CN103447705B - Double-interface card welding chip method - Google Patents
Double-interface card welding chip method Download PDFInfo
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- CN103447705B CN103447705B CN201310224672.6A CN201310224672A CN103447705B CN 103447705 B CN103447705 B CN 103447705B CN 201310224672 A CN201310224672 A CN 201310224672A CN 103447705 B CN103447705 B CN 103447705B
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Abstract
The invention discloses a kind of double-interface card welding chip method, described double-interface card is built-in with a wire, two aerial heads that described wire has are respectively first aerial head and second aerial head, and described first aerial head and described second aerial head are all positioned at the chip slot of described double-interface card; The two ends of the first wire are respectively first end and the second end, and the two ends of the second wire are respectively the 3rd end and the 4th end, comprise the following steps: S1: described first end welds with described first aerial head, and described 3rd end welds with described second aerial head; S2: described second end welds with the first predetermined solder joint of chip, described 4th end welds with the second predetermined solder joint of described chip.Implement double-interface card welding chip method of the present invention, have following beneficial effect: production efficiency is higher, cost is lower.
Description
Technical field
The present invention relates to smart card and manufacture field, more particularly, relate to a kind of double-interface card welding chip method.
Background technology
The manufacturing process of double-interface card comprises the process of double-interface card welding chip.In prior art, the method for double-interface card welding chip is generally divided into following three kinds:
1, butt-joint.First aerial head adopts the method adding tin welding to be welded on the first predetermined solder joint of chip, and second aerial head also adopts the method adding tin welding to be welded on the second predetermined solder joint of chip.Shortcoming: extra introducing intermediate material tin, operation comparatively bothers, and cost is higher.
2, be coupled.Coil coupling in chip coil and chip slot.Shortcoming: cost is the highest in these three kinds of methods.
3, sheet metal welding.In chip slot, arrange two panels tin sheet or two panels copper sheet, the first predetermined solder joint of chip welds with first tin sheet, and the second predetermined solder joint of chip welds with second tin sheet.Shortcoming: weld connects built on the sand, and make loaded down with trivial details, need man-hour longer, cost is high.
To sum up, there is the defect that process is more complicated, cost is higher in the method for double-interface card welding chip of the prior art.
Summary of the invention
The technical problem to be solved in the present invention is, the method for the above-mentioned double-interface card welding chip of prior art exists the defect that process is more complicated, cost is higher, provides a kind of process simpler, lower-cost double-interface card welding chip method.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of double-interface card welding chip method,
Described double-interface card is built-in with a wire, and two aerial heads that described wire has are respectively first aerial head and second aerial head, and described first aerial head and described second aerial head are all positioned at the chip slot of described double-interface card; The two ends of the first wire are respectively first end and the second end, and the two ends of the second wire are respectively the 3rd end and the 4th end, comprise the following steps:
S1: described first end welds with described first aerial head, described 3rd end welds with described second aerial head;
S2: described second end welds with the first predetermined solder joint of chip, described 4th end welds with the second predetermined solder joint of described chip.
In double-interface card welding chip method of the present invention, further comprising the steps of S1.1 before described step S1: groove milling goes out described chip slot on described double-interface card, exposes described first aerial head and described second aerial head in described chip slot.
In double-interface card welding chip method of the present invention, further comprising the steps of S1.2 between described step S1.1 and described step S1: choose described first aerial head and described second aerial head respectively.
In double-interface card welding chip method of the present invention, further comprising the steps of S1.3 between described step S1.2 and described step S1: mill out the boss slot matched with the boss of described chip in described chip slot.
In double-interface card welding chip method of the present invention, in described step S1, butt-welding machine is adopted to carry out welding of welding of described first end and described first aerial head and described 3rd end and described second aerial head respectively.
In double-interface card welding chip method of the present invention, further comprising the steps of S3 after described step S2: by chip slot described in described implanted chip.
In double-interface card welding chip method of the present invention, the length of described first wire and described second wire is all between 0.5-5 centimetre.
In double-interface card welding chip method of the present invention, the length of described first wire and described second wire is all between 0.9-2 centimetre.
Implement double-interface card welding chip method of the present invention, have following beneficial effect: production efficiency is higher, cost is lower.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the program flow diagram of double-interface card welding chip embodiment of the method for the present invention;
Fig. 2 is the structural representation having welded chip in double-interface card welding chip embodiment of the method for the present invention;
Fig. 3 is the structural representation after implanting chip in double-interface card welding chip embodiment of the method for the present invention.
Detailed description of the invention
In order to there be understanding clearly to technical characteristic of the present invention, object and effect, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
The cardinal principle of the present embodiment is the predetermined solder joint with the aerial head in conductor connecting core sheet slot and chip.This method does not quote intermediate material (being such as tin), and production efficiency is higher, and cost is low.
The two ends of the first wire 1 are respectively first end and the second end, and the two ends of the second wire 2 are respectively the 3rd end and the 4th end; The first wire 1 herein and the second wire 2 are two copper cash, and both also can be other wires in other embodiments certainly, such as, be silver-colored line.
