JP2006237285A - Semiconductor light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which can be appropriately made thin. <P>SOLUTION: The semiconductor light emitting device A1 is provided with a plurality of LED chips 2 and a conduction supporting member wherein the LED chips 2 are mounted. The conduction supporting member includes first and second leads 1A and 1B, and all of the LED chips 2 are mounted to the first lead 1A. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor light emitting device that is configured by using a plurality of semiconductor light emitting elements such as LED chips and is used as a so-called planar light source in a lighting device such as a flash of a digital camera or a mobile phone.

  An example of a conventional semiconductor light emitting device is shown in FIG. 6 (see, for example, Patent Document 1). The semiconductor light emitting device X shown in the figure includes a plurality of LED chips 92 mounted on a printed wiring board 91 as a conduction support member, and a reflector 93 surrounding each LED chip 92. The printed wiring board 91 is configured by laminating resin insulating layers 91b and 91c and wiring 91d on a metal plate 91a. The reflector 93 is made of, for example, Al, and its inward side surface is a reflecting surface 93a. The plurality of LED chips 92 and the reflector 93 are covered with a transparent resin 94. The plurality of LED chips 92 emit light all at once when power is supplied through the wiring 91d. Thus, the semiconductor light emitting device X is configured as a so-called planar light source.

  However, in recent years, there has been a strong demand for higher brightness for the semiconductor light emitting device X. This is due to the fact that it can cope with higher image quality of digital cameras, and is expected to be applied to automobile headlights. As a measure for increasing the brightness of the semiconductor light emitting device X, it is conceivable to increase the output by flowing a larger current. However, when a large current flows through the LED chip 92, the amount of heat generated from the LED chip 92 increases in proportion to this. Then, the transparent resin 94 changes in quality and the translucency is lowered, or the semiconductor light emitting device X as a whole is liable to bend and be broken. For this reason, it is necessary to dissipate heat from the LED chip 92 appropriately. However, the LED chip 92 is covered with a transparent resin 94 having a relatively low thermal conductivity at the upper side and the side in the drawing. Also, in the lower part of the LED chip 92 in the figure, since the printed wiring board 91 is used as the conduction support member, the insulating resins 91b and 91c become thermal resistances, and the heat between the LED chip 92 and the metal plate 91a. The transfer coefficient is relatively small. Therefore, there is a case where heat dissipation from the LED chip 92 is not properly performed and the request for high brightness cannot be sufficiently satisfied. In particular, when a reduction in size is achieved with an increase in brightness, a plurality of LED chips 92 are mounted at a higher density. In such a case, there is also a problem that increasing the density of the LED chip 92 makes the heat dissipation more difficult.

JP 2004-241509 A

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide a semiconductor light emitting device capable of appropriately achieving high luminance by improving heat dissipation.

  In order to solve the above problems, the present invention takes the following technical means.

  A semiconductor light-emitting device provided by the present invention is a semiconductor light-emitting device including a plurality of semiconductor light-emitting elements and a conduction support member on which the plurality of semiconductor light-emitting elements are mounted. And the second lead, and the plurality of semiconductor light emitting elements are all mounted on the first lead. In the present invention, the conduction support member refers to a member having conductivity that enables power supply to the semiconductor light emitting element and the like and capable of mechanically supporting the semiconductor light emitting element. The lead is generally formed by processing a metal plate such as Cu or Cu alloy, and has a rigidity capable of supporting the semiconductor light emitting element while being electrically connected to the semiconductor light emitting element. The thing which has.

  According to such a configuration, the plurality of semiconductor light emitting elements are directly mounted on the first lead without using an insulating resin, for example. The first lead can be made of a metal having a relatively high thermal conductivity as compared with a resin or the like. For this reason, the heat generated from the semiconductor light emitting element is easily dissipated through the first lead. Thereby, for example, it is possible to avoid that the transparent resin covering the semiconductor light emitting element becomes excessively high in temperature and deteriorates to deteriorate translucency, and that the entire semiconductor light emitting device is unduly bent due to thermal stress. . Therefore, it is suitable for promoting heat dissipation and achieving high output and high brightness.

