JP2006154223A - Method for manufacturing liquid crystal panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal panel, with which the productivity is further improved. <P>SOLUTION: The liquid crystal panels are arranged in close contact with one another on a mother substrate for the purpose of increasing the number of liquid crystal panels to be acquired, and as a result, a tip portion of an injection port 18 of a sealing material 17 protrudes to the inside of an adjacent liquid crystal panel. A layer 20 with low strength of adhesion to the sealing material 17 is exposed and formed in advance only on the tip portion of the injection port 18 protruding from an adjacent liquid crystal panel in the mother substrate surface of the sealing material 17 application portion. Thereby the sealing material 17 is easily released from the substrate surface, and any damage of the substrate surface due to the release of the sealing material 17 in cutting off the panels is suppressed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a liquid crystal panel manufacturing method in which a plurality of liquid crystal panels are integrally formed on a mother substrate, and the mother substrate is divided into panels to manufacture a liquid crystal panel.

  The liquid crystal panel is formed by enclosing a liquid crystal material between a pair of substrates each formed of a transmissive material such as glass. Conventionally, such a liquid crystal panel is manufactured in the following manner.

  First, a pixel electrode, a thin film transistor (TFT), a color filter, a wiring, a terminal, a drive circuit, and the like are formed on a substrate by a photo-etching technique (PEP) or the like (array process). In the case of a color liquid crystal panel using TFTs, in this array step, a pair of an array substrate having a thin film transistor array formed on the image display portion and a counter substrate (color filter substrate) having a color filter array formed thereon is formed. In addition, a polyimide film is applied to the image display portions of both substrates, and the applied polyimide film is rubbed to form an alignment film that aligns the orientation of the liquid crystal material.

  Next, as shown in FIG. 11, on the surface of one of the substrates to be bonded (substrate 51), an injection port 54 that surrounds the image display unit 56 and injects a liquid crystal material is formed at the outer edge of the liquid crystal panel. The sealing agent 52 is applied so as to be formed in an opening, and the other substrate 53 is placed thereon and the substrates 51 and 53 are bonded together. Thereafter, a liquid crystal material is injected from the formed injection port 54, and the opening 54 is filled with a sealing agent to seal the injection port 54. And finally, a polarizing plate is stuck on the front and back of the bonded substrates 51 and 53 to produce a liquid crystal panel.

  In general, a small-sized liquid crystal panel is manufactured by integrally forming a large number of liquid crystal panels on one large substrate (mother substrate) and dividing the mother substrate into each liquid crystal panel. At this time, the liquid crystal panel can be removed from the mother substrate by placing each liquid crystal panel on the mother substrate with a gap between the respective liquid crystal panels, or as shown in FIG. There is a case where it is arranged on the mother board 55 without a gap. When the gap between the liquid crystal panels 50 is eliminated as in the latter case, the number of liquid crystal panels to be taken from the mother substrate 55 can be increased compared to the former, so that the liquid crystal panel 50 can be manufactured more efficiently. Can do.

  In order to divide the mother substrate 55 at the time of panel separation, cooling with water or the like is not required at the time of processing, and therefore a processing method called scribe and impact is widely used. Scribe and impact is a processing method in which a mother substrate is divided by making a straight scratch on the substrate surface along the dividing plane and cleaving the substrate from the scratch by applying an impact from the back surface of the substrate.

  By the way, in the liquid crystal panel 50 as described above, in order to prevent the liquid crystal material from leaking, it is necessary to reliably apply the sealing agent 52 at the inlet 54 portion to the outer edge of the liquid crystal panel 50. However, it is technically difficult to apply the sealant 52 with high accuracy so that the cross section of the mother substrate 55 at the time of panel separation and the front end surface of the injection port 54 can be made uniform. Therefore, normally, the sealing agent 52 is applied so that the tip portion of the injection port 54 slightly protrudes outside the liquid crystal panel 50, and the protruding tip portion is divided together with the mother substrate 55. In such a case, even if there is some variation in the application position of the sealing agent 52, it is possible to uniformly align the cross section of the mother substrate 55 and the distal end surface of the injection port 54.

