JP2006164365A - Resin mask layer forming method, information recording medium manufacturing method, and resin mask layer forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a resin mask layer having a projecting and recessed pattern wherein the thickness of a residue and the height of projecting parts are uniform in the whole region while manufacturing costs are reduced. <P>SOLUTION: When a resin mask 41 for etching treatment is formed, application treatment for applying a resin material on a surface of a stamper 20 on which the projecting and recessed pattern 31 is formed, a pasting treatment for pasting the layer of the resin material applied on the stamper 20 to an intermediate body 10 by pushing the resin material applied surface of the stamper 20 to the surface of the intermediate body 10 and peeling treatment for peeling the stamper 20 from a layer (a resin layer 22) of the resin material pasted to the intermediate body 10 are executed and curing treatment for curing the layer of the resin material applied on the stamper 20 is executed in the period from the time at which the application treatment is completed until the time at which the peeling treatment is started. Thus, the resin mask 41 comprising the layer (the resin layer 22) of the resin material formed by transferring the projecting and recessed pattern 20 of the stamper 20 onto the surface of the intermediate body 10 is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention uses a resin mask layer forming method, a resin mask layer forming apparatus, and a resin mask layer formed by forming a resin mask layer made of a resin material layer to which a concave / convex pattern of a stamper is transferred on the surface of a workpiece. The present invention relates to an information recording medium manufacturing method for manufacturing an information recording medium.

  For example, as a method for forming a resin layer in which a fine (nanometer size) uneven pattern is formed on the surface of a substrate (object to be processed) when manufacturing a semiconductor element or a recording medium, Stefan Y. et al. Stephen Y. Chou, “Imprint of sub 25 nm vias and trenches in polymers”, Applied Physics Letters, (USA), November 20, 1995, Vol. 67, No. 21, p. In 3114-3116, a method of forming a concavo-convex pattern in a resin layer by an imprint method is proposed. In this imprint method, the uneven shape of the stamper (mold) is transferred to the resin layer by pressing a nanometer-sized uneven portion (projection) against the resin layer on the substrate surface.

Specifically, first, a stamper having a concavo-convex portion with a nanometer size (minimum width 25 nm) formed on the surface is prepared. In this case, the uneven portion of the stamper is formed by drawing a pattern on a silicon substrate having a silicon oxide layer formed on the surface using an electron beam lithography apparatus and etching using a reactive ion etching apparatus (RIE). The Next, PMMA (polymethyl methacrylate) as a resin material is applied to the surface of a silicon substrate by a spin coating method to form a 55 nm resin layer. Next, after heating the stamper, the base material, and the resin layer, the uneven portion of the stamper is pressed against the resin layer on the base material surface at a pressure of 13.1 MPa (1900 psi). Subsequently, after the stamper, the base material, and the resin layer are cooled, the stamper is separated from the resin layer. Thereby, the uneven shape of the uneven portion in the stamper is transferred to the resin layer, the nanometer-sized uneven pattern is transferred, and a resin layer (resin mask layer) is formed on the surface of the substrate.
Stefan Y. Stephen Y. Chou, “Imprint of sub 25 nm vias and trenches in polymers”, Applied Physics Letters, (USA), November 20, 1995, Vol. 67, No. 21, p. 3114-3116

  However, the conventional imprint method has the following problems. That is, in this imprint method, a concavo-convex pattern is transferred to a resin layer by pressing a stamper onto a resin layer formed on the surface of the substrate and pressing a convex portion of the stamper into the resin layer. In this case, various convex portions having different widths (areas of the front end surfaces) are formed on the surface of the stamper. Therefore, even if the entire area of the stamper is pressed against the resin layer with a uniform pressing force, the amount of pressing into the resin layer (the depth at which the protrusion is pressed into the resin layer) is increased between the wide convex portion and the narrow convex portion. ). As a result, variation occurs in the thickness of the resin layer (hereinafter, this portion of the resin layer is also referred to as “residue”) between the tip end surface of the convex portion of the stamper and the substrate surface.

  In this case, when the substrate is etched using the resin layer to which the concavo-convex pattern is transferred as a mask, it is necessary to remove the residue on the bottom surface of the concave portion of the concavo-convex pattern from the substrate by etching or the like. When removing the residue, for example, when the etching process is performed for a sufficient time so that the thick residue can be surely removed, the thin residue is removed before the removal of the thick residue is completed. Removal is complete. As a result, at the part where the removal of the residue is completed prior to the part where the thick residue was present, the inner wall of the recess is eroded by the gas continuously irradiated until the removal of the residue is completed over the entire substrate. As a result, the width of the concave portion is expanded more than necessary. Therefore, in the conventional imprint method, when forming a concavo-convex pattern on a substrate, it is difficult to form the width of the recess after removing the residue (after the etching process) to a desired width. There is a problem that it is difficult to form a recess in a desired state on the (object to be processed).

  Further, in the conventional imprint method, when the stamper is pressed against the resin layer on the surface of the substrate, the resin existing in the portion where the convex portion is pushed in moves toward the concave portion of the stamper, and the convexity of the resin layer is increased. Part is formed. In this case, various recesses having different widths (areas of the bottom surface) are formed on the surface of the stamper. Therefore, when the resin moves into the concave portion of the stamper by pushing the convex portion of the stamper, a difference occurs in the height of the convex portion formed by the moved resin between the wide concave portion and the narrow concave portion. . In this case, when the substrate is etched using the resin layer to which the concavo-convex pattern has been transferred as a mask, the convex portions of the transferred concavo-convex pattern are protected from being etched while protecting the substrate. Therefore, at the portion where the height of the convex portion in the resin layer is low (the portion where the concave portion of the stamper is wide), the resin layer disappears until the etching process is completed, and it becomes difficult to sufficiently protect the substrate. There is a fear. For this reason, in the conventional imprint method, there exists a problem that the site | part which should be protected of a base material (processing object) may be etched.

