JP2008107642A - Liquid crystal display and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique advantageous for attaining higher yield in manufacture of a liquid crystal display including a step for cutting an insulating substrate. <P>SOLUTION: The liquid crystal display is provided with substrates SUB1 and SUB2 opposed to each other, a frame-shaped sealing resin layer SL interposed between the substrates SUB1 and SUB2, an alignment layer AL1 with which a first principal surface opposed to the substrate SUB2 of the substrate SUB1 is coated on the inner side of the frame-shaped sealing resin layer SL, an alignment layer AL2 with which a second principal surface opposed to the substrate SUB1 of the substrate SUB2 is coated on the inner side of the frame-shaped sealing resin layer SL, a liquid crystal material LC with which a space enclosed by the substrates SUB1 and SUB2 and the frame-shaped sealing resin layer SL is filled and a peeling layer AL1' which is composed of the same material as the alignment layer AL1 and with which a peripheral part of the first principal surface is coated and which encloses the frame-shaped sealing resin layer SL. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device and a manufacturing method thereof.

The liquid crystal display device is manufactured, for example, by the following method.
First, first and second insulating substrates each having an electrode or a plurality of electrodes formed on one main surface are prepared. Then, a plurality of alignment films are formed on the main surface of each insulating substrate or on the main surface on which the plurality of electrodes are formed so that the alignment films are separated from each other and each electrode is covered with the alignment film. .

  Next, a plurality of frame-shaped sealing resin layers are formed on the main surface of the first insulating substrate using an adhesive. These frame-shaped sealing resin layers are formed so that the alignment films formed on the first insulating substrate are respectively surrounded by the frame-shaped sealing resin layers. Each frame-shaped sealing resin layer is provided with an opening for later use as an injection port.

  Thereafter, these insulating substrates are bonded so that the alignment films formed on the second insulating substrate are positioned in the frame-shaped sealing resin layer on the first insulating substrate. Thereby, a large format panel is obtained.

  Next, one insulating substrate of the large panel is cleaved along the frame-shaped sealing resin layer at a position between the frame-shaped sealing resin layers. Subsequently, the other insulating film of the large format panel is similarly cleaved. Thereby, a plurality of liquid crystal cells are obtained.

  Next, a liquid crystal material is injected from the previous injection port into a space surrounded by the pair of substrates and the frame-shaped sealing resin layer of each liquid crystal cell. After filling the inlet with resin, if necessary, an optical film is attached to the liquid crystal cell. Further, the display panel thus obtained is connected to an external circuit and combined with a backlight or the like as necessary. Thereby, a liquid crystal display device is completed.

  As represented by this, many of the liquid crystal display device manufacturing processes include a step of cleaving the insulating substrate. In such a process, the frame-shaped sealing resin layer may protrude from the region where it is allowed. In this case, when the insulating substrate is divided into a plurality of pieces, the pieces may remain connected via the frame-shaped sealing resin layer.

  If the fragments are connected to each other via the frame-shaped sealing resin layer, separation of the fragments is prevented. Moreover, in this case, one of the fragments may damage the other fragment.

  An object of the present invention is to provide a technique advantageous for realizing a higher yield in the manufacture of a liquid crystal display device including a step of cleaving an insulating substrate.

  According to the first aspect of the present invention, the first and second substrates facing each other, the frame-shaped sealing resin layer interposed between the first and second substrates, and the second substrate of the first substrate facing each other. A first alignment film covering the first main surface with the inside of the frame-shaped sealing resin layer, and a second main surface of the second substrate facing the first substrate inside the frame-shaped sealing resin layer. A liquid crystal material filling a space surrounded by the first and second substrates and the frame-shaped sealing resin layer, and the same material as the first alignment film, There is provided a liquid crystal display device comprising a first release layer covering a peripheral portion of one main surface and surrounding the frame-shaped sealing resin layer.

  According to the second aspect of the present invention, a step of forming a first alignment film partially covering the first main surface of the first substrate, and a second alignment partially covering the second main surface of the second substrate. Forming a film; forming a first release layer that surrounds the first alignment film on the first main surface and is made of the same material as the first alignment film; and the first substrate and the second A substrate is bonded via a frame-shaped sealing resin layer, the first and second alignment films face each other, and the frame-shaped sealing resin layer is between the first alignment film and the first release layer. A step of forming a positioned large panel, and a step of cleaving the first substrate of the large panel along the frame-shaped sealing resin layer at the position of the first release layer. A method for manufacturing a display device is provided.

