JP2006175476A - Contact type laser beam heating apparatus, and heating machine using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact type laser beam heating apparatus which is used for heating a minute area of a workpiece with a pulsed laser beam, is simple in structure, can be manufactured inexpensively, does not need complicated operation for the use and safety measures against reflection from the workpiece, and to provide a heating machine using the apparatus. <P>SOLUTION: The contact type laser beam heating apparatus is characterized in that it is equipped with: a pulsed laser beam oscillating means 1; a light receiving/heat generating part 4 which receives the oscillated laser beam to convert it to heat energy; a heat transmitting part 5 which is in close contact with the outer surface of the light receiving/heat generating part, which is formed with a high heat conductivity material, and which transmits the heat energy converted in the light receiving/heat generating part; and a heater tip 6 composed of a heating/processing section which comes in contact with the heat transmitting part and which, heated by the heat energy from it, pressurizes and heats the workpiece. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a contact type laser heating apparatus that uses a pulsed laser beam to heat a minute region of an object to be processed, and performs processing such as welding, brazing, etc., contact type stamp type marking, etc. About. The present invention further relates to a heat processing machine using the contact type laser heating apparatus.

  At present, a heating processing apparatus using YAG laser and optical fiber transmission is widely used for heating a minute region of an object to be processed by using pulsed laser light to perform processing such as joining and marking. For example, Japanese Patent Laid-Open No. 2000-334562 (Patent Document 1, Claim 1) describes a laser oscillator that emits a laser and a transparent material that is highly transparent to the laser, and a tip that is made of the laser. A heater tool having a laser absorption portion with low transparency, a light guide for guiding the laser emitted by the laser oscillator to the heater tool, pressing the heater tool against the bonded portion with a predetermined pressing force, and the laser oscillator A pulse heat type bonding apparatus (contact type laser heating apparatus) including a bonding control unit for controlling is described. A YAG laser (paragraph 0013) is used as the laser oscillator, and an optical fiber is used as the light guide. (Paragraph 0027) is illustrated as preferred.

In a heating processing apparatus using such a YAG laser and optical fiber transmission, usually, a semiconductor YAG rod is excited by two LD bars arranged around it, and laser light is oscillated by resonant mirrors arranged on both sides. The laser beam emitted from the resonant mirror is incident on the optical fiber, and the optical fiber is fixed to the Z drive device portion of the XYZ drive device of the heating device, and is focused on the tip of the optical fiber. The lens is focused on the object to be processed and irradiated with a laser for processing.
JP 2000-334562 A (Claim 1)

  However, in the conventional apparatus as described above, the laser light emitted from the two LD bars has a large divergence angle, so that the collimating lens for producing parallel light and the semiconductor YAG rod can be excited so as to be excited. It is necessary to adjust the position of each lens system by installing a condensing lens for this purpose. In addition, it is necessary to attach a condensing lens to the tip of the optical fiber and adjust the oscillation and position with the laser beam of the built-in HeNe laser so that the focal point is focused on the workpiece. As a result, the apparatus becomes complicated and expensive, and the problem of deterioration of the optical elements such as the semiconductor YAG rod and the lens system is likely to occur, and complicated operations such as the position adjustment of the lens system are required even in the use thereof.

Further, since the reflection characteristics of the laser beam are different depending on the object to be processed, it is necessary to adjust the incident angle of the laser beam and to take anti-reflection measures on the object to be processed, and this is also difficult to use. Furthermore, since a powerful laser is reflected from the workpiece, safety measures are required, and when manufacturing products using this apparatus, class 4B safety measures are required according to JIS C 6802.

  The present invention is a contact type laser heating apparatus that uses a pulsed laser beam to heat a minute region of an object to be processed, and performs processing such as bonding and marking, such as a semiconductor YAG rod, a resonant mirror, and a lens system. No optical element or lens system is used, it has a simple structure, can be manufactured at low cost, and does not require complicated operations such as oscillation adjustment and position adjustment during use. It is an object of the present invention to provide a contact-type laser heating device that does not require safety measures against reflection of laser light from an object. Another object of the present invention is to provide a heat processing machine using the contact type laser heating apparatus.

  The above-mentioned problems include a pulsed laser light oscillation means, a light receiving heat generating part that receives the oscillated laser light and converts the laser light into heat energy, and is in close contact with the outer surface of the light receiving heat generating part, and has a high thermal conductivity. A heat transfer part that is formed of a material and transfers heat energy converted by the light receiving and heating part, and contacts with the heat transfer part, is heated by the heat energy from the heat transfer part, and presses the workpiece. A heater chip consisting of a heating processing part to be heated, or a function of the light receiving heat generating part, a heat transfer part and a heating processing part, and at least two or more parts among the light receiving heat generating part, the heat transfer part and the heat processing part are This is achieved by a heater chip having a monolithic structure (claim 1).

  That is, in this contact-type laser heating device, substantially all of the laser light oscillated from the pulse laser light oscillation means is emitted to the light receiving and heat generating portion and used for heat generation. In the light receiving and heating unit, substantially all of the incident laser light is absorbed and converted into thermal energy. Therefore, since there is no laser beam emission to the outside, there is no reflection of the laser beam from the object to be processed, it can be used safely, and it is not necessary to take any special safety measures.

  The heat energy generated in the light receiving heat generating part is transferred to the processing part by the heat transfer part formed in close contact with the light receiving heat generating part, and the processing part is heated to the temperature of the processing conditions. In this heated processing portion, processing is performed while applying pressure to the workpiece that needs to be pressed. As described above, the contact type laser heating apparatus of the present invention does not require a lens system in the heater chip portion, that is, the processing portion and the vicinity thereof, so that the structure is simple and can be manufactured at low cost. When using an optical fiber, the lens system is only required for laser emission, etc., so that the amount of lens system used can be greatly reduced compared to the prior art, and the number of other optical elements used can also be reduced. Therefore, it is possible to greatly reduce the problems of deterioration and complicated operations such as adjustment thereof, which is very advantageous in use.

