JP2006229009A - Semiconductor manufacturing device and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To wash a wafer holder without removing the wafer holder from a device body. <P>SOLUTION: After a semiconductor wafer is treated by immersing a semiconductor wafer W in a chemical 6 while supporting the semiconductor wafer W by means of wafer guides 4a, 4b, the semiconductor wafer W is taken out of a treatment tank 1 via a wafer arm 7. After the chemical 6 inside the treatment tank 1 is exhausted via an exhaust pipe H1 by opening a valve V1, a valve V3 is opened. Consequently, a washing liquid 8 is supplied to nozzles 5a, 5b via a piping H3, and the washing liquid 8 is jetted toward the wafer guides 4a, 4b from the nozzles 5a, 5b. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor manufacturing apparatus and a semiconductor device manufacturing method, and is particularly suitable for application to a wafer guide cleaning method for holding a wafer in a processing tank.

  In the semiconductor manufacturing process, various chemical treatments are performed in order to perform cleaning of a semiconductor wafer or fine processing of a semiconductor wafer. In this chemical processing, there is a method of immersing a semiconductor wafer in a chemical stored in a chemical processing tank. In order to hold the semiconductor wafer in the chemical processing tank, a wafer guide or a semiconductor wafer is transferred to support the semiconductor wafer. For example, a wafer arm is used.

Further, for example, Patent Document 1 discloses a method of fixing a wafer carrier to a fixing device in a cleaning tank filled with pure water and rubbing the wafer carrier with a rotating brush in order to clean the wafer carrier. .
JP-A-9-283478

  However, since the wafer guide and wafer arm for holding the semiconductor wafer in the chemical solution treatment tank are constantly immersed in the chemical solution, no cleaning mechanism for the wafer guide or wafer arm has been provided. For this reason, once the wafer guide and the wafer arm are contaminated, the contamination is transferred to the semiconductor wafer one after another, causing a large number of defective products.

  In the method disclosed in Patent Document 1, in order to clean the wafer carrier, it is necessary to fix the wafer carrier to a fixing device in a cleaning tank filled with pure water. For this reason, in order to clean the wafer guide and the wafer arm that hold the semiconductor wafer, it is necessary to remove the wafer guide and the wafer arm from the apparatus main body, and it is necessary to stop the production line for a long time. There was a problem.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device and a semiconductor manufacturing apparatus manufacturing method capable of cleaning the wafer holder without removing the wafer holder from the apparatus main body.

In order to solve the above-described problem, according to a semiconductor manufacturing apparatus according to an aspect of the present invention, a processing tank for processing a wafer, a wafer holding unit for holding a wafer in the processing tank, and the inside of the processing tank And a cleaning means for cleaning the wafer holder.
This makes it possible to clean the wafer holding unit in the processing tank for processing the wafer, and it is possible to remove particles attached to the wafer holding unit without removing the wafer holding unit from the apparatus main body. For this reason, the wafer holder can be cleaned without stopping the production line for a long time, and contamination of the wafer can be prevented while suppressing a decrease in throughput.

In the semiconductor manufacturing apparatus according to one aspect of the present invention, the cleaning unit includes a cleaning liquid ejecting unit that ejects a cleaning liquid onto a wafer contact surface of the wafer holding unit.
Thereby, the wafer holding part can be cleaned in the processing tank while suppressing the contamination in the processing tank, and contamination of the wafer can be prevented while suppressing a decrease in throughput.
Moreover, according to the semiconductor manufacturing apparatus which concerns on 1 aspect of this invention, the wafer processing part which processes a wafer, the wafer conveyance part which conveys a wafer in the said processing tank, and the said wafer conveyance part in the said processing tank are wash | cleaned And a cleaning means.

  Thus, the wafer transfer unit can be cleaned in the processing tank for processing the wafer, and particles attached to the wafer transfer unit can be removed without removing the wafer transfer unit from the apparatus main body. For this reason, the wafer transfer unit can be cleaned without stopping the production line for a long time, and contamination of the wafer can be prevented while suppressing a decrease in throughput.