  According to the third aspect of the present invention, a step of forming a first alignment film partially covering the first main surface of the first substrate, and a second alignment partially covering the second main surface of the second substrate. Forming a film; forming a first release layer that surrounds the first alignment film on the first main surface and is made of the same material as the first alignment film; and Forming a second release layer that surrounds the second alignment film and made of the same material as the second alignment film; and the first alignment film on the first main surface and outside the first release layer; A step of forming a third release layer made of the same material, and the first substrate and the second substrate are bonded together via a frame-shaped sealing resin layer and a dummy sealing resin layer. An alignment film faces and the frame-shaped sealing resin layer is between the first alignment film and the first release layer, and the second alignment film Forming a large panel positioned between the second release layer and the dummy sealing resin layer on the third release layer; and forming the first substrate of the large panel as the first release layer. Cleaving along the frame-shaped sealing resin layer at the position, and cleaving the first substrate of the large panel along the frame-shaped sealing resin layer at the position of the first release layer. The manufacturing method of the liquid crystal display device characterized by including is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the technique advantageous in implement | achieving a higher yield by manufacture of the liquid crystal display device including the process of cleaving an insulated substrate is provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same referential mark is attached | subjected to the component which exhibits the same or similar function, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a cross-sectional view schematically showing an example of a liquid crystal display device that can be manufactured by the method according to the first and second aspects of the present invention.

  This liquid crystal display device is a TN (twisted nematic) type liquid crystal display device. This liquid crystal display device includes a display panel DP. In FIG. 1, both main surfaces of the display panel DP are parallel to the X direction and the Y direction intersecting each other, and the thickness direction of the display panel DP is parallel to the Z direction orthogonal to the X direction and the Y direction. Typically, the X direction and the Y direction are orthogonal to each other.

  The display panel DP includes an array substrate AS and a counter substrate CS. The array substrate AS and the counter substrate CS face each other with a slight gap. The structures of the array substrate AS and the counter substrate CS will be described later in detail.

  A gap between the array substrate AS and the counter substrate CS is formed by a spacer (not shown). These spacers are columnar spacers formed as part of the array substrate AS and / or the counter substrate CS, for example. Alternatively, these spacers may be granular spacers distributed between the array substrate AS and the counter substrate CS.

  A frame-shaped sealing resin layer SL is interposed between the array substrate AS and the counter substrate CS. The frame-shaped sealing resin layer SL forms a frame-shaped pattern opened at one or a plurality of locations. The frame-shaped sealing resin layer SL bonds the array substrate AS and the counter substrate CS. The frame-shaped sealing resin layer SL is formed using an adhesive such as a thermosetting epoxy resin, for example.

  The array substrate AS, the counter substrate CS, and the frame-shaped sealing resin layer SL form a liquid crystal cell CL. The opening provided in the frame shape pattern of the frame-shaped sealing resin layer SL is used as an injection port that connects the internal space and the external space of the liquid crystal cell CL.

  Transfer electrodes (not shown) are interposed between the array substrate AS and the counter substrate CS and outside the frame-shaped pattern formed by the frame-shaped sealing resin layer SL. By this transfer electrode, the array substrate AS and the counter substrate CS are electrically connected.

  The internal space of the liquid crystal cell CL is filled with the liquid crystal material LC. The liquid crystal material LC forms a liquid crystal layer. In this display panel DP, nematic liquid crystal having positive dielectric anisotropy is used as the liquid crystal material LC. The liquid crystal material LC is injected into the liquid crystal cell CL using, for example, an injection method such as a dip type or a dispenser type.

  The inlet of the liquid crystal cell CL is closed with a sealing body (not shown). The sealing body is formed, for example, by dispensing an adhesive such as an ultraviolet curable resin into the injection port and curing it.

  A polarizing plate PLZ1 is attached to the outer surface of the array substrate AS. A polarizing plate PLZ2 is also attached to the outer surface of the counter substrate CS.

Next, the array substrate AS and the counter substrate CS will be described.
The array substrate AS includes an insulating substrate SUB1. The substrate SUB1 is a light transmissive substrate such as a glass substrate, for example. In this glass substrate, an inorganic film may be formed on the main surface on the counter substrate CS side, or such an inorganic film may not be formed. Examples of the inorganic film include an inorganic insulating film made of an insulator such as silicon oxide and / or silicon nitride.

  On the substrate SUB1, a plurality of signal lines (not shown) and a plurality of source electrodes SE are arranged. The signal lines extend in the Y direction and are arranged in the X direction. The signal line also serves as the drain electrode DE. The source electrode SE forms a plurality of columns corresponding to the signal lines.

  On the substrate SUB1, a plurality of semiconductor layers SC are further arranged corresponding to the drain electrodes DE. Each semiconductor layer SC covers the source electrode SE and the drain electrode DE. A source and a drain are formed in each semiconductor layer.

  Each semiconductor layer SC is covered with an insulating film GI. A portion of the insulating film GI that covers the semiconductor layer SC is used as a gate insulating film.

  On the substrate SUB1, a plurality of scanning lines (not shown) extending in the X direction are arranged in the Y direction. Each scanning line includes a plurality of protrusions extending in the Y direction corresponding to the signal lines. Each of these protrusions is a gate electrode GE that faces the semiconductor layer SC via the insulating film GI.

  The semiconductor layer SC, the insulating film GI, and the gate electrode GE form a top gate type thin film transistor as the switching element SW. The switching elements SW are arranged corresponding to the source electrodes SE.