The pulse laser beam oscillation means constituting the contact type laser heating apparatus of the present invention includes a power supply unit for supplying a pulse laser to a light emitting element, and an assembly of a YAG laser, a CO ₂ laser, and a semiconductor laser element (LD) Among them, those composed of an assembly of a power supply unit and a semiconductor laser element (LD), for example, an LD bar, an LD stack, etc. are preferably used. Claim 2 corresponds to this preferable mode.

  That is, the aspect of claim 2 is an LD direct processing system in which an LD bar or the like conventionally used for exciting a semiconductor YAG rod is used for laser light oscillation. The LD bar is a one-dimensional array of a large number of LD light emitting elements. The size of a single emitter, which is an LD light emitting device, is about 100 μ (width) × 1 μ (thickness) × 1 mm (resonator length) and has a power of several mW to 2 W, but about 50 LD light emitting devices are arranged in a row. The arranged LD bars are about 10 mm in length, and an output of 40 to 60 W can be obtained by flowing 40 to 60 A.

  The LD stack is obtained by further stacking LD bars in two dimensions. An LD stack in which about 30 LD bars are arranged in a row has a length of about 10 mm and a current of 40 to 60 A is obtained to obtain 1 kw or more. be able to. Since the single emitter of the LD light emitting element has a large spread angle of the laser beam, the conventional heat processing apparatus requires a lens system and means for adjusting the same in order to irradiate the semiconductor YAG rod. However, in the contact type laser heating apparatus of the present invention, when the heater chip is provided in the emission part of the pulse laser beam oscillation means, that is, in the aspect of claim 3, a lens system or the like is not required, The structure is such that substantially all of the laser light oscillated from the LD or the like is emitted to the light receiving and heating portion, and the advantages of the LD that it is highly stable, has a long life, is inexpensive and is small can be utilized. Here, “substantially all of the light is emitted to the light receiving and heating part” means that all light except a part of light reflected by the light incident part to the heater chip is used for heat generation of the light receiving and heating part. Means.

  Since the pulse laser beam oscillation means constituting the contact type laser heating apparatus of the present invention is pulse driven without always oscillating, even when an LD bar or the like is used, a heat radiation means such as providing a heat radiation plate is provided. As a result, no forced cooling means such as water cooling is required, and the structure can be simplified from this point. Note that pulse driving means oscillation other than constant oscillation, and is not limited to a narrowly defined pulse that is a repetition of short-time oscillation. For example, in the 500 ms (millisecond) pulse drive, one pulse energization may be performed for 500 ms, or a total of 500 ms energization may be performed by repeating a cycle of 100 ms energization and 50 ms rest.

  The contact-type laser heating apparatus of the present invention has a heater chip including a light-receiving / heating unit, a heat transfer unit, and a heating processing unit, together with pulsed laser beam oscillation means. Usually, the heater chip further has a base portion having a function capable of transmitting laser light such as transparent ceramic or glass as means for holding the light receiving and heating portion, the heat transfer portion, and the heat processing portion.

  The contact-type laser heating apparatus of the present invention has a heater chip including a light-receiving / heating unit, a heat transfer unit, and a heating processing unit, together with pulsed laser beam oscillation means. In addition, the light receiving heat generating part and the heat transfer part, the heat transfer part and the heat processing part, or the light receiving heat generating part, the heat transfer part, and the heat processing part are made of an integral structure, for example, the same material. A structure that cannot be used. That is, the heater chip is composed of an integral structure portion and a heat processing portion having functions of a light receiving heat generating portion and a heat transfer portion, or an integral structure portion having functions of a heat transfer portion and a heating processing portion and a light receiving heat generating portion. Alternatively, it may be an integrated structure having the functions of a light receiving heat generating part, a heat transfer part, and a heat processing part. A heater chip that has the functions of a light receiving heat generating part, a heat transfer part, and a heat processing part, and at least two of the light receiving heat generating part, the heat transfer part, and the heat processing part are integrally structured. Say tip. Usually, the heater chip further has a base portion having a function capable of transmitting laser light such as transparent ceramic or glass as means for holding the light receiving and heating portion, the heat transfer portion, and the heat processing portion.

  The heater chip is directly provided in the emission part of the pulse laser beam oscillation means (for example, LD bar). Alternatively, a light incident portion of a light guide means made of an optical fiber or the like is provided in the laser light emission portion, and a heater chip is directly provided in the emission portion of the light guide means. The emission part is a part from which the laser beam is emitted from the above-mentioned means, and is directly provided means that the light incident part of the heater chip is in contact with the laser light emission part or the light-guiding part. That is, it is locked so as not to leave a gap. By providing it directly, energy loss due to diffraction, reflection or the like can be prevented.

  In any case, it is necessary that substantially all of the laser light emitted from the emitting unit is incident on the light receiving and heating unit and converted into thermal energy. The third aspect corresponds to an aspect in which the heater chip is directly provided in the emission part of the pulse laser beam oscillation means, and the fourth aspect is that the light guide means is made of an optical fiber, and the heater chip is directly in the emission part of the optical fiber. It corresponds to the aspect provided. When an optical fiber is used, a condensing lens is used to guide laser light emitted from an LD or the like to a light incident part of the optical fiber.

  The heater chip of the contact type laser heating apparatus of the present invention is a part that is heated and subjected to pressing, and is more easily deteriorated than other parts of the contact type laser heating apparatus. In particular, the light receiving and heating portion is often thin because it has a small heat capacity, and is easily damaged. On the other hand, this heater chip is a part that is simple in structure and inexpensive to manufacture. Therefore, a contact type laser heating apparatus is preferable in which the heater chip can be attached or detached, or the heating processing portion of the heater chip can be attached or detached, and the replacement is easy. Claims 5 and 6 correspond to this preferable mode. The contact-type laser heating device of this aspect is excellent in the initial state by replacing the heater chip or replacing the heater chip heat processing part even if the heater chip, for example, the heat processing part is damaged by use. Therefore, it is very suitable as a processing tool.

