JP2006202742A - Organic el display device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL display device which prevents scratches from being made on an inorganic solid layer and is improved in a yield of the organic EL display, and hardly has a display defect with the passage of time. <P>SOLUTION: The organic EL element substrate 10 comprises a color filter 102, an overcoat layer 103, and an inorganic solid layer 104 on a substrate 101, a first electrode 105, an organic film 107, a second electrode 108, and an insulating layer 106 provided so as to cover the end part on the adjacent first electrode 105 side and between the adjoining electrodes on the inorganic solid layer 104, and a protection layer 109 which is provided on the inorganic solid layer 104 in the region where the first electrode 105 is not installed, and is provided separated from the first electrode 105. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an organic electroluminescence (hereinafter abbreviated as organic EL) display device and a method for manufacturing the same.

  An organic EL element substrate used for an organic EL display includes a thin-film organic compound layer sandwiched between electrodes. An organic compound emits light by passing a current between the electrodes. One of the methods for full-coloring this organic EL display is a color filter method. Such an organic EL display device is described in Patent Document 1, for example.

  The full color method of an organic EL display using a color filter method realizes full color by combining an organic EL element that emits white light with a color filter layer of three primary colors. FIG. 9 is a diagram showing a part of a cross section of a conventional organic EL display device 2. As shown in FIG. 9, in the conventional organic EL display device 2, a color filter 202 made of RGB (red, green, blue) is formed on a glass substrate 201, and a transparent resin such as an acrylic resin is formed thereon. Overcoat layer 203 is formed of resin.

  Further thereon, an inorganic solid layer 204 is formed in order to prevent a trace amount of water, solvent, and organic compound contained in the color filter 202 and the overcoat layer 203 from deteriorating the organic EL element. A transparent conductive film 205 as an anode is patterned thereon and covered with an opening insulating layer 206. An organic film 207 that emits white light is deposited thereon, and a cathode 208 is formed thereon. When a current is passed between the transparent conductive film 205 and the cathode 208, the organic film 207 emits white light. White light emitted from the organic film 207 passes through the transparent conductive film 205 and enters the color filter 202. The lower layer of the organic film 207, that is, the transparent conductive film 205, the inorganic solid layer 204, the overcoat layer 203, and the glass substrate 201 are made of a transparent material. The white light is incident on the color filter 202 made of RGB, and is color-coded for each of RGB to realize full color. In addition, the organic EL display device has an auxiliary wiring (not shown) connected to the cathode 208.

The inorganic solid layer 204 protects the organic EL element from moisture and organic compounds as described above, and plays a very important role in affecting the yield. If the inorganic solid layer 204 is incomplete, display characteristics are changed. For example, there is a known problem that the non-light emitting portion R as shown in FIG. The inorganic solid layer 204 plays a very important role in the organic EL display device. Here, what is indicated by a dotted line in FIG. 10 is the transparent conductive film 205 in FIG. 9, and a partition wall 111 for forming a cathode is provided so as to be orthogonal to the transparent conductive film 205.
JP 09-212106 A

  The conventional organic EL display device described above has the following problems. In the manufacturing process of the organic EL display device described above, in order to remove foreign substances attached to the substrate, cleaning is performed mainly after patterning the transparent conductive film 205 of the anode and an auxiliary wiring metal film (not shown). Cleaning is performed by supplying high-pressure ultrapure water and using a high-density brush or the like. At this time, the inorganic solid layer 204 exposed on the cleaning surface may be damaged. If the inorganic solid layer 204 is damaged by the high-density brush, the very important role of preventing the deterioration of the organic EL element due to the moisture described above is lost. This problem is particularly noticeable when the inorganic solid layer is formed thin. The above-mentioned problem also exists in a CCM (color changing material) type organic EL display.

  The present invention has been made to solve such a problem, and prevents the inorganic solid layer from being damaged in the cleaning process during the manufacturing process of the organic EL display device, thereby improving the yield of the organic EL display and the aging. An object of the present invention is to provide an organic EL display device in which typical display defects are unlikely to occur.

