JP2006208634A - Method of manufacturing electrooptic apparatus, electrooptic apparatus, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately divide two large-sized substrates in manufacturing electrooptic apparatuses. <P>SOLUTION: A method of manufacturing a plurality of electrooptic apparatus includes a process of dividing at least two large sized substrates 101 and 102. When a so-called chip unit electrooptic apparatus is manufactured by sticking the large-sized substrates together and by dividing them, a scribe line 101a along a dividing line is formed on a sticking face of one substrate 101 and the scribe line 101a formed on one substrate 101 is aligned to an alignment mark 102a0 provided on a surface of the other substrate 102 and two substrates are stuck together. After sticking together, a scribe line 102a is formed on a face opposite from the sticking face of the other substrate 102, matching the scribe line 101a formed on one substrate 101, and by pressing the substrates along a dividing line from the face opposite from the sticking face of one substrate 101, two large-sized substrates are divided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device, and an electronic device, and more particularly to a method for manufacturing an electro-optical device, an electro-optical device, and an electronic device that are manufactured by cutting a bonded large substrate along a dividing line. .

Conventionally, in order to increase the mass productivity of an electro-optical device such as a liquid crystal device, there is a method in which two substrates in a large substrate state are bonded together and then divided into individual electro-optical device sizes. In the case of a liquid crystal device, for example, an element substrate in which a plurality of active elements such as thin film transistors (hereinafter referred to as TFTs) are arranged in a matrix and two large substrates, which are counter substrates on which counter electrodes are formed, are provided. There has been proposed a method of bonding and dividing into so-called chip units, that is, the sizes of individual liquid crystal devices by a scribe break method (see, for example, Patent Document 1).
JP 2001-147423 A

However, the above-described proposal does not disclose a specific method for accurately dividing two substrates in a large substrate state, and it has not been possible to perform highly accurate separation.
The present invention has been made in view of such problems, and a method for manufacturing an electro-optical device manufactured by accurately dividing two large substrates, an electro-optical device manufactured by the method, and An object is to provide electronic equipment.

An electro-optical device manufacturing method according to the present invention is a method of manufacturing a plurality of electro-optical devices including a step of dividing at least two large substrates, wherein the first substrate of the two substrates is formed. A step of forming a plurality of first cracks or grooves along a dividing line on a surface to be bonded to the second substrate, and a surface to be bonded to the first substrate of the second substrate. Forming a plurality of reference marks corresponding to the plurality of first cracks or grooves on the opposite surface, and a direction perpendicular to the respective substrate planes of the first and second substrates. The surface of the first substrate on which the plurality of first cracks or grooves are formed, so that the plurality of reference marks and the plurality of first cracks or grooves respectively match, Bonding to the first substrate of the second substrate A step of bonding the surface to be bonded, and when viewed from a direction orthogonal to the respective substrate planes of the first and second substrates, so as to coincide with the plurality of first cracks or grooves, Forming a plurality of second cracks or grooves on a surface of the second substrate on which the plurality of reference marks are formed; and forming the plurality of first cracks or grooves on the first substrate. Applying a predetermined pressing force along the plurality of first cracks or grooves from a surface on the opposite side to the formed surface.
According to such a configuration, two large substrates can be divided with high accuracy.

  Further, each of the plurality of reference marks includes two lines, and the first and second substrates have the two lines when viewed from a direction orthogonal to the respective substrate planes. It is desirable that the reference mark and the plurality of first cracks or grooves are bonded together so that the plurality of first cracks or grooves are interposed therebetween.

Further, each of the plurality of reference marks is composed of at least three marks, and the first and second substrates, when viewed from a direction orthogonal to the respective substrate planes, It is preferable that the reference marks and the plurality of first cracks or grooves are bonded to each other by making the plurality of first cracks or grooves between the two marks.
According to such a configuration, it is easy to align the two substrates.

The plurality of second cracks or grooves are preferably formed on a surface of the second substrate on which circuit elements are formed.
According to such a configuration, the circuit element can be protected at the time of disconnection by forming the scribe line on the surface where it is not desired to cause disconnection of the circuit.

