JP2006135198A - Component-mounting machine and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component-mounting machine, capable of improving the moving speed of an electronic component being photographed. <P>SOLUTION: In the component-mounting machine, when photographing an electronic component 103 brought into a moving state, a corrective lens 109 provided within a component-recognizing camera 104 is so operated by a corrective-lens control device 113 as to synchronize it with the movement of a mounting head 101 and as to continuously form the image of the electronic component at the same position as that of a photographic element 111. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounter and a component mounting method.

  In recent years, in order to cope with the downsizing and weight reduction of electronic devices such as mobile phones, it has become necessary to reduce the size of electronic components and increase the density of mounting, which is more precise than component mounting machines that mount electronic components. Implementation capability is required.

  Therefore, in conventional component mounting machines, for precise mounting, a slight misalignment of the electronic component that occurs when the electronic component is held by the mounting head (for example, when using a suction nozzle, the center of the nozzle Position and the center position of the electronic component)) and a tilt shift are detected by image recognition using a camera, and based on the amount of the shift, the posture control of the electronic component held by the mounting head and the component mounting Position control is performed.

  Furthermore, the amount of deviation from the ideal position of the reference mark on the board on which the electronic component is mounted is detected by image recognition using a camera, and more precise board positioning control is performed based on the amount of deviation. Is going.

  On the other hand, in order to reduce the production cost of electronic equipment, it is required to shorten the mounting tact, so when performing the above image recognition, the electronic components held by the mounting head are not stopped within the imaging field of view of the camera. There is a need for a technique for imaging or imaging a substrate mark without stopping the movement of the camera. Hereinafter, a technique for imaging an electronic component without stopping in the imaging field of view of the camera in a conventional component mounter will be described.

  FIG. 7 is a conceptual diagram of a conventional component mounter. In FIG. 7, the mounting head 701 takes out and holds the electronic component 703 from the take-out position 702 by pneumatic pressure or a plurality of claws, and moves onto the electronic circuit board 705 through the imaging field of view of the component recognition camera 704. Then, the electronic component 703 is mounted at a predetermined position on the electronic circuit board 705.

  The component recognition camera 704 images the electronic component 703 held by the mounting head 701 and sends the image signal to the control device 706. The control device 706 detects positional deviation and inclination deviation of the electronic component 703 by image recognition, and commands for posture control of the electronic component 703 held by the mounting head 701 and position control at the time of component mounting based on the deviation amount. Is sent to the mounting head 701 so that the electronic component 703 is mounted at a predetermined position on the electronic circuit board 705.

  In addition, the component recognition camera 704 moves in the same direction as the mounting head 701 by the component recognition camera moving unit 707 when capturing an image, and images the electronic component 703 without stopping the mounting head 701. . Thus, in the conventional component mounter, the component recognition camera is moved in the same direction as the mounting head in the same direction, and the electronic component is imaged without stopping within the imaging field of the component recognition camera. (For example, refer to Patent Document 1).

  Also, as another conventional method, by using a camera called an image sensor arranged in a line called a line sensor, the moving speed of the mounting head and the imaging timing are electrically synchronized, and imaging is performed while shifting electronic components. There is a technique for imaging moving electronic components. In addition, there is a technique for imaging a moving electronic component by exposing and imaging the moving electronic component for a certain period of time using a shutter camera and high-luminance illumination. Even using these methods, it is possible to take an image of an electronic component without stopping it within the imaging field of view of the component recognition camera. On the other hand, the image of the substrate mark can also be taken while moving the camera by using a line sensor or a shutter camera.

  Also, a shutter camera, high-luminance illumination, and shutter camera moving means are provided on the mounting head, and the camera is moved to a predetermined imaging position until the mounting head holds the electronic component and mounts it on the substrate. There is a technique called a fly scan method for imaging. Also in this fly scan method, it is possible to take an image while moving the camera by the shutter camera and the high brightness illumination.

  However, the technique of imaging the electronic component by moving the camera in the same direction as the mounting head requires a space for installing the means for moving the camera, which increases the size of the equipment. It was.

  On the other hand, according to the method using the line sensor or the shutter camera, it is not necessary to install a means for moving the camera in the same direction as the mounting head, so that the size of the equipment can be reduced. However, the brightness of the illumination, the F value of the lens, the magnification of the lens, the imaging capability of the image sensor (the amount of light necessary to produce the difference between the electronic component and the background), and the recognition processing capability (image recognition of the electronic component) Due to the difference in brightness between the electronic component and the background necessary for this, there is a problem that the moving speed of the electronic component within the imaging field of view of the camera (moving speed of the mounting head) cannot be higher than a certain speed. Similarly, there has been a problem that the speed at which the board mark moves within the imaging field of view of the camera (the moving speed of the camera) cannot be made higher than a certain speed.