  The organic EL display device according to the first aspect of the present invention has a colored organic layer on a substrate, an overcoat layer covering the colored organic layer, and an inorganic solid layer provided on the overcoat layer. And a plurality of first electrodes, an organic light emitting layer, and a plurality of second electrodes on the inorganic solid layer, wherein the first electrode and the second electrode overlap each other. The region of the organic light-emitting layer that is in contact with the first electrode and the second electrode is a light-emitting portion, the adjacent electrode-side end portions of the plurality of first electrodes, and between the adjacent first electrodes And an insulating layer provided so as to cover the first electrode, and a protective layer provided on the inorganic solid layer in a region where the first electrode is not provided and provided separately from the first electrode. is there. With such a configuration, it is possible to provide an organic EL display device in which the protective layer protects the inorganic solid layer and display defects over time hardly occur.

  The organic EL display device according to the second aspect of the present invention is the organic EL display device described above, wherein the protective layer is formed outside the display region. Thereby, in the cleaning process, the region where the inorganic solid layer is exposed outside the display area is protected by the protective layer, so that the foreign matter caused by these damages causes display defects without being damaged by the cleaning process, It is possible to prevent moisture, solvent, etc. from diffusing into the display area and causing display defects.

  An organic EL display device according to a third aspect of the present invention is the above-described organic EL display device, wherein the protective layer has conductivity and is insulated from the first electrode. Accordingly, the first electrode and the protective layer can be formed in the same layer with the same material.

  An organic EL display device according to a fourth aspect of the present invention is the above-described organic EL display device, wherein the protective layer extends from the inside to the outside of the range where the overcoat layer is provided. . Thereby, the site | part which is easy to receive the damage by a washing | cleaning process can be protected suitably.

  An organic EL display device according to a fifth aspect of the present invention is the organic EL display device described above, wherein the protective layer and the first electrode are the same process layer. Thereby, the number of manufacturing steps can be reduced.

  An organic EL display device according to a sixth aspect of the present invention is the organic EL display device described above, wherein white light is emitted by the organic light emitting layer, and the colored organic layer is an R, G, B color filter. is there.

  An organic EL display device according to a seventh aspect of the present invention is the above-described organic EL display device, wherein the organic EL display device includes at least one color conversion layer between the organic light emitting layer and the colored organic layer. The layer converts light emitted from the organic light emitting layer into light of a different color.

  The organic EL display device manufacturing method according to the eighth aspect of the present invention includes a step of forming a colored organic layer on a substrate, a step of forming an overcoat layer so as to cover the colored organic layer, and the overcoat layer Forming an inorganic solid layer on the inorganic solid layer; forming a plurality of first electrodes on the inorganic solid layer; and on the inorganic solid layer, outside the plurality of first electrodes. Forming a protective layer on the first electrode, cleaning the substrate from above the first electrode and the protective layer, forming an opening insulating layer on the plurality of first electrodes, and organic light emission Forming a layer, and forming a second electrode on the organic light emitting layer provided on the first electrode. With such a configuration, an organic EL display device can be provided in which the protective layer protects the inorganic solid layer, display defects with time do not easily occur, and cleaning damage due to the cleaning process is suppressed.

  A method for manufacturing an organic EL display device according to a ninth aspect of the present invention is the above-described method for manufacturing an organic EL display device, wherein the first electrode and the protective layer are formed in the same step. Thereby, an organic EL display device excellent in productivity and cost can be provided.

  A method for manufacturing an organic EL display device according to a tenth aspect of the present invention further includes a step of forming a partition for separating the second electrodes from each other in the method for manufacturing an organic EL display device described above. is there. Thereby, a 2nd electrode can be formed suitably.

  According to the present invention, it is possible to provide an organic EL display device in which the yield of an organic EL display is improved and display defects with time are less likely to occur, and a method for manufacturing the same.

  Hereinafter, embodiments to which the present invention can be applied will be described. The following description explains the embodiment of the present invention, and the present invention is not limited to the following embodiment.

  FIG. 1A is a cross-sectional view showing a part of an organic EL element substrate 10 in the present embodiment. According to the figure, a color filter 102 made of RGB (red, green, blue) is formed on a glass substrate 101, and an overcoat layer 103 is formed thereon. In addition, an inorganic solid layer 104 is formed in order to prevent a trace amount of moisture, solvent, and the like contained in the color filter 102 from degrading the organic EL element. The inorganic solid layer 104 also has an effect of improving the adhesion with the transparent conductive film 105 formed thereon. A protective pattern 109 and a transparent conductive film 105 are formed on the inorganic solid layer 104. The protective pattern 109 is disposed so as to cover as much of the inorganic solid layer 104 as possible other than the region of the transparent conductive film 105. When this protective pattern is made of a conductive material, it is formed so as not to conduct with the transparent conductive film 105. A pattern of the opening insulating film 106 is formed for the purpose of protecting the pattern edge of the transparent conductive film 105 and for pixel separation. Further, a reverse-tapered partition wall (not shown) is formed for the purpose of separating the cathode when forming the cathode, an organic film 107 is deposited thereon, and a cathode 108 is formed thereon. The above is the structure of the multilayer structure of the organic EL display element.