The second substrate includes a plurality of third substrates constituting each electro-optical device, and the plurality of second cracks or grooves are formed by the third substrate of the second substrate. It is desirable to form between the third substrates on the mounted surface.
According to such a configuration, dust such as a glass piece generated by forming a crack or a groove does not enter between the third substrate and the second substrate.

Further, the receiving device is mounted on a receiving jig member having an opening corresponding to a region where the plurality of third substrates are arranged on the second substrate so that the plurality of third substrates enter the opening. And applying a predetermined pressing force along the plurality of first cracks or grooves from the surface of the first substrate opposite to the surface on which the plurality of first cracks or grooves are formed. It is desirable.
According to such a configuration, the two substrates can be accurately divided along the respective cracks or grooves.

The electro-optical device according to the present invention is an electro-optical device manufactured using the method for manufacturing the electro-optical device of the present invention.
With such a configuration, it is possible to realize an electro-optical device that is divided with high accuracy.

An electronic apparatus according to the present invention is an electronic apparatus using the electro-optical device of the present invention.
According to such a configuration, an electronic apparatus using the electro-optical device divided with high accuracy can be realized.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, the structure of a liquid crystal device as an electro-optical device will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the liquid crystal device is configured by enclosing a liquid crystal 50 between a liquid crystal device substrate 10 such as a TFT substrate and a counter substrate 20. FIG. 1 is a plan view of the liquid crystal device substrate 10 as viewed from the counter substrate 20 side together with the components formed thereon, and FIG. 2 shows the HH ′ of FIG. It is sectional drawing. The counter substrate 20 is provided with a second light-shielding film 42 as a light-shielding film (frame) that partitions the display area. The second light shielding film 42 is, for example, the same or different light shielding as the first light shielding film 23 for preventing light from entering the channel region, the source region, and the drain region of the TFT (not shown) from the counter substrate 20 side. It is made of a sexual material.

  A sealing material 41 that encloses the liquid crystal 50 in a region outside the second light shielding film 42 is formed between the liquid crystal device substrate 10 and the counter substrate 20. The sealing material 41 is disposed so as to substantially match the contour shape of the counter substrate 20, and fixes the liquid crystal device substrate 10 and the counter substrate 20 to each other. The sealing material 41 is missing in a part of one side of the liquid crystal device substrate 10, and a liquid crystal seal for sealing the liquid crystal 50 is placed in the gap between the bonded liquid crystal device substrate 10 and the counter substrate 20. An inlet 78 is formed. After the liquid crystal 50 is sealed from the liquid crystal sealing port 78, the liquid crystal sealing port 78 is sealed with a sealing material 79.

  A data line driving circuit 61 and a mounting terminal 62 are provided along one side of the liquid crystal device substrate 10 in a region outside the sealing material 41 of the liquid crystal device substrate 10, and along two sides adjacent to the one side. Thus, a scanning line driving circuit 63 is provided. On the remaining one side of the substrate 10 for the liquid crystal device, a plurality of wirings 64 are provided for connecting between the scanning line driving circuits 63 provided on both sides of the screen display area. Further, a conductive material 65 for electrically connecting the liquid crystal device substrate 10 and the counter substrate 20 is provided in at least one corner of the counter substrate 20.

  The liquid crystal device illustrated in FIGS. 1 and 2 described above is manufactured by a manufacturing process including a process of dividing at least two large substrates (also referred to as so-called mother substrates) that are bonded together. Below, the dividing method in the manufacturing method is demonstrated.

  FIG. 3 is a diagram for explaining a method of dividing the dust-proof glass and the element substrate after bonding them together in the state of a large substrate. FIG. 4 is a process diagram showing a part of the manufacturing process.