The light receiving and heating unit of the heater chip has a function of receiving the oscillated laser beam and converting substantially all of it into heat energy to generate heat, and has the following form, for example.
(1) The entire surface of the base portion (glass or the like) is coated with an opaque material having a heat absorption property of vibration laser light, for example, black plating such as carbon, black chrome, or black nickel. On top of this, a metal with good heat transfer, such as a copper alloy, an iron alloy, or a molybdenum alloy with good heat resistance when the joint is welded is coated.
(2) A high heat transfer metal such as a copper alloy, an iron alloy, or a weld that is coated with the above-described material having an endothermic property of oscillation laser light without providing a base (glass, etc.) In the case of use, a light-receiving heat generating portion is formed by drawing or pressing a heat-resistant molybdenum alloy or the like with the coated surface inside.
(3) The heater part is formed directly from a foamed / porous metal made of a metal having an endothermic property of oscillation laser light instead of glass or the like.
In the case of such a structure, the light receiving heat generating portion and the heat transfer portion / heat processing portion may be integrated with each other, instead of the structure in which the heat processing portion is attached to the tip of the light receiving heat generating portion. In this case, in order to reduce the heat capacity of the heater chip, the foaming rate at the center is increased, and instead of the light receiving heat generating part, the heat transfer part is compressed to be a heat transfer part to improve the conductivity of the skin part, Since the heat-processed part has the strength of the foamed / porous metal itself, it is preferable to process the conductive part into the shape of the heat-processed part.
As the foam metal, a high-functional porous metal that enables a porosity of 90% or more in porosity is preferable, and molding using such a metal is a slurry obtained by adding an evaporating foaming agent to a metal powder, The mold can be put into a mold and heated to evaporate the foaming agent, and then molded through degreasing, drying and sintering processes.
Examples of the coat include paint coats (such as UV-curing coats), thermal spray coats (such as plasma spray coats and arc spray coats), and plating coats. Examples of plating coats include dry plating and wet plating (electroplating and electroless plating). Examples of dry plating include PVD (ion plating / vacuum deposition / sputtering) and CVD.

  In any case, the shape and installation conditions of the light receiving and heating unit are set so that all the light incident on the heater chip is irradiated to the light receiving and heating unit. In the case of (1), the thickness of the film is usually several tens of minutes to several tens of micrometers. A plurality of these films and layers may be stacked.

  The heat transfer unit has a function of transferring heat generated by being converted into heat energy in the heater chip unit to the heat processing unit. Therefore, high heat conduction characteristics are required. In addition, the heat generated in the light receiving heat generating part is transferred to the heat transferring part, and depending on the heat generation conditions, it is accumulated in the light receiving heat generating part and the base part, which may become high temperature, resulting in deterioration of the heater chip part. It may be easier to do. Therefore, in order to dissipate the heat accumulated in the light receiving heat generating part and the base part and to prevent the heat accumulation in the light receiving heat generating part and the base part, it is preferable that heat dissipation is excellent. For this reason, it is preferable that the heat capacity of the heat transfer portion is small, and therefore it is preferable that the thickness is small. As this effect, forced cooling means such as water cooling can be omitted. Moreover, since the heat transfer part becomes high temperature, excellent heat resistance is desired.

  Materials having both good heat conductivity and heat dissipation properties and excellent heat resistance include metals and alloys with high thermal conductivity or high melting point, preferably copper, iron, aluminum, molybdenum or alloys thereof. Illustrated. Molybdenum is particularly preferably used in a contact laser heating apparatus for high-temperature welding joining. The heat transfer part made of these metals, alloys and the like usually has a thickness of several tens to several hundreds of micrometers.

  A heating process part is a part which has the function to process a process target object with the heat and the heat which were heated by the heat conducted from the heat-transfer part. Accordingly, the shape of the heat-processed portion can include various shapes according to the shape of the workpiece and the purpose of processing.

  For example, the tip shape of the heat-processed portion includes a flat shape and a shape having a convex portion, and the tip-shaped convex portion having a convex portion includes a needle shape, a comb shape, a blade shape, etc. It is selected according to the purpose. An anti-oxidation coat that is difficult to oxidize is applied to the tip metal of the heat-processed portion. For example, a nitrogen-based coat is desirable. The coat thickness may be several μm or less. The constituent material is selected according to the tip shape and processing purpose. For example, in the case of a needle shape for welding joint processing corresponding to high temperature, molybdenum or tungsten as a high melting point material is used, and as the needle shape material for solder joint processing, copper, iron, aluminum, or an alloy thereof is used.

  The contact-type laser heating device of the present invention can be used by holding it with a hand like an electric iron and pressing the heating processing portion to the processing position of the processing object by hand. According to this method, it can be used by a simple operation.

  Or this contact-type laser heating apparatus can be installed in a heating processing apparatus, and it can also be used for a process of a processing target object by the action | operation of a heating processing apparatus. Claim 7 corresponds to a heating processing machine using the contact type laser heating apparatus of the present invention, and the contact type laser heating apparatus of the present invention and a workpiece to be processed by the contact type laser heating apparatus. And a positioning means for positioning the contact type laser heating device at a desired position with respect to the mounting means.

  The contact-type laser heating apparatus of the present invention does not use an optical element such as a lens system or uses a small number of lens systems, and has a simple structure and can be manufactured at low cost. In use, complicated operations such as oscillation adjustment and position adjustment are not required. Furthermore, since there is no reflection of the laser beam from the workpiece, no safety measure against the reflected laser beam is required.

