JP2006196599A - Conduction method between both surfaces of substrate and wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conduction method between both surfaces of a substrate which has simple process for conducting both plate surfaces and may not thermally deteriorating the substrate, and to provide a wiring board. <P>SOLUTION: Metallic particles 3 are filled in a hole (through hole) 2 formed on the substrate 1, and the metallic particles 3 are pressed in a thickness direction of the substrate 1. The metallic particles 3 are plastically deformed, pressed onto the inner wall of the hole 2, and fixed in the inside of the hole 2. Thus, conduction can be realized between both the surfaces of the substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a conductive method for both surfaces of a substrate and a wiring board used in an electronic device, and more particularly, a conductive method for both surfaces of a substrate having holes (through holes) for performing mutual conduction between inner and outer layer circuits, and this method. The present invention relates to the obtained wiring board.

  In general, a double-sided printed wiring board and a multilayer printed wiring board are formed with through-holes (through holes) for connecting wirings made of a conductive layer formed on both the front and back surfaces or both front and back surfaces and an inner layer. . The hole is plated with a metal such as copper on the inner wall thereof, and conduction between wirings formed in multiple layers by a conductor layer made of the metal plating is performed.

  Conventionally, such a printed wiring board is, for example, a process of forming a through hole in a double-sided copper-clad laminate as an insulating substrate by drilling or punching, and a copper panel on the surface of the copper-clad laminate including the inner wall of the through-hole. A step of plating, a step of forming an etching resist layer for forming a wiring pattern on the surface of the copper-clad laminate, a step of etching, a step of removing the resist layer, and after the wiring pattern is formed It is manufactured through a process of forming a solder resist (SR) layer on the surface of the copper clad laminate.

As a simpler method, a method of filling a through-hole with a conductive paste and baking it is also performed (for example, Patent Documents 1 and 2 below).
JP-A-5-183268 JP-A-8-255982

  The plating method is industrially disadvantageous because of complicated processes. If it is a method using the above-mentioned conductive paste, it can be manufactured with a smaller number of steps than the method by plating, but even this method requires a step of drying and further baking the conductive paste, There are drawbacks that the process is still complicated and that the substrate is limited to one that can withstand the heat during firing.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for conducting both surfaces of a substrate, in which a work process for conduction between both plate surfaces is simple and there is no risk of thermal degradation of the substrate, and a wiring board obtained by this method.

  The method for conducting both surfaces of a substrate according to the present invention (Claim 1) is to conduct both surfaces of a substrate by electrically connecting one plate surface side of the substrate and the other plate surface side by a conductor in a hole penetrating the plate surface. In the method, the metal particles are filled in the holes, and then the metal particles are pressed in the thickness direction of the substrate to be fixed in the holes.

  According to a second aspect of the present invention, there is provided the conduction method for both surfaces of the substrate according to the first aspect, wherein the metal particles are noble metal particles.

  According to a third aspect of the present invention, there is provided the conductive method for both surfaces of the substrate according to the second aspect, wherein the noble metal particles are gold particles.

  The conduction method for both surfaces of the substrate according to claim 4 is the method according to any one of claims 1 to 3, wherein the hole has a small diameter on one end side and a large diameter on the other end side. The diameter is larger than the diameter on the one end side and smaller than the diameter on the other end side.

  A wiring board according to the present invention (Claim 5) is provided with a substrate having at least one hole penetrating from one plate surface side to the other plate surface side, and disposed in the hole, the one plate surface side. In the wiring board provided with a conductor that conducts to the other plate surface side, the conductor is filled in the hole, and fixed in the hole by pressing in the thickness direction of the board, It consists of at least one metal particle.

  A wiring board according to a sixth aspect of the present invention is the wiring board according to the fifth aspect, wherein a plurality of the metal particles are filled in the holes, and a contact portion between the metal particles is plastically deformed by the pressing. Is.

