JP2007167936A - Gold plating peeling method and gold plating peeling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently perform fine gold plating peeling with high precision. <P>SOLUTION: An emission unit 16 emits laser beam SHG of YAG second harmonics received from a YAG laser oscillator via an optical fiber 18 through an optical lens in a unit from an emission port at the tip, and condenses and emits the same into a peeling region HW set to each contact W at an elliptic beam spot SP<SB>SHG</SB>with a high flatness. In the peeling region HE, each gold plating layer 12 is instantaneously evaporated in the vicinity of the elliptic beam spot SP<SB>SHG</SB>by laser energy so as to be removed. In order to remove each gold plating layer 12 in the peeling region HE almost all over, relative movement (scanning) is performed between the YAG second harmonic laser beam SHG and each contact W as a work in a direction at a desired angle to the major axis direction of the elliptic beam spot SP<SB>SHG</SB>. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for locally peeling a gold plating formed on a surface of a metal member, and more particularly, to a gold plating peeling method and apparatus suitable for fine gold plating peeling processing.

  Various surface treatments are applied to pin terminals or contacts of connectors and lead frames, and in particular, plating of gold or tin is typical. Recently, gold plating has become more popular than tin plating because of lead-free measures. Generally, in printed circuit board mounting, pin terminals of electronic components are joined to wiring patterns or through holes on the board by soldering. However, in this type of soldering, since the gold plating on the surface of the pin terminal tends to get wet with the solder, the solder on the board crawls up the pin terminal along the gold plating, and the solder on the board is insufficient and the solder joint strength There is a problem that is weakened.

Conventionally, as a technique for preventing the solder from creeping up on the surface of the terminal as described above, so-called solder rising, the gold plating is locally peeled and removed by irradiating the intermediate portion of the terminal with a laser. Therefore, a surface treatment method that can prevent solder from rising from the terminal portion to the contact portion has been proposed (see, for example, Patent Document 1).
JP 2000-152750 A

  In general, the peeling width of the gold plating of the terminal is sufficient for preventing the solder from rising, and it is not preferable to peel the gold plating more than necessary. At present, with the downsizing of electronic components, terminal pins are becoming smaller in diameter and pitch, and accordingly, the gold plating peeling width is also set to a small area of 0.5 mm × 0.5 mm or less, for example. It is desired. However, the conventional method of peeling / removing by laser irradiation can only form a peeling width corresponding to the beam diameter of the laser emission unit. There was only a way. Therefore, conventionally, it has been necessary to prepare a large number of laser emission units having different beam diameters, and there has been a problem that the initial cost is increased.

  The present invention has been made in view of the above-described problems, and provides a gold plating peeling method and a gold plating peeling apparatus that can perform fine gold plating peeling processing efficiently and with high accuracy and can change the peeling width. For the purpose.

  In order to achieve the above object, a gold plating peeling method of the present invention is a gold plating peeling method in which a gold plating layer formed on a surface of a metal material is peeled in a desired peeling region, and the YAG harmonics are formed in the peeling region. The laser beam is irradiated with an elliptical beam spot having a high flatness to remove the irradiated portion of the gold plating layer, and the peeling region is formed in a direction that forms a desired angle with respect to the major axis direction of the elliptical beam spot. The YAG harmonic laser beam is moved relative to the metal material so as to remove the gold plating layer in the region.

  Further, the gold plating peeling apparatus of the present invention is a gold plating peeling apparatus for peeling a gold plating layer formed on the surface of a metal material in a desired peeling region, and the gold plating layer formed on the surface of the metal material Is a gold plating stripping apparatus for stripping a laser beam in a desired stripping region, and a laser oscillator that generates a YAG harmonic laser beam, and an elliptical beam having a high flatness for the YAG harmonic laser beam from the laser oscillator An emission unit that focuses on a spot and irradiates the peeling region; and a rotation angle adjusting unit that rotates the emission unit at an arbitrary angle around the central axis thereof in order to vary the width of the peeling region; The separation region is scanned in a direction in which the elliptical beam spot makes an angle corresponding to the rotational angle position of the emission unit with respect to the major axis direction of the ellipse. The gold-plated layer on the inner so as to peel off, and a scanning means for relatively moving the YAG harmonic laser beam emitted from the emitting unit with respect to the metallic material.

  In the present invention, gold plating stripping is performed by laser energy of YAG harmonics. Since the YAG harmonic has a very high optical coupling with gold, the gold plating in the desired peeling region can be effectively peeled off by scanning the YAG harmonic laser light. This makes it possible to simultaneously achieve a sufficient laser power density for stably and reliably removing the gold plating layer at the laser spot position and a high processing speed for efficiently removing the gold plating layer in the peeling region in a short time. It is possible to achieve a highly practical gold plating peeling process. Furthermore, in the present invention, the beam spot of the YAG harmonic laser beam is formed into an elliptical shape with a high flatness, and it is peeled off without lowering the laser power density by scanning it by tilting it to an arbitrary or desired angle. The width can be arbitrarily varied within a predetermined range (within the range from the major axis length of the laser focusing ellipse diameter to the minor axis length).

  According to a preferred aspect of the present invention, the YAG harmonic laser beam is irradiated at a desired angle in the peeling scanning direction or the opposite direction, so that the gold plating layer in the peeling region can be formed by one beam scanning. In addition, it can be peeled off almost completely including not only the upper surface but also the side surface.

  According to a preferred aspect of the present invention, the emitting unit collimates the YAG harmonic laser beam emitted from the end face of the optical fiber into parallel light, and the YAG that has passed through the collimating lens. A first focusing lens for focusing the harmonic laser light in a first direction orthogonal to the laser optical axis direction, and the YAG harmonic laser light that has passed through the first focusing lens in the laser optical axis direction and the And a second focusing lens for focusing in a second direction orthogonal to the first direction. As a preferred embodiment in this case, the first focusing lens is composed of a first cylindrical lens, and the second focusing lens is arranged in multiple stages on the laser optical axis in a direction orthogonal to the first cylindrical lens. It can be constituted by second and third cylindrical lenses. In such a configuration, the diameter of the elliptical beam spot in the major axis direction is defined or set by the core diameter of the optical fiber, the focal length of the collimating lens, and the focal length of the first cylindrical lens. Can be defined or set by the core diameter of the optical fiber, the focal length of the collimating lens, and the combined focal length of the second and third cylindrical lenses.