Moreover, according to the semiconductor manufacturing apparatus which concerns on 1 aspect of this invention, the processing tank which processes a wafer, the wafer conveyance part which conveys a wafer in the said processing tank, and the washing tank in which the said wafer conveyance part is carried in, And a cleaning means for cleaning the wafer transfer section in the cleaning tank.
As a result, it becomes possible to provide a processing tank for processing the wafer and a cleaning tank for cleaning the wafer transfer unit, and the wafer transfer unit is cleaned by using a transfer mechanism for transferring the wafer. Can be carried into the tank. Therefore, it is possible to clean the wafer transfer unit without removing the wafer transfer unit from the apparatus main body, and it is possible to prevent the processing tank from being contaminated by cleaning the wafer transfer unit, thereby reducing the throughput. While suppressing, contamination of the wafer can be prevented.

Further, according to the semiconductor manufacturing apparatus of one aspect of the present invention, the cleaning means is provided on the wafer contact surface of the wafer transfer section and the cleaning liquid jetting means for jetting a cleaning liquid to the wafer contact face of the wafer transfer section. And a brush to be contacted.
As a result, it is possible to prevent the processing tank from being contaminated by cleaning the wafer transfer unit, and it is possible to clean the wafer transfer unit using the cleaning liquid and the brush, thereby efficiently cleaning the wafer transfer unit. can do.

In addition, according to the method for manufacturing a semiconductor device according to an aspect of the present invention, the step of cleaning the wafer holding unit that holds the wafer in the processing tank, and the wafer held by the cleaned wafer holding unit, And a step of processing the wafer in a processing tank.
This makes it possible to clean the wafer holding unit without removing the wafer holding unit from the apparatus main body, and it is possible to prevent contamination of the wafer while suppressing a decrease in throughput.

In addition, according to the method for manufacturing a semiconductor device according to one aspect of the present invention, a process of cleaning a wafer transfer unit that transfers a wafer in a processing tank, and the wafer in the processing tank by the cleaned wafer transfer unit And a step of processing the wafer in the processing tank while the wafer is held by the cleaned wafer transfer section.
Accordingly, the wafer transfer unit can be cleaned without removing the wafer transfer unit from the apparatus main body, and contamination of the wafer can be prevented while suppressing a decrease in throughput.

In addition, according to the method for manufacturing a semiconductor device according to one aspect of the present invention, a process of cleaning a wafer transfer unit that transfers a wafer in a cleaning tank, and the wafer in the processing tank by the cleaned wafer transfer unit And a step of processing the wafer in the processing tank while the wafer is held by the cleaned wafer transfer unit.
As a result, it becomes possible to clean the wafer transfer unit without removing the wafer transfer unit from the apparatus main body, and it is possible to prevent the processing tank from being contaminated by cleaning the wafer transfer unit, thereby reducing the throughput. While suppressing, contamination of the wafer can be prevented.

Hereinafter, a semiconductor manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a sectional view showing a schematic configuration of a semiconductor manufacturing apparatus according to the first embodiment of the present invention.
In FIG. 1, the semiconductor manufacturing apparatus is provided with a processing tank 1 for processing a semiconductor wafer W. Here, a pipe H <b> 4 for circulating the chemical solution 6 stored in the processing tank 1 is connected to the processing tank 1. In addition, a discharge pipe H <b> 1 that discharges the chemical solution 6 stored in the treatment tank 1 is connected to the treatment tank 1. Furthermore, a supply pipe H2 for supplying a new chemical solution 6 to the processing tank 1 is connected to the pipe H4 via the pipe H4.

  The pipe H4 is provided with a pump 2 that pushes out the chemical liquid 6 that circulates in the pipe H4, and a filter 3 that filters impurities contained in the chemical liquid 6 is provided downstream of the pump 2. In addition, the discharge pipe H1 is provided with a valve V1 for blocking the flow of the chemical liquid 6 in the discharge pipe H1, and the supply pipe H2 is provided with a valve V2 for blocking the flow of the chemical liquid 6 in the supply pipe H2. Yes.

  In the processing tank 1, wafer guides 4 a and 4 b that hold the semiconductor wafer W carried into the processing tank 1 are installed. In addition, the groove | channel for inserting the edge part of the semiconductor wafer W is formed in the wafer guides 4a and 4b, and the semiconductor wafer W can be hold | maintained by supporting the edge part of the semiconductor wafer W from both sides. In the processing tank 1, nozzles 5a and 5b for ejecting the cleaning liquid 8 to the wafer guides 4a and 4b, respectively, are provided, and a pipe H3 for supplying the cleaning liquid 8 is connected to the nozzles 5a and 5b. Is provided with a valve V3 for blocking the flow of the cleaning liquid 8 in the pipe H3.

