JP2006140744A - Method for displaying piezooscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a miniaturized means for displaying the name of a TCXO, and so on. <P>SOLUTION: In a display method of a piezooscillator provided with a substrate, electronic components and a piezoelectric vibrator, the name of the article and a lot number are displayed on a metallic cover of the piezoelectric vibrator, at least one of oscillator information and vibrator information is displayed on the rear side of the substrate on which the electronic components are not mounted, the name of the article is displayed almost on the center of the metallic cover, and marks are put on required positions on the peripheral edge of the metallic cover to display the lot number, the oscillator information, the vibrator information, and so on. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display method for a piezoelectric oscillator, and more particularly to a display method for a miniaturized piezoelectric oscillator.

In recent years, piezoelectric oscillators have been widely used in many fields such as communication equipment and electronic equipment because they have excellent points such as frequency stability, small size and light weight, and low price. A temperature-compensated piezoelectric oscillator (TCXO) that compensates the frequency-temperature characteristics of a crystal resonator has the above-described characteristics, and is often used for mobile phones that require particularly good frequency stability.
FIG. 4 is a schematic diagram showing the structure of a temperature compensated piezoelectric oscillator (discrete type TCXO) configured using individual electronic components, where FIG. 4 (a) is a cross-sectional view, and FIG. 4 (b) is a plan view. FIG. 2C is a rear view. As shown in the cross-sectional view of FIG. 4A, on the wiring formed on the printed circuit board 20, along with the electronic components 21 such as IC, thermistor, resistor, capacitor, etc., the wiring and the external terminals of the surface mount type crystal resonator 22 The surface mount type crystal resonator 22 is mounted on the copper ball 23 and soldered through a reflow bath to form a discrete TCXO. At this time, the size of the copper ball 23 is set so that the terminal electrode of the surface-mounted crystal resonator 22 and the electronic component 21 do not contact each other.
On the back side of the printed circuit board 20, terminals such as a power source (Vcc), an oscillation frequency output (OUT), a control voltage (Vcont), and a ground (GND) are formed as shown in FIG. The connection between the type TCXO and the motherboard on the mounting side is attempted.

Regarding the marking for displaying the temperature characteristic information of the crystal resonator, a display means is disclosed in Japanese Patent Application Laid-Open No. 2003-8386. As shown in the plan view of FIG. 4B, the discrete type TCXO is displayed (marked) on the metal lid of the surface mount type crystal resonator 23 with a TCXO product name 24 (for example, TCO-9141) and a lot number 25 ( For example, 0410), crystal oscillator information 26 (for example, oscillation frequency, temperature characteristic rank, etc.), surface-mounted crystal resonator information 27 (for example, temperature characteristic rank at a temperature of 60 ° C., etc.) are engraved with characters and symbols by laser engraving. It is common to display with.
The lot number is a production unit of a product manufactured under the same conditions, and functions as a management number for quality control.

The GSM mobile phone system developed in Europe is a system that strictly regulates the phase noise, that is, the CN characteristics, of the crystal oscillator to be used in order to ensure good call quality. For this reason, a discrete TCXO having excellent CN characteristics is suitable for the GSM mobile phone system, and is often used.
However, in other mobile phone systems, a single-chip IC type TCXO as shown in FIG. 5 has been developed and used to emphasize other points such as downsizing and thinning of the mobile phone. The one-chip IC type TCXO includes a ceramic package body 31 having openings on the upper and lower sides of a common base portion 30, a crystal resonator element 32, and an IC component 33 in which an oscillation circuit and a compensation circuit are integrated. FIG. 5A is a cross-sectional view showing the structure of a one-chip IC type TCXO, in which an IC component 33 is placed on the lower electrode 34 of the base portion 30 of the ceramic package body 31 via metal bumps 35. The quartz vibrating element 32 is bonded to the upper electrode 36 of the connecting portion 30 via the conductive adhesive 37, dried and connected and fixed. Then, a metal lid 38 is welded to a metallization (not shown) formed on the upper peripheral edge of the ceramic package body 31 by means of resistance welding or the like, and the crystal vibration element 32 is hermetically sealed to form a one-chip IC type TCXO. Constitute. The terminal electrode 39 on the outer bottom surface of the ceramic package body 31 is electrically connected to the lower electrode 34 and the upper electrode 36 inside by a conductor (not shown) formed in the ceramic package body 31.