On the substrate SUB1, the color filter CF and the peripheral light shielding layer LS are arranged.
The color filter CF includes a plurality of red coloring layers R, a plurality of green coloring layers G, and a plurality of blue coloring layers B. The colored layers R, G, and B have a band shape extending in the Y direction and are arranged in the X direction. These colored layers R, G, and B form a stripe pattern. The colored layers R, G, and B can be formed using, for example, a photosensitive resin containing a colored dye or a colored pigment.

  The peripheral light shielding layer LS surrounds the color filter CF. That is, the peripheral light shielding layer LS has a frame shape. The peripheral light shielding layer LS can be formed using, for example, a photosensitive resin containing a coloring dye or a coloring pigment.

  On the color filter CF, a plurality of pixel electrodes PE are arranged corresponding to the switching elements SW. The pixel electrode PE forms a plurality of columns corresponding to the colored layers R, G, and B. Each of the pixel electrodes PE is connected to the source electrode SE through a through hole formed in the color filter CF. The pixel electrode PE is a transparent electrode. When the liquid crystal display device is of a reflective type, typically, a reflective electrode is used as the pixel electrode PE. When the liquid crystal display device is a transflective type, typically, a combination of a reflective electrode and a transparent electrode is used as the pixel electrode PE.

  The pixel electrode PE is covered with the alignment film AL1. The alignment film AL1 is made of a resin such as polyimide, for example. The alignment film AL1 is subjected to an alignment process using, for example, rubbing or an optical alignment technique. When the VA (vertically aligned) mode is employed, the alignment film AL1 may not be subjected to the alignment treatment.

  The peripheral portion of the main surface of the substrate SUB1 where the alignment film AL1 is formed is covered with a release layer AL1 '. The release layer AL1 'forms a frame-shaped pattern surrounding the frame-shaped sealing resin layer SL. The release layer AL1 'is made of the same material as the alignment film AL1.

  The counter substrate CS includes an insulating substrate SUB2. The substrate SUB2 is, for example, a light transmissive substrate such as a glass substrate. In this glass substrate, an inorganic film may be formed on the main surface on the array substrate AS side, or such an inorganic film may not be formed. Examples of the inorganic film include an inorganic insulating film made of an insulator such as silicon oxide and / or silicon nitride.

  One main surface of the substrate SUB2 is covered with a counter electrode CE. The counter electrode CE faces a plurality of pixel electrodes PE. The counter electrode CE is typically a transparent electrode.

  The counter electrode CE is covered with the alignment film AL2. For the alignment film AL2, the same material as that of the alignment film AL1 can be used. The alignment film AL2 is subjected to an alignment process using, for example, rubbing or an optical alignment technique. When the VA mode is adopted, the alignment film AL2 may not be subjected to alignment treatment.

  The peripheral portion of the main surface of the substrate SUB2 on which the alignment film AL2 is formed is covered with a release layer AL2 '. The release layer AL2 'forms a frame-shaped pattern surrounding the frame-shaped sealing resin layer SL. The release layer AL2 'is made of the same material as the alignment film AL2.

This liquid crystal display device is manufactured, for example, by the following method.
2 and 3 are cross-sectional views schematically showing a method of manufacturing the liquid crystal display device according to the first aspect of the present invention. FIG. 4 is a plan view schematically showing the structure of FIG. The cross section shown in FIG. 2 corresponds to the cross section taken along the line II-II of the structure shown in FIG.

  In this method, first, the large panel OP shown in FIGS. 2 and 4 is formed. Then, the large panel OP is cut to obtain a plurality of liquid crystal cells CL shown in FIG.

  Specifically, first, a large insulating substrate SUB1 and a large insulating substrate SUB2 are prepared. Hereinafter, each of the plurality of regions corresponding to the plurality of liquid crystal cells CL to be formed on one main surface of the large substrate SUB1 is referred to as a “first region”. In addition, each of a plurality of regions corresponding to the plurality of liquid crystal cells CL to be formed on one main surface of the large substrate SUB2 is referred to as a “second region”.

  A signal line, a switching element SW, a scanning line, a color filter CF, a peripheral light shielding layer LS, and a pixel electrode PE are formed on each first region. Next, the alignment film AL1 is formed on each first region by, for example, offset printing, and the release layer AL1 'is formed at the boundary between each first region and the surrounding region. As the printing ink, for example, a mixture containing a resin such as polyimide and a solvent is used. Thereafter, the alignment film AL1 and the release layer AL1 'are baked at, for example, about 200 ° C., and the alignment film AL1 is subjected to an alignment process such as rubbing. In this way, a large array substrate AS is obtained.

  A counter electrode CE is formed on each second region. Next, the alignment film AL2 is formed on each second region by, for example, offset printing, and the release layer AL2 'is formed at the boundary between each second region and the surrounding region. As the printing ink, for example, a mixture containing a resin such as polyimide and a solvent is used. Thereafter, the alignment film AL2 and the release layer AL2 'are baked, for example, at about 200 ° C., and the alignment film AL2 is subjected to alignment treatment. In this way, a large counter substrate CS is obtained. The alignment film AL2 is arranged so that it can face the alignment film AL1 on the front surface when the large array substrate AS and the large counter substrate CS face each other.

