JP2006185986A5 - - Google Patents

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Publication number
JP2006185986A5
JP2006185986A5 JP2004375530A JP2004375530A JP2006185986A5 JP 2006185986 A5 JP2006185986 A5 JP 2006185986A5 JP 2004375530 A JP2004375530 A JP 2004375530A JP 2004375530 A JP2004375530 A JP 2004375530A JP 2006185986 A5 JP2006185986 A5 JP 2006185986A5
Authority
JP
Japan
Prior art keywords
hole
forming
inclined surface
punching
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004375530A
Other languages
English (en)
Japanese (ja)
Other versions
JP4422603B2 (ja
JP2006185986A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004375530A priority Critical patent/JP4422603B2/ja
Priority claimed from JP2004375530A external-priority patent/JP4422603B2/ja
Publication of JP2006185986A publication Critical patent/JP2006185986A/ja
Publication of JP2006185986A5 publication Critical patent/JP2006185986A5/ja
Application granted granted Critical
Publication of JP4422603B2 publication Critical patent/JP4422603B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004375530A 2004-12-27 2004-12-27 配線基板の製造方法 Expired - Fee Related JP4422603B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004375530A JP4422603B2 (ja) 2004-12-27 2004-12-27 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004375530A JP4422603B2 (ja) 2004-12-27 2004-12-27 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2006185986A JP2006185986A (ja) 2006-07-13
JP2006185986A5 true JP2006185986A5 (enExample) 2009-03-19
JP4422603B2 JP4422603B2 (ja) 2010-02-24

Family

ID=36738897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004375530A Expired - Fee Related JP4422603B2 (ja) 2004-12-27 2004-12-27 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP4422603B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817781B2 (ja) * 2005-09-28 2011-11-16 三洋電機株式会社 電子部品用パッケージの製造方法
US7871842B2 (en) 2008-10-03 2011-01-18 E. I. Du Pont De Nemours And Company Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
JP4759062B2 (ja) * 2009-01-15 2011-08-31 トヨタ自動車株式会社 ターボチャージャおよびターボチャージャの製造方法

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