JP2014179408A - Substrate treatment apparatus and method for cleaning the apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent mutual contamination caused by residual chips of photoresist coatings, by removing chips of coating films in a treatment tank.SOLUTION: A lifter 9 holding a plurality of substrates W is placed in a treatment position; a stripping liquid is circulated to carry out a stripping process; and then the lifter 9 is elevated to a stand-by position. Bubbles are supplied from a bubble supply pipe 19; an ultrasonic vibration imparting unit 21 is actuated to carry out a pulverizing process for finely pulverizing chips of photoresist coatings in a treatment tank 3; and then the stripping liquid in the treatment tank 3 is discharged through discharge pipes 33, 37. As the chips of the photoresist coatings are finely pulverized, they can be easily carried by a liquid flow in the discharge pipe 33 during the stripping liquid is discharged from the treatment tank 3. Therefore, even when a new striping liquid is supplied into the treatment tank 3, chips of the photoresist coatings can be prevented from mixing into the liquid, and mutual contamination during the treatment by the new stripping liquid can be prevented.

Description

  The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, an FED (Field Emission Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. The present invention relates to a substrate processing apparatus for processing a substrate and a substrate for a solar cell (hereinafter simply referred to as a substrate) and a cleaning method thereof, and more particularly to a technique for cleaning and removing a coating piece adhering to a processing tank.

  Conventionally, as this type of apparatus, a processing tank for storing a processing liquid and immersing a substrate to perform cleaning and removing processing of a film, an overflow tank for collecting processing liquid overflowing from the processing tank, a processing tank and an overflow tank, A circulation pipe for supplying and circulating the treatment liquid to the treatment tank, a filter member provided so as to cover the upper part of the drain port of the overflow tank communicated with the circulation pipe, and the circulation pipe. Some include a circulation filter that removes particles in the processing liquid and a lifter that holds a plurality of substrates on which a photoresist film is deposited (see, for example, Patent Document 1).

  In the apparatus having such a configuration, for example, in a state where the stripping solution is stored and circulated in the processing tank and the overflow tank, a plurality of substrates coated with a photoresist film are placed on the lifter while the processing liquid is stored in the processing tank and the overflow tank. Immerse in the stripper. Then, by maintaining the state for a predetermined time, the photoresist film deposited on the substrate is peeled off. Stripped pieces of the photoresist film are discharged along with the flow of the stripping solution from the processing tank to the overflow tank, and are captured by the filter member. Therefore, clogging of the circulation filter due to the fragments of the photoresist film can be prevented. Note that the peeled photoresist film floats in the processing tank as small fragments of several millimeters square or large fragments of several centimeters square.

JP 2002-96012 A

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, a part of the pieces of the photoresist film may not be discharged to the overflow tank and may stay in the processing tank. In such a state, even if the stripping solution in the processing tank is discharged for disposal, fragments of the photoresist film may remain attached in the processing tank. Therefore, when a new stripping solution is supplied to the processing tank, the fragments of the photoresist film adhering to the processing tank float in the stripping liquid. There is a problem that contamination of the substrate may occur due to adhesion.

  The present invention has been made in view of such circumstances, and a substrate capable of preventing cross-contamination caused by remaining pieces of the coating remaining by removing the pieces of the coating in the treatment tank. It aims at providing a processing apparatus and its cleaning method.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate processing apparatus for performing a peeling process on a film attached to a substrate with a peeling liquid, storing a peeling liquid, and immersing the substrate for processing, A discharge pipe for discharging the stripping liquid stored in the processing tank, an overflow tank for recovering the stripping liquid overflowing from the processing tank, a circulation pipe for circulating the stripping liquid in the overflow tank to the processing tank, and a plurality of sheets A lifter that can be raised and lowered over a processing position in the processing tank and a standby position that is above the processing tank, a crushing means that finely crushes the fragments of the coating existing in the processing tank, The lifter holding a single substrate is positioned at the processing position, the stripping liquid is circulated through the circulation pipe to perform the stripping process, and then the lifter is raised to the standby position to carry the substrate out of the processing tank. Shi Control means for operating the crushing means to discharge the stripping solution in the processing tank through the discharge pipe after performing the crushing process to make the fragments of the coating existing in the processing tank fine. It is characterized by being.

