JP2006138745A - Substrate inspection method and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection method which eliminates a time loss from initialization processing for a rewritable memory when making an operation check on a substrate in which a processing device and the rewritable memory are installed. <P>SOLUTION: A substrate to be inspected 1 is connected to an inspection machine 2. On the basis of the connection, a mode detection means in the substrate to be inspected 1 detects an inspection mode, while a microcomputer 11 accesses an inspection-machine side EEPROM 23, not a substrate side EEPROM 12. A device equivalent to an electronic device comprising the inspection machine 2 and the substrate to be inspected 1 connected thereto is thereby started to make an operation check on the substrate to be inspected 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate inspection method and electronic equipment, and more particularly, a substrate inspection method for performing an operation check on a substrate equipped with an arithmetic processing unit and a rewritable memory, and an electronic device incorporating the substrate inspected by the method. Regarding equipment.

  A liquid crystal television has a step of performing an operation check inspection on a single substrate incorporated in the liquid crystal television on the production line. In this step, the inspection is carried out in the same manner as an actual liquid crystal television set. This step is performed on substrates of various electronic devices even if the target is not a liquid crystal television.

  Further, the same applies to an operation check on a board on which a rewritable memory such as a microcomputer (hereinafter referred to as a microcomputer) and an EEPROM (Electrically Erasable and Programmable Read Only Memory) are mounted. Conventionally, in the inspection of such a board, an equivalent to a set of electronic devices other than the board is prepared and the power is turned on for the first time after the board is incorporated into the set, but the memory on the board is completely new In this case, the data is not usable, and initialization is performed. After the initialization is performed, the power is turned on.

As a conventional technique related to board inspection, a printed circuit board inspection system and method for reducing the ROM capacity for an inspection program and making the inspection program flexible have been proposed (see, for example, Patent Document 1). ). In the technique described in Patent Document 1, an inspection program for inspecting resources necessary for receiving a program from an external inspection device, such as ROM, RAM, and IF, is stored in a ROM mounted on a printed circuit board. . When the printed circuit board is inspected, the external inspection device causes the ROM inspection program to be executed, and if normal, the inspection program for inspecting the entire printed circuit board is stored in the RAM and executed.
JP-A-10-313199

  However, the initialization process takes time, and a considerable time loss occurs when mass production is performed. For example, in a small liquid crystal display (LCD) incorporating a microcomputer and a board on which an EEPROM having a capacity of 16 to 64 KB is mounted, the initialization process takes several seconds for each board.

  As described above, in order to perform an operation check on a board equipped with an arithmetic processing unit such as a microcomputer and a rewritable memory, it is necessary to proceed with an inspection while performing initialization of the rewritable memory. Time loss due to processing is large, and as a result, time is required for inspection.

  The present invention has been made in view of the circumstances as described above, and it is possible to eliminate time loss due to initialization processing of the rewritable memory when checking the operation of the substrate on which the arithmetic processing device and the rewritable memory are mounted. It is an object of the present invention to provide a substrate inspection method and an electronic device incorporating a substrate inspected by the method.

The present invention is constituted by the following technical means in order to solve the above-described problems.
A first technical means is a substrate inspection method for performing an operation check on a substrate on which at least an arithmetic processing unit and a rewritable memory are mounted by connecting the substrate to an inspection machine as a substrate to be inspected, The inspection machine is an electronic device set including an inspection device side memory that is a memory having at least a capacity of the memory, and a portion of the electronic device into which the inspection substrate is to be incorporated, excluding at least the inspection substrate. The arithmetic processing unit for the substrate to be inspected includes a mode detecting unit for detecting an inspection mode, and the arithmetic processing unit accesses the inspector-side memory only when the mode detecting unit detects the inspection mode. And a setting means for setting to access a substrate-side memory that is a memory on the substrate to be inspected. An inspection board is connected, and based on the connection, mode detection means in the board to be inspected detects an inspection mode, and the arithmetic processing unit accesses the inspection machine side memory instead of the board side memory, and A device corresponding to the electronic device composed of a device set and the connected board to be inspected is activated to check the operation of the board to be inspected.

  The second technical means is characterized in that, in the first technical means, optimal data for executing the operation check is stored in advance in the inspection machine side memory.

  According to a third technical means, in the first technical means or the second technical means, the operation check includes a check of a plurality of check items, and the board inspection method is information on check items determined to be defective by the operation check. Is further stored as error result information in the memory of the substrate to be inspected.