  Furthermore, in the conventional imprint method, the stamper is pressed against the resin layer on the surface of the substrate to transfer the concavo-convex pattern, so that a large stress is applied to the stamper each time the concavo-convex pattern is transferred. For this reason, in the conventional imprint method, the life of the stamper is reached in a relatively short period of time. As a result, the number of resin layers (resin layers to which the concavo-convex pattern is transferred) that can be produced by one stamper is small. Thus, there is a problem that it is difficult to reduce the manufacturing cost of information recording media and the like.

  The present invention has been made in view of such problems, and is capable of forming a resin mask layer having a concavo-convex pattern in which the thickness of the residue and the height of the convex portions are uniform throughout the entire area while reducing the manufacturing cost. The main object is to provide a layer forming method, a resin mask layer forming apparatus, and an information recording medium manufacturing method.

  In order to achieve the above object, the resin mask layer forming method according to the present invention includes a coating process for applying a resin material to the concave / convex pattern forming surface of a stamper when forming a resin mask layer for etching a workpiece. The application process of applying the resin material applied surface of the stamper to the surface of the object to be processed and applying the layer of the resin material applied to the stamper to the object to be processed, and the object applied to the object to be processed A peeling process for peeling the stamper from the resin material layer, and a curing process for curing the resin material layer applied to the stamper between the completion time of the coating process and the start time of the peeling process. To the surface of the object to be processed, the resin material layer made of the resin material layer having the uneven pattern of the stamper transferred thereto. Forming a click layer.

  In the resin mask layer forming method according to the present invention, a resin material diluted with a solvent is applied as the resin material in the application process.

  Further, in the resin mask layer forming method according to the present invention, prior to the start of the coating treatment, the unevenness of the stamper is provided with an adhesion reducing layer for reducing the adhesion of the stamper to the layer of the cured resin material. An adhesion reducing layer forming process to be formed on the pattern forming surface is executed.

  Further, the resin mask layer forming method according to the present invention performs the curing process prior to the pasting process, and processes the adhesive layer for adhering the cured resin material layer to the workpiece. An adhesive layer forming process to be formed on the surface of the object is executed prior to the start of the pasting process.

  Furthermore, the resin mask layer forming method according to the present invention uses an SOG resin material as the resin material, and executes a baking process on the applied layer of the SOG resin material as the curing process.

  In the resin mask layer forming method according to the present invention, a radiation curable resin material is used as the resin material, and a radiation irradiation process for irradiating the applied radiation curable resin material with radiation is performed as the curing process.

  The information recording medium manufacturing method according to the present invention manufactures an information recording medium by etching the object to be processed using the resin mask layer formed according to any one of the resin mask layer forming methods described above.

  In addition, the resin mask layer forming apparatus according to the present invention is configured to be capable of forming a resin mask layer for etching a workpiece, and applies a resin material to the concave / convex pattern forming surface of the stamper, and the stamper The application surface of the resin material is pressed against the surface of the object to be processed, and an application device for applying the layer of the resin material applied to the stamper to the object to be processed, and the resin material applied to the object to be processed The resin material comprising: a peeling device for peeling the stamper from a layer; and a curing device for curing the layer of the resin material applied to the stamper, wherein the uneven pattern of the stamper is transferred to the surface of the workpiece. The resin mask layer made of the above layer is formed.

  In the resin mask layer forming method and the resin mask layer forming apparatus according to the present invention, an application process for applying a resin material to a stamper, an application process for applying a layer of the resin material applied to a stamper to a workpiece, and an applied resin A peeling process for peeling the stamper from the material layer, and a curing process for curing the applied resin material layer between the completion of the coating process and the start of the peeling process. A resin mask layer having a stamper uneven pattern transferred on the surface is formed. Therefore, according to the resin mask layer forming method and the resin mask layer forming apparatus according to the present invention, the stamper can be obtained by simply applying the resin material uniformly over the entire surface of the stamper by appropriately adjusting the coating amount of the resin material. The thickness of the bottom (residue) of the concave portion in the resin mask layer can be made uniform over the entire region without being affected by the width of the convex portion of the concave / convex pattern. As a result, it is possible to avoid a situation in which the width of the concave portion becomes larger than necessary when the residue is removed. In addition, since the applied resin material enters the concave portion of the concave / convex pattern in the stamper and the convex portion of the concave / convex pattern in the resin mask layer is formed, the height of the convex portion is not affected by the width of the concave portion. A uniform resin mask layer can be formed. Therefore, when manufacturing an information recording medium using this resin mask layer, the progress of the etching process can be made uniform over the entire area of the object to be processed. As a result, an information recording medium having a concavo-convex pattern in a desired state is obtained. Can be manufactured. Furthermore, unlike the conventional imprint method in which the stamper is pressed against the resin layer on the substrate surface with a strong force, the stamper is not subjected to great stress during the formation of the resin mask layer, so the life of the stamper can be extended. it can. Accordingly, a large number of resin mask layers can be formed using one stamper, and as a result, the manufacturing cost of the information recording medium can be sufficiently reduced.