Similarly, in the fly scan method, it is not necessary to install a means for moving the camera in the same direction as the mounting head, so that the size of the equipment can be reduced. The moving speed of the camera (the moving speed of the camera) cannot be made higher than a certain speed, and therefore the moving time taken for the mounting head to move from the electronic component take-out position onto the electronic circuit board cannot be made to be a certain fixed time or less. There was a problem.
JP-A-9-64597 (5th page, FIG. 1)

  In view of the above problems, the present invention, when imaging a moving electronic component, operates a correction lens provided inside the camera or an image sensor inside the camera in synchronization with the movement of the mounting head, so that the same image sensor is used. Component mounting that enables the speed of movement of the electronic component that is the object to be recognized (moving speed of the mounting head) within the imaging field of view of the camera by allowing the component image to continue to form at the position. An object is to provide a machine and a component mounting method.

  Further, in view of the above problems, the present invention provides a correction lens provided inside the camera or an image sensor inside the camera when the electronic component held by the mounting head is imaged by the camera provided on the mounting head. By operating in synchronization with the movement and keeping the image of the component continuously formed at the same position of the image sensor, the speed at which the electronic component that is the recognition target moves within the imaging field of the camera (the movement speed of the camera) It is an object of the present invention to provide a component mounting machine and a component mounting method capable of improving the above.

  In addition, in view of the above problems, the present invention operates the correction lens provided inside the camera or the image sensor inside the camera in synchronization with the movement of the camera when the substrate mark is imaged by the camera. Component mounting that makes it possible to improve the movement speed of the board mark (camera movement speed) within the imaging field of view of the camera by allowing the board mark image to continue to form at the position. An object is to provide a machine and a component mounting method.

  A component mounting machine according to claim 1 of the present invention is a mounting machine for holding and moving a component and mounting the component at a predetermined position on a substrate, a camera for imaging the component held by the mounting head, A correction lens control means for operating a correction lens in the camera in synchronism with the movement of the mounting head so that an image of a part continues to be formed at the same position of the image sensor in the camera; and an image from the camera Control means for recognizing the holding state of the component from the signal and correcting the mounting operation of the mounting head.

  According to a second aspect of the present invention, there is provided a component mounter that holds and moves a component and mounts the component at a predetermined position on a substrate, and a camera that captures an image of the component held by the mounting head. An image sensor from the camera that operates the image sensor inside the camera in synchronization with the movement of the mounting head so that an image of a component is continuously formed at the same position of the image sensor; Control means for recognizing the holding state of the component and correcting the mounting operation of the mounting head.

  According to a third aspect of the present invention, there is provided a component mounter comprising: a mounting head that holds and moves a component and mounts the component at a predetermined position on a substrate; and the mounting head is provided on the mounting head. A camera that captures an image of a component to be held; a camera moving unit that is provided on the mounting head and moves the camera so that the component held by the mounting head is within an imaging field; and a correction lens inside the camera. The correction lens control means that operates in synchronization with the movement of the camera so that the image of the component continues to be formed at the same position of the image sensor inside the camera, and the holding state of the component from the image signal from the camera And control means for recognizing and correcting the mounting operation of the mounting head.

  According to a fourth aspect of the present invention, there is provided a component mounter including a mounting head that holds and moves a component and mounts the component at a predetermined position on a substrate, the mounting head is provided on the mounting head, A camera that captures an image of a component to be held; a camera moving unit that is provided on the mounting head and moves the camera so that the component held by the mounting head is within an imaging field; and an image sensor inside the camera. An image sensor control unit that operates in synchronization with the movement of the camera so that the image of the component continues to be formed at the same position of the image sensor, and recognizes the holding state of the component from the image signal from the camera. Control means for correcting the mounting operation of the mounting head.

  The component mounter according to claim 5 of the present invention is a camera that images a board mark on a board on which a component is mounted, and a camera moving unit that moves the camera so that the board mark falls within the imaging field of view. A correction lens control means for operating the correction lens in the camera in synchronization with the movement of the camera so that the image of the substrate mark continues to be formed at the same position of the image sensor in the camera; Control means for recognizing the amount of deviation of the board mark from the ideal position from the image signal and mounting the component at a predetermined position on the board based on the amount of deviation. .

