JP2006160962A - Joining method, joined structure and joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for joining a bonding object to an adherend using an energy ray-curable adhesive following positioning the bonding object and the adherend in high accuracy, so as to avoid the deviation of bonding position in curing due to cure shrinkage and that due to change with time irrespective of bonding mode or the like in a simple apparatus construction, and to provide a joined structure and a joining apparatus for the method. <P>SOLUTION: The method for joining a bonding object 2 to an adherend 1 using an energy ray-curable adhesive 3 comprises the following practice: While giving curing energy in advance to the adhesive 3, the adhesive 3 is applied to the adherend 1 or the bonding object 2 to form the layer of the adhesive 3 with a predetermined distribution of curing energy levels; wherein the region in the layer with the least above curing energy is ensured not to cover the adherend 1 and the bonding object 2, thereafter the curing energy is uniformly given to the whole layer to effect complete curing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a bonding method, a bonding structure, and a bonding apparatus for bonding an adhesive to an adherend using an adhesive having energy ray curing characteristics.

Various types of energy ray curable adhesives such as thermosetting and photocuring types have been known as adhesives for bonding an adhesive to an adherend, and these energy ray curable adhesives have a high reaction rate. Since the curing time is short and the production process can be made more efficient, it is used in various technical fields (see, for example, Patent Documents 1 to 6).
By the way, this energy ray curable adhesive causes curing shrinkage when cured, and stress is generated along with this curing shrinkage. Generally, an acrylic ultraviolet curable resin is cured and contracted by about 5 to 10%, and an epoxy ultraviolet curable resin is approximately 2 to 5%, and a curing shrinkage force proportional to the amount of curing shrinkage is generated.
Although the influence of the curing shrinkage force on the adhesive strength is slight, the cure shrinkage force causes a shift in the bonding position during curing between the adherend and the adhesive. Also, if the curing shrinkage force remains as internal stress after curing, this internal residual stress is released over time, and due to the change over time of this residual stress, it shifts to the bonding position between the adherend and the adhesive. As a result, the intended function of the precision assembly part is lowered, and the high precision performance may be deteriorated.
14 (a) to 14 (c) are diagrams showing a general bonding method, (a) is a situation before curing, (b) is a diagram showing a situation after UV light irradiation, and (c) is an adhesive curing. It is a figure which shows the subsequent situation. In the figure, 21 is an adherend, 22 is an adhesive, and 23 is a UV curable adhesive. First, as shown in (a), when an adhesive 23 is applied between the adherend 21 and the adhesive 22 and then irradiated with UV light 6, the adhesive 23 is close to UV light as shown in (b). Curing proceeds in order from the upper layer to the lower layer of the adhesive layer (shown in darker color as the curing reaction proceeds in response to the curing energy). This is because the energy ray curable adhesive has a predetermined light absorption rate, and inevitably occurs because the attenuation of UV light increases toward the lower layer of the adhesive layer.
In this case, curing starts in the entire upper layer of the adhesive layer. However, the fluidity of the energy beam curing adhesive 23 in this region between the adhesive 22 and the adherend 21 is lost and curing shrinkage occurs, resulting in misalignment. Cause it to occur. Further, since the curing occurs simultaneously in the entire upper layer of the adhesive layer, the energy ray curing adhesive 23 cannot flow, and the contracted portion cannot be replenished, and an internal residual stress is generated.
Subsequently, the lower layer begins to harden from this layer, but also in this region, hardening shrinkage and internal residual stress occur. At that time, the upper layer is affected by the shrinkage of the lower layer in spite of the fact that the curing has been completed, and further internal residual stress is accumulated. As a result, as shown in FIG. The internal residual stress is accumulated, and not only the positional deviation (d1) immediately after bonding (at the time of curing shrinkage) but also the positional deviation due to a change with time increases.
Because of such problems, in Patent Document 1, the viscosity of the adhesive is lowered and pressed to make the adhesive layer thin and uniform, whereby the volume change due to the curing shrinkage of the adhesive and the temperature change is caused. A device that is small and uniform occurs is disclosed. Patent Document 2 discloses a device that can be divided into a semi-curing process and a main curing process.