  [Operation / Effect] According to the invention described in claim 1, the control means positions the lifter holding a plurality of substrates at the processing position, and circulates the stripping solution through the circulation pipe to perform the stripping process. Thereafter, the lifter is raised to the standby position, and the substrate is carried out of the processing tank. Next, after the crushing process is performed to operate the crushing means to make the fragments of the coating film present in the processing tank fine, the stripping solution in the processing tank is discharged through the discharge pipe. Since the fragments of the coating existing in the treatment tank are crushed, it is easy to ride the liquid flow to the discharge pipe when the stripping liquid is discharged from the treatment tank. Therefore, even if a new stripping solution is supplied into the treatment tank, it is possible to prevent the coating strip from being mixed into the new stripping solution. As a result, it is possible to prevent cross-contamination where the fragments adhere to the substrate treated with a new stripping solution.

  Moreover, in this invention, it is preferable that the said control means positions the said lifter in a process position and performs the said crushing process following the said crushing process (Claim 2).

  The fragments of the film adhering to the lifter can be pulverized and discharged with the flow of the stripping solution from the treatment tank. Therefore, it is possible to prevent cross-contamination caused by the fragments of the film attached to the lifter.

  Moreover, in this invention, it is preferable that the said crushing means is an ultrasonic vibration provision means to provide an ultrasonic vibration with respect to the stripping solution in the said processing tank (Claim 3).

  The broken pieces of the coating existing in the treatment tank can be crushed by the ultrasonic vibration by the ultrasonic vibration applying means.

  Moreover, in this invention, it is preferable that the said crushing means is a bubble supply means which is provided in the bottom part of the said processing tank and supplies a bubble to the peeling liquid in the said processing tank (Claim 4).

  The debris of the coating existing in the treatment tank can be crushed by the bubbles generated by the bubble supply means.

  Further, in the present invention, a recovery tank provided at a discharge destination of the discharge pipe, and a net-like member having a larger area than an opening area of the discharge pipe are further provided, and the discharge pipe is disposed on the side of the recovery tank. It is preferable that the side located at is branched into a plurality of pieces, and each of them is arranged so as to face the reticulated member at a distance from each other.

  When recovering the stripping solution from the treatment tank via the discharge pipe, the fragments of the coating are dispersed and discharged at a plurality of locations on the mesh member. Therefore, the maintenance frequency of the mesh member can be reduced.

  Further, in the present invention, a recovery tank at a discharge destination of the discharge pipe, a mesh member having a larger area than an opening area of the discharge pipe, and a surface direction in which the mesh member is moved in the plane direction It is preferable that the controller further includes a driving unit, and the control unit operates the planar direction driving unit so that the pieces of the coating are dispersed in the mesh member.

  When recovering the stripping solution from the treatment tank via the discharge pipe, the control means moves the mesh member in the surface direction by the surface direction driving means. Therefore, since the fragments of the coating can be dispersed without concentrating on one location of the mesh member, the maintenance frequency of the mesh member can be reduced.

  Further, in the present invention, a recovery tank at a discharge destination of the discharge pipe, a net-like member that is provided in the recovery tank, has an area larger than an opening area of the discharge pipe, and is formed in an endless shape, and the net-like shape A driving means for driving the mesh member, arranged in contact with the inner peripheral surface side of the member; and a guide member for contacting the mesh member to guide the movement of the mesh member; and the control means It is preferable to operate the driving means so that the fragments of the film are dispersed in the mesh member.

  When recovering the stripping solution from the treatment tank via the discharge pipe, the control means moves the endless net-like member along the guide member by the driving means, so that the pieces of the coating can be dispersed. Therefore, the maintenance frequency of the mesh member can be reduced.

  Further, in the present invention, the mesh member is extended at a position where an end of the mesh member is removed from the collection tank, and is disposed on the inner peripheral side in the extended portion of the mesh member. It is preferable to further include a cleaning means for injecting a cleaning liquid from the inner surface to the outer surface of the member.

  The cleaning liquid can be supplied from the inner surface toward the outer surface by the cleaning means at a position away from the collection tank with respect to the net member. Therefore, since the fragments of the film deposited on the mesh member can be removed, the maintenance frequency can be reduced.