  Further, according to the resin mask layer forming method according to the present invention, the resin material applied to the stamper is sufficiently low by applying the resin material obtained by diluting the resin material with a solvent. It can be confidently and easily adapted. Therefore, it is possible to form a resin mask layer in which the height of each convex portion is uniform over the entire region, and avoid the occurrence of uneven coating of the resin material (variation in coating thickness), and the thickness of the residue over the entire region. A uniform resin mask layer can be formed on the workpiece.

  Furthermore, according to the method for forming a resin mask layer according to the present invention, when the stamper is peeled from the layer of the resin material by performing the adhesion reducing layer forming process prior to the coating process, the uneven pattern of the stamper and the resin material The stamper can be smoothly peeled from the layer of the resin material without applying a great stress to both the concave and convex patterns in the layer. Accordingly, it is possible to avoid a situation in which the concavo-convex pattern in the resin material layer is deformed or missing when the stamper is peeled off, and to further extend the life of the stamper and further reduce the manufacturing cost of the information recording medium.

  Further, according to the resin mask layer forming method according to the present invention, the adhesive layer forming process for forming the adhesive layer on the surface of the object to be processed is performed prior to the start of the sticking process, so that the resin material layer and the object to be processed The layer of the resin material can be bonded to the body sufficiently strongly, so that when the stamper is peeled from the layer of the resin material, the resin material layer is not subjected to great stress on both the uneven pattern of the stamper and the uneven pattern of the resin material layer. The stamper can be peeled off smoothly. Accordingly, it is possible to avoid a situation in which the concavo-convex pattern in the resin material layer is deformed or missing when the stamper is peeled off, and to further extend the life of the stamper and further reduce the manufacturing cost of the information recording medium.

  Furthermore, according to the method for forming the resin mask layer according to the present invention, by using the SOG resin material as the resin material, the fluidity of the SOG resin material is sufficiently increased during the baking process for curing the SOG resin material. As a result, the reflow effect can sufficiently improve the flatness of the back side (the surface to be applied to the workpiece later), so that the unevenness pattern residue thickness in the resin mask layer is made more uniform throughout the entire area. can do. Also. When the layer of the resin material is pressed against the object to be processed, it can be sufficiently adhered to the object to be processed.

  Moreover, according to the method for forming a resin mask layer according to the present invention, by using a radiation curable resin material as the resin material, the resin material can be cured simply by irradiating the applied resin material with radiation using a radiation irradiation apparatus. Therefore, the time required for forming the resin material layer can be shortened. In addition, by adopting a radiation curable resin material, for example, the stamper coated with the resin material can be pressed against the object to be processed, and then the resin material can be cured by irradiating the radiation. The layer of the resin material can be adhered (adhered) to the object to be processed without forming the like.

  Further, according to the information recording medium manufacturing method of the present invention, the information mask is manufactured by etching the object to be processed using the resin mask layer formed according to the above-described resin mask layer forming method. Since the thickness of the residue of the concavo-convex pattern transferred to the layer is uniform over the entire area, and the height of the convex portion is uniform over the entire area, the progress of the etching process on the workpiece is performed over the entire area of the workpiece. Can be made uniform. Therefore, it is possible to avoid an excessive etching or insufficient etching and to form a concavo-convex pattern in a desired state without excessive or insufficient.

  Hereinafter, the best mode of a resin mask layer forming method, an information recording medium manufacturing method, and a resin mask layer forming apparatus according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the resin mask layer forming apparatus will be described with reference to the drawings.

  An information recording medium manufacturing apparatus 100 shown in FIG. 1 is an apparatus configured to be able to manufacture the information recording medium 1 shown in FIG. 2 according to the information recording medium manufacturing method according to the present invention. A mask forming apparatus 102 and an etching apparatus 103 are provided. In this case, the information recording medium 1 is, for example, a discrete track type magnetic recording medium, and as shown in FIG. 2, a large number of concentric data records divided at a predetermined arrangement pitch (for example, 150 nm). A concavo-convex pattern 35 comprising a plurality of convex portions 35a, 35a,... And a plurality of concave portions 35b, 35b,. Since the configuration of the discrete track type magnetic recording medium is well known, detailed description thereof is omitted. In this information recording medium 1, a resin mask 41 (an example of a resin mask layer in the present invention: see FIG. 10) is used on the surface of the intermediate body 10 shown in FIG. 3 (upper surface in FIG. 3) using the stamper 20 shown in FIG. It is manufactured by forming and performing an etching process using this resin mask 41.

  The intermediate body 10 is an example of the object to be processed in the present invention. As shown in FIG. 3, the intermediate body 10 has a magnetic layer 12 on a disk substrate 11 formed in a disk shape with silicon, glass, ceramic, or the like. A carbon layer 13 and a nickel layer 14 are laminated in this order. Actually, there are various functional layers such as a soft magnetic layer and an orientation layer between the disk base material 11 and the magnetic layer 12. However, in order to facilitate understanding of the present invention, these will be described. And illustration is abbreviate | omitted. In this case, the carbon layer 13 is used to form a carbon mask 43 (see FIG. 12) for protecting the portions to be the convex portions 35a, 35a,... In the information recording medium 1 during the etching process on the magnetic layer 12. The The nickel layer 14 is used to form a nickel mask 42 (see FIG. 11) for forming a carbon mask 43 by etching the carbon layer 13. As will be described later, the stamper (mold) 20 is for forming a resin mask 41 (resin layer 22: see FIG. 10) on the surface of the intermediate body 10, and is formed in a disk shape as a whole. As shown in FIG. 4, a concavo-convex pattern 31 composed of a plurality of convex portions 31a, 31a,... And concave portions 31b, 31b,. In addition, the depth of the recessed part 31b in the uneven | corrugated pattern 31 (height of the convex part 31a) is 80 nm as an example.

