JP2006195842A - Structure and method for bonding information recording carrier and metal wiring - Google Patents

Structure and method for bonding information recording carrier and metal wiring Download PDF

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JP2006195842A
JP2006195842A JP2005008324A JP2005008324A JP2006195842A JP 2006195842 A JP2006195842 A JP 2006195842A JP 2005008324 A JP2005008324 A JP 2005008324A JP 2005008324 A JP2005008324 A JP 2005008324A JP 2006195842 A JP2006195842 A JP 2006195842A
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spot
bump
metal wiring
resin
metal
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Akihiro Fujii
章弘 藤井
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Maxell Ltd
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Hitachi Maxell Ltd
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent corrosion of copper wire of an antenna coil in the bonding part at which a bump of an IC chip is bonded, and reduce increasing in the size of inlet thickness in the wiring of the IC chip to the minimum. <P>SOLUTION: A resin spot coating part 33 is formed so that a part of point welding by heat between a bump 7 and an antenna coil 9 is covered. With this method, moisture or oxygen infiltration into the part of point welding can be securely prevented, so that a copper wire 12 at the point welding part, which is exposed to the surface, is not corroded with changing of surrounding environments, such as humidity, and a good electrical bonding state between the bump 7 and the antenna coil 9 can be maintained in the long term. In addition, the whole of the IC chip is not covered, but only the part of point welding is covered with the minute spot coating part 33, so that increasing in the thickness of an inlet 10 due to forming of the spot coating part 33 is very small. Also, the thickness of a contactless IC card 1 or an IC tag 40, those incorporating an inlet 10, is not greatly increased. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、情報記録担体と金属配線との接合構造、および情報記録担体と金属配線との接合方法に関する。本発明は、非接触ＩＣカードにおける、ＩＣチップとアンテナコイルとの接合構造および接合方法に好適に適用できる。また、本発明は、ＩＣタグやその他のＩＣチップとアンテナで構成される電子機器（ラジオ、テレビ、携帯電話）などにも適用できる。   The present invention relates to a joining structure between an information record carrier and metal wiring, and a joining method between the information record carrier and metal wiring. The present invention can be suitably applied to a joining structure and joining method between an IC chip and an antenna coil in a non-contact IC card. The present invention can also be applied to an electronic device (radio, television, mobile phone) configured with an IC tag or other IC chip and an antenna.

非接触ＩＣカードの製造方法の一つに、インレット方式がある。本発明に係る図２は、かかるインレット方式により作製された非接触ＩＣカード１の一形態を示しており、そこでは、ＩＣチップ６にアンテナコイル９を継線してインレット１０を作製し、次いで、当該インレット１０を二枚のシート材１１・１１内に挟み込んでインレットシート２を作製したうえで、当該インレットシート２を上カバーシート３と下カバーシート５の間に挟み込んで、三つのシート２・３・５を不離一体的に接着接合している。インレットシート２とカバーシート３・５との間に、厚み調整用のシートを別途配したものもある。   One method of manufacturing a non-contact IC card is an inlet method. FIG. 2 according to the present invention shows an embodiment of a non-contact IC card 1 manufactured by such an inlet method, in which an antenna coil 9 is connected to an IC chip 6 to manufacture an inlet 10, and then The inlet 10 is sandwiched between two sheet materials 11 and 11 to produce the inlet sheet 2, and then the inlet sheet 2 is sandwiched between the upper cover sheet 3 and the lower cover sheet 5, and the three sheets 2・ 3 and 5 are bonded and bonded in an integrated manner. There is also a sheet in which a thickness adjusting sheet is separately arranged between the inlet sheet 2 and the cover sheets 3 and 5.

以上のようなインレット方式では、アンテナコイル９をＩＣチップ６の電気接点であるバンプ７に継線させている。本発明者等は、アンテナコイル９として、図４に示すような銅線１２の表面が樹脂皮膜１３・１５で覆われたコーティングタイプのアンテナ線１６を用いることを予定している。そして、本発明に係る図６に示すごとく、バンプ７上にアンテナコイル９の端部１６ａ・１６ｂを載置した状態で、該アンテナコイル９に対して加熱圧着処理を施すことにより、樹脂皮膜１３・１５を溶かして銅線１２を露出させるとともに、該露出部分に係る銅線１２とバンプ７の接合面（上面）の一部を溶かし、これで両者を点溶接する形態を採ることを予定している（図１０参照）。   In the inlet system as described above, the antenna coil 9 is connected to the bump 7 which is an electrical contact of the IC chip 6. The inventors of the present invention plan to use a coating type antenna wire 16 in which the surface of the copper wire 12 as shown in FIG. Then, as shown in FIG. 6 according to the present invention, the resin film 13 is formed by subjecting the antenna coil 9 to thermocompression bonding with the ends 16a and 16b of the antenna coil 9 placed on the bumps 7.・ We plan to take a form in which 15 is melted to expose the copper wire 12 and a part of the joint surface (upper surface) of the copper wire 12 and the bump 7 related to the exposed portion is melted and spot-welded. (See FIG. 10).

上記のようなインレット方式により作製された非接触ＩＣカードは、例えば、特許文献１などにも見受けられる。そこでは、三つのシート２・３・５の一体化するラミネート加工時に、ＩＣチップ６に加わる熱および圧によってＩＣチップ６が破壊されることを防ぐことを目的として、ＩＣチップ６の全体を樹脂でコーティングしている。   A non-contact IC card manufactured by the inlet method as described above can also be found in, for example, Patent Document 1. In order to prevent destruction of the IC chip 6 due to heat and pressure applied to the IC chip 6 during the lamination process in which the three sheets 2, 3, and 5 are integrated, the entire IC chip 6 is made of resin. It is coated with.

特開２００２−３０４６０７号公報（図１および図２参照）JP 2002-304607 A (see FIGS. 1 and 2)

インレット方式による非接触ＩＣカードの製造方法では、インレットシート２の作製工程が、上下のカバーシート３・５との接合工程とは別工場内で行われる場合がある。また、インレットシート２の作製から数ヶ月後に、三者２・３・５の接合作業が実施されることもある。このため、図９および図１０に示すごとく、ＩＣチップ６のバンプ７との接合部分に係る銅線１２が樹脂皮膜１３・１５で覆われておらず表面に露出していると、とくに上記のようにインレットシート２の作製からカバーシート３・５との接合処理までの間が長期となった場合に、水分や酸素などによって当該露出部分に係る銅線１２が腐食されてやすく、その結果、アンテナコイル９とＩＣチップ６との電気的な接続状態が不良となって、非接触ＩＣカードの品質が低下したり、歩留まりが低下したりすることがあった。   In the non-contact IC card manufacturing method using the inlet method, the manufacturing process of the inlet sheet 2 may be performed in a separate factory from the bonding process of the upper and lower cover sheets 3 and 5. In addition, after several months from the production of the inlet sheet 2, a joining operation of the three parties 2, 3, 5 may be performed. For this reason, as shown in FIG. 9 and FIG. 10, when the copper wire 12 related to the joint portion of the IC chip 6 with the bump 7 is not covered with the resin coatings 13 and 15 and exposed to the surface, the above-mentioned Thus, when the period from the production of the inlet sheet 2 to the joining process with the cover sheets 3 and 5 is long, the copper wire 12 related to the exposed part is easily corroded by moisture, oxygen, etc., and as a result, The electrical connection between the antenna coil 9 and the IC chip 6 may be poor, and the quality of the non-contact IC card may be reduced, or the yield may be reduced.