  According to a fourth technical means, the method according to the third technical means further includes a step of repairing the inspected substrate storing the error result information.

  A fifth technical means is an electronic apparatus on which a substrate inspected by the substrate inspection method according to any one of the first to fourth technical means is mounted.

  The sixth technical means is the fifth technical means, characterized in that means for initializing the substrate-side memory is provided when the electronic device is first activated.

  According to the present invention, it is possible to eliminate time loss due to the initialization process of the rewritable memory when checking the operation of the substrate on which the arithmetic processing unit and the rewritable memory are mounted.

  A substrate to be inspected by the substrate inspection method according to the present invention is a substrate on which at least an arithmetic processing unit such as MCU (microcontroller unit) and a rewritable memory such as EEPROM are mounted, and finally a product. It is a substrate incorporated as a control unit of an electronic device. In addition, as an electronic device as a final product, various displays such as LCD and television receivers, as well as various recorders, copiers, multifunction peripherals, personal computers (PC) (for example, the board to be inspected becomes a motherboard), Various devices such as a mobile phone can be cited, and the present invention can be applied to the present invention regardless of the type or application.

  Here, the MCU is a processor such as a CPU (Central Processing Unit), a memory such as a ROM and a RAM (Random Access Memory), a peripheral device such as an I / O (input / output) interface, a timer controller, and their data. A microcomputer composed of a bus serving as a path, and will be exemplified as a microcomputer hereinafter. In the present invention, the rewritable memory mounted on the substrate to be inspected is a non-volatile memory for mainly storing setting data (control parameters) for controlling the arithmetic processing unit mounted on the same substrate to be inspected. Hereinafter, an EEPROM will be described as an example, but FLASH may be used as long as it is rewritable even with other EPROM. Note that this memory may store a part of the control program of the arithmetic processing unit depending on the electronic device on which the board is mounted.

  FIG. 1 is a schematic diagram showing a configuration example of a substrate inspection system for executing a substrate inspection method according to an embodiment of the present invention, in which 1 is a substrate to be inspected, 2 is an inspection machine, and 10 is a substrate. A side connector, 11 is a microcomputer, 12 is an EEPROM (board side EEPROM), 20 is an inspection machine side connector, 21 is an electronic device not including a board, 22 is a system controller, and 23 is an EEPROM (inspection machine side EEPROM).

  The substrate inspection method according to the present invention is a substrate inspection method in which an operation check is performed by connecting the substrate as described above to the inspection machine 2 as the substrate 1 to be inspected. In this substrate inspection method, an inspection device 2 equivalent to a set of electronic devices other than the substrate 1 is prepared, and the substrate 1 is assembled into the set (inspection device 2) and then the power is turned on. Even when the EEPROM 12 on the 1 is completely new, the microcomputer 11 is made to access the EEPROM 23 on the inspection machine 2 as will be described later, thereby eliminating the need for initialization during the inspection. A set equivalent to a set of electronic devices other than the substrate 1 means that a portion of the electronic device into which the substrate 1 to be inspected is to be incorporated, at least a portion excluding the substrate 1 to be inspected, and a capacity equal to or larger than the capacity of the substrate EEPROM 12. An electronic device set including at least an inspection machine side memory (illustrated by the inspection machine side EEPROM 23), which is a memory of the electronic device set. FIG. 1 shows an example in which a power supply unit 21c, a signal processing unit 21b, and a liquid crystal panel 21a are constituent elements of the electronic device 21 excluding at least the substrate 1, and in this example, the final product is a liquid crystal television. It becomes.

  The board 1 to be inspected includes at least a microcomputer 11 having a ROM (not shown) and a board-side EEPROM 12, and the devices between the microcomputer 11 and the board-side EEPROM 12 are, for example, an SCL (serial clock) terminal 11 b and an SDA (SDA). (serial data) Communication is performed by sharing only two signal lines of the terminal 11c as a bus. The microcomputer 11 can access the board-side EEPROM 12 from the two signal lines connected to these terminals 11b and 11c. In addition, the board 1 is connected to the inspection machine 2 by connecting the board-side connector 10 to the inspection machine-side connector 20, and the apparatus corresponding to the product of the electronic device is activated on both sides to execute the operation check of the board 1. Enable.

  The inspection machine 2 including the above-described electronic device set is connected to the board 1 by connecting the inspection machine side connector 20 and the board side connector 10, and transmits and receives video data and audio data and supplies power to the board 1. . Further, the inspection machine 2 includes a system controller 22 that is connected between the connectors 10 and 20 or connected by another path. The system controller 22 is connected to the terminals 11b and 11c of the microcomputer 11 and the terminal 11a for detecting the inspection mode, relays between the electronic device 21 not including the board 1 and the microcomputer 11 (board 1), and the microcomputer 11 described later. It is a controller that assists mode detection.

