JP2006210687A - Substrate processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing device which can further improve throughput of substrate processing which is carried out by immersing a substrate in processing liquid stored in a processing tank. <P>SOLUTION: The substrate processing device changes processing liquid stored in the processing tank 10 from pure water to sulfuric acid, adjusts the liquid temperature of the changed sulfuric acid at a prescribed temperature. The device at first discharges pure water from a processing tank 10 and an outer tank 20 in liquid exchange processing. Then, it supplies sulfuric acid from a supply nozzle 40 to the outer tank 20. Subsequently, circulation processing for circulating sulfuric acid from the outer tank 20 to the processing tank 10, and starting timing of temperature adjustment processing of processing liquid are decided based on the storage amount of sulfuric acid 25 obtained from detection result of a pressure sensor 73. Consequently, temperature adjustment processing can be started before supply is finished from the supply nozzle 40, thus reducing the time required for liquid change processing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In the present invention, pure water and chemicals stored in a processing tank (hereinafter collectively referred to as “processing liquid”) are used for semiconductor substrates, glass substrates for liquid crystal display devices, glass substrates for photomasks, optical disk substrates, etc. The present invention relates to a substrate processing apparatus that performs a predetermined process by immersing a substrate (referred to as a “substrate”), and more particularly, to an improvement in a replacement procedure of a processing liquid stored in a processing tank.

  2. Description of the Related Art Conventionally, there has been known a substrate processing apparatus that performs predetermined processing by immersing a substrate in a processing solution stored in a processing tank (for example, Patent Document 1).

Japanese Patent No. 3530426

  Here, the liquid replacement process for exchanging the processing liquid stored in the substrate processing tank of the substrate processing apparatus of Patent Document 1 and adjusting the liquid temperature of the replaced processing liquid to a temperature suitable for the substrate processing is as follows. Performed in steps.

  That is, in the liquid exchange process, first, the processing liquid in the substrate processing tank and the overflow liquid recovery unit is discharged to the outside of the apparatus. Next, after the processing liquid is discharged from the substrate processing tank and the overflow liquid recovery unit, a new processing liquid at approximately room temperature is supplied to the substrate processing tank. When the processing liquid is supplied, the processing liquid overflowing from the substrate processing tank is recovered by the overflow liquid recovery unit. Subsequently, after the supply of a new processing liquid is completed, a process of controlling the temperature is started while circulating the processing liquid from the outer tank to the processing tank. Then, when a predetermined amount of the processing liquid is set to a predetermined temperature in the substrate processing tank, the liquid exchange processing is completed, and the substrate processing with the replaced processing liquid becomes possible for the substrate.

  However, in order to further improve the throughput of the substrate processing, the time required for this liquid exchange processing, for example, when a processing solution at about room temperature that has not been preheated is supplied to the substrate processing tank, The time until the temperature is adjusted to a predetermined liquid temperature is also a problem.

  Therefore, an object of the present invention is to provide a substrate processing apparatus that can further improve the throughput of substrate processing performed by immersing a substrate in a processing solution stored in a processing tank.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a substrate processing apparatus for processing a substrate, provided with a processing tank for storing a processing liquid and outside the processing tank, and overflowed from the processing tank. An outer tank for recovering the processing liquid, a pipe for connecting the outer tank and the processing tank in communication with each other, a temperature control unit that is provided in the pipe and controls the temperature of the processing liquid flowing through the pipe, and Circulating means that is provided in a pipe and supplies the processing liquid discharged from the outer tank through the pipe to the processing tank, a detection unit that detects a storage amount of the processing liquid stored in the outer tank, and the detection unit When the first storage amount of the processing liquid stored in the outer tank is detected, the processing liquid discharged from the outer tank through the pipe by the circulation means is supplied to the processing tank, and the detection unit The amount of storage of the second value greater than the first value is detected. If it, characterized in that it comprises a control unit for operating the temperature control unit.

  The invention according to claim 2 is the substrate processing apparatus according to claim 1, further comprising a processing liquid supply unit that supplies a processing liquid to the outer tank, and the detection unit is connected to the outside from the processing liquid supply unit. It is characterized by detecting the storage amount of the processing liquid supplied to the tank.