Further, Patent Document 3 discloses a contrivance such that oxide ceramic fine particles having an average particle size of 10 μm or less are added to reduce the volume change due to curing shrinkage and temperature change of the adhesive itself. Patent Document 4 discloses a device that reduces the stress caused by shrinkage by joining while pressing at least one of the lenses following the shrinkage of the joining layer accompanying the curing shrinkage of the adhesive that joins a plurality of lenses. is doing.
Further, in Patent Document 5, an intermediate holding member is provided between an adhesive and an adherend, and an adjustment allowance similar to that of filling adhesion is allowed. Because of a thin adhesive layer, volume change due to curing shrinkage of the adhesive or temperature change is caused. The idea of making it smaller is disclosed. Further, Patent Document 6 discloses a device in which a filler having a uniform particle diameter and density is added so that volume change due to curing shrinkage and temperature change of the adhesive itself is reduced.
Furthermore, the unpublished research by the present applicant has made a multi-layer structure using a plurality of adhesives, and stiffens other energy ray curable adhesives at different curing timings to perform adhesive curing. By applying technology or irradiation control to prevent misalignment due to curing shrinkage as much as possible, the progress of the curing process has a spatial gradient, and internal stress due to curing shrinkage is reduced to prevent changes due to curing shrinkage as much as possible. There is technology.
JP 2000-090481 A Japanese Patent Laid-Open No. 06-188550 Japanese Patent Application Laid-Open No. 07-201028 JP 09-197105 A JP-A-10-309801 JP-A-10-121013

However, in the above-described various technological developments made to avoid the above-mentioned problems, the first method as described in Patent Documents 1 and 5 is to use a thin amount of adhesive to be used (applied), This is a method of reducing the change over time due to misalignment or temperature fluctuation during curing. However, in these methods, the adhesion structure between the adherend and the adhesive is limited, and since it is indirect adhesion, another part is required and there are problems that the number of adhesion points increases.
The second method as described in Patent Documents 3 and 6 is a method in which the adhesive itself is modified. Specifically, the curing shrinkage of the adhesive is reduced by adding ceramic fine particles or fillers. In this technique, the positional deviation at the time of curing is suppressed, and the internal residual stress is reduced to reduce the change with time due to temperature fluctuations. In recent years, this adhesive has been actively developed.
However, in this case, a special adhesive is required, and as the amount of the adhesive increases, the amount of cure shrinkage increases, which causes a problem that the internal residual stress increases.
Furthermore, the third method as described in Patent Document 2 is a method that divides the adhesive into a semi-curing step and a main curing step, and after removing most of the shrinkage force in the semi-curing step, This is a technology for complete curing in the main curing process.
However, in this method, a slight misalignment during curing occurs in the main curing step, and the internal residual stress remains unchanged.
Furthermore, the fourth method as described in Patent Document 4 is a method in which bonding is performed while adjusting the thickness of the bonding layer following the shrinkage of the bonding layer accompanying the curing shrinkage of the adhesive. This is a technology for reducing
However, this technique is basically surface bonding, the bonding structure is limited, can only reduce the stress that occurs at the interface between the adhesive that cures and shrinks and the part that does not shrink, and the adhesive after curing. Since the internal residual stress cannot be greatly reduced, it is also impossible to prevent a time lag.

By using the above-mentioned unpublished research by the present applicant, it is possible to reduce the adhesive shrinkage during curing by reducing the curing shrinkage force, and to reduce the internal residual stress and suppress the change with time. Adhesive is required or large-scale control is required on the irradiation device side, so an extra device is required, and it is difficult to arrange by design when bonding small parts, and to produce this Therefore, a large-scale device is required.
In view of the above-described circumstances, the object of the present invention is to position the adherend and the adhesive with high accuracy, and then attach the adherend and the adhesive to the adherend using the energy ray curable adhesive. Provides a bonding method, a bonding structure, and a bonding apparatus that avoids the deviation of the bonding position during curing due to curing shrinkage and the deviation of the bonding position due to changes over time, regardless of the bonding form, etc., with a simple apparatus configuration. There is to do.