  The contact type laser heating apparatus of the present invention can be used as a handy type such as an electric iron with a simple operation, and uses a pulsed laser beam to heat a minute region of an object to be processed, such as joining and marking. Can be suitably used. In particular, an embodiment in which the heater chip is detachable is preferable because the heater chip can be easily replaced.

  Moreover, this contact-type laser heating apparatus can also be installed and used in the heat processing apparatus of this invention. Even in this case, no complicated work such as oscillation adjustment or position adjustment is required, and since there is no reflection of laser light from the workpiece, safety measures against the reflected laser light are not required. Effect.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. In addition, this invention is not limited to this form, The change to another form is also possible unless the meaning of this invention is impaired.

  FIG. 1 shows one embodiment of a contact type laser heating apparatus of the present invention. FIG. 1 a is a plan view thereof, FIG. 1 b is a right side view thereof, and FIG. 1 c is a cross-sectional view of AA ′.

  This contact-type laser heating apparatus has an LD bar 1 (pulse laser beam oscillation means) in which LD light emitting elements are arranged in a horizontal row, and a heater chip 2. The LD bar 1 includes an electrode portion 1a and a light emitting portion 1b, and the heater chip 2 includes a glass base portion 3, a light receiving and heating portion 4, a heat transfer portion 5, and a heat processing portion 6. A pulse laser is oscillated from the light emitting portion 1b, and this laser light is emitted from the emitting portion 1c.

  As shown in FIG. 1, the heater chip 2 is provided so that its base portion 3 is in close contact with the emission portion 1 c, so that substantially all of the laser light emitted from the emission portion 1 c is within the base portion 3. Is incident on. Since the base portion 3 is made of transparent glass, all of the incident laser light irradiates the light receiving and heating portion 4.

  FIG. 2 shows the vicinity of the heater chip 2 and the heater chip 2 of the contact type laser heating apparatus of the example of FIG. 2a is an enlarged sectional view of the vicinity of the heater chip 2, FIG. 2b is a perspective view of the heater chip 2, and FIG. 2c is an enlarged sectional view thereof. As shown in FIG. 2, the entire surface of the base portion 3 excluding the portion in close contact with the LD bar 1 is covered with the light receiving heat generating portion 4, and the heat transfer portion is formed on the entire surface of the light receiving heat generating portion 4. 5 is formed.

  The light receiving and heating portion 4 is formed by coating carbon on the base portion 3 to a thickness of about 10 μm. The light receiving and heating unit 4 absorbs substantially all of the irradiated laser light and converts it into thermal energy. A part of the converted heat energy is stored in the base portion 3, but most of the heat energy is thermally transferred to the heat transfer portion 5. The heat transfer section 5 is made of a copper alloy and has a thickness of about 100 μm.

  As shown in FIG. 2, one end of the heat processing unit 6 is a processing end that performs a processing action, and the other end is covered with a heat transfer unit 5. The processing end has a flat shape.

  Since the heat transfer section 5 is made of a copper alloy having a high thermal conductivity, the heat energy that has been thermally conducted is quickly conducted to the heat processing section 6. And a process end becomes high temperature and processes a process target object with this heat and press. The heat-processed portion 6 of this example is formed of iron, copper alloy, or molybdenum, but may be formed of other materials used for the tip portion of a normal electric iron.

  As shown in FIG. 1, the electrode portion 1a of the LD bar 1 is connected to the electric wire 7, and electric energy is supplied from the power source (not shown) through the electric wire 7, and a pulse laser oscillates from the light emitting portion 1b. Is done. The broken line in the base part 3 in FIGS. 2a and 2c indicates the spread of the oscillated pulse laser. That is, the pulse laser from the LD bar 1 spreads between the two broken lines and is applied to the light receiving / heating unit 4. In addition, as a power supply part, the thing similar to the power supply device of the heat processing machine of below-mentioned FIG. 17 can be used.

  The LD bar 1, the heater chip 2 and the electric wire 7 are fixed by fixing means 8. Such a fixing means can be formed of a heat-resistant resin or the like, but in this example, it is in contact with the heat transfer section 5 and the heat-processed section 6 that are at a high temperature, and thus is formed of a ceramic having high heat resistance.

  The fixing means 8 is composed of two upper and lower parts 8a and 8b shown in FIGS. 1b and 1c, and the LD bar 1 and the heater chip 2 are sandwiched between the two parts to fix them. The two parts 8a and 8b are fixedly engaged by four screws 9.

  In addition, 8a and 8b can be decomposed | disassembled by extracting the four screws 9. FIG. If 8a and 8b are disassembled, the LD bar 1 and the heater chip 2 are fixed, and the heater chip 2 can be removed and replaced with a new heater chip 2. That is, in this example, the heater chip 2 is detachably provided.

  FIG. 3 shows another embodiment of the contact type laser heating apparatus of the present invention. 3a is a plan view thereof, and FIG. 3b is a right side view thereof. Although the processing end 6 of the example in FIG. 1 has a flat shape at the processing end, the processing end 11 in the example of FIG. 3 has a comb-teeth shape with five processing ends. Since the other points are the same as those in the example of FIG. 1, the same reference numerals as those in FIG. 1 are used in FIG.

  FIG. 4 shows an example of use of the contact type laser heating apparatus of the example of FIG. In this example, the electrode 15a of the IC element 15 is joined to the electrode 17 of the wiring board 16 by using this contact type laser heating apparatus. FIG. 4 a is a perspective view showing the arrangement of the heat-processed portion 11, the IC element 15, the wiring board 16, and the electrode 17 before performing the connecting step. In addition, illustration of the part of contact-type laser heating apparatuses other than the heat processing part 11 is abbreviate | omitted.