  Further, the invention of claim 3 is the substrate processing apparatus according to claim 1, further comprising a processing liquid supply part for supplying a processing liquid to the processing tank, wherein the detection part is transferred from the processing tank to the outer tank. It is characterized by detecting a storage amount of the overflowing processing liquid.

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to the second or third aspect, the processing liquid includes a first processing liquid and a second processing liquid, and is connected to the processing tank, A first discharge pipe that discharges the first processing liquid stored in the processing tank; and a second discharge pipe that is connected to the pipe and discharges the first processing liquid stored in the outer tank through the pipe. Further, the processing liquid supply unit supplies the second processing liquid after discharging the first processing liquid from the first discharge pipe and the second discharge pipe.

  According to the first to fourth aspects of the present invention, when the detection unit detects the storage amount of the first value of the processing liquid stored in the outer tub, it is discharged from the outer tub through the piping by the circulation means. When the treatment liquid is supplied to the treatment tank and the detection unit detects a storage amount of the second value larger than the first value, the temperature adjustment unit is operated, so before the supply of the treatment liquid is completed Since the processing liquid can be circulated by the circulating means and the temperature of the circulating processing liquid can be controlled, the throughput of the substrate processing can be improved.

  In particular, according to the invention described in claim 4, since the processing liquid supply unit supplies the second processing liquid after discharging the first processing liquid from the first discharge pipe and the second discharge pipe, The liquid exchange time from the processing liquid to the second processing liquid can be shortened.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First Embodiment>
<1.1. Configuration of substrate processing apparatus>
FIG. 1 is a diagram illustrating an example of a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a so-called “batch type” apparatus that performs substrate processing on a plurality of substrates at once. As shown in FIG. 1, the substrate processing apparatus 1 mainly includes a processing tank (inner tank) 10 and an outer tank 20 that is provided outside the processing tank 10 and collects the processing liquid overflowing from the processing tank 10. And pipes 51a, 61, 62 for supplying the processing liquid discharged from the outer tank 20 to the processing tank 10 again.

  The processing tank 10 stores the processing liquid 15 inside thereof, and the plurality of substrates W are immersed in the processing liquid 15, whereby processing such as cleaning and etching is performed on the plurality of substrates W. In addition, two processing liquid nozzles 17 extending in the Y-axis direction are disposed in the vicinity of the bottom inside the processing tank 10, and the processing liquid discharged from the outer tank 20 passes through the pipes 51 a, 61, 62. The liquid is supplied from the processing liquid nozzle 17 into the processing tank 10 as indicated by an arrow B.

  The elevating mechanism 30 is a mechanism for immersing the plurality of substrates W in the processing liquid stored in the processing tank 10, and mainly includes a lifter 31 and a holding rod 32 as shown in FIG. 1. The lifter 31 moves up and down in the Z-axis direction as indicated by an arrow A between the upper position of the processing tank 10 and the inside of the processing tank 10 by a drive mechanism (not shown). The lifter 31 is attached with three holding bars 32 extending along the Y-axis direction. Here, each of the three holding bars 32 is provided with a plurality of holding grooves (not shown), and the substrate W is held in an upright position by the outer edge portion of the board W being fitted into the corresponding holding groove. .

  Accordingly, the plurality of substrates W held by the three holding rods 32 are moved up and down by the lifter 31, and are delivered between the position where the plurality of substrates W are immersed in the processing liquid 15 and the transfer robot (not shown). It moves up and down between the upper position of the processing tank 10.

  As shown in FIG. 1, an outer tank 20 is provided on the outer upper part of the processing tank 10 so as to surround the upper end portion of the processing tank 10. Thereby, the processing liquid overflowing from the processing tank 10 is collected in the outer tank 20.

  Supply nozzles 40 and 45 are respectively disposed above the outer tub 20. As shown in FIG. 1, the supply nozzle 40 is connected to a sulfuric acid supply source 41 through a valve 42, a flow meter 43, and a pipe 44. The supply nozzle 45 is connected to a pure water supply source 46 through a valve 47, a flow meter 48, and a pipe 49. Therefore, the supply nozzles 40 and 45 supply sulfuric acid and pure water to the outer tank 20 from above the outer tank 20 by controlling the open / closed state of the valves 42 and 47, respectively.

