JP2006181641A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006181641A5 JP2006181641A5 JP2005332752A JP2005332752A JP2006181641A5 JP 2006181641 A5 JP2006181641 A5 JP 2006181641A5 JP 2005332752 A JP2005332752 A JP 2005332752A JP 2005332752 A JP2005332752 A JP 2005332752A JP 2006181641 A5 JP2006181641 A5 JP 2006181641A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- processing chamber
- pressure
- gas
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007789 gas Substances 0.000 claims 18
- 238000004140 cleaning Methods 0.000 claims 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 6
- 150000007524 organic acids Chemical class 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 239000011261 inert gas Substances 0.000 claims 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 2
- 235000019253 formic acid Nutrition 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 1
- 239000005751 Copper oxide Substances 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910000431 copper oxide Inorganic materials 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005332752A JP2006181641A (ja) | 2004-12-02 | 2005-11-17 | 接合装置及び接合方法 |
| US11/291,838 US20060118598A1 (en) | 2004-12-02 | 2005-12-02 | Bonding apparatus and bonding method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004349454 | 2004-12-02 | ||
| JP2005332752A JP2006181641A (ja) | 2004-12-02 | 2005-11-17 | 接合装置及び接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006181641A JP2006181641A (ja) | 2006-07-13 |
| JP2006181641A5 true JP2006181641A5 (https=) | 2007-07-19 |
Family
ID=36573079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005332752A Withdrawn JP2006181641A (ja) | 2004-12-02 | 2005-11-17 | 接合装置及び接合方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20060118598A1 (https=) |
| JP (1) | JP2006181641A (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008155245A (ja) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Works Ltd | 接合方法 |
| JP5263923B2 (ja) * | 2007-11-29 | 2013-08-14 | 国立大学法人 新潟大学 | 拡散接合方法及びその装置 |
| JP5424201B2 (ja) * | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
| RU2397053C1 (ru) * | 2009-09-11 | 2010-08-20 | Открытое акционерное общество "Научно-исследовательский институт физических измерений" | Установка для диффузионной сварки |
| KR101073558B1 (ko) * | 2009-10-08 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 기판 합착 장치 및 기판 합착 방법 |
| JP2012227328A (ja) | 2011-04-19 | 2012-11-15 | Sony Corp | 半導体装置、半導体装置の製造方法、固体撮像装置及び電子機器 |
| TW201301413A (zh) * | 2011-06-20 | 2013-01-01 | 華新麗華股份有限公司 | 晶片結合設備 |
| TW201301412A (zh) * | 2011-06-20 | 2013-01-01 | 華新麗華股份有限公司 | 晶片結合方法 |
| WO2013161875A1 (ja) * | 2012-04-25 | 2013-10-31 | オリジン電気株式会社 | 半田付け装置及び半田付け製品の製造方法 |
| SG2014013015A (en) * | 2012-05-30 | 2014-08-28 | Ev Group E Thallner Gmbh | Device and method for bonding of substrates |
| JP2014188536A (ja) * | 2013-03-26 | 2014-10-06 | National Institute For Materials Science | 金属材の拡散接合方法および金属材の拡散接合装置 |
| US9576928B2 (en) * | 2015-02-27 | 2017-02-21 | Kulicke And Soffa Industries, Inc. | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same |
| JP6304189B2 (ja) * | 2015-10-15 | 2018-04-04 | トヨタ自動車株式会社 | エンジンの燃料噴射制御装置 |
| MX2018010985A (es) * | 2016-03-17 | 2019-05-06 | Jcu Corp | Dispositivo generador de plasma. |
| RU2646517C1 (ru) * | 2017-02-02 | 2018-03-05 | Закрытое акционерное общество "Элитрон" | Установка для диффузионной сварки |
| RU2680170C1 (ru) * | 2017-11-15 | 2019-02-18 | ООО "Авиационно-космические технологии" | Устройство диффузионной сварки |
| CN109802030B (zh) * | 2019-01-25 | 2020-02-21 | 楼显华 | 一种led元件及其生产方法 |
| KR102707392B1 (ko) * | 2019-04-29 | 2024-09-20 | 삼성전자주식회사 | 접합헤드 및 이를 구비하는 접합 장치 |
| JP6879482B1 (ja) * | 2020-01-09 | 2021-06-02 | 株式会社オリジン | 酸化物除去済部材の製造方法及び酸化物除去装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5516031A (en) * | 1991-02-19 | 1996-05-14 | Hitachi, Ltd. | Soldering method and apparatus for use in connecting electronic circuit devices |
| US5271545A (en) * | 1993-03-31 | 1993-12-21 | Seco/Warwick Corporation | Muffle convection brazing/annealing system |
| US5573174A (en) * | 1994-08-15 | 1996-11-12 | Pekol; Robert | Automatic reflow soldering system |
| JP3693441B2 (ja) * | 1996-12-27 | 2005-09-07 | 富士通株式会社 | 記録媒体の製造方法 |
| US6152353A (en) * | 1999-01-14 | 2000-11-28 | Celestica International Inc. | Printed circuit board header attachment station |
| JP3397313B2 (ja) * | 1999-12-20 | 2003-04-14 | 富士通株式会社 | 半導体装置の製造方法及び電子部品の実装方法 |
| US7296727B2 (en) * | 2001-06-27 | 2007-11-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic components |
| US6806118B2 (en) * | 2002-02-07 | 2004-10-19 | Fujitsu Limited | Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure |
-
2005
- 2005-11-17 JP JP2005332752A patent/JP2006181641A/ja not_active Withdrawn
- 2005-12-02 US US11/291,838 patent/US20060118598A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006181641A5 (https=) | ||
| NO20071913L (no) | Fremgangsmate for lavdeformasjon diffusjonssveising av sintrete uoksiderte keramiske komponenter, og strukturer bestaende av uoksidert keramikk med en somlos sammenfoyning | |
| GB2408737A (en) | Method of removing organic impurities from water | |
| JP2005529833A5 (https=) | ||
| TW201130019A (en) | In vacuum optical wafer heater for cryogenic processing | |
| JP2015193864A5 (ja) | 半導体装置の製造方法、基板処理装置、およびプログラム | |
| JP2011514669A5 (https=) | ||
| JP2012138500A5 (https=) | ||
| CN102335792A (zh) | 碳钢与氧化锆陶瓷的连接方法及制得的连接件 | |
| JP2009518544A5 (https=) | ||
| WO2008013806A3 (en) | Process for joining materials using a metallic heat source within a controlled atmosphere | |
| DK2026927T3 (da) | Fremgangsmåde og apparat til temperaturbehandling, især loddeforbindelse | |
| JP2010511710A5 (https=) | ||
| WO2008125236A3 (de) | Wärmeintegration in einem deacon-prozess | |
| JP2004175656A5 (https=) | ||
| JP2012530848A5 (https=) | ||
| WO2010094884A3 (fr) | Procede de capture d'oxyde de carbone en vue d'un stockage ultérieur | |
| TW200715902A (en) | Ceramic member, ceramic heater, substrate placing mechanism, substrate processing apparatus and method for manufacturing ceramic member | |
| JP2016533040A5 (https=) | ||
| JP2006261362A5 (https=) | ||
| CN107298535B (zh) | 一种钛合金-k4玻璃异种材料的复合连接方法 | |
| JP2009507478A5 (https=) | ||
| GB0600712D0 (en) | Process for the manufacture of substituted propionic acids | |
| JP6675622B1 (ja) | 電子部品のシンタリング装置および方法 | |
| CN105269525A (zh) | Gw16-550，gw17-550隔离开关专用工具及加工方法 |