  In a preferred embodiment of the present invention, the first lead has a concave portion, and the second lead has a convex portion that enters the concave portion. According to such a configuration, the portion where the first lead and the second lead face each other is enlarged to facilitate provision of power supply means for the semiconductor light emitting element such as a wire, and the entire size can be reduced. Can be achieved.

  In a preferred embodiment of the present invention, the plurality of semiconductor light emitting elements are arranged so as to surround the recess. According to such a configuration, the plurality of semiconductor light emitting elements can be arranged relatively compactly.

  In a preferred embodiment of the present invention, each of the semiconductor elements and the convex portion of the second lead are connected by a wire. According to such a configuration, even when the semiconductor light emitting element and the second lead are spaced apart from each other, they can be appropriately connected.

  In a preferred embodiment of the present invention, the convex portion of the second lead is provided with a chip protruding in the thickness direction, and the wire is connected to the chip. According to such a configuration, so-called stitch bonding can be performed using the chip in the wire bonding operation. Therefore, it is possible to reduce the depth at which the bonding tool used in the bonding operation enters the semiconductor light emitting device, and to avoid interference between the bonding tool and each part of the semiconductor light emitting device. . Therefore, the semiconductor light emitting device can be easily manufactured while achieving high density and downsizing.

  In a preferred embodiment of the present invention, the chip is composed of a Si main body and an Ag or Al conductor film covering the main body. According to such a configuration, the chip has a relatively good heat transfer property. Therefore, when a transparent resin covering the semiconductor light emitting element is provided, the heat transmitted to the transparent resin can be released to the second lead through the chip. Accordingly, heat dissipation from the semiconductor light emitting device can be further promoted.

  In a preferred embodiment of the present invention, the chip is made of metal. Even with such a configuration, it is possible to easily manufacture the semiconductor light emitting device and to promote heat dissipation.

  In a preferred embodiment of the present invention, a reflector surrounding each of the plurality of semiconductor light emitting elements is further provided. Such a configuration is advantageous for increasing the luminance of the semiconductor light emitting device by effectively utilizing the light from the semiconductor light emitting element.

  In a preferred embodiment of the present invention, Ag plating or Al plating is formed on the surface of the reflector. According to such a configuration, the surface of the reflector can be a surface having a high light reflectance, and waste of light from the semiconductor light emitting element can be reduced.

  In a preferred embodiment of the present invention, an insulating resin interposed between the first and second leads is further provided, and at least a part of the reflector is formed by a part of the insulating resin. Yes. According to such a configuration, when the first and second leads are joined using the insulating resin in the manufacturing process of the semiconductor light emitting device, a part of the reflector is formed in advance. It is possible and the manufacturing efficiency can be improved.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show an example of a semiconductor light emitting device according to the present invention. The semiconductor light emitting device A1 of the present embodiment includes first and second leads 1A and 1B, a plurality of LED chips 2, a reflector 3, a transparent resin 5A, a soft resin 5B, and an insulating resin 7. In FIG. 1, the transparent resin 5A and the soft resin 5B are omitted. The semiconductor light emitting device A1 is configured as a so-called planar light source in which a region where a plurality of LED chips 2 are arranged in FIG.

  The first and second leads 1A and 1B are made of a metal having a relatively high thermal conductivity such as Cu or Cu alloy, and are insulated with an insulating resin 7 and bonded to each other. The insulating resin 7 is made of, for example, an epoxy resin. The first and second leads 1A and 1B and the insulating resin 7 constitute a conduction support member in the present invention. As shown in FIG. 1, the first lead 1A is provided with a concave portion 11A, and the second lead 1B is provided with a convex portion 11B. The first lead 1A and the second lead 1B are arranged so that the convex portion 11B enters the concave portion 11A. As shown in FIG. 2, portions near one end of the first and second leads 1A and 1B are terminals 12A and 12B, respectively. When the semiconductor light emitting device A1 is mounted on a lighting device or the like, for example, as shown in FIG. 2, the terminals 12A and 12B are connected to the power supply terminal T of the lighting device and the first and second leads 1A and 1B are connected. It is possible to make the lower surface in the figure contact the heat sink Rd of the lighting device. An insulating layer Is is formed on the surface of the heat sink Rd that is in contact with the semiconductor light emitting device A1. The insulating layer Is is made of, for example, AlN (aluminum nitride) and has a good thermal conductivity equivalent to that of metal Al as well as electrical insulation.