  On the other hand, the intermediate manufacturing apparatus 101 is an intermediate in which the magnetic layer 12, the carbon layer 13, and the nickel layer 14 are formed on the disk base material 11 in this order by sputtering various materials on the surface of the disk base material 11, for example. 10 is manufactured.

The resin mask forming apparatus 102 corresponds to the resin mask layer forming apparatus in the present invention, and as shown in FIG. 1, a release layer forming apparatus 111, a resin material applying apparatus 112, a baking apparatus 113, an adhesive layer forming apparatus 114, and a press apparatus. 115. The peeling layer forming device 111 is a device that performs the adhesion reducing layer forming process in the present invention, and a coating material of a fluorine-based material is formed on the surface of the stamper 20 where the uneven pattern 31 is formed (the uneven pattern forming surface in the present invention). For example, by applying by spin coating, a release layer 21 is formed on the surface of the stamper 20 so as to cover the uneven pattern 31 as shown in FIG. Note that the material for reducing the adhesion is not limited to the fluorine-based coating agent, and various materials that can reduce the adhesion between the resin layer 22 and the stamper 20 can be employed. The resin material coating apparatus 112 is an apparatus (coating apparatus in the present invention) that performs the coating process in the present invention, and covers the release layer 21 formed by the release layer forming apparatus 111 as shown in FIG. For example, an SOG (Spin On Glass) resin material 22a is applied by spin coating to form a layer of the SOG resin material 22a. In this case, the SOG resin material 22a corresponds to the resin material in the present invention, and is prepared by diluting a siloxane component in the following general formula A with a solvent.
General formula _{A: R n Si (OH)} 4-n (. However, "R", H or an alkyl group _"n" is an integer of 0 to 3)

  The baking device 113 corresponds to the curing device in the present invention, and the layer of the SOG-based resin material 22a applied by the resin material coating device 112 is baked and cured (an example of the curing processing in the present invention). Layer 22 is formed. The adhesive layer forming apparatus 114 is an apparatus that performs an adhesive layer forming process according to the present invention. By applying HMDS (Hexamethyldisilazane) on the surface of the intermediate body 10 by, for example, a spin coating method, As shown in FIG. 8, the adhesive layer 15 is formed on the surface of the intermediate body 10. The press device 115 is a device (a pasting device according to the present invention) for executing the pasting process according to the present invention. As shown in FIG. 9, the adhesive layer 15 is formed on the resin layer 22 formed on the stamper 20. By pressing (pressing) toward the intermediate body 10, the resin layer 22 is attached to the intermediate body 10 via the adhesive layer 15. Further, the press device 115 is a device (a peeling device in the present invention) that performs the peeling process in the present invention, and moves the stamper 20 in a direction away from the intermediate body 10 as shown in FIG. Thus, the stamper 20 is peeled from the resin layer 22 attached to the intermediate body 10.

  The etching apparatus 103 performs an etching process on the intermediate body 10 to manufacture the information recording medium 1. Specifically, the etching apparatus 103 removes the residue of the resin mask 41 formed on the surface of the intermediate body 10 by the resin mask forming apparatus 102. In addition, the etching apparatus 103 etches the nickel layer 14 using the resin mask 41 from which the residue has been removed, thereby forming an uneven pattern 33 on the carbon layer 13 as shown in FIG. 42 is formed. Further, the etching apparatus 103 etches the carbon layer 13 using the nickel mask 42, thereby forming the concavo-convex pattern 34 on the magnetic layer 12 to form the carbon mask 43 as shown in FIG. Further, the etching apparatus 103 etches the magnetic layer 12 using the carbon mask 43 to form the concave / convex pattern 35 as shown in FIG.

  Next, the process of manufacturing the information recording medium 1 according to the information recording medium manufacturing method according to the present invention will be described with reference to the drawings.

  First, the stamper 20 is manufactured. Specifically, first, a resist layer is formed by spin-coating a resist on the surface of the substrate. Next, an exposure pattern (latent image) is drawn by irradiating the resist layer with an electron beam (radiation) using, for example, an electron beam lithography apparatus. Subsequently, the resist layer on which drawing has been completed is developed to eliminate a portion of the latent image formed by electron beam irradiation, thereby forming a concavo-convex pattern on the substrate. As a result, a master master is produced. In addition, it can also be set as a master original disk by etching a base material using the resist layer which remains on the base material after a development process as a mask, and carving a concavo-convex pattern in the base material. Next, after forming an electrode film for electroforming along the concavo-convex shape of the concavo-convex pattern on the master master, an electroforming process is performed using the formed electrode film as an electrode to form a nickel layer. Subsequently, the laminate of the electrode film and the nickel layer is peeled from the substrate by immersing the laminate of the substrate, the resist layer, the electrode film, and the nickel layer in a resist stripping solution to eliminate the resist layer. Thereby, the concavo-convex pattern of the master master is transferred to the electrode film and the nickel layer, and the concavo-convex pattern 31 is formed. Thereafter, the stamper 20 is completed as shown in FIG. 4 by polishing and shaping the back side of the nickel layer to be flat.