  Next, the frame-shaped sealing resin layer SL is formed on each first region. The frame-shaped sealing resin layer SL is formed so as to be positioned between the peripheral light shielding layer LS and the peeling layer AL1 '. The frame-shaped sealing resin layer SL can be formed by, for example, a dispenser method and a screen printing method. Next, a transfer electrode made of, for example, silver paste is formed on each first region and outside the frame-shaped sealing resin layer SL. The transfer electrode can be formed by a dispenser method, for example. The frame-shaped sealing resin layer SL and the transfer electrode may be formed on the second region instead of being formed on the first region.

  Then, when using a granular spacer as a spacer, a granular spacer is spread | dispersed on a 2nd area | region or a 1st area | region. Subsequently, the large array substrate AS and the large counter substrate CS are aligned and bonded together. Further, the frame-shaped sealing resin layer SL is heated and cured. The large format panel OP is obtained as described above.

  Next, the large substrate SUB1 is cleaved along the frame-shaped sealing resin layer SL at the position of the release layer AL1 '. Next, the large substrate SUB2 is cleaved along the frame-shaped sealing resin layer SL at the position of the release layer AL2 '. That is, the large substrates SUB1 and SUB2 are cut along the cutting lines BL1 and BL2, respectively.

  Specifically, first, the large panel OP is placed on a table so that the large substrate SUB1 faces upward. Next, the outer surface of the large substrate SUB1 is scribed along the cutting line BL1 with a cutter blade to form a scribe line, that is, a crack. After inverting the large format panel OP, pressure is locally applied to the large format substrate SUB1 from the large format substrate SUB2 side to expand the previous crack. As a result, the large substrate SUB1 is divided. Next, the outer surface of the large substrate SUB2 is scribed along the cutting line BL2 with a cutter blade using diamond to form a scribe line, that is, a crack. After inverting the large format panel OP, pressure is locally applied to the large format substrate SUB2 from the substrate SUB1 side to enlarge the previous crack. Thereby, the large substrate SUB2 is divided to obtain a plurality of liquid crystal cells CL.

  Next, the liquid crystal material LC is injected into each liquid crystal cell CL from the injection port, and then the injection port is closed with a sealing body. Further, polarizing plates PLZ1 and PLZ2 are attached to the array substrate AS and the counter substrate CS of each liquid crystal cell CL1, respectively, to obtain a plurality of display panels DP.

  Thereafter, an external circuit such as a driver circuit is connected to each display panel DP. Further, each display panel DP is combined with, for example, a backlight. The liquid crystal display device is completed as described above.

  According to this method, when the insulating substrate SUB1 is divided into a plurality of pieces and when the insulating substrate SUB2 is divided into a plurality of pieces, the pieces are separated from each other via the frame-shaped sealing resin layer SL. It is possible to prevent connection. This will be described with reference to FIGS.

  5 and 6 are cross-sectional views schematically showing a cleaving process when the frame-shaped sealing resin layer is formed wide in the method for manufacturing the liquid crystal display device according to the first comparative example. 7 and 8 are cross-sectional views schematically showing a cleaving process when the frame-shaped sealing resin layer is formed wide in the manufacturing method of FIGS.

  For example, when the frame-shaped sealing resin layer SL is formed by a dispenser method or the like, the frame-shaped sealing resin layer SL may be partially widened. Therefore, when the distance between the cutting line BL1 and the frame-shaped sealing resin layer SL is short, the wide part of the frame-shaped sealing resin layer SL may straddle the cutting line BL1.

  It is extremely difficult to divide the frame-shaped sealing resin layer SL in the cleaving process of the large substrate SUB1. Therefore, in the structure in which AL1 ′ is not formed as shown in FIG. 5, when the frame-shaped sealing resin layer SL is formed so as to straddle the cutting line BL1, even if the large substrate SUB1 is cut, FIG. As shown, the cleaved substrates SUB1 remain connected via the frame-shaped sealing resin layer SL.

  As the frame-shaped sealing resin layer SL, one having high adhesion to the adherend surfaces of the array substrate AS and the counter substrate CS, here, the surfaces of the substrates SUB1 and SUB2 is used. Therefore, when the cleaved substrates SUB1 are connected to each other via the frame-shaped sealing resin layer SL, if they are separated, the frame-shaped sealing resin layer SL is damaged and formed on the substrate SUB1. Other components can also be damaged.

  The adhesion of the release layer AL1 'to the substrate SUB1 is much lower than the adhesion of the frame-shaped sealing resin layer SL to the substrate SUB1. Therefore, when the structure in which the peeling layer AL1 ′ is formed as shown in FIG. 7 is adopted, even when the frame-shaped sealing resin layer SL is formed so as to straddle the cutting line BL1, for example, when the large substrate SUB1 is cut When the separated substrates SUB1 are separated from each other, the separation layer AL1 ′ is easily separated from the substrate SUB1, as shown in FIG.