  On the other hand, when the liquid crystal panel 50 is arranged on the mother substrate 55 without any gap as described above, as shown in FIG. 12, the sealant 52 at the tip end of the injection port 54 applied from the liquid crystal panel 50 is applied to the mother substrate 55. It will protrude to the formation position of the liquid crystal panel 50 adjacent to the substrate 55.

  When the panel is separated, the unnecessary sealant 52 at the tip of the inlet 54 may be peeled off from the substrates 51 and 53. However, the sealing agent 52 is bonded with a high strength so as not to peel off from the surfaces of the substrates 51 and 53 for the purpose of sealing the liquid crystal material, and it can be forcibly peeled off as shown in FIG. In this case, the substrate 51 may be chipped or broken as shown in FIG. Moreover, even if it does not lead to chipping or cracking, it becomes a factor of reducing the strength of the liquid crystal panel 50. For this reason, it is difficult for the conventional manufacturing method to increase both the number of liquid crystal panels taken from the mother board and the reduction of defective products due to chipping, cracking defects, and insufficient strength, improving liquid crystal panel productivity. Naturally had its limits.

  Even when the liquid crystal panels 50 are arranged on the mother substrate 55 at intervals, if the intervals are not sufficiently large, the tip of the injection port 54 is formed at the position where the liquid crystal panel 50 adjacent to the mother substrate 55 is formed. May protrude. In such a case, even if the liquid crystal panel 50 is arranged at a distance from the mother substrate 55, the above problem can occur in the same manner.

  The present invention has been made in view of such a situation, and a problem to be solved is to provide a method of manufacturing a liquid crystal panel capable of further improving productivity.

Hereinafter, means for solving the above-described problems and the effects thereof will be described.
According to the first aspect of the present invention, the liquid crystal material injection port is formed so as to be opened at the outer edge of the panel through a process of separating each liquid crystal panel from a pair of mother substrates in which a plurality of liquid crystal panels are integrally formed. A method of manufacturing a liquid crystal panel comprising a pair of substrates bonded via a sealing agent, wherein the sealing agent is disposed so that a tip portion of the injection port protrudes at a position where a liquid crystal panel adjacent to the mother substrate is formed. And, prior to the application of the sealing agent, on the sealing agent application surface of the mother substrate at the tip of the inlet, compared to the material constituting the other sealing agent application surface of the mother substrate And a step of exposing and forming a layer made of a material having low adhesive strength to the sealant.

  In the above method, prior to the application of the sealing agent, only the tip portion of the inlet that protrudes into the adjacent liquid crystal panel on the sealing agent application surface of the mother substrate is applied from a material having low adhesive strength to the sealing agent. The layer to be exposed is formed. By providing such a layer, an unnecessary sealant at the tip of the injection port can be removed from the substrate relatively easily. Therefore, as a result of increasing the number of liquid crystal panels taken from the mother substrate, even when the sealant at the tip of the injection port protrudes to the adjacent liquid crystal panel, the unnecessary sealant is peeled off from the substrate. The occurrence of defective products due to chipping, cracking defects and insufficient strength can be kept low.

  According to a second aspect of the present invention, the liquid crystal material injection port is formed so as to open to the outer edge of the panel through a process of separating each liquid crystal panel from a pair of mother substrates in which a plurality of liquid crystal panels are integrally formed. A method of manufacturing a liquid crystal panel comprising a pair of substrates bonded together through a sealed sealant, wherein the seal portion is formed so that a tip portion of the injection port protrudes at a position where a liquid crystal panel adjacent to the mother substrate is formed. Prior to the application of the sealing agent and the application of the sealing agent, among the sealing agent application surface of the mother substrate, only the sealing agent application surface at the tip portion of the inlet has an adhesive strength to the layer immediately below. And a step of coating a layer having a lower adhesive strength than the sealing agent.