  First, as shown in FIG. 3A, a line indicating a predetermined position to be divided on one surface of a dust-proof glass (hereinafter referred to as a dust-proof substrate) 101, which is one large substrate, using a scribing device. A plurality of cracks are made by scribing with a diamond cutter along (hereinafter referred to as a parting line). More specifically, cracks along a plurality of cutting lines are caused to run on the dust-proof substrate 101 of the quartz substrate in accordance with each cutting line so as to cut the blade of the diamond cutter with a predetermined pressing force. It can be obtained by forming the scribe line 101a at the position of the dividing line (step S1). The size of the large substrate is the size of a wafer having a diameter of, for example, 200 mm or 300 mm if the substrate is a circular substrate. The thickness of the substrate is, for example, 1 mm to 1.2 mm. That is, the scribe line 101a is caused to run on the surface of the dust-proof substrate 101 while applying a predetermined pressing force so that the cutting edge of the diamond cutter has a predetermined cutting amount with respect to the surface of the substrate. It is formed by cracks on the substrate surface. In addition, since the dustproof substrate 101 which is a large substrate is divided into a so-called matrix shape, a plurality of scribe lines 101a are formed along the plurality of dividing lines in the vertical and horizontal directions, respectively.

  FIG. 5 is a partial cross-sectional view for explaining the scribe line. As shown in FIG. 5, when the cutting edge of the diamond cutter 201 is rotated on the substrate surface 101b from the surface toward the inside by a distance d1, only d2 is further provided inside the substrate surface 101b. Cracks come in. The cutting amount d1 is, for example, 10 μm. The crack amount d2 is, for example, in the range of 80 μm to 250 μm, and preferably 150 μm. The crack amount d2 can be controlled by setting the cutting amount d1 of the diamond cutter 201 in the scribing device, the pressing force against the substrate surface against the blade edge, the speed at which the substrate surface runs, and the like to predetermined values.

Further, in the results of experiments conducted by the present applicant, by setting the crack amount d2 to a value as described above, when scribing the substrate surface in order to form a scribe line, a glass is formed around the scribe line. Since cracks for separation can be formed without scattering the pieces, the defect rate of the liquid crystal device generated by winding a glass piece on the bonding surface is reduced to approximately 0 (zero)%. I was able to.
Subsequently, the dust-proof substrate 101 is cleaned (step S2).

  Further, as shown in FIG. 3B, the element substrate 102 which is the other large quartz substrate has a plurality of counter substrates 103 which are separately divided into liquid crystal device units in advance on the element substrate 102. It is mounted and pasted. Therefore, before the scribe line 102a is formed on the element substrate 102 as described later, since the counter substrate 103 is bonded, dust such as a glass piece generated by forming the scribe line 101a is opposed to the element substrate 101. It does not enter between the substrates 103.

  Further, the element substrate 102, which is the other large substrate, and the dust-proof substrate 101 are bonded together (step S3). At this time, as shown in FIG. 3C, the element substrate 102 with the dust-proof substrate 101 and the plurality of counter substrates 103 is opposite to the surface of the element substrate 102 to which the plurality of counter substrates 103 are attached. The surface and the surface on which the scribe line 101a of the dustproof substrate 101 is formed are bonded together.

  Here, in order to bond the element substrate 102 and the dustproof substrate 101 with high positional accuracy, an alignment mark 102a0, which is a reference mark as an alignment index corresponding to the scribe line 101a, is provided on the surface of the element substrate 102. It is attached. The alignment mark 102a0 is a mark for easily aligning the two substrates.

  FIG. 6 is a diagram for explaining alignment marks. Two lines are drawn between the counter substrates 103 on the element substrate 102 between the counter substrates 103. The two lines serving as the alignment mark 102a0 can be formed by a mask pattern, for example. When the element substrate 102 is viewed from a direction orthogonal to the surface thereof, the scribe line 101a and the alignment mark 102a0 are coincident with each other, that is, here, between the two lines of the alignment mark 102, the dustproof substrate The element substrate 102 and the dust-proof substrate 101 are bonded together so that the scribe line 101a formed on the surface of the 101 enters. FIG. 6 shows the positions of the alignment mark 102a0 and the scribe line 101a when two substrates are overlapped and viewed from a direction orthogonal to the surface. Two lines of the alignment mark 102 a 0 are drawn between the upper and lower sides and the left and right sides of the counter substrate 103.

