JP2006165243A - Method for forming electrode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming an electrode pattern capable of surely preventing the penetration of an electrode base to a section excepting a specified place such as a trench or the like for division, having no defective short-circuit or the like, and having excellent reliability. <P>SOLUTION: In the method for forming the electrode pattern, resin paste is printed and dried previously to a section to which the electrode pattern is not formed, and the electrode pattern is printed and dried at a specified place by electrode paste. In the method, the electrode paste is baked while resin paste is decomposed thermally and made to disappear. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrode forming method such as an electrode pattern having a predetermined pattern on a part of a substrate such as an alumina substrate.

  2. Description of the Related Art Electronic parts are widely used in which electrodes are formed in a predetermined pattern on a substrate such as an alumina substrate, and functional elements such as piezoelectric elements are mounted using the electrodes.

  When electrodes are formed on a substrate by such a method, a plurality of electrode patterns are formed on a substrate in which division grooves are formed in advance so as to correspond to a plurality of elements, and functional elements are formed on the substrate. After mounting by a method such as soldering, a plurality of electronic components are obtained by dividing by a dividing groove.

For example, Patent Document 1 can be cited as a prior art document relating to such a technique.
JP-A-3-85793

  However, along with the downsizing of electronic components, the number of divided electronic components increases, the interval between the dividing grooves provided on the substrate becomes narrower, and the number of dividing grooves tends to increase.

  In such a case, when an electrode pattern is formed by printing an electrode paste at a predetermined position as in the prior art, an electrode is formed at a position other than the predetermined position because the electrode paste enters an adjacent dividing groove. There were problems such as short circuit failure.

  In addition, since the dividing groove (slit) is narrow and has a certain depth, an electrode paste with a small surface tension using an organic solvent can easily penetrate into the dividing groove due to capillary action, and further penetrates the electrode. The paste was not only difficult to find, but also difficult to remove.

  The present invention solves the above-described problems, and can reliably prevent the electrode paste from entering a portion other than a predetermined position such as a dividing groove by a method with high mass productivity, and there is no short circuit failure. An object of the present invention is to provide a method for forming an electrode pattern with excellent reliability.

  In order to achieve this object, the present invention prints and dries a resin paste in advance on a non-formed portion of the electrode pattern, and then prints and dries the electrode pattern with the electrode paste at a predetermined position, and then simultaneously burns the electrode paste and resin. An electrode pattern forming method characterized in that the paste is thermally decomposed to disappear, and a predetermined pattern for forming an electrode pattern using an electrode paste after covering an electrode non-formation portion including a dividing groove with a resin. The electrode paste does not adhere to other than the position, and the short circuit failure can be reliably prevented.

  In addition, since the resin paste is scattered and disappeared simultaneously with the baking of the electrode paste, there is no need for a step of removing the resin paste, and no excessive residue such as the resin paste remains on the substrate, so the cleaning process is poor. In addition, a highly reliable electrode pattern can be formed.

  Furthermore, by making the melting point of the glass frit contained in the electrode paste higher than the dispersion temperature of the resin paste, even if the resin paste adheres to the electrode formation necessary part due to printing misalignment, etc. In this case, since the electrode is brought into close contact with the substrate and the electrode is formed, the electrode can be reliably formed at a predetermined position.

  In the electrode pattern forming method of the present invention, the resin paste is printed and dried in advance on the non-formed part of the electrode pattern, and then the electrode pattern is printed and dried with the electrode paste at a predetermined position. It is a method of electrode pattern formation characterized by being thermally decomposed and disappeared, and there is no need for a step of removing the resin paste while reliably preventing short circuit failure without electrode paste adhering to other than the predetermined position, In addition, since no excess residue such as a resin paste remains on the substrate, a cleaning process is not necessary, and a highly reliable electrode pattern can be formed.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to FIGS.

  FIG. 1 is a partially enlarged plan view of an alumina substrate showing a state in which a resin paste 14 is formed by printing and drying an electrode non-formation portion of an alumina substrate 13 having dividing grooves 11 and through holes 12. FIG. FIG. 4 is a partially enlarged plan view of an alumina substrate showing a state where an electrode pattern 15 is printed on a predetermined portion of an alumina substrate 13 on which a paste 14 is formed using an electrode paste and dried.

  FIG. 3 shows an alumina substrate on which an alumina substrate on which a resin paste and an electrode pattern are formed is baked according to the temperature profile shown in FIG. 4 and the resin paste is scattered and disappeared simultaneously with the baking of the electrode pattern. It is a partially enlarged plan view.

  Hereinafter, the electrode pattern forming method of the present invention will be described in detail.

  First, an alumina substrate having an alumina purity of 95%, a vertical and horizontal dimension of 84 mm, and a thickness of 0.38 mm is prepared.