  Therefore, when the release layer AL1 'is provided, damage to the frame-shaped sealing resin layer SL and other components is less likely to occur than when the release layer AL1' is not provided. That is, according to this method, it is possible to achieve a high yield even when the distance between the cutting line BL1 and the frame-shaped sealing resin layer SL is shortened.

  Further, in this method, as described above, even when the frame-shaped sealing resin layer SL is formed so as to straddle the cutting line BL2, for example, when the large substrate SUB2 is cut or when the divided substrates SUB2 are separated from each other In addition, the release layer AL2 ′ is easily peeled from the substrate SUB2. Therefore, when the release layer AL2 'is provided, damage to the frame-shaped sealing resin layer SL and other components is less likely to occur as compared to the case where the release layer AL2' is not provided. That is, according to this method, a high yield can be achieved even when the distance between the cutting line BL2 and the frame-shaped sealing resin layer SL is shortened.

  In the structure shown in FIG. 8, the frame-shaped sealing resin layer SL and the release layer AL1 'protrude from the gap between the array substrate AS and the counter substrate CS. Usually, the protruding portions of the frame-shaped sealing resin layer SL and the release layer AL1 'are removed by cutting and / or polishing after the large-sized substrates SUB1 and SUB2 are cleaved.

  In this method, the release layer AL1 'and the alignment film AL1 may be formed in separate steps or simultaneously. According to the latter, compared with the former, a liquid crystal display device can be manufactured with fewer steps. Further, the release layer AL2 'and the alignment film AL2 may be formed in separate steps or simultaneously. According to the latter, compared with the former, a liquid crystal display device can be manufactured with fewer steps.

  In this method, the frame-shaped sealing resin layer SL does not cover the release layers AL1 'and AL2'. Instead, the frame-shaped sealing resin layer SL may be formed so as to cover the inner part of the release layer AL1 'and / or the release layer AL2'.

  The design value of the distance from the frame-shaped sealing resin layer SL to the cutting line BL1 is not particularly limited. However, the problem described with reference to FIGS. This is particularly likely to occur when the thickness is 5 mm or less. Therefore, the technique described here is particularly useful in such cases. Although the lower limit of this design value is zero, it is usually set to 0.3 mm or more in consideration of the position error of the scribe line.

  Similarly, this technique is particularly useful when the design value of the distance from the frame-shaped sealing resin layer SL to the cutting line BL2 is short, for example, 0.5 mm or less. The lower limit of this design value is zero, but it is usually set to 0.3 mm or more in consideration of the position error of the scribe line.

  Next, the second aspect of the present invention will be described. In the second aspect, as described below, the large format panel includes a dummy sealing resin layer and an evaluation element. The dummy sealing resin layer is disposed between the array substrate and the counter substrate and outside the frame-shaped sealing resin layer. The dummy sealing resin layer is formed on the release layer. The dummy sealing resin layer is used to integrate the unnecessary portion of the array substrate and the unnecessary portion of the sealing substrate. The evaluation element is disposed on the array substrate and outside the frame-shaped sealing resin layer. The evaluation element has a structure similar to, for example, a circuit or element included in the display panel. In this case, the evaluation element can be used for the evaluation of the previous circuit or element.

  9 to 11 are cross-sectional views schematically showing a method for manufacturing a liquid crystal display device according to the second embodiment of the present invention.

  In this method, first, the large panel OP shown in FIG. 9 is formed. Next, the large panel OP is cleaved to obtain a plurality of liquid crystal cells CL shown in FIG. 3 and a fragment PC shown in FIG. Then, a circuit or element included in the liquid crystal cell CL is evaluated using a part of the broken piece PC.

  Specifically, first, a large insulating substrate SUB1 and a large insulating substrate SUB2 are prepared. As in the first embodiment, each of a plurality of regions corresponding to the plurality of liquid crystal cells CL to be formed on one main surface of the large substrate SUB1 is referred to as a “first region”. In addition, each of a plurality of regions corresponding to the plurality of liquid crystal cells CL to be formed on one main surface of the large substrate SUB2 is referred to as a “second region”. Furthermore, a region other than the first region in the main surface of the large substrate SUB1 is referred to as a third region.

  A signal line, a switching element SW, a scanning line, a color filter CF, a peripheral light shielding layer LS, and a pixel electrode PE are formed on each first region. An evaluation element EE is formed on a part of the third region. The evaluation element EE is, for example, one or more of a signal line, a switching element SW, a scanning line, a color filter CF, a peripheral light shielding layer LS, and a pixel electrode PE.

  Next, the alignment film AL1 is formed on each first region by, for example, offset printing, and the release layer AL1 'is formed at the boundary between each first region and the surrounding third region. Further, on the third region, a release layer AL1 ″ is formed adjacent to the evaluation element EE or at a position away from the evaluation element EE. As the printing ink, for example, a resin such as polyimide and a solvent are used. Thereafter, the alignment film AL1 and the release layers AL1 ′ and AL1 ″ are baked at, for example, about 200 ° C., and the alignment film AL1 is subjected to alignment treatment such as rubbing. In this way, a large array substrate AS is obtained.