  In order to allow the scribe line 101a to enter between the two lines of the alignment mark 102a0 drawn in the vertical and horizontal directions when the dustproof substrate 101 and the element substrate 102 are viewed from a direction orthogonal to the surface thereof. The surface of the element substrate 102 can be imaged by a camera equipped with a solid-state imaging element such as a CCD, and the two substrates of the element substrate 102 and the dustproof substrate 101 can be easily aligned using an image processing technique. . The interval between the two lines of the alignment mark is, for example, 100 μm.

  The two substrates, the element substrate 102 and the dust-proof substrate 101, which are accurately aligned, are put into a heating device such as an oven, and are subjected to a thermosetting process so as to be fixed by a thermosetting adhesive (step S4). ).

  In bonding, a thermosetting adhesive is applied to a predetermined position on the outer peripheral portion of the bonding surface of the element substrate 102 and the dustproof substrate 101, both of which are large substrates, for example, the peripheral portion, and the bonding is performed. In this state, heat is applied only to the part of the adhesive to perform temporary bonding, and then it is cured by being put in a heating device, whereby two large substrates are bonded.

  When the element substrate 102 and the dust-proof substrate 101 are bonded together, only one point of adhesive is dropped or applied to the middle of the dust-proof substrate 102 which is a large substrate, and the element substrate 102 is applied to the surface of the dust-proof substrate 101 where the adhesive is applied. It is also conceivable that the adhesive is stretched over the entire surface between the dust-proof substrate 102 and the element substrate 101 by pressing and the element substrate 102 and the dust-proof substrate 101 are bonded to each other.

  However, in such a method, since the adhesive applied to only one point is moved so as to be stretched from the middle of the two large substrates toward the periphery, a long distance is involved while entraining foreign matter on each large substrate. And the adhesive is applied over the entire surface between the dust-proof substrate 102 and the element substrate 101. As a result, foreign matter may be present in the display area of the liquid crystal device and the manufactured liquid crystal device may be defective.

  Therefore, in this embodiment, the place where the adhesive is dropped or applied is at least one of the bonding surfaces of the element substrate 102 and the dustproof substrate 101 when viewed from the direction orthogonal to the respective substrate planes, The locations of the plurality of electro-optical devices are set, and the amount of the adhesive to be dropped or applied is set to an amount necessary for each liquid crystal device. Next, the method for applying the adhesive will be described in detail with reference to FIG.

  FIG. 7 is a view for explaining a method of applying an adhesive when the two large substrates are bonded together by being put into a heating device and thermally cured. As shown in FIG. 7, the element substrate 102 on which the counter substrate 103 is mounted and the dust-proof substrate 101 to which the adhesive 109 is applied are bonded to the places where the individual liquid crystal devices are to be bonded.

  Specifically, the adhesive 109 is applied at multiple points on the surface of the dust-proof substrate 101 where the scribe lines 101a are formed. The place where the adhesive is applied is a place where the liquid crystal device between the scribe lines 101a is formed when viewed from the direction orthogonal to the surfaces of the two large substrates bonded together, This is the center of the area that becomes the display area of the liquid crystal device.

  In FIG. 7, since the counter substrate 103 is not mounted on the defective portion 103X of the element substrate 102, the adhesive 109 is applied to a place where the counter substrate 103 is not mounted, that is, a place where the liquid crystal device is not formed. Not applied. The inspection is performed after the element substrate 102 is manufactured, and the counter substrate 103 is not mounted where there is a defect. When the adhesive 109 is applied, the presence of the counter substrate 103 is checked, This is because the adhesive 109 is applied only to a place where the counter substrate 103 exists. Thereby, since the adhesive 109 is not applied to a place where the liquid crystal device is not formed, the waste of the adhesive 109 can be eliminated.

  In this way, when bonding the two large substrates together, if the adhesive 109 is applied at multiple points on the dustproof substrate 101, the adhesive 109 will not move over a long distance on the substrate. The foreign matter on the substrate, for example, the foreign matter at the time of forming the scribe line is not mixed in the adhesive, and as a result, the rate of foreign matter failure in the manufactured liquid crystal device is extremely reduced.