  The microcomputer 11 of the board 1 to be inspected includes a mode detection unit that detects an inspection mode (also referred to as an inspection machine mode) and an access setting unit that sets an EEPROM to be accessed. For example, a part of these means is stored in a ROM (not shown) in the microcomputer 11 so as to be executable as a program. The mode detection means provided in the microcomputer 11 may be realized by port detection as follows, for example. That is, the system controller 22 on the inspection machine 2 side is provided with two terminals for connecting to the two signal lines from the terminals 11b and 11c, and the board 1 is connected to the inspection machine 2 on the system controller 22 side. In other words, it is detected that the two terminals 11b and 11c of the microcomputer 11 are connected to the two terminals of the system controller 22, and the detection is notified to another terminal (mode detection terminal 11a) on the microcomputer 11 side. The microcomputer 11 detects the inspection mode. The mode detection unit may be a mode determination unit that determines the inspection mode and the normal mode, and the inspection mode only needs to be detected in some form.

  The access setting means described above is a means for setting the microcomputer 11 to access the inspection machine side EEPROM 23 only when the mode detection means detects the inspection mode, and to access the board side EEPROM 12 at other times (ie, normal time). It is. Here, the normal time refers to the time when the substrate 1 is incorporated into the electronic device 21 that does not include the substrate 1, is actually completed as a product, and the product is activated, and can be said to be a normal operation time.

  In the substrate inspection method according to the present invention, in the substrate inspection system configured as described above, first, the substrate to be inspected 1 is connected to the inspection machine 2, and based on the connection, the mode detecting means in the substrate to be inspected 1 sets the inspection mode. The microcomputer 11 accesses not the board-side EEPROM 12 but the inspection machine-side EEPROM 23, and activates an apparatus corresponding to the electronic apparatus constituted by the inspection machine 2 (electronic equipment set) and the board 1 to be inspected connected thereto. The operation check of the substrate 1 to be inspected is executed. Here, the content of the operation check (check items) and the number of items are not limited. Here, it is assumed that the inspection machine 2 has been checked for operation and that the operation check has been completed before the execution of the operation check here. In addition, an operation check such as a connection check between the microcomputer 11 and the board-side EEPROM 12 may be incorporated into the check items of the operation check here, or the operation check is checked independently before the operation check is executed here. You may leave as.

  FIG. 2 is a flowchart for explaining an example of a substrate inspection method according to an embodiment of the present invention. An example of the substrate inspection method by the substrate inspection system of FIG. It is the flowchart demonstrated centering on the main process procedures performed within the upper microcomputer.

  As described above, the present invention is incorporated in the substrate 1 in order to reduce time loss due to the weight during execution of the EEPROM initialization operation incorporated in the substrate 1 at the time of substrate operation check (operation checker inspection) in the production process. The normal mode / inspection mode determination function by the microcomputer 11 and an EEPROM having the same or larger ROM capacity as the EEPROM built in the substrate 1 are built in the inspection machine 2 (checker) side, and in the inspection mode (also called checker mode) By accessing the EEPROM (initialized) built in the checker, the initialization of the EEPROM built in the substrate 1 is not executed.

  As an example of processing inside the microcomputer 11, first, when the substrate 1 is connected to the inspection machine 2, the hardware reset (RESET) of the microcomputer 11 is released (step S1), and reset processing is performed. Then, an initial setting process inside the microcomputer 11 is performed (step S2).

  Next, the mode determination means determines whether or not the inspection mode is set (step S3). Here, the inspection mode is determined by a connection notification from the system controller 22 resulting from the connection (wiring) between the substrate 1 and the inspection machine 2, and the normal mode is determined without this notification. For example, the inspection port 2 (the system controller 22) controls the detection port so that the detection port becomes “H” in the normal state and “L” in the inspection mode. Accordingly, this notification is received by the substrate 1 (and the electronic apparatus including the substrate 1) that has been subjected to the substrate inspection in accordance with the substrate inspection method according to the present embodiment in the substrate inspection system having the configuration example described here. The port for use is shared with any of the other necessary ports, or is provided separately from the other necessary ports. It should be noted that the determination in step S3 needs to be performed first after the reset is canceled and before an access to the EEPROM described later is executed. This determination is performed only when the reset is cancelled, and the mode is maintained until the reset is performed again. Hold.