  Next, a resin paste having an acrylic resin as a main component and a viscosity of about 2000 centipoise is printed on an electrode pattern non-formed portion on an alumina substrate and dried as shown in FIG.

  Here, FIG. 1 shows an enlarged main part of the alumina substrate, and the same applies to FIGS.

  Thereafter, an electrode paste made of Ag powder, an organic binder, an organic solvent and glass frit is printed at a predetermined position as shown in FIG. 2 and dried to form an electrode pattern.

  The melting point of the glass frit contained in the electrode paste is particularly preferably higher than the scattering disappearance temperature of the resin paste.

  By making the melting point of the glass frit higher than the dispersion disappearance temperature of the resin paste, the electrode adheres to the substrate after the resin disappears even if the resin paste adheres to the electrode formation necessary part due to printing misalignment etc. Since the electrodes are formed, the electrodes can be reliably formed at predetermined positions.

  In this embodiment, a glass frit having a melting point of 500 ° C. or higher is used.

  The alumina substrate on which the electrode pattern thus formed was formed was placed in an electric furnace, and baked at 850 ° C. for 12 minutes with the temperature profile shown in FIG.

  The scattering disappearance temperature of the resin paste is 400 ° C. or lower.

  The dispersion disappearance temperature of the resin paste is preferably adjusted in relation to the baking temperature of the electrode paste. However, when a resin paste having a dispersion disappearance temperature exceeding 400 ° C. is used, the decomposition residue of the resin paste is a carbon-like residue. Since it becomes a substance and remains on the substrate and may cause a short circuit failure after mounting and mounting electronic components, it is not preferable.

  The resin paste can be a resin other than an acrylic resin as long as it dissipates and disappears at a temperature of 400 ° C. or lower. However, an acrylic resin is preferable because a carbon-like residue hardly remains during thermal decomposition.

  In addition, the acrylic resin is not a single type of acrylic resin, and the resin paste can be more reliably decomposed and scattered by using a plurality of types of acrylic resins having different decomposition temperatures.

  Further, the resin in the resin paste may be the same as the resin in the electrode paste.

  In this case, in the temperature rising process of the baking temperature profile shown in FIG. 4, it is also effective to hold the resin at 400 ° C. for about 10 minutes to make the resin component more reliably scattered.

  When the surface of the 100 substrates subjected to electrode baking as described above was examined in detail with an optical microscope, no electrode was found on the electrode non-formed portion including the dividing grooves.

  At the same time, without covering the non-formed portion of the electrode with the resin paste, the electrode paste was printed in the shape of an electrode pattern and baked in the same manner as described above. As a result of the examination, it was confirmed that 53 of 100 substrates had electrodes attached to a part of the dividing grooves.

  In this embodiment, the resin paste is printed and dried by a drier. However, the same effect can be obtained by using an ultraviolet curable resin paste and applying the resin paste to the non-electrode-formed portion by ultraviolet irradiation. It is done.

  In this embodiment, an alumina substrate is used as the substrate. However, the present invention is not limited to this, and a ceramic substrate such as a zirconia substrate or a mullite substrate, or a hollow substrate in which a steel plate is coated with glass may be used.

  In the electrode pattern forming method of the present invention, the resin paste is printed and dried in advance on the non-formed part of the electrode pattern, and then the electrode pattern is printed and dried with the electrode paste at a predetermined position. It is a method of electrode pattern formation characterized in that it is thermally decomposed and disappears, and not only a cleaning process is required, but also a highly reliable electrode pattern can be formed, and a substrate on which electronic parts are mounted and wired It is useful for electrode formation.

The partially expanded plan view of the alumina substrate which shows the state which formed the resin paste on the board | substrate in one embodiment of this invention Partially enlarged plan view of an alumina substrate showing an electrode pattern formed on the same substrate Partially enlarged plan view of an alumina substrate showing the state after the electrode pattern is baked Figure showing temperature profile example

Explanation of symbols

11 Dividing groove 12 Through hole 13 Alumina substrate 14 Resin paste 15 Electrode pattern

Claims (5)

In a method of forming an electrode pattern using an electrode paste on a part of a ceramic substrate, a first step of printing and drying a resin paste in advance on a non-formed portion of the electrode pattern, and using the electrode paste at a predetermined position An electrode forming method comprising: a second step of printing and drying an electrode pattern; and a third step of baking the electrode paste and then thermally decomposing and disappearing the resin paste. The electrode forming method according to claim 1, wherein the resin paste is thermally decomposed at 400 ° C. or lower and dissipates and disappears. The electrode forming method according to claim 2, wherein the resin paste is mainly composed of an acrylic resin. 2. The electrode forming method according to claim 1, wherein the ceramic substrate is formed with a dividing groove. The electrode forming method according to claim 1, wherein the electrode paste includes glass frit, and the glass frit has a melting point higher than a scattering temperature of the resin paste.

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