JP2009195953A - Ultrasonic soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic soldering device which has an ultrasonic soldering iron as a heating means having a good heat efficiency capable of drastically reducing the labor of maintenance-cleaning, and does not take away heat of a melted solder from an iron tip. <P>SOLUTION: In the ultrasonic soldering device (100), the iron tip (11) making ultrasonic oscillation is brought into contact with the solder (31) melted by heating, and soldering to a substrate (30) to be soldered is performed by raising wettability by giving ultrasonic oscillation to the melted solder. The device is provided with an infrared heater (20) which emits infrared light (28), collects the emitted infrared light, and irradiates the collected light on the iron tip. The solder is melted by heating by the iron tip heated by infrared light irradiation. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an ultrasonic soldering apparatus using an ultrasonic soldering iron, and more particularly to improvement of a heating means for heating and melting solder.

Solder that is heated and melted by heating means is contacted with a tip that has been ultrasonically vibrated by an ultrasonic vibrator, thereby applying ultrasonic vibration to the molten solder to improve wettability and soldering to the substrate to be soldered An ultrasonic soldering apparatus using an ultrasonic soldering iron for carrying out the above is in practical use.
For example, according to a connection method using an indium solder-coated copper foil ribbon conductor, an ultrasonic soldering iron is used to securely and firmly connect the conductor electrode on the glass substrate and the ribbon conductor at low cost without damage. Solder connection is performed while indium solder is melted while heating (see, for example, Patent Document 1).

However, although the soldering iron heating means is not disclosed, the ultrasonic soldering iron heating means provided in the general market has a heater coil wound around the outer periphery of the tip of the ultrasonic soldering iron. The tip of the iron is heated by energizing the heater coil.
Also disclosed is a technique of ultrasonic soldering in which solder is melted by a heating device provided in a holder for supplying linear brazing filler metal or a preheating plate for heating a substrate (for example, Patent Document 2). reference).
Further, a non-contact soldering apparatus is disclosed in which solder is melted using a halogen lamp (see, for example, Patent Document 3).

JP 2007-207861 A Japanese Patent No. 3205423 Japanese Patent Laid-Open No. 06-254673

However, in the connection method according to Patent Document 1, when a heater coil is used, the solder residue penetrates into the gap and obstructs the ultrasonic vibration, and it takes time for maintenance and cleaning to cope with this. If spread, there is a problem that the heat transfer efficiency deteriorates.
Further, in the soldering method according to Patent Document 2, since the ultrasonic soldering iron itself is not heat-treated, there is a problem that high-quality soldering cannot be performed by removing the heat of the molten solder with the iron tip.
The soldering apparatus according to Patent Document 3 does not require a soldering iron because it is not ultrasonic soldering. However, if the solder is heated by infrared rays in the ultrasonic soldering iron, the iron tip that is not heated is used. As a result, the heat of the molten solder is deprived and high-quality soldering cannot be performed.

  The present invention provides an ultrasonic soldering apparatus that has a heating means for an ultrasonic soldering iron that has high thermal efficiency and can greatly reduce maintenance and cleaning, and that does not take the heat of molten solder from the tip of the iron. It is to be.

  The ultrasonic soldering apparatus according to the present invention is such that a soldering tip that is ultrasonically vibrated is brought into contact with the solder melted by heating, and ultrasonic wave vibration is imparted to the melted solder so as to improve wettability. An ultrasonic soldering apparatus for soldering to a substrate includes an infrared heater that emits infrared light, collects the emitted infrared light and irradiates the tip of the iron, and is irradiated with infrared light and heated. The solder is heated and melted with the iron tip.

  The effect of the ultrasonic soldering apparatus according to the present invention is that the soldering which ultrasonically vibrates includes a halogen lamp that emits infrared light and a condensing mirror that collects and radiates the emitted infrared light on the tip of the iron. Since the iron tip for heating is heated by infrared light, the ultrasonic vibration is not hindered by clogging due to solder clogging or clogging compared to the case where the iron tip is heated from the outer periphery by an electric heater coil. In addition to saving the trouble of cleaning management to prevent it, heat efficiency is high and rapid heating can be performed.