かかる不具合を解決する方法としては、例えば特許文献１のように、バンプ７を含むＩＣチップ６の全体を樹脂でコーティングして、点溶接部分を水分や酸素から遮断することが考えられる。しかしその場合には、ＩＣチップ６の存在部分に係るインレット１０の厚み寸法が、コーティング層の厚み寸法分だけ大きくなることが避けられず、非接触ＩＣカードの厚み寸法の増加を招く。最悪の場合には、非接触ＩＣカードの大幅な設計変更が必要となる。   As a method for solving such a problem, for example, as in Patent Document 1, it is conceivable that the entire IC chip 6 including the bumps 7 is coated with a resin to block the spot welded portion from moisture and oxygen. However, in that case, it is inevitable that the thickness dimension of the inlet 10 related to the portion where the IC chip 6 exists is increased by the thickness dimension of the coating layer, which leads to an increase in the thickness dimension of the non-contact IC card. In the worst case, a significant design change of the non-contact IC card is required.

本発明の目的は、情報記録担体（ＩＣチップ）の存在箇所に係るインレットの厚み寸法の増加を最小限に抑えて、該インレットが組み込まれる最終製品（非接触ＩＣカードやＩＣタグ）の薄型化に貢献すること、およびバンプとの接合部分に係る金属配線（アンテナコイル）の金属線状体（銅線）が腐食することがなく、したがって、情報記録担体（ＩＣチップ）と金属配線（アンテナコイル）の電気的接合を良好に維持して、製品不良の発生を一掃することができるようにすることにある。   The object of the present invention is to minimize the increase in the thickness of the inlet associated with the location of the information record carrier (IC chip) and to reduce the thickness of the final product (non-contact IC card or IC tag) into which the inlet is incorporated. The metal linear body (copper wire) of the metal wiring (antenna coil) related to the joint portion with the bump is not corroded, and therefore the information recording carrier (IC chip) and the metal wiring (antenna coil) ) To maintain a good electrical connection so that the occurrence of product defects can be eliminated.

本発明に係る情報記録担体６と金属配線９との接合構造は、図１、図３および図８に示すごとく、情報記録担体６の表面に形成されたバンプ７と、該バンプ７に加熱圧着接合される金属配線９とからなり、これらバンプ７と金属配線９との加熱圧着による点溶接部分が、樹脂製のスポットコーティング部３３で覆われていることを特徴とする。なお、図１および図３は、本発明に係る接合構造を非接触ＩＣカードに適用した例を、図８は、ＩＣタグに適用した例を示している。   The information recording carrier 6 and the metal wiring 9 according to the present invention have a junction structure as shown in FIGS. 1, 3, and 8, and bumps 7 formed on the surface of the information recording carrier 6, and thermocompression bonding to the bumps 7. It consists of metal wirings 9 to be joined, and a spot welded part by thermocompression bonding of these bumps 7 and metal wirings 9 is covered with a resin-made spot coating part 33. 1 and 3 show an example in which the joint structure according to the present invention is applied to a non-contact IC card, and FIG. 8 shows an example in which the joint structure is applied to an IC tag.

また、本発明に係る情報記録担体６と金属配線９との接合構造は、図１、図３および図８に示すごとく、情報記録担体６の表面に形成されたバンプ７と、該バンプ７に加熱圧着接合される金属配線９とからなる。金属配線９は、図４に示すごとく、金属線状体１２の表面を樹脂皮膜１３・１５でコーティングしてなる。図６に示すごとく、バンプ７上に金属配線９を載置した状態で、該金属配線９に対して加熱圧着処理を施すことにより、図３および図８に示すごとく、該加熱圧着部分に係る樹脂皮膜１３・１５が除去されて金属線状体１２が露出されるとともに、該露出部分に係る金属線状体１２の表面部分とバンプ７の接合面の一部が溶けることで、両者１２・７が不離一体的に点溶接されるようにする。そして、前記点溶接部分に係るバンプ７と金属線状体１２の全体が、樹脂製のスポットコーティング部３３で覆われていることを特徴とする。   The information recording carrier 6 and the metal wiring 9 according to the present invention have a bonding structure in which bumps 7 formed on the surface of the information recording carrier 6 and the bumps 7 are formed as shown in FIGS. It consists of metal wiring 9 to be thermocompression bonded. As shown in FIG. 4, the metal wiring 9 is formed by coating the surface of the metal linear body 12 with resin films 13 and 15. As shown in FIG. 6, with the metal wiring 9 placed on the bump 7, the metal wiring 9 is subjected to a thermocompression bonding process, so that the thermocompression bonding portion as shown in FIGS. The resin coatings 13 and 15 are removed to expose the metal linear body 12, and the surface portion of the metal linear body 12 related to the exposed portion and a part of the bonding surface of the bump 7 are melted, whereby both 12. 7 is made to be spot-welded integrally. The entire bump 7 and the metal linear body 12 related to the spot welded portion are covered with a resin-made spot coating portion 33.

また本発明に係る情報記録担体と金属配線との接合方法は、図６に示すごとく、金属線状体１２の表面を樹脂皮膜１３・１５でコーティングしてなる金属配線９を、情報記録担体６のバンプ７上に載置する工程と、前記金属配線９に対して上方より加熱圧着処理を施すことにより、該加熱圧着部分に係る樹脂皮膜１３・１５を昇華除去して前記金属線状体１２を露出させるとともに、該露出部分に係る金属線状体１２の表面部分とバンプ７の接合面の一部を溶かして、両者１２・７を不離一体的に点溶接する工程と（図３および図８参照）、図７に示すごとく、前記点溶接部分に係るバンプ７と金属線状体１２に向けて樹脂３４を滴下することにより、該点溶接部分の全体を覆うスポットコーティング部３３を形成する工程とを含むことを特徴とする。   In addition, as shown in FIG. 6, the method of joining the information record carrier and the metal wiring according to the present invention comprises forming the metal wiring 9 formed by coating the surface of the metal linear body 12 with the resin film 13 or 15 on the information recording carrier 6. The step of placing on the bumps 7 and the thermocompression treatment of the metal wiring 9 from above are performed to sublimate and remove the resin films 13 and 15 relating to the thermocompression-bonded portion, thereby the metal linear body 12. And a part of the joint surface of the bump 7 and the surface portion of the metal linear body 12 related to the exposed portion are melted and spot welding is performed on the portions 12 and 7 in an integral manner (see FIG. 3 and FIG. 3). 8), as shown in FIG. 7, by spotting the resin 34 toward the bump 7 and the metal linear body 12 related to the spot welded portion, a spot coating portion 33 covering the entire spot welded portion is formed. Including the process To.

