JP2006157511A - Quartz oscillator - Google Patents

Quartz oscillator Download PDF

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JP2006157511A
JP2006157511A JP2004345516A JP2004345516A JP2006157511A JP 2006157511 A JP2006157511 A JP 2006157511A JP 2004345516 A JP2004345516 A JP 2004345516A JP 2004345516 A JP2004345516 A JP 2004345516A JP 2006157511 A JP2006157511 A JP 2006157511A
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crystal resonator
base substrate
substrate
electrode
crystal
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Hiroki Yasunaga
浩樹 安永
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a quartz oscillator that can be miniaturized, can secure a mounting space, and can be manufactured at lower costs. <P>SOLUTION: The quart oscillator comprises a crystal oscillation element, a base substrate for mounting the crystal oscillation element thereon, and a lid board for performing seal. A step is formed on the outer periphery of the crystal oscillation element, the step being formed with an extraction electrode, and the step is fixed such that it is sandwiched between the base substrate and lid board. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、通信機器や電子機器等の基準信号であるタイミングデバイスとして用いられる水晶振動子に関するものである。   The present invention relates to a crystal resonator used as a timing device which is a reference signal for communication equipment, electronic equipment, and the like.

従来より、携帯用通信機器や電子計算機等の電子機器に水晶振動子が用いられている。かかる従来の水晶振動子としては、例えば図8に示す如く一対の接続パッドが設けられている絶縁基体21の上面に、前記接続パッドに導電性接着材を介して電気的に接続される一対の振動電極を有した水晶振動素子23と、先の水晶振動素子23を囲繞するシールリングとを取り付けるとともに、前記シールリングの上部に金属製の蓋体24をシーム溶接等で接合することにより水晶振動素子23の搭載領域22を気密封止した構造のものが知られている(例えば、特許文献1参照)。   Conventionally, crystal resonators have been used in electronic devices such as portable communication devices and electronic computers. As such a conventional crystal unit, for example, a pair of electrodes electrically connected to the connection pads via a conductive adhesive on the upper surface of an insulating substrate 21 provided with a pair of connection pads as shown in FIG. A quartz crystal vibration element 23 having a vibration electrode and a seal ring surrounding the previous crystal vibration element 23 are attached, and a quartz lid 24 is joined to the upper portion of the seal ring by seam welding or the like. A structure in which the mounting region 22 of the element 23 is hermetically sealed is known (for example, see Patent Document 1).

かかる水晶振動子は、絶縁基体21の下面に設けられる入出力端子を介して水晶振動素子23の振動電極間に外部からの変動電圧が印加されると、水晶振動素子24の特性に応じた所定の周波数で厚みすべり振動を起こすようになっており、その共振周波数に基づいて外部の発振回路で所定周波数の基準信号が発振されて出力される。このような基準信号は、携帯用通信機器等の電子機器におけるクロック信号として利用されることとなる。
特開2001−274649号公報
Such a crystal resonator has a predetermined value corresponding to the characteristics of the crystal resonator element 24 when an external variable voltage is applied between the vibration electrodes of the crystal resonator element 23 via an input / output terminal provided on the lower surface of the insulating base 21. The thickness-shear vibration is caused at the frequency, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.
JP 2001-274649 A

尚、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を本件出願時までに発見するに至らなかった。   In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information described above.

しかしながら、上述した従来の水晶振動子では、このような容器接続用電極において、水晶振動素子を絶縁基体の内部に搭載するときの絶縁基体側の素子接続用電極パッドと電気的導通を取る方法としては、電気的に接続する必要がある絶縁基体接続用電極及び素子接続用電極パッドを導通するために多量の導電性接着剤を、表裏の絶縁気体接続用電極、水晶振動素子側面及び素子接続用電極パッドに塗布することがあるが、水晶振動子の小型化により、内部に水晶振動素子を搭載する空間が著しく狭くなっていることから、多量の導電性接着剤を塗布することが難しくなってきた。   However, in the conventional crystal resonator described above, in such a container connection electrode, as a method of establishing electrical continuity with the element connection electrode pad on the insulating substrate side when the crystal resonator element is mounted inside the insulating substrate. A large amount of conductive adhesive for conducting the insulating substrate connecting electrode and the element connecting electrode pad that need to be electrically connected, the insulating gas connecting electrodes on the front and back, the side surface of the crystal vibrating element, and the element connecting Although it may be applied to the electrode pad, it is difficult to apply a large amount of conductive adhesive because the space for mounting the crystal resonator element is extremely narrow due to the miniaturization of the crystal unit. It was.