  Next, when the detection port is “L” based on the determination in step S3, the access setting means sets access to the inspection machine side EEPROM 23 built in the inspection machine 2 (step S4). ", The access to the board-side EEPROM 12 built in the board 1 to be inspected is set (step S5). At this time, for example, the slave address “A0h” is given as address information to the board-side EEPROM 12 and the slave address “A2h” is given to the inspection machine-side EEPROM 23, and the microcomputer 11 on the master side sets the access settings in the normal mode. The address information “A0h” representing the board-side EEPROM 12 may be sent out, and the address information “A2h” representing the inspection machine-side EEPROM 23 may be sent out in the checker mode. The board-side EEPROM 12 and the inspection machine-side EEPROM 23 can transmit and receive data only when the address information sent from the microcomputer 11 matches its own address.

  Regardless of which step of steps S4 and S5, the specific address data described later of the EEPROM is read and compared with the data inside the microcomputer 11 (in the ROM not shown) (step S6). The reading source of the specific address data in step S6 is the access destination set in steps S4 and S5, and is the inspection machine side EEPROM 23 in the inspection mode, and the substrate side EEPROM 12 in the normal mode.

  Following step S6, it is determined whether the models are the same (step S7) and whether the panel sizes are the same (step S8). In step S7, model determination is performed in step S6. For example, microcomputer part code information in the EEPROM is read, and the code information and the part code held in the ROM in the microcomputer 11 are transferred to an ASCII such as “A645”. It is good to carry out by comparing by code comparison or the like and determining the coincidence. The panel size determination (inch determination) in step S8 may be performed by comparing and determining the port setting and the information in the EEPROM in step S6.

  If it is determined that the model and panel size are the same, the process proceeds to the next process without executing initialization, and the operation check for each check item (in the inspection mode) or the normal operation (in the normal mode) is executed. (Step S10). After the operation check for the substrate 1 is completed, the substrate may be replaced with the next one, and the operation check may be performed by the same processing as steps S1 to S10.

  The operation check (good / bad determination) may be performed by executing an inspection program stored in the ROM in the microcomputer 11, the ROM in the system controller 22, or the inspection machine side EEPROM 23. Good. Alternatively, it is simply checked whether the electronic device is normally started up by incorporating the board 1, and then the state of the electronic device (for example, video input) is operated by an inspector's operation or an automatic operation program stored in one of them. And TV input) may be changed, and what is judged as good / bad by visual confirmation may be included. As a necessary inspection item, as a more typical example, the contents of a check such as whether or not a pattern (print pattern) from a certain place to a certain place on the substrate 1 is connected, and normally displayed on the screen, for example, input There are two types of check content: a check content indicating whether or not a video is properly displayed when a switching operation is performed. In addition, when there is a defective product, it is usually sent to a repair process.

  On the other hand, if it is determined in steps S7 and S8 that the model is not the same or the panel size is not the same, initialization of the entire area of the EEPROM is executed (step S9), and then the operation check of each check item (in the inspection mode) Alternatively, normal operation (in normal mode) is executed (step S10). The initialization process in step S9 is applied to the access destination EEPROM set in steps S4 and S5. The inspection machine side EEPROM 23 is initialized in the inspection mode, and the board side EEPROM 12 is initialized in the normal mode. Turn into.

  Here, the initialization process is a process of putting initial data such as necessary adjustment data and data for accurately projecting video in the case of a television into the EEPROM. The initialization process is basically a process to be finally executed for all areas of the EEPROM, and unless it is executed, the data to be sent to the IC in the television set is not optimal. Therefore, normally, when the EEPROM is completely new, for example, all “FF” is stored as data, and if the initialization process is not performed, the device may be damaged.

  In the inspection mode, at the beginning when the model to be produced is changed, it is determined in step S7 that the same model is not the same, that is, the comparison result in step S6 is inconsistent, and initialization of the entire area of the EEPROM (inspector-side EEPROM 23) is executed. Of course, it becomes coincident from the second unit of the same model, and it is not necessary to execute initialization. On the other hand, in the normal mode, when the power is turned on for the first time in the normal mode, the comparison result is always inconsistent, so the initialization of the EEPROM (substrate-side EEPROM 12) is always executed. Here, in the normal mode, the inch information or the like is referred to when the entire area of the EEPROM is initialized. However, in the inspection mode, the process of performing the entire area initialization differs depending on the difference in the inch information.