Embodiment 1 FIG.
1 is an overall configuration diagram of an ultrasonic soldering apparatus according to Embodiment 1 of the present invention. FIG. 2 is a detailed view of the ultrasonic soldering iron of the ultrasonic soldering apparatus according to Embodiment 1 of the present invention.
As shown in FIG. 1, the ultrasonic soldering apparatus 100 according to the first embodiment of the present invention includes an assembly 50 in which the ultrasonic soldering iron 10 and the infrared heater 20 are integrated, and the assembly 50 is moved up and down. And an actuator 40 that moves back and forth.
The ultrasonic soldering apparatus 100 is used in a process of soldering the leads 32 using the solder 31 to the substrate to be soldered 30 which is a glass plate, for example.

The ultrasonic soldering iron 10 is, for example, a tip 11A, which is a round rod material of stainless steel, a fixing plate 14 for fixing the large diameter portion 12 of the tip 11A to the case 13, and a super fixed to one end of the large diameter portion 12. An ultrasonic transducer 15 and an ultrasonic controller 17 connected to the ultrasonic transducer 15 via a lead wire 16 are provided.
The center axis 5 of the tip 11A of the round bar is inclined by an inclination angle θ degree with respect to the end surface 19 of the tip 11A that contacts the solder surface 31a of the substrate 30 to be soldered. Further, at least an irradiation surface 27A on which the infrared light 28 is irradiated among the cylindrical abdominal surface of the tip 11A is coated with, for example, a ceramic heat-resistant black paint and efficiently absorbs the infrared light 28. .

  The infrared heater 20 includes a halogen lamp 21 that emits infrared light 28 in the near-infrared region, a condenser mirror 22, and a lamp controller 24 connected to the halogen lamp 21 via a lead wire 23. The infrared light 28 emitted from the halogen lamp 21 is condensed by the condenser mirror 22 so as to have a beam diameter d on the irradiation surface 27A of the tip 11A, and is irradiated on the irradiation surface 27A. At this time, the side surface of the tip 11A irradiated with the infrared light 28 is a cylindrical surface, and the length of the region irradiated with the infrared light 28 in the direction of the central axis 5 of the tip 11A is d. d. The relationship between the beam diameter d and the outer diameter D of the tip 11A is preferably set in the range of the formula (1).

    D / 3 ≦ d ≦ D (1)

  The infrared heater 20 and the ultrasonic soldering iron 10 include a first holding member 18 that holds the case 13 from the outer periphery, and a second holding the first holding member 18 on one end side and the infrared heater 20 being fixed on the other end side. The holding member 25 is integrated.

The actuator 40 includes a servo motor 41, a moving body 44 that moves to the servo motor 41 in parallel with the soldered substrate 30 via a coupling 42 and a ball screw 43, and an up-and-down driving air fixed to the moving body 44. A cylinder 45, a lift 46 that moves up and down by a piston of the air cylinder 45, an air cylinder 47 that moves up and down fixed on the lift 46, and a lift 49 a that moves up and down by a piston of the air cylinder 47 A support shaft 26 having one end fixed to the second holding member 25 and a stopper 49b fixed to the other end, and a spring 48 that is compression-inserted between the lifting platform 49a and the stopper 49b.
The support shaft 26 is driven in the horizontal direction and the vertical direction by the actuator 40, and the assembly 50 fixed to the support shaft 26 is also driven integrally in the horizontal direction and the vertical direction.