  The invention according to claim 9 is a cleaning method of a substrate processing apparatus for performing a peeling process on a film attached to a substrate with a peeling liquid, a treatment tank storing the peeling liquid and accommodating the substrate, and the treatment The lifter that holds the substrate is positioned at the processing position in the processing male while circulating the stripping solution through a circulation pipe across the overflow tank that collects the stripping solution overflowing from the tank, and the substrate is stripped by the stripping solution. A process of raising the lifter to a standby position above the processing tank and a crushing process of making the fragments of the coating existing in the processing tank fine after the peeling process is completed. And a process of discharging the stripping solution in the processing tank from the discharge pipe.

  [Operation / Effect] According to the invention described in claim 9, after the lifter is positioned at the processing position and the peeling process is performed, the lifter is positioned at the standby position and the fragments of the coating existing in the processing tank are removed. The crushing process which makes it fine is performed, and the peeling liquid in a processing tank is discharged from a discharge pipe. Since the fragments of the coating film existing in the processing tank are crushed by the crushing process, it is possible to easily ride the liquid flow to the discharge pipe when the stripping liquid is discharged from the processing tank. Therefore, even if a new stripping solution is supplied into the treatment tank, it is possible to prevent the coating strip from being mixed into the new stripping solution. As a result, it is possible to prevent cross-contamination where the fragments adhere to the substrate treated with a new stripping solution.

  According to the substrate processing apparatus of the present invention, the control means positions the lifter holding a plurality of substrates at the processing position, circulates the stripping solution through the circulation pipe to perform the stripping process, and then waits for the lifter. Raise to position. Next, after the crushing process is performed to operate the crushing means to make the fragments of the coating film present in the processing tank fine, the stripping solution in the processing tank is discharged through the discharge pipe. Since the fragments of the coating existing in the treatment tank are pulverized, it is easy to get on the liquid flow when the stripping liquid is discharged from the treatment tank. Therefore, even if a new stripping solution is supplied into the treatment tank, it is possible to prevent the coating strip from being mixed into the new stripping solution. As a result, it is possible to prevent cross-contamination where the fragments adhere to the substrate treated with a new stripping solution.

It is a block diagram which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic diagram which shows a peeling process. It is a schematic diagram which shows the state which raised the lifter to the standby position and started the crushing process. It is a schematic diagram which shows the state which performed the crushing process. It is a schematic diagram which shows the state which transferred the board | substrate from the lifter. It is a schematic diagram which shows the crushing process in the state where only the lifter was located in the processing position. It is a schematic diagram which shows the state which finished the crushing process. It is a schematic diagram which shows the state which is discharging the stripping solution. It is a figure which shows the modification of discharge piping. It is a figure which shows the modification of a collection tank. It is a figure which shows the other modification of a collection tank.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to an embodiment.

  The substrate processing apparatus according to the present embodiment performs a peeling process on the film deposited on the substrate W with a peeling liquid. In the following description, a photoresist film will be described as an example of the film, but the film in the present invention may be a film such as a passivation film, for example.

  The substrate processing apparatus includes a processing unit 1 for collectively performing a peeling process on a plurality of substrates W. The processing unit 1 stores a processing liquid such as pure water or a stripping liquid, and has a processing tank 3 having a size capable of accommodating a plurality of substrates W and a processing liquid overflowing from the upper edge of the processing tank 3 to the surroundings. An overflow tank 5 to be collected and a propagation tank 7 for storing propagation water serving as a propagation medium of ultrasonic vibration are provided.

  A lifter 9 is provided near the processing unit 1. The lifter 9 can be moved up and down over the “standby position” (the two-dot chain line in FIG. 1) that is above the processing tank 3 in the height direction and the “processing position” (the solid line in FIG. 1) that is inside the processing tank 3. It is configured. The lifter 9 includes a back plate 11 that extends along the side wall of the processing tank 3 and three support portions 13 that extend in the horizontal direction (the front side of the paper) at the bottom of the back plate 11. And.

