JP2006139379A - Non-contact communication medium - Google Patents

Non-contact communication medium Download PDF

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JP2006139379A
JP2006139379A JP2004326409A JP2004326409A JP2006139379A JP 2006139379 A JP2006139379 A JP 2006139379A JP 2004326409 A JP2004326409 A JP 2004326409A JP 2004326409 A JP2004326409 A JP 2004326409A JP 2006139379 A JP2006139379 A JP 2006139379A
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chip
sheet substrate
communication medium
contact communication
data
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Yoshiki Takei
芳樹 武居
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the possibility of the occurrence of damage at a wiring portion to an IC chip even when a non-contact communication medium is pasted on a curved surface. <P>SOLUTION: The IC chip CP is flip-chip mounted on a sheet substrate SB with face up, having the wiring portion connecting an active face of the IC chip CP with a conductive pattern formed on the sheet substrate SB formed thereon. On the sheet substrate SB, there is provided a protruded stripe GB which extends along the direction intersecting with an extended line of one side of the IC chip CP on which the wiring portion is formed, when viewed as a plane, and also extends from an end portion of the above conductive pattern side in the wiring portion of the above one side to a position on the opposite side, striding over the above extended line, so as not to be overlaid with the IC chip CP and the above wiring portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、データの授受を非接触で行うＲＦＩＤ（Radio Frequency IDentification）システムにおける非接触通信媒体に関し、特に、曲面に貼り付けて使用するのに好適な非接触通信媒体に関する。   The present invention relates to a non-contact communication medium in an RFID (Radio Frequency IDentification) system that performs data transfer in a non-contact manner, and more particularly to a non-contact communication medium suitable for use by being attached to a curved surface.

近年、リーダライタと非接触通信媒体との間で、電磁波を介して非接触でデータの授受を行うＲＦＩＤシステムが普及してきている。例えば、非接触通信媒体を物品に貼り付けて、ＲＦＩＤシステムを物流管理に活用し、効率化が図られているケースもある。
このＲＦＩＤシステムでは、非接触通信媒体の所持者が非接触通信媒体に格納されているデータの内容を把握するには、リーダライタや専用の読み取り機器に非接触通信媒体に格納されているデータを読み取らせなければならなかった。そこで、データの内容を表示する表示部を備えるなど、非接触通信媒体の多機能化が進んできている。 In recent years, RFID systems that exchange data in a contactless manner via electromagnetic waves between a reader / writer and a contactless communication medium have become widespread. For example, in some cases, a non-contact communication medium is attached to an article, and an RFID system is used for physical distribution management to improve efficiency.
In this RFID system, in order for the holder of the non-contact communication medium to grasp the contents of the data stored in the non-contact communication medium, the data stored in the non-contact communication medium is stored in a reader / writer or a dedicated reading device. I had to read it. Therefore, multi-functionalization of non-contact communication media is progressing, such as having a display unit for displaying data contents.

非接触通信媒体の多機能化の例としては、従来、非接触通信媒体に格納されているデータの内容を表示する表示部を備えたＩＣカードが知られている（例えば、特許文献１参照）。
特開２００３−２７１９１１号公報 As an example of multi-functionality of a non-contact communication medium, conventionally, an IC card including a display unit that displays the contents of data stored in the non-contact communication medium is known (for example, see Patent Document 1). .
JP 2003-271911 A

しかしながら、非接触通信媒体に多機能を求めると、上記特許文献１に示されるＩＣカードのように、表示部を駆動するドライバが必要になるなど、ＩＣチップの大型化を招くことになる。これは、図９（ａ）に示すように、上述した非接触通信媒体を物品に貼り付ける際に、ＩＣチップＣＰと基板ＢＤ上の導電パターンとの間をワイヤボンディングで結線した結線部ＫＢが破損しやすくなるという課題となる。すなわち、ＩＣチップＣＰが大きくなると、図９（ａ）のＡ部拡大図である図９（ｂ）に示すように、基板ＢＤの変形量が大きくなるためである。なお、この図９（ｂ）において、破線は、ＩＣチップの大きさが小さい場合の結線部ＫＢ及び変形した基板ＢＤを示す。
本発明は、上記課題を解決するためになされたものであり、曲面に貼り付けてもＩＣチップへの結線部に損傷が発生する可能性を低減することができる非接触通信媒体を提供することを目的とする。 However, when multifunctional functions are required for a non-contact communication medium, an IC chip is increased in size, such as a driver for driving the display unit as in the IC card disclosed in Patent Document 1. As shown in FIG. 9A, when the non-contact communication medium described above is affixed to an article, the connection part KB connecting the IC chip CP and the conductive pattern on the substrate BD by wire bonding is used. It becomes the subject that it becomes easy to break. That is, when the IC chip CP is increased, the deformation amount of the substrate BD is increased as shown in FIG. 9B, which is an enlarged view of the portion A in FIG. 9A. In FIG. 9B, the broken line indicates the connection part KB and the deformed substrate BD when the size of the IC chip is small.
The present invention has been made to solve the above-described problem, and provides a non-contact communication medium that can reduce the possibility of damage to a connection portion to an IC chip even when pasted on a curved surface. With the goal.

上記課題を解決するために、本発明に係る非接触通信媒体は、リーダライタから送信される所定周波数の電磁波を受けて電磁誘導により電力を生成してデータの授受を行う非接触通信媒体であって、誘電体からなるシート基板を備え、該シート基板に、前記電磁波の送受信を行うアンテナコイルと、該アンテナコイルに接続され、前記所定周波数の電磁波を介して授受される前記データを処理するデータ処理部を有するＩＣチップと、を備え、前記ＩＣチップは、前記シート基板にフェイスアップでフリップチップ実装されているとともに、当該ＩＣチップの能動面と前記シート基板に形成された導体パターンとを接続する結線部が形成され、前記シート基板には、平面視で前記ＩＣチップの前記結線部が形成されている一辺の延長線とは交差する方向に沿って延びるとともに、当該一辺の前記結線部における前記導体パターン側の端部よりさらに外側の位置から前記延長線を跨いで逆側の位置に亘り、且つ前記ＩＣチップ及び前記結線部とは重ならないように、突条部が設けられていることを特徴とする。
上記の構成によれば、シート基板に設けられる突条部は、平面視でＩＣチップの結線部が形成されている一辺の延長線とは交差する方向に沿って延びる。また、この突条部は、結線部の導体パターン側の端部よりさらに外側の位置からその延長線の逆側の位置に亘って延びている。さらに、この突条部は、ＩＣチップ及び結線部とは重ならないように設けられている。 In order to solve the above problems, a non-contact communication medium according to the present invention is a non-contact communication medium that receives electromagnetic waves of a predetermined frequency transmitted from a reader / writer, generates electric power by electromagnetic induction, and transfers data. And an antenna coil that transmits and receives the electromagnetic wave to the sheet substrate, and data that processes the data that is connected to the antenna coil and exchanged via the electromagnetic wave of the predetermined frequency. An IC chip having a processing unit, and the IC chip is flip-chip mounted face-up on the sheet substrate, and connects an active surface of the IC chip and a conductor pattern formed on the sheet substrate A connecting portion is formed, and the sheet substrate intersects with an extension line on one side where the connecting portion of the IC chip is formed in a plan view. And extending along the direction to extend from the end on the conductor pattern side of the connection part of the one side to the position on the opposite side across the extension line, and the IC chip and the connection part. The protrusions are provided so as not to overlap.
According to said structure, the protrusion part provided in a sheet | seat board | substrate extends along the direction which cross | intersects the extended line of the one side in which the connection part of IC chip is formed by planar view. Moreover, this protrusion part is extended over the position on the opposite side of the extension line from the position further outside the edge part by the side of the conductor pattern of a connection part. Further, the protruding portion is provided so as not to overlap the IC chip and the connecting portion.