  A wiring board according to a seventh aspect is the wiring board according to the fifth or sixth aspect, wherein the metal particles are noble metal particles.

  According to an eighth aspect of the present invention, there is provided the wiring board according to the seventh aspect, wherein the noble metal particles are gold particles.

  A wiring board according to a ninth aspect is characterized in that, in any one of the fifth to eighth aspects, a conductive layer is formed on an inner wall of the hole.

  A wiring board according to a tenth aspect is the wiring board according to any one of the fifth to eighth aspects, wherein the substrate is made of silicon and an insulating layer is formed on an inner wall of the hole.

  A wiring board according to an eleventh aspect is the wiring board according to the tenth aspect, wherein the insulating layer is formed by oxidizing silicon on the inner wall.

  According to the conduction method and the wiring board on both sides of the substrate of the present invention, the metal particles are arranged in the holes (through holes), and the metal particles are pressed and fixed in the holes to conduct both the plate surfaces of the substrate. A conductor can be formed. At this time, in the present invention, since the heat treatment is not performed, the substrate is not deteriorated by heat. Therefore, the substrate is not limited to a heat-resistant substrate.

  Moreover, this process consists of a simple process of the metal particle filling process and the subsequent pressing process, and the operation is simple.

  When a plurality of metal particles are filled in the holes, it is preferable that the contact portion between the metal particles is plastically deformed by pressing in the thickness direction of the substrate. In this case, the area of the contact portion increases, and the current easily flows through the contact portion.

  As the metal particles, noble metal particles having excellent corrosion resistance and low electrical resistance are preferable, and gold particles having particularly good spreadability are preferable.

  In the present invention, one end side of the hole has a small diameter, the other end side has a large diameter, and the particle size of the metal particles is larger than one end side (small diameter) of the hole and smaller than the other end side (large diameter). It is preferable that If it does in this way, when filling a metal particle into a hole from the other end side, since it will not drop out from the one end side, filling workability of a metal particle will improve.

  A conductive layer may be formed on the inner wall of the hole. In this way, the current can flow in the metal particles and also in the conductive layer, so that the conductivity is more excellent.

  Further, when the material of the substrate is made of silicon, an insulating layer may be formed on the inner wall of the hole to prevent the metal particles from diffusing into the substrate.

  As this insulating layer, when a silicon oxide layer is formed by oxidizing silicon on the inner wall of the hole, the insulating layer can be easily formed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view for explaining a conductive method on both sides of a substrate and a wiring substrate according to an embodiment.

  As shown in FIG. 1, metal particles 3 are filled into holes (through holes) 2 formed in the substrate 1, the metal particles 3 are pressed in the thickness direction of the substrate 1, and the metal particles 3 are inserted into the holes 2. Is fixed, conduction between both surfaces of the substrate 1 is achieved.

  That is, as shown in FIG. 1A, a through hole (through hole) 2 is formed in the thickness direction of the substrate 1. The hole 2 is formed by etching, laser, drill, or the like.

  The material of the substrate 1 is not particularly limited, and examples thereof include glass such as alkali silicate glass, non-alkali glass and quartz glass, ceramics such as aluminum nitride, alumina, silicon carbide and silicon nitride, epoxy resin, filler and fine particles. An insulating material such as a composite resin mixed with or a semiconductor material such as silicon is used.

  In the present embodiment, the hole 2 has a shape that gradually decreases in diameter from one plate surface (upper surface in FIG. 1) to the other plate surface (lower surface in FIG. 1). The inner diameter of the upper end side of the hole 2 (hereinafter may be referred to as “large-portion diameter”) is, for example, about 6 to 400 μm, and the inner diameter of the lower end side (hereinafter may be referred to as “small-portion diameter”). For example, it is about 40-250 micrometers, Preferably, a large opening part diameter is 100-200 micrometers, a small opening part diameter is 80-150 micrometers, or a large opening part diameter is 280-320 micrometers, and a small opening part diameter is about 160-200 micrometers. The thickness of the substrate 1 is, for example, about 100 to 500 μm, and the taper angle θ of the hole 2 is preferably about 45 to 85 °.