In order to solve the above-described problems, the invention described in claim 1 is a bonding method in which an adhesive is bonded to an adherend using an adhesive having energy beam curing characteristics, and curing energy is applied to the energy beam curable adhesive. By applying the energy ray curable adhesive to the adherend or the adhesive while applying in advance, an adhesive layer of the energy ray curable adhesive having a predetermined distribution in the amount of curing energy is formed, and the energy ray The region in the adhesive layer with the least curing energy applied to the curable adhesive is not covered with the adherend and the adhesive, and then uniform curing energy is applied to the entire adhesive layer. It is characterized by a joining method in which it is completely cured.
According to a second aspect of the present invention, in the bonding method according to the first aspect, the curing energy is applied to the energy beam curable adhesive so that the curing energy changes stepwise in the adhesive layer. .
According to a third aspect of the present invention, in the joining method according to the first or second aspect, the energy beam curable adhesive is changed while the irradiation intensity of the energy beam irradiated to the energy beam curable adhesive discharged from the nozzle is changed in advance. It is characterized by being applied to an adherend or an adhesive.
According to a fourth aspect of the present invention, in the joining method according to the first or second aspect, the energy beam curable adhesive is applied while the irradiation time of the energy beam irradiated to the energy beam curable adhesive discharged from the nozzle is changed in advance. It is characterized by being applied to an adherend or an adhesive.
According to a fifth aspect of the present invention, in the joining method according to any one of the first to fourth aspects of the present invention, the energy beam curable adhesive portion provided with a large amount of curing energy is applied to an adherend or an adhesive. It is characterized by going.
According to a sixth aspect of the present invention, there is provided a bonding structure in which an adhesive is bonded to an adherend using an adhesive having energy beam curing characteristics, while the energy beam curable adhesive is applied to the energy beam curable adhesive in advance. An adhesive layer of an energy beam curable adhesive having a predetermined distribution in the amount of curing energy was formed by applying the adhesive to an adherend or an adhesive, and applied to the energy beam curable adhesive The bonding structure is configured such that a region in the adhesive layer having the least curing energy does not span the adherend and the adhesive.

The invention according to claim 7 is characterized in that, in the joint structure according to claim 6, the energy energy is applied to the energy ray curable adhesive so that the curing energy changes stepwise in the adhesive layer. .
The invention according to claim 8 is an adhesive application unit that applies an energy beam curable adhesive, a first energy beam irradiation unit that can impart a predetermined amount of curing energy to the energy beam curable adhesive during application, A first irradiation amount control means for controlling a curing energy amount of the first energy ray irradiation means; a second energy ray irradiation means for completely curing the energy ray curable adhesive; and the second energy ray irradiation means. A bonding apparatus including a second dose control unit that controls the energy beam irradiation unit is characterized.
A ninth aspect of the invention is characterized in that, in the joining device according to the eighth aspect, the first irradiation amount control means changes the irradiation intensity of the energy beam applied to the energy beam curable adhesive.
A tenth aspect of the present invention is the bonding apparatus according to the eighth aspect, characterized in that the first irradiation amount control means changes the irradiation time of the energy beam applied to the energy beam curable adhesive.
The invention according to claim 11 is the bonding apparatus according to claim 8, wherein the first energy beam irradiating means irradiates only a desired range of the energy beam curable adhesive discharged by the adhesive applying unit. An irradiation range control means capable of applying energy is provided.

According to the present invention, even if curing energy is given to the entire adhesive layer to start curing, it can be divided into a part that retains fluidity during the curing and a part that undergoes curing shrinkage. It is possible to absorb the tensile stress accompanying the flow deformation and curing shrinkage.
In addition, since the adhesive layer includes a portion in which fluidity is maintained and a portion that undergoes shrinkage at the time of application, it can be performed in an off-line process, and the process time can be shortened. Furthermore, irradiation control in the in-line process is not performed, large-scale control and expensive equipment are not required, and it is not necessary to secure an installation place thereby, so that it is easy to replace existing equipment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, an energy beam curable adhesive (for example, a photo curable adhesive (UV curable adhesive, visible light curable adhesive), a radiation curable adhesive, an X-ray curable adhesive) will be described. .
This is because in the case of a thermosetting adhesive, it is necessary to apply heat in an oven or the like in order to cure it, which hinders the improvement of production efficiency or may not allow heat depending on the adherend or adhesive. Because there are things.
In the case of an anaerobic curable adhesive, it is necessary to block air in order to cure the adhesive, which may limit the bonding form. This is because the photo-curing adhesive does not have such a problem, and is easier to handle and practical than the thermosetting adhesive and the anaerobic curing adhesive.
Usually, when an adhesive is bonded to an adherend with, for example, a UV curable adhesive, the adhesive is cured by applying the adhesive to the interface of the two members and irradiating the adhesive with UV (ultraviolet) light. Glued. When this adhesive is cured, a curing shrinkage phenomenon occurs, and a general acrylic ultraviolet curable resin contracts by about 5 to 10%, and an epoxy ultraviolet curable resin contracts by about 2 to 5%.
Although the decrease in the adhesive strength due to the contraction force is slight, a tensile stress is generated by the curing contraction, and the initial adhesion position cannot be maintained. Further, if it exists as an internal residual stress after curing, the internal residual stress is released as a change with time, and the initial bonding position cannot be maintained.
The tensile stress and internal residual stress due to this curing shrinkage are due to the curing shrinkage of the adhesive and the fluidity of the peripheral adhesive. When the volume of the adhesive is reduced by the curing shrinkage, the surrounding adhesive retains fluidity. If the shrinkage can be replenished, no stress is generated. That is, when the volume of the adhesive is reduced due to curing shrinkage, the surrounding adhesive is also cured and has no fluidity, so that stress is generated.
Therefore, in the present invention, even if the volume of the adhesive is reduced due to cure shrinkage, the fluidity is retained in the surrounding adhesive where cure shrinkage occurs, and the generated stress can be absorbed by the portion having fluidity. A method, a joining structure, and a joining apparatus are provided.