上記により、非接触通信媒体を上記延長線とは交差する方向に湾曲させても、突条部の剛性によってシート基板の結線部での屈折が抑制され、結線部に損傷が発生する可能性を低減することができる。
また、本発明に係る非接触通信媒体において、前記突条部は、平面視で前記ＩＣチップの全周を囲むように、環状に設けられていることを特徴とする非接触通信媒体を提供する。 According to the above, even if the non-contact communication medium is curved in a direction intersecting with the extension line, refraction at the connection portion of the sheet substrate is suppressed by the rigidity of the protrusion, and the connection portion may be damaged. Can be reduced.
In the non-contact communication medium according to the present invention, there is provided the non-contact communication medium, wherein the protrusion is provided in an annular shape so as to surround the entire circumference of the IC chip in plan view. .

上記により、突条部がＩＣチップの全周を囲むように環状に設けられているため、非接触通信媒体を種々の方向に湾曲させても、その方向に沿った結線部の損傷の発生を軽減することができる。
また、本発明に係る非接触通信媒体において、前記ＩＣチップは、平面視で四角形状であり、該四角形状の四辺のそれぞれに前記結線部が形成され、前記突条部は、前記ＩＣチップの前記四辺のそれぞれに対応して設けられているとともに、前記四辺のそれぞれに対応する前記突条部が互いに接続されて全体で平面視口字形となっていることを特徴とする非接触通信媒体を提供する。
上記により、突条部は、ＩＣチップの四辺のそれぞれに対応する前記突条部が互いに一体となり、平面視で口字形状を有する。従って、非接触通信媒体の種々の方向の湾曲に対しても、ＩＣチップの四辺すべての結線部を補強することが可能となる。
また、本発明に係る非接触通信媒体において、前記突条部は、前記シート基板に貼り付けられた板状の補強部材であることを特徴とする非接触通信媒体を提供する。
上記により、突条部を、補強部材をシート基板に貼り付けた簡易な構成とすることができる。
また、本発明に係る非接触通信媒体において、前記シート基板には、前記ＩＣチップの前記能動面と前記導電パターンとの間に、該能動面から該導電パターンにつながるスロープが形成され、前記結線部は、液滴吐出装置によって前記スロープを経て吐出された金属インクで形成されていることを特徴とする非接触通信媒体を提供する。
上記により、結線部は、ＩＣチップの能動面及び導体パターン間をつなぐスロープ上に、金属インクを液滴吐出装置で吐出させて形成されている。つまり、シート基板上に設けられる突条部とともに、スロープも結線部を補強するため、結線部における損傷の発生を一層軽減することが可能となる。 As described above, since the protruding portion is provided in an annular shape so as to surround the entire circumference of the IC chip, even if the non-contact communication medium is curved in various directions, the connection portion along the direction is not damaged. Can be reduced.
Further, in the non-contact communication medium according to the present invention, the IC chip has a quadrangular shape in a plan view, and the connection portion is formed on each of the four sides of the quadrangular shape. A non-contact communication medium that is provided corresponding to each of the four sides, and that the protrusions corresponding to each of the four sides are connected to each other to form a square shape in plan view as a whole. provide.
As described above, the protruding portion has a square shape in plan view, with the protruding portions corresponding to each of the four sides of the IC chip being integrated with each other. Therefore, it is possible to reinforce all the connection parts of the four sides of the IC chip even when the non-contact communication medium is curved in various directions.
Moreover, the non-contact communication medium which concerns on this invention WHEREIN: The said protrusion is a plate-shaped reinforcement member affixed on the said sheet | seat board | substrate, The non-contact communication medium characterized by the above-mentioned is provided.
According to the above, the protruding portion can have a simple configuration in which the reinforcing member is attached to the sheet substrate.
In the non-contact communication medium according to the present invention, the sheet substrate is provided with a slope connected to the conductive pattern from the active surface between the active surface of the IC chip and the conductive pattern, and the connection The section provides a non-contact communication medium, characterized in that the section is formed of metal ink ejected through the slope by a droplet ejection device.
As described above, the connection portion is formed by discharging the metal ink with the droplet discharge device on the slope connecting the active surface of the IC chip and the conductor pattern. That is, since the slope also reinforces the connection portion together with the protruding portion provided on the sheet substrate, it is possible to further reduce the occurrence of damage in the connection portion.

本発明の実施形態を、曲げて使用することができる表示機能付きＲＦＩＤラベル（以下ＲＦＩＤラベルと称す）を例に、図面に基づいて説明する。
本発明の実施形態におけるＲＦＩＤラベル１は、曲げた状態での斜視図である図１に示すように、シート基板ＳＢに、アンテナコイルＡＴと、コンデンサＣＡと、ＩＣチップＣＰと、表示部ＤＰと、補強板ＧＢと、保護シートとを備えて構成されている。なお、ＲＦＩＤラベル１の表面を覆って上記の各構成を保護し、且つ十分な可撓性を有する保護シートについては、図示及び説明を省略する。 An embodiment of the present invention will be described with reference to the drawings, taking as an example an RFID label with a display function (hereinafter referred to as an RFID label) that can be bent and used.
As shown in FIG. 1 which is a perspective view in a bent state, the RFID label 1 in the embodiment of the present invention includes an antenna coil AT, a capacitor CA, an IC chip CP, a display unit DP, and a sheet substrate SB. The reinforcing plate GB and a protective sheet are provided. In addition, illustration and description are abbreviate | omitted about the protection sheet which covers the surface of RFID label 1 and protects said each structure, and has sufficient flexibility.

ここで、上記の各構成について詳細を説明する。
シート基板ＳＢは、平面図である図２（ａ）に示すように、図２（ａ）で見て、縦及び横の長さがそれぞれ約５４ｍｍ、約８５ｍｍに設定され、ＩＳＯ規格に準拠した平面サイズを有している。このシート基板ＳＢは、例えば、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリイミド、ポリエステル等の誘電体からなる材料で構成され、十分な可撓性が得られるように、厚さが約２５μｍに設定されている。 Here, the details of each of the above-described configurations will be described.
As shown in FIG. 2A, which is a plan view of the sheet substrate SB, the vertical and horizontal lengths are set to about 54 mm and about 85 mm, respectively, as shown in FIG. It has a planar size. The sheet substrate SB is made of a material made of a dielectric material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, polyester, etc., and has a thickness of about enough to obtain sufficient flexibility. It is set to 25 μm.

アンテナコイルＡＴは、図２（ａ）に示すように、シート基板ＳＢの一方の面ＳＢ１上に、導体パターンＰＴがシート基板ＳＢの外周に沿ってコイル状に形成された構成を有している。このアンテナコイルＡＴは、外部から電磁波を受信すると、この電磁波を電磁誘導によって、受信した電磁波の周波数と同等の周波数を有する交流電流に変換する。なお、この図２において、シート基板ＳＢに形成される導体パターンＰＴにハッチングを施して図示した。また、この導体パターンＰＴは、プリント配線技術やエッチング技術などにより形成される。   As shown in FIG. 2A, the antenna coil AT has a configuration in which a conductor pattern PT is formed in a coil shape along the outer periphery of the sheet substrate SB on one surface SB1 of the sheet substrate SB. . When receiving an electromagnetic wave from the outside, the antenna coil AT converts the electromagnetic wave into an alternating current having a frequency equivalent to the frequency of the received electromagnetic wave by electromagnetic induction. In FIG. 2, the conductor pattern PT formed on the sheet substrate SB is hatched. The conductor pattern PT is formed by a printed wiring technique or an etching technique.