  In general, the organic EL display device performs passive matrix driving using the transparent conductive film 105 as a signal electrode and the cathode 108 as a scanning electrode. This is because a device having this configuration is easy to manufacture in terms of element formation. Conversely, the transparent conductive film 105 can be formed as a scanning electrode and the cathode 108 can be formed as a signal electrode. In the opening provided in the opening insulating film 106, a current flows through the organic film 107, and the organic film 107 in this region emits light. That is, the organic film 107 in the opening becomes a light emitting portion. The entire area in which the plurality of light emitting portions are provided in a matrix is a display area.

  The glass substrate 101 is a support for the organic EL element substrate 10 and is a transparent glass substrate in this example, but is not limited thereto. A plastic substrate provided with a moisture-proof coat can also be used. In the case of a glass substrate, a soda lime glass substrate or an alkali-free glass substrate with an alkali barrier is often used. In the case of plastic, polycarbonate, polymethacrylate, polysulfolene and the like are used.

  The color filter 102 is a colored resin and includes a plurality of short patterns separated from each other. Each short pattern is arranged so as to correspond to a region to be a pixel. The color filter 102 has three colors of RGB as described above, and is not formed uniformly on the glass substrate 101 but is provided at a position corresponding to a pixel. Therefore, in the state where the color filter 102 is formed, a step is generated depending on its thickness. The overcoat layer 103 is formed to eliminate the step. In the present embodiment, the color filters 102 are formed separately from each other. However, patterning for surface alignment may be performed. Further, although the step due to the color filter 102 is eliminated as described above by forming the overcoat layer 103, the step can be eliminated by polishing after the color filter is formed.

  As a material for forming the overcoat layer 103, a material such as an acrylic resin is often used, but is not particularly limited. However, the overcoat layer 103 needs to have transparency so that the light emitting portion can be seen from the outside. Moreover, a well-known method is employable as a formation method.

  The color filter 102 and the overcoat layer 103 are organic layers (organic layers) as described above, and easily hold organic substances such as water and organic solvents. When the transparent conductive film 105 is formed by sputtering or the like, these organic layers are formed. In some cases, good film formation of the transparent conductive film 105 may be hindered by moisture or organic matter generated from the film. In addition, it is also known that moisture and organic matter diffuse into the organic film 107 provided on the transparent conductive film 105 and prevent light emission thereafter.

From the viewpoint of improving the adhesion between the organic layer and the transparent conductive film 105, it is preferable to use silicon oxide as the inorganic solid layer 104. Silicon nitride is preferably used from the viewpoint of preventing diffusion of moisture and organic matter, but in order to achieve both transparency and gas barrier properties, the ratio of SiO _x / SiN _x is often optimized and used. The inorganic solid layer 104 is provided with a water permeable path. In the substrate drying process, moisture and organic substances are emitted through the water permeable path, and normally, the inorganic solid layer 104 is formed so as not to pass moisture and organic substances. The suitable film thickness is 1-20 nm or less, for example, and it forms as a very thin film | membrane.

  As the transparent conductive film 105, for example, an ITO (indium-tin oxide) thin film is formed with a thickness of about 150 nm here, and is patterned by wet etching. For this reason, a cleaning step is required after patterning. After the patterning of the transparent conductive film 105, there is a portion where the inorganic solid layer 104 is exposed on the substrate surface. For example, since the cleaning is performed by pressing a high-density brush while supplying high-pressure ultrapure water, the surface of the inorganic solid layer 104 may be damaged. Since the inorganic solid layer 104 is formed as a very thin film as described above, if it is scratched, it will not only be difficult to fulfill the above-mentioned role but also cause display defects.