水晶振動素子が前記絶縁基体及び蓋体に接触することにより、周波数特性等に影響をもたらす為、絶縁基体及び蓋体に緩衝用の枕部材等を形成する必要がある為、製造工程を複雑にしてしまうという問題があった。   Since the quartz resonator element comes into contact with the insulating base and the lid, the frequency characteristics and the like are affected. Therefore, it is necessary to form a cushioning pillow member on the insulating base and the lid, which complicates the manufacturing process. There was a problem that.

本発明は上記問題点に鑑みに案出されたもので、小型化に対応でき、搭載空間を確保できると共に低コスト化が可能となる水晶振動子を提供することにある。   The present invention has been devised in view of the above problems, and it is an object of the present invention to provide a crystal resonator that can cope with downsizing, can secure a mounting space, and can be reduced in cost.

本発明の水晶振動子は、水晶振動素子と、該水晶振動素子を搭載する為のベース基板と、封止する為のリッド基板とからなる水晶振動子であって、該水晶振動素子の外周辺部分に段差部を形成し、該段差部には、引き出し電極が形成されており、該段差部とベース基板並びにリッド基板とが挟み込むように固定されていることを特徴とするものである。   A crystal resonator according to the present invention is a crystal resonator including a crystal resonator element, a base substrate for mounting the crystal resonator element, and a lid substrate for sealing, the outer periphery of the crystal resonator element A step portion is formed in the portion, an extraction electrode is formed in the step portion, and the step portion, the base substrate, and the lid substrate are fixed so as to be sandwiched therebetween.

また、本発明の水晶振動子は、前記水晶振動素子の段差部が両端側に形成されていることを特徴とするものである。   The crystal resonator according to the present invention is characterized in that the step portion of the crystal resonator element is formed on both ends.

更に本発明の水晶振動子は、前記水晶振動素子に形成されている素子接続用電極が両主面に形成されていることを特徴とするものである。   Furthermore, the crystal resonator of the present invention is characterized in that element connection electrodes formed on the crystal resonator element are formed on both main surfaces.

上記記載の本発明の水晶振動子によれば、水晶振動素子の外周辺部分に段差部を形成し、該段差部には、引き出し電極が形成されており、該段差部とベース基板並びにリッド基板とが挟み込むように接続されていることにより、水晶振動素子の小型化による容器接続用電極の狭小化にも対応できるようになる。また該段差部を形成することにより、水晶振動素子がベース基板並びにリッド基板に接触することがなく、振動を阻害されることが無い為、安定した周波数を供給することが可能となる。   According to the above-described crystal resonator of the present invention, the step portion is formed in the outer peripheral portion of the crystal resonator element, and the extraction electrode is formed in the step portion. The step portion, the base substrate, and the lid substrate , So that the container connecting electrode can be made narrower due to the miniaturization of the crystal resonator element. Further, by forming the stepped portion, the crystal vibrating element does not come into contact with the base substrate and the lid substrate, and vibration is not hindered, so that a stable frequency can be supplied.

また、本発明の水晶振動子によれば、前記水晶振動素子の段差部が両端側に形成されていることにより、水晶振動素子の強度面で安定して接続することが可能となる。   Further, according to the crystal resonator of the present invention, since the step portions of the crystal resonator element are formed on both ends, it is possible to stably connect in terms of the strength of the crystal resonator element.

更に本発明の水晶振動子によれば、前記水晶振動素子に形成されている素子接続用電極が両主面に形成されていることにより、ベース基板並びにリッド基板接続用電極と素子接続用電極パッドとを固着導通する場合においても、導電性接着剤の塗布量を、水晶振動素子段差部のベース基板並びにリッド基板側主面に形成したベース基板並びにリッド基板接続用電極と、このベース基板並びにリッド基板接続用電極と対向する位置に形成できる素子接続用電極パッドとの間の固着導通のみに使用する量に限定できるので、水晶振動素子を使用する水晶振動子の小型化に効果を奏する。   Furthermore, according to the crystal resonator of the present invention, since the element connection electrodes formed on the crystal resonator element are formed on both main surfaces, the base substrate, the lid substrate connection electrode, and the element connection electrode pad are provided. In the case where the conductive adhesive is applied to the base substrate and the lid substrate connecting electrode, the base substrate formed on the main surface of the stepped portion of the crystal vibration element, the lid substrate side main surface, the lid substrate connecting electrode, and the base substrate and the lid. Since it can be limited to the amount used only for the fixed continuity between the element connection electrode pad that can be formed at a position facing the substrate connection electrode, it is effective in miniaturizing a crystal resonator using a crystal resonator element.