コンデンサＣＡは、図２（ａ）及び底面図である図２（ｂ）に示すように、シート基板ＳＢの一方の面ＳＢ１上で、アンテナコイルＡＴの最内周の端部に接続され、シート基板ＳＢの他方の面ＳＢ２上で、ビアホールＶＨ１を介してアンテナコイルＡＴの最外周の端部に接続されている。つまり、コンデンサＣＡは、一対の導体パターンＰＴが誘電体であるシート基板ＳＢを挟んで対向するように形成され、コンデンサを構成している。   The capacitor CA is connected to the innermost end of the antenna coil AT on one surface SB1 of the sheet substrate SB as shown in FIG. On the other surface SB2 of the substrate SB, it is connected to the outermost end of the antenna coil AT via a via hole VH1. That is, the capacitor CA is formed so that the pair of conductor patterns PT are opposed to each other with the sheet substrate SB that is a dielectric interposed therebetween, and constitutes a capacitor.

そして、アンテナコイルＡＴ及びコンデンサＣＡは、互いに並列に接続されて共振回路を構成している。
ＩＣチップＣＰは、図２（ａ）に示すように、四角形状を有しており、アンテナコイルＡＴの内側でシート基板ＳＢの一方の面ＳＢ１上に配設されている。また、このＩＣチップＣＰは、図２（ａ）で見て、シート基板ＳＢを縦及び横の中心線で区切った第四象限の中に配設されている。すなわち、シート基板ＳＢの縦及び横の中心線を避けて、ＩＣチップＣＰが配設されている。 The antenna coil AT and the capacitor CA are connected in parallel to each other to form a resonance circuit.
As shown in FIG. 2A, the IC chip CP has a quadrangular shape, and is disposed on one surface SB1 of the sheet substrate SB inside the antenna coil AT. Further, the IC chip CP is disposed in a fourth quadrant in which the sheet substrate SB is divided by vertical and horizontal center lines as seen in FIG. That is, the IC chip CP is disposed avoiding the vertical and horizontal center lines of the sheet substrate SB.

そして、アンテナコイルＡＴの最外周の端部及び最内周の端部が導体パターンＰＴを介して、ＩＣチップＣＰに接続されている。なお、アンテナコイルＡＴの最外周の端部は、導体パターンＰＴがビアホールＶＨ１及びＶＨ２を介してシート基板ＳＢの他方の面ＳＢ２上でアンテナコイルＡＴをまたいで、ＩＣチップＣＰに接続されている。
このＩＣチップＣＰは、図２（ａ）中のＢ−Ｂ断面図である図３（ａ）に示すように、図３（ａ）で見て、シート基板ＳＢの一方の面ＳＢ１上に、能動面ＡＰを上に向けてアンダーフィル材ＡＦによって固定されている。つまり、ＩＣチップＣＰは、フェイスアップでフリップチップ実装されている。なお、この図３では、構成をわかりやすく示すため、各構成の厚みを誇張して図示している。 The outermost end and the innermost end of the antenna coil AT are connected to the IC chip CP via the conductor pattern PT. At the outermost end of the antenna coil AT, the conductor pattern PT is connected to the IC chip CP across the antenna coil AT on the other surface SB2 of the sheet substrate SB via the via holes VH1 and VH2.
As shown in FIG. 3A which is a BB cross-sectional view in FIG. 2A, the IC chip CP is formed on one surface SB1 of the sheet substrate SB as seen in FIG. The active surface AP faces upward and is fixed by the underfill material AF. That is, the IC chip CP is flip-chip mounted face up. In FIG. 3, the thickness of each component is exaggerated for easy understanding.

また、ＩＣチップＣＰは、能動面ＡＰとは反対側の面が研削加工されることによって、その全体の厚みが６０μｍに形成されている。
ＩＣチップＣＰの厚みは、ＩＣチップＣＰの曲げやすさ及び曲げ応力の低減という観点から６０μｍ以下に設定されることが好ましいが、ＩＣチップＣＰのハンドリングや実装の困難性という観点から１０μｍを下回らないことが望ましい。つまり、ＩＣチップＣＰは、厚みが１０μｍ未満では、ハンドリングが極めて困難となり、シート基板ＳＢへの実装の際に多くの破損をともない、量産性が乏しくなる。 Further, the entire surface of the IC chip CP is formed to 60 μm by grinding the surface opposite to the active surface AP.
The thickness of the IC chip CP is preferably set to 60 μm or less from the viewpoint of bendability of the IC chip CP and reduction of bending stress, but it is not less than 10 μm from the viewpoint of handling and mounting difficulty of the IC chip CP. It is desirable. That is, if the thickness of the IC chip CP is less than 10 μm, handling becomes extremely difficult, and many IC chips CP are damaged when mounted on the sheet substrate SB, resulting in poor mass productivity.

また、ＩＣチップＣＰの能動面ＡＰと各導体パターンＰＴとは、図３（ａ）のＤ部詳細図である図３（ｂ）に示すように、スロープＳＬによって段差が緩和されている。
このスロープＳＬは、エポキシ系の絶縁性樹脂材をディスペンサで、ＩＣチップＣＰの端面を被覆するように、且つＩＣチップＣＰから外方向に下がる傾斜面を形成するように塗布して形成される。また、ＩＣチップＣＰの厚みが薄い場合には、液滴吐出装置で吐出して形成してもよい。このスロープＳＬは、ＩＣチップＣＰの能動面ＡＰと各導体パターンＰＴとの段差を緩和するとともに、ＩＣチップＣＰに形成されている内部配線の側面における露出部を覆って保護する機能も持つ。 Further, the step between the active surface AP of the IC chip CP and each conductor pattern PT is relaxed by the slope SL, as shown in FIG.
The slope SL is formed by applying an epoxy-based insulating resin material with a dispenser so as to cover the end surface of the IC chip CP and to form an inclined surface that descends outward from the IC chip CP. Further, when the IC chip CP is thin, it may be formed by discharging with a droplet discharge device. The slope SL has a function of relaxing the step between the active surface AP of the IC chip CP and each conductor pattern PT and covering and protecting the exposed portion on the side surface of the internal wiring formed on the IC chip CP.

そして、ＩＣチップＣＰの能動面ＡＰと各導体パターンＰＴとは、図３（ｂ）に示すように、スロープＳＬ上を経て液滴吐出装置から吐出された導電性を有する金属インクによって形成された結線部ＫＢによって接続されている。
導電性を有する金属インクは、金、銀、銅、アルミニウムなどの導電性が良好な金属を主体として構成され、吐出された後に、シート基板ＳＢがポリイミドであれば２００℃の大気環境下で３０分程度、シート基板ＳＢがポリエチレンテレフタレート（ＰＥＴ）であれば１２０℃の大気環境下で３０分程度、シート基板ＳＢがポリエチレンナフタレート（ＰＥＮ）であれば１５０℃の大気環境下で３０分程度、焼成を行うことによって、形状が安定する。 Then, as shown in FIG. 3B, the active surface AP of the IC chip CP and each conductor pattern PT are formed by conductive metal ink discharged from the droplet discharge device via the slope SL. It is connected by the connection part KB.
The conductive metal ink is composed mainly of a metal having good conductivity such as gold, silver, copper, and aluminum, and is 30 in an atmospheric environment of 200 ° C. if the sheet substrate SB is polyimide after being discharged. If the sheet substrate SB is polyethylene terephthalate (PET), about 30 minutes in an atmospheric environment of 120 ° C. If the sheet substrate SB is polyethylene naphthalate (PEN), about 30 minutes in an atmospheric environment of 150 ° C. By firing, the shape is stabilized.