  As shown in FIG. 1B, the metal particles 3 are filled in the holes 2.

  As the material of the metal particles 3, a material having high electrical conductivity, excellent corrosion resistance, soft and excellent malleability and ductility is preferable. For example, noble metals such as gold, silver and platinum, copper, or alloys thereof, Gold alloys composed of gold and tin are preferable, and gold and gold-tin alloys are particularly preferable.

  Alternatively, the metal particles 3 may be formed by plating the surface of the metal sphere with the metal or the alloy.

  The shape of the metal particles 3 is preferably a true sphere in terms of handling, but is not necessarily a true sphere, and may be a polyhedral structure such as an octahedron or a 16-hedron, or an egg shape, for example. good.

  In the present embodiment, the diameter of the metal particle 3 is smaller than the large diameter of the hole 2 and larger than the small diameter. For this reason, the metal particles 3 can be inserted into the holes 2 from above the holes 2, and the metal particles 3 are prevented from falling from below the holes 2 as shown in FIG. . However, the diameter of the metal particle 3 may be larger than the large diameter of the hole 2 as long as the metal particle 3 can be pressed and inserted into the hole 2. Further, if the lower end side of the hole 2 is closed with a plate or the like to prevent the metal particles 3 from falling from the hole 2, the diameter of the metal particles 3 may be made smaller than the diameter of the small opening of the hole 2.

  However, from the viewpoints of handling workability and filling into the hole, the diameter of the metal particle 3 is 1.05 to 2.0 times the small diameter of the hole 2 and is 1 of the large diameter of the hole 2. It is preferable that it is about /1.1 to 1/3 times.

  In the present embodiment, three metal particles 3 are filled in the hole 2, but one, two, or four or more metal particles 3 are filled according to the size of the hole 2 and the size of the metal particle 3. May be.

  After filling the holes 2 with the metal particles 3, the metal particles 3 are pressed in the thickness direction of the substrate 1 as shown in FIG. By this pressing, the metal particles 3 are pressed against the inner wall of the hole 2 and fixed in the hole 2 as shown in FIG. As shown in FIG. 1C, the metal particles 3 are in contact with each other, and the upper end of the metal particle 3 disposed at the highest position of the hole 2 is flush with the upper surface of the substrate 1. The lower end of the metal particle 3 disposed on the substrate 1 is flush with the lower surface of the substrate 1. For this reason, the upper surface side and the lower surface side of the substrate 1 are electrically connected by the metal particles 3. The upper end of the highest metal particle 3 and the lower end of the lowest metal particle 3 may protrude from the upper surface and the lower surface of the substrate 1, respectively.

  In the present embodiment, the metal particles are plastically deformed by pressing and are firmly fixed to the inner wall of the hole 2. Moreover, the area of the contact part between metal particles becomes large, and an electric current flows through this contact part easily.

  The above embodiment is an example of the present invention, and the present invention is not limited to the above embodiment. For example, as shown in FIG. 2, a substrate 1A in which a hole 2A having a step portion 4 is formed on the inner wall portion may be used. In this case, the metal particles 3 are held by the step portion 4 and prevented from falling. be able to. Even in this case, by pressing the metal particles filled in the holes 2A in the thickness direction of the substrate 1A, the metal particles are plastically deformed to reach the lower end of the small holes 2A, and the upper surface side of the substrate 1A The lower surface side is electrically connected by the metal particles.

  In the present invention, in order to ensure good electrical conductivity, the total volume of the metal particles 3 (the metal particles 3 present in the holes 2 after pressing) fixed in the holes 2 of the substrate 1 is at least the volume of the holes 2. It is preferable that the gap between the metal particles 3 and 3 is 30% or less, particularly 15% or less of the volume of the hole 2.