以下に図面を参照しながら本発明の実施形態について説明する。なお、各図においての同一の符号は同じ対象を示すものとする。
図1は、本発明の水晶振動子の分解斜視図である。図2は、本発明の水晶振動子の断面図である。図3及び図4は、本発明における水晶振動素子の製造時における、水晶ウエハ状態時の形態を図示した斜視図である。図5乃至図7に図示した本発明の水晶振動子の他の実施例を示した分解斜視図である。
尚、各図において、本説明に必ずしも必要としない部品又は構造体は図示していない。又、各図を明確にするために一部部品又は構造体を誇張して図示しており、部品及び構造体の厚み寸法については特に誇張してある。
Embodiments of the present invention will be described below with reference to the drawings. In addition, the same code | symbol in each figure shall show the same object.
FIG. 1 is an exploded perspective view of a crystal resonator according to the present invention. FIG. 2 is a cross-sectional view of the crystal resonator of the present invention. FIG. 3 and FIG. 4 are perspective views illustrating a form in a crystal wafer state when the crystal resonator element according to the present invention is manufactured. FIG. 8 is an exploded perspective view showing another embodiment of the crystal resonator of the present invention shown in FIGS. 5 to 7.
In each drawing, parts or structures that are not necessarily required for this description are not shown. Further, in order to clarify each drawing, some parts or structures are exaggerated, and the thickness dimensions of the parts and structures are particularly exaggerated.

図1及び図2に示す水晶振動子は大略的に言って、水晶振動素子1の中央部には、所望の周波数で励振する励振電極領域2が形成されている。その外周辺部にこの励振電極領域2が形成されている箇所よりも厚みが厚い段差部3が形成され水晶振動素子1を構成している。
図1の水晶振動素子1は水晶結晶体より所謂ATカットで切り出され平板加工されたものであり、励振電極領域2の振動モードは厚みすべり振動である。その周波数は励振電極領域2が形成されている箇所の厚みに反比例ため、高周波化を図るには励振電極領域2の厚さを薄くする必要がある。
このような形状に加工した水晶振動素子1に、励振電極領域2の表裏主面上に励振電極4と該励振電極4から引き出した引出電極5と、段差部3の外周辺のうち一辺の表裏縁部近傍に形成した前記引出電極5と電気的に接続したベース基板並びにリッド基板接続用電極6とを形成することで水晶振動子を形成している。
In general, the crystal resonator shown in FIGS. 1 and 2 has an excitation electrode region 2 that is excited at a desired frequency at the center of the crystal resonator element 1. A stepped portion 3 having a thickness greater than that of the portion where the excitation electrode region 2 is formed is formed on the outer peripheral portion thereof, thereby constituting the crystal resonator element 1.
The crystal resonator element 1 shown in FIG. 1 is cut out from a crystal body by so-called AT cut and processed into a flat plate, and the vibration mode of the excitation electrode region 2 is thickness shear vibration. Since the frequency is inversely proportional to the thickness of the portion where the excitation electrode region 2 is formed, it is necessary to reduce the thickness of the excitation electrode region 2 in order to increase the frequency.
In the crystal resonator element 1 processed in such a shape, the excitation electrode 4 on the front and back main surfaces of the excitation electrode region 2, the extraction electrode 5 drawn from the excitation electrode 4, and one side of the outer periphery of the step portion 3. A crystal substrate is formed by forming a base substrate electrically connected to the extraction electrode 5 formed in the vicinity of the edge portion and a lid substrate connection electrode 6.