表示部ＤＰは、図２（ａ）に示すように、アンテナコイルＡＴの内側でシート基板ＳＢの一方の面ＳＢ１上に配設されている。また、この表示部ＤＰは、図２（ａ）で見て、シート基板ＳＢを、横方向に延びる中心線で上下に区切ったときの上半分の領域内に配設されている。
この表示部ＤＰは、電気泳動表示素子ＥＰを備えてセグメント表示を行うものであり、図３（ａ）に示すように、ＩＴＯ（Indium Tin Oxide）電極膜を備える透明電極ＴＤと導体パターンＰＴで形成されたセグメント電極ＳＧとで電気泳動表示素子ＥＰを挟んだ構成を有している。 As shown in FIG. 2A, the display unit DP is disposed on one surface SB1 of the sheet substrate SB inside the antenna coil AT. Further, as shown in FIG. 2A, the display portion DP is disposed in an upper half region when the sheet substrate SB is divided vertically by a center line extending in the horizontal direction.
The display unit DP includes an electrophoretic display element EP to perform segment display. As shown in FIG. 3A, the display unit DP includes a transparent electrode TD including an ITO (Indium Tin Oxide) electrode film and a conductor pattern PT. The electrophoretic display element EP is sandwiched between the formed segment electrodes SG.

また、表示部ＤＰは、透明電極ＴＤと電気泳動表示素子ＥＰとを重ねた厚みが１２０μｍに設定されている。透明電極ＴＤと電気泳動表示素子ＥＰとを重ねた厚みは、ＩＣチップＣＰの厚みの設定理由と同様の理由から、１０μｍ以上に設定されることが望ましい。
セグメント電極ＳＧ及び透明電極ＴＤは、導体パターンＰＴを介して、上記の液滴吐出装置から吐出された金属インクで形成された結線部ＫＢによって、ＩＣチップＣＰの能動面ＡＰに接続されている。 In addition, the display portion DP is set to have a thickness of 120 μm where the transparent electrode TD and the electrophoretic display element EP are overlapped. The thickness where the transparent electrode TD and the electrophoretic display element EP are overlapped is desirably set to 10 μm or more for the same reason as that for setting the thickness of the IC chip CP.
The segment electrode SG and the transparent electrode TD are connected to the active surface AP of the IC chip CP through a conductor pattern PT by a connection portion KB formed of the metal ink discharged from the droplet discharge device.

なお、結線部ＫＢは、図２（ａ）で見て、四角形状を有するＩＣチップＣＰの四辺のそれぞれに形成されている。しかし、図２では、構成をわかりやすく示すため、表示部ＤＰとＩＣチップＣＰとを接続する導体パターンＰＴの数量を減じて図示している。すなわち図２では、ＩＣチップＣＰの四辺のうち、図２（ａ）で見て、左側の辺及び下側の辺に形成されている結線部ＫＢと、これにつながる導体パターンＰＴとを省略して図示している。   In addition, the connection part KB is formed in each of four sides of IC chip CP which has square shape seeing in Fig.2 (a). However, in FIG. 2, the number of conductor patterns PT that connect the display unit DP and the IC chip CP is reduced in order to easily show the configuration. That is, in FIG. 2, among the four sides of the IC chip CP, the connection part KB formed on the left side and the lower side as seen in FIG. 2A and the conductor pattern PT connected thereto are omitted. Are shown.

補強板ＧＢは、図２（ａ）に示すように、外周が四角形状である板状体にＩＣチップＣＰの外形より大きい四角穴が形成され、口字形状を有している。
そして、補強板ＧＢは、口字形状の内周がＩＣチップＣＰの外周を囲むように、シート基板ＳＢの一方の面ＳＢ１に、導体パターンＰＴの上から接着固定されている。この補強板ＧＢは、図２（ａ）中のＣ部詳細図である図４に示すように、四角穴の大きさが、この四角穴の形状で結線部ＫＢのすべてを囲むことができる大きさに設定されており、ＩＣチップＣＰ、スロープＳＬ及び結線部ＫＢに重ならないように配設されている。なお、この図４では、構成をわかりやすく示すため、結線部ＫＢにハッチングを施して図示した。 As shown in FIG. 2A, the reinforcing plate GB has a square shape in which a square hole larger than the outer shape of the IC chip CP is formed in a plate-like body having a rectangular outer periphery.
The reinforcing plate GB is bonded and fixed to the one surface SB1 of the sheet substrate SB from above the conductor pattern PT so that the inner periphery of the square shape surrounds the outer periphery of the IC chip CP. As shown in FIG. 4 which is a detailed view of a portion C in FIG. 2A, the reinforcing plate GB has a size that allows the square hole to surround the entire connection portion KB in the shape of the square hole. It is set so that it does not overlap with the IC chip CP, the slope SL, and the connection part KB. In FIG. 4, the connecting portion KB is hatched for easy understanding of the configuration.

補強板ＧＢは、図３（ｂ）に示すように、ＩＣチップＣＰ及び補強板ＧＢのシート基板ＳＢの一方の面ＳＢ１からの高さが同等になるように、厚みが設定される。なお、図３では、補強板ＧＢとシート基板ＳＢとの間の接着層を省略して図示している。また、本実施形態では、アンダーフィル材ＡＦやＩＣチップＣＰの耐光処理等を考慮し、補強板ＧＢの厚みを約１００μｍに設定した。   As shown in FIG. 3B, the thickness of the reinforcing plate GB is set so that the heights of the IC chip CP and the reinforcing plate GB from the one surface SB1 of the sheet substrate SB are equal. In FIG. 3, the adhesive layer between the reinforcing plate GB and the sheet substrate SB is omitted. In the present embodiment, the thickness of the reinforcing plate GB is set to about 100 μm in consideration of the light resistance treatment of the underfill material AF and the IC chip CP.

補強板ＧＢの材料としては、ＲＦＩＤラベル１の可撓性が損なわれない範囲内で破断伸びが小さく引張強度が高い材料を選択することが望ましく、ポリエステル、セルローストリアセテート、延伸ポリプロピレンなどを採用することができる。
上述したＩＣチップＣＰは、ＲＦＩＤラベル１のブロック図である図５に示すように、データ受信部ＲＣと、データ送信部ＴＲと、電力生成部ＰＷと、データ記憶部ＭＲと、表示駆動部ＤＰＤと、データ制御部ＣＰＵとを有している。 As a material for the reinforcing plate GB, it is desirable to select a material having a small elongation at break and a high tensile strength within a range in which the flexibility of the RFID label 1 is not impaired, and polyester, cellulose triacetate, stretched polypropylene, etc. are adopted. Can do.
As shown in FIG. 5 which is a block diagram of the RFID label 1, the IC chip CP described above includes a data receiving unit RC, a data transmitting unit TR, a power generating unit PW, a data storage unit MR, and a display driving unit DPD. And a data control unit CPU.