  As shown in FIG. 1, the flow meters 43 and 48 are provided in pipes 44 and 49, respectively, and unit time of sulfuric acid supplied from the sulfuric acid supply source 41 and pure water supplied from the pure water supply source 46. Measure the flow rate per unit. Based on the detection values of the flow meters 43 and 48, the supply amounts of sulfuric acid and pure water supplied toward the outer tank 20 are obtained.

  In the outer tank 20, a gas discharge unit 23 that discharges nitrogen gas into the processing liquid stored in the outer tank 20 is provided. The gas discharge unit 23 is connected to a nitrogen gas supply source 71 via a pipe 74. The pipe 74 is provided with an adjustment unit 72 and a pressure sensor 73 from the upstream side. The adjustment unit 72 adjusts the flow rate of nitrogen gas supplied from the nitrogen gas supply source 71 per unit time to a constant value. The pressure sensor 73 detects the pressure of nitrogen gas flowing through the pipe 74.

  When detecting the storage amount of the processing liquid stored in the outer tub 20, first, the adjustment unit 72 sets the flow rate of the nitrogen gas supplied from the nitrogen gas supply source 71 to a constant value, and nitrogen passes through the pipe 74. Then, it is supplied from the gas discharge part 23 into the processing liquid stored in the outer tub 20. At this time, the pressure sensor 73 detects a pressure value corresponding to the storage amount of the processing liquid stored in the outer tub 20. This pressure value also increases as the storage amount of the treatment liquid increases.

  In addition, a pipe 51 a is connected to the inner region of the outer tub 20. The pipe 51a is provided with a valve 56a that can be opened and closed. The pipe 51 a is connected to the common pipe 61 at the communication position 82. Further, the communication position 82 is connected to an inner region of the processing tank 10 and is also connected to a first discharge pipe 51b provided with a valve 56b that can be opened and closed.

  The common pipe 61 is a pipe mainly for supplying the processing liquid 25 discharged from the outer tank 20 to the processing tank 10 side. As shown in FIG. 1, the common pipe 61 is provided with a pump 53, a valve 67, a temperature adjustment unit 63, and a filter 64 in order from the outer tank 20 side to the processing tank 10 side. The common pipe 61 is connected in communication with the two supply pipes 62 at a position 83. Further, each of the two supply pipes 62 is connected to the corresponding processing liquid nozzle 17.

  Therefore, when the pump 53 is driven, the valves 56a and 67 are opened, and the valves 56b and 57 are closed, so that the processing liquid 25 collected or supplied to the outer tub 20 is the pipe 51a and the common pipe. 61, the temperature adjusting unit 63, the supply pipe 62, and the processing liquid nozzle 17 are discharged in the direction of arrow B and supplied into the processing tank 10. Thus, the pump 53 circulates the processing liquid 25 stored in the outer tank 20 to the processing tank 10 via the pipe 51a, the common pipe 61, and the supply pipe 62.

  One end of the second discharge pipe 52 is connected to a position 81 sandwiched between the pump 53 and the valve 67 in the pipe 61. A drainage drain 59 is connected to the other end of the second discharge pipe 52. The second discharge pipe 52 is provided with a valve 57 that can be opened and closed. The drainage drain 59 is provided outside the substrate processing apparatus 1 and is used as a common facility in the semiconductor factory.

  When the processing liquid 25 stored in the outer tub 20 is discharged as waste liquid, the pump 53 is driven, the valves 56a and 57 are opened, and the valves 56b and 67 are closed. The processing liquid 25 collected in the outer tub 20 is discharged to the drainage drain 59 through the pipe 51a, the common pipe 61, and the second discharge pipe 52. Further, when the processing liquid 15 stored in the processing tank 10 is discharged as drainage, the pump 53 is driven, the valves 56b and 57 are opened, and the valves 56a and 67 are closed. Thus, the processing liquid 15 stored in the processing tank 10 is discharged to the drainage drain 59 via the first discharge pipe 51b, the common pipe 61, and the second discharge pipe 52. Further, when the valves 67 and 57 are opened and the valves 56a and 56b are closed, the processing liquid remaining in each of the pipe 51a, the common pipe 61, and the supply pipe 62 is discharged into the drainage drain 59 by its own weight. To be discharged.