  FIG. 1B, which is an enlarged view of the end portion of the organic EL element substrate 10, includes only the color filter 102, the overcoat layer 103, the inorganic solid layer 104, the transparent conductive film 105, and the protective pattern 109 of FIG. Is illustrated. As shown in FIG. 1B, the color filter 102 is covered with an overcoat layer 103, and a transparent conductive film 105 is patterned at a position corresponding to the color filter 102. In the present invention, in the region where the color filter 102 is not present, the transparent layer is formed on the inorganic solid layer 104 for the purpose of covering the pattern edge region of the overcoat layer 103 from the inside to the outside of the region where the overcoat layer 103 is formed. A protective pattern 109 is formed separately from the conductive film 105. The protective pattern 109 is arranged so as to be adjacent to the outside of the transparent electrode 105 located at the end of the display area. The protective pattern 109 can also be formed of the same ITO as the transparent conductive film 105. By forming the protective pattern 109, the inorganic solid layer 104 can be protected from the brush in the cleaning process. Whereas the transparent conductive film 105 is formed in a portion necessary as a wiring, the protective pattern 109 is patterned in a portion not necessary as a wiring.

  Therefore, the transparent conductive film 105 and the protective pattern 109 are formed apart from each other at an interval that can prevent the inorganic solid layer 104 from being damaged in the cleaning process, that is, an interval that does not allow the high-density brush to enter. It is preferable. In the drying process, patterning is performed with an optimum interval at which moisture and organic substances contained in the color filter 102 and the overcoat layer 103 can be diffused. If the interval is too wide, the exposed portion of the inorganic solid layer 104 becomes wide, and the cleaning process is damaged. This is because if the interval is narrowed, it will be difficult to sufficiently release moisture and organic matter in the drying process. Further, when the protective pattern 109 is formed of ITO as described above, the transparent conductive film 105 and the protective pattern 109 may be short-circuited if the interval is too narrow.

  The transparent conductive film 105 is an anode wiring of the organic EL display device. The protective pattern 109 is a pattern for protecting the inorganic solid layer 104 as described above. The protective pattern 109 and the transparent conductive film 105 are distinguished by their roles, but may be formed by patterning in the same process. In this case, the protective pattern 109 is also formed of ITO, and since it is a conductor, it needs to be formed insulated from the transparent conductive film 105. In the case where the transparent conductive film 105 and the protective pattern 109 are patterned in the same process, it is not necessary to separately perform the two processes of film formation and patterning of the protective pattern 109, and a reduction in productivity can be prevented.

  When patterning the transparent conductive film 105 and the protective pattern 109 in separate steps, it may be necessary to clean the substrate once after patterning one of them. For this reason, the exposed portion of the inorganic solid layer 104 before the protective pattern 109 is formed is washed, which may cause scratches. From this point of view, it can be said that the transparent conductive film 105 and the protective pattern 109 are preferably patterned by the same material and in the same process.

  For the opening insulating layer 106, a polymer material such as polyimide resin is often used, but there is no particular limitation, and a known material having sufficient insulation can be used. The opening insulating layer 106 is provided for the purpose of protecting the pattern edge of the transparent conductive film 105 and for pixel separation. An organic film 107 is provided in the display area and its periphery, and a pixel is formed by making the intersection of the transparent conductive film 105 and the cathode 108 correspond to this opening.

  As a material used for the organic film 107, a compound having a high fluorescence quantum yield, a high electron injection rate from the cathode 108, and a high electron mobility is effective, and a known organic light emitting material such as an 8-oxynoline-based material is used. Complexes, tetraphenylbutadiene, styryl dyes, oxadiazole dyes, and the like can be used.

  Moreover, the film thickness of the organic film 107 is 10-200 nm normally, Preferably it is 20-80 nm. Note that the light-emitting layer may be accompanied by a hole transport layer, an interface layer, an electron injection layer, an electron transport layer, and the like. It means the layer that contains. The cathode 108 is formed of, for example, a metal thin film.

  2, 3, 5, and 6 are views of the manufacturing process of the organic EL display device including the organic EL element substrate 10 according to the present embodiment as viewed from above, and FIG. 7 is a flowchart of the manufacturing process. is there. Further, in FIGS. 2, 3, 5, and 6, the pixels are simply shown as only 2 rows and 2 columns, but this is not the case. A manufacturing process of the organic EL display device according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 2A, a color filter 102 is first formed on a glass substrate 101 (S101). The film thickness of the color filter 102 is 1.2 μm, for example, and is formed by a photolithography method. Next, as shown in FIG. 2B, an overcoat layer 103 is formed on the glass substrate 101 from above the color filter 102 by photolithography (S102). Since the overcoat layer 103 is formed so as to cover the color filter 102, the substrate surface is planarized. The thickness of the overcoat layer 103 is 1.5 μm, for example, and is made of an acrylic resin.