Double-interface card is built-in with a wire, and two aerial heads that wire has are respectively the chip slot 3 that first aerial head 4 and second aerial head, 5, first aerial head 4 and second aerial head 5 are all positioned at double-interface card.
Usually, first aerial head 4 in double-interface card chip slot 3 and the length of second aerial head 5 all shorter, both length generally all only has 1-3 centimetre, so just cause the more difficult operation of method of butt-joint welding chip 7 of the prior art, because the length of first aerial head 4 and second aerial head 5 is all shorter, the operating space so just causing equipment during butt-joint is very little, not only make the precision requirement of butt-joint equipment higher (correspondingly increasing the cost of butt-joint equipment), also make production efficiency lower; In addition, the method for butt-joint welding chip 7 of the prior art also needs to use tin, too increases cost, reduces efficiency.
The double-interface card welding chip method of the present embodiment efficiently solves the problems referred to above.Preferably, first wire 1 and second wire 2 of the present embodiment, both length is all between 0.5-5 centimetre, and more preferably both length is all between 0.9-2 centimetre; Make the operating space of equipment during butt-joint comparatively large like this, butt-joint equipment is easier to layout, and the cost of butt-joint equipment is lower.Certainly, in certain embodiments, the first wire 1 and the length both the second wire 2 also can be other numerical value.In the present embodiment, the first wire 1 and the second wire 2 are all 1 centimetre, and certainly in other embodiments, both length also can be 0.5 centimetre, 0.9 centimetre, 2 centimetres, 5 centimetres etc., and other is between the numerical value of 0.5-5 centimetre, and other is identical with the present embodiment.
As shown in Figure 1, Figure 3.The double-interface card welding chip method of the present embodiment, comprises the following steps:
S1: first end welds with first aerial head 4, the 3rd end welds with second aerial head 5.
Butt-welding machine is adopted to carry out welding of welding of first end and first aerial head 4 and the 3rd end and second aerial head 5 respectively, do not need during welding to use tin, the weld part that first end and first aerial head 4 are placed in butt-welding machine is welded, it is the partial melting first end during welding, and the partial melting of first aerial head 4, both melt portions contacts, both parts of fusing are just integrated after cooling, weld successfully.In order to ensure the weld strength of first end and first aerial head 4, preferably, the first end length of welding with first aerial head 4 is between 1-8 millimeter; Equally, in order to ensure the weld strength of the 3rd end and second aerial head 5, preferably, the length that the 3rd end welds with second aerial head 5 is also between 1-8 millimeter.
S2: the second end welds with the first predetermined solder joint 73 of chip 7, and the 4th end welds with the second predetermined solder joint 74 of chip 7.
In certain embodiments; welding manner, the 4th end of the welding manner of the welding manner of first end and first aerial head 4, the 3rd end and second aerial head 5, the second end and the first predetermined solder joint 73 also all can adopt electric iron to weld, add tin welding, butt-joint or use the welding manners such as conducting resinl welding with the welding manner of the second predetermined solder joint 74, and these all belong within protection scope of the present invention.The present embodiment mainly utilizes line wire bonding to fetch welding chip, also namely aerial head (first aerial head 4 and second aerial head 5) and predetermined solder joint (first predetermined solder joint 73 and the second predetermined solder joint 74) is connected by wire (the first wire 1 and the second wire 2), thus welding chip.
Chip 7 generally in square, connects a predetermined solder joint in foursquare every outside, and also namely chip 7 surrounding is evenly equipped with 4 predetermined solder joints; In these 4 predetermined solder joints, relative predetermined solder joint is one group, and one of them solder joint is positive pole solder joint, another solder joint is negative pole solder joint; Namely chip 7 has two groups of predetermined solder joints.The first predetermined solder joint 73 of the present embodiment and the second predetermined solder joint 74 are wherein one group, and solder joint is positive pole solder joint, another solder joint is negative pole solder joint.
Further comprising the steps of S1.1 before step S1: groove milling knockout sheet slot 3 on double-interface card, exposes first aerial head 4 and second aerial head 5 in chip slot 3.It should be noted that, first aerial head 4 now and second aerial head 5 are embedded the bottom in chip slot 3.
Further comprising the steps of S1.2 between step S1.1 and step S1: choose first aerial head 4 and second aerial head 5 respectively.The above-mentioned operation choosing aerial head can manually be carried out, and also can carry out by machinery; Manually carrying out is the cuspidated take-up part of hand-held tool, chooses first aerial head 4 and second aerial head 5 respectively by the tip of take-up part; Machinery carries out being choose first aerial head 4 and second aerial head 5 respectively by mechanical tong.
Further comprising the steps of S1.3 between step S1.2 and step S1: mill out the boss slot 6 matched with the boss 72 of chip 7 in chip slot 3.Chip 7 comprises main body 71, the surface of main body 71 is provided with boss 72, and the surface area of main body 71 is greater than the surface area of boss 72; At uniform 4 the predetermined solder joints of the periphery of main body 71.In step S1.3, be on the diapire of chip slot 3, mill out boss slot 6, shape, the size of boss slot 6 all match with boss 72; The operation of milling boss slot 6 can be undertaken by milling head.