FIG. 1 is a view showing an embodiment of a bonding apparatus for performing a bonding method according to the present invention, and FIGS. 2A to 2C are views for explaining irradiation in which the amount of curing energy is partially different. .
In these drawings, 1 is an adherend, 2 is an adhesive, 3 is an adhesive, 5a is a first energy beam irradiation means, 5b is a second energy beam irradiation means, 6 is an energy beam, and 7a is a first energy beam irradiation means. Energy beam irradiation control means, 7b is second energy ray irradiation control means, 8 is adhesive application means, 9 is application means operation means, 10 is operation control means, and 11 is overall control means. The first and second energy beam irradiating means condenses the energy source that radiates the curing energy beam, the optical fiber that guides the radiated energy beam to a predetermined position, and the cured energy beam at the curing site. And a condensing lens or a diverging lens.

First, when the adhesive 2 and the adherend 1 are bonded with the adhesive 3, the adhesive applying means 8, the applying means operating means 9 for moving the adhesive applying means 8 to an arbitrary position, and the applying means From the first energy ray irradiation means 5a that moves in conjunction with the adhesive application means 8 at the same time that the energy ray curable adhesive 3 is applied to a desired arrangement by the operation control means 10 and the overall control means 11 of the operation control means. The energy beam 6 corresponding to the energy beam-curing adhesive 3 is controlled and ejected by the first energy beam irradiation control means 7a so that the energy beam-curing adhesive 3 is not completely cured and is applied to the adhesive layer. Irradiation is performed so that the amount is partially different (see FIGS. 2A and 2B).
Next, as shown in (c), the adhesive 2 is set, the relative position between the adhesive 2 and the adherend 1 is determined, and the energy beam 6 is transferred from the second energy beam irradiation means 5b to the energy beam curing adhesive 3. Is controlled and ejected by the second energy beam irradiation control means 7b, and the entire energy beam curing adhesive 3 is uniformly irradiated and completely cured. The overall control means 11 controls the operation and timing of the entire apparatus.
In this way, if the energy energy is applied to the energy beam curing adhesive 3 in advance, the amount of curing energy corresponding to the energy energy is accumulated. Time is shortened, and inevitably the arrival timing at which the curing shrinkage force accompanying the curing shrinkage is transmitted to the outside is also accelerated.

FIG. 3 is a diagram showing a first embodiment of the configuration around the coating device, and the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. The configuration shown in FIG. 3 accurately irradiates the energy beam 6 from the energy beam irradiation unit 5a to the energy beam curing adhesive 3 coming out of the nozzle of the adhesive application unit 8 by using the condenser lens 12. Can do. In this way, the energy beam 6 from the first energy beam irradiation unit 5a is condensed by the condenser lens 12 so that the curing energy is given only to the portion (range) discharged from the nozzle of the coating unit 8 (see FIG. 1). If it makes it possible, the adhesive layer can be constructed more accurately without applying excessive curing energy to other parts of the adhesive layer.
FIG. 4 is a diagram showing a second embodiment of the configuration around the coating apparatus, and the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. In the configuration shown in FIG. 4, an infinite number of holes 14 are provided on the side surface of the nozzle of the adhesive application means 8, and the hole portion is covered with a transparent material, so that the energy ray curable adhesive 3 causes the nozzle of the adhesive application means 8 to The energy beam 6 is irradiated while passing. Further, instead of providing the hole 14, the entire nozzle or a part of the nozzle is made of a transparent material, and the energy beam 6 is irradiated while the energy beam curable adhesive 3 passes through the nozzle of the adhesive application means 8. Good.