このような形状の水晶振動素子1は図2のように水晶振動子を構成するベース基板7並びにリッド基板8の内部に搭載される。ベース基板7並びにリッド基板8の内部底面上に水晶振動素子1に形成したベース基板並びにリッド基板接続用電極6に対応した位置に形成した素子接続用電極パッド9に、導電性接着剤10を介して固着導通している。この際に導電性接着剤10は、水晶振動素子1のベース基板並びにリッド基板側主面に形成したベース基板並びにリッド基板接続用電極6と素子接続用電極パッド12との間を固着導通できる量のみ塗布されている。   The crystal resonator element 1 having such a shape is mounted inside the base substrate 7 and the lid substrate 8 constituting the crystal resonator as shown in FIG. The base substrate 7 and the lid substrate 8 are connected to the base substrate formed in the crystal resonator element 1 on the inner bottom surface of the base substrate 7 and the element connection electrode pad 9 formed at a position corresponding to the lid substrate connection electrode 6 through the conductive adhesive 10. And is firmly connected. At this time, the conductive adhesive 10 is capable of fixing and conducting between the base substrate of the crystal resonator element 1, the base substrate formed on the main surface of the lid substrate, and the lid substrate connecting electrode 6 and the element connecting electrode pad 12. Only applied.

ベース基板7並びにリッド基板8は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料を用いて制作される多層基板である。セラミック材料から成る基板は、例えば、セラミック材料粉末に適当な有機溶剤等を添加・混合して得たセラミックグリーンシートの表面等に導電膜となる導体ペーストを所定パターンに印刷・塗布するとともに、これを複数枚積層してプレス成形した後、高温で焼成することによって製作される。   The base substrate 7 and the lid substrate 8 are multilayer substrates manufactured using a ceramic material such as glass-ceramic or alumina ceramic. A substrate made of a ceramic material is formed by, for example, printing and applying a conductive paste serving as a conductive film in a predetermined pattern on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to the ceramic material powder. A plurality of sheets are laminated and press-molded, and then fired at a high temperature.

ベース基板並びにリッド基板接続用電極6は、ベース基板7並びにリッド基板8上に被着した一対の導電膜であり、銀、銅、タングステン等の金属材料が用いて形成されている。また、必要に応じてニッケルメッキや金メッキが表面に被着される。尚、ベース基板7並びにリッド基板8上には、ベース基板並びにリッド基板接続用電極6の他にグランド電極が、同じ金属材料で形成されている。   The base substrate and the lid substrate connecting electrode 6 are a pair of conductive films deposited on the base substrate 7 and the lid substrate 8, and are formed using a metal material such as silver, copper, or tungsten. In addition, nickel plating or gold plating is applied to the surface as necessary. In addition to the base substrate and the lid substrate connecting electrode 6, a ground electrode is formed on the base substrate 7 and the lid substrate 8 with the same metal material.

導電性接着剤10は、例えばポリイミド系樹脂、エポキシ系樹脂、シリコーン系樹脂を主成分として、Agなどの導電性材料が均一に分散しているものである。導電性接着剤10は、ベース基板7並びにリッド基板8と水晶振動素子1の固定端部とを機械的に接合するともに、同時にベース基板7並びにリッド基板8のベース基板並びにリッド基板接続用電極6と、水晶振動素子1の素子接続用電極9とを夫々電気的に接続するものである。   The conductive adhesive 10 is made of, for example, a polyimide resin, an epoxy resin, or a silicone resin as a main component, and a conductive material such as Ag is uniformly dispersed. The conductive adhesive 10 mechanically bonds the base substrate 7 and the lid substrate 8 to the fixed end portion of the crystal resonator element 1, and at the same time, the base substrate 7, the base substrate of the lid substrate 8, and the electrode 6 for connecting the lid substrate. And the element connection electrode 9 of the crystal resonator element 1 are electrically connected to each other.

そして、上述したベース基板7とリッド基板8との間には、水晶振動素子1の素子接続用電極9と外部端子電極11を電気的に接続する複数個の導電性接合材12が、これら導電性接合材12の外方には環状の封止部材13が介在されており、かかる封止部材13はベース基板7とリッド基板8との間に設けられる空所、具体的には、リッド基板8の下面やベース基板の上面によって囲まれた水晶振動素子1の収納領域を囲繞することにより気密封止している。   Between the base substrate 7 and the lid substrate 8 described above, a plurality of conductive bonding materials 12 that electrically connect the element connection electrodes 9 and the external terminal electrodes 11 of the crystal resonator element 1 are electrically conductive. An annular sealing member 13 is interposed on the outer side of the conductive bonding material 12, and the sealing member 13 is a space provided between the base substrate 7 and the lid substrate 8, specifically, a lid substrate. 8 is hermetically sealed by surrounding the storage area of the crystal resonator element 1 surrounded by the lower surface of 8 and the upper surface of the base substrate.

