JP2006185986A5 - - Google Patents
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- Publication number
- JP2006185986A5 JP2006185986A5 JP2004375530A JP2004375530A JP2006185986A5 JP 2006185986 A5 JP2006185986 A5 JP 2006185986A5 JP 2004375530 A JP2004375530 A JP 2004375530A JP 2004375530 A JP2004375530 A JP 2004375530A JP 2006185986 A5 JP2006185986 A5 JP 2006185986A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- forming
- inclined surface
- punching
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
上記グリーンシートの貫通孔内に、金型の傾斜した面を有する凸部を進入させて、上記貫通孔を上記傾斜した面と相似形に成形する工程と、を含む、
ことを特徴とする配線基板の製造方法。 For one or more green sheets, a step of forming a through hole by punching,
A step of allowing a convex portion having an inclined surface of a mold to enter into the through hole of the green sheet, and forming the through hole in a shape similar to the inclined surface .
A method of manufacturing a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004375530A JP4422603B2 (en) | 2004-12-27 | 2004-12-27 | Wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004375530A JP4422603B2 (en) | 2004-12-27 | 2004-12-27 | Wiring board manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006185986A JP2006185986A (en) | 2006-07-13 |
| JP2006185986A5 true JP2006185986A5 (en) | 2009-03-19 |
| JP4422603B2 JP4422603B2 (en) | 2010-02-24 |
Family
ID=36738897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004375530A Expired - Fee Related JP4422603B2 (en) | 2004-12-27 | 2004-12-27 | Wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4422603B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817781B2 (en) * | 2005-09-28 | 2011-11-16 | 三洋電機株式会社 | Manufacturing method of electronic component package |
| US7871842B2 (en) | 2008-10-03 | 2011-01-18 | E. I. Du Pont De Nemours And Company | Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package |
| JP4759062B2 (en) * | 2009-01-15 | 2011-08-31 | トヨタ自動車株式会社 | Turbocharger and method of manufacturing turbocharger |
-
2004
- 2004-12-27 JP JP2004375530A patent/JP4422603B2/en not_active Expired - Fee Related
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