FIG. 5 is a view showing a third embodiment of the configuration around the coating apparatus together with the AA ′ cross section, and the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. In the configuration shown in FIG. 5, a fiber 13 (shown in the AA ′ cross section) for transmitting the energy beam 6 of the energy beam irradiation unit (not shown) is embedded in the outer peripheral portion of the nozzle of the adhesive application unit 8. The energy beam 6 can be irradiated to the energy beam curing adhesive 3 coming out from the nozzle of the adhesive application means 8.
The energy ray curable adhesive 3 applied in this way is in a state where it is applied to one point of the adhesive layer with predetermined curing energy interposed. Control of the amount of curing energy is determined by energy beam irradiation intensity × irradiation time. Therefore, the amount of curing energy given to the energy beam curable adhesive in advance can be controlled by changing the irradiation intensity of the energy beam, or by changing the application time with the irradiation intensity kept constant.
The gist of the present invention changes the progress (advance) of the curing process step by step with one adhesive, ensures fluidity in the adjacent part (adhesive 3) of the adhesive to be cured, and immediately after bonding (curing) It is possible to prevent misalignment at the time of shrinkage) and misalignment after a change due to reduction of internal residual stress, thereby enabling extremely high precision bonding (joining).

FIGS. 6A to 6C are views showing an adhesion (joining) method according to the present invention, and are explanatory diagrams used for comparison with the conventional adhesion method (FIG. 14) explained in the prior art. First, as shown in (a), when the energy beam curing adhesive 3 is irradiated with curing energy to be cured, the energy beam curing adhesive 3 loses its fluidity, and the curing shrinkage force is transmitted to the outside through the portion in contact with the outside. An adhesive layer is formed by applying and applying the curing energy amount in advance for each portion of the adhesive (energy ray curing adhesive 3) layer so that the amount of curing energy to be transmitted is different. 3a is a portion having the least amount of curing energy, and 3b is a portion having a large amount of curing energy. The adhesive layer has a structure in which the portion 3a having the smallest amount of curing energy is divided so as not to be placed on the adherend 1 and the adhesive 2.
For this reason, as shown in (b), even when the energy line 6 as the curing energy is applied to the entire adhesive layers 3a and 3b and the curing is started, the portion 3a that retains the fluidity during the curing and the portion that causes the curing shrinkage. It is possible to absorb the tensile stress accompanying the shrinkage of the adhesive layer 3b as indicated by the arrow by dividing the fluid into the part 3b and maintaining the fluidity 3a.
More specifically, when the energy ray curable adhesives 3a and 3b are cured, a portion 3b having a quick arrival timing and a portion 3a having a late arrival timing capable of transmitting the curing shrinkage force accompanying the curing shrinkage to the outside are formed. At the time when the part 3b, which has been irradiated with a predetermined amount of energy rays in advance and reaches the arrival timing at which the cure shrinkage force can be transmitted to the outside, has reached the arrival timing, the remaining part of the energy ray curable adhesive 3a still maintains fluidity. It becomes a state.

Here, the arrival timing at which the curing shrinkage force accompanying the curing shrinkage can be transmitted to the outside means the moment when the adherend 1 or the adhesive 2 can be shifted because the fluidity of the energy beam curable adhesive is lost in each of the layers of the adhesive portion. Say.
When the energy ray curable adhesives 3a and 3b are cured, curing shrinkage occurs, and tensile stress is generated. However, when tensile stress is generated in the portion 3b with early arrival timing, the remaining portion 3a causes the portion 3b with early arrival timing. Is formed so as not to hang over the adherend 1 and the adhesive 2.
Therefore, the tensile stress acts only on the energy ray-curable adhesive 3a in the portion that retains the remaining fluidity, and the energy ray-curable adhesive 3a that retains the fluidity compensates (replenishes) the cure shrinkage caused by the cure shrinkage. ) And the tensile stress does not propagate to the adherend 1, and the positional deviation of the adhesive 2 with respect to the adherend 1 does not occur.
In addition, in the portion 3b having a quick arrival timing, the adherend 1 and the adhesive 2 can be cured without being inhibited by curing shrinkage, so that no internal residual stress is generated. Since the internal residual stress is an important factor that causes a change over time, the change over time can be suppressed by suppressing the internal residual stress.
Subsequently, as shown in (c), curing shrinkage occurs and tensile stress is generated even in the process in which the remaining portion 3a having a late arrival timing reaches the arrival timing. The tensile stress generated when the portion 3a having a late arrival timing is cured is not absorbed elsewhere and propagates to the adhesive 2, and as a result, the positional deviation of the adhesive 2 with respect to the adherend 1 occurs, but has already occurred. As the tensile stress is absorbed, the shift width can be kept small.
That is, as shown in FIGS. 14A to 14C, the energy beam curable adhesive 3 that forms the adhesive portion without having a plurality of portions having different arrival timings that can transmit the curing shrinkage force to the outside. In the case of a joint structure that cures evenly, there is nothing that absorbs the tensile stress associated with the curing shrinkage of the energy beam curable adhesive, and therefore, this tensile stress propagates directly from the adherend 21 to the adhesive 22. The curing shrinkage due to the curing of the linear curable adhesive 23 appears as it is as the positional deviation of the adhesive 22 with respect to the adherend 21, and a positional deviation with a large deviation occurs. However, in the joining method according to the present invention, FIG. As shown in 6 (a) to (c), the shrinkage width can be reduced because the shrinkage caused by the curing of the energy ray curable adhesive is absorbed by a part of the adhesive.