  According to a preferred aspect of the present invention, the emission unit has a unit casing surface on the laser emission port side formed in a truncated cone shape. In such a configuration, when the emission unit is irradiated with a large inclination, the unit can be prevented from interfering with or coming into contact with the metal material even if the emission unit is rotated to an arbitrary angle.

  According to a preferred aspect of the present invention, the emission unit is a unit housing in which at least the tip on the laser emission port side is surface-treated with gold plating, or a unit in which at least a part of the outer wall is made of fluororesin. Has a housing. According to such a configuration, it is possible to obtain an emission unit that is splashed from a workpiece during gold plating peeling processing, or that is not easily rusted even during operation in a plating factory.

  According to a preferred aspect of the present invention, the laser oscillator has a Q switch for generating laser light having a YAG harmonic of a Q switch pulse. By irradiating the peeling region with a YAG harmonic laser beam of Q switch pulse, the gold plating layer can be peeled cleanly with the YAG harmonic energy with little thermal influence.

  The present invention can be applied to any gold plating peeling process, but is particularly suitable for gold plating peeling of contacts of electronic components. In particular, even when a separation region is set on both surfaces of the contact, it can be easily handled.

  A first gold plating peeling apparatus according to the present invention suitable for double-sided peeling of a connector is a gold plating peeling apparatus for peeling a gold plating layer formed on the surface of a connector terminal in a desired peeling area, which is a YAG harmonic. A laser oscillator that generates a laser beam of the above, a beam splitter that splits the YAG harmonic laser light generated by the laser oscillator into first and second branched YAG harmonic laser lights, and the beam splitter obtained by the beam splitter A first optical fiber for transmitting a first branched YAG harmonic laser beam; a second optical fiber for transmitting the second branched YAG harmonic laser beam obtained from the beam splitter; The first branched YAG harmonic laser beam emitted from the end face of the first optical fiber is converted into a first elliptical beam spot having a high flatness. In order to vary the width of the first peeling region and the first emission unit that is bundled and irradiates the first peeling region set on the first surface of the connector terminal, the first emission unit The first rotation angle adjusting means for rotating the unit at an arbitrary angle with the center axis as the rotation center, and the second branched YAG harmonic laser beam emitted from the end face of the second optical fiber is flattened. A second emission unit that focuses on a second elliptical beam spot having a high height and irradiates a second peeling region set on a second surface opposite to the first surface of the connector terminal; In order to vary the width of the second peeling region, second rotation angle adjusting means for rotating the second emission unit at an arbitrary angle with the central axis as the rotation center; and the first and second ellipses Shaped beam spots in the long axis direction Are emitted from the first and second emission units, respectively, so as to separate the gold plating layer in each region by scanning the first and second separation regions in a direction inclined at a desired angle with respect to each other. Scanning means for moving the first and second branched YAG harmonic laser beams relative to the connector terminal. In such an apparatus configuration, the gold plating stripping can be simultaneously performed on the first and second stripping regions by the simultaneous two-branch method using one laser oscillator.

  A second gold plating peeling apparatus according to the present invention suitable for peeling both sides of a connector is a gold plating peeling apparatus for peeling a gold plating layer formed on the surface of a connector terminal in a desired peeling area, A laser oscillator that generates a harmonic laser beam, a laser beam path switching unit that switches an optical path of the YAG harmonic laser beam generated by the laser oscillator to one of a first optical path and a second optical path; A first optical fiber for transmitting the YAG harmonic laser beam switched to the first optical path by a laser optical path switching unit; and the YAG harmonic switched to the second optical path by the laser optical path switching unit. A second optical fiber for transmitting the wave laser beam, and the YAG harmonic laser beam emitted from the end face of the first optical fiber. A first emission unit that focuses light into an elliptical beam spot having a high flatness and irradiates the first separation unit set on the first surface of the connector terminal; and a width of the first separation region In order to vary the first output unit, the first rotation angle adjusting means for rotating the first output unit at an arbitrary angle around the central axis thereof, and the YAG output from the end face of the second optical fiber. A second emission for converging the harmonic laser beam into an elliptical beam spot having a high flatness and irradiating the second laser beam in a second peeling region set on the second surface opposite to the first surface of the connector terminal. A second rotation angle adjusting means for rotating the second emission unit at an arbitrary angle about the center axis thereof as a rotation center in order to vary the width of the unit and the second peeling region; and the elliptical beam Spot is its long axis The first emission unit or the second emission unit emits light so that the first and second peeling regions are scanned in a direction inclined at a desired angle with respect to the direction so as to peel the gold plating layer in each region. Scanning means for moving the YAG harmonic laser beam to be moved relative to the connector terminal. In such an apparatus configuration, it is possible to sequentially perform gold plating stripping on the first and second stripping regions with a time difference by an optical path switching method using one laser oscillator.

  According to the gold plating stripping method or the gold plating stripping apparatus of the present invention, the above-described configuration and operation enable efficient and high-precision fine gold plating stripping processing, and the elliptical beam spot on the optical axis. The peeling width can be arbitrarily changed by rotating it around a predetermined angle.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  1 to 3 show an embodiment of the gold plating peeling method in the present invention. The illustrated workpiece W is, for example, a pin terminal of an electronic component or a lead of a lead frame (hereinafter collectively referred to as “contact”). Each contact W is made of, for example, a Cu (copper) alloy 10, and a gold plating layer 12 is formed on the entire surface.

The emission unit 16 is optically connected to a YAG laser oscillator 20 (FIG. 6), which generates laser light SHG of YAG second harmonic (532 nm), which will be described later, via an optical fiber 18, and the optical fiber is contained in the unit. The YAG second harmonic laser beam SHG emitted from the end surface 18 is passed through optical lenses 54 to 60 (FIGS. 7 and 8), which will be described later, in the unit, and is emitted from the emission port at the tip, and set to each contact W. _Condensing irradiation is performed with the elliptical beam spot SP _SHG having a high flatness in the peeled area HE. In this example, as shown in FIG. 2, the diameter R _Y of the elliptical beam spot SP _{SHG in} the major axis direction is made to coincide with the size L _HE of the peeling region HE in the contact longitudinal direction.

In the peeling region HE, the gold plating layer 12 is instantly evaporated and removed by laser energy in the vicinity of the elliptical beam spot SP _SHG . Usually, a nickel plating layer 14 for preventing diffusion between copper and gold is formed as a base film between the Cu alloy 10 which is a material metal of the contact W and the gold plating layer 12, as shown in FIG. The nickel base film 14 is exposed at the portion where the gold plating layer 12 is removed.