  The treatment tank 3 has jet pipes 17 attached to both sides of the bottom. Each ejection pipe 17 ejects the supplied processing liquid toward the center of the bottom surface of the processing tank 3. Four bubble supply pipes 19 are provided between the ejection pipes 17 and on the bottom surface of the processing tank 3. Each bubble pipe 19 supplies bubbles from the bottom of the processing tank 3. The propagation tank 7 is provided with an ultrasonic vibration applying unit 21 that generates ultrasonic vibration at the center of the bottom surface on the outside. The ultrasonic vibration applying unit 21 generates ultrasonic vibrations of several MHZ. The treatment tank 3 is installed with its lower part immersed in the propagation water of the propagation tank 7, and the ultrasonic vibration generated by the ultrasonic vibration applying unit 21 is transmitted through the propagation water and the lower part of the treatment tank 3. 3 is propagated to the processing liquid inside.

  The ultrasonic vibration applying unit 21 described above corresponds to the “fracturing means” and the “ultrasonic vibration applying means” in the present invention. The bubble supply pipe 19 corresponds to the “crushing means” in the present invention.

  In the overflow tank 5, one end side of the circulation pipe 22 extends from the upper opening toward the bottom surface. The other end of the circulation pipe 22 is connected to the ejection pipe 17 in communication. The circulation pipe 22 is provided with a control valve 23, a circulation pump 25, a control valve 27, an in-line heater 29, and a circulation filter 31 in order from the overflow tank 5 side. The control valves 23 and 27 control the flow of the processing liquid in the circulation pipe 22. The circulation pump 25 pumps the processing liquid stored in the processing unit 1 to the circulation pipe 22. The inline heater 29 adjusts the temperature of the processing liquid flowing through the circulation pipe 22 to a predetermined temperature. The circulation filter 31 captures contaminants such as particles contained in the processing liquid flowing through the circulation pipe 22.

  In the circulation pipe 22, one end side of the discharge pipe 33 is connected in communication between the circulation pump 25 and the control valve 23. The other end side of the discharge pipe 33 extends toward the bottom surface of the processing tank 3. The discharge pipe 33 is for discharging the processing liquid stored in the processing tank 3 to the circulation pipe 22. The discharge pipe 33 includes a control valve 35 that controls the flow of the processing liquid.

  The circulation pipe 22 is connected to one end side of a discharge pipe 37 between the circulation pump 25 and the control valve 27. The discharge pipe 37 includes a control valve 39 that controls the flow of the processing liquid. The other end side of the discharge pipe 37 is connected to the upper opening of the recovery tank 41. In the collection tank 41, a mesh member 43 is disposed in the upper opening. The mesh member 43 has an area larger than the opening area of the discharge pipe 37 and captures contaminants such as fragments of the photoresist film contained in the processing liquid, but has a mesh size that allows the processing liquid to pass therethrough. Have. The collection tank 41 collects and temporarily stores the stripping solution used in the processing unit 1.

  Each bubble supply pipe 19 is connected to one end of the supply pipe 45 in communication. The other end side of the supply pipe 45 is connected in communication with a nitrogen gas supply source 47. The supply pipe 45 includes a control valve 49 that controls the flow of nitrogen gas. When the control valve 49 is opened, nitrogen gas is supplied from the nitrogen gas supply source 47 to the supply pipe 45, and nitrogen gas bubbles are supplied from the bubble supply pipe 19 to the treatment tank 3.

  Each unit described above is centrally controlled by a control unit 51 including a CPU and a memory. The control unit 51 operates the lifting / lowering operation of the lifter 9, the operation of the ultrasonic vibration applying unit 21, the operation of the circulation pump 25, the temperature adjustment operation of the in-line heater 29, and the opening / closing of the control valves 23, 27, 35, 39, 49. .

  The control unit 51 described above corresponds to the “control unit” in the present invention.

  Next, processing by the substrate processing apparatus having the above-described configuration will be described with reference to FIGS. 2 is a schematic diagram showing the peeling process, FIG. 3 is a schematic diagram showing a state where the lifter is raised to the standby position and the crushing process is started, and FIG. 4 is a state where the crushing process is performed. FIG. 5 is a schematic diagram showing a state where the substrate is transferred from the lifter, and FIG. 6 is a schematic diagram showing the crushing process in a state where only the lifter is located at the processing position. FIG. 7 is a schematic view showing a state after the crushing process is completed, and FIG. 8 is a schematic view showing a state where the stripping solution is discharged. Moreover, in each FIG. 2-8, the control part 51 is abbreviate | omitted and drawn.