  As shown in FIG. 1, three chips 15 are provided in series on the convex portion 11B of the second lead 1B. These chips 15 are for use in so-called stitch bonding of the wires 4 connecting the LED chips 2 described later, and as shown in the partially enlarged view of FIG. 3, a main body 15a and a conductor film 15b covering the main body 15a. Consists of. The main body 15a is made of, for example, Si. The conductor film 15b is a thin film in which, for example, Ag or Al is evaporated. Unlike the present embodiment, the chip 15 may be integrally formed of a metal such as Cu or Cu alloy.

  The LED chip 2 corresponds to an example of a semiconductor light emitting element and has a substantially rectangular parallelepiped shape, for example, about 0.3 mm square. In the present embodiment, an LED chip 2 is used in which an LED having a substantially trapezoidal cross section capable of emitting blue light is packaged in a substantially rectangular parallelepiped shape with a resin containing phosphor powder. As shown in FIG. 1, the semiconductor light emitting device A1 includes nine LED chips 2. The nine LED chips 2 are all mounted on the first lead 1 </ b> A, and are disposed so as to surround the concave portion 11 </ b> A, the convex portion 11 </ b> B, and the three chips 15. Thus, nine LED chips 2 and three chips 15 are arranged in a matrix of 3 rows and 4 columns.

  The LED chip 2 is a so-called double-sided electrode type LED chip provided with one of an anode electrode and a cathode electrode on each of the upper and lower surfaces in FIG. 2 or FIG. The LED chip 2 is so-called die-bonded to the first lead 1A, so that the electrode on the lower surface of the LED chip 2 in the drawing is electrically connected to the first lead 1A. On the other hand, as shown in FIG. 3, the upper surface of the LED chip 2 in the drawing is connected to the upper surface of the chip 15 in the drawing via the wire 4. As a result, the electrode on the upper surface of the LED chip 2 in the drawing is electrically connected to the second lead 1B. The joint between the LED chip 2 and the wire 4 is covered with a soft resin 5B. The soft resin 5B is made of, for example, a silicone resin containing phosphor powder, and is for changing blue light emitted from the upper surface of the LED chip 2 into white light.

  The reflector 3 has a plurality of partition walls 31 and 32 and an outer frame 33. The partition walls 31 and 32 are disposed so as to partition the nine LED chips 2 and the three chips 15 disposed in a matrix. As shown in the partial enlarged views of FIGS. 2 and 3, the partition walls 31 and 32 have a cross-sectional mountain shape, and a conductor film 36 such as Ag plating or Al plating is formed on the surface thereof. Thereby, each inclined surface of the partition walls 31 and 32 is a reflecting surface 3 a surrounding the LED chip 2. As shown in the partially enlarged view of FIG. 2, the partition wall 31 is provided on the first lead 1A, and is formed of, for example, an epoxy resin. On the other hand, the partition wall 32 is formed by a part of the insulating resin 7 as shown in FIGS. The wire 4 described above connects the LED chip 2 and the chip 15 so as to straddle the partition walls 31 and 32. As shown in FIG. 1, the outer frame 33 surrounds the nine LED chips 2 at once. As shown in FIGS. 2 and 3, the outer frame 33 has an inwardly inclined surface in the figure, and a conductor film 36 is formed on the surface thereof as shown in the partially enlarged view of FIG. Yes. Thereby, the slope is the reflecting surface 3b. The partition walls 31 and 32 and the outer frame 33 may be formed using a white resin containing TiO 2 powder. In that case, the conductor film 36 may not be formed on these surfaces. .