  The initial data usually includes adjustment data for electronic devices (here, LCD TVs) such as white balance, but such data is not data for each model (model or panel size), Each data. Therefore, when the circuit board 1 is started after being inspected and incorporated in the other electronic device 21, the comparison result in step S6 is inconsistent in the normal mode due to the presence of such adjustment data. Such a mode is referred to as an adjustment process mode, and adjustment data is written to the substrate-side EEPROM 12 by the initialization process in step S9. After that, that is, after the EEPROM initialization is executed, the initialization end display may be performed not in the adjustment process mode but in the user mode (a mode in which the comparison results match even in the normal mode). Note that after executing the EEPROM initialization, the power is turned on and the initialization end display is performed regardless of the mode. At this time, the state of the inspection mode / normal mode is maintained.

  Further, the EEPROM initialization is executed with an initial value suitable for the model and the panel size based on the result of determination in step S8. When adopting the same microcomputer 11 for the same model having different panel sizes, (1) setting by microcomputer port H / L, (2) setting by EEPROM specific address data (to be described later with reference to FIGS. 3 and 4) For example, a means for setting the size may be provided.

  In addition to the determinations in steps S7 and S8, the version of the electronic device (or substrate) may be determined. This version determination is the same process in both the inspection mode and the normal mode. When the result of the determination is a match, the process proceeds to the next process. Conversely, when there is a mismatch, the EEPROM initialization (except for the specific area) is executed.

  In addition, the ROM in the inspection machine 2 has a function of writing different data for each model and each version in advance, and also executing a model (and version) determination. If there is (when the model to be inspected is switched), if the model data is stored in a certain area of the EEPROM 23, it is possible to detect that the model has been switched and initialize it.

  Thus, in the present invention, in the inspection mode, it is not necessary to initialize the board-side EEPROM 12, and the initialization process of the inspection machine-side EEPROM 23 is the same model and the same panel, that is, the same. It is not necessary while inspecting the model electronics board one after another. As described above, according to the present invention, it is not necessary to perform an initialization process that takes several seconds every time one substrate is checked, so that the time required for the operation check can be shortened accordingly. In addition, conventionally, it is possible to reduce the number of inspection machines prepared for each model to a more versatile inspection machine.

  Furthermore, the board 1 (and the electronic apparatus including the board 1) subjected to the board inspection in accordance with the board inspection method according to the embodiment in the board inspection system having the configuration example described here is the EEPROM 12 in the board 1. However, the fact that the initialization process is not performed differs from the substrate inspected by the conventional substrate inspection method. Actually, when the board 1 is started after being incorporated into an electronic device, the EEPROM 12 in the board 1 is initialized as described in the flow of the microcomputer in FIG. For example, it is executed during the adjustment waiting time that exists when the user (in some cases, an inspector) first turns on the power. In this way, for example, the memory on the board is not initialized at the time of shipment, and is initialized when it is first started up. In other words, the electronic device inspected by the method according to the present invention is the first. It is necessary to provide means for initializing the substrate-side memory when it is started.

  FIG. 3 is a diagram showing an example of an EEPROM map when the same microcomputer is shared by products of different models and different panel sizes. FIG. 4 is a model and panel size based on data in the EEPROM based on the EEPROM map of FIG. It is a figure for demonstrating the setting method.

  With reference to FIG. 3 and FIG. 4, the case where the board | substrate for several models (and panel size) is test | inspected using the same test | inspection machine 2 is further explained in full detail. This process mainly corresponds to the processes of steps S7 to S9 in FIG. As described above, the difference between the checker mode and the normal mode is only the difference in the EEPROM to be accessed except for the initialization process.

  In the EEPROM MAP 30 illustrated in FIG. 3, the data content 32 for the address 31 is “000Hex” as model data (for initialization determination). Here, representative model data is set to be shared by multiple models. Further, “001Hex” is panel size data (for initialization determination). Here, representative size data is set to be shared by various panels. Further, “002Hex” is model size data, and “003Hex” is panel size data. These are areas not subject to the EEPROM initialization process. As in the EEPROM MAP 30 illustrated here, an area for model data and panel size data is secured, this address position is fixed, and this address is a non-target area where the EEPROM initialization process is not performed.

  In production, the model and panel size can be set according to the following flow. First, (1) data in the EEPROM 12 mounted on the substrate 1 is indefinite (generally, “FFHex” as shown by reference numeral 41 in FIG. 4). Further, (2) data necessary for the model to be produced and the panel size is written in advance in the EEPROM 23 in the inspection machine 2 as illustrated by reference numeral 42 in FIG.

