JP2006224193A5 - - Google Patents

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Publication number
JP2006224193A5
JP2006224193A5 JP2005037250A JP2005037250A JP2006224193A5 JP 2006224193 A5 JP2006224193 A5 JP 2006224193A5 JP 2005037250 A JP2005037250 A JP 2005037250A JP 2005037250 A JP2005037250 A JP 2005037250A JP 2006224193 A5 JP2006224193 A5 JP 2006224193A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005037250A
Other languages
Japanese (ja)
Other versions
JP2006224193A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005037250A priority Critical patent/JP2006224193A/ja
Priority claimed from JP2005037250A external-priority patent/JP2006224193A/ja
Publication of JP2006224193A publication Critical patent/JP2006224193A/ja
Publication of JP2006224193A5 publication Critical patent/JP2006224193A5/ja
Pending legal-status Critical Current

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JP2005037250A 2005-02-15 2005-02-15 電子装置及び電子装置の製造方法 Pending JP2006224193A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005037250A JP2006224193A (ja) 2005-02-15 2005-02-15 電子装置及び電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037250A JP2006224193A (ja) 2005-02-15 2005-02-15 電子装置及び電子装置の製造方法

Publications (2)

Publication Number Publication Date
JP2006224193A JP2006224193A (ja) 2006-08-31
JP2006224193A5 true JP2006224193A5 (de) 2008-03-27

Family

ID=36985995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005037250A Pending JP2006224193A (ja) 2005-02-15 2005-02-15 電子装置及び電子装置の製造方法

Country Status (1)

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JP (1) JP2006224193A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5493290B2 (ja) * 2008-05-07 2014-05-14 パナソニック株式会社 電子部品パッケージ
EP2850654B1 (de) * 2012-05-17 2016-10-26 Heptagon Micro Optics Pte. Ltd. Anordnung von wafer-stapeln
WO2019088764A1 (ko) 2017-11-03 2019-05-09 주식회사 엘지화학 플라스틱 기판의 제조방법 및 이에 의하여 제조된 플라스틱 기판

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149155A (ja) * 1985-09-02 1987-07-03 Hitachi Ltd 封止電子装置
JP2002343950A (ja) * 2001-05-15 2002-11-29 Canon Inc 固着方法、撮像モジュールの製造方法および撮像モジュール
JP2003078121A (ja) * 2001-09-03 2003-03-14 Canon Inc 固体撮像装置
JP2004063782A (ja) * 2002-07-29 2004-02-26 Fuji Photo Film Co Ltd 固体撮像装置およびその製造方法
JP3878897B2 (ja) * 2002-08-30 2007-02-07 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
US7701631B2 (en) * 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same

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