Next, the operation of the ultrasonic soldering apparatus according to Embodiment 1 of the present invention will be described.
The ultrasonic controller 17 applies ultrasonic vibration with a frequency of, for example, 40 kHz to the tip 11A fixed to the ultrasonic transducer 15 by flowing a high-frequency current through the ultrasonic transducer 15, and the tip 11A that ultrasonically vibrates. Improves the wettability of the melted solder 31.
The infrared heater 20 irradiates the infrared light 28 condensed on the irradiation surface 27A of the tip 11A to heat the tip 11A.
The actuator 40 descends the assembly 50 of the ultrasonic soldering iron 10 and the infrared heater 20 until the end surface 19 of the iron tip 11A contacts the solder surface 31a, and then the end surface 19 of the iron tip 11A contacts the solder surface 31a. Soldering is performed while horizontally moving from the left hand side to the right hand side of the soldered substrate 30 shown in FIG. However, a hot air heater (not shown) is provided on the right side of the ultrasonic soldering iron 10 shown in FIG. 1 so as to preheat the soldering portion.

Here, the irradiation surface 27A of the tip 11A irradiated with the infrared light 28 is preferably closer to the end surface 19 of the tip 11A. However, since the outer diameter of the condensing mirror 22 is large, the optical axis of the infrared light 28 is increased. 3 is required to be inclined so as to look into the solder surface 31a of the substrate 30 to be soldered from above.
When the optical axis 3 of the infrared light 28 is inclined with respect to the solder surface 31a, the center line of the irradiation surface 27A parallel to the central axis 5 of the tip 11A is perpendicular to the solder surface 31a. There is a problem that a part of the infrared light 28 irradiated to the irradiation surface 27A is reflected by the irradiation surface 27A and irradiates the solder surface 31a.
Therefore, in the ultrasonic soldering apparatus 100 according to Embodiment 1 of the present invention, the center line of the irradiation surface 27A parallel to the center axis 5 of the tip 11A is orthogonal to the optical axis 3 of the infrared light 28. Further, the central axis 5 of the tip 11A is inclined without being orthogonal to the solder surface 31a. When the optical axis 3 of the infrared light 28 is tilted by (180-θ) degrees with respect to the solder surface 31a, the center axis 5 of the tip 11A is tilted with respect to the solder surface 31a by an inclination angle θ degrees, whereby infrared light 28 optical axes 3 are orthogonal to the center line of the irradiation surface 27A.
As described above, when the optical axis 3 of the infrared light 28 is orthogonal to the center line of the irradiation surface 27A, the infrared light 28 reflected on the center line of the irradiation surface 27A is directed to the condensing mirror 22, and thus the condensing mirror 22. Then, it is reflected again and irradiated onto the irradiation surface 27A.

However, since the outer surface of the tip 11A is a cylindrical surface, the reflected infrared light 28 is scattered in multiple directions, but the position of the irradiation surface 27A is set so that the surface of the soldered substrate 30 is not irradiated with scattered light. The distance from the end face 19 is set.
The beam diameter d is set to be smaller than the outer diameter D of the tip 11A so that the scattering direction does not become a wide angle.
In addition, in order for the tip 11A to vibrate with stable ultrasonic waves, it is desirable that the tip 11A has a simple cylindrical shape and is orthogonal to the solder surface 31a. However, the ultrasonic wave according to the first embodiment of the present invention is preferred. In the soldering apparatus, the central axis 5 of the cylindrical tip 11A is inclined by an inclination angle θ degrees with respect to the solder surface 31a so that the reflected light does not irradiate the solder surface 31a.

  The ultrasonic soldering apparatus 100 according to the first embodiment of the present invention includes a halogen lamp 21 that emits infrared light 28 and a condensing mirror 22 that collects and radiates the emitted infrared light 28 onto the tip 11A. The soldering iron tip 11A that is ultrasonically vibrated is heated by the infrared light 28, so that the ultrasonic vibration is caused by clogging with the solder residue compared to the case where the iron tip 11A is heated from the outer periphery by the electric heater coil. Is not obstructed, and the labor of cleaning management for preventing clogging can be saved, and the heat efficiency is high and rapid heating can be performed.

  In addition, compared to the case where the solder 31 itself is directly heated by the infrared heater 20, the tip 11A for applying ultrasonic vibration does not take heat from the solder 31, and is stabilized by the heat capacity of the heated tip 11A. The solder 31 can be heated by the temperature, and the solder 31 in the minimum required area can be heated by changing the shape of the tip 11A.