本発明に係る情報記録担体と金属配線との接合構造では、バンプ７と金属配線９との加熱圧着による点溶接部分のみを覆うようなスポットコーティング部３３を形成したので、当該点溶接部分に水分や酸素が侵入することを確実に防ぐことができる。これにて、加熱溶着により樹脂皮膜１３・１５が除去されて表面に露出した点溶接部分に係る金属線状体１２が、湿度等の周囲環境の変化によって腐食することを防いで、情報記録担体６のバンプ７と金属配線９の良好な電気的接合状態を長期にわたって維持することができる。   In the joint structure of the information recording carrier and the metal wiring according to the present invention, the spot coating part 33 is formed so as to cover only the spot welded part by the thermocompression bonding of the bump 7 and the metal wiring 9, so that the spot welded part has moisture. And oxygen can be surely prevented from entering. As a result, the metal linear body 12 related to the spot welded portion exposed on the surface after the resin films 13 and 15 are removed by heat welding is prevented from corroding due to changes in the surrounding environment such as humidity, and the information record carrier Thus, a good electrical bonding state between the bumps 7 and the metal wiring 9 can be maintained for a long time.

具体例を挙げて説明すると、図２のような非接触のＩＣカード１の場合には、インレットシート２の作製から、該インレットシート２を上下のカバーシート３・５と接合する接合処理までの間に長期のインターバルがあると、表面に露出している金属線状体１２の部分が腐食しやすく、その点に不利があったが、本発明のように当該点溶接部分をスポットコーティング部３３で覆ってあると、金属線状体１２の腐食を確実に防ぐことができるため、上記のようなインターバルがあった場合においても、バンプ７と金属配線９との間の良好な電気的な接合状態が損なわれることはない。   In the case of a non-contact IC card 1 as shown in FIG. 2, from the production of the inlet sheet 2 to the joining process for joining the inlet sheet 2 to the upper and lower cover sheets 3 and 5. If there is a long interval between them, the portion of the metal linear body 12 exposed on the surface is easily corroded, which is disadvantageous, but the spot welded portion is replaced with the spot coating portion 33 as in the present invention. If it is covered with, the corrosion of the metal linear body 12 can be surely prevented. Therefore, even when there is an interval as described above, good electrical bonding between the bump 7 and the metal wiring 9 can be achieved. The state is not impaired.

図８に示すようなＩＣタグ４０においては、インレット１０を基体４１内に埋設することとなるが、とくに紙製の基体４１内にインレット１０を埋設する場合に、点溶接部分の金属線状体１２が樹脂で覆われておらず表面に露出していると、紙を通った水分等により金属線状体１２が腐食されて、バンプ７との良好な電気的な接合状態が損なわれるおそれがある。その点、本発明のように点溶接部分をスポットコーティング部３３で覆ってあると、金属線状体１２の腐食を確実に防ぐことができるため、紙製の基体４１に対しても、インレット１０を別途防水加工等を施すことなく埋設することが可能となる。これはＩＣタグ４０の低コスト化に資する。   In the IC tag 40 as shown in FIG. 8, the inlet 10 is embedded in the base body 41. Particularly when the inlet 10 is embedded in the paper base body 41, the metal linear body of the spot welded portion is used. If 12 is not covered with resin and exposed on the surface, the metal linear body 12 may be corroded by moisture or the like that has passed through the paper, and a good electrical bonding state with the bump 7 may be impaired. is there. In that respect, when the spot-welded portion is covered with the spot coating portion 33 as in the present invention, the corrosion of the metal linear body 12 can be reliably prevented. It becomes possible to embed without additional waterproofing. This contributes to cost reduction of the IC tag 40.

また、加熱溶着時（図６参照）の条件によっては、点溶接部分の下面に存する情報記録担体６を構成するシリコンウエハに、クラックが入ってシリコンウエハが割れやすくなったり、バンプ７にクラックが入ってバンプ７が剥がれやすくなったりすることがあるが、本発明のように点溶接部分にスポットコーティング部３３を形成してあると、該点溶接部分の強度向上を図ることができるので、シリコンウエハの割れやバンプ７の剥がれなどを確実に防ぐことができる点でも優れている。以上より、本発明に係る接合構造によれば、点溶接部分に係る金属線状体１２の腐食や、情報記録担体６の割れ等に起因する製品不良の問題を一掃して、非接触ＩＣカード１やＩＣタグ４０などの最終製品の歩留まり率の向上に大いに貢献できる。   Further, depending on the conditions at the time of heat welding (see FIG. 6), the silicon wafer constituting the information recording carrier 6 existing on the lower surface of the spot welded portion is cracked, and the silicon wafer is easily broken, or the bumps 7 are cracked. However, if the spot coating portion 33 is formed in the spot welded portion as in the present invention, the strength of the spot welded portion can be improved. It is also superior in that it can surely prevent wafer breakage and bump 7 peeling. As described above, according to the joint structure according to the present invention, the problem of product failure caused by corrosion of the metal linear body 12 related to the spot welded portion, cracking of the information record carrier 6 or the like is eliminated, and the non-contact IC card. 1 and the IC tag 40 can greatly contribute to the improvement of the yield rate of final products.

加えて、従来例に係る特許文献１のように情報記録担体の全体を樹脂によりコーティングする形態では、コーティング層が半球状に盛り上がった形状となるために、情報記録担体の存在箇所に係るインレットの厚み寸法がコーティング層の厚み寸法分だけ大きくなることが避けられず、その結果、該情報記録担体が組み込まれる非接触ＩＣカードやＩＣタグなどの最終製品の厚み寸法が増加したり、当該製品の大幅な設計変更が必要となるなどの不具合を招くおそれがあった。より具体的には、非接触ＩＣカード１の場合には、情報記録担体６の存在箇所に係るインレット１０およびインレットシート２の厚み寸法がコーティング層の厚み寸法分だけ大きくなることが避けられず、その結果、非接触ＩＣカードの厚み寸法が増加したり、非接触ＩＣカードの大幅な設計変更が必要となるなどの不具合を招くおそれがあった。ＩＣタグ４０の場合には、情報記録担体６が存在する箇所が異常に盛り上がったり、ＩＣタグ４０の全体の厚み寸法が増加するなどの不具合を招くおそれがあった。   In addition, in the form in which the entire information record carrier is coated with resin as in Patent Document 1 according to the conventional example, the coating layer has a hemispherical shape, so that the inlet of the information record carrier is located. It is inevitable that the thickness dimension is increased by the thickness dimension of the coating layer. As a result, the thickness dimension of a final product such as a non-contact IC card or IC tag in which the information record carrier is incorporated increases, There was a risk of inconveniences such as a significant design change. More specifically, in the case of the non-contact IC card 1, it is inevitable that the thickness dimension of the inlet 10 and the inlet sheet 2 related to the location where the information record carrier 6 exists is increased by the thickness dimension of the coating layer. As a result, there is a possibility that the thickness dimension of the non-contact IC card is increased, or that the design of the non-contact IC card needs to be drastically changed. In the case of the IC tag 40, there is a possibility that the location where the information record carrier 6 exists is abnormally raised, or that the overall thickness dimension of the IC tag 40 increases.

その点、本発明によれば、点溶接部分のみを微小なスポットコーティング部３３で覆ったので、当該スポットコーティング部３３を形成したことによるインレット１０の厚み寸法の増加は極めて僅かで済み、したがって、従来例のように最終製品の厚み寸法が増加したり、最終製品の設計変更が必要となることはない。最終製品の薄型化にも貢献できる。また、情報記録担体６の全体を樹脂で覆う場合に比べて、必要とされる樹脂量は僅かであり、材料コストの増加に伴う製造コストが増加が少なく、安価に高品質な製品を提供できる点でも優れている。   In that respect, according to the present invention, since only the spot-welded portion is covered with the minute spot coating portion 33, the increase in the thickness dimension of the inlet 10 due to the formation of the spot coating portion 33 is very small. Unlike the conventional example, the thickness dimension of the final product is not increased, and the design change of the final product is not required. It can also contribute to making the final product thinner. Further, compared to the case where the entire information record carrier 6 is covered with a resin, the amount of resin required is small, and the manufacturing cost associated with the increase in material cost is small, and a high-quality product can be provided at low cost. Also excellent in terms.