データ受信部ＲＣは、アンテナコイルＡＴが受信した電磁波からデータを取り出し、このデータをデータ制御部ＣＰＵに送る。
データ送信部ＴＲは、データ制御部ＣＰＵからのデータ送信指令に基づいて、送信するデータを所定周波数の交流電流に変調し、アンテナコイルＡＴから電磁波として送信する。 The data receiving unit RC extracts data from the electromagnetic wave received by the antenna coil AT and sends this data to the data control unit CPU.
Based on a data transmission command from the data control unit CPU, the data transmission unit TR modulates data to be transmitted into an alternating current having a predetermined frequency, and transmits it as an electromagnetic wave from the antenna coil AT.

電力生成部ＰＷは、共振回路からの交流電流からＲＦＩＤラベル１が動作可能な電力を生成し、この電力をデータ制御部ＣＰＵに供給する。
データ記憶部ＭＲは、不揮発性のメモリ等で構成され、ＲＦＩＤラベル１が有する固有の識別ＩＤや、他のデータを記憶しておく。他のデータとしては、例えば、ＲＦＩＤラベル１がプリペイドカードに利用される場合には、プリペイド料金の残高であったり、運送荷物の物流管理に利用される場合には、配送先の情報や送り主の情報、割れ物、要冷蔵、要冷凍などの荷物の情報等であったりすることが想定される。 The power generation unit PW generates power that can operate the RFID label 1 from the alternating current from the resonance circuit, and supplies this power to the data control unit CPU.
The data storage unit MR is composed of a nonvolatile memory or the like, and stores a unique identification ID that the RFID label 1 has and other data. As other data, for example, when the RFID label 1 is used for a prepaid card, it is the balance of the prepaid fee, or when it is used for logistics management of the transported luggage, the information on the delivery destination or the sender's It may be information, information on cracks, refrigeration required, information on luggage such as refrigeration required.

表示駆動部ＤＰＤは、データ制御部ＣＰＵからのデータ表示指令に基づいて、表示部ＤＰを駆動させる。
データ制御部ＣＰＵは、データ送信部ＴＲ、データ記憶部ＭＲ及び表示駆動部ＤＰＤのそれぞれの動作を制御する。
ＲＦＩＤラベル１におけるデータの流れについて、図５に基づいて説明する。 The display drive unit DPD drives the display unit DP based on a data display command from the data control unit CPU.
The data control unit CPU controls operations of the data transmission unit TR, the data storage unit MR, and the display driving unit DPD.
The flow of data in the RFID label 1 will be described with reference to FIG.

図５に示すＲＦＩＤラベル１は、通信可能範囲内でリーダライタから所定周波数の電磁波が送信されると、アンテナコイルＡＴがこの電磁波を受信し、電磁誘導によって変換された交流電流がデータ受信部ＲＣ及び電力生成部ＰＷに送られる。
電力生成部ＰＷは、交流電流からＲＦＩＤラベル１が動作可能な電力を生成し、この電力をデータ制御部ＣＰＵに供給する。 In the RFID label 1 shown in FIG. 5, when an electromagnetic wave having a predetermined frequency is transmitted from the reader / writer within the communicable range, the antenna coil AT receives this electromagnetic wave, and the alternating current converted by electromagnetic induction is converted into the data receiving unit RC. And sent to the power generation unit PW.
The power generation unit PW generates power capable of operating the RFID label 1 from the alternating current, and supplies this power to the data control unit CPU.

データ受信部ＲＣは、交流電流を復調し、リーダライタから送信された電磁波に変調されていたデータを取り出してからこのデータをデータ制御部ＣＰＵに送る。
データ制御部ＣＰＵは、データ受信部ＲＣから受け取ったデータに基づいて、データ送信部ＴＲ、データ記憶部ＭＲ及び表示駆動部ＤＰＤに動作の指令を送る。例えば、データ受信部ＲＣから受け取ったデータが、リーダライタがＲＦＩＤラベル１に応答を呼びかける応答要求コマンドである場合には、データ記憶部ＭＲに格納されている識別ＩＤを読み込んで、この識別ＩＤをデータ送信指令とともにデータ送信部ＴＲに送る。 The data receiving unit RC demodulates the alternating current, takes out the data modulated by the electromagnetic wave transmitted from the reader / writer, and sends this data to the data control unit CPU.
The data control unit CPU sends an operation command to the data transmission unit TR, the data storage unit MR, and the display drive unit DPD based on the data received from the data reception unit RC. For example, when the data received from the data receiving unit RC is a response request command for the reader / writer to call for a response to the RFID label 1, the identification ID stored in the data storage unit MR is read, and this identification ID is read. It is sent to the data transmission unit TR together with the data transmission command.

データ送信部ＴＲは、データ送信指令に基づいて、識別ＩＤを所定周波数の交流電流に変調し、アンテナコイルＡＴから電磁波として送信する。
また、データ受信部ＲＣから受け取ったデータが、例えば、プリペイドカードの残高料金から所定料金を引き落とす指令である場合には、データ制御部ＣＰＵは、まず、データ記憶部ＭＲに格納されている残高料金データを読み込む。 Based on the data transmission command, the data transmission unit TR modulates the identification ID into an alternating current having a predetermined frequency and transmits it as an electromagnetic wave from the antenna coil AT.
Further, when the data received from the data receiving unit RC is, for example, a command for deducting a predetermined fee from the balance fee of the prepaid card, the data control unit CPU first stores the balance fee stored in the data storage unit MR. Read data.

次いで、データ制御部ＣＰＵは、読み込んだ残高料金データから所定料金を差し引いた値を新たな残高料金データとし、この新たな残高料金データをデータ記憶指令とともにデータ記憶部ＭＲに送る。
データ記憶部ＭＲは、データ制御部ＣＰＵからのデータ記憶指令に基づいて、新たな残高料金データを記憶する。 Next, the data control unit CPU uses the value obtained by subtracting a predetermined fee from the read balance fee data as new balance fee data, and sends this new balance fee data to the data storage unit MR together with the data storage command.
The data storage unit MR stores new balance fee data based on a data storage command from the data control unit CPU.

次いで、データ制御部ＣＰＵは、所定料金の引き落としが完了したことを示す完了データを、データ送信指令とともにデータ送信部ＴＲに送る。このとき、データ送信部ＴＲは、完了データを所定周波数の交流電流に変調し、アンテナコイルＡＴから電磁波として送信する。
次いで、データ制御部ＣＰＵは、表示部ＤＰを駆動させる表示指令を表示駆動部ＤＰＤに送り、表示部ＤＰに新たな残高料金を表示させる。 Next, the data control unit CPU sends completion data indicating that the deduction of the predetermined fee has been completed to the data transmission unit TR together with the data transmission command. At this time, the data transmission unit TR modulates the completion data into an alternating current having a predetermined frequency and transmits it as an electromagnetic wave from the antenna coil AT.
Next, the data control unit CPU sends a display command for driving the display unit DP to the display driving unit DPD, and causes the display unit DP to display a new balance fee.