  Further, since the adhesive 109 is applied at multiple points on the dust-proof substrate 101, there is an effect that the thickness of the adhesive 109 at a plurality of locations between two large substrates is uniform.

  In the above example, the adhesive 109 is multi-pointed on the dust-proof substrate 101 in order to bond two large substrates, but it should be multi-pointed on the element substrate 102 instead of the dust-proof substrate 101. Or you can add a small amount to both.

  Next, as shown in FIG. 3D, the surface of the element substrate 102, which is a large substrate, is scribed with a diamond cutter using a scribing device so that a crack is formed in the dust-proof substrate 101. Cracks are made on the substrate surface of the substrate 102 (step S5).

  At this time, the scribe line 102a formed on the element substrate 102 overlaps and coincides with the scribe line 101a formed on the dustproof substrate 101 when the element substrate 102 is viewed from a direction orthogonal to the surface thereof. Formed. As a result, in the two bonded substrates, two substrate planes, that is, a scribe line on the dust-proof substrate 101 formed on the bonded surface and a scribe line on the element substrate 102 formed on the outer surface. By setting the amount of deviation in the direction perpendicular to 0 to zero (zero), cracks are generated in a direction substantially perpendicular to the two substrate planes from each scribe line when dividing by a break bar as will be described later. Can be divided well.

  Accordingly, by forming the crack amount d2 that is the depth of the crack as described above on the substrate surface, the two substrates bonded together can accurately divide the outer diameter of each liquid crystal device. Can be accurately assembled to an electronic device that uses.

  In addition, when the scribe line 102a on the element substrate 102 is divided by forming a scribe line having a depth (d2) in the above-described range on the surface on which various circuits of the element substrate 102 are formed. Circuit elements formed on the surface of 102 that do not want to cause disconnection or the like, such as driver circuits, can be protected from being disconnected.

  Then, the bonded element substrate 102 and dust-proof substrate 101 are reversed so that the surface of the element substrate 102 on which the plurality of counter substrates 103 are provided is inserted into the opening of the receiving jig 104. Place on the tool 104 and break (step S6). Next, step S6 will be described more specifically.

  FIG. 8 is a schematic perspective view for explaining the receiving jig 104 on which the bonded element substrate 102 and dust-proof substrate 101 are placed. The receiving jig 104 is a plate-like member having openings 104 a corresponding to the arrangement shape of the plurality of counter substrates 103 on the element substrate 102. The shape of the opening 104a formed on the surface of the receiving jig 104a is a one-stroke drawing of the arrangement shape of the plurality of counter substrates 103, specifically the outermost edge portions of the plurality of counter substrates 103 on the element substrate 102. It is a shape CL made so as to enclose it.

  The receiving jig 104A may be a receiving jig 104A having a circular shape as shown in FIG. FIG. 9 is a schematic perspective view for explaining a state in which the element substrate 102 and the dust-proof substrate 101 bonded to the receiving jig 104A according to the modification are placed.

Therefore, as shown in FIG. 3E, the receiving jig 104 is placed on the flat stage 105, and the surface on which the plurality of counter substrates 103 are placed is placed on the opening 104a side of the jig 104. The element substrate 102 and the dust-proof substrate 101 that are bonded together are received and placed on the jig 104 so that the plurality of counter substrates 103 enter inside the opening 104a. The plate thickness Td of the receiving jig 104 is substantially the same as the thickness Tc of each counter substrate 103 placed on the element substrate 102. As a result, the plurality of counter substrates 103 are supported on the stage 105, and the portion of the element substrate 102 around the plurality of counter substrates 103 is supported by the receiving jig 104. It can be divided well.
Note that the receiving jig 104 does not have the opening 104 a but may have a recess whose depth is substantially the same as the thickness Tc of the counter substrate 103.