  In the following description, a stripping solution is taken as an example of the processing solution, and a stripping process for stripping the photoresist film deposited on the substrate W will be described as an example. In the following description, it is assumed that the stripping liquid has already been supplied to the processing unit 1 and the circulation pipe 22 and the temperature adjustment to the processing temperature has been completed.

  The control unit 51 lowers the lifter 9 holding a plurality of substrates W from the standby position to the processing position. Then, the circulation pump 25 is operated to circulate the stripping solution from the overflow tank 5 to the processing tank 3 to perform the stripping process on the substrate W (FIG. 2). As a result, the photoresist film is peeled off from the plurality of substrates W at the processing position, and becomes fragments ff and floats in the stripping solution in the processing bath 3. The photoresist film debris ff is a part of the photoresist film debris ff in the treatment tank 3 except for the photoresist film debris ff discharged by the flow of the stripping solution from the processing tank 3 to the overflow tank 5. Float in the stripping solution.

  In addition, said process is corresponded to the "process which performs a peeling process" in this invention.

  The control unit 51 stops the circulation pump 25 and raises the lifter 9 to the standby position. At this time, in the stripping solution stored in the processing tank 3, fragments ff of the photoresist film stay.

  Note that the above-described process corresponds to the “process of raising to the standby position” in the present invention.

  Next, the control unit 51 opens the control valve 49 and operates the ultrasonic vibration applying unit 21. Thereby, bubbles of nitrogen gas are supplied into the stripping solution stored in the processing tank 3 and ultrasonic vibration is applied (FIG. 3). Then, the water flow when the bubbles rise, the physical force when the bubbles collide with the film fragments, the energy when the bubbles burst and the energy of ultrasonic vibration breaks the fragments ff of the photoresist film in the stripping solution. Then, it is decomposed into fine fragments sff of the photoresist film (FIG. 4).

  In addition, said process corresponds to the "process to perform a crushing process" in this invention.

  On the other hand, a piece of photoresist film ff may adhere to the back plate 11 or the holding portion 13 of the lifter 9 that has risen to the standby position after the peeling process.

  The controller 51 transfers the plurality of substrates W held by the lifter 9 to another transport mechanism (not shown) (FIG. 5), and then moves the lifter 9 to the processing position again (FIG. 6). . In the processing tank 3, the supply of bubbles and the application of ultrasonic vibration are continued and the crushing process remains, so that the crushing process is performed on the fragments ff of the photoresist film adhering to the lifter 9. Thereby, the fragment ff of the photoresist film adhering to the lifter 9 is made into a fine fragment sff (FIG. 7). Thereby, in the stripping solution of the processing tank 3, there are fine fragments sff of the photoresist film floating in the processing tank 3 and fine fragments sff of the photoresist film fragments ff adhering to the lifter 9. It will float.

  Next, the control unit 51 closes the control valve 49 to stop the supply of bubbles and also stops the application of ultrasonic vibration by the ultrasonic vibration applying unit 21. Then, the control unit 51 closes the control valves 23 and 27 and opens the control valves 35 and 39. Further, the control unit 51 operates the circulation pump 25 to remove the stripping solution containing fine fragments sff of the photoresist film stored in the processing tank 3 through the discharge pipe 33, the circulation pipe 22, and the discharge pipe 37. Through the recovery tank 41. At this time, the fine debris sff of the photoresist film in the stripping solution is captured by the mesh member 43, so that only the stripping solution is collected in the collection tank 41. The stripping liquid recovered in the recovery tank 41 is supplied again to the processing tank 3 for the stripping process or is disposed of by a disposal processing facility. Further, since fine fragments sff of the photoresist film accumulate on the mesh member 43 of the collection tank 41, it is only necessary to perform maintenance periodically to remove the fine fragments sff of the photoresist film from the mesh member 43.

  The above process corresponds to the “discharge process” in the present invention.