  In the connection step, first, the IC element 15 is placed on the wiring board 16 so that each terminal of the electrode 15 a overlaps each terminal of the electrode 17. Next, the comb-like protrusions of the heat-processed portion 11 are placed on the respective terminals of the IC element 15 so as to overlap each other, and heated and pressed by a contact type laser heating apparatus.

  A solder paste is printed on each terminal of the electrode 17. Therefore, when heated and pressed by the contact type laser heating device, the solder is melted and deformed, and the terminals of the electrode 15a and the terminals of the electrode 17 are connected to each other, and the bonding is achieved by cooling and solidification. The FIG. 4B is a front view seen in the direction of the arrow in FIG. 4A and shows a state where the IC element 15 is placed on the wiring board 16. FIG. 4 c is a front view seen in the direction of the arrow in FIG. 4 a and shows a state during the heat processing in which the heat processing portion 11 is placed on the IC element 15.

  FIG. 5 shows another embodiment of the contact type laser heating apparatus of the present invention. 5a is a plan view thereof, and FIG. 5b is a right side view thereof. Although the processing end 6 of the example of FIG. 1 has a flat shape at the processing end, the heating processing unit 21 of the example of FIG. 5 is a single-convex type whose processing end has one protrusion. Since the other points are the same as those in the example of FIG. 1, the same reference numerals as those in FIG. 1 are used in FIG.

  FIG. 6 is a process diagram showing an example of use of the contact type laser heating apparatus of the example of FIG. 5, and is a diagram showing a cross-sectional view of the center line. (A-1) in FIG. 6 is a front view of the heat-processing part 21, and (b-1), (c-1), and (d-1) are front views showing each process of this use example. . Also, (a-2), (b-2), (c-2) and (d-2) are converted into (a-1), (b-1), (c-1) and (d-1). It is a right view corresponding respectively.

  In this example, the terminals 26 and 26 ′ arranged in parallel on the element 25 are joined by brazing using a contact type laser heating apparatus having a brazing material tape 27 and a heating processing portion 21. As shown in (a-1), the heat-processed portion 21 has a shape having one protrusion on one side thereof. Examples of the brazing material tape that can be used here include a single brazing material tape and a composite tape in which a solder having a low melting point is coated on a resin film such as polyimide. The tape 27 is a single tape made of an amorphous brazing material.

  First, as shown in (b-1) and (b-2), the amorphous brazing material tape 27 is brought into contact with the terminals 26 and 26 ′, and the protrusions of the heat-processed portion 12 are locked to the amorphous brazing material tape 27. . Next, as shown in (c-1) and (c-2), the amorphous brazing material tape 27 is pressed onto the conductive portions 26 and 26 'by the heat processing portion 21 and heated. At this time, a part of the heat processing part 21 is on the conductive parts 26 and 26 ′ and the other part is on the amorphous brazing material tape 27, and the conductive parts 26 and 26 ′ and the amorphous brazing material tape 27 are simultaneously raised for the first time. The amorphous brazing material tape 27 is melted and allowed to flow between the conductive portions 26 and 26 '.

  Then, the amorphous brazing filler metal in the portion 28 of (d-1) is melted and moved between the terminals 26 and 26 ', and the terminals 26 and 26' are connected by cooling and solidification. 29 in (d-2) is this amorphous brazing material that has been cooled and solidified. Here, examples of the amorphous brazing material include a copper-based amorphous brazing material having a solidus temperature of 595 ° C. and a liquidus temperature of 650 ° C., which include 9.3% tin, 6.5% phosphorus, and nickel 5. 7% and other components are copper brazing material. If the solder brazing material is a low temperature brazing material, the amorphous brazing material becomes a high temperature brazing material.

  FIG. 7 shows another embodiment of the contact type laser heating apparatus of the present invention. 7a is a plan view thereof, and FIG. 7b is a right side view thereof. The heat processing unit 6 in the example of FIG. 1 has a flat processed end, but the heat processing unit 31 in the example of FIG. 7 is a two-convex type in which the processing end has two protrusions on both sides. Since the other points are the same as those in the example of FIG. 1, the same reference numerals as those in FIG. 1 are used in FIG.

  FIG. 8 is a process diagram showing an example of use of the contact type laser heating apparatus of the example of FIG. (B-1), (c-1) and (d-1) in FIG. 8 are front views showing the respective steps of this use example. (B-2), (c-2) and (d-2) are right side views corresponding to (b-1), (c-1) and (d-1), respectively.

  In this example, the urethane-coated copper wire 34 is joined to the terminal 33 on the element 32 by soldering using a contact-type laser heating apparatus having a solder wire 35 and a heat processing portion 31.

  First, as shown in (b-1) and (b-2), the urethane-coated copper wire 34 and the solder wire 35 are brought into contact with each other, and the heat-processed portion 31 is pressed thereon. Next, the excess urethane-coated copper wire 34 and the solder wire 35 are cut as shown in (c-2) while being pressed by the heat-processed portion 31, and then heated. The solder is melted and then solidified by cooling to achieve bonding as shown in (d-1) and (d-2).

  FIG. 9 shows another example of the heater chip of the contact type laser heating apparatus of the present invention. 9A is a cross-sectional view of the vicinity of the heater chip, FIG. 9B is a perspective view of the heat transfer section 43 and the heat processing section 44, and FIG. 9C is a part of the heat processing section 44 (FIG. 9). 9 (b) is an enlarged side view of FIG. 9 (b), and FIG. 9 (d) is an enlarged sectional view of the heater chip. This heater chip also includes a base portion 41, a light receiving and heating portion 42, a heat transfer portion 43 and a heat processing portion 44. The heat processing unit 44 has a printing function and is detachable. In the case of a stamp having many printing patterns, it is preferable that the heat processing unit 44 has a function of being detachable from the heat transfer unit 43 as described above. As is clear from FIG. 9C, the heat-processed portion 44 having a printing function has a plurality of convex portions whose widths and intervals are not constant.