As shown in the plan view of FIG. 5B, the display (marking) of the one-chip IC type TCXO is performed on the metal lid 38 that covers one opening of the ceramic package body 31 (for example, TCO-9141). ), Lot number 41 (for example, 0410), crystal oscillator information 42 (for example, oscillation frequency, temperature characteristic rank, etc.), crystal oscillator information 43 (temperature characteristic rank, etc. at a temperature of 60 ° C.) are displayed by laser engraving. Has been.
JP 2003-8386 A

However, if the external dimensions of the discrete type TCXO are about 7 mm × 5 mm, or 5 mm × 3.2 mm, the product name, lot number, oscillator information, crystal resonator information on the metal lid of the crystal resonator mounted on the printed circuit board Can be displayed by laser engraving. However, if the discrete TCXO has a small external dimension of about 3.2 mm × 2.5 mm, the external dimensions of the crystal unit to be mounted are further reduced. There is a problem that it is extremely difficult to display all of the number, oscillator information, crystal resonator information, and the like.
On the other hand, since the external dimension of the current one-chip IC type TCXO is about 3.2 mm × 2.5 mm, the product name, lot number, oscillator information, crystal oscillator information, etc. are placed on a metal lid for hermetically sealing the crystal resonator element. Can be displayed by laser engraving, but when the external dimensions of the 1-chip IC type TCXO is reduced to about 2.5 mm x 2.0 mm, the product name, lot number, oscillator information, crystal vibration on the metal lid There was a problem that it was extremely difficult to display all of the child information.

The present invention relates to a display method for a piezoelectric oscillator, and the invention according to claim 1 is a display method for a piezoelectric oscillator in which an electronic component and a piezoelectric vibrator are mounted on one main surface of a printed circuit board. A product name and a lot number are displayed on the lid, and at least one of oscillator information and vibrator information is displayed on the other main surface side of the printed circuit board to constitute a piezoelectric oscillator.
According to a second aspect of the present invention, a product name is displayed at substantially the center of the metal lid, and a mark is attached to a required position on the periphery of the metal lid to display a lot number, oscillator information, vibrator information, etc. 1 is configured.
According to a third aspect of the present invention, there is provided a piezoelectric oscillator display method comprising: a package main body that accommodates a piezoelectric vibration element and an IC component; and a metal lid for enclosing at least the piezoelectric vibration element. The piezoelectric oscillator according to claim 1 is configured by displaying a product name at a substantially central position and marking a required position on the periphery of the metal lid to display a lot number, oscillator information, vibrator information, and the like.
According to a fourth aspect of the present invention, the piezoelectric oscillator according to any one of the first to third aspects is configured by using a laser as the display means.

  In the case of the discrete type TCXO, the display method of the piezoelectric oscillator according to the present invention is displayed separately on the metal lid of the surface mount type crystal resonator and the back side of the substrate. Therefore, when the discrete type TCXO is downsized. Has the advantage of being able to handle. In addition, in the case of discrete type TCXO or 1-chip IC type TCXO, the product name can be displayed in the center of the metal lid and the lot number can be displayed by the mark on the periphery of the metal lid, so that it is possible to cope with further miniaturization. is there.

  FIG. 1 is a schematic view showing an embodiment of display of a temperature compensated piezoelectric oscillator (discrete type TCXO) according to the present invention. FIG. 1 (a) is a sectional view showing the structure of a discrete type TCXO. b) is a plan view, and FIG. As shown in the schematic cross-sectional view of FIG. 1A, the discrete type TCXO has a wiring and a planar mounting type crystal vibration on the wiring formed on the printed circuit board 1 along with electronic components 2 such as an IC, a thermistor, a resistor, and a capacitor. A copper ball 4 for conduction with an external terminal of the child 3 is mounted, and the surface mount type crystal resonator 3 is mounted on the copper ball 4, and is passed through a reflow bath and soldered. At this time, the copper ball 4 is sized so that the crystal unit 3 and the electronic component 2 do not contact each other.

  The external dimensions of the discrete type TCXO are reduced to about 3.2 mm × 2.5 mm, so the external dimensions of the mounted surface mounted crystal resonator are also extremely small, about 2.5 mm × 2.0 mm. It is extremely difficult to display the product name, lot number, oscillator information, crystal resonator information, and the like on the metal lid of the surface-mount crystal unit 3 by laser engraving to the extent that it can be read with the naked eye. Therefore, the applicant of the present application laser engraved only the product name 5 and the lot number 6 which are the most important displays for both the manufacturer and the user on the metal lid of the surface mount type crystal unit 3, and other oscillator information 7, crystal unit It was conceived that the information 8 or the like is displayed on the back side of the printed circuit board 1 on which no electronic component is mounted.

Oscillator information 7 or crystal oscillator information 8 is information necessary for the quality control of the discrete type TCXO during or after the manufacture of the discrete type TCXO. The product name 5 and the lot number 6 are important information, and the oscillator information 7 or the crystal resonator information 8 is not necessarily necessary information.
However, when a failure occurs in the discrete type TCXO, the manufacturer information as well as the product name 5 and the lot number 6 as well as the oscillator information 7 and the vibrator information 8 are important information for failure analysis. It is desirable to be described somewhere.