  In the above method, the adhesive strength to the layer immediately below itself is applied only to the tip portion of the injection port that protrudes into the adjacent liquid crystal panel in the surface of the sealant application surface of the mother substrate prior to the application of the sealant. A layer having a lower adhesion strength to the sealing agent is formed. If such a layer is provided, when the unnecessary sealant at the tip of the inlet is peeled off from the substrate, the layer is peeled off from the layer immediately below, thereby protecting the substrate surface from damage. Therefore, as a result of increasing the number of liquid crystal panels taken from the mother substrate, even when the sealant at the tip of the injection port protrudes to the adjacent liquid crystal panel, the unnecessary sealant is peeled off from the substrate. The occurrence of defective products due to chipping, cracking defects and insufficient strength can be kept low.

  Furthermore, in the invention described in claim 3, the layer is any one of an insulating film, an electrode, a wiring, a gate, a channel, a transparent protective film, an alignment film, a transparent conductive film and a light shielding film formed on the substrate of the liquid crystal panel. The gist is that it is made of the same material as that of the other.

  In the above method, the above-mentioned layer can be formed through the same process as that normally used in the manufacture of liquid crystal panels, so that an increase in the manufacturing process and manufacturing equipment and, in turn, an increase in manufacturing cost can be suppressed. Can do.

  According to the present invention, it is possible to achieve both the increase in the number of liquid crystal panels taken from the mother substrate and the reduction of defective products due to chipping, cracking defects, and insufficient strength, thereby further improving productivity. become.

  Hereinafter, an embodiment embodying a method for manufacturing a liquid crystal panel according to the present invention will be described in detail with reference to FIGS. Here, the case where the present invention is applied to the manufacture of a color liquid crystal panel including a thin film transistor (TFT) will be described as an example.

  The manufacture of the liquid crystal panel in the present embodiment basically includes (A) an array process, (B) an alignment film formation process, (C) a sealing agent application and a mother substrate bonding process, and (D) a liquid crystal panel. (E) Liquid crystal material injection and injection port sealing step, and (F) Polarizing plate attaching step.

Hereinafter, the details of each of the above steps relating to the manufacture of the liquid crystal panel in the present embodiment will be described.
(A) Array process In the array process, the surface of each of a pair of mother substrates corresponding to the two glass substrates constituting the color liquid crystal panel provided with the TFT, that is, the array substrate and the counter substrate (color filter substrate), respectively. The necessary structure is arranged using the aforementioned PEP or printing technology. For example, on the mother substrate on the array substrate side, a thin film transistor array, its drive circuit, terminals for external connection, wiring for connecting them, and the like are arranged. On the other hand, a color filter array, a counter electrode, wiring, and the like are arranged on the mother substrate on the counter substrate side.

  FIG. 1 shows a planar structure of sub-pixels which are basic structural units of a thin film transistor array provided in an image display portion of each liquid crystal panel of a mother substrate for an array substrate in this array process. Each pixel of the image display unit includes three sub pixels corresponding to three colors of red (R), green (G), and blue (B). Each sub pixel includes a thin film transistor, a sub pixel electrode, and A storage capacitor is provided. The thin film transistor has a gate connected to a gate line extending in the screen scanning line direction, a drain connected to a drain line extending in the screen vertical direction, and a source connected to the sub-pixel electrode. On the other hand, a color filter is provided at a position facing the sub-pixel electrode in the image display portion of each liquid crystal panel of the mother substrate for the counter substrate.

  FIG. 2 shows an enlarged cross-sectional structure of the image display portion of the liquid crystal panel after completion. As shown in the figure, the liquid crystal panel is formed by bonding an array substrate 10 and a counter substrate 11 together with a sealant around the substrates via a liquid crystal material layer. Various films are formed in layers on the glass substrates constituting the array substrate 10 and the counter substrate 11 by using the PEP or the printing technique in the array step.