図７に示すごとく、樹脂３４を滴下することによりスポットコーティング部３３を形成してあると、刷毛などを用いて点溶接部分に樹脂を塗布して、スポットコーティング部３３を形成する場合に比べて、点溶接部分に対して位置精度良く適量の樹脂を乗せることが容易である。実質的に、微量の樹脂３４を一滴だけ滴下するだけであるので、製造作業の大幅な変更を必要とすることなく、作業効率良くスポットコーティング部３３を形成できる点でも優れている。   As shown in FIG. 7, when the spot coating portion 33 is formed by dropping the resin 34, the resin is applied to the spot-welded portion using a brush or the like to form the spot coating portion 33. It is easy to place an appropriate amount of resin on the spot welded portion with high positional accuracy. Substantially only one drop of a small amount of resin 34 is dropped, which is excellent in that the spot coating portion 33 can be formed with high work efficiency without requiring a significant change in the manufacturing work.

（第１実施形態）
図１ないし図７は、本発明を非接触ＩＣカードのインレットシートに適用した第１実施形態を示す。図２は、非接触ＩＣカード１の基本構造を示しており、当該カード１は、インレットシート２と、該インレットシート２の上方に配された上カバーシート３と、該インレットシートの下方に配された下カバーシート５の三者を、不離一体的に接合してなる。インレットシート２は、ＩＣチップ（情報記録担体）６のバンプ７に、アンテナコイル（金属配線）９を加熱圧着接合してなるインレット１０を、通気性を有する材質からなるシート材１１、具体的には不織布製のシート材１１内に埋設してなる。ここでは、二枚のシート材１１・１１でインレット１０を挟み込んで、インレットシート２を作製した。インレット１０が埋設されるように、乾式や湿式の公知の方法により不織布シートを形成して、インレットシート２を作製することもできる。 (First embodiment)
1 to 7 show a first embodiment in which the present invention is applied to an inlet sheet of a non-contact IC card. FIG. 2 shows the basic structure of the non-contact IC card 1, which is arranged under the inlet sheet 2, the upper cover sheet 3 disposed above the inlet sheet 2, and the inlet sheet. The three members of the lower cover sheet 5 thus formed are joined together without separation. The inlet sheet 2 includes an inlet 10 formed by thermocompression bonding an antenna coil (metal wiring) 9 to a bump 7 of an IC chip (information recording carrier) 6, and a sheet material 11 made of a material having air permeability. Is embedded in a sheet material 11 made of nonwoven fabric. Here, the inlet sheet 2 was sandwiched between the two sheet materials 11 and 11 to produce the inlet sheet 2. The inlet sheet 2 can also be produced by forming a nonwoven fabric sheet by a known dry or wet method so that the inlet 10 is embedded.

アンテナコイル９は、図４に示すような、銅線（金属線状体）１２の外周面のまわりを、中層としてのポリウレタン樹脂皮膜（樹脂皮膜）１３と、外層としてのポリエステル樹脂皮膜（樹脂皮膜）１５とで被覆してなる多層構造のアンテナ線１６を、図１に示すごとく、ＩＣチップ６を囲むような四角形の多重巻線状に配してなるものである。図示例では、ＩＣチップ６を囲むように、四重にアンテナ線１６を配して、これをアンテナコイル９とした。   The antenna coil 9 includes a polyurethane resin film (resin film) 13 as an intermediate layer and a polyester resin film (resin film) as an outer layer around an outer peripheral surface of a copper wire (metal linear body) 12 as shown in FIG. The antenna wire 16 having a multilayer structure covered with 15 is arranged in a quadrangular multiple winding shape surrounding the IC chip 6 as shown in FIG. In the illustrated example, four antenna wires 16 are arranged so as to surround the IC chip 6, and this is used as the antenna coil 9.

図１に示すごとく、ＩＣチップ６は、微小な四角形状のチップ本体１７を基体として、該チップ本体１７の一側表面に、電気接点としてのバンプ７を二つ備える。図示例に係るＩＣチップ６では、チップ本体１７の上面の左右縁のそれぞれに、一つずつバンプ７を備えている。各バンプ７は、金メッキされたニッケル製のバンプであり、図３に示すごとく、チップ本体１７の上面から、上方に向かって突設状に設けられている。   As shown in FIG. 1, the IC chip 6 is provided with two bumps 7 as electrical contacts on one side surface of the chip body 17, using a small rectangular chip body 17 as a base. In the IC chip 6 according to the illustrated example, one bump 7 is provided on each of the left and right edges of the upper surface of the chip body 17. Each bump 7 is a gold-plated nickel bump and, as shown in FIG. 3, is provided so as to project upward from the upper surface of the chip body 17.

以上のようなＩＣチップ６とアンテナコイル９とを、不離一体的に接合することにより、インレット１０を作製する。ここでは、加熱圧着接合により、アンテナコイル９をＩＣチップのバンプ７上に接合して、インレット１０を作製した。   The inlet 10 is manufactured by joining the IC chip 6 and the antenna coil 9 as described above in an integral manner. Here, the inlet coil 10 was manufactured by bonding the antenna coil 9 onto the bump 7 of the IC chip by thermocompression bonding.

かかるインレット１０の作製方法を図５ないし図７を使って説明する。まず、図５に示すような治具１９を用いて、アンテナ線１６からアンテナコイル９を作製する。この治具１９は、四角形状のプレート体２０を基体として、該プレート体２０の四つのコーナー部に四本の微小支柱２１からなる支柱群２２をそれぞれ備える。各支柱群２２を構成する微小支柱２１は、各コーナー部を構成する各辺から略４５°の角度で、プレート体２０の盤面の内向きに等間隔を置いて配されている。プレート体２０の盤面中央には、ＩＣチップ６を載置するための支持基盤２３の挿入を許す四角形状の開口２５が開設されている。この開口２５を区画する一つの開口縁の近傍にも、図示例のような三本の微小支柱２６ａ〜２６ｃが立設されている。   A method for manufacturing the inlet 10 will be described with reference to FIGS. First, the antenna coil 9 is produced from the antenna wire 16 using a jig 19 as shown in FIG. This jig 19 is provided with a column group 22 composed of four micro columns 21 at four corners of the plate body 20 with a rectangular plate body 20 as a base. The micro struts 21 constituting each strut group 22 are arranged at equal intervals inward of the plate surface of the plate body 20 at an angle of approximately 45 ° from each side constituting each corner portion. In the center of the plate surface of the plate body 20, a rectangular opening 25 that allows the insertion of the support base 23 on which the IC chip 6 is placed is opened. Three micro-pillars 26a to 26c as shown in the drawing are also erected in the vicinity of one opening edge that defines the opening 25.