Next, as shown in FIG. 2C, an inorganic solid layer 104 is formed on the overcoat layer 103 (S103). The inorganic solid layer 104 is made of SiO _{2. In} order to achieve both transparency and gas barrier properties, the ratio of SiO _x / SiN _x is optimized and used. The inorganic solid layer 104 is formed by, for example, a sputtering method. Moreover, although the thickness of the inorganic solid layer 104 changes with manufacturing conditions, it can be suitably adjusted, for example in the range of 1 nm-20 nm, and can be 5 nm. In this embodiment, a film can be formed by RF sputtering under conditions of a substrate temperature of 220 ° C., SiO ₂ as a target, argon as a sputtering gas, and a gas pressure of 0.7 Pa.

  An ITO film is formed on the entire inorganic solid layer 104, and the protective pattern 109 and the transparent conductive film 105 are patterned as shown in FIG. 3D (S104). The pattern on the left two lines of the transparent conductive film 105 shown in FIG. 3D is matched with the pattern of the auxiliary wiring 110 to be formed later. As described above, the formation of the protective pattern 109 and the formation of the transparent conductive film 105 are more preferably performed in the same process, but may be performed in separate processes.

  The protective pattern 109 is outside the transparent conductive film 105, that is, outside the region where the color filter 102 is provided, and from the inside to the outside of the region where the overcoat layer 103 is provided, particularly the pattern edge region of the overcoat layer 103. Is provided on the inorganic solid layer 104 for the purpose of coating. The distance between the protective pattern 109 and the transparent conductive film 105 is such that the high-density brush does not enter as described above. The reason for removing moisture and organic matter is to prevent deterioration of the organic film 107 and to eliminate display defects. Therefore, the portion other than the vicinity of the pixel in the positional relationship with respect to the main surface of the substrate is a protective pattern rather than removing moisture and organic matter in the drying process. It may be preferable to cover it.

  For example, an ITO film is formed by DC sputtering under the conditions of a substrate temperature of 220 ° C., argon with 0.8% oxygen added as a sputtering gas, and a gas pressure of 0.7 Pascal. Then, the transparent conductive film 105 and the protective pattern 109 are manufactured by wet etching with hydrochloric acid + ferric chloride aqueous solution. By this operation, a portion where the inorganic solid layer 104 is exposed is formed. For example, the width of the transparent conductive film 105 is 50 μm, the width between the adjacent transparent conductive films 105 and the width between the transparent conductive film 105 and the protective pattern 109 are 10 μm. The protective pattern 109 is patterned for the purpose of covering the entire sheet as much as possible in order to protect the inorganic solid layer 104 even in an area outside the pixel.

  Thereafter, a cleaning process is performed (S105). That is, the cleaning process is performed in the state shown in FIG. For example, the cleaning is performed while supplying high-pressure ultrapure water. Foreign matter on the surface is removed by rotating the substrate after pressing a high-density brush against the surface on which the transparent conductive film 105 is formed. At this time, since the inorganic solid layer 104 is covered with the protective pattern 109, scratches due to cleaning can be prevented.

  FIG. 4B shows a cross-sectional view taken along the line AA ′ shown in FIG. FIG. 4A shows a case where the protective pattern 109 is not provided, that is, the case of the conventional organic EL display device 2. Conventionally, the inorganic solid layer 204 is exposed as shown in FIG. Among the exposed inorganic solid layer 204, the inorganic solid layer 204 is thin particularly in a region where the overcoat layer 203 has a step, and thus is easily damaged by cleaning. As for the organic EL display device according to this embodiment, the inorganic solid layer 104 is covered with a protective pattern 109 including the region as shown in FIG. Therefore, cleaning damage to the inorganic solid layer 104 can be suppressed.

