JP2006173379A - Device and method for polishing board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To widen a polishing area when the area of the outer periphery of a board is polished, also to reduce a production cost by means of a simple device, to polish the board at a desired curvature with a high accuracy, and to stably perform the polishing with a high accuracy and good repeatability. <P>SOLUTION: The board polishing device 1 for polishing a board D comprises a board support 2 for rotatably supporting the board D around the shaft; a polishing body 3 having a substantially disc shape and formed with a polishing part 30 in its outer periphery; a polishing body support body 4 for rotatably supporting the polishing body 3 around the shaft; and a polishing body moving part 5 for moving the polishing body support body 4. The board D and the polishing body 3 are rotated, while the polishing part 30 of the polishing body 3 is brought into contact with the area of the outer periphery of the board D by the polishing body moving part 5, and is moved along the shape of the area of the outer periphery for polishing the area of the outer periphery by means of the polishing part 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate.

  In recent years, metal materials used for semiconductor substrates have been diversified due to miniaturization of wirings and the like. Since this metal material is usually attached to the substrate surface by the CVD method, adhesion to the outer peripheral edge portion and the outer peripheral end portion (hereinafter referred to as “peripheral region”) of the front surface and the rear surface of the substrate cannot be avoided. And since the metal material adhering to such an outer periphery area | region peels off, dust-generates in a subsequent process, or melt | dissolves and becomes a pollutant, it has become a cause by which a board | substrate becomes defective.

Therefore, in order to remove the metal material adhering to the outer peripheral region of the substrate, various apparatuses as shown in Patent Document 1 below have been proposed.
JP 2003-257901 A

  The edge polishing apparatus disclosed in Patent Document 1 is described as follows: “A circular work surface of a pair of upper edge polishing members facing each other across a workpiece while chucking a disk-shaped workpiece and rotating it around an axis. Is brought into contact with the inclined upper edge of the workpiece, the arcuate work surface of the polishing member for the lower edge is brought into contact with the inclined lower edge of the workpiece, and the arcuate work surface of the polishing member for the outer peripheral surface is further brought into contact with the outer periphery of the workpiece. It is an apparatus that polishes the outer peripheral area of a workpiece by contacting the surface. With this apparatus, the upper edge, the lower edge and the outer peripheral surface of the workpiece can be polished efficiently at the same time.

  However, in the above-described edge polishing apparatus, the arc-shaped work surface is in contact with the workpiece for polishing, so that the edge near the outer peripheral surface can be polished, but the flat surface that penetrates more toward the substrate center from the edge is It cannot be polished.

  On the other hand, in recent years, there is an increasing demand for polishing not only the outer peripheral surface and edge of the substrate, but also the flat surface that penetrates from the edge toward the center of the substrate, and widens the polishing area to reliably remove the above-mentioned defect factors. .

  Further, the above-described edge polishing apparatus requires four polishing members, ie, a pair of upper edge polishing member, lower edge polishing member and outer peripheral surface polishing member, and the apparatus is complicated and the manufacturing cost is high. It was.

  Further, in the above edge polishing apparatus, the arc-shaped work surface of each polishing member is in line contact with the edge or outer peripheral surface of the work, so that the work surface and the work are in contact each time the work shape is different. The area is different and the surface pressure is also different. Therefore, the polishing process conditions become unstable, and accurate polishing cannot be performed stably with good reproducibility. Furthermore, the workpiece is restricted by the arc-shaped work surface and is processed to have the same curvature as that of the arc-shaped work surface, and there is a problem that the edge and outer peripheral surface of the workpiece cannot be processed to a desired curvature.

  The present invention has been proposed in view of the above, and when the outer peripheral region of the substrate is polished, the polishing region can be widened, the manufacturing cost can be reduced with a simple apparatus, and the substrate can be formed with a desired curvature. It is an object of the present invention to provide a substrate polishing apparatus that can perform high-precision polishing and can perform the high-precision polishing stably with high reproducibility.