プレート体２０の開口２５を巻始端、および巻終端として、これら微小支柱２１・２６にアンテナ線１６を巻き付けることにより、アンテナコイル９を作製することができる。具体的には、開口２５にアンテナ線１６の一方の端部１６ａを配したうえで、微小支柱２６ａ、次いで右上コーナー部において最も内寄りに位置する微小支柱２１（２１ａ）、次に右下コーナー部において最も内寄りに位置する微小支柱２１（２１ｂ）というように、各支柱群２２を構成する微小支柱２１に対して、時計回りに外方に向かってアンテナ線１６を巻き付けたうえで、最後に微小支柱２６ｂ・２６ｃを介して、開口２５に他方の端部１６ｂを配することにより、図５に示すような四重巻線状のアンテナコイル９を作製した。このとき、アンテナコイル９の巻始端と巻終端、すなわちアンテナ線１６の二つの端部１６ａ・１６ｂは、平行状となるようにする。開口２５に隣接する二本の微小支柱２６ａ・２６ｃの左右方向の対向間隔寸法は、ＩＣチップ６の二つのバンプ７・７の左右方向の対向間隔寸法と略一致しており、したがってアンテナコイル９の巻始端と巻終端に係る二つの端部１６ａ・１６ｂ（以下、単にアンテナコイル９の端部１６ａ・１６ｂと記す）は、バンプ７・７の対向間隔寸法と同寸法の対向間隔寸法を有するような平行姿勢となる。なお上述のように、アンテナ線１６の最表面はポリエステル樹脂皮膜１５で覆われているため、アンテナ線１６どうしが重なり合う部分においても短絡は生じない。   The antenna coil 9 can be manufactured by winding the antenna wire 16 around the micro struts 21 and 26 using the opening 25 of the plate body 20 as the winding start end and winding end. Specifically, after one end 16a of the antenna wire 16 is arranged in the opening 25, the micro strut 26a, then the micro strut 21 (21a) positioned inward most in the upper right corner, and then the lower right corner After the antenna wire 16 is wound clockwise outward around the micro struts 21 constituting the respective strut groups 22 such as the micro struts 21 (21b) located at the innermost part in the section, the last The other end portion 16b is arranged in the opening 25 through the micro struts 26b and 26c, thereby producing a quadruple-winding antenna coil 9 as shown in FIG. At this time, the winding start end and winding end of the antenna coil 9, that is, the two ends 16 a and 16 b of the antenna wire 16 are made parallel. The distance between the two micro struts 26a and 26c adjacent to the opening 25 in the left-right direction is substantially the same as the distance between the two bumps 7 and 7 in the IC chip 6 in the left-right direction. The two end portions 16a and 16b (hereinafter simply referred to as the end portions 16a and 16b of the antenna coil 9) related to the winding start end and the winding end end of the winding have opposing spacing dimensions that are the same as the opposing spacing dimensions of the bumps 7 and 7, respectively. It becomes such a parallel posture. As described above, since the outermost surface of the antenna wire 16 is covered with the polyester resin film 15, a short circuit does not occur even in a portion where the antenna wires 16 overlap each other.

以上のようなアンテナコイル９の作製に先立って、支持基盤２３上にＩＣチップ６が載置され、次いで、各バンプ７・７に対応するアンテナコイル９の端部１６ａ・１６ｂが加熱圧着接合により接合される。図６は、かかる加熱圧着接合工程（ボンディング工程）の様子を示しており、そこではＩＣチップ６のバンプ７上にアンテナコイル９の端部１６ａ・１６ｂを載置したうえで、アンテナコイル９の上方からボンディング装置のボンドヘッド３０を加熱圧着することにより、加熱圧着部分に係る樹脂皮膜１３・１５を昇華除去して銅線１２を露出させるとともに、銅線１２の表面部分とバンプ７の接合面（上面）の一部を溶かして、両者（銅線１２とバンプ７）を不離一体的に接合させた（図３参照）。   Prior to manufacturing the antenna coil 9 as described above, the IC chip 6 is placed on the support base 23, and then the end portions 16a and 16b of the antenna coil 9 corresponding to the bumps 7 and 7 are bonded by thermocompression bonding. Be joined. FIG. 6 shows a state of such a thermocompression bonding process (bonding process), in which the end portions 16a and 16b of the antenna coil 9 are placed on the bumps 7 of the IC chip 6 and then the antenna coil 9 is mounted. By bonding the bonding head 30 of the bonding apparatus from above, the resin films 13 and 15 relating to the thermocompression bonding portion are sublimated and removed to expose the copper wire 12, and the surface portion of the copper wire 12 and the bonding surface of the bump 7 are bonded together. A part of the (upper surface) was melted, and both (the copper wire 12 and the bump 7) were joined together in an integrated manner (see FIG. 3).

より詳しく説明すると、図６に示すように、ボンドヘッド３０は、電気的に非導通状態にある一対の分割型のヘッド部３０ａ・３０ｂで構成されている。ボンドヘッド３０の押し下げ動作に先立って、該ボンドヘッド３０とアンテナコイル９の端部１６ａ（１６ｂ）との間には、モリブデン製のリボン３１を介在させる。かかるモリブデン製のリボン３１は、大きな電気抵抗特性を備えており、電流印加時に激しく発熱する。なお、図６において、リボン３１に付される黒塗り矢印は、該リボン３１に付与されるテンションを示している。   More specifically, as shown in FIG. 6, the bond head 30 is composed of a pair of split-type head portions 30a and 30b that are electrically non-conductive. Prior to the operation of pushing down the bond head 30, a ribbon 31 made of molybdenum is interposed between the bond head 30 and the end 16a (16b) of the antenna coil 9. The molybdenum ribbon 31 has a large electric resistance characteristic, and generates heat intensely when a current is applied. In FIG. 6, a black arrow attached to the ribbon 31 indicates a tension applied to the ribbon 31.

リボン３１を配した状態で、ボンドヘッド３０を押し下げて、アンテナコイル９をバンプ７に押し付ける。同時に、一方のヘッド部３０ａに電流を印加する。これにてリボン３１を介して他方のヘッド部３０ｂに電流が流れ、リボン３１が激しく発熱する。当該リボン３１の発熱により、加熱圧着部分に係る樹脂皮膜１３・１５が昇華除去されて銅線１２が表面に露出される。同時的に、この発熱とボンドヘッド３０の押し下げ動作に伴う加圧によって、銅線１２の表面部分とバンプ７の接合面の一部が溶けて、両者１２・７が点溶接される。   With the ribbon 31 disposed, the bond head 30 is pushed down to press the antenna coil 9 against the bumps 7. At the same time, a current is applied to one head portion 30a. As a result, a current flows through the ribbon 31 to the other head portion 30b, and the ribbon 31 generates intense heat. The heat generation of the ribbon 31 removes the resin films 13 and 15 related to the thermocompression bonding portion, thereby exposing the copper wire 12 to the surface. At the same time, due to the heat generation and the pressurization accompanying the push-down operation of the bond head 30, the surface portion of the copper wire 12 and a part of the joint surface of the bump 7 are melted, and both 12 and 7 are spot welded.

そのうえで本実施形態においては、図３に示すごとく、これらバンプ７と銅線１２との加熱溶着による点溶接部分を覆い、当該部分を水分や酸素等から遮断することを主目的として、樹脂製のスポットコーティング部３３を形成してある点が着目される。すなわち、上記特許文献１に係る従来例のように、ＩＣチップ６の全体を覆うのではなく、バンプ７と銅線１２との点溶接部分のみを覆うように、樹脂製のスポットコーティング部３３を形成してある点が着目される。   In addition, in the present embodiment, as shown in FIG. 3, a resin-made resin is mainly used for covering the spot-welded portion by heat welding between the bump 7 and the copper wire 12 and shielding the portion from moisture, oxygen, and the like. It is noted that the spot coating portion 33 is formed. That is, the resin-made spot coating portion 33 is not covered so as to cover only the spot welded portion between the bump 7 and the copper wire 12 instead of covering the entire IC chip 6 as in the conventional example according to Patent Document 1. Attention is paid to the points formed.