In order to remove the gold plating layer 12 in the peeling region HE almost completely, relative movement is performed between the YAG second harmonic laser beam SHG emitted from the emission unit 16 and the contact W to be processed. More specifically, the peeling region HE is formed in a direction X in which the elliptical beam spot SP _SHG of the YAG second harmonic laser beam SHG forms a desired angle (90 degrees in the example of FIG. 2) with respect to the elliptical major axis direction. A relative movement such as scanning or traversing is performed. Normally, the emission unit 16 side is fixed, and the contact W side to be processed is fed in a constant direction (−X direction) at a constant speed in the form of a hoop material or a reel material. As described above, since the diameter R _{Y in} the major axis direction of the elliptical beam spot SP _SHG is equal to the contact longitudinal direction size L _HE of the peeling region HE, the gold plating layer 12 in the rectangular peeling region HE is formed by one-way scanning. All or almost all can be peeled off.

Further, as in this example, when a large number of contacts W ₁ , W ₂ , W ₃ ,... Having the same shape and the same size are arranged in a line, as shown in FIG. All contacts W ₁ , W ₂ , W ₃ ,... Are scanned once in the X direction from end to end of the contact row while continuously emitting YAG second harmonic laser light SHG. The gold-plated layer 12 can be peeled without any cracks in the peeling region HE. In this embodiment, the YAG second harmonic laser beam SHG of the Q switch pulse is used.

As an example, when the size of the peeling region HE is D _HE (contact width direction) = 0.3 mm, L _HE (contact longitudinal direction) = 0.3 mm, and the thickness of the gold plating layer 12 is 0.1 μm, The average output of the YAG second harmonic Q-switched pulse laser beam SHG is 30 W, the pulse frequency is 20 kHz, and the size of the beam spot SP _SHG is R _X (elliptical minor axis direction) = 0.1 mm, R _Y (elliptical major axis direction) ) = 0.3 mm, and the scanning speed is set to 10 m / min.

As described above, the gold plating peeling method of this embodiment irradiates the Q switch pulse laser beam SHG of the YAG second harmonic in order to locally peel the gold plating layer 12 of the contact W limited to the peeling region HE. The beam spot SP _SHG of the YAG second harmonic laser beam SHG is formed in an elliptical shape with a high flatness, and is scanned in a direction that forms a desired angle with respect to the ellipse major axis direction of the beam spot SP _SHG. It is characterized by that.

  The reason why the YAG second harmonic laser beam is used as the laser beam is that the YAG harmonic has very high optical coupling with gold (Au). The fundamental wave of an Nd: YAG laser, which is a typical YAG laser, is 1064 nm. This YAG fundamental wave (1064 nm) absorbs iron (Fe) -based metal relatively well, but Au-based metal absorbs only a little. For this reason, if YAG fundamental wave laser light is used for the gold plating peeling process, it is very difficult to input heat to the gold plating layer. If the laser power is increased forcibly, the gold plating layer will blow off beyond the desired peeling area. May be damaged, and highly accurate micromachining of 1 mm or less is almost impossible. However, Au absorbs the harmonic of the YAG fundamental wave, that is, the second harmonic (532 nm), the third harmonic (355 nm), the fourth harmonic (266 nm), and the like well. For example, the absorption rate of Au with respect to the second harmonic (532 nm) is 50% or more. In view of the fact that the absorption rate of Fe, which is said to absorb the YAG fundamental wave well, is 40% or less, it can be seen how high the absorption rate is. Practically, the second harmonic (532 nm) is sufficient for the gold plating peeling process. Further, since this type of gold plating peeling process is a laser process for removing the gold plating layer in the peeling area without excess or deficiency, a laser beam of Q switch pulse with less thermal influence than a normal pulse or a long pulse is suitable.

Further, according to the method in which the beam spot SP _SHG of the YAG second harmonic laser beam SHG is formed into an elliptical shape with a high flatness and scanned, a sufficient laser for removing the gold plating layer stably and reliably at the laser spot position. The power density and the high processing speed for efficiently removing the gold plating layer in the peeling region HE in a short time can be simultaneously applied to realize a highly practical gold plating peeling process.

  Further, in this embodiment, the peeling width can be arbitrarily adjusted without lowering the laser power density by a beam spot rotating function as described below.

  As shown in FIG. 1, the emission unit 16 is supported by the holder 15 so that the angle in the circumferential direction can be adjusted. That is, an annular circumferential groove 17 extending in the circumferential direction is formed on the outer periphery of the upper housing 50 (see FIGS. 7 and 8) of the emission unit 16, and the circumferential convex portion (see FIG. (Not shown) is rotatably supported. By rotating the emission unit 16 with respect to the holder 15 and fixing it with a fastening screw 19, the emission unit 16 can be set to an arbitrary rotation angle. More specifically, a positioning mark is provided on the surface of the emission unit 16 and an angle scale (not shown) is provided on the holder 15, and the positioning mark and the angle scale are aligned to fasten the emission unit 16 with a fastening screw 19. By attaching and fixing, the emission unit 16 can be adjusted to an arbitrary rotation angle or rotation direction.

As shown in FIG. 4, when the angle formed by the scanning direction X with respect to the major axis direction of the elliptical beam spot SP _SHG is θ, the peeling width L _HE is expressed as L _HE = R _Y tan θ. Here, R _Y is the length of the major axis of the elliptical beam spot SP _SHG as described above. Therefore, for example, when θ = 45 degrees is set, L _HE = R _Y / 2. Thus, by changing the angle θ formed by the scanning direction X with respect to the major axis direction of the elliptical beam spot SP _SHG , the width size L _HE of the separation region HE is set to R _X (minor axis) while keeping the laser power density constant. The length can be variably adjusted within the range of R _y (long axis length).

FIG. 5 shows, as a comparative example, an operation in the case where the beam spot SP _SHG of the YAG second harmonic laser beam SHG is formed in a conventional general shape, that is, in a circular shape, and the inside of the peeling region HE is scanned. (A) of FIG. 5 matches the diameter of the circular beam spot SP _SHG with the dimension (contact longitudinal direction size) of the separation region HE. In this case, the laser energy of the YAG second harmonic laser beam SHG can be irradiated all over the gold plating layer 12 in the peeling region HE by one-way scanning, but since the area of the beam spot SP _SHG is very large, the laser There is a disadvantage that the power density is low and it is difficult to efficiently and reliably remove the gold plating layer 12. Therefore, in order to reliably remove the gold plating layer at the laser spot position, it is necessary to reduce the diameter of the circular beam spot SP _SHG sufficiently small as shown in FIG. However, in this case, it is impossible to remove all of the gold plating layer 12 in the peeling region HE by a single one-way scan, and a plurality of scans or reciprocating scans must be performed. The required time becomes very long. Thus, with a circular beam spot, there is a trade-off relationship between the laser power density and the processing speed, and a highly practical gold plating stripping process cannot be realized.