FIG. 7 is a graph showing the relationship between energy beam irradiation, polymerization rate, and positional deviation. As shown in the figure, the polymerization rate fluctuates after the elapse of a predetermined time according to the energy beam irradiation, and further, the position shift occurs after the elapse of the predetermined time from the fluctuation of the polymerization rate. As described above, the arrival timing at which the curing shrinkage force accompanying the curing shrinkage can be transmitted to the outside means that the adherend 1 or the adhesive 2 is removed because the fluidity of the energy ray curable adhesive is lost in each of the layers of the adhesive portion. The moment that can be shifted is referred to, and this moment is not necessarily indicated by the polymerization rate or the like, but is closely related to the viscosity of the energy beam curable adhesive 3, the weight of the adherend 1 or the adhesive 2, and the friction coefficient. Is.
FIGS. 8A to 8C are views showing a second embodiment of the bonding (joining) method according to the present invention.
According to the present invention, when the energy beam curable adhesive 3 is irradiated with curing energy and cured, the fluidity of the energy beam curable adhesive 3 is lost, and the curing shrinkage force is externally applied through the portion in contact with the outside. The adhesive layer is formed by applying the irradiation while controlling the amount of curing energy for each part of the adhesive layer (energy ray curable adhesive layer) 3 in advance so that the amount of curing energy transmitted to is different.
At that time, the amount of curing energy of the energy beam curable adhesive 3 is changed stepwise, and fluidity is secured in the adjacent portion (adhesive) of the energy beam curable adhesive 3 to be cured. FIG. 8A shows a state in which the amount of curing energy on the right side of the energy beam curable adhesive 3 is high and the amount of curing energy on the left side is low.
When the adhesive is cured in this state, as shown in FIG. 8B, the internal residual stress accumulates only in the slowest curing portion (the left end in the figure) in the adhesive layer. The amount of internal residual stress possessed by is significantly reduced, and positional deviation after aging is prevented to enable extremely high precision bonding (joining). In addition, by applying an energy ray curable adhesive from a location where the amount of curing energy applied to the adhesive layer is large, it is possible to prevent the transmission of curing energy to other parts of the adhesive layer as much as possible, and to accurately configure the adhesive layer. .

FIGS. 9A to 9C are graphs showing an example of the distribution of the amount of curing energy in the first and second embodiments of the joining method according to the present invention.
The distribution of the amount of curing energy when forming the adhesive layer is mainly to prevent misalignment immediately after bonding (at the time of curing shrinkage). It is preferable that this part is clearly separated. For this purpose, it is preferable to use a joining method as shown in FIGS. 6A to 6C and to have a distribution of the curing energy amount as shown in FIG.
Further, since it is sufficient if the timing of the portion that finally causes the positional deviation is clear, the bonding method as shown in FIGS. 8A to 8C is used, and the curing is performed as shown in FIG. 9B. The energy amount may be provided with an inclination, or the curing energy amount may be set to be divided into a plurality of stages as shown in FIG.
10A to 10C are diagrams showing other examples of the curing energy amount distribution by the joining method according to the present invention. The distribution of the amount of curing energy when forming the adhesive layer is mainly shown in FIGS. 10 (a) to 10 (c), since it is sufficient to minimize the portion that is cured at the same time in order to prevent misalignment after a change with time. As shown, there is a portion with the highest amount of curing energy from the end to the center to the end, and it is preferable to have a distribution so as to continuously decrease from there.
When energy is uniformly irradiated to the bonded portion including the amount of curing energy, the portion having the highest amount of curing energy proceeds the fastest in the curing process, and as the portion having the smaller amount of curing energy proceeds, the progress of the curing process is delayed. In particular, in the case of the curing energy amount distribution shown in FIG. 9B, since it can have both properties of preventing misalignment immediately after bonding and preventing misalignment after aging, it is the most preferable mode.
11 (a) to 11 (c) are a perspective view showing a case where it is applied to build-up bonding (joining), a diagram showing a distribution of the amount of curing energy, and a partial view showing build-up bonding. The bonding method and principle are the same as those in the case of surface bonding shown in FIGS.