  Further, as shown in FIG. 3, a substrate 1B formed by forming a conductive layer 5 on the inner wall of the hole 2 may be used instead of the substrate 1 of FIG. In this case, by filling the metal particles in the holes 2 and pressing the metal particles in the thickness direction of the substrate, the metal particles are in contact with each other, the metal particles are in contact with the conductive layer, and the upper surface side of the substrate 1B is The conduction with the lower surface side is further improved.

  The conductive layer 5 is formed by, for example, CVD or sputtering. The material of the conductive layer 5 is preferably, for example, a noble metal such as gold, silver or platinum, copper, or an alloy thereof, or a gold alloy composed of gold and tin, and particularly preferably gold and a gold-tin alloy.

  Further, as shown in FIG. 4, when the material of the substrate 1C is made of silicon, silicon on the inner wall of the hole 2 is oxidized to form the insulating layer 6 made of silicon oxide, and the metal particles diffuse into the substrate 1C. May be prevented.

  In addition, it is preferable that the thickness of the conductive layer 5 of FIG. 3 is about 0.01-10 micrometers. When the thickness is about 0.005 μm, the effect of improving the conductivity is poor, and even if the thickness exceeds 10 μm, there is no difference in the effect of improving the conductivity. Rather, the conductive layer is easily peeled off and the formation cost is high.

  Further, the thickness of the insulating layer 6 in FIG. 4 is preferably about 0.1 to 10 μm. When the thickness is about 0.05 μm, the above-mentioned effect due to the formation of the insulating layer cannot be sufficiently obtained, and when it exceeds 10 μm, the formation cost is high.

It is sectional drawing explaining the conduction | electrical_connection method of the both surfaces of the board | substrate which concerns on embodiment. It is sectional drawing which shows different embodiment of the board | substrate used by this invention. It is sectional drawing which shows further another embodiment of the board | substrate used by this invention. It is sectional drawing which shows another embodiment of the board | substrate used by this invention.

Explanation of symbols

1, 1A, 1B, 1C substrate 2, 2A hole 3 metal particle 4 step part 5 conductive layer 6 insulating layer

Claims (11)

In the conduction method on both sides of the substrate, where one plate surface side and the other plate surface side of the substrate are made conductive by a conductor in a hole penetrating the plate surface,
A method of conducting both surfaces of a substrate, wherein the holes are filled with metal particles, and the metal particles are pressed in the thickness direction of the substrate and fixed in the holes.   2. The conduction method on both sides of a substrate according to claim 1, wherein the metal particles are noble metal particles.   3. The conduction method for both surfaces of a substrate according to claim 2, wherein the noble metal particles are gold particles. The hole according to any one of claims 1 to 3, wherein the hole has a small diameter at one end and a large diameter at the other end.
A method for conducting both surfaces of a substrate, wherein the particle size of the metal particles is larger than the diameter on the one end side of the hole and smaller than the diameter on the other end side. A substrate having at least one hole penetrating from one plate surface side to the other plate surface side, and a conductor disposed in the hole and electrically connecting the one plate surface side and the other plate surface side In a wiring board with
The wiring board, wherein the conductor is composed of at least one metal particle filled in the hole and fixed in the hole by pressing in the thickness direction of the substrate.   The wiring board according to claim 5, wherein a plurality of the metal particles are filled in the holes, and a contact portion between the metal particles is plastically deformed by the pressing.   7. The wiring board according to claim 5, wherein the metal particles are noble metal particles.   8. The wiring board according to claim 7, wherein the noble metal particles are gold particles.   9. The wiring board according to claim 5, wherein a conductive layer is formed on an inner wall of the hole.   9. The wiring board according to claim 5, wherein the substrate is made of silicon, and an insulating layer is formed on an inner wall of the hole.   11. The wiring board according to claim 10, wherein the insulating layer is formed by oxidizing silicon on the inner wall.

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