  Further, the beam diameter d on the irradiation surface 27A of the infrared light 28 irradiated to the irradiation surface 27A of the iron tip 11A is equal to or smaller than the outer diameter D of the iron tip 11A and one third or more of the outer diameter D of the iron tip 11A. Thus, since the infrared light 28 is condensed, the entire tip 11A can be heated uniformly, and unnecessary light projection to a region exceeding the outer diameter width of the tip 11A can be prevented.

Further, since the central axis 5 of the tip 11A is inclined with respect to the solder surface 31a so as to be orthogonal to the optical axis 3 of the infrared light 28 inclined with respect to the solder surface 31a, the end surface of the tip 11A Even when the infrared light 28 is irradiated to a portion close to 19, the infrared light 28 scattered on the irradiation surface 27A of the tip 11A does not go to the solder surface 31a, and the soldered substrate 30 may be heated more than necessary. I can prevent it.
Further, since the infrared light 28 is irradiated onto the tip 11A so that the irradiation surface 27A of the tip 11A irradiated with the infrared light 28 is separated from the end surface 19 of the tip 11A, the end surface 19 of the tip 11A is irradiated with the infrared light 28A. Even if the infrared light 28 is irradiated to a nearby location, the infrared light 28 scattered on the irradiation surface 27A of the tip 11A does not go to the solder surface 31a, and the soldered substrate 30 can be prevented from being heated more than necessary.

  Also, since the tip 11A of the ultrasonic soldering iron 10 is coated with a heat-resistant black paint, the absorption of the infrared light 28 is increased, and the heating efficiency is improved.

  Further, the ultrasonic soldering iron 10 and the infrared heater 20 are integrated as an assembly 50 by the first holding member 18 and the second holding member 25, and the integrated assembly 50 is moved up and down and horizontally moved by the actuator 40. In addition, stable heating is always performed while moving up and down and horizontally moving while maintaining the mutual dimensional relationship between the ultrasonic soldering iron 10 and the infrared heater 20.

Embodiment 2. FIG.
FIG. 3 is a partial configuration diagram of an ultrasonic soldering apparatus according to Embodiment 2 of the present invention. FIG. 4 is a front view of a soldering tip of an ultrasonic soldering apparatus according to Embodiment 2 of the present invention.
The ultrasonic soldering apparatus according to Embodiment 2 of the present invention is different from the ultrasonic soldering apparatus 100 according to Embodiment 1 of the present invention in that the tip 11B is the same. The same reference numerals are given and description thereof is omitted.
The iron tip 11B according to the second embodiment of the present invention is different in that a groove-shaped irradiation flat portion 27B is provided on the abdominal surface facing the infrared heater 20 of the iron tip 11A according to the first embodiment of the present invention. Since the rest is the same, the same reference numerals are given to the same parts, and the description is omitted.
The irradiation flat part 27B of the iron tip 11B is provided on the abdominal surface of the iron tip 11B orthogonal to the direction in which the iron tip 11B moves horizontally, and has a plane orthogonal to the optical axis 3 of the infrared light 28, The width of the flat iron tip 11B in the direction of the central axis 5 is larger than the beam diameter d on the plane of the condensed infrared light 28.

  The infrared light 28 irradiated to the irradiation plane portion 27B from the infrared heater 20 is reflected by the plane of the irradiation plane portion 27B, but the plane is orthogonal to the optical axis 3 of the infrared light 28, and is reflected by the plane. The infrared light 28 is directed to the condenser mirror 22. And since it is not a cylindrical side surface like the irradiation surface 27A of the tip 11A, all of the reflected infrared light 28 goes to the condensing mirror 22 and does not generate scattered light in other directions.