  As shown in FIGS. 2 and 3, the LED chip 2, the chip 15, the wire 4, and the partition walls 31 and 32 are covered with a transparent resin 5A. The transparent resin 5A is made of, for example, an epoxy resin and has translucency with respect to light emitted from the LED chip 2. The transparent resin 5 </ b> A is for protecting the LED chip 2 and the wire 4 while emitting light from the LED chip 2. The transparent resin 5A is formed by, for example, filling an epoxy resin having fluidity so as to cover the LED chip 2 and the like and curing it.

  Next, the operation of the semiconductor light emitting device A1 will be described.

  According to this embodiment, heat dissipation of the semiconductor light emitting device A1 can be promoted. That is, the plurality of LED chips 2 are directly mounted on the first lead 1A without using an insulating resin, for example. The first lead 1A is made of, for example, Cu or a Cu alloy having a relatively high thermal conductivity. For this reason, the heat generated from the LED chip 2 when the semiconductor light emitting device A1 is turned on is, for example, through the first lead 1A as compared with the example of the prior art in which the printed wiring board shown in FIG. 6 is used. It is easy to be dissipated. Therefore, heat from the LED chip 2 is not easily transmitted to the transparent resin 5A. Thereby, it can avoid that the transparent resin 5A becomes too high temperature, and it can prevent that the transparent resin 5A changes in quality and translucency falls. Further, it is possible to suppress the temperature rise of the entire semiconductor light emitting device A1. For this reason, there is little possibility that the semiconductor light-emitting device A1 is bent due to thermal stress and destroyed. From the above, according to the semiconductor light emitting device A1, it is possible to increase the current supplied to the LED chip 2 and increase the output, which is suitable for increasing the luminance.

  In particular, as shown in FIG. 2, according to the present embodiment, the lower surface of the first lead 1A in the drawing can be brought into contact with a heat radiating plate Rd such as a lighting device on which the semiconductor light emitting device A1 is mounted. By adopting such a mounting structure, it is possible to actively release heat from the first lead 1A to the heat sink Rd, which is suitable for high output.

  A portion in which the first and second leads 1A and 1B face each other when the convex portion 11B formed in the second lead 1B enters the concave portion 11A formed in the first lead 1A. Is getting longer. The nine LED chips 2 are arranged along the facing portions. With this arrangement, the length of the wire 4 can be shortened, and the connection between the LED chip 2 and the convex portion 11B of the second lead 1B is facilitated. Therefore, the electrical connection of the LED chip 2 can be rationally performed. The nine LED chips 2 are arranged in a matrix with the three chips 15. Thereby, there is almost no useless space between adjacent LED chips 2. Therefore, the LED chip 2 can be disposed relatively compactly, and is suitable for increasing the density and size of the semiconductor light emitting device A1.

  In the present embodiment, it is possible to further promote heat dissipation by providing the chip 15 on the second lead 1B. That is, as described above, by mounting all the LED chips 2 on the first lead 1A, heat dissipation can be promoted. However, in order to further increase the output, it is desirable to further promote heat dissipation. It is. The chip 15 is made of Si, for example, having a relatively high thermal conductivity compared to the transparent resin 5A, and the conductor film 36 is also made of Ag or Al having a relatively high thermal conductivity. For this reason, the heat transferred from the LED chip 2 to the transparent resin 5 </ b> A can be released to the second lead 1 </ b> B via the chip 15. Therefore, it is advantageous for further promoting the heat dissipation of the semiconductor light emitting device A1 to achieve higher output and higher luminance.

  Further, since the chip 15 is provided, the wire 4 can be easily formed. That is, in the manufacturing process of the semiconductor light emitting device A1, the wire 4 is formed by so-called wire bonding. Specifically, a so-called stitch bonding is performed on the second lead 1B after the bonding tool is pressed against the LED chip 2 to perform so-called first bonding. The farther the position where the stitch bonding is performed, the deeper the semiconductor light emitting device A1, the more the bonding tool interferes with the partition walls 31 and 32, for example. This becomes more problematic as the semiconductor light emitting device A1 is reduced in size and density. In this embodiment, since the chip 15 protrudes from the second lead 1B, the depth of penetration of the bonding tool can be reduced. Therefore, the bonding tool is less likely to interfere with other members, and can be easily manufactured.