Further, a wafer arm 7 for transporting the semiconductor wafer W is provided on the processing tank 1, and the wafer arm 7 is configured to be movable up and down and left and right.
When processing the semiconductor wafer W in the processing tank 1, the semiconductor wafer W is carried into the processing tank 1 via the wafer arm 7 as shown in FIG. When the semiconductor wafer W is carried into the processing tank 1, as shown in FIG. 1B, the semiconductor wafer W is immersed in the chemical solution 6 while the semiconductor wafer W is supported by the wafer guides 4a and 4b. Thus, the semiconductor wafer can be processed.

Examples of the processing of the semiconductor wafer W performed in the processing tank 1 include chemical processing and pure water processing. For example, resist processing and stripping processing of the resist formed on the semiconductor wafer W, wet processing of the semiconductor wafer, and the like. An etching process, a cleaning process of the semiconductor wafer W, and the like can be given.
When the processing of the semiconductor wafer W is completed in the processing tank 1, the semiconductor wafer W is unloaded from the processing tank 1 through the wafer arm 7 as shown in FIG. And when the semiconductor wafer W is carried out of the processing tank 1, the chemical | medical solution 6 in the processing tank 1 is discharged | emitted via the discharge pipe H1 by opening valve | bulb V1. Then, by opening the valve V3, the cleaning liquid 8 is supplied to the nozzles 5a and 5b via the pipe H3, and the cleaning liquid 8 is ejected from the nozzles 5a and 5b toward the wafer guides 4a and 4b.

  This makes it possible to clean the wafer guides 4a and 4b in the processing tank 1 that processes the semiconductor wafer W, and attaches to the wafer guides 4a and 4b without removing the wafer guides 4a and 4b from the processing tank 1. Particles can be removed. For this reason, the wafer guides 4a and 4b can be cleaned without stopping the production line for a long time, and contamination of the semiconductor wafer W can be prevented while suppressing a decrease in throughput.

FIG. 2 is a cross-sectional view showing a schematic configuration of a semiconductor manufacturing apparatus according to the second embodiment of the present invention.
In FIG. 2, the semiconductor manufacturing apparatus is provided with a processing tank 11 for processing a semiconductor wafer W. Here, the processing tank 11 is connected to a pipe H <b> 14 for circulating the chemical solution 16 stored in the processing tank 11. Further, the treatment tank 11 is connected to a discharge pipe H11 for discharging the chemical solution 16 stored in the treatment tank 11. Furthermore, a supply pipe H12 for supplying a new chemical solution 16 to the processing tank 11 is connected to the pipe H14 via the pipe H14.

  The pipe H14 is provided with a pump 12 for pushing out the chemical liquid 16 circulating in the pipe H14, and a filter 13 for filtering impurities contained in the chemical liquid 16 is provided at a subsequent stage of the pump 12. Further, the discharge pipe H11 is provided with a valve V11 for blocking the flow of the chemical liquid 16 in the discharge pipe H11, and the supply pipe H12 is provided with a valve V12 for blocking the flow of the chemical liquid 16 in the supply pipe H12. Yes.

  Further, on the processing tank 11, wafer arms 17a and 17b for transporting the semiconductor wafer W are provided, and the wafer arms 17a and 17b are configured to be movable up and down and left and right. The wafer arms 17a and 17b are formed with grooves for inserting the end portions of the semiconductor wafer W, and the semiconductor wafer W can be held by supporting the end portions of the semiconductor wafer W from both sides. In the processing tank 11, nozzles 15b and 15a for ejecting the cleaning liquid 18 to the wafer arms 17a and 17b are provided, respectively, and a pipe H13 for supplying the cleaning liquid 18 is connected to the nozzles 15b and 15a. Is provided with a valve V13 for blocking the flow of the cleaning liquid 18 in the pipe H13.

  And when processing the semiconductor wafer W in the processing tank 11, as shown to Fig.2 (a), the semiconductor wafer W is conveyed on the processing tank 11 via wafer arm 17a, 17b. When the semiconductor wafer W is transferred onto the processing tank 11, as shown in FIG. 2B, the wafer arms 17 a and 17 b are lowered while holding the semiconductor wafer W, and the semiconductor wafer W is moved into the processing tank 11. Carry in. When the semiconductor wafer W is carried into the processing tank 11, the semiconductor wafer W can be processed by immersing the semiconductor wafer W in the chemical solution 16 while the semiconductor wafer W is supported by the wafer arms 17a and 17b. it can.