かかるスポットコーティング部３３は、図７に示すごとく、エポキシ樹脂などの各種樹脂３４を、点溶接部分に滴下することによって形成することができる。ＵＶ硬化樹脂を点溶接部分に滴下したうえで、紫外線光を照射することにより、該ＵＶ硬化樹脂を硬化させて、スポットコーティング部３３としてもよい。滴下ではなく、刷毛などを用いて点溶接部分に樹脂を塗布して、スポットコーティング部３３を形成してもよいが、滴下の方が、点溶接部分に対して位置精度良く適量の樹脂３４を乗せることが容易である。実質的に一滴の樹脂３４を滴下するだけであるので、製造作業の大幅な変更を必要とすることなく、作業効率良くスポットコーティング部３３を形成できる点でも優れている。   As shown in FIG. 7, the spot coating portion 33 can be formed by dropping various resins 34 such as an epoxy resin onto the spot welded portion. The UV curable resin may be cured by dropping the UV curable resin onto the spot-welded portion and then irradiating with ultraviolet light to form the spot coating portion 33. The spot coating portion 33 may be formed by applying a resin to the spot welded portion by using a brush or the like instead of dripping. However, in the dripping, an appropriate amount of the resin 34 is applied to the spot welded portion with high positional accuracy. Easy to get on. Since only one drop of the resin 34 is dropped substantially, the spot coating portion 33 can be formed with high work efficiency without requiring a significant change in the manufacturing work.

このように、点溶接部分のみを覆うようなスポットコーティング部３３を形成してあると、当該点溶接部分に水分や酸素が侵入することを確実に防ぐことができるので、加熱溶着により樹脂皮膜１３・１５が除去されて表面に露出した点溶接部分に係る銅線１２が、湿度等の周囲環境の変化によって腐食することを防ぐことができ、したがってＩＣチップ６のバンプ７とアンテナコイル９の良好な電気的接合状態を長期にわたって維持することができる。点溶接部分に係る銅線１２が表面に露出していると、特に、インレットシート２の作製から、該インレットシート２を上下のカバーシート３・５と接合する接合処理までの間に長期のインターバルがあった場合に、露出している銅線１２の部分が腐食しやすいが、このように当該点溶接部分をスポットコーティング部３３で覆ってあると、銅線１２の腐食を確実に防ぐことができるため、バンプ７とアンテナコイル９との間の良好な電気的な接合状態が損なわれる不具合は生じない。また、加熱溶着条件によっては、点溶接部分の下面に存するＩＣチップ６のチップ本体１７を構成するシリコンウエハに、クラックが入ってシリコンウエハが割れやすくなったり、バンプ７にクラックが入ってバンプ７が剥がれやすくなったりすることがあるが、本実施形態のように点溶接部分にスポットコーティング部３３を形成してあると、点溶接部分の強度向上を図ることができるので、上記のようなシリコンウエハの割れやバンプ７の剥がれなどを確実に防ぐことができる点でも優れている。これにて、非接触ＩＣチップ１の製品不良の発生を一掃して、歩留まり率の向上に大いに貢献できる。   Thus, if the spot coating part 33 which covers only a spot-welded part is formed, it can prevent reliably that a water | moisture content and oxygen penetrate | invade into the said spot-welded part, Therefore The resin film 13 is carried out by heat welding. -It is possible to prevent the copper wire 12 related to the spot-welded portion exposed on the surface after removing 15 from being corroded due to changes in the surrounding environment such as humidity, and hence the bump 7 of the IC chip 6 and the antenna coil 9 are good. It is possible to maintain a simple electrical junction state over a long period of time. When the copper wire 12 related to the spot welded portion is exposed on the surface, in particular, a long-term interval between the production of the inlet sheet 2 and the joining process for joining the inlet sheet 2 to the upper and lower cover sheets 3 and 5. In this case, the exposed portion of the copper wire 12 is easily corroded, but if the spot-welded portion is covered with the spot coating portion 33 in this manner, the corrosion of the copper wire 12 can be reliably prevented. Therefore, there is no problem that a good electrical bonding state between the bump 7 and the antenna coil 9 is impaired. Further, depending on the heat welding conditions, the silicon wafer constituting the chip body 17 of the IC chip 6 existing on the lower surface of the spot welded portion is cracked and the silicon wafer is easily broken, or the bump 7 is cracked and the bump 7 However, if the spot coating portion 33 is formed on the spot welded portion as in this embodiment, the strength of the spot welded portion can be improved, so that the silicon as described above can be used. It is also superior in that it can surely prevent wafer breakage and bump 7 peeling. As a result, the occurrence of product defects in the non-contact IC chip 1 can be eliminated, which can greatly contribute to the improvement of the yield rate.

加えて、上記特許文献１に係る従来例のように、ＩＣチップの全体を樹脂によりコーティングする形態では、コーティング層が半球状に盛り上がった形状となるために（特許文献１の図１参照）、インレットシートの厚み寸法がコーティング層の厚み寸法分だけ大きくなることが避けられず、その結果、非接触ＩＣカードの厚み寸法が増加したり、非接触ＩＣカードの大幅な設計変更が必要となるなどの不具合が生じるおそれがあった。非接触ＩＣカード１の薄型化を図るうえでも不利があった。その点本実施形態では、点溶接部分のみを微小なスポットコーティング部３３で覆ったので、当該スポットコーティング部３３を形成したことによる厚み寸法の増加は極めて僅かであり、したがって、上記のような非接触ＩＣカード１の厚み寸法が増加したり、カード１の設計変更が必要となることはない。また、ＩＣチップ６の全体を樹脂で覆う場合に比べて、必要とされる樹脂量は僅かであり、材料コストの増加に伴う製造コストが増加が少なく、安価に高品質なインレット１０、インレットシート２、さらに非接触ＩＣカード１を提供できる利点もある。   In addition, in the form in which the entire IC chip is coated with a resin as in the conventional example according to Patent Document 1, the coating layer has a hemispherical shape (see FIG. 1 of Patent Document 1). It is inevitable that the thickness dimension of the inlet sheet is increased by the thickness dimension of the coating layer. As a result, the thickness dimension of the non-contact IC card is increased or the design of the non-contact IC card needs to be significantly changed. There was a possibility that the problem of. There was a disadvantage in reducing the thickness of the non-contact IC card 1. In that respect, in this embodiment, since only the spot welded portion is covered with the minute spot coating portion 33, the increase in the thickness dimension due to the formation of the spot coating portion 33 is extremely small. There is no need to increase the thickness dimension of the contact IC card 1 or to change the design of the card 1. Compared to the case where the entire IC chip 6 is covered with resin, the amount of resin required is small, and the manufacturing cost accompanying the increase in material cost is small, and the high-quality inlet 10 and inlet sheet are inexpensive. 2. Further, there is an advantage that the non-contact IC card 1 can be provided.