  FIG. 6 shows a configuration of a gold plating peeling apparatus suitable for use in the gold plating peeling method of this embodiment. In this gold plating stripping apparatus, the YAG laser oscillator 20 includes a pair of termination mirrors 22 and 24, a solid laser active medium 26, a Q switch 28, a wavelength conversion crystal 30, and a harmonic separation output mirror 32 in a linear array type. .

  Both the end mirrors 22 and 24 face each other to constitute an optical resonator. The reflecting surface 22a of one terminal mirror 22 is coated with a film reflective to the fundamental wavelength (1064 nm). The reflective surface 24a of the other terminal mirror 24 is coated with a film reflective to the fundamental wavelength (1064 nm) and coated with a film reflective to the second harmonic (532 nm).

  The active medium 26 is made of, for example, an Nd: YAG rod, and is disposed at a substantially central position between the both end mirrors 22 and 24 and optically pumped by the electro-optic excitation unit 34. The electro-optic excitation unit 34 has an excitation light source (for example, an excitation lamp or a laser diode) for generating excitation light toward the active medium 26, and is driven to be lit by the excitation current from the laser power source unit 36. As a result, the active medium 26 is continuously pumped. The laser power source unit 36 drives the electro-optical excitation unit 34 under the control unit 38. The light beam LB having the fundamental wavelength (1064 nm) generated in the active medium 26 is confined between the terminal mirrors 22 and 24 and amplified.

The wavelength conversion crystal 30 is made of a nonlinear optical crystal such as a KTP (KTiOPO ₄ ) crystal or an LBO (LiB ₃ O ₅ ) crystal, and is arranged near the other end mirror 24 and is excited by this optical resonator. The second harmonic (532 nm) light beam SHG is generated on the optical path of the optical resonator by nonlinear optical action with the fundamental wavelength.

  The second harmonic light beam SHG emitted from the wavelength conversion crystal 30 toward the terminal mirror 24 is returned by the terminal mirror 24 and passes through the wavelength conversion crystal 30. The second harmonic light beam SHG emitted from the wavelength conversion crystal 30 to the opposite side of the terminal mirror 24 is disposed obliquely at a predetermined angle (for example, 45 degrees) with respect to the optical path or optical axis of the optical resonator. The light is incident on the harmonic separation output mirror 32, and is reflected or separated and output by the mirror 32 toward a predetermined direction, that is, the incident unit 42.

  The Q switch 28 is composed of an acousto-optic Q switch, for example. The control unit 38 drives the Q switch 28 via a Q switch driver 40 by a high frequency electric signal that is temporarily interrupted at a predetermined cycle. Each time the high-frequency electrical signal is interrupted, a YAG fundamental wave laser beam LB having a very high peak power is generated between the optical resonators 22 and 24, whereby the second YAG second wave of the giant pulse is generated from the harmonic separation output mirror 32. Harmonic laser light SHG is output.

  The incident unit 42 has a built-in condensing lens 44, and the YAG second harmonic laser beam SHG from the harmonic separation output mirror 32 is focused by the focusing lens 44 and is applied to one end face (incident end face) 18 a of the optical fiber 18. Make it incident. The optical fiber 18 is made of, for example, an SI (step index) fiber, and transmits the YAG second harmonic laser beam SHG incident by the incident unit 42 to the emission unit 16.

In this embodiment, as described above, the elliptical beam spot SP _SHG of the YAG second harmonic laser beam SHG scans or crosses the peeling region HE in the elliptical minor axis direction X orthogonal to the elliptical major axis direction. A move is made. That is, relative movement is performed between the YAG second harmonic laser beam SHG emitted from the emission unit 16 and the contact W to be processed. For this relative movement, there is provided a scanning mechanism 46 formed of, for example, an XY table that holds or places the contact W side and moves it in a predetermined direction (that is, the direction opposite to the beam scanning direction). In this case, the emission unit 16 is arranged at a fixed position via the holder 15 with the emission unit rotation function.

  7 and 8 are longitudinal sectional views showing the configuration of the emission unit 16 in this embodiment. In the emission unit 16, a cylindrical upper housing 50 made of stainless steel and a cylindrical lower housing 52 made of copper alloy are integrally coupled with bolts (not shown) or the like. . A circumferential groove 17 for rotating the unit is formed in the upper housing 50.

  The optical fiber 18 is inserted into the casing along the unit center axis from the upper part of the upper casing 50, and the emission end face 18b of the optical fiber 18 faces the cavity in the casing. Inside the upper housing 50, a collimating lens 54 is disposed on the unit center axis near the emission end face 18 b of the optical fiber 18, and a plano-convex cylindrical lens 56 is disposed behind or below the upper end 50. In the lower housing 52, two plano-convex cylindrical lenses 58 and 60 are arranged close to each other on the unit center axis, and a protective glass 62 is detachably attached to the exit port at the lower end (tip). Yes. The plano-convex cylindrical lens 56 on the upper housing 50 side and the plano-convex cylindrical lens (58, 60) on the lower housing 52 side are arranged in a direction in which the generatrixes of the respective cylindrical surfaces are orthogonal to each other.

  The YAG second harmonic laser beam SHG emitted radially from the emission end face 18b of the optical fiber 18 first enters the collimator lens 54, where it is collimated into parallel light. The YAG second harmonic laser beam SHG that has passed through the collimating lens 54 passes through the upper plano-convex cylindrical lens 56, then passes through the lower plano-convex cylindrical lens (58, 60), and then passes through the protective glass 62 and passes through the protective glass 62. The light is emitted to the outside and focused on the processing point.