  Similar to the ultrasonic soldering apparatus 100 according to the first embodiment of the present invention, the ultrasonic soldering apparatus according to the second embodiment of the present invention and the halogen lamp 21 that emits the infrared light 28 and the emitted red light. A condensing mirror 22 for condensing and irradiating the external light 28 onto the iron tip 11B is provided, and the iron tip 11B is heated by the infrared light 28, so that high efficiency, power saving, rapid heating and combustion products Clean heating is possible.

  In addition, the ultrasonic soldering apparatus according to Embodiment 2 of the present invention applies infrared light to the irradiation plane portion 27B having a surface orthogonal to the optical axis 3 of the infrared light 28 inclined with respect to the solder surface 31a. Since the light 28 is irradiated, even if the infrared light 28 is irradiated to a portion close to the end surface 19 of the tip 11B, all the infrared light 28 reflected by the irradiation plane portion 27B of the tip 11B is directed to the condenser mirror 22 and is soldered. It is possible to prevent the attached substrate 30 from being heated more than necessary.

Embodiment 3 FIG.
FIG. 5 is a partial configuration diagram of an ultrasonic soldering apparatus according to Embodiment 3 of the present invention. FIG. 6 is a front view of a soldering tip of an ultrasonic soldering apparatus according to Embodiment 3 of the present invention.
The ultrasonic soldering apparatus according to the third embodiment of the present invention is different from the ultrasonic soldering apparatus 100 according to the first embodiment of the present invention in that the ultrasonic soldering iron is different and the other parts are the same. Are denoted by the same reference numerals and description thereof is omitted.
In the ultrasonic soldering iron 10 according to the first embodiment of the present invention, the central axis 5 of the iron tip 11A is inclined with respect to the solder surface 31a in the direction in which the iron tip 11A is horizontally moved. In the ultrasonic soldering iron according to the third embodiment of the invention, the center axis 5 of the tip 11C is orthogonal to the solder surface 31a.
The iron tip 11C according to Embodiment 3 of the present invention is provided with a groove-shaped irradiation flat portion 27C on the abdominal surface orthogonal to the horizontal movement direction of the iron tip 11C irradiated with the infrared light 28, and the end face 19 is The point 11C perpendicular to the center axis 5 is different from the point 11A according to the first embodiment of the present invention, and the other points are the same. Omitted.
The irradiation flat portion 27C of the tip 11C is provided on the abdominal surface orthogonal to the direction in which the tip 11C is horizontally moved and faces the infrared heater 20, and has a plane orthogonal to the optical axis 3 of the infrared light 28. However, the width of the flat iron tip 11C in the direction of the central axis 5 is larger than the beam diameter d on the plane of the condensed infrared light 28.

  The infrared light 28 irradiated to the irradiation flat portion 27C from the infrared heater 20 is reflected by the plane of the irradiation flat portion 27C, but the plane is orthogonal to the optical axis 3 of the infrared light 28, and is reflected by the plane. The infrared light 28 is directed to the condenser mirror 22. And since it is not a cylindrical side surface like the irradiation surface 27A of the tip 11A, all of the reflected infrared light 28 goes to the condensing mirror 22 and does not generate scattered light in other directions.

  The ultrasonic soldering apparatus according to the third embodiment of the present invention is similar to the ultrasonic soldering apparatus 100 according to the first embodiment of the present invention. The halogen lamp 21 emits infrared light 28 and the emitted red light. A condensing mirror 22 that condenses and radiates external light 28 onto the iron tip 11C is provided, and the iron tip 11C is heated by the infrared light 28, so that high efficiency, power saving and rapid heating can be achieved, and a product by combustion Clean heating is possible.

  Further, the ultrasonic soldering apparatus according to the third embodiment of the present invention is similar to the ultrasonic soldering apparatus according to the second embodiment of the present invention in that the infrared light 28 tilted with respect to the solder surface 31a. Irradiation plane portion 27C having a surface orthogonal to optical axis 3 is irradiated with infrared light 28. Therefore, even if infrared light 28 is irradiated at a position near end surface 19 of tip 11C, the irradiation plane of tip 11C is irradiated. It is possible to prevent all of the infrared light 28 reflected by the portion 27 </ b> C from moving toward the condenser mirror 22 and heating the soldered substrate 30 more than necessary.