また、ＲＦＩＤラベル１が運送荷物の物流管理に利用される場合には、識別ＩＤの送信とともに、配送先の情報や送り主の情報、割れ物、要冷蔵、要冷凍などの荷物の情報等を表示部ＤＰに表示させる。
なお、本実施形態において、ＲＦＩＤラベル１が非接触通信媒体に対応し、データ受信部ＲＣ及びデータ送信部ＴＲがデータ処理部に対応し、補強板ＧＢが補強部材としての突条部に対応している。

本実施形態によれば、ＩＣチップＣＰを６０μｍの厚みにまで薄くして構成しているため、ＩＣチップＣＰ自体にも可撓性が現れ、ＲＦＩＤラベル１を湾曲させたときに、ＲＦＩＤラベル１のＩＣチップＣＰの端部で発生する屈折を軽減させることが可能となるとともに、ＩＣチップＣＰ自体を湾曲させることが可能となる。 In addition, when the RFID label 1 is used for logistics management of transported goods, a display unit displays information on delivery destinations, information on senders, information on goods such as cracks, refrigeration required, and freezing as well as transmission of identification IDs. Display on DP.
In the present embodiment, the RFID label 1 corresponds to a non-contact communication medium, the data receiving unit RC and the data transmitting unit TR correspond to a data processing unit, and the reinforcing plate GB corresponds to a protrusion as a reinforcing member. ing.

According to this embodiment, since the IC chip CP is thinned to a thickness of 60 μm, the IC chip CP itself is flexible, and when the RFID label 1 is bent, the RFID label 1 The refraction generated at the end of the IC chip CP can be reduced, and the IC chip CP itself can be curved.

また、本実施形態によれば、ＩＣチップＣＰは、シート基板ＳＢに対して、フェイスアップでアンダーフィル材ＡＦを介してフリップチップ実装されている。従って、シート基板ＳＢを湾曲させると、ＩＣチップＣＰとアンダーフィル材ＡＦとが一体的に変形し、ＩＣチップＣＰをシート基板ＳＢの湾曲に倣うように変形させることが可能となる。
また、本実施形態によれば、シート基板ＳＢには、補強板ＧＢがＩＣチップＣＰを結線部ＫＢの外側から囲むように接着固定されているため、シート基板ＳＢを図６（ａ）のように湾曲させたとき、図６（ａ）中のＥ部詳細図である図６（ｂ）に示すように、シート基板ＳＢは、補強板ＧＢの外側端部で屈折する。従って、結線部ＫＢに大きなひずみが発生することを抑制することが可能となる。 Further, according to the present embodiment, the IC chip CP is flip-chip mounted on the sheet substrate SB with the face-up via the underfill material AF. Therefore, when the sheet substrate SB is curved, the IC chip CP and the underfill material AF are integrally deformed, and the IC chip CP can be deformed so as to follow the curvature of the sheet substrate SB.
Further, according to the present embodiment, since the reinforcing plate GB is bonded and fixed to the sheet substrate SB so as to surround the IC chip CP from the outside of the connection portion KB, the sheet substrate SB is as shown in FIG. 6B, which is a detailed view of the E portion in FIG. 6A, the sheet substrate SB is refracted at the outer end portion of the reinforcing plate GB. Therefore, it is possible to suppress the occurrence of a large strain in the connection part KB.

また、本実施形態によれば、補強板ＧＢは、シート基板ＳＢの平面の一部の領域に貼り付けられている。つまり、シート基板ＳＢは、シート基板ＳＢの平面の広い範囲が補強板ＧＢによって覆われるのではなく、一部の狭い範囲が覆われるだけである。従って、ＲＦＩＤラベル１の可撓性を十分に確保することが可能となる。また、補強板ＧＢは、ＩＣチップＣＰに重ならないように設けられるため、ＩＣチップＣＰ自体の可撓性を損なうことがない。   Further, according to the present embodiment, the reinforcing plate GB is attached to a partial region of the plane of the sheet substrate SB. That is, the sheet substrate SB is not covered with the reinforcing plate GB in a wide range of the plane of the sheet substrate SB, but only in a narrow range. Therefore, sufficient flexibility of the RFID label 1 can be ensured. Further, since the reinforcing plate GB is provided so as not to overlap the IC chip CP, the flexibility of the IC chip CP itself is not impaired.

上述したこれらの効果により、ＲＦＩＤラベル１を、種々の形状を有する物品に良好な状態で貼り付けることができ、且つ結線部ＫＢに損傷が発生する可能性を低減することができる。
また、本実施形態によれば、ＩＣチップＣＰの能動面ＡＰと導体パターンＰＴとの間に形成されたスロープＳＬ上に、結線部ＫＢが形成されている。従って、シート基板ＳＢ上に設けられる補強板ＧＢのみならず、スロープＳＬによっても結線部ＫＢが補強されることになり、結線部ＫＢに損傷が発生する可能性を一層低減することが可能となる。 Due to these effects described above, the RFID label 1 can be attached to an article having various shapes in a good state, and the possibility of damage to the connection portion KB can be reduced.
Further, according to the present embodiment, the connection portion KB is formed on the slope SL formed between the active surface AP of the IC chip CP and the conductor pattern PT. Accordingly, not only the reinforcing plate GB provided on the sheet substrate SB but also the connecting portion KB is reinforced by the slope SL, and the possibility that the connecting portion KB is damaged can be further reduced. .

また、本実施形態によれば、データ受信部ＲＣ、データ送信部ＴＲ、電力生成部ＰＷ、データ記憶部ＭＲ、表示駆動部ＤＰＤ及びデータ制御部ＣＰＵが、一つのＩＣチップＣＰ内に形成されている。従って、これらの各構成を個別の半導体装置で構成する場合に比較して、ＲＦＩＤラベル１を湾曲させたときに発生する屈折の箇所を低減することができ、一層良好な状態で物品に貼り付けることが可能となる。   Further, according to the present embodiment, the data receiving unit RC, the data transmitting unit TR, the power generating unit PW, the data storage unit MR, the display driving unit DPD, and the data control unit CPU are formed in one IC chip CP. Yes. Therefore, as compared with the case where each of these components is configured by individual semiconductor devices, the portion of refraction generated when the RFID label 1 is bent can be reduced, and it is attached to an article in a better state. It becomes possible.

また、本実施形態によれば、補強板ＧＢは、ＩＣチップＣＰ及び補強板ＧＢのシート基板ＳＢの一方の面ＳＢ１からの高さが同等になるように、厚みが設定されている。つまり、結線部ＫＢは、ＩＣチップＣＰと補強板ＧＢとによってこれらの間に形成される凹部内に収まる態様をなす。従って、補強板ＧＢは、結線部ＫＢの補強のみならず、物品の接触などからの結線部ＫＢの保護にも寄与する。   Further, according to the present embodiment, the thickness of the reinforcing plate GB is set so that the heights of the IC chip CP and the reinforcing plate GB from the one surface SB1 of the sheet substrate SB are equal. That is, the connection part KB is configured to be accommodated in a recess formed between the IC chip CP and the reinforcing plate GB. Therefore, the reinforcing plate GB contributes not only to the reinforcement of the connection portion KB, but also to the protection of the connection portion KB from contact with articles.