  In order to achieve the above object, according to a first aspect of the present invention, there is provided a substrate polishing apparatus for polishing a substrate, a substrate support portion for rotatably supporting the substrate around an axis, and a substantially disc-shaped polishing on the outer periphery thereof. A polishing body having a portion formed thereon, a polishing body support section that supports the polishing body rotatably about an axis, and a polishing body moving section that moves the polishing body support section. While rotating, the polishing body moving section brings the polishing section of the polishing body into contact with the outer peripheral edge and outer peripheral edge (hereinafter referred to as “outer peripheral area”) of the substrate and moves along the shape of the outer peripheral area. The outer peripheral region is polished by the above.

  According to a second aspect of the invention, in addition to the configuration of the first aspect of the invention described above, the polishing body moving unit includes a vertical moving unit that moves the polishing body in a direction perpendicular to the substrate, and a polishing body. And a radial direction moving part for moving the substrate in a predetermined radial direction of the substrate.

  According to a third aspect of the invention, in addition to the configuration of the first or second aspect of the invention described above, the polishing body moving section moves the polishing body in a direction perpendicular to the predetermined radial direction of the substrate. An orthogonal direction moving unit is provided.

  According to a fourth aspect of the present invention, in addition to the configuration of any one of the first to third aspects, the movement of the polishing portion of the polishing body by the polishing body moving portion is performed on one side of the substrate. The first movement from the outer peripheral edge of the other surface to the outer peripheral edge of the other surface through the outer peripheral edge, and the other surface of the other surface from the outer peripheral edge of the other surface in the opposite direction via the outer peripheral edge It is a combination with the second movement toward the outer peripheral edge.

  Furthermore, the invention according to claim 5 is a substrate polishing method for polishing a substrate, wherein the polishing portion of the polishing body is rotated while rotating the substrate and a polishing body having a substantially disc shape and a polishing portion formed on the outer periphery thereof. Is brought into contact with the outer peripheral region of the substrate and moved along the shape of the outer peripheral region, and the outer peripheral region is polished by the polishing portion.

  In the substrate polishing apparatus of this invention, the outer peripheral region is polished while the polishing portion formed on the outer periphery of the substantially disc-shaped polishing body is brought into contact with the outer peripheral region of the substrate and moved along the shape of the outer peripheral region. As a result, it is possible to freely polish the surface entering the center of the substrate from the outer periphery. This surface may be a flat surface or an inclined surface, and the surface may be uneven. By widening the polishing area in this manner, the deposits can be removed in a wider range, and therefore, defects caused by the deposits can be reliably removed.

  Further, since it is only necessary to bring the polishing body into contact with the substrate, polishing can be performed with a simple apparatus, and the manufacturing cost can be reduced.

  Furthermore, since the polishing part is moved along the shape of the outer peripheral region of the substrate, it can follow any shape of the substrate. Therefore, the substrate can be polished with a desired curvature with high accuracy, and the high accuracy can be achieved. Can be stably performed with good reproducibility.

  First, a first embodiment of the present invention will be described in detail with reference to the drawings.

  1 is a plan view of a substrate polishing apparatus according to the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG. Note that the polishing body 3 in FIG. 3 is in a state in which the polishing body 3 in FIG. 1 is moved in the Y direction. In these drawings, a substrate polishing apparatus 1 according to the present invention is constructed on bases 91 and 92, and has a substrate support portion 2 that supports a substrate D so as to be rotatable about an axis, and a substantially disc-shaped polishing portion on the outer periphery thereof. A polishing body 3 on which 30 is formed, a polishing body support portion 4 that supports the polishing body 3 so as to be rotatable about an axis, and a polishing body moving portion 5 that moves the polishing body support portion 4 are provided.

  The polishing body moving unit 5 includes a vertical moving unit 6 that moves the polishing body 3 in a direction perpendicular to the substrate D, a radial moving unit 7 that moves the polishing body 3 in a predetermined radial direction of the substrate D, An orthogonal direction moving unit 8 that moves the polishing body 3 in a direction orthogonal to a predetermined radial direction of the substrate D is provided.