  Further, in the ultrasonic soldering apparatus according to Embodiment 3 of the present invention, since the tip 11C has a simple cylindrical shape and the central axis 5 is orthogonal to the solder surface 31a, the tip 11C is stable. Vibrates ultrasonically.

Embodiment 4 FIG.
FIG. 7 is a partial configuration diagram of an ultrasonic soldering apparatus according to Embodiment 4 of the present invention. FIG. 8 is a side view of a soldering tip of an ultrasonic soldering apparatus according to Embodiment 4 of the present invention.
In the ultrasonic soldering apparatus according to the second embodiment of the present invention, the infrared heater 20 applies infrared light 28 to the irradiation plane portion 27B provided on the abdominal surface of the tip 11B perpendicular to the direction in which the tip 11B moves horizontally. In the ultrasonic soldering apparatus according to Embodiment 4 of the present invention, the irradiation plane portion 27D provided on the abdominal surface of the iron tip 11D parallel to the direction in which the iron tip 11D moves horizontally in the ultrasonic soldering apparatus according to the fourth embodiment of the present invention. This is different from the ultrasonic soldering apparatus according to the second embodiment of the present invention in that the infrared light 28 is irradiated.
The iron tip 11D according to Embodiment 4 of the present invention is an irradiation flat surface portion 27D having planes perpendicular to the optical axis 3 of the infrared light 28 on both abdominal surfaces parallel to the direction in which the iron tip 11D is horizontally moved. Are provided at two points symmetrical about the central axis 5 of the tip 11D.
The irradiation flat portion 27D of the tip 11D has a plane orthogonal to the optical axis 3 of the infrared light 28. When the infrared heater 20 is directed toward this plane, the infrared light 28 is reflected. Return to the condenser mirror 22.

  The ultrasonic soldering apparatus according to the fourth embodiment of the present invention is similar to the ultrasonic soldering apparatus 100 according to the first embodiment of the present invention. The halogen lamp 21 emits infrared light 28 and the emitted red light. A condensing mirror 22 that condenses and radiates external light 28 onto the iron tip 11D is provided, and the iron tip 11D is heated by the infrared light 28, so that high efficiency, power saving and rapid heating can be achieved, and products from combustion Clean heating is possible.

  Further, the ultrasonic soldering apparatus according to the fourth embodiment of the present invention is similar to the ultrasonic soldering apparatus according to the second embodiment of the present invention in that the infrared light 28 tilted with respect to the solder surface 31a. Irradiation plane portion 27D having a surface orthogonal to optical axis 3 is irradiated with infrared light 28, so that irradiation plane of tip 11D is irradiated even if infrared light 28 is irradiated at a position near end surface 19 of tip 11D. It is possible to prevent all of the infrared light 28 reflected by the portion 27 </ b> D from moving toward the condenser mirror 22 and heating the soldered substrate 30 more than necessary.

Further, since the two irradiation flat portions 27D are provided point-symmetrically around the central axis 5 at the tip of the tip 11D, the tip 11D can be more stably ultrasonically vibrated.
In the ultrasonic soldering apparatus according to Embodiment 4 described above, the central axis 5 of the tip 11D is inclined with respect to the solder surface 31a in the direction in which the tip 11D is horizontally moved, but may be orthogonal. .

1 is an overall configuration diagram of an ultrasonic soldering apparatus according to Embodiment 1 of the present invention. It is detail drawing of the ultrasonic soldering iron of the ultrasonic soldering apparatus which concerns on Embodiment 1 of this invention. It is a partial block diagram of the ultrasonic soldering apparatus which concerns on Embodiment 2 of this invention. It is a front view of the iron tip of the ultrasonic soldering apparatus which concerns on Embodiment 2 of this invention. It is a partial block diagram of the ultrasonic soldering apparatus which concerns on Embodiment 3 of this invention. It is a front view of the tip of the soldering apparatus for ultrasonic soldering according to Embodiment 3 of the present invention. It is a partial block diagram of the ultrasonic soldering apparatus which concerns on Embodiment 4 of this invention. It is a front view of the iron tip of the ultrasonic soldering apparatus which concerns on Embodiment 4 of this invention.