  As shown in FIGS. 2 and 3, the side of the LED chip 2 is surrounded by the reflecting surfaces 3 a and 3 b of the reflector 3, so that the light traveling from the LED chip 2 to the side is upward in the figure. And can be reflected. Therefore, the emitted light quantity of the semiconductor light emitting device A1 can be increased to increase the luminance. In particular, the partition walls 31 and 32 surround each LED chip 2 so that the light from each LED chip 2 is effectively used. As understood from FIG. 1, the shape of the first and second leads 1 </ b> A and 1 </ b> B of the present embodiment is relative to the LED chip 2 while sufficiently arranging the partition walls 31 and 32 suitable for high luminance. Therefore, it is suitable for supplying power appropriately.

  Furthermore, the wire 4 connects the LED chip 2 and the chip 15 of the second lead 1 </ b> B so as to straddle the partition walls 31 and 32 of the reflector 3. Thereby, although the LED chips 2 are arranged in a matrix and the partition walls 31 and 32 are provided so as to surround each LED chip 2, it is possible to appropriately connect the LED chips 2. is there. Therefore, this embodiment is suitable for achieving both high brightness, high density, and miniaturization.

  A partition wall 32 which is a part of the reflector 3 is formed by a part of the insulating resin 7. Thereby, for example, when the first and second leads 1A and 1B are joined by the insulating resin 7 in the manufacturing process of the semiconductor light emitting device A1, the basic shape of the partition wall 32 can be formed. . Therefore, the partition wall 32 can be rationally formed.

  4 and 5 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  The semiconductor light emitting device A2 shown in FIG. 4 includes three LED chips 2 and one chip 15 unlike the semiconductor light emitting device A1 described above in terms of the number of LED chips 2 and chips 15. The three LED chips 2 are all mounted on the first lead 1A, similarly to the semiconductor light emitting device A1. Each LED chip 2 and chip 15 are connected by a wire 4.

  As understood from the present embodiment, the present invention can have an appropriate layout according to the number of LED chips 2. It goes without saying that, regardless of the number of LED chips 2, heat radiation can be promoted to achieve higher output and higher brightness.

  In the semiconductor device A3 shown in FIG. 5, the LED chip 2 of a type different from the above-described embodiment is used. The LED chip 2 of the present embodiment is a so-called single-sided electrode type LED chip having both an anode electrode and a cathode electrode on the upper surface in the drawing. When the LED chip 2 of this type is provided, two wires 4 are connected to the upper surface of each LED chip 2 in the drawing. Among these, one wire 4 is connected to the chip 15 provided on the second lead 1B, as in the above-described embodiment. The other wire 4 is connected to the first lead 1A. In the figure, the first lead 1A is connected to a portion adjacent to the LED chip 2. Thus, the present invention can use not only a double-sided electrode type LED chip but also a single-sided electrode type LED chip as a semiconductor light emitting element.

  Further, in the semiconductor device A3 of the present embodiment, an insulating layer 8 is formed on the lower surface in the drawing. The insulating layer 8 is made of, for example, AlN, similarly to the insulating layer Is formed on the heat sink Rd in FIG. 2, and has electrical insulation and relatively good thermal conductivity. As shown in FIG. 5, the lower surface in the drawing of the semiconductor light emitting device A3 is covered with an insulating layer 8 in the horizontal direction in the drawing. On the other hand, in the depth direction in the figure, the insulating layer 8 is formed so as to expose portions near both ends of the semiconductor light emitting device A3, as in the relationship between the semiconductor light emitting device A1 and the insulating layer Is in FIG. Thereby, the terminals 12A and 12B are exposed and can be used for mounting the semiconductor light emitting device A3.