  A counter electrode CE is formed on each second region. Next, the alignment film AL2 is formed on each second region by, for example, offset printing, and the release layer AL2 'is formed at the boundary between each second region and the surrounding region. As the printing ink, for example, a mixture containing a resin such as polyimide and a solvent is used. Thereafter, the alignment film AL2 and the release layer AL2 'are baked, for example, at about 200 ° C., and the alignment film AL2 is subjected to alignment treatment. In this way, a large counter substrate CS is obtained. The alignment film AL2 is arranged so that it can face the alignment film AL1 on the front surface when the large array substrate AS and the large counter substrate CS face each other.

  Next, a frame-shaped sealing resin layer SL is formed on each first region, and a dummy sealing resin layer SL ′ is formed on the release layer AL1 ″. The frame-shaped sealing resin layer SL is a peripheral light shielding layer LS. The frame-shaped sealing resin layer SL and the dummy sealing resin layer SL ′ can be formed by, for example, a dispenser method and a screen printing method. For example, the same material as that of the frame-shaped sealing resin layer SL is used for the dummy sealing resin layer SL ′, and then, for example, silver is formed on each first region and outside the frame-shaped sealing resin layer SL. A transfer electrode made of paste can be formed by, for example, a dispenser method, and the frame-shaped sealing resin layer SL, the dummy sealing resin layer SL ′, and the transfer electrode are formed on the large substrate SUB1. form Instead of, or it may be formed on the large substrate SUB2.

  Thereafter, when a granular spacer is used as the spacer, the granular spacer is spread on the large array substrate AS or the large counter substrate CS. Subsequently, the large array substrate AS and the large counter substrate CS are aligned and bonded together. Further, the frame-shaped sealing resin layer SL and the dummy sealing resin layer SL 'are heated and cured. The large format panel OP is obtained as described above.

  Next, the large substrate SUB1 is cleaved along the frame-shaped sealing resin layer SL at the position of the peeling layer AL1 ′ by the same method as described with reference to FIGS. 2 to 4, and the large substrate SUB2 is formed. Cleaving along the frame-shaped sealing resin layer SL at the position of the release layer AL2 ′. That is, the large substrates SUB1 and SUB2 are cut along the cutting lines BL1 and BL2, respectively.

  When the large substrates SUB1 and SUB2 are cleaved, the liquid crystal cell CL shown in FIG. 3 and the fragment PC shown in FIG. 6 are obtained.

  In the liquid crystal cell CL, as described in the first embodiment, the liquid crystal material LC is injected, the injection port is sealed, and the polarizing plates PLZ1 and PLZ2 are sequentially attached to obtain a plurality of display panels DP. Then, an external circuit such as a driver circuit is connected to each display panel DP, and further combined with, for example, a backlight to complete a liquid crystal display device.

  A fragment PC shown in FIG. 6 includes an evaluation element EE. In this aspect, this evaluation element EE is used to evaluate a circuit or element included in the display panel DP.

  First, as shown in FIG. 11, the substrate SUB1 is separated from the substrate SUB2. Since the release layer AL1 ″ is interposed between the dummy sealing resin layer SL ′ and the substrate SUB1, the substrate SUB23 is easily peeled from the substrate SUB1 together with the dummy sealing resin layer SL ′ and the release layer AL1 ″. .

  When the dummy sealing resin layer SL ′ is not formed, there is a high possibility that the liquid crystal cell CL and / or the evaluation element EE are damaged when the substrate SUB1 and the substrate SUB2 are cleaved. When the dummy sealing resin layer SL ′ is formed, such damage can be suppressed.

  Next, the evaluation element EE is evaluated. When the evaluation element EE is a thin film transistor, for example, its threshold voltage is evaluated. When the evaluation element EE is a part of the constituent elements of the array substrate AS, for example, the film thickness thereof is evaluated.

  Thereafter, the evaluation result is fed back to the production line. For example, the doping conditions and film forming conditions are changed based on the evaluation results.

  In this embodiment, as described above, the release layers AL1 'and AL2' described in the first embodiment are formed. Therefore, in this aspect, the same effect as described in the first aspect can be obtained.

  In this embodiment, the release layer AL1 ″ is disposed between the dummy sealing resin layer SL ′ and the substrate SUB1. Therefore, as described below, the evaluation element EE and the like are destroyed. Can be prevented.

  12 and 13 are cross-sectional views schematically showing a method for manufacturing a liquid crystal display device according to a second comparative example. This method is the same as the method described with reference to FIGS. 9 to 11 except that the release layer AL1 ″ is omitted.

  The dummy sealing resin layer SL ′ exhibits high adhesion to both the substrates SUB1 and SUB2. Therefore, when the separation layer AL1 ″ is omitted, the substrate SUB1 and / or the substrate SUB2 is easily damaged when the substrate SUB1 is separated from the substrate SUB2. That is, in the method of FIGS. Prone to destruction.