以上のように、点溶接部分に対するスポットコーティング部３３の形成作業を経たインレット１０は、図２に示すごとく、不織布製のシート材１１・１１内に埋設して、インレットシート２の形態とされたのち、上下のカバーシート３・５とともに接着接合される。ここでは、二枚のシート材１１・１１をヒートシール加工により接合して、インレットシート２を作製した。このように、シート材１１として通気性を有する不織布を用いていると、以後の上下カバーシート３・５との接合作業に用いられる接着剤が、該不織布を介して万遍無く広がり、上下カバーシート３・５の内面どうしを、一層の接着剤層を介して一体化できる。これによれば、インレットシート２を樹脂シートとして（換言すればシート材として樹脂を用いて）、該樹脂製のインレットシートの表裏面に塗布された接着剤により、上下カバーシートとインレットシートとを接合する形態に比べて、３つのシート２・３・５の接合強度の格段の向上を図ることができて有利である。   As described above, the inlet 10 that has undergone the formation work of the spot coating portion 33 with respect to the spot welded portion is embedded in the non-woven sheet material 11 and 11 as shown in FIG. After that, it is bonded together with the upper and lower cover sheets 3 and 5. Here, the two sheet | seat materials 11 * 11 were joined by heat sealing process, and the inlet sheet 2 was produced. In this way, when a non-woven fabric having air permeability is used as the sheet material 11, the adhesive used for the subsequent joining operation with the upper and lower cover sheets 3 and 5 spreads uniformly through the nonwoven fabric, and the upper and lower covers The inner surfaces of the sheets 3 and 5 can be integrated through one adhesive layer. According to this, the inlet sheet 2 is used as a resin sheet (in other words, a resin is used as a sheet material), and the upper and lower cover sheets and the inlet sheet are bonded by the adhesive applied to the front and back surfaces of the resin inlet sheet. Compared to the form of joining, it is advantageous that the joining strength of the three sheets 2, 3, 5 can be remarkably improved.

（第２実施形態）
図８は、本発明をＩＣタグに適用した第２実施形態を示す。ここでのＩＣタグ４０は、紙製のシート状の基体４１内に、インレット１０を埋設してなるものである。インレット１０は、ＩＣチップ（情報記録担体）６のバンプ７に、アンテナコイル（金属配線）９を加熱圧着接合してなる。 (Second Embodiment)
FIG. 8 shows a second embodiment in which the present invention is applied to an IC tag. Here, the IC tag 40 is formed by embedding the inlet 10 in a sheet-like base 41 made of paper. The inlet 10 is formed by thermocompression bonding an antenna coil (metal wiring) 9 to a bump 7 of an IC chip (information record carrier) 6.

アンテナコイル９は、図４に示すような、銅線（金属線状体）１２の外周面のまわりを、中層としてのポリウレタン樹脂皮膜１３と、外層としてのポリエステル樹脂皮膜１５とで被覆してなる多層構造のアンテナ線１６を、図８に示すごとくＩＣチップ６を囲むような四角形の多重巻線状に配してなるものである。そして、これらバンプ７と銅線１２との加熱溶着による点溶接部分を覆い、当該部分を水分や酸素等から遮断することを主目的として、樹脂製のスポットコーティング部３３を形成した。   The antenna coil 9 is formed by coating a periphery of a copper wire (metal linear body) 12 as shown in FIG. 4 with a polyurethane resin film 13 as an intermediate layer and a polyester resin film 15 as an outer layer. The antenna wire 16 having a multilayer structure is arranged in a quadrangular multiple winding shape surrounding the IC chip 6 as shown in FIG. Then, a spot coating portion 33 made of resin was formed mainly for the purpose of covering the spot welded portion by heat welding of the bump 7 and the copper wire 12 and shielding the portion from moisture, oxygen and the like.

インレット１０の作製方法、およびスポットコーティング部３３の形成方法は、先の図５ないし図７に示したとおりである。すなわち、図６に示すごとく、ＩＣチップ６のバンプ７上にアンテナコイル９の端部１６ａ・１６ｂを載置したうえで、アンテナコイル９の上方からボンディング装置のボンドヘッド３０を加熱圧着することにより、加熱圧着部分に係る樹脂皮膜１３・１５を昇華除去して銅線１２を露出させるとともに、銅線１２の表面部分とバンプ７の接合面（上面）の一部を溶かして、両者（銅線１２とバンプ７）を不離一体的に接合させた。また、図７に示すごとく、エポキシ樹脂などの各種樹脂３４を、点溶接部分に滴下することによってスポットコーティング部３３を形成した。   The method for manufacturing the inlet 10 and the method for forming the spot coating portion 33 are as shown in FIGS. That is, as shown in FIG. 6, the end portions 16 a and 16 b of the antenna coil 9 are placed on the bumps 7 of the IC chip 6, and then the bonding head 30 of the bonding apparatus is thermocompression bonded from above the antenna coil 9. The resin coatings 13 and 15 relating to the thermocompression bonding portion are sublimated and removed to expose the copper wire 12, and the surface portion of the copper wire 12 and a part of the bonding surface (upper surface) of the bump 7 are melted. 12 and the bumps 7) were joined to each other. Moreover, as shown in FIG. 7, the spot coating part 33 was formed by dripping various resin 34, such as an epoxy resin, to a spot welding part.

紙製の基体４１内にインレット１０を埋設する場合において、点溶接部分の金属線状体１２が樹脂で覆われておらず表面に露出していると、紙を通った水分等により金属線状体１２腐食して、バンプ７との良好な電気的な接合状態が損なわれるおそれがある。その点、本実施形態のように点溶接部分をスポットコーティング部３３で覆ってあると、水分や酸素等が基体４１内に浸入した場合でも、これらが点溶接部分に至ることがなく、金属線状体１２の腐食を確実に防ぐことができる。これにて、紙製の基体４１に対してインレット１０を別途防水加工等を施すことなく埋設することが可能となり、信頼性の高いＩＣタグ４０を安価に提供することが可能となる。   In the case where the inlet 10 is embedded in the paper base 41, if the metal linear body 12 of the spot welded portion is not covered with the resin and exposed on the surface, the metal linear shape is caused by moisture or the like that has passed through the paper. The body 12 is corroded, and there is a possibility that a good electrical bonding state with the bump 7 is impaired. In that respect, when the spot-welded portion is covered with the spot coating portion 33 as in the present embodiment, even when moisture, oxygen, or the like enters the base body 41, these do not reach the spot-welded portion. Corrosion of the state body 12 can be reliably prevented. This makes it possible to embed the inlet 10 in the paper base 41 without separately performing waterproofing or the like, and to provide a highly reliable IC tag 40 at a low cost.

加えて、点溶接部分のみを微小なスポットコーティング部３３で覆ったので、特許文献１のように、ＩＣチップの全体を樹脂で覆う形態に比べて、インレット１０の厚み寸法の増加は極めて僅かで済む。したがって、ＩＣチップ６の存する部分が異常に盛り上がったり、ＩＣタグ４０の全体の厚み寸法が増加したりするようなことはない。また、ＩＣチップ６の全体を樹脂で覆う場合に比べて、必要とされる樹脂量は僅かであり、材料コストの増加に伴う製造コストが増加が少なく、高品質かつ信頼性の高いＩＣタグ４０を安価に提供できる利点もある。   In addition, since only the spot welded portion is covered with the minute spot coating portion 33, the increase in the thickness dimension of the inlet 10 is very small compared to the case where the entire IC chip is covered with resin as in Patent Document 1. That's it. Therefore, the portion where the IC chip 6 exists does not rise abnormally, and the overall thickness dimension of the IC tag 40 does not increase. Further, compared to the case where the entire IC chip 6 is covered with resin, the amount of resin required is small, the manufacturing cost accompanying the increase in material cost is small, and the IC tag 40 is of high quality and high reliability. Can also be provided at low cost.