Here, the upper plano-convex cylindrical lens 56 focuses the YAG second harmonic laser beam SHG only in the first direction (Y direction) orthogonal to the laser optical axis direction, and the lower plano-convex cylindrical lens (58, 60) The YAG second harmonic laser beam SHG is focused only in the laser optical axis direction and the second direction (X direction) orthogonal to the first direction (Y direction). The diameter (core diameter) of the output end face 18b of the optical fiber 18 is a, the focal length of the collimating lens 54 is f ₅₄ , the focal length of the upper plano-convex cylindrical lens 56 is f ₅₆ , and the focal lengths of the lower plano-convex cylindrical lenses 58 and 60. Are f ₅₈ and f ₆₀ , respectively, and their combined focal length is f _C , in the first direction (Y direction) and the second direction (X direction) of the elliptical beam spot SP _SHG formed at the processing point. The diameters R _Y and R _X are expressed by the following formulas (1) and (2).
R _Y = a * f ₅₆ / f ₅₄ (1)
R _X = a * f _C / f ₅₄ (2)
However, f _C = {(1 / f ₅₈ ) + (1 / f ₆₀ )} ⁻¹

As an example, when a = 200 μm, f ₅₄ = 70 mm, f ₅₆ = 100 mm, f ₅₈ = 70 mm, and f ₆₀ = 60 mm, R _Y = 288 μm and R _X = 91 μm. That is, the first focusing direction (Y direction) by the upper plano-convex cylindrical lens 56 corresponds to the major axis direction of the elliptical beam spot SP _SHG , and the second focusing direction (58, 60) by the lower plano-convex cylindrical lens (58, 60). X direction) corresponds to the minor axis direction of the elliptical beam spot SP _SHG . In the case of the above embodiment, the ratio of the major axis direction diameter R _Y to the minor axis direction diameter R _X is 288: 91, which is about 3: 1. When the flatness of the elliptical beam spot SP _SHG is so large, the above-described effects of the present invention can be sufficiently achieved. In practice, the ratio of R _{Y to} R _X is preferably at least 2 or more.

  Further, the emission unit 16 has a surface treatment of the lower housing 52 with a gold plating 64 and a cover 66 made of a fluororesin is attached from the lower portion to the middle portion of the upper housing 50, and the outer wall structure (64, 66). The anti-rust function is realized. That is, the emission unit 16 is not only exposed to gold splash from the processing point during the gold plating peeling process, but generally used in a plating factory, and is easily rusted in a structure in which a casing member such as aluminum or SUS is exposed. . Thus, by providing the surface treatment processing of the gold plating 64 and the fluororesin cover 66, a unit structure that does not rust can be obtained. Note that the fluororesin cover 66 may extend to the upper end of the upper housing 50.

The embodiment shown in FIGS. 1 to 4 relates to a gold plating peeling method in the case where a peeling region HE is set on one surface (upper surface) of the contact W. When the separation region HE is set on the entire circumference (upper surface, both side surfaces, and the lower surface) of the contact W, as shown in FIG. 9, each of the upper separation region HE _A and the lower region HE _B (individually) The harmonic laser beam SHG may be irradiated in the same manner as in the above embodiment to remove the gold plating in both regions HE _A and HE _B. Further, since the YAG second harmonic laser beam SHG irradiates the side surface of the contact W when scanning or traversing the upper peeling region HE _A or the lower peeling region HE _B , the side gold plating 12 can also be removed. That is, the gold plating 12 can be peeled around the contact W across the upper peeling region HE _A and the lower peeling region HE _B.

  In such a double-sided peeling process, one output unit 18 may be shared by both sides, but as shown in FIG. 10, the two output units 18A, 18B are inclined and processed by being individually assigned to both sides. The efficiency can be greatly increased.

In the method shown in FIG. 10A, the YAG second harmonic laser beam SHG is simultaneously emitted from the upper emission unit 16A and the lower emission unit 16B, and is condensed and applied to the upper and lower separation regions HE _A and HE _B. It is. According to this method, the workpiece, for example, the contact W can be passed once, and the metal plating layer 12 can be simultaneously peeled off in the peeling areas HE _A and HE _B on both the upper and lower surfaces. This can be handled by simultaneous two branches by the laser oscillator 70 (FIG. 13).

In the method shown in FIG. 10B, the upper emission unit 16A and the lower emission unit 16B are offset and arranged opposite to each other, and the YAG second harmonic laser is shifted from the upper emission unit 16A and the lower emission unit 16B with a time shift. The light SHG is condensed and applied to the upper peeling region HE _A and the lower peeling region HE _B , respectively. Even in this method, it is possible to separate the metal plating layers 12 in the upper and lower peeling regions HE _A and HE _B in the process of passing the workpiece once, and one laser oscillator as will be described later. This can be dealt with by switching the laser light path according to 70 (FIG. 13).

  The method shown in FIG. 10C is an example in which the upper emission unit 16A and the lower emission unit 16B are arranged at an inclination angle of 45 degrees or less with respect to the peeling surface. In this example, the arrangement height of the emission unit 16 can be reduced, which is effective when it is desired to reduce the layout of the peeling processing apparatus.

FIG. 11 is an example of an aspect in which the emission unit 16 is inclined. By connecting the holder 15 to an arm 65 or the like of a robot or the like, the center axis of the emission unit 16 is inclined in the direction of the elliptical minor axis direction X. In this state, peeling scanning can be performed. By configuring the lower casing 52 of the emission unit 16 in a truncated cone shape, as shown in FIG. 10C, when the emission unit 16 (16A, 16B) is inclined at 45 degrees or less, the lower casing 52 is in contact with Interference with W is avoided. When the lower casing 52 of the emission unit 16 has a truncated cone shape, the sectional structure of the emission unit 16 is as shown in FIGS. When handling the emission unit 16 with the robot arm, the robot arm side can also have a function of rotating the emission unit 16 around the central axis by a predetermined angle in accordance with the separation width _LHE of the separation region. .

  FIG. 13 shows a configuration example of a laser oscillator 70 used in the twin type emission unit system as shown in FIG. In the figure, parts that are the same as those in the laser oscillator of FIG. In this laser oscillator 70, the YAG second harmonic laser beam SHG output from the harmonic separation output mirror 32 is selectively entered into the two optical fibers 18A and 18B simultaneously in two branches or without branching. . Here, one optical fiber 18A communicates with the upper output unit 16A, and the other optical fiber 18B communicates with the lower output unit 16B.