Further comprising the steps of S3 after step S2: chip 7 is implanted in chip slot 3.Shown in Fig. 3 be chip 7 is implanted in chip slot 3 after structural representation.What method chip 7 being implanted chip slot 3 can adopt prior art conventional puts into chip slot 3, presses chip 7 to make the steps such as its embedded core sheet slot 3, hot weld and cold welding by chip 7.Chip 7 is implanted in the process in chip slot 3, should guarantee that the first wire 1, second wire 2, first aerial head 4 and second aerial head 5 all do not expose, all be positioned at chip slot 3.After chip 7 implants chip slot 3, the boss 72 of chip 7 is positioned at boss slot 6, and the main body 71 of chip 7 is positioned at chip slot 3.
Compared with the method for three kinds of double-interface card welding chips of the prior art, through test comparison, the double-interface card welding chip method of the present embodiment can improve the production efficiency of 20-50%, can reduce the cost of 13-28% simultaneously.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned detailed description of the invention; above-mentioned detailed description of the invention is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (8)
1. a double-interface card welding chip method, described double-interface card is built-in with a wire, two aerial heads that described wire has are respectively first aerial head and second aerial head, and described first aerial head and described second aerial head are all positioned at the chip slot of described double-interface card; The two ends of the first wire are respectively first end and the second end, and the two ends of the second wire are respectively the 3rd end and the 4th end, it is characterized in that, comprise the following steps:
S1: described first end welds with described first aerial head, described 3rd end welds with described second aerial head;
S2: described second end welds with the first predetermined solder joint of chip, described 4th end welds with the second predetermined solder joint of described chip.
2. double-interface card welding chip method according to claim 1, it is characterized in that, further comprising the steps of S1.1 before described step S1: groove milling goes out described chip slot on described double-interface card, exposes described first aerial head and described second aerial head in described chip slot.
3. double-interface card welding chip method according to claim 2, is characterized in that, further comprising the steps of S1.2 between described step S1.1 and described step S1: choose described first aerial head and described second aerial head respectively.
4. double-interface card welding chip method according to claim 3, is characterized in that, further comprising the steps of S1.3 between described step S1.2 and described step S1: in described chip slot, mill out the boss slot matched with the boss of described chip.
5. double-interface card welding chip method according to claim 1, it is characterized in that, in described step S1, butt-welding machine is adopted to carry out welding of welding of described first end and described first aerial head and described 3rd end and described second aerial head respectively.
6. double-interface card welding chip method according to claim 1, is characterized in that, further comprising the steps of S3 after described step S2: by chip slot described in described implanted chip.
7. double-interface card welding chip method according to claim 1, is characterized in that, the length of described first wire and described second wire is all between 0.5-5 centimetre.
8. double-interface card welding chip method according to claim 1, is characterized in that, the length of described first wire and described second wire is all between 0.9-2 centimetre.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310224672.6A CN103447705B (en) | 2013-06-06 | 2013-06-06 | Double-interface card welding chip method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310224672.6A CN103447705B (en) | 2013-06-06 | 2013-06-06 | Double-interface card welding chip method |
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| CN103447705A CN103447705A (en) | 2013-12-18 |
| CN103447705B true CN103447705B (en) | 2015-11-25 |
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| CN109214494B (en) * | 2018-10-25 | 2021-07-09 | 上海东方磁卡信息股份有限公司 | Contactless smart card and method for manufacturing same |
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| CN102114578A (en) * | 2010-12-27 | 2011-07-06 | 上海一芯智能科技有限公司 | Antenna welding process of non-contact intelligent card |
| CN102930329A (en) * | 2012-10-18 | 2013-02-13 | 中电智能卡有限责任公司 | Double-interfaced card packaging method and take-up clamp thereof |
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| JP2006195842A (en) * | 2005-01-14 | 2006-07-27 | Hitachi Maxell Ltd | Structure and method for bonding information recording carrier and metal wiring |
| EP1914828A1 (en) * | 2005-07-29 | 2008-04-23 | Beijing Watch Data System Co. Ltd. | Antenna for use with plug-in type dual-interface smart card |
| CN102035120A (en) * | 2009-09-25 | 2011-04-27 | 凸版印刷(上海)有限公司 | Current pulse parallel spot-welding connecting method for double-interface card |
| CN102024176A (en) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | Manufacturing method of double-interface smart card |
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Address after: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Applicant after: Guangdong dawn automation equipment limited company Address before: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Applicant before: Sunrise Technology Co., Ltd. |
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Inventor after: Xiong Shuguang Inventor after: Liao Jinwen Inventor before: Xiong Shuguang |
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Address after: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee after: Guangdong Jingyi Polytron Technologies Inc Address before: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee before: Guangdong dawn automation equipment limited company |