 15b and 16b of the first wire 15 and the second wire 16, it is possible to prevent the second bond from being peeled off from the electrode, thereby further improving the connection reliability. Can do. In the present embodiment, the security bond is provided on both the first wire 15 and the second wire 16, but the reliability can be improved by using only one of them.

以上、本発明の実施の形態について説明してきたが、本発明は前記実施の形態に限定されるものではなく、例えば、半導体素子の電極パッドと、リードフレームの電極とを２本のワイヤで接続することも可能である。またワイヤは２本だけでなく、３本以上とすることも半導体素子の電極パッドの面積を広く確保することで可能となる。また、リードフレームに半導体素子を搭載した半導体装置だけでなく、配線パターンを形成した基板に半導体素子を搭載した半導体装置にも適用できる。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, an electrode pad of a semiconductor element and an electrode of a lead frame are connected by two wires. It is also possible to do. Further, not only two wires but also three or more wires can be obtained by securing a large area of the electrode pads of the semiconductor element. Further, the present invention can be applied not only to a semiconductor device having a semiconductor element mounted on a lead frame, but also to a semiconductor device having a semiconductor element mounted on a substrate on which a wiring pattern is formed.

本発明は、加熱に対して接続信頼性を向上させることができるので、半導体素子と、半導体素子を樹脂封止する樹脂パッケージと、半導体素子に設けられた電極および他の電極を接続するワイヤとを備えた半導体装置に好適である。   Since the present invention can improve connection reliability against heating, a semiconductor element, a resin package for resin-sealing the semiconductor element, an electrode provided on the semiconductor element, and a wire for connecting another electrode, It is suitable for a semiconductor device provided with

本発明の実施の形態に係る半導体装置を説明する図10A and 10B illustrate a semiconductor device according to an embodiment of the present invention. 本発明の実施の形態に係る半導体装置を説明する部分拡大断面図Partial expanded sectional view explaining the semiconductor device which concerns on embodiment of this invention セカンドボンドにセキュリティボンドを設けた状態を示す図The figure which shows the state which provided the security bond in the second bond 本発明の実施の形態に係る半導体装置を説明する図10A and 10B illustrate a semiconductor device according to an embodiment of the present invention. 本発明の実施の形態に係る半導体装置を説明する部分拡大断面図Partial expanded sectional view explaining the semiconductor device which concerns on embodiment of this invention セカンドボンドにセキュリティボンドを設けた状態を示す図The figure which shows the state which provided the security bond in the second bond 本発明の実施の形態に係る半導体装置を説明する部分拡大断面図Partial expanded sectional view explaining the semiconductor device which concerns on embodiment of this invention セカンドボンドにセキュリティボンドを設けた状態を示す図The figure which shows the state which provided the security bond in the second bond 従来の半導体装置を説明する図FIG. 6 illustrates a conventional semiconductor device 従来の半導体装置を説明する図FIG. 6 illustrates a conventional semiconductor device

符号の説明Explanation of symbols

１ 光半導体装置
２ 第１の発光素子
３ 第２の発光素子
４ 受光素子
５ 制御素子
６ 半導体素子
７ リードフレーム
７ａ 接続端子
７ｂ 電極
８ ワイヤ
１０ 電極パッド
１１，１３，１５ 第１のワイヤ
１１ａ，１３ａ，１５ａ ファーストボンド
１１ｂ，１３ｂ，１５ｂ セカンドボンド
１２，１４，１６ 第２のワイヤ
１２ａ，１４ａ，１６ａ ファーストボンド
１２ｂ，１４ｂ，１６ｂ セカンドボンド
１２ｃ，１４ｃ，１６ｃ セキュリティボンド DESCRIPTION OF SYMBOLS 1 Optical semiconductor device 2 1st light emitting element 3 2nd light emitting element 4 Light receiving element 5 Control element 6 Semiconductor element 7 Lead frame 7a Connection terminal 7b Electrode 8 Wire 10 Electrode pad 11,13,15 1st wire 11a, 13a , 15a First bond 11b, 13b, 15b Second bond 12, 14, 16 Second wire 12a, 14a, 16a First bond 12b, 14b, 16b Second bond 12c, 14c, 16c Security bond

Claims (6)