  A metal film is formed on the structure as shown in FIG. 3E, and is patterned as the auxiliary wiring 110 as shown in FIG. 3F (S106). After patterning, the substrate is cleaned (S107). Since the cleaning process is performed in the same manner as S106, the formation of the protective pattern 109 can similarly prevent the inorganic solid layer 104 from being damaged during cleaning. An opening insulating layer 106 is formed thereon as shown in FIG. 5G (S108). In this embodiment, the photosensitive polyimide is formed by a photolithography method. A first opening 1061 shown in FIG. 5G is a position where the transparent conductive film 105 intersects with the cathode 108 formed in a later step, and one of the first openings 1061 is one pixel. It becomes. The second opening 1062 is a contact hole that connects the auxiliary wiring 110 and the cathode 108.

  On the upper layer, as shown in FIG. 5H, the barrier rib 111 for forming the cathode is formed (S109). The partition wall 111 has a reverse taper shape, and is formed using a cresol resin in this embodiment. Here, drying is performed to remove moisture and organic substances contained in the organic layers such as the color filter 102 and the overcoat layer 103 (S110). For example, after the partition 111 is formed, it is performed at 200 ° C. in a vacuum for 1 hour, and immediately before the next step, it is dried at 200 ° C. for 10 minutes in a dry nitrogen atmosphere having a dew point of about −80 ° C. Move. As a result, moisture in the organic layer including the color filter 102, the overcoat layer 103, the opening insulating layer 106, and the partition wall 111 is not only from the portion where the organic layer is exposed but also from the portion where the inorganic solid layer is exposed. Can be removed.

  Then, as shown in FIG. 5I, an organic film 107 is formed (S111). For example, Alq3 (tris (8-quinolinolato) doped with 10 nm thick copper phthalocyanine, 100 nm thick α-NPD (4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl) and rubrene doped (Aluminum) is deposited by 60 nm. The organic film 107 is formed so as to cover at least the entire display region.

  Then, as shown in FIG. 6J, the cathode 108 is formed from the top (S112). For example, a 0.5 nm thick LiF and an 80 nm thick Al electrode are formed by vapor deposition to form an electron injection layer and a cathode. The deposited film is separated by the reverse taper shape of the partition wall 111 to become a cathode. The cathode 108 intersects the anode wiring made of the transparent conductive film 105. A first opening 1061 is provided in the opening insulating film 106 at the intersecting portion. Accordingly, a current flows through the organic film 107 in this portion to form a light emitting portion. Each of the light emitting units is a pixel. Then, as shown in FIG. 6K, sealing is performed with a sealing substrate 112 in a region outside the overcoat layer 103 (S113). Finally, as shown in FIG. 6L, it is cut into a mounting shape (S114). A drive circuit is provided on a substrate cut into a mounting shape.

  FIG. 8 is a cross-sectional view of the organic EL display device to which the sealing substrate 112 is attached at the BB ′ cutting line shown in FIG. As shown in the figure, the organic film 107 is sandwiched between a transparent conductive film 105 and a cathode 108, and the cathode 108 is connected to the auxiliary wiring 110 through a contact hole in the opening insulating film 106. The sealing substrate 112 has a recess provided by etching, and a drying agent 113 is provided in the recess. In addition, a sealant 114 is provided at the contact point with the glass substrate 101 to ensure adhesiveness and waterproofness. The space Q is filled with dry nitrogen. The sealing substrate 112 needs to be manufactured separately from the flow shown in FIG. In the present embodiment, the sealing substrate 112 is a glass substrate, and the desiccant 113 is a desiccant manufactured by SAES Getters. Further, the recess of the sealing substrate 112 can be formed by forming a recess by sandblasting or forming glass by a mold in addition to etching. Furthermore, what is enclosed in the space Q is not limited to dry nitrogen, but may be other dry gas such as helium or argon.

  As described above, in the organic EL display device according to the first embodiment of the present invention, the inorganic solid layer 104 is prevented from being damaged in the cleaning process during the manufacturing process, and the yield is improved and the defects are reduced over time. Can be achieved.

Other Embodiments In the above embodiment, the color filter type organic EL display device has been described, but the present invention is not limited to this. The present invention can also be used for, for example, a CCM (color changing material) type organic EL display device. In the CCM organic EL display device, the organic film 107 is formed using an organic light emitting material that emits blue-green light, for example. In the configuration shown in FIG. 1, a color conversion layer for converting blue-green light into red and green is provided instead of the R and G color filters 102. The B color filter 102 converts blue-green light into desired blue light. Thereby, the blue-green light from the organic film 107 is converted into light of the three primary colors of R, G, and B. One type of color conversion layer that converts light emitted from the organic film 107 into light of a different color may be provided. In this case, the color conversion layer is provided in place of any of the R, G, and B color filters. The light converted into a different color by the color conversion layer and the original light emission are mixed to generate white light. Of course, organic light emitting materials that emit light of other colors may be used. Furthermore, a color filter or CCM other than the above color may be used.