  In parallel with the production of the stamper 20, the intermediate 10 is produced by the intermediate production apparatus 101. Specifically, first, the magnetic layer 12 is formed on the disk substrate 11 by setting the disk substrate 11 polished so as to have a flat surface on the intermediate body manufacturing apparatus 101 and sputtering the magnetic material. . Next, the carbon layer 13 is formed on the magnetic layer 12 by sputtering carbon so as to cover the formed disk substrate 11. Subsequently, the nickel layer 14 is formed on the carbon layer 13 by sputtering nickel so as to cover the formed carbon layer 13. Thereby, as shown in FIG. 3, the intermediate body 10 is completed.

  Next, the manufactured stamper 20 and intermediate body 10 are set in the resin mask forming apparatus 102, and the resin mask 41 is formed on the surface of the intermediate body 10. Specifically, as shown in FIG. 5, first, the release layer forming device 111 spin-coats a coating material of a fluorine-based material so as to cover the uneven pattern 31 of the stamper 20, so that the release layer is formed on the surface of the stamper 20. 21 (adhesion reducing layer forming process in the present invention). The release layer 21 may be formed each time the resin mask 41 is formed. However, the release layer 21 may be formed a plurality of times to such an extent that the release property of the stamper 20 from the resin layer 22 described later is not impaired. It may be executed once. Subsequently, as shown in FIG. 6, the resin material coating device 112 spin-coats the SOG resin material 22a through the release layer 21 so as to cover the formation surface of the uneven pattern 31 of the stamper 20 (application in the present invention). processing).

  In this case, as described above, the SOG resin material 22a is diluted with a solvent and its viscosity is sufficiently low. Therefore, the SOG resin material 22a applied by the resin mask forming apparatus 102 sufficiently penetrates deep into the recesses 31b, 31b,... In the recess / protrusion pattern 31 of the stamper 20 (the SOG resin material 22a fully adapts to the recess / protrusion pattern 31). ), And the occurrence of coating unevenness (coating thickness variation) is avoided, and the SOG resin material 22a is applied to a substantially uniform thickness over the entire surface of the stamper 20. During spin coating of the SOG resin material 22a, the amount of the SOG resin material 22a dripped onto the stamper 20, the diluted state (viscosity) of the SOG resin material 22a with a solvent, and the rotational speed of the stamper 20 during spin coating It is preferable to avoid applying a large amount (thick) of the SOG resin material 22a on the convex portions 31a, 31a,... Of the concave / convex pattern 31 in the stamper 20 by appropriately adjusting the time and the like.

  Subsequently, the baking apparatus 113 performs a baking process on the layer of the SOG resin material 22a applied to the stamper 20 by the resin material applying apparatus 112, for example, at 140 ° C. for about 3 minutes (curing in the present invention). processing). At this time, as a result of the volatilization of the solvent from the layer of the SOG resin material 22a by the baking process, the SOG resin material 22a is cured and the resin layer 22 is formed on the stamper 20, as shown in FIG. . In this case, as shown in FIG. 6, the convex portions 31 a and 31 a in the concave / convex pattern 31 of the stamper 20 are formed on the layer of the SOG resin material 22 a formed on the stamper 20 during the coating process by the resin material coating device 112. ..Slightly unevenness may occur on the surface so that the part above is slightly raised. However, when the layer of the SOG resin material 22a is baked by the baking device 113, extremely small irregularities generated at the time of completion of application become smaller irregularities (the irregularities almost disappear).

  Next, as shown in FIG. 8, the adhesive layer forming apparatus 114 spin-coats HMDS on the surface of the intermediate body 10 (the surface of the nickel layer 14), thereby forming the adhesive layer 15 on the surface of the intermediate body 10 (this book). Adhesive layer forming treatment in the invention). Subsequently, the stamper 20 is set on the press device 115 with the surface on which the resin layer 22 is formed facing downward, and the intermediate body 10 is set on the press device 115 with the surface on which the adhesive layer 15 is formed facing upward. Next, the press device 115 lowers the stamper 20 toward the intermediate body 10 and presses the stamper 20 (resin layer 22) against the intermediate body 10 (adhesive layer 15). At this time, for example, the press device 115 maintains a state in which a pressure of about 2 MPa (290 psi) is applied for one minute. As a result, as shown in FIG. 9, the back surface (the lower surface in the figure) of the resin layer 22 formed on the stamper 20 is bonded to the surface of the intermediate body 10 via the adhesive layer 15 (in the present invention). Pasting process).

  Subsequently, the press device 115 raises the stamper 20 so as to be separated from the intermediate body 10. At this time, as shown in FIG. 10, the stamper 20 is peeled off from the resin layer 22 so that the resin layer 22 bonded to the intermediate body 10 is left on the intermediate body 10 side through the adhesive layer 15. (Peeling treatment in the present invention). As a result, the portion of the stamper 20 where the convex portion 31a is present in the concave / convex pattern 31 becomes the concave portion 32b, and the portion where the concave portion 31b is present in the concave / convex pattern 31 becomes the convex portion 32a. The concave / convex pattern 31 is transferred to the resin layer 22, and a resin mask 41 made of the resin layer 22 is formed on the intermediate body 10. In this case, since the resin mask 41 (concave / convex pattern 32) is formed in a state in which the SOG resin material 22a is sufficiently familiar in the concave portions 31b, 31b... Of the concave / convex pattern 31 formed on the stamper 20, The height of the convex portions 32a, 32a,... (The depth of the concave portions 32b, 32b,...) Is uniform at 80 nm over the entire area of the body 10. Further, since the release layer 21 is formed so as to cover the uneven pattern 31 of the stamper 20 by the release layer forming device 111 prior to the release of the stamper 20 by the press device 115, The stamper 20 is smoothly peeled off from the resin layer 22 without applying large stress to both the patterns 31 and 32. As a result, it is possible to avoid a situation in which both the concave and convex patterns 31 and 32 are deformed or missing. Thus, the formation of the resin mask 41 as the resin mask layer in the present invention is completed.