  In addition, the temperature control part 63 provided in the common piping 61 heat-processes the process liquid which is flowing through the common pipe 61, and temperature-controls a process liquid. The filter 64 removes particles and the like contained in the processing liquid flowing through the common pipe 61.

  As shown in FIG. 1, the control unit 90 includes a memory 91 that stores programs, variables, and the like, and a CPU 92 that executes control according to the programs stored in the memory 91. Further, the valves 42, 47, 56 a, 56 b, 57, 67, the pump 53, the temperature adjustment unit 63, the adjustment unit 72, the pressure sensor 73, and the like that are controlled by the control unit 90 are electrically connected by a signal line 95. Has been.

  Therefore, the CPU 92 performs predetermined control of opening / closing of the valves 42, 47, 56a, 56b, 57, 67, drive control of the pump 53, the temperature adjusting unit 63, and the adjusting unit 72 in accordance with a program stored in the memory 91. Run at the timing.

<1.2. Liquid exchange procedure>
FIG. 2 is a timing chart for explaining the processing liquid replacement processing in the present embodiment. FIG. 3 is a diagram for explaining the start timing of the circulation process and the temperature adjustment process by the temperature adjustment unit 63. Here, the procedure of the liquid exchange process will be described with reference to FIGS. 1 to 3.

  In the following, a process for exchanging pure water (H2O) as the first treatment liquid stored in the treatment tank 10 at a time before time t1 with sulfuric acid (H2SO4) as the second treatment liquid will be described. In addition, it is assumed that the substrate W is moved up and down in the positive direction of the Z-axis by the lifting mechanism 30 and transferred to a transfer robot (not shown) at a time before time t1 in FIG. Furthermore, the liquid temperature of the sulfuric acid supplied to the outer tank 20 shall be substantially room temperature.

  First, at time t1, the operation of the pump 53 is started, the valves 56b and 57 are opened, and the valves 56a and 67 are closed. As a result, the pure water 15 stored in the processing tank 10 is discharged to the drainage drain 59 through the first discharge pipe 51b, the common pipe 61, and the second discharge pipe 52 by driving the pump 53 (processing tank). drain).

  Next, at time t2, the operating state of the pump 53 is maintained, the valve 56b is closed, and the valve 56a is opened. Thereby, the pure water 25 collected in the outer tub 20 is discharged to the drainage drain 59 via the pipe 51a, the common pipe 61, and the second discharge pipe 52 by driving the pump 53 (outer tub drain).

  Subsequently, at time t3, the operation of the pump 53 is stopped while the open state of the valve 57 is maintained, the valves 56a and 56b are closed, and the valve 67 is opened. Thereby, the pure water remaining in the supply pipe 62 is discharged to the drainage drain 59 through the common pipe 61 and the second discharge pipe 52 by the dead weight of the pure water (pipe drain).

  Subsequently, at time t4, at least the valves 56a and 56b are closed and the valve 42 is opened, so that sulfuric acid from the sulfuric acid supply source 41 is supplied from the supply nozzle 40 toward the outer tub 20 via the pipe 44. Then, sulfuric acid is stored in the outer tank 20. The sulfuric acid is supplied until time t7 when the supply of the amount necessary for substrate processing is completed.

  Subsequently, based on the detection value of the pressure sensor 73, the height Z of the sulfuric acid stored in the outer tub 20 becomes Z <b> 1 (see FIG. 3: the solid liquid level), and the sulfuric acid 25 stored in the outer tub 20. At a time t5 when it is determined that the storage amount V of the gas reaches V1, the valves 56a and 67 are opened while the valves 56b and 57 are kept closed, and the pump 53 is activated. As a result, the sulfuric acid 25 stored in the outer tank 20 is supplied from the processing liquid nozzle 17 into the processing tank 10 through the pipe 51a, the common pipe 61, and the two supply pipes 62. That is, at time t4, a circulation process for circulating the sulfuric acid 25 from the outer tank 20 to the treatment tank 10 is started.

  As shown in FIG. 2, the valve 42 is opened even after the circulation process is started, and the supply nozzle 40 continues to supply sulfuric acid to the outer tank 20. Therefore, the sulfuric acid discharged from the outer tank 20 is continuously supplied to the processing tank 10 and stored therein. Note that the storage amount V1 of the sulfuric acid 25, which is a trigger for starting the circulation process, is obtained in advance by experiments or the like.