  FIG. 10 shows a heat processing unit 44 having a printing function and its printing object 45. FIG. 10A is a perspective view showing a state before printing, and FIG. 10B is a perspective view showing a state after printing. As shown in FIG. 10B, a barcode is printed on the print object 45.

  FIG. 11 shows another embodiment of the contact type laser heating apparatus of the present invention. FIG. 11 a is an enlarged cross-sectional view showing the vicinity of the heater chip portion 49, and FIG. 11 b is a front view seen from the tip direction. There is no base part made of glass or the like, and in order to make it easy to absorb the oscillating laser light, the heater chip is directly formed integrally with a foamed / porous metal. The light receiving and heating portion 46 is a portion that receives laser light and is made of a foam metal or a porous metal having a high foaming rate. The heat transfer part 47 is compressed to improve the conductivity of the skin part to reduce the foaming rate so that the laser beam does not leak outside. Since the foamed / porous metal itself has strength, the heat-processed portion is formed by processing the tip portion of the conductive portion into the shape of the heat-processed portion.

  FIG. 12 is a front view showing another embodiment of the contact type laser heating apparatus of the present invention. This laser heating device condenses laser light oscillated from an LD bar (not shown) as pulse laser light oscillation means by a lens system (not shown), and this light is heated by an optical fiber 51. It inject | emits on the chip | tip 52, and the heat processing part 60 is heated. The optical fiber 51 and the heater chip 52 are connected by an optical fiber joint 54.

  13a is an enlarged cross-sectional view of the vicinity of the optical fiber joint portion 54 and the heater chip 52 in the example of FIG. As shown in FIG. 13a, the optical fiber 51 is held by an optical fiber joint 54, and the tip of the optical fiber joint 54 and the heater chip 52 are held by a heater chip fixing cap 53. 55 is in close contact with the light incident portion 56 of the heater chip 52.

  The heater chip 52 includes a transparent glass base portion 57, a light receiving and heating portion 58 that covers the outer periphery thereof, a heat transfer portion 59 that further covers the outer periphery of the light receiving and heating portion 58, and a heating processing portion 60. The tip of the base portion 57 has a conical shape, and a heating processing portion 60 is provided at the apex portion thereof.

  The light receiving and heating portion 58 is formed by coating a carbide such as carbon or DLC (Diamond Like Carbon) on the base portion 57 to a thickness of about 10 μm. The heat transfer part 59 is formed of a copper alloy having a high thermal conductivity and has a thickness of about 100 μm. The heat-processed portion 60 is formed of a copper alloy coated with nitride that has high thermal conductivity and is not easily oxidized, and has a thickness of about 1 μm.

  FIG. 13b is a front view of the contact type laser heating apparatus of the example of FIG. 12 as viewed from the end of the processing end. As shown in FIG. 13b, the processing end has a thin rod shape (hereinafter referred to as a needle shape). Yes, it is made of an iron alloy, but may be made of other materials used for the tip of a normal electric iron. Such a needle-shaped processed end is used when single joining is performed by soldering or the like, but the processed end has another shape, for example, the above-described comb-teeth shape, one-convex shape or bi-convex shape It is also possible to use a processing unit in place of the heat processing unit 60.

  The positional relationship among the base portion 57, the light receiving and heating portion 58, the heat transfer portion 59, and the heat processing portion 60 is the same as in the example shown in FIG.

  In the contact type laser heating apparatus of the example of FIGS. 12 and 13, the laser light emitted from the emitting portion 55 of the optical fiber 51 into the base portion 57 passes through the base portion 57 and is irradiated to the light receiving and heating portion 58. The light receiving and heating unit 58 absorbs substantially all of the irradiated laser light and converts it into thermal energy. A part of the converted heat energy is accumulated in the base portion 57, but most of the heat energy is thermally transferred to the heat transfer portion 5. Since the heat transfer portion 59 is formed of a copper alloy having a high thermal conductivity, the heat energy that has been thermally conducted is quickly conducted to the heat processing portion 60. And a process end becomes high temperature and processes a process target object with this heat and press.

The heater chip 52 of the contact type laser heating apparatus in the example of FIGS. 12 and 13 is also detachable. That is, the heater chip fixing cap 53 is screwed to the outer periphery of the optical fiber joint 54, and the heater chip 52 can also be removed by loosening the spiral and pulling the optical fiber joint 54 rightward in the drawing. it can. In addition, after replacing the heater chip 52, the light incident part 56 of the new heater chip is brought into close contact with the emission part 55 of the optical fiber 51, and then the heater chip fixing cap 53 is attached to the outer peripheral part of the optical fiber joint part 54 to form a spiral. By tightening, the heater chip 52 can be attached at a predetermined position.
Moreover, the heating process part 60 of the heater chip 52 of the contact type laser heating apparatus of the example of FIG. 12, FIG. 13 is also detachable. That is, the needle-shaped root portion of the heat processing portion 60 is in a split pin state (the split pin state is not shown), and is inserted into the recess for the heat processing portion 60 at the tip portion of the base portion 57. Thus, a close contact state is formed with the heat transfer portion 59 on the surface of the recess of the base portion, and the heat for transferring the heat of the heat transfer portion 59 to the heating processing portion 60 is also provided.

  FIG. 14 shows another embodiment of the contact type laser heating apparatus of the present invention. FIG. 14 a is an enlarged cross-sectional view showing the vicinity of the heater chip portion 72, and FIG. 14 b is a front view seen from the front end direction.

  Also in the contact type laser heating apparatus of this example, laser light oscillated from an LD bar (not shown) which is a pulse laser light oscillation means is condensed by a lens system (not shown), and this light is condensed. It is injected to the heater chip 72 by the optical fiber 71 and heats the heat processing part 75, and the parts other than the heater chip 72 are the same as the examples of FIGS.