  Next, when manufacturing the information recording medium 1 using the resin mask 41, the intermediate body 10 on which the resin mask 41 is formed is set in the etching apparatus 103 and an etching process is performed. Specifically, first, residues remaining on the bottom surfaces of the recesses 32b, 32b,... In the resin mask 41 (uneven pattern 32) are removed using an etching gas for removing residues. Subsequently, the nickel layer 14 in the intermediate 10 is etched using an etching gas for etching the nickel layer, so that the bottom surface of the recesses 32b, 32b,. The surface of the carbon layer 13 is exposed to form an uneven pattern 33 (nickel mask 42) on the carbon layer 13 as shown in FIG. At this time, the nickel layer 14 at the portion covered with the convex portion 32a in the resin mask 41 (uneven pattern 32) is protected from the etching gas and remains on the carbon layer 13 to form the convex portion 33a. A portion of the recess 32b in 32 is removed from the carbon layer 13 by the etching gas to form the recess 33b.

  Subsequently, the carbon layer 13 in the intermediate body 10 is etched using an etching gas for etching the carbon layer, so that the bottom surface of the recesses 33b, 33b,. The surface of the magnetic layer 12 is exposed, and an uneven pattern 34 is formed on the magnetic layer 12 as shown in FIG. At this time, the carbon layer 13 in a portion covered with the convex portion 33a in the nickel mask 42 (concave / convex pattern 33) is protected from the etching gas and remains on the magnetic layer 12 to form the convex portion 34a. A portion of the recess 33b in the pattern 33 is removed from the magnetic layer 12 by the etching gas to form a recess 34b. Next, the magnetic layer 12 in the intermediate body 10 is etched using an etching gas for magnetic layer etching, so that the surface of the disk substrate 11 is exposed from the bottom surface of the recesses 34b, 34b,. As shown in FIG. 2, an uneven pattern 35 is formed on the disk substrate 11. At this time, the portion of the magnetic layer 12 covered with the convex portion 34a in the carbon mask 43 (uneven pattern 34) is protected from the etching gas and remains on the disk substrate 11 to form the convex portion 35a. A portion of the concave portion 34b in the concave / convex pattern 34 is removed from the disk substrate 11 by the etching gas to form the concave portion 35b. Thereafter, a surface finishing process is performed after filling the recesses 35b, 35b,... With a nonmagnetic material such as silicon dioxide as necessary. If necessary, for example, a protective film is formed on the surface by DLC (Diamond Like Carbon) and a lubricant is applied. Thereby, the information recording medium 1 is completed.

  As described above, in the method for manufacturing the information recording medium 1 (method for forming the resin mask 41) by the information recording medium manufacturing apparatus 100, the coating process for applying the SOG resin material 22a to the stamper 20 and the SOG applied to the stamper 20 are performed. An affixing process for affixing the layer of the resin-based resin material 22a to the intermediate body 10 and a peeling process for separating the stamper 20 from the affixed layer of the SOG-based resin material 22a are performed. The curing process to be cured is performed from the time point when the coating process is completed to the time point when the peeling process is started (in this example, immediately after the completion of the coating process and before the start of the sticking process). A resin mask 41 (resin layer 22) to which the uneven pattern 31 is transferred is formed. Therefore, according to the method for manufacturing the information recording medium 1 (method for forming the resin mask 41) by the information recording medium manufacturing apparatus 100, the coating amount of the SOG resin material 22a is adjusted as appropriate over the entire surface of the stamper 20. By simply applying the SOG resin material 22a uniformly, the concave portions 32b, 32b in the resin mask 41 (resin layer 22) are not affected by the width of the convex portions 31a, 31a,. .. The thickness of the bottom (residue) can be made uniform over the entire area. As a result, it is possible to avoid a situation in which the lateral width of the recess 32b becomes larger than necessary when the residue is removed. Further, since the SOG resin material 22a applied into the concave portions 31b, 31b,... Of the concave / convex pattern 31 in the stamper 20 enters into the convex portions 32a, 32a,. The resin mask 41 (resin layer 22) having a uniform height of the convex portion 32a can be formed over the entire region without being affected. Therefore, when the information recording medium 1 is manufactured using the resin mask 41, the progress of the etching process can be made uniform over the entire area of the intermediate body 10. As a result, the information recording having the uneven pattern 35 in a desired state. The medium 1 can be manufactured. Further, unlike the conventional imprint method in which the stamper is pressed against the resin layer on the substrate surface with a strong force, no great stress is applied to the stamper 20 when the resin mask 41 (resin layer 22) is formed. Long life can be achieved. Accordingly, a large number of resin masks 41 can be formed using one stamper 20, and as a result, the manufacturing cost of the information recording medium 1 can be sufficiently reduced.