  Subsequently, based on the detection value of the pressure sensor 73, the height Z of the sulfuric acid stored in the outer tub 20 becomes Z <b> 2 (see FIG. 3: dotted liquid level), and the sulfuric acid 25 stored in the outer tub 20. At the time t6 when it is determined that the stored amount V of V2 has reached V2, the operation of the temperature adjustment unit 63 is started while the sulfuric acid circulation process is being performed. Thereby, the temperature control process by the temperature control part 63 is started, and the sulfuric acid which distribute | circulates the common piping 61 is heated up.

  In this case, the valve 42 is opened even after the temperature adjustment process is started, and sulfuric acid is continuously supplied to the treatment tank 10. When the supply amount of sulfuric acid discharged from the outer tank 20 and supplied to the treatment tank 10 exceeds the maximum storage amount of the treatment tank 10, the excess sulfuric acid overflows from the treatment tank 10 and is collected by the outer tank 20. Is done.

  Thus, in the substrate processing apparatus 1 of this Embodiment, the process which temperature-controls while circulating a sulfuric acid can be started at the time t6 before the time t7 when the supply of sulfuric acid is completed. In addition, depending on the position where the temperature adjustment unit 63 is disposed, the temperature adjustment process can be started from a point in time before the sulfuric acid 25 starts to be stored in the treatment tank 10. Therefore, compared with the conventional substrate processing apparatus, the start timing of the temperature adjustment process can be advanced, and as a result, the time required for the liquid exchange process can be shortened. The reason why the temperature adjustment process is started after the circulation process is started is to prevent the temperature adjustment unit 63 from being damaged due to airing.

  Then, by continuing the circulation process, the liquid exchange process is completed at time t8 when the temperature of the sulfuric acid 15 stored in the processing tank 10 is raised to a temperature at which the substrate can be processed (for example, about 120 ° C.). To do.

  Note that the circulation process is continuously executed even after time t8 when the substrate process is performed after the liquid exchange process. Thereby, the sulfuric acid overflowing from the processing tank 10 is collected in the outer tank 20 and is discharged from the outer tank 20, and thermal energy is transmitted to the sulfuric acid from the temperature control unit 63 provided in the common pipe 61. Therefore, sulfuric acid continues to be maintained at a predetermined temperature.

<1.3. Advantages of the substrate processing apparatus of the first embodiment>
As described above, in the substrate processing apparatus 1 of the first embodiment, the sulfuric acid circulation process can be started at time t5, which is a time point before time t7 when the supply of sulfuric acid is completed, and at time t6. The temperature adjustment process of sulfuric acid flowing through the common pipe 61 can be started. Therefore, the start timing of the temperature adjustment process can be advanced, and as a result, the time required for the liquid exchange process can be shortened.

<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. FIG. 4 is a diagram showing an example of the configuration of the substrate processing apparatus 100 in the present embodiment. As shown in FIG. 4, the hardware configuration of the substrate processing apparatus 100 according to the present embodiment is such that sulfuric acid and pure water supply nozzles 140 and 145 perform processing as compared with the substrate processing apparatus 1 according to the first embodiment. Although different in that it is disposed above the tank 10, the other points are the same as those of the substrate processing apparatus 1 of the first embodiment. That is, in the second embodiment, the treatment liquid such as pure water and sulfuric acid is supplied to the treatment tank 10 instead of the outer tank 20. Therefore, the procedure of the liquid exchange process will be described below while paying attention to this difference.

  In the following description, the same components as those in the substrate processing apparatus 1 of the first embodiment are denoted by the same reference numerals. Since the components with the same reference numerals have already been described in the first embodiment, description thereof will be omitted in the present embodiment.

<2.1. Liquid exchange procedure>
FIG. 5 is a diagram for explaining the start timing of the temperature adjustment process by the circulation process and the temperature adjustment unit 63. Here, the procedure of the liquid exchange process will be described mainly with reference to FIGS. 2, 4, and 5.