  The substrate D is, for example, a substantially disk-shaped semiconductor wafer. As shown in FIGS. 4A and 4B, the surface-side pattern forming portion D0 and the outer peripheral edge on the outer peripheral side from the pattern forming portion D0. It has a portion D1, an outer peripheral end D2, and an outer peripheral edge D3 on the back surface. The outer peripheral edge portions D1 and D3 may be flat or may be slopes. Further, the surface may be uneven. The outer peripheral end D2 usually has a curvature as shown in FIG. 4A, but may be formed of a slope and a vertical surface as shown in FIG. 4B. Further, the surface may be uneven. In the following description, a region including the outer peripheral edge portion D1, the outer peripheral edge portion D2, and the outer peripheral edge portion D3 on the back surface is referred to as an “outer peripheral region”.

  As shown in FIGS. 2 and 3, the substrate support portion 2 is provided on a base 91, a support shaft 21 erected on the base 91, and a top portion of the support shaft 21. A substrate receiving portion 22 and a rotation driving portion 23 are provided. The supporting shaft 21 has a cylindrical portion 21a fixed to the base 91 and a shaft portion 21b that is rotatably provided by a bearing mechanism in a hollow portion of the cylindrical portion 21a. The rotation of the motor 23a of the rotation drive unit 23 is transmitted through the gear train 23b, whereby the substrate receiving unit 22 rotates. A hole 21c is formed in the shaft portion 21b in the vertical direction, air is sucked from below the hole 21c, and the substrate D set in the substrate receiving portion 22 is chucked and fixed by the suction force.

  When the substrate D is set in the substrate receiving portion 22, at least the outer peripheral region protrudes from the substrate receiving portion 22 (see FIGS. 2 and 3).

  The base 91 is provided with three positioning portions 2A. Although only two places are illustrated in FIG. 1, the remaining one positioning part 2 </ b> A (not shown) is disposed, for example, in the vicinity of the position of the polishing body support part 4. In the positioning portion 2A, a rotatable cylindrical body 201 at the top thereof abuts on the outer peripheral surface of the substrate D, and positioning at the time of chucking the substrate D is performed with high accuracy from three directions. During polishing, it is retracted to a position away from the substrate D. In addition, this positioning part 2A may be provided not only at three places but also at two places or four or more places as required.

  Next, the polishing body moving unit 5 and the polishing body support unit 4 will be described.

  As described above, the polishing body moving unit 5 includes the vertical moving unit 6, the radial direction moving unit 7, and the orthogonal direction moving unit 8. The orthogonal direction moving unit 8 is provided on a base 92 and includes rails 8 a and 8 b, a servo motor 81, a ball screw 82, and an orthogonal direction moving table 83. With this configuration, when the servo motor 81 rotates and the ball screw 82 rotates, the orthogonal direction moving table 83 moves in the Y direction in the figure along the rails 8a and 8b via the nut-like moving body.

  The radial movement unit 7 is provided on the orthogonal movement table 83 and includes rails 7 a and 7 b, a servo motor 71, a ball screw 72, and a radial movement table 73. With this configuration, when the servo motor 71 rotates and the ball screw 72 rotates, the radial movement table 73 moves along the rails 7a and 7b in the X direction (predetermined radial direction) along the rails 7a and 7b. To do.

  The vertical moving unit 6 is provided in a machine frame 60 erected on the radial moving table 73. The vertical moving unit 6 includes rails 6 a and 6 b, a servo motor 61, a ball screw 62, a nut-like moving body 64, and a vertical moving table 63. With this configuration, when the servo motor 61 rotates and the ball screw 62 rotates, the vertical movement table 63 moves in the Z direction in the figure along the rails 6a and 6b via the nut-like moving body 64. The vertical moving table 63 is provided with a horizontal machine frame 65 in the horizontal direction, and a polishing body support portion 4 is provided at the horizontal direction front end side of the horizontal machine frame 65. 3 is rotatably supported. That is, a motor 66 is disposed in the horizontal machine frame 65, and the rotation of the motor 66 is transmitted to the polishing body 3 via the pulley, and the polishing body 3 rotates.

  As described above, the polishing body 3 has a substantially disk shape, and the polishing portion 30 is formed on the outer periphery thereof. The polishing unit 30 is, for example, the surface of a polishing cloth or a grindstone. During polishing, a polishing liquid is supplied between the polishing unit 30 and the substrate D.