  The heater chip 72 has a structure without a glass base. Accordingly, the light receiving and heating unit 73 has a cavity, and the laser light emitted from the emitting unit 76 of the optical fiber 71 is directly irradiated to the light receiving and heating unit 73 and the heating processing unit 75.

  The light receiving and heating unit 73 absorbs substantially all of the irradiated laser light and converts it into thermal energy, and the converted thermal energy is thermally conducted to the heat transfer unit 74, and the thermally conducted thermal energy is quickly transmitted. The heat is transferred to the heat processing unit 75. And a process end becomes high temperature and processes a process target object with this heat and press.

  The heater chip 72 is formed by coating the entire inner surface of a 100 μm thick copper alloy with black nickel plating or the like to a thickness of about 10 μm, and by pressing or drawing, the light receiving heat generating part 73, the heat transfer part 74, and the heat processing part 75. Are integrally molded.

  Similar to the contact-type laser heating apparatus in the examples of FIGS. 12 and 13, a heat-processed part having another shape can be used in place of the needle-shaped heat-processed part 75, and the heater chip 72 has the same method. Is detachable.

  FIG. 15 shows another embodiment of the contact type laser heating apparatus of the present invention. This contact-type laser heating apparatus is the same as the examples of FIGS. 12 to 14 except that the shape of the heat processing section 78 is an edge shape (blade shape). FIG. 15a is a front view, and FIG. 15b is a side view as seen from the machining end face.

  FIG. 16 is a process diagram conceptually showing a process of welding and joining the urethane-coated copper wire 79 to the joining object 77 using the contact type laser heating apparatus of FIG. In this case, the high-melting point molybdenum is used as the material for the heat transfer section 74 and the heat processing section 78. As for the contact type laser heating apparatus, only the heat processing part is shown, and other parts are not shown. As shown in FIG. 16A, a urethane-coated copper wire 79 is placed on the joining object 77. Next, as shown in FIG. 16 (b), the processed end 78 is brought into contact with the urethane-coated copper wire 79, and by pressing and heating, the urethane coating of the urethane-coated copper wire 79 is melted and at the same time the copper wire portion is melted and joined. The urethane-coated copper wire 79 is welded and joined to the joining object 77 by raising the temperature of the object 77 to 1300 degrees or more. FIG. 16C is a diagram in which the heat-processed portion 78 is raised, and FIG. 16D is a diagram in which the urethane-coated copper wire 79 from which the extra urethane-coated copper wire 79 is removed from the terminal 77 is used as the terminal 77. It is a figure which shows the completion state joined by welding. However, at this time, the urethane-coated copper wire 79 and the object to be joined 77 are joined by welding, but the joining strength is weak. Therefore, it is preferable to coat and reinforce with a UV curing agent or the like from the top. A contact-type laser heating device having an edge-shaped processed end is suitably used for joining a fine portion such as this welding joint.

  FIG. 17 is a schematic diagram showing the overall configuration of an embodiment of the heat processing machine of the present invention. This heating machine includes a contact type laser heating device 80 according to the present invention, a placing means 82 for placing a workpiece 81, and a positioning means for positioning the contact type laser heating device at a desired position in the placing means. And a power supply device 83 and a brazing material tape 84.

  The power supply device 83 is a device that supplies a current having a desired voltage value to the contact-type laser heating device 80, and the current is supplied from the power supply terminal through the power supply line 85. A display panel operation unit 87 is provided on the front surface of the power supply device 83, and an on / off switch 88 is connected thereto. The operator sets a predetermined voltage value, current value, and the like using the display panel operation unit 87, and operates based on the voltage value, current value, and the like displayed on the display panel of the display panel operation unit 87. Further, the on / off switch 88 or the like is operated with a hand or a foot to start and stop power feeding.

  The mounting means 82 includes a base 89, two long parallel grooves 90 formed substantially at the center thereof, a movable table 91 movably provided in the groove direction (X direction), and movable. The mounting surface 86 is a horizontal surface on the table 91 on which the workpiece 81 is mounted. The movable table 91 is moved in the X direction by a control device, a motor (not shown) or the like provided in the lower part of the base 89, thereby moving the workpiece 81 to a desired position in the X direction. Can do.

  The support base 92 of the contact-type laser heating device 80 includes two leg portions 93a and 93b and a horizontal base 94 provided in the horizontal direction between the tops 93a and 93b. Two parallel grooves 95 are formed. A movable table 96 is provided in the groove 95 so as to be movable in this groove direction (Y direction). The movable table 96 is moved in the Y direction by a control device, a motor (not shown) or the like provided in the lower portion of the base 89, so that the support table 92 and a contact type laser heating provided fixed thereto are provided. The device 80 can be positioned by moving it to a desired position in the Y direction.

  Further, two long parallel grooves 97 are formed on the front surface of the movable table 96, and the movable table 98 is movable in this groove direction (Z direction) in the groove 97. The contact-type laser heating device 80 is fixed to the movable table 98 so that the heating processing portion is on the lower side. The movable table 98 is moved in the Z direction by a control device, a motor (not shown) or the like provided in the lower part of the base 89, so that the movable table 98 and the contact type laser heating device 80 fixed thereto are moved to the Z direction. It can be moved to a desired position in the direction.

  In this way, in the heat processing machine of the present invention, the positional relationship between the contact type laser heating device 80 and the workpiece 81 can be freely controlled in the XYZ directions, and can be positioned at a desired position with respect to the mounting means 82. . The movable table 91, the movable table 96, and the movable table 98 constitute positioning means for positioning the contact type laser heating device 80 at a desired position with respect to the mounting means 82. The movable table 91, the movable table 96, and the movable table 98 are controlled by operating a control panel 99 provided below the base 89.