  In addition, below, the process which replace | exchanges the pure water stored in the processing tank 10 for a time before the time t1 to a sulfuric acid is demonstrated. In addition, it is assumed that the substrate W is moved up and down in the positive direction of the Z-axis by the lifting mechanism 30 and transferred to a transfer robot (not shown) at a time before time t1 in FIG. Furthermore, the liquid temperature of the sulfuric acid supplied to the outer tank 20 shall be substantially room temperature.

  In the liquid exchange process, as in the first embodiment, the pure water 15 stored in the processing tank 10 is used from time t1 to t2, and the pure water 25 collected in the outer tank 20 is used from time t2 to t3. At time t3 to t4, a process of discharging the pure water remaining in the supply pipe 62 to the drainage drain 59 is performed (processing tank drain, outer tank drain, pipe drain).

  Subsequently, at time t <b> 4, sulfuric acid from the sulfuric acid supply source 41 is supplied from the supply nozzle 140 toward the processing tank 10 through the pipe 44, and sulfuric acid is stored in the processing tank 10. Then, the sulfuric acid is supplied until time t7 when the supply of the amount necessary for the substrate processing is completed.

  Here, when the supply amount of sulfuric acid supplied from the supply nozzle 140 exceeds the maximum storage amount of the processing tank 10, the excess sulfuric acid overflows from the processing tank 10 and is collected by the outer tank 20. Then, based on the detection value of the pressure sensor 73, the height Z of the sulfuric acid stored in the outer tub 20 becomes Z1 (see FIG. 5: solid line level), and the sulfuric acid 25 stored in the outer tub 20 At time t5 when it is determined that the storage amount V has reached V1, a circulation process for circulating the sulfuric acid 25 from the outer tank 20 to the processing tank 10 is started. Further, at time t6 when it is determined that the level Z of the sulfuric acid liquid level stored in the outer tub 20 becomes Z2 (see FIG. 3: dotted line liquid level) and the storage amount V becomes V2, the temperature adjustment unit 63 The temperature adjustment process is started.

  As described above, in the substrate processing apparatus 100 of the present embodiment, similar to the substrate processing apparatus 1 of the first embodiment, the temperature is increased while circulating sulfuric acid at a time before the time t7 when the supply of sulfuric acid is completed. Process can be started. Therefore, the start timing of the temperature adjustment process can be advanced, and as a result, the time required for the liquid exchange process can be shortened.

  Then, by continuing to perform the inner circulation process, the liquid exchange process is completed at time t8 when the temperature of the sulfuric acid 15 stored in the processing tank 10 is raised to a temperature at which the substrate can be processed.

  Note that the circulation process is continuously executed even after time t8 when the substrate process is performed after the liquid exchange process. As a result, the sulfuric acid overflowing from the treatment tank 10 is collected in the outer tank 20 and discharged from the outer tank 20, and receives heat energy from the temperature control unit 63 provided in the common pipe 61. Therefore, sulfuric acid continues to be maintained at a predetermined temperature.

<2.2. Advantages of Substrate Processing Apparatus According to Second Embodiment>
As described above, in the substrate processing apparatus 100 of the second embodiment, similarly to the substrate processing apparatus 1 of the first embodiment, at the time t5 that is a time before the time t7 when the supply of sulfuric acid is completed. The sulfuric acid circulation process is started, and at time t6, the temperature adjustment process of the sulfuric acid flowing through the common pipe 61 can be started. Therefore, the start timing of the temperature adjustment process can be advanced, and as a result, the time required for the liquid exchange process can be shortened.

<3. Modification>
While the embodiments of the present invention have been described above, the present invention is not limited to the above examples.

  (1) In the first and second embodiments, nitrogen gas is discharged from the gas discharge unit 23, but the present invention is not limited to this. For example, a gas that is chemically stable in relation to the treatment liquid 25 stored in the outer tank 20 may be used, and an inert gas such as argon or helium may be used.

  (2) In the first and second embodiments, the processing liquid stored in the outer tub 20 is detected by detecting the pressure in the pipe 74 that fluctuates by discharging nitrogen gas from the gas discharge unit 23. Although the 25 storage amount is detected, it is not limited to this. For example, the level of the processing liquid 25 may be detected by a level sensor.