  On the other hand, in the method of FIGS. 9 to 11, as described above, the release layer AL1 ″ is interposed between the dummy sealing resin layer SL ′ and the SUB1. Therefore, the substrate SUB1 is separated from the substrate SUB2. Therefore, the substrate SUB1 and / or the substrate SUB2 is not easily damaged, and according to this aspect, it is possible to prevent the evaluation element EE and the like from being destroyed.This effect is obtained without the release layers AL1 ′ and AL2 ′. Even if it is obtained.

  In this embodiment, the release layer AL ″ is interposed between the substrate SUB1 and the dummy sealing resin layer SL ′. Instead, the alignment film AL2 is interposed between the substrate SUB2 and the dummy sealing resin layer SL ′. A release layer made of the same material as that of the substrate SUB1 may be interposed between the substrate SUB2 and the dummy sealing resin layer SL, in addition to the release layer AL ″ being interposed between the substrate SUB1 and the dummy sealing resin layer SL ′. A peeling layer made of the same material as that of the alignment film AL2 may be interposed therebetween.

  In this aspect, the TN mode is adopted as the display mode. Instead, other display modes such as a VA mode, an OCB (optically compensated birefringence) mode, and an IPS (in-plane switching) mode may be employed. Note that when the VA mode or the like is employed, the alignment treatment on the alignment films AL1 and AL2 is not necessary. Further, when the IPS mode or the like is adopted, the counter electrode CE is omitted and the pixel electrode PE is constituted by a pair of electrodes, for example.

  Examples of the present invention will be described below.

(Example 1)
14 is a plan view schematically showing the large panel manufactured in Example 1. FIG. In this example, as described below, a large panel OP shown in FIG. 14 was manufactured, and six display panels DP shown in FIG. 1 were manufactured using this. The diagonal dimension of each liquid crystal panel DP was 2.2 inches.

  First, a glass substrate SUB1 having a size of 150 mm × 150 mm was prepared. A signal line, a thin film transistor SW, a scanning line, a color filter CF, a peripheral light shielding layer LS, and a pixel electrode PE are formed on each of the six first regions to be used for the liquid crystal panel DP on one main surface of the substrate SUB1. Formed. Next, an alignment film AL1 made of polyimide was formed on each first region by offset printing, and a release layer AL1 'was formed at the boundary between each first region and the surrounding region. The alignment film AL1 and the release layer AL1 'were baked at about 200 ° C., and the alignment film AL1 was rubbed. In this way, a large array substrate AS was obtained.

  Moreover, the glass substrate SUB2 with a dimension of 150 mm x 150 mm was prepared. A counter electrode CE was formed on each of the six second regions to be used for the liquid crystal panel DP on one main surface of the substrate SUB2. Next, an alignment film AL2 was formed on each second region by offset printing, and a release layer AL2 'was formed at the boundary between each second region and the surrounding region. Thereafter, the alignment film AL2 and the release layer AL2 ′ were baked at about 200 ° C., and the alignment film AL2 was rubbed. In this way, a large counter substrate CS was obtained.

  Next, a frame-shaped sealing resin layer SL made of a thermosetting epoxy resin was formed on each first region by a dispenser method. The frame-shaped sealing resin layer SL was formed so as to be positioned between the peripheral light shielding layer LS and the peeling layer AL1 '. Next, a transfer electrode made of a silver paste was formed on each first region and outside the frame-shaped sealing resin layer SL by a dispenser method.

  Then, the granular spacer was spread | dispersed on the 2nd area | region. Subsequently, the large-sized array substrate AS and the large-sized counter substrate CS were aligned and bonded together. Further, the frame-shaped sealing resin layer SL was heated and cured. Thus, a large panel OP was obtained.

  Next, the substrates SUB1 and SUB2 were cleaved sequentially along the cleaving lines BL1 and BL2, respectively. Thereafter, the liquid crystal material LC was injected into each liquid crystal cell CL from the injection port, and then the injection port was closed with a sealing body. Further, polarizing plates PLZ1 and PLZ2 were attached to the array substrate AS and the counter substrate CS of each liquid crystal cell CL1, respectively, to obtain six display panels DP.

  In this example, the cleaved substrates did not remain connected via the sealing resin layer SL. Further, when the obtained display panel DP was examined, all were non-defective products.

(Example 2)
FIG. 15 is a plan view schematically showing a large panel manufactured in Example 2. FIG. In this example, six display panels DP of FIG. 1 were manufactured by the same method as described in Example 1 except that the sealing resin layer SL was formed in the shape shown in FIG. Specifically, in this example, as shown in FIG. 15, the sealing resin layer SL is formed so that a part thereof straddles the cutting line BL1 over a length of 5 mm.

  In this example, the cleaved substrates did not remain connected via the sealing resin layer SL. Further, when the obtained display panel DP was examined, all were non-defective products.

(Comparative example)
In this example, a display panel was manufactured by the same method as in Example 2 except that the release layers AL1 ′ and AL2 ′ were not formed.

  In this example, the cleaved substrates remained connected via the sealing resin layer SL. When more force was applied to separate them, a part of the substrate cracked. For this reason, in this example, only three display panels DP were obtained as good products.