  The heat processing machine of the present invention has a brazing material tape 84, and the brazing material tape 84 passes through the lower side of the contact-type laser heating device 80, that is, the lower portion of the heat processing portion, and is wound between the two reels 100a and 100b. Has been taken. This example corresponds to a case where the processed end of the heat-processed portion shown in FIG. 6 has a single convex shape, and the brazing material tape is locked to the processed end and used for joining. Therefore, the brazing material tape 84 is locked to the processing edge having a one-convex shape, and after use for joining, the brazing material tape 84 is moved by the reels 100a and 100b, and the new part is used for the next joining. .

  In the joining by the heat processing machine of the present invention, the contact type laser heating device 80 is positioned on the workpiece 81 placed on the placement surface 86, the contact type laser heating device 80 is lowered, and the workpiece 81 is attached to the workpiece 81. It can be performed by pressing a predetermined position and supplying power from the power supply device 83 to heat. If the heating processing machine of the present invention is used, the positioning of the workpiece 81 placed on the placement surface 86 and the contact type laser heating device 80 can be easily controlled, and strong pressing is performed. You can also

  In the heat processing machine of the present invention, it is possible to use a brazing material wire or the like in place of the brazing material tape 84 by changing the shape of the heat processing portion, and also to use the brazing material tape or the brazing material wire. It can also be used for joining without using the like.

It is the top view which shows one form of the contact-type laser heating apparatus of this invention, a right view, and sectional drawing. FIG. 2 is an enlarged cross-sectional view and a perspective view showing the vicinity of the heater chip 2 and the heater chip 2 in the contact type laser heating apparatus of FIG. 1. It is the top view and right view which show another one form of the contact-type laser heating apparatus of this invention. It is the perspective view and front view which show the usage example of the contact-type laser heating apparatus of the example of FIG. It is the top view and right view which show another one form of the contact-type laser heating apparatus of this invention. It is process drawing which shows the usage example of the contact-type laser heating apparatus of the example of FIG. It is the top view and right view which show another one form of the contact-type laser heating apparatus of this invention. It is process drawing which shows the usage example of the contact-type laser heating apparatus of the example of FIG. It is sectional drawing, the side view, and perspective view which show the other example of the heater chip | tip of the contact-type laser heating apparatus of this invention. It is a perspective view which shows the printing process by the contact-type laser heating apparatus of the example of FIG. It is sectional drawing and a top view which show the other example of the heater chip | tip of the contact-type laser heating apparatus of this invention. It is a front view which shows another form of the contact-type laser heating apparatus of this invention. It is an expanded sectional view and the front view of the vicinity of the optical fiber joint part and heater chip of the example of FIG. It is the expanded sectional view and front view which show another one form of the contact-type laser heating apparatus of this invention. It is the front view and side view which show another form of the contact-type laser heating apparatus of this invention. It is process drawing which showed notionally the process of welding-bonding a urethane coat copper wire using the contact type laser heating apparatus of the example of FIG. It is the schematic which shows the whole structure of one form of the heat processing machine of this invention.

Explanation of symbols

1 LD bar 2, 52 Heater chip 3, 41 Base part 4, 42 Light receiving heat generating part 5, 43 Heat transfer part 6, 11, 21, 31, 44 Heat processing part 7 Electric wire 8 Fixing means 9 Screw 15 IC element 16 Wiring board 17 Electrode 25, 32 Element 26, 26 ', 33 Terminal 27 Brazing material tape 34 Urethane-coated copper wire 35 Solder wire 45 Print target 51, 71 Optical fiber 53 Heater chip fixing cap 54 Optical fiber joint portion 57 Base portions 58, 73 Light receiving heat generation Parts 59, 74 Heat transfer parts 60, 75, 78 Heat processing part 77 Bonding object 79 Urethane-coated copper wire 80 Contact-type laser heating device 81 Processing object 82 Mounting means 83 Power supply device 84 Brazing material tape 86 Mounting surface 88 ON / OFF switch 89 Base 92 Support base 94 Horizontal base 90, 95, 97 Groove 91, 96, 98 Movable tape Bull 99 control panel 100a, 100b reel

Claims (7)

Pulse laser light oscillation means, and
A light receiving heat generating part that receives the oscillated laser light and converts the laser light into heat energy, is in close contact with the outer surface of the light receiving heat generating part, is formed of a material with high thermal conductivity, and is converted by the light receiving heat generating part A heat transfer part that transfers heat energy, and a heater chip that is in contact with the heat transfer part and is heated by the heat energy from the heat transfer part to press and heat the object to be processed; or It has a function of a light receiving heat generating part, a heat transfer part and a heat processing part, and at least two parts among the light receiving heat generating part, the heat transfer part and the heat processing part have a heater chip having an integral structure. Contact type laser heating device.   2. The contact type laser heating device according to claim 1, wherein the pulsed laser beam oscillation means comprises a laser oscillation power source and an assembly of semiconductor laser elements.   The heater chip is provided at an emission part of the pulse laser light oscillation means so that substantially all of the laser light oscillated from the pulse laser light oscillation means is incident on the heater chip. The contact-type laser heating apparatus according to claim 1 or 2.   It further has a light guide means composed of an optical fiber, and laser light oscillated from the pulse laser light oscillation means is incident on the light guide means, and is emitted from the emission portion of the light guide means to the emission portion of the light guide means. The contact-type laser heating apparatus according to claim 1, wherein substantially all of the laser beam is provided so as to be incident on the heater chip.   The contact-type laser heating apparatus according to claim 1, wherein the heater chip is detachably provided.   6. The contact type laser heating apparatus according to claim 1, wherein the heat processing section is detachably provided. The contact-type laser heating device according to any one of claims 1 to 6, a placement means for placing a workpiece to be heated by the contact-type laser heating device, and a desired position with respect to the placement means And a positioning means for positioning the contact type laser heating device.

Images