  When the processing of the semiconductor wafer W is completed in the processing tank 11, the semiconductor wafer W is carried out of the processing tank 11 through the wafer arms 17a and 17b as shown in FIG. Then, when the semiconductor wafer W is carried out of the processing bath 11, the wafer arms 17 a and 17 b are carried into the processing bath 11 without holding the semiconductor wafer W. When the wafer arms 17a and 17b are carried into the processing tank 11, the chemical solution 16 in the processing tank 11 is discharged through the discharge pipe H11 by opening the valve V11. When the chemical liquid 16 in the processing tank 11 is discharged, the cleaning liquid 18 is supplied to the nozzles 15a and 15b via the pipe H13 by opening the valve V13, and the cleaning liquid 18 is supplied from the nozzles 15b and 15a to the wafer arms 17a and 17b. Erupt towards.

  As a result, the wafer arms 17a and 17b can be cleaned in the processing tank 11 for processing the semiconductor wafer W, and particles attached to the wafer arms 17a and 17b can be removed without removing the wafer arms 17a and 17b from the apparatus main body. can do. For this reason, the wafer arms 17a and 17b can be cleaned without stopping the production line for a long time, and contamination of the semiconductor wafer W can be prevented while suppressing a decrease in throughput.

FIG. 3 is a sectional view showing a schematic configuration of a semiconductor manufacturing apparatus according to the third embodiment of the present invention.
In FIG. 3, the semiconductor manufacturing apparatus is provided with a processing tank 21 for processing a semiconductor wafer W, and a cleaning tank 31 for cleaning wafer arms 27 a and 27 b that transport the semiconductor wafer W.
Here, a pipe H <b> 24 for circulating the chemical liquid 26 stored in the processing tank 21 is connected to the processing tank 21. The treatment tank 21 is connected to a discharge pipe H11 for discharging the chemical solution 26 stored in the treatment tank 21. Furthermore, a supply pipe H22 for supplying a new chemical solution 26 to the processing tank 21 is connected to the pipe H24 via the pipe H24.

  The pipe H24 is provided with a pump 22 for pushing out the chemical liquid 26 circulating in the pipe H24, and a filter 23 for filtering impurities contained in the chemical liquid 26 is provided at the subsequent stage of the pump 22. Further, the discharge pipe H21 is provided with a valve V21 for blocking the flow of the chemical liquid 26 in the discharge pipe H21, and the supply pipe H22 is provided with a valve V22 for blocking the flow of the chemical liquid 26 in the supply pipe H22. Yes.

  Further, on the processing tank 21, wafer arms 27a and 27b for transporting the semiconductor wafer W are provided, and the wafer arms 27a and 27b are configured to be movable up and down and left and right. The wafer arms 27a and 27b are formed with grooves for inserting the end portions of the semiconductor wafer W, and the semiconductor wafer W can be held by supporting the end portions of the semiconductor wafer W from both sides.

  In the cleaning tank 31, nozzles 32b and 32a for ejecting the cleaning liquid 28 to the wafer arms 27a and 27b are provided, respectively, and a pipe H31 for supplying the cleaning liquid 34 is connected to the nozzles 32b and 32a. Is provided with a valve V31 for blocking the flow of the cleaning liquid 34 in the pipe H31. Further, in the cleaning tank 31, there are provided rotating brushes 33a and 33b for cleaning the wafer arms 27a and 27b in contact with the wafer arms 27a and 27b. In addition, a discharge pipe H32 for discharging the cleaning tank 31 accumulated in the cleaning tank 31 is connected to the cleaning tank 31, and a valve for blocking the flow of the cleaning tank 31 in the discharge pipe H32 is connected to the discharge pipe H32. V32 is provided.

  When processing the semiconductor wafer W in the processing tank 21, as shown in FIG. 3A, the semiconductor wafer W is transferred into the processing tank 21 through the wafer arms 27 a and 27 b. Then, when the semiconductor wafer W is carried into the processing tank 21, the semiconductor wafer W can be processed by immersing the semiconductor wafer W in the chemical solution 26 while the semiconductor wafer W is supported by the wafer arms 27a and 27b. it can.