  Impurities such as sodium ions (Na (+)) contained in the glass substrate are prevented from entering the polysilicon (P-Si) film formed on the glass substrate surface of the array substrate 10. As the buffer film, an insulating film made of a laminated film of silicon oxide (SiO2) and silicon nitride (SiN) is formed. Further, the array substrate 10 has a P-Si film constituting a channel of the thin film transistor, an insulating film having a two-layer structure of SiO2 and SiN, and a molybdenum constituting the gate of the thin film transistor in order from the buffer film toward the counter substrate 11 side. Mo) film is formed, and an insulating film having a two-layer structure of SiO2 and SiN is formed thereon. Further thereon, an aluminum-neodymium alloy (Al-Nd) film constituting the drain and source of the thin film transistor, a transparent protective film (overcoat) made of a photosensitive acrylic resin, and indium oxide constituting the subpixel electrode- A transparent conductive film made of tin alloy (ITO) or indium oxide-zinc alloy (IZO) is sequentially formed. Further, a molybdenum (Mo) film is formed at the contact point between the source / drain and the channel and at the contact point between the source / drain and the sub-pixel electrode.

  The counter substrate 11 of the liquid crystal panel has a light shielding film made of chromium, a color filter, a transparent protective film (overcoat) made of a photosensitive acrylic resin, and a counter electrode in order from the glass substrate toward the array substrate 10. A transparent conductive film made of ITO or IZO is formed.

  An alignment film made of polyimide (PI) is disposed on the surface of the array substrate 10 and the counter substrate 11 in contact with the liquid crystal, and a polarizing plate is disposed on the outer surface of these substrates. Provided in the process. In addition, the liquid crystal material between both the substrates is sealed in the steps after the array step.

  FIG. 3 shows a partial planar structure of the mother substrate 12 on the array substrate 10 side after the array process. Note that a region A surrounded by a thick broken line in the figure corresponds to one liquid crystal panel. As shown in the figure, a large number of liquid crystal panels are arranged on the mother substrate 12 without gaps. In the array process, a thin film transistor array is disposed on the image display unit 14 of each liquid crystal panel of the mother substrate 12 on the array substrate 10 side, and an external connection terminal 16 is disposed on the end of each liquid crystal panel. .

  On the other hand, FIG. 4 shows a partial planar structure of the mother substrate 13 on the counter substrate 11 side after the array process. Also in the figure, a region A corresponding to one liquid crystal panel is indicated by a thick broken line. Similarly to the mother substrate 12 on the array substrate 10 side, a large number of liquid crystal panels are arranged on the mother substrate 13 on the counter substrate 11 side without any gaps. In the image display portion 15 of each liquid crystal panel of the mother substrate 13, a color filter array is arranged in the array process.

  In FIGS. 3 and 4, the application position of the sealing agent 17 applied in the subsequent process is also shown by a two-dot chain line. The sealant 17 is applied so as to surround the image display portions 14 and 15 and to form an injection port 18 for injecting a liquid crystal material that is open at the outer edge of the panel. Note that the sealant 17 is applied so that the tip of the injection port 18 slightly protrudes to the formation position of the liquid crystal panel adjacent to the mother substrates 12 and 13 so that an error in the application position is allowed to some extent. ing. Incidentally, in this embodiment, an epoxy resin is used as the sealing agent 17.

  In this embodiment, in such an array process, the sealing agent 17 on the surface of the mother substrate 13 on the tip of the inlet 18 is compared with the material constituting the other sealing agent application surface of the mother substrate 13. The layer 20 made of a material having low adhesive strength with respect to is exposed. That is, in this embodiment, the sealant 17 needs to be firmly bonded for sealing the liquid crystal material, and the tip of the injection port 18 that has such a high adhesive strength that causes the above-described problems is sealed. The layer 20 is formed on the substrate surface with materials having different adhesive strengths to the agent 17. Here, the layer 20 is made of a photosensitive acrylic resin that forms a transparent protective film.