Sectional drawing which shows roughly an example of the liquid crystal display device which can be manufactured with the method which concerns on the 1st and 2nd aspect of this invention. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on the 1st aspect of this invention. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on the 1st aspect of this invention. FIG. 3 is a plan view schematically showing the structure of FIG. 2. Sectional drawing which shows roughly the cleaving process when the frame-shaped sealing resin layer is formed wide in the manufacturing method of the liquid crystal display device which concerns on a 1st comparative example. Sectional drawing which shows roughly the cleaving process when the frame-shaped sealing resin layer is formed wide in the manufacturing method of the liquid crystal display device which concerns on a 1st comparative example. Sectional drawing which shows roughly the cleaving process when the frame-shaped sealing resin layer is formed wide in the manufacturing method of FIG. 2 thru | or FIG. Sectional drawing which shows roughly the cleaving process when the frame-shaped sealing resin layer is formed wide in the manufacturing method of FIG. 2 thru | or FIG. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on the 2nd aspect of this invention. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on the 2nd aspect of this invention. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on the 2nd aspect of this invention. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on a 2nd comparative example. Sectional drawing which shows schematically the manufacturing method of the liquid crystal display device which concerns on a 2nd comparative example. FIG. 2 is a plan view schematically showing a large panel manufactured in Example 1. FIG. 2 is a plan view schematically showing a large panel manufactured in Example 1.

Explanation of symbols

  AL1 ... alignment film, AL1 '... release layer, AL1 "... release layer, AL2 ... alignment film, AL2' ... release layer, AS ... array substrate, BL1 ... cleaving line, BL2 ... cleaving line, CE ... counter electrode, CF ... Color filter, CL ... Liquid crystal cell, CS ... Counter substrate, DE ... Drain electrode, DP ... Display panel, EE ... Element for evaluation, GE ... Gate electrode, GI ... Insulating film, LC ... Liquid crystal material, LS ... Peripheral light shielding layer, OP ... large format panel, PE ... pixel electrode, PLZ1 ... polarizing plate, PLZ2 ... polarizing plate, SE ... source electrode, SUB1 ... insulating substrate, SC ... semiconductor layer, SL ... frame-shaped sealing resin layer, SUB2 ... insulating substrate, SW ... switching element.

Claims (6)

First and second substrates facing each other;
A frame-shaped sealing resin layer interposed between the first and second substrates;
A first alignment film in which the first main surface of the first substrate facing the second substrate is covered with the inside of the frame-shaped sealing resin layer;
A second alignment film in which the second main surface of the second substrate facing the first substrate is covered with the inside of the frame-shaped sealing resin layer;
A liquid crystal material filling a space surrounded by the first and second substrates and the frame-shaped sealing resin layer;
A liquid crystal display device comprising: a first release layer made of the same material as the first alignment film, covering a peripheral edge portion of the first main surface and surrounding the frame-shaped sealing resin layer.   The second release layer made of the same material as the second alignment film, further covering a peripheral edge of the second main surface and surrounding the frame-shaped sealing resin layer. The liquid crystal display device described. Forming a first alignment film partially covering the first main surface of the first substrate;
Forming a second alignment film partially covering the second main surface of the second substrate;
Forming a first release layer made of the same material as the first alignment film while surrounding the first alignment film on the first main surface;
The first substrate and the second substrate are bonded to each other through a frame-shaped sealing resin layer, the first and second alignment films face each other, and the frame-shaped sealing resin layer and the first alignment film Forming a large panel positioned between the first release layer;
And cleaving the first substrate of the large panel along the frame-shaped sealing resin layer at the position of the first release layer. Forming a second release layer made of the same material as the second alignment film while surrounding the second alignment film on the second main surface;
Cleaving the second substrate of the large panel along the frame-shaped sealing resin layer at the position of the second release layer,
4. The method of manufacturing a liquid crystal display device according to claim 3, wherein the frame-shaped sealing resin layer is positioned between the second alignment film and the second release layer in the large panel. Forming a first alignment film partially covering the first main surface of the first substrate;
Forming a second alignment film partially covering the second main surface of the second substrate;
Forming a first release layer made of the same material as the first alignment film while surrounding the first alignment film on the first main surface;
Forming a second release layer made of the same material as the second alignment film while surrounding the second alignment film on the second main surface;
Forming a third release layer made of the same material as the first alignment film on the first main surface and outside the first release layer;
The first substrate and the second substrate are bonded via a frame-shaped sealing resin layer and a dummy sealing resin layer, the first and second alignment films face each other, and the frame-shaped sealing resin layer is Between the first alignment film and the first release layer and between the second alignment film and the second release layer, the dummy sealing resin layer is positioned on the third release layer Forming a large panel,
Cleaving the first substrate of the large panel along the frame-shaped sealing resin layer at the position of the first release layer;
And cleaving the first substrate of the large panel along the frame-shaped sealing resin layer at the position of the first release layer.   After cleaving the first and second substrates, a portion of the cleaved first substrate that faces a part of the second substrate across the dummy sealing resin layer is the one of the second substrates. The method for manufacturing a liquid crystal display device according to claim 5, further comprising a step of peeling from the portion.

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