In the case of the simultaneous bifurcation method, a half mirror 72 is arranged on the reflection optical path of the harmonic separation output mirror 32, and a total reflection mirror or a vent mirror 74 is arranged behind the half mirror 72. The reflectance and transmittance of the half mirror 72 may each be 50%. On the reflected light path of the half mirror 72, the first shutter (ST) 76A and the first incident unit 42A are arranged in a line. On the reflected light path of the bent mirror 74, the second shutter (ST) 76B and the second incident unit 42B are arranged in a line. The YAG second harmonic laser beam SHG output from the harmonic separation output mirror 32 is incident on the half mirror 72, where it is divided into reflected light and transmitted light. The first branched YAG second harmonic laser beam SHG _A reflected by the half mirror 72 passes through the first shutter 76A in the open state and enters the optical fiber 18A from the first incident unit 42A. The second branch YAG second harmonic laser beam SHG _B transmitted through the half mirror 72 is bent in the optical path by the vent mirror 74, passes through the second shutter 76B in the open state, and passes through the optical fiber from the second incident unit 42B. 18B.

  In the case of the optical path switching method, the half mirror 72 is replaced with a total reflection mirror or a vent mirror 78. Then, the position of the vent mirror 78 is moved to a position (working position) on the optical path connecting the harmonic separation output mirror 32 and the total reflection mirror 74 by a mirror moving mechanism (not shown), and a position deviated from the optical path (retraction position). Can be switched between. When the vent mirror 78 is switched to the working position, the YAG second harmonic laser beam SHG from the harmonic separation output mirror 32 has its optical path bent by the vent mirror 78, and the first shutter 76A and the first shutter 76A in the open state One optical unit 18A is inserted into the optical fiber 18A. When the vent mirror 78 is switched to the retracted position, the YAG second harmonic laser beam SHG from the harmonic separation output mirror 32 enters the vent mirror 74 and is reflected by the mirror 74 before being opened. The second shutter 76B and the second incident unit 42B are inserted into the optical fiber 18B.

  Although not shown, each of the shutters 76A and 76B includes a total reflection mirror that can move between a position on the laser optical path (closed position) and a position off the optical path (open position). And a light absorber that receives laser light reflected in a predetermined direction at the closed position. In this embodiment, the YAG second harmonic laser beam SHG is emitted from each of the emission units 16A and 16B by closing the shutters 76A and 76B while oscillating and outputting the YAG second harmonic laser beam SHG from the laser oscillator. Can be stopped. Then, by switching the shutters 76A and 76B from the closed state to the open state, the emission of the YAG second harmonic laser beam SHG can be started immediately (for example, within 200 milliseconds).

  In this laser oscillator 70, a guide LD (semiconductor laser) 78 generates visible laser light GB used for optical alignment. The visible laser beam GB enters the optical resonator from behind the terminal mirror 24 via the bent mirrors 80 and 82, and is given to the fundamental wave optical system and the second harmonic optical system.

  The preferred embodiments of the present invention have been described above, but various modifications can be made within the scope of the technical idea of the present invention. For example, the laser oscillators 20 and 70 in the above-described embodiment oscillate and output the YAG second harmonic laser beam SHG with a Q switch pulse, but can also oscillate and output with a long pulse having a variable pulse width. It is also possible to focus and irradiate the peeling region HE of the workpiece with YAG second harmonic laser beam SHG having a pulse longer than 16 (16A, 16B). Further, in the laser transmission system, for example, a beam expander 84 or an optical mirror 86 can be used instead of the optical fiber as shown in FIG. In this case, as shown in FIG. 15, the optical system in the emission unit 100 can be constituted by two optical lenses.

  In FIG. 15, the emission unit 100 has a substantially rectangular parallelepiped main body 124 made of, for example, aluminum, and two holes or cavities 125 pass through the center of the main body 90 in the vertical direction (optical axis direction). Cylindrical lenses 120 and 122 are vertically arranged with variable distance intervals. Both cylindrical lenses 120 and 122 are plano-convex cylindrical lenses made of, for example, synthetic quartz or BK7 material, with the respective flat surfaces facing downward (to the workpiece W side) and the generatrixes of the respective cylindrical surfaces being orthogonal to each other. Placed horizontally.

  The upper cylindrical lens 120 is mounted on a flange portion of a fixed lens holding portion 127 that extends in a cylindrical shape from the upper surface of the main body 124, and from both the opposite left and right end portions through the lens pressing member 128 from above. It is clamped and held by the bolt 130.

  The lower cylindrical lens 122 is held by a rectangular cylindrical movable lens holding portion 134 that is movable in the vertical direction (optical axis direction) within the cavity portion 125 of the main body 124. More specifically, the cylindrical lens 122 is mounted on a flange portion formed at the lower portion of the movable lens holding portion 134, and is clamped and held by bolts 138 from above at the opposite left and right end portions via the lens pressing member 136. Is done. The upper part of the movable lens holding part 134 constitutes a guide part 134a that can be rubbed in the vertical direction along the upper inner wall 125a formed in a rectangular section of the cavity part 125. A plurality of screw holes 139 communicating with the cavity 125 are formed in the back of the hole 123 formed on one side surface of the main body 124, and the tip of the screw 140 is guided from the screw hole 139 to the guide portion 134 a of the movable lens holding portion 134. The movable lens holding part 134 and the cylindrical lens 122 can be fixed at desired positions on the optical axis.

  The movable lens holding part 134 is supported on a rotating ring 142 whose diameter is slightly larger than that. The lower portion of the cavity portion 125 is formed in a circular cross section whose diameter is slightly larger than that of the rectangular upper inner wall 125a, and a screw thread (female screw) 144 is formed on the inner wall 125b. A screw thread (male thread) is formed on the outer peripheral surface of the rotating ring 142 to be screwed with the screw thread 144 of the lower inner wall 125b of the cavity 125. A bolt 146 constituting a rotary operation knob is attached to the lower surface of the rotary ring 142. When the rotary operation knob 146 is turned with a finger by a person, for example, the rotary ring 142 is fed vertically upward. As a result, the movable lens holding part 134 and the cylindrical lens 122 are also moved vertically upward, and the rotating ring 142 is sent vertically downward in the counterclockwise direction, whereby the movable lens holding part 134 and the cylindrical lens 122 are also moved vertically downward. It is supposed to be.

  A protective glass plate 148 for shielding the lower cylindrical lens 122 from the dust (especially the workpiece W side) from the outside (particularly the workpiece W side) is detachably attached to the opening of the rotating ring 142 from the outside through the Delrin ring 150 by the screw ring 152. It is done. A screw thread (male screw) 154 is formed on the outer peripheral surface of the screw ring 152, and a screw thread (female screw) that is screwed with the screw thread 154 of the screw ring 152 is formed on the inner peripheral surface of the opening of the rotating ring 142. . Holes 156 through which bolts (not shown) for attaching the emission unit 100 to unit support parts (not shown) are formed at the corners of the main body 124.