また上述した導電性接合材12や封止部材13としては、例えば、AuやAu−Sn合金、半田等の金属から成るロウ材が好適に用いられ、封止部材13はベース基板7並びにリッド基板8の配線導体14等を介してベース基板8の外部端子電極21と電気的に接続されている。   Further, as the conductive bonding material 12 and the sealing member 13 described above, for example, a brazing material made of a metal such as Au, Au—Sn alloy, or solder is preferably used, and the sealing member 13 includes the base substrate 7 and the lid substrate. 8 is electrically connected to the external terminal electrode 21 of the base substrate 8 through the wiring conductor 14 and the like.

上述の水晶振動素子の実装構造は、以下のような製造方法によって得られる。
まず、最初に水晶振動素子1及びベース基板並びにリッド基板接続用電極6を有したベース基板7並びにリッド基板8を用意する。次に、ベース基板並びにリッド基板接続用電極6上に導電性接着剤10となる導電性樹脂ペーストを塗布する。導電性接着剤10は、例えばポリイミド系樹脂を主成分とし、Ag粒子を均質に分散されている導電性樹脂ペーストを用い、ベース基板7並びにリッド基板8に被着したベース基板並びにリッド基板接続用電極6上に塗布される。次に、導電性接着剤10となる導電性樹脂ペースト上に、水晶振動素子1の素子接続用電極9が位置するように、ベース基板7並びにリッド基板8上に水晶振動素子1を載置する。そして、水晶振動素子1が載置された状態で、導電性樹脂ペーストを約200℃の加熱処理により完全に加熱硬化する。これにより、導電性ペーストは導電性接着剤10となり、水晶振動素子1がベース基板7並びにリッド基板8上に、一辺側でのみ保持するようにして実装されることとなる。
The mounting structure of the above-described quartz resonator element can be obtained by the following manufacturing method.
First, the base substrate 7 and the lid substrate 8 having the crystal resonator element 1 and the base substrate and the lid substrate connecting electrode 6 are prepared. Next, a conductive resin paste to be the conductive adhesive 10 is applied on the base substrate and the lid substrate connecting electrode 6. For the conductive adhesive 10, for example, a conductive resin paste mainly composed of a polyimide resin and in which Ag particles are homogeneously dispersed is used. The base substrate 7 and the lid substrate 8 are attached to the base substrate 7 and the lid substrate 8. It is applied on the electrode 6. Next, the crystal resonator element 1 is placed on the base substrate 7 and the lid substrate 8 so that the element connection electrode 9 of the crystal resonator element 1 is positioned on the conductive resin paste that becomes the conductive adhesive 10. . Then, with the crystal resonator element 1 placed, the conductive resin paste is completely heat-cured by a heat treatment at about 200 ° C. As a result, the conductive paste becomes the conductive adhesive 10, and the crystal resonator element 1 is mounted on the base substrate 7 and the lid substrate 8 so as to be held only on one side.

次に上記のような水晶振動素子1を製造する方法としては、まず平板形状の水晶ウエハの両主面側から、厚みすべり振動モードで所望する周波数を励振する厚みにまで厚み加工した矩形状の複数個の励振電極領域2を、フォトリソグラフィ法及びエッチングにより、励振電極領域2の周囲に水晶ウエハの厚みを厚さとする外周形状を矩形状とする段差部3が形成され、且つ個々の励振電極領域2の外周部に形成した段差部3のうち、ベース基板並びにリッド基板接続用電極6を形成し、段差部3と一体で形成した捨代領域部を形成する位置にマトリックス状に複数個整列形成する。   Next, as a method of manufacturing the crystal resonator element 1 as described above, a rectangular shape is first processed to a thickness that excites a desired frequency in the thickness-shear vibration mode from both main surface sides of a flat plate-shaped crystal wafer. A plurality of excitation electrode regions 2 are formed by photolithography and etching to form a stepped portion 3 having a rectangular outer peripheral shape having a thickness of the quartz wafer around the excitation electrode region 2 and individual excitation electrodes. Among the stepped portions 3 formed on the outer peripheral portion of the region 2, the base substrate and the lid substrate connecting electrode 6 are formed, and a plurality of rows are arranged in a matrix at a position where the abandoned region portion formed integrally with the stepped portion 3 is formed. Form.