  The formation of the photosensitive acrylic resin layer 20 on the surface of the mother substrate 13 at the tip of the injection port 18 is performed as follows. A transparent protective film made of a photosensitive acrylic resin for protecting the color filter array disposed on the image display unit 15 of the counter substrate 11 is formed so as to cover it. Actually, the transparent protective film is once provided on the entire surface of the mother substrate 13. However, this transparent protective film does not have sufficient adhesive strength with respect to the sealing agent 17, and if the sealing agent 17 is applied on the transparent protective film, the transparent protective film may peel off and impair the sealing performance of the liquid crystal material. For this reason, the transparent protective film once coated is removed from the periphery of the image display unit 15 to which the sealant 17 is applied, and the light-shielding film made of chromium having high adhesion strength to the sealant 17 is provided below the transparent protective film. Is exposed to the substrate surface. At this time, the transparent protective film is intentionally left without being removed at the tip of the inlet 18. As a result, as shown in FIGS. 5 (A) and 5 (B), the layers 19 and 20 of the transparent protective film are provided around the image display unit 15 (layer 19) and the periphery of the injection port 18 (layer 20). It will be provided only to.

(B) Alignment Film Forming Step In this step, polyimide for aligning liquid crystal molecules on the surfaces of the image display portions 14 and 15 of the liquid crystal panels of the mother substrates 12 and 13 subjected to the array step ( An operation of forming an alignment film made of PI) is performed. Specifically, a polyimide film is first formed on the surfaces of the image display units 14 and 15 by using a printing technique, and then the surface is rubbed by a rotating drum wound with a cloth to form minute grooves on the film surface. An alignment film is formed by performing a rubbing treatment.

(C) Application of sealing agent and bonding step of mother substrate In this step, the above-described position of either the mother substrate 12 on the array substrate 10 side or the mother substrate 13 on the counter substrate 11 side where the alignment film is formed The sealing agent 17 is applied to the substrate, and the other mother substrate is laminated and bonded to the other mother substrate.

  FIG. 6 shows a partial planar structure of the mother substrates 12 and 13 bonded together as seen from the mother substrate 12 side. FIG. 7 shows a cross-sectional structure taken along the line VII-VII in FIG. 6, and FIG. 8 shows an enlarged cross-sectional structure near the tip of the injection port 18. As shown in these drawings, in the mother substrate 13, the sealing agent 17 at the tip of the inlet 18 that is originally unnecessary is formed on the transparent protective film layer 20 made of a photosensitive acrylic resin having low adhesion strength to the sealing agent 17. Will be applied.

(D) Separating process of liquid crystal panel In this process, the bonded mother substrates 12 and 13 are divided by using the scribe and impact described above, and an operation of separating each liquid crystal panel is performed. At the same time, the end portion of the counter substrate 11 on the terminal 16 side is also separated, and the terminal 16 is exposed by removing the separated end portion. 7 and 8, the portion R of each mother substrate 12, 13 is removed without remaining in any liquid crystal panel in this step.

(E) Liquid crystal material injection and injection port sealing step In this step, the liquid crystal material is injected from the injection port 18 into the separated liquid crystal panel, and then the injection port 18 is sealed. .

(F) Attaching process of polarizing plate In this process, an operation of attaching a polarizing plate to the front and back of the liquid crystal panel in which the liquid crystal material is sealed is performed. Thereby, the liquid crystal panel is completed.