  2A and 2B are diagrams showing an embodiment of display relating to a one-chip IC type TCXO. FIG. 2A is a schematic sectional view showing the structure of the one-chip IC type TCXO, and FIG. 2B is a plan view. . The one-chip IC type TCXO is composed of a ceramic package body 11 having a central portion connected by a connecting portion 10 and having openings at the top and bottom, a crystal resonator element 12, and an IC component 13 in which an oscillation circuit and a compensation circuit are integrated. Yes. A metal lid 14 is welded to a metallization (not shown) formed on the upper peripheral edge of the ceramic package body 11 by resistance welding or the like, and the crystal resonator element 12 is hermetically sealed to constitute a one-chip IC type TCXO. When the external dimensions of the one-chip IC type TCXO are reduced to about 2.5 mm × 2.0 mm, it is extremely difficult to display the product name, lot number, oscillator information, crystal resonator information, etc. even if laser engraving is used. Therefore, as shown in FIG. 2B, only the product name 5 and the lot number 6 which are the minimum information necessary for both the manufacturer and the user are displayed.

FIG. 3 is a plan view showing a second embodiment according to the present invention. In the case of a discrete type TCXO, the metal lid of the surface mount type crystal unit 3 is replaced with a ceramic in the case of a one-chip IC type TCXO. A metal lid welded to a metallization (not shown) formed on the upper peripheral edge of the package body 11 is assumed. If the outer dimensions of these metal lids are further smaller than about 2.5 mm × 2.0 mm, it is difficult to display both the product name and lot number. In this case, as shown in the plan view of FIG. 3, only the product name 15 is displayed on the metal lid 17 by laser engraving, and the lot number is divided equally into the periphery of the metal lid 17. Then, the mark 18 is engraved by laser engraving at the center of the divided part. In the example of FIG. 3, the horizontal direction is divided into six equal parts and the vertical direction is divided into four equal parts. Since 1-bit information can be written with or without the mark 18 per division, 20-bit information can be written.
For example, if year, month, and day are used as the lot number, 4 bits (16 ways) are used for displaying the year, 4 bits (16 ways) are used for displaying the month, and 5 bits (32 ways) are used for displaying the day. 13 bits are sufficient. If only the presence or absence of the mark 18 is present, the outer periphery of the metal lid 17 can be further divided equally, so that it is possible to display information other than the lot number, for example, oscillator information, and the like when a crystal oscillator malfunctions. Make investigation easier.
In the case of a discrete type TCXO, the product name can be displayed on the metal lid of the surface mount type crystal resonator, and information such as the lot number and oscillator information can be displayed on the back side of the printed circuit board.

It is a figure which shows the display (marking) of discrete type TCXO which concerns on this invention, Comprising: (a) is sectional drawing, (b) is a top view, (c) is a back view. It is a figure which shows the display of 1 chip type | mold TCXO, Comprising: (a) is sectional drawing, (b) is a top view. It is a figure which shows the 2nd display (marking) example of TCXO which concerns on this invention. It is a figure which shows the display (marking) of the conventional discrete type | mold TCXO, Comprising: (a) is sectional drawing, (b) is a top view, (c) is a back view. It is a figure which shows the display of the conventional 1-chip type | mold TCXO, (a) is sectional drawing, (b) is a top view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Electronic component 3 Surface mount type crystal oscillator 4 Copper ball | bowl 5,15 Product name 6,16 Lot number 7 Oscillator information 8 Oscillator information 10 Connection part 11 Ceramic package main body 12 Crystal oscillator 13 IC
14, 17 Metal lid 18 mark

Claims (4)

A display method of a piezoelectric oscillator in which an electronic component and a piezoelectric vibrator are mounted on one main surface of a printed circuit board, wherein a product name and a lot number are displayed on a metal lid of the piezoelectric vibrator, and the printed circuit board A display method of a piezoelectric oscillator, characterized in that at least one of oscillator information and vibrator information is displayed on the other main surface side. 2. The product name is displayed at substantially the center of the metal lid, and a lot number, oscillator information, vibrator information, and the like are displayed by marking a required position on the periphery of the metal lid. Display method of the piezoelectric oscillator. A display method of a piezoelectric oscillator comprising: a package main body that houses a piezoelectric vibration element and an IC component; and at least a metal lid for enclosing the piezoelectric vibration element,
2. The product name is displayed at substantially the center of the metal lid, and a lot number, oscillator information, vibrator information, and the like are displayed by marking a required position on the periphery of the metal lid. Display method of the piezoelectric oscillator. 4. The display method for a piezoelectric oscillator according to claim 1, wherein a laser is used as the display means.

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