次に、上記のような外形加工を施した水晶ウエハの個々の励振電極領域2の表裏主面上に励振電極4と、励振電極4から励振電極領域2の外周部に形成した段差部3のうち外周の一つの辺縁部まで延設した引出電極5と、引出電極5と電気的に接続したベース基板並びにリッド基板接続用電極6に、水晶ウエハ両主面に対向するように形成されている各々のベース基板並びにリッド基板接続用電極6同士を電気的に接続する電極間接続用電極8を蒸着法により形成する。このように各種電極を形成した後の形態を図3及び図4に示す。   Next, the excitation electrode 4 is formed on the front and back main surfaces of the individual excitation electrode regions 2 of the crystal wafer subjected to the outer shape processing as described above, and the step portion 3 formed from the excitation electrode 4 to the outer peripheral portion of the excitation electrode region 2. The lead electrode 5 extending to one edge of the outer periphery, the base substrate electrically connected to the lead electrode 5 and the electrode 6 for connecting the lid substrate are formed so as to face both main surfaces of the crystal wafer. An interelectrode connecting electrode 8 for electrically connecting the base substrate and the lid substrate connecting electrodes 6 is formed by vapor deposition. The form after forming the various electrodes in this way is shown in FIGS.

次に、水晶ウエハを励振電極領域2の周囲に所定の領域及び該水晶ウエハの厚みの段差部を形成するように所定の切断線により切断することにより、各個片加工した複数個の水晶振動素子1を形成する。   Next, the crystal wafer is cut by a predetermined cutting line so as to form a predetermined region around the excitation electrode region 2 and a step portion having a thickness of the crystal wafer, so that a plurality of crystal resonator elements each processed individually 1 is formed.

尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。   In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

上述した実施形態において、図5に示すように、段差部に全面に素子接続用電極が形成されていることにより、接続精度並びに接続強度が向上することが可能となる。   In the embodiment described above, as shown in FIG. 5, the connection accuracy and the connection strength can be improved by forming the element connection electrode on the entire surface of the stepped portion.

また上述した実施形態において、図6に示すように、一方の段差部に導電性接着剤10にて接続し、他方の段差部には、絶縁性接着剤にて、固定強度を向上させることが可能となる。   Moreover, in embodiment mentioned above, as shown in FIG. 6, it is connected to the one level | step-difference part with the conductive adhesive 10, and it can improve fixed strength with an insulating adhesive to the other level | step difference part. It becomes possible.

更に上述した実施形態において、図7に示すように、前記水晶振動素子の段差部が両端側に形成されていることにより、水晶振動素子の強度面で安定して接続することが可能となる。   Further, in the above-described embodiment, as shown in FIG. 7, since the step portions of the crystal resonator element are formed at both ends, it is possible to stably connect in terms of strength of the crystal resonator element.

また更に上述した実施形態において、リッド基板8の上面から側面にかけてシールド層を被着・形成するとともに、該シールド層の一部を封止部材13に被着させておけば、外部からのノイズをより良好に遮蔽することができ、水晶振動子の動作信頼性を高く維持することが可能となる。   Furthermore, in the above-described embodiment, when a shield layer is deposited and formed from the upper surface to the side surface of the lid substrate 8, and a part of the shield layer is deposited on the sealing member 13, noise from the outside is reduced. It is possible to shield better, and it is possible to maintain high operation reliability of the crystal resonator.

更にまた上述した実施形態においては、水晶振動素子を用いた表面実装型の水晶振動子を例にとって説明したが、これに代えて、弾性表面波(SAW)フィルタ等の他の圧電振動素子を用いる場合にも本発明は適用可能である。   Furthermore, in the above-described embodiments, the surface-mount type crystal resonator using the crystal resonator element has been described as an example, but other piezoelectric resonator elements such as a surface acoustic wave (SAW) filter are used instead. Even in this case, the present invention is applicable.