  Here, since the inner shape of the outer tub 20 is known by design, the storage amount can be obtained from the height of the liquid surface of the processing liquid. That is, the storage amount of the processing liquid and the height of the liquid level of the processing liquid have a one-to-one correspondence. Therefore, the storage amount of the outer tub 20 may be calculated from the liquid level height of the processing liquid detected by the level sensor, and the start timing of the circulation process and the temperature adjustment process may be determined based on the calculation result.

  (3) In the first and second embodiments, the process of exchanging pure water stored in the treatment tank 10 with sulfuric acid at a time point before the time t1 has been described. However, the present invention is not limited to this. In addition, the present invention can be applied to a case where the treatment liquid stored in the treatment tank 10 is changed from sulfuric acid to pure water. Further, the treatment liquid before and after the exchange may be other than pure water and sulfuric acid, respectively. For example, phosphoric acid (H3PO4) may be supplied as a new treatment liquid.

  (4) Furthermore, in the first and second embodiments, the sulfuric acid introduced from the sulfuric acid supply source 41 is not preheated and its liquid temperature is approximately room temperature, but is not limited thereto. Instead, for example, sulfuric acid adjusted to a temperature higher than room temperature may be supplied to the outer tank 20. That is, in the present embodiment, the object of the present invention can be achieved when a processing solution having a temperature lower than a temperature suitable for substrate processing is supplied to the processing bath 10 or the outer bath 20.

It is a figure which shows an example of a structure of the substrate processing apparatus in the 1st Embodiment of this invention. It is a timing chart for demonstrating the liquid exchange process of the process liquid in 1st and 2nd embodiment. It is a figure for demonstrating the timing which starts the circulation process and temperature control process in 1st Embodiment. It is a figure which shows an example of a structure of the substrate processing apparatus in the 2nd Embodiment of this invention. It is a figure for demonstrating the timing which starts the circulation process and temperature control process in 1st Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,100 Substrate processing apparatus 10 Processing tank 17 Processing liquid nozzle 20 Outer tank 23 Gas discharge part 30 Elevating mechanism 40, 45, 140 Supply nozzle 41 Sulfuric acid supply source 42, 47, 56a, 56b, 57, 67 Valve 46 Pure water supply Source 51a Piping 51b 1st discharge pipe 52 2nd discharge pipe 53 Pump 61 Common piping 62 Supply pipe 63 Temperature control part 71 Nitrogen gas supply source 72 Adjustment part 73 Pressure sensor 90 Control part 91 Memory 92 CPU
95 Signal line W Substrate

Claims (4)

In a substrate processing apparatus for processing a substrate,
A treatment tank for storing the treatment liquid;
An outer tank provided on the outside of the processing tank for recovering the processing liquid overflowing from the processing tank;
Piping for communicating between the outer tank and the processing tank;
A temperature control unit that is provided in the pipe and controls the temperature of the processing liquid flowing through the pipe;
Circulation means provided in the pipe for supplying the processing liquid discharged from the outer tank through the pipe to the processing tank;
A detection unit for detecting a storage amount of the processing liquid stored in the outer tank;
When the detection unit detects a storage amount of the first value of the processing liquid stored in the outer tank, the processing liquid discharged from the outer tank through the pipe by the circulation unit is supplied to the processing tank, When the detection unit detects a storage amount of the second value greater than the first value, a control unit that operates the temperature adjustment unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
A treatment liquid supply unit for supplying the treatment liquid to the outer tank;
The substrate processing apparatus, wherein the detection unit detects a storage amount of the processing liquid supplied from the processing liquid supply unit to the outer tank. The substrate processing apparatus according to claim 1,
A treatment liquid supply unit for supplying a treatment liquid to the treatment tank;
The said detection part detects the storage amount of the process liquid which overflowed from the said process tank to the said outer tank, The substrate processing apparatus characterized by the above-mentioned. In the substrate processing apparatus of Claim 2 or Claim 3,
The treatment liquid includes a first treatment liquid and a second treatment liquid,
A first discharge pipe connected to the processing tank and discharging the first processing liquid stored in the processing tank;
A second discharge pipe connected to the pipe and discharging the first treatment liquid stored in the outer tank through the pipe;
The substrate processing apparatus, wherein the processing liquid supply unit supplies the second processing liquid after discharging the first processing liquid from the first discharge pipe and the second discharge pipe.

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