  As shown in FIG. 14, the emission unit 100 can also be adjusted to an arbitrary rotation angle with the central axis as the rotation center by the rotation angle adjustment unit 160. The rotation angle adjustment unit 160 may be a manual type such as the holder 15 and the fastening screw 19 in the first embodiment, but may be configured to be an automatic adjustment type using a pulse motor or the like.

  Here, with reference to FIGS. 16 and 17, the optical action (particularly, the light collecting action) of the emission unit 100 will be described. In FIGS. 16 and 17, the generatrix of the fixed cylindrical lens 120 is the X axis, and the generatrix of the movable cylindrical lens 122 is the Y axis orthogonal to the X axis.

The YAG second harmonic laser beam SHG from the laser light source 10 (FIG. 14) is a parallel light having a circular cross section having a small divergence angle θ, and is transmitted through the fixed cylindrical lens 120 so as to be in the X-axis direction that is the generatrix direction. The light enters the movable cylindrical lens 122 while being refracted (converged) in the Y-axis direction without being refracted in the direction. The laser beam SHG travels straight without being refracted in the Y-axis direction in the movable cylindrical lens 122, and the focal length f ₁₂₀ of the fixed cylindrical lens 120 as shown in FIGS. 16 (a) and 17 (a). The focal point in the Y-axis direction is set at the position. Here, since the spread angle θ exists in the laser beam SHG, a slight spread occurs in the Y-axis direction instead of a point shape. This spread is determined by the characteristics of the laser light source 10 and the laser transmission optical system, and can be, for example, about 100 μm. In this embodiment, the working distance is set so that the processing point on the workpiece W is positioned near the focal point of the fixed cylindrical lens 120.

On the other hand, when the laser beam SHG passes through the fixed cylindrical lens 120, it is not refracted in the X-axis direction as described above, enters the movable cylindrical lens 122 with the spread angle θ, and passes through the movable cylindrical lens 122. refracted (converged) in the X-axis direction by, the process proceeds to focus the X-axis direction to the position of the focal distance f _122. When the movable cylindrical lens 122 has its focal length f ₁₂₂ matched with the distance interval from the processing point of the workpiece W, that is, when it is placed at the reference position Q, it is shown in FIG. As described above, the laser beam SHG is focused on the processing point of the workpiece W almost on-focus even in the X-axis direction. However, when the distance interval of the movable cylindrical lens 122 with respect to the processing point of the workpiece W is offset from the focal length f ₁₂₂ of the movable cylindrical lens 122, for example, as shown in FIG. Then, the light is not focused and is focused on the processing point of the workpiece W by defocusing. In this case, the beam spot SP at the processing point of the workpiece W is a linear or strip pattern, and the size in the length direction is proportional to the offset amount.

As described above, the emission unit 100 of this embodiment does not require adjustment of the work distance, and only by variably adjusting the position of the movable cylindrical lens 122 in the vertical direction (optical axis direction), the processing point of the workpiece W It is possible to arbitrarily vary the aspect ratio of the beam spot SP formed in the beam spot SP SHG, and it is possible to form the beam spot SP _SHG having a high flatness with respect to the YAG second harmonic laser beam SHG.

In the above embodiment, the second harmonic (532 nm) is used as the YAG harmonic, but a third harmonic (355 nm) or a fourth harmonic (266 nm) can also be used. In addition to the Nd: YAG crystal, an Nd: YLF crystal, Nd: YVO ₄ crystal, Yb: YAG crystal, or the like can also be used as the solid laser medium or active medium 24, 40 for generating YAG harmonics. . The emission units 16 and 100 in the above embodiment can be used for metal thin film peeling processing other than gold plating, and can be used for tin plating peeling processing by laser light of a YAG fundamental wave, for example.

It is a perspective view which shows the gold plating peeling method by one Embodiment of this invention. It is a top view which shows the effect | action of the gold plating peeling method by embodiment. It is sectional drawing which shows the effect | action of the gold plating peeling method by embodiment. It is a top view which shows the effect | action of the gold plating peeling method by embodiment. It is a top view which shows the effect | action of the gold plating peeling in a comparative example. It is a figure which shows the structure of the laser oscillation part in embodiment. It is a longitudinal cross-sectional view which shows the structure of the radiation | emission unit in embodiment. It is a longitudinal cross-sectional view which shows the structure of the radiation | emission unit in embodiment. It is a wave form diagram which shows the typical laser output waveform of the YAG fundamental wave pulsed laser beam and YAG 2nd harmonic pulsed laser beam in embodiment. It is a side view which shows the twin-type radiation | emission unit system in embodiment. It is a perspective view which shows the example which makes an emission unit an inclination posture in embodiment. It is a figure which shows the cross-sectional structure in the case of making the housing | casing surface around the laser emission opening of an emission unit into a truncated cone shape in embodiment. It is a figure which shows the structure of the laser oscillator applicable to the twin type | mold emission unit system of embodiment. It is a figure which shows the structure of the gold plating peeling apparatus by another embodiment. It is a longitudinal cross-sectional view which shows the internal structure of the radiation | emission unit in embodiment. It is a figure for demonstrating the effect | action of the laser condensing unit in embodiment. It is a figure for demonstrating the effect | action of the laser condensing unit in embodiment.

Explanation of symbols

W contact 10 metal material 12 gold plating layer 14 nickel plating layer 15 holder (rotation angle adjusting means)
16 exit unit 16A upper exit unit 16B lower exit unit 18, 18A, 18B optical fiber 19 fastening screw (rotation angle adjusting means)
20, 70, 100 Laser oscillator 22, 24 Termination mirror (optical resonator mirror)
26 Active Medium 28 Q Switch 30 Wavelength Conversion Crystal 32 Harmonic Separation Output Mirror 34 Electro-Optical Excitation Unit 36 Laser Power Supply 38 Control Unit 42 Incident Unit 42A First Incident Unit 42B Second Incident Unit 46 Scanning Mechanism 50 Upper Housing 52 Lower casing 54 Collimating lens 56 Upper cylindrical lens 58, 60 Lower cylindrical lens 64 Gold plating 65 Robot arm 66 Fluoro resin cover 72 Half mirror 74, 78 Total reflection mirror (bent mirror)
100 Output unit 160 Rotation angle adjustment unit

Claims (16)