また更に上述した実施形態においては、導電性接合材12の外側に封止部材13が介在されているが、封止部材13の外側に導電性接合材12を設ける場合でも本発明は適用可能である。   Furthermore, in the embodiment described above, the sealing member 13 is interposed outside the conductive bonding material 12, but the present invention can be applied even when the conductive bonding material 12 is provided outside the sealing member 13. is there.

図1は、本発明の水晶振動子の分解斜視図である。FIG. 1 is an exploded perspective view of a crystal resonator according to the present invention. 図2は、図1記載の水晶振動子の断面図である。FIG. 2 is a cross-sectional view of the crystal resonator shown in FIG. 図3は、本発明における水晶振動素子製造時における、水晶ウエハに個々の水晶振動素子を作成した形態を図示する外観斜視図である。FIG. 3 is an external perspective view illustrating a form in which individual crystal resonator elements are formed on a crystal wafer when the crystal resonator element is manufactured according to the present invention. 図4は、本発明における水晶振動素子製造時における、水晶ウエハに個々の水晶振動素子を作成した形態を図示する外観斜視図である。FIG. 4 is an external perspective view illustrating a form in which individual crystal resonator elements are formed on a crystal wafer when manufacturing the crystal resonator elements according to the present invention. 図5は、本発明の水晶振動子の他の実施形態を示す分解斜視図である。FIG. 5 is an exploded perspective view showing another embodiment of the crystal resonator of the present invention. 図6は、本発明の水晶振動子の他の実施形態を示す分解斜視図である。FIG. 6 is an exploded perspective view showing another embodiment of the crystal resonator of the present invention. 図7は、本発明の水晶振動子の他の実施形態を示す分解斜視図である。FIG. 7 is an exploded perspective view showing another embodiment of the crystal resonator of the present invention. 図8は、従来の水晶振動子の断面図である。FIG. 8 is a cross-sectional view of a conventional crystal resonator.

符号の説明Explanation of symbols

1・・・水晶振動素子
2・・・励振電極領域
3・・・段差部
4・・・励振電極
5・・・引出電極
6・・・ベース基板並びにリッド基板接続用電極
7・・・ベース基板
8・・・リッド基板
9・・・素子接続用電極
10・・・導電性接着剤
11・・・外部端子電極
12・・・導電性接合材
13・・・封止部材
14・・・配線導体
DESCRIPTION OF SYMBOLS 1 ... Quartz crystal vibration element 2 ... Excitation electrode area | region 3 ... Level difference part 4 ... Excitation electrode 5 ... Extraction electrode 6 ... Electrode for base substrate and lid substrate connection 7 ... Base substrate DESCRIPTION OF SYMBOLS 8 ... Lid board | substrate 9 ... Element connection electrode 10 ... Conductive adhesive 11 ... External terminal electrode 12 ... Conductive joining material 13 ... Sealing member 14 ... Wiring conductor

Claims (2)

水晶振動素子と、該水晶振動素子を搭載する為のベース基板と、封止する為のリッド基板とからなる水晶振動子であって、
該水晶振動素子の外周辺部分に段差部を形成し、該段差部には、引き出し電極が形成されており、該段差部とベース基板並びにリッド基板とが挟み込むように固定されていることを特徴とする水晶振動子。
A crystal resonator comprising a crystal resonator element, a base substrate for mounting the crystal resonator element, and a lid substrate for sealing,
A step portion is formed in an outer peripheral portion of the crystal resonator element, and an extraction electrode is formed in the step portion, and the step portion, the base substrate, and the lid substrate are sandwiched and fixed. A crystal resonator.
前記水晶振動素子に形成されている素子接続用電極が両主面に形成されていることを特徴とする請求項1記載の水晶振動子。
The crystal resonator according to claim 1, wherein element connection electrodes formed on the crystal resonator element are formed on both main surfaces.
JP2004345516A 2004-11-30 2004-11-30 Quartz oscillator Pending JP2006157511A (en)

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US8963402B2 (en) 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device

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JP2012119856A (en) * 2010-11-30 2012-06-21 Seiko Epson Corp Piezoelectric vibrating piece, piezoelectric vibrator, and electronic device
US8963402B2 (en) 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device

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