Explanation of symbols

  3 Optical axis, 5 Center axis, 10 Ultrasonic soldering iron, 11A, 11B, 11C, 11D Iron tip, 12 Large diameter part, 13 Case, 14 Fixing plate, 15 Ultrasonic vibrator, 16 Lead wire, 17 Ultrasonic controller , 18 First holding member, 19 End face, 20 Infrared heater, 21 Halogen lamp, 22 Condensing mirror, 23 Lead wire, 24 Lamp controller, 25 Second holding member, 26 Support shaft, 27A Irradiation surface, 27B, 27C, 27D Irradiation plane, 28 Infrared light, 30 Soldered substrate, 31 Solder, 31a Solder surface, 32 Lead, 40 Actuator, 41 Servo motor, 42 Coupling, 43 Ball screw, 44 Moving body, 45 Air cylinder, 46 Lifting platform 47 air cylinder, 48 spring, 49a lifting platform, 49b stopper, 50 assembly, 100 Ultrasonic soldering equipment.

Claims (9)

An ultrasonic soldering apparatus that contacts a soldered tip with ultrasonic soldering to the solder melted by heating, and applies ultrasonic vibration to the melted solder to improve wettability and solder the substrate to be soldered. In
An infrared heater that emits infrared light and collects the emitted infrared light to irradiate the tip of the iron;
An ultrasonic soldering apparatus, wherein the solder is heated and melted by the iron tip irradiated with infrared light and heated.   2. The ultrasonic solder according to claim 1, wherein the infrared heater includes a halogen lamp that emits infrared light in a near infrared region, and a condenser mirror that collects the emitted infrared light. Attached equipment.   2. The super beam according to claim 1, wherein a beam diameter of the infrared light on an irradiation surface of the tip is not more than an outer diameter of the tip and not less than 1/3 of an outer diameter of the tip. Sonic soldering equipment. The iron tip is inclined at a predetermined inclination angle in the parallel movement direction of the iron tip with respect to the solder surface of the substrate to be soldered,
The optical axis of the infrared light intersects at a predetermined distance from the side surface of the iron tip and the end surface of the iron tip while being orthogonal to the central axis,
4. The ultrasonic soldering apparatus according to claim 3, wherein the infrared light reflected by the side surface does not reach the surface of the substrate to be soldered. The tip of the iron is provided with an irradiation plane portion orthogonal to the optical axis of the infrared light,
The ultrasonic soldering apparatus according to claim 4, wherein the infrared heater irradiates the infrared light toward the irradiation plane portion. The soldering tip is provided with an irradiation plane portion whose central axis is inclined or orthogonal to the soldering surface of the substrate to be soldered in the parallel movement direction of the soldering tip and orthogonal to the optical axis of the infrared light,
The ultrasonic soldering apparatus according to claim 3, wherein the infrared heater irradiates the infrared light toward the irradiation plane portion. The iron tip is inclined or perpendicular to the solder tip parallel movement direction with respect to the solder surface of the substrate to be soldered, and infrared light is applied to at least one of the two antinode surfaces of the tip tip translation direction. An irradiation plane part orthogonal to the axis is provided,
The ultrasonic soldering apparatus according to claim 3, wherein the infrared heater irradiates the infrared light toward the irradiation plane portion.   The ultrasonic soldering apparatus according to claim 1, wherein the iron tip is coated with a heat-resistant black paint. An assembly in which the ultrasonic soldering iron and the infrared heater are integrated by a holding member;
An actuator for moving the assembly up and down and horizontally;
The ultrasonic soldering apparatus according to claim 1, further comprising:

Images