また、本実施形態によれば、表示部ＤＰが電気泳動表示素子ＥＰを備えて構成されているため、一旦表示が行われた後に表示部ＤＰへの電力の供給が断たれても、その表示内容が維持される。
また、本実施形態によれば、液滴吐出装置から吐出される金属インクによって、ＩＣチップＣＰの能動面ＡＰとシート基板ＳＢに形成されている導電パターンＰＴとが結線されている。つまり、このＩＣチップＣＰは、ワイヤボンディングやフェイスダウン実装などの際にかかる負荷を受けていない。従って、高い信頼性を有するＲＦＩＤラベル１を構成することが可能となる。また、能動面ＡＰと導電パターンＰＴとを結線する際に、ＩＣチップＣＰの破損に対して過剰に注意を払う必要がなく、ＲＦＩＤラベル１の製造方法や製造工程の効率化に寄与する。 In addition, according to the present embodiment, since the display unit DP is configured to include the electrophoretic display element EP, even if the supply of power to the display unit DP is interrupted after the display is once performed, the display is performed. Content is maintained.
Further, according to the present embodiment, the active surface AP of the IC chip CP and the conductive pattern PT formed on the sheet substrate SB are connected by the metal ink discharged from the droplet discharge device. That is, the IC chip CP is not subjected to a load applied during wire bonding or face-down mounting. Therefore, the RFID label 1 having high reliability can be configured. Further, when connecting the active surface AP and the conductive pattern PT, it is not necessary to pay excessive attention to the breakage of the IC chip CP, which contributes to the efficiency of the manufacturing method and manufacturing process of the RFID label 1.

また、本実施形態によれば、補強板ＧＢをシート基板ＳＢに貼り付けるという簡易な構成で結線部ＫＢを補強することができる。また、ＩＣチップＣＰのシート基板ＳＢへの実装及び結線部ＫＢの形成の後に補強板ＧＢを貼り付けることができるので、予めシート基板ＳＢに補強部材としての突条部を形成しておく場合に比較して、補強板ＧＢがＩＣチップＣＰの実装及び結線部ＫＢの形成の障害とはならず、既存の非接触通信媒体の製造方法や製造工程をそのまま活用することが可能となる。
なお、本実施形態では、補強板ＧＢの厚みを、ＩＣチップＣＰ及び補強板ＧＢのシート基板ＳＢの一方の面ＳＢ１からの高さが同等になるように設定するようにしたが、これに限定されず、補強板ＧＢの高さがＩＣチップＣＰの高さよりも高くなるように設定してもよい。この場合、ＩＣチップＣＰ及び結線部ＫＢを一層強く保護することが可能となる。 Moreover, according to this embodiment, the connection part KB can be reinforced with a simple configuration in which the reinforcing plate GB is attached to the sheet substrate SB. Further, since the reinforcing plate GB can be pasted after the IC chip CP is mounted on the sheet substrate SB and the connection portion KB is formed, when the protrusions as the reinforcing member are previously formed on the sheet substrate SB. In comparison, the reinforcing plate GB does not hinder the mounting of the IC chip CP and the formation of the connection portion KB, and it is possible to utilize the existing manufacturing method and manufacturing process of the non-contact communication medium as they are.
In the present embodiment, the thickness of the reinforcing plate GB is set so that the heights of the IC chip CP and the reinforcing plate GB from the one surface SB1 of the sheet substrate SB are equal. However, the present invention is not limited to this. Alternatively, the height of the reinforcing plate GB may be set to be higher than the height of the IC chip CP. In this case, the IC chip CP and the connection part KB can be further protected.

また、本実施形態では、四角穴が形成されて口字形状を有する補強板ＧＢを用いた場合を例に説明したが、補強板ＧＢはこれに限定されず、図７（ａ）に示すように、くの字形状を有する補強板ＧＢを、ＩＣチップＣＰの四隅のそれぞれに配設するようにしてもよい。このように構成すれば、左右及び上下に隣接する補強板ＧＢ同士間で、ＲＦＩＤレベル１の可撓性を向上させることが可能となる。   Further, in the present embodiment, the case where the reinforcing plate GB having the square shape formed with the square holes is used has been described as an example. However, the reinforcing plate GB is not limited to this, and as illustrated in FIG. In addition, a reinforcing plate GB having a square shape may be disposed at each of the four corners of the IC chip CP. If comprised in this way, it will become possible to improve the flexibility of RFID level 1 between the reinforcement boards GB adjacent on the left and right and up and down.

また、図７（ｂ）に示すように、短冊形に形成した補強板ＧＢを、結線部ＫＢの外側の位置に、ＩＣチップＣＰ及び結線部ＫＢとは重ならないように配設した構成としてもよい。このように構成すれば、補強板ＧＢの歩留りを向上させることが可能となる。
また、本実施形態では、ＩＣチップＣＰの平面視での四辺のすべてに結線部ＫＢが形成されている場合を例に説明したが、これに限定されず、結線部ＫＢが形成されている辺の数は、任意の数で構わない。 Further, as shown in FIG. 7B, the reinforcing plate GB formed in a strip shape may be arranged at a position outside the connection part KB so as not to overlap the IC chip CP and the connection part KB. Good. If comprised in this way, it will become possible to improve the yield of the reinforcement board GB.
In the present embodiment, the case where the connection parts KB are formed on all four sides of the IC chip CP in plan view is described as an example. However, the present invention is not limited to this, and the sides on which the connection parts KB are formed. Any number may be used.

例えば、ＩＣチップＣＰの結線部ＫＢが形成されている辺の数が一つであるとき、補強板ＧＢは、図８に示すように、右側の端部ＧＲが結線部ＫＢの導体パターンＰＴ側の端部ＫＲよりさらに右側に位置し、補強板ＧＢの左側の端部ＧＬが、ＩＣチップＣＰの結線部ＫＢが形成されている辺の延長線ＥＸよりさらに左側に位置するように配設されればよい。このように、ＩＣチップＣＰの結線部ＫＢが形成されている辺と、この結線部ＫＢを補強する補強板ＧＢとが対応付けられる。   For example, when the number of sides on which the connection part KB of the IC chip CP is formed is one, the reinforcing plate GB has a right end part GR on the conductor pattern PT side of the connection part KB as shown in FIG. The left end GL of the reinforcing plate GB is disposed further to the left of the extension line EX of the side where the connection part KB of the IC chip CP is formed. Just do it. In this way, the side where the connection part KB of the IC chip CP is formed is associated with the reinforcing plate GB that reinforces the connection part KB.

従って、ＩＣチップＣＰの結線部ＫＢが形成されている辺に対応して、補強板ＧＢを設けるようにすれば、結線部ＫＢが形成されている辺の数は限定されない。
また、図８に示す例では、必要に応じて、補強板ＧＢを、ＩＣチップＣＰを挟んだ上側に追加するようにしてもよい。
また、本実施形態では、アンテナコイルＡＴの巻き数を２ターンとしたが、これに限定されず、所定周波数での通信が可能な範囲で任意の巻き数にすることができる。 Therefore, if the reinforcing plate GB is provided corresponding to the side where the connection part KB of the IC chip CP is formed, the number of sides where the connection part KB is formed is not limited.
In the example shown in FIG. 8, the reinforcing plate GB may be added on the upper side of the IC chip CP as necessary.
In this embodiment, the number of turns of the antenna coil AT is two turns. However, the number of turns is not limited to this, and the number of turns can be set as long as communication at a predetermined frequency is possible.