  Further, according to the information recording medium 1 manufacturing method (resin mask 41 forming method) by the information recording medium manufacturing apparatus 100, the stamper 20 is applied to the stamper 20 by applying the SOG resin material 22a in which the siloxane component is diluted with a solvent. Since the viscosity of the SOG resin material 22a to be applied is sufficiently low, the SOG resin material 22a can be reliably and easily adapted to the concavo-convex pattern 31. Therefore, the resin mask 41 (resin layer 22) having a uniform height of the convex portions 32a, 32a,... Can be formed over the entire area, and uneven application of the SOG resin material 22a (application thickness variation). The situation which arises can be avoided and the resin mask 41 (resin layer 22) with the uniform thickness of the residue can be formed on the intermediate body 10 in the whole region.

  Furthermore, according to the method for manufacturing the information recording medium 1 by the information recording medium manufacturing apparatus 100 (method for forming the resin mask 41), the adhesion force is reduced prior to the coating process of applying the SOG resin material 22a to the stamper 20. When the stamper 20 is peeled from the resin layer 22 by performing a coating process for applying a material (adhesion reducing layer forming process in the present invention), the uneven pattern 31 of the stamper 20 and the uneven pattern 32 of the resin layer 22 The stamper 20 can be smoothly peeled from the resin layer 22 without applying large stress to both. Accordingly, it is possible to avoid a situation in which the concave / convex pattern 32 is deformed or missing when the stamper 20 is peeled off, and to further extend the life of the stamper 20 and further reduce the manufacturing cost of the information recording medium 1.

  Further, according to the method for manufacturing the information recording medium 1 (method for forming the resin mask 41) by the information recording medium manufacturing apparatus 100, the adhesive layer forming process for forming the adhesive layer 15 on the surface of the intermediate body 10 is performed on the intermediate body 10. By executing the stamper 20 prior to the start of the sticking process, the resin layer 22 and the intermediate body 10 can be bonded sufficiently strongly. Therefore, when the stamper 20 is peeled from the resin layer 22, the uneven pattern of the stamper 20 is obtained. The stamper 20 can be smoothly peeled from the resin layer 22 without applying a large stress to both the 31 and the concavo-convex pattern 32 of the resin layer 22. Accordingly, it is possible to avoid a situation in which the concave / convex pattern 32 is deformed or missing when the stamper 20 is peeled off, and to further extend the life of the stamper 20 and further reduce the manufacturing cost of the information recording medium 1.

  Furthermore, according to the method for manufacturing the information recording medium 1 (method for forming the resin mask 41) by the information recording medium manufacturing apparatus 100, the SOG resin material 22a is used as the resin material in the present invention. As a result of sufficiently improving the fluidity of the SOG resin material 22a during the baking process for curing the surface, it is possible to sufficiently improve the flatness of the back surface (the surface to be attached to the intermediate body 10 later) by the reflow effect. Can do. Accordingly, the thickness of the residue of the concave / convex pattern 32 can be made more uniform over the entire region, and when the resin layer 22 is pressed against the intermediate body 10, it can be sufficiently adhered to the intermediate body 10.

  In addition, according to the method of manufacturing the information recording medium 1 by the information recording medium manufacturing apparatus 100, the intermediate body 10 is etched using the resin mask 41 (resin layer 22) formed according to the above method, and the information recording medium 1 is processed. , The thickness of the residue of the resin mask 41 (resin layer 22) is uniform over the entire area, and the heights of the convex portions 32a, 32a,. The progress of the etching process can be made uniform over the entire area of the intermediate body 10. Accordingly, it is possible to avoid the excessive etching and insufficient etching, and to form the uneven pattern 35 (uneven pattern 33, 34) in a desired state without excessive or insufficient.

  In addition, this invention is not limited to said structure and method. For example, in the information recording medium manufacturing apparatus 100 described above, the resin mask 41 (resin layer 22) is formed using the SOG resin material 22a as the resin material in the present invention, but instead of the SOG resin material 22a, For example, the resin mask 41 (resin layer 22) may be formed using various radiation curable resin materials such as an ultraviolet curable resin material, a heat ray curable resin material, and an electron beam curable resin material. In this case, by forming the resin mask 41 (resin layer 22) using a radiation curable resin material, a radiation irradiation device (curing according to the present invention) is applied to the applied resin material instead of the baking process by the baking device 113 described above. Since the resin material can be cured simply by irradiating radiation using an example of the apparatus, the time required for forming the resin mask 41 (resin layer 22) can be shortened. Further, by adopting a radiation curable resin material, for example, the stamper 20 coated with the resin material can be pressed against the intermediate body 10 and then irradiated with radiation to cure the resin material. The resin layer 22 can be adhered (adhered) to the intermediate 10 without forming the layer 15. In this case, when an ultraviolet curable resin material is employed as the radiation curable resin material, a stamper manufactured using a light transmissive material is used instead of the stamper 20 described above. Further, when an electron beam curable resin material is employed as the radiation curable resin material, a stamper manufactured using a material capable of passing an electron beam is used instead of the stamper 20 described above.

  Further, instead of the SOG resin material 22a, the resin mask 41 (resin layer 22) can be formed using, for example, an acrylic resin material. In addition, the resin material is diluted with a highly volatile solvent, and the resin material is cured simply by leaving it at room temperature for a predetermined time (in this case, leaving for a predetermined time corresponds to the curing treatment in the present invention). 22 can also be formed. Further, in the information recording medium manufacturing apparatus 100 described above, the release layer forming apparatus 111 applies the coating agent by the spin coating method, and the resin material applying apparatus 112 applies the SOG resin material 22a by the spin coating method. The present invention is not limited to this, and the adhesion reducing material and the resin material can be applied by various application methods other than the spin coat method. Further, in the information recording medium manufacturing apparatus 100 described above, the release layer 21 is formed by applying a coating material of a fluorine material to the stamper 20, but the adhesion reducing layer forming process in the present invention is not limited to this. For example, the adhesion reducing layer can be formed on the stamper by various forming methods such as a CVD method (chemical vapor deposition method).