  When the processing of the semiconductor wafer W is completed in the processing tank 21, the semiconductor wafer W is carried out of the processing tank 21 via the wafer arms 27a and 27b as shown in FIG. Then, when the semiconductor wafer W is carried out of the processing bath 21, the wafer arms 27 a and 27 b are carried into the cleaning bath 31 in a state where the semiconductor wafer W is not held. When the wafer arms 27a and 27b are carried into the cleaning tank 31, the valve V32 is opened to supply the cleaning liquid 34 to the nozzles 32a and 32b via the pipe H32, and the cleaning liquid 34 is supplied from the nozzles 32b and 32a to the wafer arm 27a. , 27b and the rotating brushes 33a, 33b are brought into contact with the wafer arms 27a, 27b while rotating the rotating brushes 33a, 33b.

  Accordingly, it is possible to provide the processing tank 21 for processing the semiconductor wafer W and the cleaning tank 31 for cleaning the wafer arms 27a and 27b, and use a transfer mechanism for transferring the semiconductor wafer W. Thus, the wafer arms 27 a and 27 b can be carried into the cleaning tank 31. Therefore, the wafer arms 27a and 27b can be cleaned without removing the wafer arms 27a and 27b from the apparatus main body, and the processing tank 21 can be prevented from being contaminated by cleaning the wafer arms 27a and 27b. Contamination of the semiconductor wafer W can be prevented while suppressing a decrease in throughput.

Sectional drawing which shows schematic structure of the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. Sectional drawing which shows schematic structure of the semiconductor manufacturing apparatus which concerns on 2nd Embodiment of this invention. Sectional drawing which shows schematic structure of the semiconductor manufacturing apparatus which concerns on 3rd Embodiment of this invention.

Explanation of symbols

  W Wafer 1, 11, 21 Processing tank 2, 12, 22 Pump 3, 13, 23 Filter, 4a, 4b Wafer guide, 5a, 5b, 15a, 15b, 32a, 32b Nozzle, 6, 16, 26 Chemical solution 7a, 7b, 17a, 17b, 27a, 27b Wafer arm, 8, 18, 34 Cleaning solution, H1-H4, H11-H14, H21, H22, H24, H31, H32 piping, V1-V3, V11-V13, V21, V22, V31, V32 Valve, 31 Cleaning tank, 33a, 33b Rotating brush

Claims (8)

A processing tank for processing wafers;
A wafer holding unit for holding a wafer in the processing tank;
A semiconductor manufacturing apparatus, comprising: cleaning means for cleaning the wafer holder in the processing tank. The cleaning means includes
The semiconductor manufacturing apparatus according to claim 1, further comprising a cleaning liquid ejecting unit that ejects a cleaning liquid onto a wafer contact surface of the wafer holding unit. A processing tank for processing wafers;
A wafer transfer section for transferring a wafer into the processing tank;
A semiconductor manufacturing apparatus comprising: a cleaning unit that cleans the wafer transfer unit in the processing tank. A processing tank for processing wafers;
A wafer transfer section for transferring a wafer into the processing tank;
A cleaning tank into which the wafer transfer unit is loaded;
A semiconductor manufacturing apparatus comprising: cleaning means for cleaning the wafer transfer section in the cleaning tank. The cleaning means includes
Cleaning liquid jetting means for jetting cleaning liquid to the contact surface of the wafer in the wafer transfer section;
The semiconductor manufacturing apparatus according to claim 4, further comprising a brush that is in contact with a wafer contact surface of the wafer transfer unit. Cleaning a wafer holding unit for holding a wafer in a processing tank;
And a step of processing the wafer in the processing tank while holding the wafer in the cleaned wafer holding portion. Cleaning the wafer transfer section for transferring the wafer in the processing tank;
Transporting the wafer into the processing bath at the cleaned wafer transport section;
And a step of processing the wafer in the processing tank while the wafer is held by the cleaned wafer transfer section. Cleaning the wafer transfer section for transferring the wafer in the cleaning tank;
A step of transferring the wafer into a processing tank by the cleaned wafer transfer unit;
And a step of processing the wafer in the processing tank while the wafer is held by the cleaned wafer transfer section.

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