  In the substrate polishing apparatus 1, a height position measurement sensor S1 is disposed slightly above the substrate D, and an eccentricity measurement sensor S2 is disposed at a position slightly away from the outer peripheral surface of the substrate D. The height position measurement sensor S1 Measures the exact height position of the substrate D set on the substrate receiving portion 22, and the eccentricity measuring sensor S2 detects the amount of eccentricity in the radial direction when the substrate D set on the substrate receiving portion 22 rotates ( Measure runout).

  The operation of each part of the substrate polishing apparatus 1 is performed using a control device not shown here. That is, the control device instructs the motors 23a and 66 and the servo motors 61, 71, and 81 to drive these motors to perform predetermined operations, and also performs the suction operation when chucking the substrate D, the polishing liquid It also controls the supply operation.

  In the substrate polishing apparatus 1 configured as described above, the outer peripheral region is polished as follows. First, the shape of the outer peripheral region of the substrate D is measured using a profiler (surface shape measuring device), and the shape data is input to the control device.

  Next, the substrate D is chucked to the substrate receiving portion 22, positioned and set by the positioning portion 2A, and in this state, the height position of the substrate D is measured with high accuracy using the height position measuring sensor S1. Then, the deflection amount of the substrate D during the substrate rotation is measured using the eccentricity measuring sensor S2, and fed back to the control device.

  In the control device, the trajectory of each part (trajectory in the XYZ directions) for polishing the outer peripheral region of the polishing body 3 is obtained from the shape data obtained by the profiler, and the height position measurement sensor S1 and the eccentricity amount are further included in the trajectory. Correction is performed in consideration of various data from the measurement sensor S2, and a highly accurate locus of the polishing body 3 is obtained.

  Thereafter, the control device rotates the substrate D and the polishing body 3 and operates the polishing body moving unit 5 (vertical moving unit 6, radial moving unit 7 and orthogonal direction moving unit 8) according to the obtained trajectory data. As a result, while the substrate D and the polishing unit 30 are in contact with each other, the polishing body 3 performs the first movement from the M position to the N position along the outer peripheral area according to the locus P as shown in FIGS. 5 and 6, for example. And a second movement from the N position to the M position along the outer peripheral area according to the trajectory P, and at least one of the movements. In many cases, the first movement and the second movement are performed. The outer peripheral region is polished by performing in combination. FIG. 5 shows a case where the diameter of the polishing body is large, and FIG. 6 shows a case where the diameter of the polishing body is small.

  FIG. 7 is an explanatory diagram of the polishing range in the present invention. In the present invention, since the polishing portion 30 formed on the outer periphery of the polishing body 3 is polished while being in contact with the substrate D, the polishing range W in the outer peripheral region of the substrate D is shown in FIG. In addition to the outer peripheral edge portion D2, the range including the outer peripheral edge portions D1 and D3 as shown in FIG. 7B can be polished, and further, as shown in FIG. The outer peripheral edge portions D1 and D3 that have penetrated and the flat area becomes wider can be polished freely. Further, as shown in FIG. 7D, even when the polishing range is different between the front surface and the back surface of the substrate D, it is possible to cope with it freely. Note that the edge polishing apparatus using an arcuate working surface as shown in Patent Document 1 can only cope with the polishing of the outer peripheral end of FIG.

  As described above, in the substrate polishing apparatus 1 of the present invention, the polishing portion 30 formed on the outer periphery of the substantially disc-shaped polishing body 3 is brought into contact with the outer peripheral region of the substrate D and along the shape of the outer peripheral region. Since the outer peripheral region is polished while being moved, the surface entering the center of the substrate from the outer periphery can be freely polished. This surface may be a flat surface or an inclined surface, and the surface may be uneven. By widening the polishing area in this manner, the deposits can be removed in a wider range, and therefore, defects caused by the deposits can be reliably removed.

  Moreover, since it is only necessary to bring the polishing body 3 into contact with the substrate D, polishing can be performed with a simple apparatus, and the manufacturing cost can be reduced.

  Further, since the polishing unit 30 is moved along the shape of the outer peripheral region of the substrate D, it is possible to follow any shape of the substrate, and therefore, the substrate D can be polished with a desired curvature with high accuracy. The high-precision polishing can be performed stably with good reproducibility.

  Next, a second embodiment of the present invention will be described.