  In the manufacturing method of the present embodiment described above, the adhesive strength to the sealing agent 17 is only applied to the tip portion of the inlet 18 that is originally unnecessary and protrudes from the adjacent liquid crystal panel in the application portion of the sealing agent 17 in the array step. A layer 20 of a transparent protective film made of a photosensitive acrylic resin having a low thickness is exposed on the substrate surface. Therefore, in the step of separating the liquid crystal panel, when the end portion on the terminal 16 side of the counter substrate 11 is to be removed as shown in FIG. 9A, it is applied on the photosensitive acrylic resin layer 20 having low adhesive strength. Further, the sealing agent 17 is relatively easily peeled off from the surface of the counter substrate 11 as shown in FIG. That is, by sufficiently reducing the adhesive strength of the layer 20 to the sealing agent 17, the sealing agent 17 is peeled off before damaging the substrate surface.

According to the liquid crystal panel manufacturing method of the present embodiment described above, the following effects can be obtained.
(1) In this embodiment, while securing a strong adhesive strength between the opposing substrate 11 and the sealing agent 17 at other sealing agent application portions, the sealing agent 17 from the opposing substrate 11 at the tip portion of the inlet 18 that is originally unnecessary is secured. Is easily peeled off, and defects such as chipping, cracking failure, and strength reduction that occur when the liquid crystal panel is separated can be suitably suppressed. Therefore, the productivity of the liquid crystal panel can be further improved by achieving both the increase in the number of panels taken from the mother substrate and the reduction of defective products due to chipping / cracking defects and insufficient strength.

  (2) In this embodiment, the layer 20 provided to reduce the adhesive strength of the counter substrate 11 to the sealing agent 17 at the tip of the inlet 18 is originally used as a transparent protective film of the color filter. It is formed of a photosensitive acrylic resin that is the same material as the transparent protective film formed on the substrate 11. Therefore, the layer 20 can be formed as a part of the manufacturing process of a normal liquid crystal panel, and an increase in manufacturing steps and manufacturing equipment related to the formation of the layer 20 and, in turn, an increase in manufacturing cost can be suppressed.

In addition, the said embodiment can also be changed and implemented as follows.
In the above embodiment, the layer 20 having a low adhesive strength to the sealant 17 is exposed only at the tip of the injection port 18 in the application part of the sealant 17 on the surface of the mother substrate 13. The same effect can be obtained even if a layer having a lower adhesive strength to the layer than the adhesive strength to the sealing agent 17 is formed. That is, as shown in FIG. 10A, when the end portion on the terminal 16 side of the counter substrate 11 on which the layer 21 is formed is removed, as shown in FIG. Is easily peeled off from the layer immediately below, so that the original substrate surface is protected from damage.

  However, in the case of providing the layer 21 that is easily peeled from the layer immediately below, attention should be paid to the following points. That is, in order to protect the substrate surface from damage, it is necessary to make the adhesive strength to the layer immediately below the layer 21 sufficiently low, but if the adhesive strength is too low, rubbing treatment at the time of forming the alignment film, etc. In this case, the layer 21 may be peeled off. However, when there is no possibility of such peeling, or when the rubbing process itself is not performed, such coating of the layer 21 is effective in protecting the substrate surface from damage.

The layers 20 and 21 may be provided on the array substrate side, or may be provided on both the counter substrate side and the array substrate side.
If the material of the sealant or the layer immediately below is different, the appropriate material for the layers 20 and 21 will naturally change depending on the compatibility with them. That is, it is necessary to select an appropriate material for the layers 20 and 21 according to the compatibility with the sealing agent 17 and the material of the layer immediately below. However, the layers 20 and 21 are desirably formed of the same material as the insulating film, electrode, wiring, gate, channel, transparent protective film, alignment film, transparent conductive film, light shielding film, and the like formed on the substrate. Specific examples of such materials include polysilicon, silicon oxide, silicon nitride, chromium, aluminum-neodymium alloy, photosensitive acrylic resin, ITO, IZO, molybdenum and the like. If these materials are the same, the layers 20 and 21 can be formed through processes similar to those normally used in the manufacture of liquid crystal panels, which increases the number of manufacturing processes and manufacturing equipment, and consequently the manufacturing cost. The increase can be suppressed. Of course, when the increase in manufacturing cost does not become a problem, or when an appropriate material is not found in them, the layers 20 and 21 can be formed of other materials.