  The semiconductor light emitting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the semiconductor light emitting device according to the present invention can be varied in design in various ways.

  As described above, the shape of the first and second leads having the concave and convex portions is preferable for high density and miniaturization, but the present invention is not limited to this, and the first lead has a plurality of shapes. Any shape can be used as long as the semiconductor light emitting elements can be appropriately connected to the second lead while mounting the semiconductor light emitting elements.

  The number of semiconductor light emitting elements can be variously changed according to the required luminance. Moreover, although the size of the semiconductor light emitting element is 0.3 mm square in the above embodiment, it is not limited to this and can be variously changed. As the semiconductor light emitting device, if an LED chip is used, there is an advantage that relatively low power consumption and high luminance can be obtained. However, this is an example, and various semiconductor light emitting devices can be used. It is.

  A configuration in which the second lead is provided with a chip is preferable for promoting heat dissipation and facilitating manufacturing. However, the present invention is not limited to this, and the second lead may not have the above-described chip.

  As shown in FIG. 1, the reflector is not limited to one that divides a square region in plan view for each semiconductor light emitting element, but may be one that is divided into a circular shape in plan view, for example. Moreover, it is good also as a structure which does not provide the outer frame in FIG. In such a case, if the illumination device on which the semiconductor light emitting device is mounted includes a member corresponding to the outer frame, the amount of emitted light can be improved.

  The semiconductor light-emitting device according to the present invention is suitable for use in a flash of a digital camera, a mobile phone, or a headlight of an automobile. However, these are merely examples, and the application is not limited thereto.

1 is an overall plan view showing an example of a semiconductor light emitting device according to the present invention. It is sectional drawing in alignment with the II-II line of FIG. 1, and its partial enlarged view. It is sectional drawing which follows the III-III line | wire of FIG. 1, and its partial enlarged view. It is a whole top view which shows the other example of the semiconductor light-emitting device concerning this invention. It is sectional drawing which shows the other example of the semiconductor light-emitting device concerning this invention. It is sectional drawing which shows an example of the conventional semiconductor light-emitting device.

Explanation of symbols

A1, A2, A3 Semiconductor light emitting devices 1A, 1B First and second leads 2 LED chip (semiconductor light emitting element)
3 Reflector 3a, 3b Reflecting surface 4 Wire 5A Transparent resin 5B Soft resin 7 Insulating resin 8 Insulating layer 11A Concave 11B Convex 12A, 12B Terminal 15 Chip (protruding part)
15a body 15b conductor films 31, 32 partition wall 33 outer frame 36 conductor film (Ag plating or Al plating)

Claims (10)

A plurality of semiconductor light emitting elements;
A conductive support member on which the plurality of semiconductor light emitting elements are mounted, and a semiconductor light emitting device comprising:
The conductive support member includes first and second leads, and the plurality of semiconductor light emitting elements are all mounted on the first lead. A recess is formed in the first lead,
The semiconductor light emitting device according to claim 1, wherein the second lead is formed with a convex portion that enters the concave portion.   The semiconductor light emitting device according to claim 2, wherein the plurality of semiconductor light emitting elements are disposed so as to surround the recess.   4. The semiconductor light emitting device according to claim 2, wherein each of the semiconductor elements and the convex portion of the second lead are connected by a wire.   The semiconductor light-emitting device according to claim 4, wherein a chip projecting in a thickness direction is provided on the convex portion of the second lead, and the wire is connected to the chip.   6. The semiconductor light emitting device according to claim 5, wherein the chip includes a Si main body and an Ag or Al conductor film covering the main body.   The semiconductor light emitting device according to claim 5, wherein the chip is made of metal.   The semiconductor light-emitting device according to claim 1, further comprising a reflector surrounding each of the plurality of semiconductor light-emitting elements.   The semiconductor light-emitting device according to claim 8, wherein Ag plating or Al plating is formed on a surface of the reflector. The insulating resin interposed between the first and second leads, and at least a part of the reflector is formed of a part of the insulating resin. Semiconductor light emitting device.

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