  In this state, a predetermined pressing force is applied from the surface of the dust-proof substrate 101 opposite to the surface on which the scribe line 101a is formed by applying the break bar 106 of the break device along the scribe line 101a. As a result, as indicated by an arrow F in FIG. 3E, a predetermined pressing force is applied to the surface of the dust-proof substrate 101 by the break bar 106, so that the dust-proof substrate 101 and the element substrate 102 are connected to the scribe line 101a, It is divided along 102a. Similarly, a predetermined pressing force is applied against the break bar 106 along all the scribe lines necessary for cutting out the individual liquid crystal devices. In this way, the two substrates bonded together in the state of a large substrate are divided to manufacture liquid crystal devices of individual sizes.

Since a plurality of scribe lines 101a and 102a are formed in the vertical direction and the horizontal direction, the break bar 106 is pressed while being sequentially applied from one end in the vertical direction, and then pressed while being sequentially applied from one end in the horizontal direction. Thus, the two substrates bonded together in the state of a large substrate can be divided at the same time.
Furthermore, the separation of the two substrates may be performed manually.

  Next, a method for forming a scribe line on a substrate using a scribe device will be described. FIG. 10 is a configuration diagram showing the configuration of a scribe system for forming a scribe line. The scribe system is connected to a scribe device 111 having a diamond cutter, a camera 112 having a CCD or the like as an image pickup means for picking up an image of a substrate, and a scribe device 111 and a camera 112 as control means for controlling each of them. The controller 113. FIG. 11 is a flowchart illustrating an example of a control flow in the controller 113.

  In order to form the scribe lines 101a on the surface of the dust-proof substrate 101, a camera 112 captures a reference position mark formed in advance on the surface of the dust-proof substrate 101, and sets each of the scribe lines 101a as a reference position. The controller 113 controls the scribe device 111 so as to form the predetermined position. The reference position mark is a mark formed in advance as a mark indicating the reference position of the substrate with respect to the scribing apparatus when performing scribing, for example, at the corner of the substrate.

  Specifically, for example, the controller 113 checks the reference position mark based on the image data of the camera 112 (step S11). First, the variable i is set to 1 (step S12).

  The controller 113 scribes the scribing device 111 by moving the diamond cutter to the position where the first scribe line is formed because the i-th and i is 1 at first (step S13). . At this time, two scribe lines are formed.

  When the formation of the first scribe line is completed, the controller 113 determines whether or not the formed scribe line is the last scribe line (step S14). If the formed scribe line is not the last scribe line, NO is determined in the step S14, the process proceeds to a step S15, the variable i is set to (i + 1), and the process jumps to the process of the step S13.

  Next, in step S13, the second scribe line is formed, and then in step S14, it is determined whether or not the last scribe line is completed. If the last scribe line formation process has not been completed, the process jumps to step S15, and the above-described process is repeated until the last scribe line formation process is completed.

When the last scribe line forming process is completed, the controller 113 determines YES in step S14 and ends the process.
The processing of FIG. 11 is performed in each of the top, bottom, left and right directions of the surface of the dustproof substrate 101.

  In step S13, the element substrate 102 coincides with the scribe line 101a already formed on the surface of the dust-proof substrate 101 when viewed from the direction orthogonal to the substrate surface in the bonded state as described above. The scribing is performed while being controlled as described above.

In the above example, the depth of the scribe line formed on the dustproof substrate 101 and the element substrate 102 may not be the same, and may be different from each other as long as they are in the range of 80 μm to 250 μm. If it is the depth of such a range, as above-mentioned, it is also possible to cut by hand.
As described above, a plurality of electro-optical devices can be manufactured with high accuracy by dividing two bonded large substrates.

  In addition, although the above example is a case where a dust-proof board | substrate and an element board | substrate are bonded together as a large sized board | substrate, this invention is bonding of an element board | substrate and an opposing board | substrate, bonding of an opposing board | substrate and a dust-proof board | substrate, etc. The present invention can also be applied to a combination of two large substrates.