  The present invention can be applied to the manufacture of liquid crystal panels other than the liquid crystal panel using the TFT. For example, a liquid crystal panel using MIM (Metal-Insulator-Metal), a STN (Super Twisted Nematic) type, a DSTN (Dual-scan Super Twisted Nematic) type liquid crystal panel, etc. are manufactured in a manner similar to or equivalent to the above embodiment. You may make it do.

The top view of the sub pixel of the liquid crystal panel used as the manufacture object of one Embodiment of this invention. Sectional drawing of the liquid crystal panel. The partial top view of the array substrate side mother board | substrate of the embodiment. The partial top view of the opposing board | substrate side mother board | substrate of the embodiment. The (A) enlarged plan view and (B) sectional drawing of the same opposing substrate side mother board | substrate. The partial top view of the mother board | substrate after bonding of the embodiment. Sectional drawing of the mother board | substrate after the bonding. The expanded sectional view of FIG. (A), (B) Sectional drawing which shows the cutting | disconnection aspect of the panel in the same embodiment. (A), (B) Sectional drawing which shows the isolation | separation aspect of the panel in another embodiment of this invention. The perspective view which shows the bonding aspect of the board | substrate in the manufacturing method of the conventional liquid crystal panel. Similarly, the partial top view of the mother board | substrate in the conventional manufacturing method. (A), (B) Sectional drawing which shows the disconnection aspect of the panel in the conventional manufacturing method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Array substrate, 11 ... Counter substrate, 12 ... Mother substrate (array substrate side), 13 ... Mother substrate (counter substrate side), 14 ... Image display part (array substrate side), 15 ... Image display part (opposite substrate side) ), 16 ... terminal, 17 ... sealing agent, 18 ... injection port, 19 ... transparent protective film layer, 20 ... (adhesive strength to the sealing agent as compared with the material constituting the other sealing agent application surface of the mother substrate) A layer composed of a low material, 21... (A layer whose adhesive strength to the layer immediately below is lower than the adhesive strength to the sealant)

Claims (3)

Through a process of separating each liquid crystal panel from a pair of mother substrates in which a plurality of liquid crystal panels are integrally formed, the liquid crystal material was bonded through a sealant applied so that the inlet of the liquid crystal material was opened at the outer edge of the panel. A method for producing a liquid crystal panel comprising a pair of substrates,
Applying the sealing agent so that the tip of the injection port protrudes at the formation position of the liquid crystal panel adjacent to the mother substrate;
Prior to the application of the sealing agent, the adhesive strength to the sealing agent compared to the material constituting the other sealing agent application surface of the mother substrate on the sealing agent application surface of the mother substrate at the tip of the injection port Exposing a layer made of a low material,
A method for producing a liquid crystal panel, comprising: Through a process of separating each liquid crystal panel from a pair of mother substrates in which a plurality of liquid crystal panels are integrally formed, the liquid crystal material was bonded through a sealant applied so that the inlet of the liquid crystal material was opened at the outer edge of the panel. A method for producing a liquid crystal panel comprising a pair of substrates,
Applying the sealing agent so that the tip of the injection port protrudes at the formation position of the liquid crystal panel adjacent to the mother substrate;
Prior to the application of the sealant, among the sealant application surface of the mother substrate, only the sealant application surface at the tip of the injection port has an adhesive strength to the layer immediately below that of the sealant. Coating the lower layer;
A method for producing a liquid crystal panel, comprising:   The layer is formed of the same material as any one of an insulating film, an electrode, a wiring, a gate, a channel, a transparent protective film, an alignment film, a transparent conductive film, and a light shielding film formed on the substrate. 3. A method for producing a liquid crystal panel according to 1 or 2.

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