また、本実施形態では、コンデンサＣＡの平面の面積が所定の値で固定された構成としたが、これに限定されず、導体パターンＰＴを切断するなどして平面の面積を可変とする構成としてもよい。このように構成すれば、共振周波数を効率的に微調整することが可能となる。
また、本実施形態では、アンテナコイルＡＴ及びコンデンサＣＡを含む導体パターンＰＴを、プリント配線技術やエッチング技術などによって形成した場合を例に説明したが、これに限定されず、金属インクを液滴吐出装置から吐出させて導体パターンＰＴを形成するようにしてもよい。この場合、導体パターンＰＴの形成及びＩＣチップＣＰの能動面ＡＰへの結線を一つの工程で実施することができ、ＲＦＩＤラベル１の製造工程の効率化が図られる。 In this embodiment, the area of the plane of the capacitor CA is fixed at a predetermined value. However, the present invention is not limited to this, and the area of the plane is variable by cutting the conductor pattern PT. Also good. With this configuration, the resonance frequency can be finely adjusted efficiently.
In the present embodiment, the case where the conductor pattern PT including the antenna coil AT and the capacitor CA is formed by a printed wiring technique, an etching technique, or the like has been described as an example. However, the present invention is not limited to this. The conductor pattern PT may be formed by discharging from the apparatus. In this case, the formation of the conductor pattern PT and the connection of the IC chip CP to the active surface AP can be performed in one process, and the manufacturing process of the RFID label 1 can be made more efficient.

また、本実施形態では、表示部ＤＰをセグメント電極ＳＧによってセグメント表示させるように構成したが、これに限定されず、マトリクス電極によってマトリクス表示をさせるように構成してもよい。   Further, in the present embodiment, the display unit DP is configured to perform segment display using the segment electrode SG. However, the present invention is not limited thereto, and the display unit DP may be configured to perform matrix display using the matrix electrode.

本発明の実施形態におけるＲＦＩＤラベルの斜視図。The perspective view of the RFID label in the embodiment of the present invention. 本発明の実施形態におけるＲＦＩＤラベルの主要構成を示す外観図。1 is an external view showing a main configuration of an RFID label according to an embodiment of the present invention. 本発明の実施形態におけるＲＦＩＤラベルの断面図。Sectional drawing of the RFID label in embodiment of this invention. 図２（ａ）中のＣ部を詳細に示す図。The figure which shows the C section in Fig.2 (a) in detail. 本発明の実施形態におけるＲＦＩＤラベルの主要部の制御のつながりを示すブロック図。The block diagram which shows the connection of control of the principal part of the RFID label in embodiment of this invention. 本発明の実施形態における効果を説明する図。The figure explaining the effect in embodiment of this invention. 本発明の実施形態における補強板の他の例を示す図。The figure which shows the other example of the reinforcement board in embodiment of this invention. 本発明の実施形態における補強板のさらに他の例を示す図。The figure which shows the further another example of the reinforcement board in embodiment of this invention. 従来技術における課題を説明する図。The figure explaining the subject in a prior art.

符号の説明Explanation of symbols

１…ＲＦＩＤラベル、ＳＢ…シート基板、ＡＴ…アンテナコイル、ＣＰ…ＩＣチップ、ＡＰ…能動面、ＰＴ…導体パターン、ＡＦ…アンダーフィル材、ＳＬ…スロープ、ＫＢ…結線部、ＲＣ…データ受信部、ＴＲ…データ送信部   DESCRIPTION OF SYMBOLS 1 ... RFID label, SB ... Sheet substrate, AT ... Antenna coil, CP ... IC chip, AP ... Active surface, PT ... Conductor pattern, AF ... Underfill material, SL ... Slope, KB ... Connection part, RC ... Data receiving part , TR ... Data transmitter

Claims (5)

リーダライタから送信される所定周波数の電磁波を受けて電磁誘導により電力を生成してデータの授受を行う非接触通信媒体であって、
誘電体からなるシート基板を備え、
該シート基板に、前記電磁波の送受信を行うアンテナコイルと、
該アンテナコイルに接続され、前記所定周波数の電磁波を介して授受される前記データを処理するデータ処理部を有するＩＣチップと、を備え、
前記ＩＣチップは、前記シート基板にフェイスアップでフリップチップ実装されているとともに、当該ＩＣチップの能動面と前記シート基板に形成された導体パターンとを接続する結線部が形成され、
前記シート基板には、平面視で前記ＩＣチップの前記結線部が形成されている一辺の延長線とは交差する方向に沿って延びるとともに、当該一辺の前記結線部における前記導体パターン側の端部よりさらに外側の位置から前記延長線を跨いで逆側の位置に亘り、且つ前記ＩＣチップ及び前記結線部とは重ならないように、突条部が設けられていることを特徴とする非接触通信媒体。 A non-contact communication medium that receives electromagnetic waves of a predetermined frequency transmitted from a reader / writer, generates electric power by electromagnetic induction, and exchanges data,
A sheet substrate made of a dielectric is provided,
An antenna coil for transmitting and receiving the electromagnetic wave to the sheet substrate;
An IC chip connected to the antenna coil and having a data processing unit for processing the data transmitted / received via the electromagnetic wave of the predetermined frequency,
The IC chip is flip-chip mounted face-up on the sheet substrate, and a connection portion for connecting the active surface of the IC chip and the conductor pattern formed on the sheet substrate is formed,
The sheet substrate extends along a direction intersecting with an extension line of one side where the connection part of the IC chip is formed in a plan view, and an end part on the conductor pattern side of the connection part of the one side A non-contact communication characterized in that a ridge portion is provided so as not to overlap the IC chip and the connection portion from a position further outside to the opposite position across the extension line. Medium. 前記突条部は、平面視で前記ＩＣチップの全周を囲むように、環状に設けられていることを特徴とする請求項１に記載の非接触通信媒体。   The non-contact communication medium according to claim 1, wherein the protrusion is provided in an annular shape so as to surround the entire circumference of the IC chip in a plan view. 前記ＩＣチップは、平面視で四角形状であり、該四角形状の四辺のそれぞれに前記結線部が形成され、
前記突条部は、前記ＩＣチップの前記四辺のそれぞれに対応して設けられているとともに、前記四辺のそれぞれに対応する前記突条部が互いに接続されて全体で平面視口字形となっていることを特徴とする請求項２に記載の非接触通信媒体。 The IC chip has a quadrangular shape in plan view, and the connection portion is formed on each of the four sides of the quadrilateral shape,
The protrusions are provided corresponding to the four sides of the IC chip, and the protrusions corresponding to the four sides are connected to each other to form a square shape in plan view. The contactless communication medium according to claim 2. 前記突条部は、前記シート基板に貼り付けられた板状の補強部材であることを特徴とする請求項１乃至３のいずれか一項に記載の非接触通信媒体。   The non-contact communication medium according to claim 1, wherein the protrusion is a plate-like reinforcing member attached to the sheet substrate. 前記シート基板には、前記ＩＣチップの前記能動面と前記導電パターンとの間に、該能動面から該導電パターンにつながるスロープが形成され、
前記結線部は、液滴吐出装置によって前記スロープを経て吐出された金属インクで形成されていることを特徴とする請求項１乃至４のいずれか一項に記載の非接触通信媒体。 On the sheet substrate, a slope connected from the active surface to the conductive pattern is formed between the active surface of the IC chip and the conductive pattern,
5. The non-contact communication medium according to claim 1, wherein the connection portion is formed of a metal ink ejected through the slope by a droplet ejection device.
JP2004326409A 2004-11-10 2004-11-10 Non-contact communication medium Withdrawn JP2006139379A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010140384A (en) * 2008-12-15 2010-06-24 Human Tech:Kk Rfid sheet with display function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010140384A (en) * 2008-12-15 2010-06-24 Human Tech:Kk Rfid sheet with display function

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