  According to the present embodiment, the control unit 51 positions the lifter 9 holding the plurality of substrates W at the processing position, circulates the stripping solution through the circulation pipe 22 and performs the stripping process, and then lifts the lifter 9. Raise to standby position. Next, a crushing process is performed in which bubbles are supplied from the bubble supply pipe 19 and the ultrasonic vibration application unit 21 is operated to apply ultrasonic vibrations to finely break the photoresist coating fragments ff present in the processing tank 3. After performing, the stripping solution in the processing tank 3 is discharged through the discharge pipes 33 and 37. Since the pieces ff of the photoresist film existing in the processing tank 3 are crushed into fine pieces sff, it is possible to easily ride the liquid flow in the discharge pipe 33 when the stripping liquid is discharged from the processing tank 3. Therefore, even if a new stripping solution is supplied into the processing tank 3, it is possible to prevent the fragments of the photoresist film from being mixed into the new stripping solution. As a result, it is possible to prevent cross-contamination where the fragments ff adhere to the substrate W to be treated with a new stripping solution.

  Further, since only the lifter 9 is positioned at the processing position of the processing tank 3 and the crushing process is performed, the fragments ff of the photoresist film adhering to the lifter 9 can be crushed. Therefore, fine fragments sff of the photoresist film can be discharged to the discharge pipe 33 by the flow of the stripping solution from the processing tank 3. As a result, cross-contamination caused by the fragments ff of the photoresist film adhering to the lifter 9 can be prevented.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the stripping solution discharged from the single discharge pipe 37 is collected in the collection tank 41 via the mesh member 43 that is fixedly arranged. The configuration is not limited. For example, you may employ | adopt a structure as shown in FIGS. FIG. 9 is a view showing a modification of the discharge pipe, and FIGS. 10 and 11 are views showing a modification of the recovery tank.

  First, FIG. 9 will be referred to. In this modification, the discharge pipe 37A is different from the above embodiment. Specifically, the discharge pipe 37A has an end on the collection tank 41 side branched into three discharge pipes. That is, the discharge pipe 37 </ b> A is branched into a first discharge pipe 61, a second discharge pipe 62, and a third discharge pipe 63, and each is arranged so as to face the mesh member 43 with a distance therebetween. . Each discharge pipe 61-63 is provided with control valves 65-67, respectively.

  In this modification, the control valves 65 to 67 are opened at the time of discharging the stripping liquid described above. Accordingly, since the stripping solution is discharged from the three discharge pipes 61 to 63, fine fragments sff of the photoresist film are dispersed and discharged at a plurality of locations of the mesh member 43. Therefore, the maintenance frequency of the mesh part 43 can be reduced.

  The discharge pipe 37A may be branched into two or may be branched into four or more.

  Reference is now made to FIG. This modification is different from the above-described configuration of the recovery tank 41A and the mesh member 43A. Specifically, the mesh member 43A is configured to be movable in the horizontal direction in the recovery tank 41A. The collection tank 41A includes a guide unit 69 that guides the mesh member 43A in the horizontal direction within the opening of the collection tank 41A, and a drive unit 71 that is connected to the edge of the mesh member 43A and advances and retracts the mesh member 43A in the horizontal direction. I have. The drive unit 71 includes an electric motor 73 and a ball screw 75. The drive unit 71 is operated by the control unit 51.

  The driving unit 71 described above corresponds to the “surface direction driving unit” in the present invention.

  According to this modification, the control unit 29 moves the mesh member 43A in the surface direction by the drive unit 71, so that fine fragments sff of the photoresist film can be dispersed without concentrating on one location of the mesh member 43A. . Therefore, the maintenance frequency of the mesh member 43A can be reduced.

  Please refer to FIG. In this modification, the collection tank 41B and the mesh member 43B are different from the configuration described above. Specifically, the recovery tank 41B includes a cleaning unit 75 at a position adjacent to the recovery tank 41B, and includes a partition member 77 at the boundary. The cleaning unit 75 cleans and removes the fine fragments sff of the photoresist film captured by the mesh member 43B.