12A to 12C are a perspective view showing an adhesion form called filling adhesion (joining), a diagram showing a distribution of the amount of curing energy, and a cross-sectional view showing filling adhesion, respectively.
Filling adhesion as shown in FIGS. 12A to 12C is particularly used when the number of adjustment axes of the relative positional relationship between the adherend 1 and the adherend 2 is large, and as shown in FIG. A pin is provided on one side of the adhesive 2 and a hole is provided on the other side. After adjusting the position, the energy ray curable adhesive 3 is filled and bonded. In this case as well as in the case of filling bonding, it can be considered in the same manner as surface bonding or overlay bonding.
The adherend 1 is composed of an optical base such as a glass plate, a ceramic plate, or a metal plate. The adhesive 2 is composed of optical components such as an optical element such as a lens, a diffraction grating, and a mirror, a light receiving element, a light emitting element, and a solid-state imaging element such as a CCD.

FIG. 13 is a flowchart for explaining the overall control flow of the bonding (joining) method of the present invention. First, the adhesive 2 and the adherend 1 are set at predetermined positions by adjustment (S1). Next, the energy ray curable adhesive 3 is applied while irradiating energy rays based on a predetermined amount of curing energy, and an adhesive layer having a distribution of the amount of curing energy is set (S2). Next, the irradiation condition (integrated light quantity) corresponding to the energy ray curable adhesive 3 is set (S3), and the cured portion is irradiated with energy rays (S4). At this time, the energy beam irradiation light quantity is calculated (S5), and the calculated integrated light quantity is compared with a preset integrated light quantity at which the curing of the energy beam curable adhesive 3 is completed, so that the integrated light quantity is a set value. It is determined whether or not (the integrated light amount at which curing is completed) has been reached (S6). If the integrated light amount has not reached the set value ("N" in step S6), the process returns to step S4, while the integrated light amount is When the set value is reached (“Y” in step S6), the irradiation is terminated.
The determination of the curing of the energy beam curable adhesive 3 is, for example, that the energy beam irradiation intensity is known in advance, so that the integrated light amount can be determined by measuring the irradiation time from the relationship of energy beam irradiation intensity × irradiation time = integrated light amount. This is performed by comparing the integrated light amount with the integrated light amount necessary for curing the energy beam curable adhesive 3.
Further, steps S1 to S2 of the control flow are application processes, and steps S3 to S6 are adjustment / adhesion curing processes, and the tact time can be shortened by working in parallel in two processes. It becomes possible.

As described above, in the bonding method according to the present invention, when the energy beam curable adhesive is cured by irradiating the curing energy, the energy beam curable adhesive loses its fluidity and is cured through a portion in contact with the outside. Since the amount of curing energy until the contraction force can be transmitted to the outside differs, the adhesive layer is formed by applying the irradiation while controlling the amount of curing energy for each part of the adhesive layer in advance. The tensile stress accompanying the shrinkage | hardening shrinkage of another part by a part can be absorbed.
Therefore, internal residual stress accumulates only in the slowest-curing part of the adhesive layer, and the amount of internal residual stress held by the energy beam curable adhesive is overwhelmingly reduced. It is possible to achieve extremely high-precision adhesive bonding.
Moreover, since it can satisfy | fill said structure at the time of apply | coating, it can carry out by an offline process and can shorten process time. Furthermore, irradiation control in the in-line process is not performed, large-scale control and expensive equipment are not required, and it is not necessary to secure an installation place thereby, so that it is easy to replace existing equipment.