  Furthermore, although the alignment mark is formed on the substrate surface with the solid line as described above, it may be a dotted line, a one-dot chain line or the like instead of the solid line, and may be a mark as shown in FIG. FIG. 12 is a diagram showing a modification of the alignment mark. As shown in FIG. 12, when the substrate is viewed from a direction orthogonal to the substrate surface, marks 102a1, 102a2, and 102a3 are formed of four marks that indicate positions where scribe lines formed on each of the two substrates intersect. , 102a4. The four marks are provided at the intersections of the dividing lines, and are formed in the vertical and horizontal directions to indicate the widths at which the scribe lines are formed in the vertical and horizontal directions.

  Specifically, in the case of FIG. 12, two marks 102a1 and 102a2 or marks 102a3 and 102a4 arranged in the row direction are alignment marks in the vertical direction, and the scribe line 101a is inserted between the two marks. Alignment is performed. Two marks 102a1 and 102a4 or marks 102a2 and 102a3 arranged in the column direction are alignment marks in the left-right direction, and alignment is performed so that the scribe line 101a is inserted between the two marks.

  In the above example, four marks are used. However, at least three marks may be provided at the intersection of the dividing lines. There may be two marks 102a1 and 102a2 or marks 102a3 and 102a4 in the row direction, and two marks 102a1 and 102a4 or marks 102a2 and 102a3 in the column direction.

  That is, even when the alignment mark is a mark composed of at least three marks, when the two substrates are viewed from a direction orthogonal to the respective substrate planes, the scribe line is located between at least two of the three marks. 101a can be put together with high accuracy.

  Moreover, although the case where the formation of the scribe line by a diamond cutter was utilized was demonstrated in the above example, you may use the groove | channel of predetermined depth instead of a scribe line. For example, the groove can be formed by a dicing apparatus in accordance with the line to be cut.

  As described above, according to the method of manufacturing the electro-optical device according to the above-described embodiment, when the so-called chip-unit electro-optical device is manufactured by bonding and dividing a large substrate, the disconnection line as described above. A crack or groove is formed on the bonding surface of one substrate, and a crack or groove formed on one substrate is bonded to the reference mark provided on the surface of the other substrate, and bonded together Later, a crack or groove is formed on the surface opposite to the bonding surface of the other substrate to match the crack or groove formed on one substrate, and from the surface opposite to the bonding surface of one substrate The two large substrates are divided by pressing along the dividing line. By doing so, the two large substrates bonded together can be divided with high accuracy, so that the yield and productivity of the manufacturing process can be improved.

  Next, a projection type color display device as an example of an electronic apparatus using a liquid crystal device, which is an electro-optical device manufactured using the electro-optical device manufacturing method described in detail above, as a light valve, and the liquid crystal device as a display unit An overall configuration, particularly an optical configuration, of an embodiment of a mobile phone as an example of an electronic device used as an electronic device will be described. FIG. 13 is an explanatory diagram of a projection type color display device. FIG. 14 is a perspective view showing a configuration of a mobile phone. These electronic devices are electronic devices using an electro-optical device that is divided with high accuracy.

  In FIG. 13, a liquid crystal projector 1100, which is an example of a projection type color display device according to the present embodiment, prepares three liquid crystal modules including a liquid crystal device having a drive circuit mounted on a TFT array substrate, each of which is a light valve for RGB. It is configured as a projector used as 100R, 100G, and 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. The light is divided into B and led to the light valves 100R, 100G and 100B corresponding to the respective colors. In particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114.

  In FIG. 14, a mobile phone 4200 according to the present embodiment includes a plurality of operation buttons 4202, an earpiece 4204, a mouthpiece 4206, and a display unit 4100 provided with a liquid crystal device.

  The electro-optical device of the present invention can be applied not only to an active matrix liquid crystal panel (for example, TFT (thin film transistor) or TFD (thin film diode)) but also to a passive matrix liquid crystal display panel. It is. In addition to liquid crystal display panels, electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission (such as Field Emission Display and Surface-Conduction Electron-Emitter Display), DLP ( The present invention can be similarly applied to various electro-optical devices such as Digital Light Processing (aka DMD: Digital Micromirror Device).