  FIG. 8 is an explanatory diagram of the second embodiment of the present invention. In the second embodiment, the polishing body 3 is arranged on both the front side and the back side of the substrate D. In the first embodiment, when the polishing body 3 is moved in the Y direction from the state of FIG. 1, the state of FIG. 3 is obtained. In FIG. 3, when the front side and the back side of the substrate D are polished. Then, the polishing body 3 is moved to each position, and the process is performed in order. On the other hand, in the second embodiment shown in FIG. 8, the polishing body 3 is arranged on both the front side and the back side of the substrate D so that the front side polishing and the back side polishing can be performed simultaneously. Therefore, polishing can be performed more efficiently.

FIG. 1 is a plan view of a substrate polishing apparatus according to the present invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is explanatory drawing of the outer peripheral area | region of a board | substrate. It is explanatory drawing of the locus | trajectory of a grinding | polishing body. It is explanatory drawing of the grinding | polishing area | region in this invention. It is explanatory drawing of the grinding | polishing area | region in this invention. It is explanatory drawing of 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate polisher 2 Substrate support part 2A Positioning part 21 Support shaft 21a Cylindrical part 21b Shaft part 21c Hole 22 Substrate receiving part 23 Rotation drive part 23a Motor 23b Gear train 201 Cylindrical body 3 Polishing body 30 Polishing part 4 Polishing body support part DESCRIPTION OF SYMBOLS 5 Polishing body moving part 6 Vertical moving part 6a, 6b Rail 60 Machine frame 61 Servo motor 62 Ball screw 63 Vertical direction moving table 64 Nut-like moving body 65 Horizontal machine frame 66 Motor 7 Radial direction moving part 7a, 7b Rail 71 Servo motor 72 Ball screw 73 Radial direction moving table 74 Nut-like moving body 8 Orthogonal direction moving part 8a, 8b Rail 81 Servo motor 82 Ball screw 83 Orthogonal direction moving table 91 Base 92 Base base D Substrate D0 Pattern forming part D1, D3 Outer peripheral edge D2 Outer periphery Edge P Trajectory S1 Height position measuring center S2 eccentricity measurement sensor W polishing range X direction Z perpendicular direction orthogonal to the predetermined radial Y predetermined radial

Claims (5)

In a substrate polishing apparatus for polishing a substrate,
A substrate support section for supporting the substrate rotatably about an axis;
A polishing body having a substantially disc shape and a polishing portion formed on the outer periphery thereof;
A polishing body support for supporting the polishing body rotatably about an axis;
A polishing body moving section for moving the polishing body support section,
While rotating the substrate and the polishing body, the polishing body moving portion brings the polishing portion of the polishing body into contact with the outer peripheral edge portion and the outer peripheral edge portion (hereinafter referred to as “outer peripheral region”) of the substrate, and follows the shape of the outer peripheral region. And move the outer peripheral area with the polishing part.
A substrate polishing apparatus. The polishing body moving part is
A vertical movement unit for moving the polishing body in a direction perpendicular to the substrate;
The substrate polishing apparatus according to claim 1, further comprising a radial direction moving unit that moves the polishing body in a predetermined radial direction of the substrate. The polishing body moving part is
The substrate polishing apparatus according to claim 2, further comprising: an orthogonal direction moving unit that moves the polishing body in a direction orthogonal to the predetermined radial direction of the substrate.   The movement of the polishing portion of the polishing body by the polishing body moving portion is the first movement from the outer peripheral edge portion of one surface of the substrate to the outer peripheral edge portion of the other surface through the outer peripheral edge portion, and in the opposite direction. The substrate polishing apparatus according to any one of claims 1 to 3, which is a combination of a second movement from the outer peripheral edge portion of the other surface to the outer peripheral edge portion of the one surface via the outer peripheral end surface. In a substrate polishing method for polishing a substrate,
While rotating the substrate and a polishing body having a substantially disc shape and a polishing portion formed on the outer periphery thereof, the polishing portion of the polishing body is brought into contact with the outer peripheral region of the substrate and moved along the shape of the outer peripheral region, Polish the outer peripheral area with the polishing part,
A substrate polishing method characterized by the above.

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