  Furthermore, in the information recording medium manufacturing apparatus 100 described above, the adhesive layer 15 is formed on the surface of the intermediate body 10 by the adhesive layer forming apparatus 114, and the resin layer 22 is bonded to the intermediate body 10. It is not limited. For example, after the temperature of the stamper 20 in which the formation of the resin layer 22 is completed is increased to a temperature equal to or higher than the glass transition point of the resin layer 22 and pressed against the intermediate body 10 in which the adhesive layer 15 is not formed in that state, It is also possible to form the resin mask 41 by directly contacting (adhering) the resin layer 22 to the intermediate body 10 by lowering the temperature. The use of the concave / convex pattern formed by the resin mask layer forming method according to the present invention is not limited to the manufacture of a discrete track type information recording medium, and a patterned medium having a pattern other than a track-shaped pattern, or an information recording The present invention can be used for manufacturing electronic components other than media.

1 is a configuration diagram showing a configuration of an information recording medium manufacturing apparatus 100. FIG. 1 is a cross-sectional view of an information recording medium 1. FIG. FIG. 3 is a cross-sectional view of the intermediate body 10. 2 is a cross-sectional view of a stamper 20. FIG. 3 is a cross-sectional view of the stamper 20 in a state in which a release layer 21 is formed on the surface on which the uneven pattern 31 is formed. FIG. 3 is a cross-sectional view of the stamper 20 in a state where an SOG resin material 22a is applied to a concavo-convex pattern forming surface through a release layer 21. It is sectional drawing of the stamper 20 of the state which baked with respect to the layer of SOG type resin material 22a and formed the resin layer 22. FIG. It is sectional drawing of the intermediate body 10 of the state which formed the contact bonding layer 15 on the surface. 3 is a cross-sectional view of a state in which a resin layer 22 formed on a stamper 20 is pressed against an intermediate body 10. FIG. 3 is a cross-sectional view of a state in which a stamper 20 is peeled from a resin layer 22 attached to an intermediate body 10. FIG. It is sectional drawing of the intermediate body 10 of the state which formed the uneven | corrugated pattern 33 by etching the nickel layer 14 using the resin layer 22 as a mask. It is sectional drawing of the intermediate body 10 of the state which etched the carbon layer 13 using the uneven | corrugated pattern 33 as a mask, and formed the uneven | corrugated pattern 34. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Information recording medium 10 Intermediate body 15 Adhesive layer 20 Stamper 21 Peeling layer 22 Resin layer 22a SOG type resin material 31,35 Uneven pattern 41 Resin mask 100 Information recording medium manufacturing apparatus 102 Resin mask forming apparatus 103 Etching apparatus 111 Peeling layer forming apparatus 112 Resin material coating device 113 Bake device 114 Adhesive layer forming device 115 Press device

Claims (8)

When forming a resin mask layer for etching the object to be processed,
An application process for applying a resin material to the concave / convex pattern forming surface of the stamper;
A pasting process in which the application surface of the resin material in the stamper is pressed against the surface of the object to be processed and the layer of the resin material applied to the stamper is attached to the object to be processed;
A peeling process for peeling the stamper from the layer of the resin material affixed to the object to be processed, and a curing process for curing the layer of the resin material applied to the stamper from the time of completion of the coating process. A resin mask layer forming method comprising: forming the resin mask layer including the resin material layer obtained by transferring the concave / convex pattern of the stamper on the surface of the object to be processed by executing until the start of the peeling process.   The resin mask layer forming method according to claim 1, wherein a resin material diluted with a solvent is applied as the resin material in the application process.   Prior to the start of the coating process, an adhesion reduction layer forming process is performed in which an adhesion reduction layer for reducing the adhesion of the stamper to the cured resin material layer is formed on the uneven pattern formation surface of the stamper. The method for forming a resin mask layer according to claim 1 or 2 to be executed.   An adhesive layer forming process is performed in which the curing process is performed prior to the pasting process, and an adhesive layer for bonding the cured resin material layer to the workpiece is formed on the surface of the workpiece. The resin mask layer forming method according to claim 1, which is executed prior to the start of the pasting process.   5. The resin mask layer forming method according to claim 1, wherein an SOG resin material is used as the resin material, and a baking process for the applied layer of the SOG resin material is performed as the curing process. 6.   The resin mask layer according to claim 1, wherein a radiation curable resin material is used as the resin material, and a radiation irradiation process for irradiating the applied radiation curable resin material with radiation is performed as the curing process. Forming method.   An information recording medium manufacturing method for manufacturing an information recording medium by etching the object to be processed using the resin mask layer formed according to the resin mask layer forming method according to claim 1. It is configured to be able to form a resin mask layer for etching the object to be processed,
An applicator for applying a resin material to the concave / convex pattern forming surface of the stamper;
A sticking device for sticking the layer of the resin material applied to the stamper by pressing the application surface of the resin material on the stamper against the surface of the workpiece;
A peeling device for peeling the stamper from the layer of the resin material affixed to the object to be processed;
A curing device for curing the layer of the resin material applied to the stamper,
The resin mask layer forming apparatus which forms the said resin mask layer which consists of the layer of the said resin material which transferred the said uneven | corrugated pattern of the said stamper to the said surface of the said workpiece.

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