  The mesh member 43B is formed in an endless shape. The mesh member 43B extends from the recovery tank 41B over the cleaning unit 75. A main driving pulley 79 is disposed on the upper inner peripheral surface of the mesh member 43B located in the cleaning unit 75. A driven pulley 81 that contacts the inner peripheral surface is disposed below the main driving pulley 79, and a driven pulley 83 that contacts the outer peripheral surface of the mesh member 43 </ b> B is disposed above the partition member 77. A driven pulley 85 is disposed on the discharge pipe 37 side at substantially the same height. Below the discharge pipe 37, the mesh member 43B is in a horizontal posture. With this configuration, when the main pulley 79 is driven, the mesh member 43B is rotated counterclockwise. The rotation of the main pulley 79 is operated by the control unit 51.

  The cleaning unit 75 includes a shower nozzle 87 on the inner peripheral side between the driven pulley 81 and the driven pulley 83. The shower nozzle 87 injects the cleaning liquid from the inner peripheral surface of the mesh member 43B toward the outer peripheral surface. The ejection of the cleaning liquid by the shower nozzle 87 is controlled by the control unit 51.

  The above-described main driving pulley 79 corresponds to “driving means” in the present invention, and the driven pulleys 81, 83, and 85 correspond to “guide members” in the present invention. The shower nozzle 87 corresponds to the “cleaning means” in the present invention.

  Since the controller 51 moves the mesh member 43B along the driven pulleys 81, 83, and 85 by the main pulley 79, the fine debris sff of the photoresist film discharged from the discharge pipe 37 can be dispersed. Therefore, the maintenance frequency of the mesh member 43B can be reduced.

  In addition, the cleaning liquid can be supplied from the inner surface toward the outer surface by the shower nozzle 87 in the cleaning unit 75 removed from the collection tank 41B. Therefore, the fine debris sff of the photoresist film deposited on the mesh member 43B can be removed, so that the maintenance frequency can be reduced.

  (2) In the above-described embodiment, the supply of bubbles and the application of ultrasonic vibration are performed simultaneously during the crushing process, but the present invention is not limited to such a configuration. For example, these timings may be shifted. Alternatively, only one of supply of bubbles and application of ultrasonic vibration may be used. In the case where only one of them is performed during the crushing process, the other configuration is unnecessary, so that the apparatus cost can be suppressed.

  (3) The crushing process described above may be performed every time a set of substrates W (one batch) supported by the lifter 9 is processed, or may be performed every time a predetermined number of sets of substrates are processed. Then, it may be performed every predetermined time or when the amount of the coating fragments in the treatment tank 3 is measured by an optical sensor or the like and exceeds a predetermined level.

  (4) In the above-described embodiment, when the crushing process is performed, first, the lifter 9 is raised to the standby position, the substrate W is carried out of the processing tank 3, and the crushing process is performed while the lifter 9 is raised. After that, after transferring the substrate W held by the lifter 9 to another transport mechanism (not shown), the lifter 9 was moved again to the processing position and the crushing process was continued. When the lifter 9 rises after the end of the peeling process, the substrate W held by the lifter 9 is immediately transferred to another transport mechanism (not shown), and the lifter 9 is immediately lowered to the processing position. May be opened, and the ultrasonic vibration applying unit 21 may be operated to start the crushing process.

W ... Substrate 1 ... Processing section 3 ... Processing tank 5 ... Overflow tank 7 ... Propagation tank 9 ... Lifter 19 ... Bubble supply pipe 21 ... Ultrasonic vibration applying section 22 ... Circulation pipe 25 ... Circulation pump 31 ... Circulation filter 33, 37 ... Drain pipe 41 ... Recovery tank 43 ... Mesh member

Claims (14)