It is sectional drawing which shows an example of the organic EL element substrate concerning embodiment of this invention. It is a top view which shows typically the manufacturing process of the organic electroluminescent display apparatus concerning embodiment of this invention. It is a top view which shows typically the manufacturing process of the organic electroluminescent display apparatus concerning embodiment of this invention. It is sectional drawing which shows a part of embodiment of this invention and the organic EL element substrate which concerns on a prior art. It is a top view which shows typically the manufacturing process of the organic electroluminescent display apparatus concerning embodiment of this invention. It is a top view which shows typically the manufacturing process of the organic electroluminescent display apparatus concerning embodiment of this invention. It is a flowchart showing the manufacturing process of the organic electroluminescent display apparatus concerning embodiment of this invention. It is sectional drawing which shows an example of the organic electroluminescent display apparatus concerning embodiment of this invention. It is sectional drawing which shows an example of the organic electroluminescent display apparatus concerning a prior art. It is a figure showing the display surface of the organic electroluminescent display apparatus concerning a prior art.

Explanation of symbols

2 Conventional organic EL display device 10 Organic EL element substrate 101 Glass substrate 102 Color filter 103 Overcoat layer 104 Inorganic solid layer 105 Transparent conductive film 106 Opening insulating layer 107 Organic film 108 Cathode 109 Protection pattern 110 Auxiliary wiring 111 Partition 112 Sealing Substrate 113 Desiccant 114 Sealant 201 Glass substrate 202 Color filter 203 Overcoat layer 204 Inorganic solid layer 205 Transparent conductive film 206 Opening insulating layer 207 Organic film 208 Cathode 1061 First opening 1062 Second opening Q Space R Non- Light emitting part

Claims (10)

A colored organic layer on the substrate;
An overcoat layer covering the colored organic layer;
An inorganic solid layer provided on the overcoat layer,
A plurality of first electrodes on the inorganic solid layer;
An organic light emitting layer;
A plurality of second electrodes;
A region where the first electrode and the second electrode overlap with each other and a region in contact with the first electrode and the second electrode of the organic light emitting layer is a light emitting portion,
An insulating layer provided so as to cover the adjacent electrode-side end portions of the plurality of first electrodes, and between the adjacent first electrodes, and an inorganic solid in a region where the first electrode is not provided An organic EL display device including a protective layer provided over the layer and spaced apart from the first electrode.   The organic EL display device according to claim 1, wherein the protective layer is formed outside a display region.   The organic EL display device according to claim 1, wherein the protective layer has conductivity and is formed to be insulated from the first electrode.   The organic EL display device according to claim 1, wherein the protective layer extends from the inside to the outside of the range in which the overcoat layer is provided.   The organic EL display device according to claim 1, wherein the protective layer and the first electrode are the same process layer.   6. The organic EL display device according to claim 1, wherein white light is emitted by the organic light emitting layer, and the colored organic layer is an R, G, B color filter. 7.   From at least 1 type of color conversion layer between the said organic light emitting layer and the said colored organic layer, The said color conversion layer converts the light emitted by the said organic light emitting layer into the light of a different color. The organic EL display device according to claim 5. Forming a colored organic layer on the substrate;
Forming an overcoat layer so as to cover the colored organic layer;
Forming an inorganic solid layer on the overcoat layer;
Forming a plurality of first electrodes on the inorganic solid layer;
Forming a protective layer on the inorganic solid layer and outside the plurality of first electrodes;
Cleaning the substrate from above the first electrode and the protective layer;
Forming an opening insulating layer on the plurality of first electrodes;
Forming an organic light emitting layer;
Forming a second electrode on an organic light emitting layer provided on the first electrode;
The manufacturing method of the organic electroluminescence display which has this.   The method for manufacturing an organic EL display device according to claim 8, wherein the first electrode and the protective layer are formed in the same step.   9. The organic EL display device according to claim 8, further comprising a step of forming a partition for separating the second electrodes from each other.

Images