  (3) When the power is turned on in the inspection mode, the microcomputer 11 operates in accordance with the model and panel data in order to access the EEPROM 23 in the inspection machine 2. (4) The model data (002Hex) and the panel size data (003Hex) are written from the system controller 22 in the inspection machine 2 to the EEPROM 12 in the board 1 to be inspected, and stored data as illustrated by reference numeral 43 in FIG. . (5) In the process after completion of assembly as a product, the power is turned on in the normal mode when the power is turned on, so the initialization of the EEPROM 12 is executed. At this time, the data in the EEPROM 12 is illustrated by reference numeral 43 in FIG. The model data (002Hex) and the panel size data (003Hex) are read and initialized with the corresponding initial value data among the initial values stored in the microcomputer ROM.

  As another embodiment of the present invention, in the above-described embodiment, data that is optimal for performing an operation check may be stored in advance in the inspection machine side memory. For data that has undergone normal initialization, for example, in a television receiver, it is more likely that a TV image is projected. However, if the inspection is to be executed in the video mode in the inspection device-side EEPROM, the data becomes video input. Write down. In this way, it is not necessary to manually switch the input from the TV image to the video image. Thus, by writing the optimum state for the inspection, it is possible to shorten the inspection time and to automate the inspection.

  As another embodiment of the present invention, in each of the above-described embodiments, the operation check includes a check of a plurality of check items, and the substrate inspection method is determined to be defective by the operation check as the final step of the inspection. You may make it further contain the step which memorize | stores the information regarding the determined check item in the memory by the side of to-be-inspected board | substrate as error result information. As the error result information, for example, information on which item (in which stage) it was NG obtained by inspection by an inspection machine can be mentioned. As described above, by storing the error result information in the EEPROM on the board side, the error result information may be read and used from the subsequent repair process. According to the present embodiment, not only the time required for the subsequent repair process can be shortened, but also the inspection can be automated.

It is the schematic which shows one structural example of the board | substrate inspection system for performing the board | substrate inspection method which concerns on one Embodiment of this invention. It is a flowchart for demonstrating an example of the board | substrate inspection method which concerns on one Embodiment of this invention. It is a figure which shows an example of the map of EEPROM in the case of sharing the same microcomputer for the product of a different model and a different panel size. It is a figure for demonstrating the setting method of the model and panel size by the data in EEPROM based on the EEPROM map of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board to be tested, 2 ... Inspection machine, 10 ... Board side connector, 11 ... Microcomputer, 12 ... EEPROM (board side EEPROM), 20 ... Inspection machine side connector, 21 ... Electronic equipment not including board, 22 ... System controller 23 EEPROM (inspector side EEPROM).

Claims (6)

A substrate inspection method for performing an operation check on a substrate on which at least an arithmetic processing unit and a rewritable memory are mounted by connecting the substrate as an inspection substrate to an inspection machine,
The inspection machine includes an electronic device set including an inspection device side memory that is a memory having at least a capacity of the memory, and a portion of the electronic device into which the inspection substrate is to be incorporated, excluding at least the inspection substrate. age,
The arithmetic processing unit for the substrate to be inspected includes a mode detection unit for detecting an inspection mode, and the arithmetic processing unit accesses the inspection machine side memory only when the mode detection unit detects the inspection mode. And setting means for setting to access the substrate-side memory, which is the memory on the inspected substrate side,
In the substrate inspection method, the substrate to be inspected is connected to the inspection machine, and based on the connection, a mode detection unit in the substrate to be inspected detects an inspection mode, and the arithmetic processing unit is not the substrate-side memory. Accessing the inspection machine side memory, starting an apparatus corresponding to the electronic apparatus constituted by the electronic apparatus set and the connected inspected board, and executing an operation check of the inspected board. Substrate inspection method.   The substrate inspection method according to claim 1, wherein optimal data for executing the operation check is stored in advance in the inspection machine side memory.   The operation check includes a check of a plurality of check items, and the substrate inspection method stores information on a check item determined to be defective by the operation check as error result information in the memory of the substrate to be inspected. The substrate inspection method according to claim 1, further comprising:   4. The substrate inspection method according to claim 3, further comprising a step of repairing the inspected substrate storing the error result information.   An electronic device on which a substrate inspected by the substrate inspection method according to claim 1 is mounted.   6. The electronic apparatus according to claim 5, further comprising means for initializing the board-side memory when the electronic apparatus is first activated.

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