In a substrate processing apparatus for performing a peeling process on a film attached to a substrate with a peeling liquid
A treatment tank for storing the stripping solution and immersing the substrate for processing,
A discharge pipe for discharging the stripping solution stored in the treatment tank;
An overflow tank for recovering the stripping solution overflowing from the treatment tank;
A circulation pipe for circulating the stripping solution of the overflow tank to the treatment tank;
A lifter that holds a plurality of substrates and can be raised and lowered over a processing position in the processing tank and a standby position above the processing tank;
Crushing means for finely crushing fragments of the coating existing in the treatment tank;
The lifter holding a plurality of substrates is positioned at a processing position, and a stripping solution is circulated through the circulation pipe to perform a stripping process, and then the lifter is raised to a standby position to bring the substrate out of the processing tank. Control means for discharging the stripping solution in the processing tank through the discharge pipe after carrying out the crushing process for operating the crushing means to make the fragments of the coating film present in the processing tank fine;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus is characterized in that the control means causes the crushing process to be performed by positioning the lifter at a processing position following the crushing process. The substrate processing apparatus according to claim 1 or 2,
The substrate processing apparatus, wherein the crushing means is an ultrasonic vibration applying means for applying ultrasonic vibration to the stripping solution in the processing tank. The substrate processing apparatus according to claim 1 or 2,
The said crushing means is a bubble supply means which is provided in the bottom part of the said processing tank, and supplies a bubble to the peeling liquid in the said processing tank, The substrate processing apparatus characterized by the above-mentioned. In the substrate processing apparatus according to claim 1,
A recovery tank at the discharge destination of the discharge pipe, and provided in the recovery tank, further comprising a mesh member having an area larger than the opening area of the discharge pipe,
The substrate processing apparatus according to claim 1, wherein the discharge pipe is arranged so that a side located on the collection tank side is branched into a plurality, and each of the discharge pipes is separated and faces the mesh member. In the substrate processing apparatus according to claim 1,
A recovery tank at a discharge destination of the discharge pipe, a mesh member having an area larger than an opening area of the discharge pipe, and a surface direction driving unit that moves the mesh member in a plane direction; Prepared,
The substrate processing apparatus, wherein the control means operates the surface direction driving means so that fragments of the coating are dispersed on the mesh member. In the substrate processing apparatus according to claim 1,
A collection tank at a discharge destination of the discharge pipe, a mesh member provided in the collection tank and having an area larger than an opening area of the discharge pipe and formed in an endless shape, and an inner peripheral surface side of the mesh member Drive means for driving the mesh member, and a guide member that contacts the mesh member and guides the movement of the mesh member,
The substrate processing apparatus, wherein the control means operates the driving means so that the fragments of the coating are dispersed on the mesh member. The substrate processing apparatus according to claim 7,
The net-like member is extended to a position where the end is removed from the collection tank,
A substrate processing apparatus, further comprising: a cleaning unit that is disposed on an inner peripheral side of the extended portion of the mesh member and injects a cleaning liquid from the inner surface to the outer surface of the mesh member. In a cleaning method for a substrate processing apparatus, in which a coating applied to a substrate is stripped with a stripping solution,
A lifter for holding the substrate is provided in the processing male while circulating the stripping solution through a circulation pipe over a processing tank capable of storing the stripping liquid and accommodating the substrate and an overflow tank for collecting the stripping liquid overflowing from the processing tank. In the process position, the process of performing the peeling process with the peeling liquid on the substrate,
After the peeling process is completed, raising the lifter to a standby position above the treatment tank;
A process of performing a crushing process to make fine pieces of the coating film present in the treatment tank;
Discharging the stripping solution in the treatment tank from the discharge pipe;
A method for cleaning a substrate processing apparatus, comprising: In the cleaning method of the substrate processing apparatus according to claim 9,
In the process of performing the crushing process, following the crushing process, the crushing process is performed again with only the lifter positioned at a processing position. In the washing | cleaning method of the substrate processing apparatus of Claim 9 or 10,
The process of performing the crushing process is performed by applying ultrasonic vibration to the stripping solution in the processing tank. In the washing | cleaning method of the substrate processing apparatus of Claim 9 or 10,
The process of performing the crushing process is performed by supplying air bubbles to the stripping solution from the bottom in the processing tank. In the washing | cleaning method of the substrate processing apparatus in any one of Claim 9 to 12,
The method of cleaning a substrate processing apparatus, wherein the discharging step is performed on a collection tank provided at a discharge destination of the discharge pipe and having a mesh member having a larger area than the opening area of the discharge pipe. . In the washing | cleaning method of the substrate processing apparatus in any one of Claim 9 to 12,
The discharging process is performed on a collection tank provided at a discharge destination of the discharge pipe and having a mesh member having an area larger than the opening area of the discharge pipe, and moving the mesh member in the surface direction. A cleaning method for a substrate processing apparatus, which is performed.

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