スポットコーティング部３３を構成する樹脂は、上記実施形態に挙げたエポキシ樹脂等に限られず、公知の各種樹脂を採用できる。金属線状体１２を覆う樹脂皮膜は、二層に限られず、一層であってもよく、さらに樹脂皮膜の樹脂の種別は、上述したものに限られない。   The resin constituting the spot coating portion 33 is not limited to the epoxy resin and the like listed in the above embodiment, and various known resins can be employed. The resin film covering the metal linear body 12 is not limited to two layers, and may be a single layer, and the type of resin of the resin film is not limited to the above.

本発明が適用されたインレットシートの平面図Plan view of an inlet sheet to which the present invention is applied 本発明が適用されたインレットシートと、該インレットシートが組み込まれた非接触ＩＣカードの斜視図An inlet sheet to which the present invention is applied and a perspective view of a non-contact IC card in which the inlet sheet is incorporated 図１のＡ−Ａ線断面図AA line sectional view of FIG. アンテナ線１６の縦断正面図Longitudinal front view of antenna wire 16 アンテナコイルの作製方法を説明するための図Diagram for explaining a method for manufacturing an antenna coil ＩＣチップのバンプに対するアンテナコイルの加熱溶着作業を説明するための図The figure for explaining the heat welding operation of the antenna coil to the bump of the IC chip スポットコーティング部の形成方法を説明するための図The figure for demonstrating the formation method of a spot coating part 本発明が適用されたＩＣタグの平面図Plan view of an IC tag to which the present invention is applied 従来のＩＣチップのバンプに対するアンテナ線の接合構造を示す図The figure which shows the joining structure of the antenna line with respect to the bump of the conventional IC chip 図９のＢ−Ｂ線断面図BB sectional view of FIG.

符号の説明Explanation of symbols

６ 情報記録担体（ＩＣチップ）
７ バンプ
９ 金属配線（アンテナコイル）
１２ 金属線状体（銅線）
１３ 皮膜（ポリウレタン樹脂皮膜）
１５ 皮膜（ポリエステル樹脂皮膜）
３３ スポットコーティング部
３４ 樹脂 6 Information record carrier (IC chip)
7 Bump 9 Metal wiring (antenna coil)
12 Metal wire (copper wire)
13 Film (Polyurethane resin film)
15 Film (Polyester resin film)
33 Spot coating part 34 Resin

Claims (3)

情報記録担体の表面に形成されたバンプと、該バンプに加熱圧着接合される金属配線とからなり、
これらバンプと金属配線との加熱圧着による点溶接部分が、樹脂製のスポットコーティング部で覆われていることを特徴とする情報記録担体と金属配線との接合構造。 It consists of bumps formed on the surface of the information record carrier, and metal wiring that is thermocompression bonded to the bumps,
A junction structure between an information recording carrier and a metal wiring, characterized in that a spot-welded portion by thermocompression bonding between the bump and the metal wiring is covered with a resin spot coating portion. 情報記録担体の表面に形成されたバンプと、該バンプに加熱圧着接合される金属配線とからなり、
金属配線は、金属線状体の表面を樹脂皮膜でコーティングしてなるものであり、
バンプ上に金属配線を載置した状態で、該金属配線に対して加熱圧着処理を施すことにより、該加熱圧着部分に係る樹脂皮膜が除去されて金属線状体が露出されるとともに、該露出部分に係る金属線状体の表面部分とバンプの接合面の一部が溶けることで、両者が不離一体的に点溶接されており、
前記点溶接部分に係るバンプと金属線状体の全体が、樹脂製のスポットコーティング部で覆われていることを特徴とする情報記録担体と金属配線との接合構造。 It consists of bumps formed on the surface of the information record carrier, and metal wiring that is thermocompression bonded to the bumps,
The metal wiring is formed by coating the surface of the metal linear body with a resin film,
In a state where the metal wiring is placed on the bump, the metal wiring is subjected to a thermocompression treatment, whereby the resin film relating to the thermocompression bonding portion is removed to expose the metal linear body, and the exposure By melting part of the surface part of the metal linear body related to the part and the joint surface of the bump, both are inseparably spot welded,
A joint structure between an information recording carrier and a metal wiring, wherein the bump and the metal linear body related to the spot welded portion are entirely covered with a resin spot coating portion. 金属線状体の表面を樹脂皮膜でコーティングしてなる金属配線を、情報記録担体のバンプ上に載置する工程と、
前記金属配線に対して上方より加熱圧着処理を施すことにより、該加熱圧着部分に係る樹脂皮膜を昇華除去して前記金属線状体を露出させるとともに、該露出部分に係る金属線状体の表面部分とバンプの接合面の一部を溶かして、両者を不離一体的に点溶接する工程と、
前記点溶接部分に係るバンプと金属線状体に向けて樹脂を滴下することにより、該点溶接部分の全体を覆うスポットコーティング部を形成する工程とを含むことを特徴とする情報記録担体と金属配線との接合方法。 Placing the metal wiring formed by coating the surface of the metal linear body with a resin film on the bumps of the information record carrier; and
By subjecting the metal wiring to a thermocompression bonding process from above, the resin film relating to the thermocompression bonding portion is sublimated to expose the metal linear body, and the surface of the metal linear body relating to the exposed portion Melting a part of the joint surface of the part and the bump, and performing spot welding of the two in an integral manner;
Forming a spot coating portion covering the entire spot-welded portion by dripping a resin toward the bump and the metal linear body related to the spot-welded portion, and an information recording carrier and a metal Bonding method with wiring.
JP2005008324A 2005-01-14 2005-01-14 Structure and method for bonding information recording carrier and metal wiring Withdrawn JP2006195842A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7828222B2 (en) 2008-12-11 2010-11-09 Samsung Electronics Co., Ltd. Radio frequency identifier tag and method of fabrication
CN103447705A (en) * 2013-06-06 2013-12-18 东莞市曙光自动化设备科技有限公司 Method for welding chip on double-interface card
WO2016006405A1 (en) * 2014-07-09 2016-01-14 Ｄｏｗａエレクトロニクス株式会社 Rfid tag substrate including paper base, and rfid tag

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7828222B2 (en) 2008-12-11 2010-11-09 Samsung Electronics Co., Ltd. Radio frequency identifier tag and method of fabrication
CN103447705A (en) * 2013-06-06 2013-12-18 东莞市曙光自动化设备科技有限公司 Method for welding chip on double-interface card
CN103447705B (en) * 2013-06-06 2015-11-25 广东曙光自动化设备股份有限公司 Double-interface card welding chip method
WO2016006405A1 (en) * 2014-07-09 2016-01-14 Ｄｏｗａエレクトロニクス株式会社 Rfid tag substrate including paper base, and rfid tag
CN106663214A (en) * 2014-07-09 2017-05-10 同和电子科技有限公司 RFID tag substrate including paper base, and RFID tag

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