The top view seen from the counter substrate side of the liquid crystal device which concerns on this Embodiment. It is HH 'sectional drawing of FIG. The figure for demonstrating the method of parting with the dust-proof glass and element substrate which concern on this Embodiment. Process drawing which shows the example of the one part flow of the manufacturing process which concerns on this Embodiment. The fragmentary sectional view for demonstrating the scribe line which concerns on this Embodiment. The figure for demonstrating the alignment mark which concerns on this Embodiment. The figure for demonstrating the example of the coating method of the adhesive agent which concerns on this Embodiment. The typical perspective view for demonstrating a receiving jig. The typical perspective view for demonstrating the receiving jig which concerns on a modification is aimed at. The block diagram which shows the structure of the scribe system for forming a scribe line. The flowchart which shows the example of the flow of control in a controller. The figure which shows the modification of an alignment mark. Explanatory drawing of a projection type color display apparatus. The perspective view which shows the structure of a mobile telephone.

Explanation of symbols

  101a, 102a scribe line, 201 diamond cutter, 102a0, 102a1, 102a2, 102a3, 102a4 alignment mark, 104, 104A

Claims (9)

A method of manufacturing a plurality of electro-optical devices including a step of dividing at least two large substrates,
Forming a plurality of first cracks or grooves along a dividing line on a surface of the first substrate of the two substrates to be bonded to the second substrate;
Forming a plurality of reference marks corresponding to the plurality of first cracks or grooves on a surface of the second substrate opposite to a surface to be bonded to the first substrate;
The plurality of reference marks and the plurality of first cracks or grooves match each other when viewed from a direction orthogonal to the respective substrate planes of the first and second substrates. Bonding a surface of the first substrate on which the plurality of first cracks or grooves are formed and a surface of the second substrate to be bonded to the first substrate;
A plurality of second cracks or grooves are formed so as to coincide with the plurality of first cracks or grooves when viewed from a direction orthogonal to the respective substrate planes of the first and second substrates. Forming on the surface of the second substrate on which the plurality of reference marks are formed;
Applying a predetermined pressing force along the plurality of first cracks or grooves from the surface of the first substrate opposite to the surface on which the plurality of first cracks or grooves are formed;
A method for manufacturing an electro-optical device. Each of the plurality of reference marks is composed of two lines,
The first and second substrates have the plurality of first cracks or grooves between the two lines when viewed from a direction orthogonal to the respective substrate planes. The method of manufacturing the electro-optical device according to claim 1, wherein the reference mark and the plurality of first cracks or grooves are bonded to each other. Each of the plurality of reference marks includes at least three marks,
The first and second substrates have the plurality of first cracks or grooves between two of the at least three marks when viewed from a direction perpendicular to the respective substrate planes. The method of manufacturing an electro-optical device according to claim 1, wherein the reference mark and the plurality of first cracks or grooves are bonded to each other.   4. The electro-optical device according to claim 1, wherein the plurality of second cracks or grooves are formed on a surface of the second substrate on which circuit elements are formed. 5. How to manufacture. The second substrate includes a plurality of third substrates constituting each electro-optical device,
The plurality of second cracks or grooves are formed between the third substrates on a surface of the second substrate on which the third substrate is mounted. 5. A method for manufacturing the electro-optical device according to any one of 4 above.   The plurality of third substrates are placed on a receiving jig member having an opening corresponding to a region where the plurality of third substrates are arranged on the second substrate so that the plurality of third substrates enter the opening. Applying a predetermined pressing force along the plurality of first cracks or grooves from the surface of the first substrate opposite to the surface on which the plurality of first cracks or grooves are formed. The method of manufacturing the electro-optical device according to claim 5.   The step of bonding the first substrate and the second substrate is performed when the bonding surface of the first substrate and the second substrate is viewed from a direction orthogonal to the respective substrate planes. The method for manufacturing an electro-optical device according to claim 1, further comprising a step of applying an adhesive to each of at least one of the plurality of electro-optical devices.   An electro-optical device manufactured using the method for manufacturing the electro-optical device according to claim 1. An electronic apparatus using the electro-optical device according to claim 8.

Images