It is a figure which shows embodiment of the adhesion | attachment apparatus which enforces the joining method by this invention. (A) is a diagram for explaining irradiation in which the amount of curing energy is partially different, (b) is a diagram showing an adhesive on the adherend, and (c) is an adhesive from the second energy beam irradiation means. It is a figure which shows corresponding energy ray irradiation. It is the schematic which shows 1st Embodiment of a structure around a coating device. It is the schematic which shows 2nd Embodiment of a structure around a coating device. It is the schematic which shows 3rd Embodiment of a structure around a coating device with an A-A 'cross section. (A) is a figure which shows the adhesion (joining) method by this invention, (b) is a figure which shows irradiation of UV light in the adhesion method by this invention, (c) is a figure which shows adhesion hardening by the adhesion method by this invention It is. It is a figure which shows the relationship of energy beam irradiation, a polymerization rate, and position shift with a graph. (A) is a figure which shows 2nd Embodiment of the adhesion | attachment (joining) method by this invention, (b) is a figure which shows irradiation of UV light in the adhesion | attachment method by this invention, (c) is the adhesion | attachment method by this invention It is a figure which shows the adhesion hardening by. (A)-(c) is a figure which shows the example of distribution of hardening energy amount with a graph. (A)-(c) is a figure which shows the other example of distribution of hardening energy amount with a graph. (A) is a perspective view which shows the case where it adapts to build-up adhesion (joining), (b) is a figure which shows distribution of the amount of hardening energy in that case, and (c) is a fragmentary figure which shows build-up adhesion. . (A) is a perspective view which shows the adhesion | attachment form called filling adhesion | attachment (joining), (b) is a figure which shows distribution of the amount of hardening energy in that case, and (c) is sectional drawing which shows filling adhesion | attachment. It is a flowchart explaining the flow of the whole control of the adhesion | attachment (joining) method of this invention. (A)-(c) is a figure which shows the general adhesion | attachment method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhering material 2 Adhesive material 3 Energy-beam curable adhesive (adhesive layer)
3a Part holding fluidity 3b Part causing curing shrinkage 5a First energy beam irradiation means 5b Second energy beam irradiation means 6 Energy beam 7a First energy beam irradiation control means 7b Second energy beam irradiation control means 8 Adhesive application means 9 Application means operation means 10 Operation control means 11 Overall control means

Claims (11)

  In a bonding method of bonding an adhesive to an adherend using an adhesive having energy beam curing characteristics, the energy beam curable adhesive is applied to the adherend or the adhesive while applying energy to the energy beam curable adhesive in advance. By forming the adhesive layer of the energy beam curable adhesive having a predetermined distribution in the amount of curing energy, and in the adhesive layer with the least curing energy applied to the energy beam curable adhesive A bonding method characterized in that a region does not extend over the adherend and the adhesive, and thereafter uniform curing energy is applied to the entire adhesive layer to completely cure it.   The bonding method according to claim 1, wherein curing energy is applied to the energy ray curable adhesive so that the curing energy changes stepwise in the adhesive layer.   3. The energy beam curable adhesive is applied to an adherend or an adhesive while changing the irradiation intensity of the energy beam irradiated to the energy beam curable adhesive discharged from the nozzle in advance. Joining method.   3. The energy beam curable adhesive is applied to an adherend or an adhesive while changing the irradiation time of the energy beam irradiated to the energy beam curable adhesive discharged from the nozzle in advance. Joining method.   5. The bonding method according to claim 1, wherein the energy beam curable adhesive is applied to the adherend or the adhesive from a portion of the energy ray curable adhesive provided with a large amount of curing energy.   In a bonding structure in which an adhesive is bonded to an adherend using an adhesive having energy beam curing characteristics, the energy beam curable adhesive is applied to the adherend or the adhesive while pre-applying curing energy to the energy beam curable adhesive. The adhesive layer of the energy beam curable adhesive having a predetermined distribution in the amount of curing energy is applied to the adhesive layer, and the adhesive layer having the least curing energy applied to the energy beam curable adhesive is formed. A joining structure characterized in that an inner region does not span the adherend and the adhesive.   The joining structure according to claim 6, wherein curing energy is applied to the energy ray curable adhesive so that the curing energy changes stepwise in the adhesive layer.   Adhesive applying means for applying an energy ray curable adhesive, first energy ray irradiating means capable of imparting a predetermined amount of curing energy to the energy ray curable adhesive during application, and the first energy ray irradiating means A first irradiation amount control means for controlling the amount of curing energy, a second energy ray irradiation means for completely curing the energy ray curable adhesive, and a second energy ray irradiation means for controlling the second energy ray irradiation means. And a second dose control means.   9. The bonding apparatus according to claim 8, wherein the first irradiation amount control means changes the irradiation intensity of the energy beam irradiated to the energy beam curable adhesive.   9. The bonding apparatus according to claim 8, wherein the first irradiation amount control means changes the irradiation time of the energy beam applied to the energy beam curable adhesive.   An irradiation range control unit capable of applying curing energy irradiated from the first energy beam irradiation unit only to a desired range of the energy beam curable adhesive discharged by the adhesive application unit. Item 9. The joining apparatus according to Item 8.

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