A gold plating peeling method for peeling a gold plating layer formed on the surface of a metal material in a desired peeling region,
A YAG harmonic laser beam is irradiated into the peeling region with an elliptical beam spot having a high flatness to remove an irradiated portion of the gold plating layer, and the elliptical beam spot is formed at a desired angle with respect to the major axis direction. A gold plating peeling method in which the YAG harmonic laser beam is moved relative to the metal material so as to scan the peeling region in the direction of forming the metal plating layer and remove the gold plating layer in the region.   The gold plating stripping method according to claim 1, wherein the width of the stripping region is changed by rotating the elliptical beam spot by a desired angle about the center of the ellipse.   The gold plating peeling method according to claim 1 or 2, wherein a ratio of a diameter in a major axis direction to a minor axis direction in the elliptical beam spot is 2 or more.   The gold plating peeling method according to any one of claims 1 to 3, wherein the YAG harmonic laser beam is irradiated at a desired angle with respect to a peeling region of the metal material in a peeling scanning direction or a direction opposite thereto.   The said metal raw material is a connector terminal, The gold plating peeling method as described in any one of Claims 1-4.   The peeling region is formed by irradiating the YAG harmonic laser light from the first surface side and the second surface side to the peeling region straddling the first and second surfaces facing each other of the connector terminal. The gold plating peeling method of Claim 5 which peels the gold plating layer in an area | region.   The gold plating peeling method according to any one of claims 1 to 6, wherein the metal material has a nickel plating layer as a base film of the gold plating layer. A gold plating peeling apparatus for peeling a gold plating layer formed on the surface of a metal material in a desired peeling region,
A laser oscillator that generates laser light of YAG harmonics;
An emission unit that focuses the YAG harmonic laser beam from the laser oscillator into an elliptical beam spot having a high flatness and irradiates the peeling area;
A rotation angle adjusting means for rotating the emission unit at an arbitrary angle around the center axis thereof as a rotation center in order to vary the width of the peeling region;
The elliptical beam spot scans the peeling region in a direction that makes an angle corresponding to the rotational angle position of the emission unit with respect to the elliptical long axis direction so as to peel the gold plating layer in the region. And a scanning means for moving the YAG harmonic laser beam emitted from the emission unit relative to the metal material. The emission unit is
A collimating lens that collimates the YAG harmonic laser beam emitted from the end face of the optical fiber;
A first focusing lens that focuses the YAG harmonic laser light that has passed through the collimating lens in a first direction orthogonal to the laser optical axis direction;
The second focusing lens for focusing the YAG harmonic laser beam that has passed through the first focusing lens in the laser optical axis direction and a second direction orthogonal to the first direction. The gold plating peeling apparatus as described.   The first focusing lens is a first cylindrical lens, and the second and third cylindrical lenses are arranged in multiple stages on the laser optical axis in a direction orthogonal to the first cylindrical lens. The gold plating peeling apparatus according to claim 9, comprising a lens. A gold plating stripping device for stripping a gold plating layer formed on the surface of a connector terminal in a desired stripping region,
A laser oscillator that generates laser light of YAG harmonics;
A beam splitter that splits the YAG harmonic laser light generated by the laser oscillator into first and second branched YAG harmonic laser lights;
A first optical fiber for transmitting the first branched YAG harmonic laser beam obtained from the beam splitter;
A second optical fiber for transmitting the second branched YAG harmonic laser light obtained from the beam splitter;
The first branched YAG harmonic laser beam emitted from the end surface of the first optical fiber is focused on the first elliptical beam spot having a high flatness and set on the first surface of the connector terminal. A first emission unit for irradiating the first peeling region;
First rotation angle adjusting means for rotating the first emission unit at an arbitrary angle about the center axis thereof as a rotation center in order to vary the width of the first peeling region;
The second branched YAG harmonic laser beam emitted from the end surface of the second optical fiber is focused on a second elliptical beam spot having a high flatness and is opposed to the first surface of the connector terminal. A second emission unit for irradiating the second peeling area set on the second surface to be
Second rotation angle adjusting means for rotating the second emission unit at an arbitrary angle around the center axis thereof as a rotation center in order to vary the width of the second peeling region;
The first and second ellipsoidal beam spots scan the first and second peeling regions in directions in which the first and second elliptical beam spots are inclined at a desired angle with respect to the major axis directions, respectively, and peel the gold plating layer in each region. As described above, a gold plating peeling apparatus comprising: scanning means for moving the first and second branched YAG harmonic laser beams emitted from the first and second emission units, respectively, relative to the connector terminal. A gold plating stripping device for stripping a gold plating layer formed on the surface of a connector terminal in a desired stripping region,
A laser oscillator that generates laser light of YAG harmonics;
A laser optical path switching unit that switches the optical path of the YAG harmonic laser light generated by the laser oscillator to either the first optical path or the second optical path;
A first optical fiber for transmitting the YAG harmonic laser beam switched to the first optical path by the laser optical path switching unit;
A second optical fiber for transmitting the YAG harmonic laser beam switched to the second optical path by the laser optical path switching unit;
In the first separation region set on the first surface of the connector terminal by focusing the YAG harmonic laser beam emitted from the end surface of the first optical fiber into an elliptical beam spot having a high flatness. A first exit unit for irradiating
First rotation angle adjusting means for rotating the first emission unit at an arbitrary angle about the center axis thereof as a rotation center in order to vary the width of the first peeling region;
The YAG harmonic laser beam emitted from the end surface of the second optical fiber is focused on an elliptical beam spot having a high flatness and set to a second surface opposite to the first surface of the connector terminal. A second emission unit for irradiating the second exfoliation region,
Second rotation angle adjusting means for rotating the second emission unit at an arbitrary angle around the center axis thereof as a rotation center in order to vary the width of the second peeling region;
The first emission is performed such that the elliptical beam spot scans the first and second peeling regions in a direction inclined at a desired angle with respect to the major axis direction to peel the gold plating layer in each region. And a scanning means for moving the YAG harmonic laser beam emitted from the unit or the second emission unit relative to the connector terminal.   The gold plating peeling apparatus according to any one of claims 8 to 12, wherein the emission unit has a truncated cone-shaped casing surface around a laser emission port for emitting the laser beam.   The gold plating peeling apparatus according to claim 13, wherein the casing surface is surface-treated with gold plating.   The gold plating peeling apparatus as described in any one of Claims 8-14 in which the said radiation | emission unit has a unit housing | casing which comprises at least one part of an outer wall with a fluororesin. The gold-plating peeling apparatus as described in any one of Claims 8-15 in which the said laser oscillator has a Q switch for producing | generating the laser beam of the YAG harmonic of a Q switch pulse.

Images