JP2006245481A - Cutting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting apparatus for resin molded electronic components with a simplified structure whose cutting mold can be easily exchanged when it is worn. <P>SOLUTION: The cutting apparatus for resin molded electronic components cuts and forms the vicinity of tie bars 17 of a lead frame 16. It is provided with two rectangular parallelepiped metal blocks 11 and 12 constituting a die which sandwiches a surface separation keeping member 13 having two parallel planes and is fixed by one-end holding. It is also provided with a mechanism for pushing up the resin molded electronic component by a punch 14 in the direction of travel of the punch 14. Also, when the rectangular parallelepiped metal blocks 11 and 12 are worn, they may be replaced one by one. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cutting apparatus used for cutting the vicinity of a tie bar of a lead frame in which an electronic component is sealed with resin, and adjusting the shape of an external terminal, and in particular, the configuration of a cutting portion can be simplified and manufactured at low cost. It relates to a cutting device.

  Conventionally, a method by punching using an upper die and a lower die has been used to form external terminals of resin-molded electronic components.

  For example, Patent Document 1 discloses a method and apparatus for punching and cutting a lead frame with an upper mold and a lower mold corresponding to the upper mold in the case of a semiconductor device.

  FIG. 2 is a perspective view showing an external terminal cutting device for resin-molded electronic components according to a general prior art. 21 is an upper mold, 22 is a lower mold, 16 is a lead frame, 17 is a tie bar, and 19 is a resin of a resin molded electronic component. Using such a mold, the external terminals are cut into a predetermined length by punching and molded.

JP 2004-327668 A

  In a conventional cutting apparatus using an upper die and a lower die, as shown in FIG. 2, a general case in which an electronic component is to be cut with a resin-sealed tie bar portion (terminal portion) of a lead frame. A typical method is to make punches and dies and cut them.

  The above conventional techniques have the following problems. In other words, when trying to cut the tie bar portion of a lead frame in which an electronic component is sealed with resin, the punch and die must be newly manufactured by cutting or the like into a dedicated shape that matches the electronic component. The production cost is high, and the replacement is not easy.

  Therefore, it is important to provide technical means regarding the cutting portion that solves the above-described problems and is inexpensive to manufacture and requires a short manufacturing time.

  That is, an object of the present invention is to provide a cutting device for a resin mold electronic component which has a simplified structure and can be easily replaced when the cutting die is worn.

  In order to solve the above-described problems, a cutting apparatus according to the present invention includes a cutting unit using a die and a punch, and cuts a terminal portion of an electronic component resin-sealed on a lead frame. In the vicinity of the ends of the rectangular parallelepiped metal blocks, a plane spacing holding member having a constant width is sandwiched and the end portions are cantilevered, and the surfaces of the two rectangular parallelepiped metal blocks facing each other are parallel to each other. And the punch has a width smaller than the interval, and the punch is used to push the electronic component on the lead frame between the rectangular parallelepiped metal blocks of the die by the punch. A mechanism for relative movement is provided.

  According to the present invention, a cutting die can be constructed by combining two parts made of a rectangular parallelepiped metal block and cantilevered, and it is easy to produce a rectangular parallelepiped part. Since replacement is easy, it is possible to provide a cutting apparatus for resin-molded electronic components that has a simple configuration and is easy to maintain.

  An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a cutting apparatus for resin mold electronic parts and a method of using the same according to the present invention. , 15 indicates a punch moving direction during cutting, 16 indicates a lead frame, 17 indicates a tie bar (terminal portion), and 18 indicates a lead frame moving direction.

  As shown in FIG. 1, the cutting apparatus according to the present embodiment can form a cutting die easily and inexpensively by arranging two cutting blades that are parts of a polished rectangular parallelepiped block. Furthermore, parts can be easily replaced by using cantilever support. In some cases, only one side can be replaced.

  Next, based on FIG. 1, the usage method of this cutting device is demonstrated. Two rectangular parallelepiped metal blocks 11 and 12 having the same dimensions are arranged in parallel at positions where the corresponding surfaces face each other, and the parallel interval between the rectangular parallelepiped metal blocks 11, The punch 14, which is another member having a width smaller than that of the punch 14, is allowed to enter the punch movement direction 15 in the gap formed thereby. . In the apparatus having such a configuration, the two rectangular parallelepiped metal blocks 11 and 12 and the gap formed thereby are used as a die, and one member that enters the die is used as a punch 14, and an electronic component is sealed with a resin 19. However, the tie bar 17 is cut by inserting the lead frame 16 between the punch 14 and the die in the lead frame moving direction 18. The rectangular parallelepiped metal blocks 11 and 12 can be used as they are without adding processing to a commercially available block material, and can be easily manufactured.

  The present invention relates to a cutting device used for cutting a tie bar portion (terminal portion) of a lead frame where an electronic component is sealed with a resin by the above configuration, and particularly to provide a device with a simplified cutting portion configuration. I was able to.

  As a result of using this cutting device for resin-molded inductors with surface-mounted terminals in the cutting process of the terminal part, it became possible to reduce the manufacturing cost of the cutting device and the cost related to maintenance of the cutting blade .

The perspective view which shows the cutting apparatus of the resin mold electronic component of this invention, and its usage method. The perspective view which shows the cutting device of the external terminal of the resin-molded electronic component by a prior art.

Explanation of symbols

11, 12 Cuboid metal block 13 Surface spacing holding member 14 Punch 15 Punch moving direction 16 Lead frame 17 Tie bar (terminal part)
18 Lead frame moving direction 19 Resin

Claims (1)

  In a cutting apparatus that includes a die and a punch cutting portion and cuts a terminal portion of an electronic component resin-sealed on a lead frame, the die has a parallel plane in the vicinity of the ends of two rectangular parallelepiped metal blocks The end portion is cantilevered while sandwiching a constant-width surface interval holding member, and the two opposing surfaces of the rectangular parallelepiped metal block are held parallel to each other and at an interval defined by the constant width, A cutting apparatus having a mechanism for relatively moving the punch so that the punch has a width smaller than the interval and the electronic component on the lead frame is pushed between the rectangular parallelepiped metal blocks of the die by the punch. .

Images