半導体素子と、前記半導体素子を樹脂封止する樹脂パッケージと、前記半導体素子に設けられた電極および他の電極を接続するワイヤとを備えた半導体装置において、
前記ワイヤは、接続される１対の前記半導体素子の電極と前記他の電極との間に、複数本配線されていることを特徴とする半導体装置。 In a semiconductor device comprising a semiconductor element, a resin package for resin-sealing the semiconductor element, and an electrode provided on the semiconductor element and a wire for connecting another electrode,
A plurality of wires are wired between the pair of electrodes of the semiconductor element to be connected and the other electrode. 前記ワイヤは、前記半導体素子の電極と前記他の電極との間に２本配線され、
第１のワイヤは、ファーストボンドが一方の電極に接続され、かつセカンドボンドが他方の電極に接続され、
第２のワイヤは、前記第１のワイヤのセカンドボンドとした位置にセキュリティボンドとしたファーストボンドが接続され、かつ一方の電極の前記第１のワイヤのファーストボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴とする請求項１記載の半導体装置。 Two wires are wired between the electrode of the semiconductor element and the other electrode,
The first wire has a first bond connected to one electrode and a second bond connected to the other electrode;
The second wire has a position different from the position where the first bond of the first wire of one electrode is connected to the position of the first wire as the second bond of the first wire. 2. The semiconductor device according to claim 1, wherein a second bond is connected to the semiconductor device. 前記第２のワイヤのセカンドボンドにセキュリティボンドが設けられていることを特徴とする請求項２記載の半導体装置。 The semiconductor device according to claim 2, wherein a security bond is provided in a second bond of the second wire. 前記ワイヤは、前記半導体素子の電極と前記他の電極との間に２本配線され、
第１のワイヤは、一方の電極にファーストボンドが接続され、かつ他方の電極にセカンドボンドが接続され、
第２のワイヤは、前記他方の電極の前記第１のワイヤのセカンドボンドが接続された位置とは異なる位置にファーストボンドが接続され、かつ前記一方の電極の前記第１のワイヤのファーストボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴とする請求項１記載の半導体装置。 Two wires are wired between the electrode of the semiconductor element and the other electrode,
The first wire has a first bond connected to one electrode and a second bond connected to the other electrode;
The second wire has a first bond connected to a position different from a position where the second bond of the first wire of the other electrode is connected, and a first bond of the first wire of the one electrode is 2. The semiconductor device according to claim 1, wherein a second bond is connected to a position different from the connected position. 前記ワイヤは、前記半導体素子の電極と前記他の電極との間に２本配線され、
第１のワイヤは、一方の電極にファーストボンドが接続され、かつ他方の電極にセカンドボンドが接続され、
第２のワイヤは、前記一方の電極の前記第１のワイヤのファーストボンドが接続された位置とは異なる位置にファーストボンドが接続され、かつ前記他方の電極の前記第１のワイヤのセカンドボンドが接続された位置とは異なる位置にセカンドボンドが接続されていることを特徴とする請求項１記載の半導体装置。 Two wires are wired between the electrode of the semiconductor element and the other electrode,
The first wire has a first bond connected to one electrode and a second bond connected to the other electrode;
The second wire has a first bond connected to a position different from a position where the first bond of the first wire of the one electrode is connected, and a second bond of the first wire of the other electrode is 2. The semiconductor device according to claim 1, wherein a second bond is connected to a position different from the connected position. 前記第１のワイヤまたは第２のワイヤの少なくとも一方または両方のセカンドボンドにセキュリティボンドが設けられていることを特徴とする請求項４または５記載の半導体装置。 6. The semiconductor device according to claim 4, wherein a security bond is provided in a second bond of at least one or both of the first wire and the second wire.
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
US8008785B2 (en) 2009-12-22 2011-08-30 Tessera Research Llc Microelectronic assembly with joined bond elements having lowered inductance
US20220278060A1 (en) * 2020-12-07 2022-09-01 Infineon Technologies Ag Molded semiconductor package with high voltage isolation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008785B2 (en) 2009-12-22 2011-08-30 Tessera Research Llc Microelectronic assembly with joined bond elements having lowered inductance
US8410618B2 (en) 2009-12-22 2013-04-02 Tessera, Inc. Microelectronic assembly with joined bond elements having lowered inductance
US8816514B2 (en) 2009-12-22 2014-08-26 Tessera, Inc. Microelectronic assembly with joined bond elements having lowered inductance
US20220278060A1 (en) * 2020-12-07 2022-09-01 Infineon Technologies Ag Molded semiconductor package with high voltage isolation
US11817407B2 (en) * 2020-12-07 2023-11-14 Infineon Technologies Ag Molded semiconductor package with high voltage isolation

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