  The component mounter according to claim 6 of the present invention is a camera that images a board mark on a board on which a component is mounted, and a camera moving unit that moves the camera so that the board mark falls within the imaging field of view. From the image signal from the camera, an image sensor control means for operating the image sensor inside the camera in synchronization with the movement of the camera so that the image of the substrate mark continues to be formed at the same position of the image sensor. And a control means for recognizing an image of a deviation amount of the board mark from the ideal position and mounting the component at a predetermined position on the board based on the deviation amount.

  In the component mounting method according to claim 7 of the present invention, when the component is held and moved by the mounting head and the component is mounted at a predetermined position on the board, the component held by the mounting head is imaged by the camera. In the component mounting method of recognizing the holding state of the component from the image signal from the camera and correcting the mounting operation of the mounting head, when imaging the moving component, the correction lens inside the camera or the imaging The element is operated in synchronism with the movement of the mounting head so that the image of the component is continuously formed at the same position of the image pickup element inside the camera.

  In the component mounting method according to claim 8 of the present invention, when the component is held and moved by the mounting head and the component is mounted at a predetermined position on the board, the camera is provided on the mounting head by the camera. In a component mounting method for imaging a component held by a mounting head, recognizing the holding state of the component from an image signal from the camera, and correcting the mounting operation of the mounting head, so that the component is in the imaging field of view. When imaging the component by moving the camera, the correction lens or the image sensor inside the camera is operated in synchronization with the movement of the camera, and an image of the component is formed at the same position of the image sensor inside the camera. It is characterized by continuing.

  In the component mounting method according to claim 9 of the present invention, the board mark on the board on which the part is mounted is imaged by a camera, and the amount of deviation from the ideal position of the board mark is recognized from the image signal from the camera. In the component mounting method in which the component is mounted at a predetermined position on the board on the basis of the deviation amount, when the board mark is imaged by moving the camera so that the board mark is in the imaging field of view. The correction lens or the image sensor inside the camera is operated in synchronization with the movement of the camera so that the image of the substrate mark is continuously formed at the same position of the image sensor inside the camera.

  As described above, according to the present invention, it is possible to improve the speed at which components and board marks, which are recognition objects, move within the imaging field of view of the camera, and as a result, the mounting tact can be shortened. Moreover, it is not necessary to install a means for moving the camera in the same direction as the mounting head at the same speed, and the size of the equipment can be reduced.

Hereinafter, a component mounter and a component mounting method according to embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a conceptual diagram of a component mounter according to the first embodiment.

  In FIG. 1, the mounting head 101 includes component holding means for holding an electronic component 103 and mounting means for moving the component holding means and mounting the electronic component 103 held by the component holding means on an electronic circuit board 105. Prepare.

  The mounting head 101 has a mechanism for holding the electronic component 103 by pneumatic pressure or a plurality of claws and releasing the holding at the time of mounting. When moving, the mounting head 101 not only moves in a plane to the mounting position but also at the time of mounting. It has a mechanism to rotate the tip of the mounting head so that it can move up and down and change the posture of the mounting component.

  The mounting head 101 configured as described above takes out and holds the electronic component 103 from the take-out position 102, moves it onto the electronic circuit board 105, and attaches the electronic component 103 to a predetermined position on the electronic circuit board 105. To do.

  Further, the mounting head 101 passes over the imaging field of view of the component recognition camera 104 when moving the electronic component 103 onto the electronic circuit board 105. The component recognition camera 104 images the electronic component 103 held by the mounting head 101.

  The control device (control means) 106 detects the positional deviation or inclination deviation (electronic component holding state) of the electronic component 103 held by the mounting head 101 from the image signal of the image captured by the component recognition camera 104 by image recognition. To detect. As described above, the positional deviation of the electronic component 103 is the amount of deviation between the center position of the electronic component 103 and the predetermined position of the component holding means (for example, when the component holding means is a suction nozzle, the electronic component 103 Of the center position of the suction nozzle and the center position of the suction nozzle).

  Then, the control device 106 sends a command based on the detected deviation amount to the mounting head 101 so that the slight positional deviation and inclination deviation generated when the electronic component is held by the mounting head 101 are corrected. The mounting operation of the head 101 is controlled.

  The component recognition camera 104 includes an illumination unit 107, a lens unit 110 having a main lens 108 and a correction lens 109, and an imaging unit 112 having an imaging element 111. Further, the correction lens control device (correction lens control means) 113 attaches the correction lens 109 to the mounting head based on a predetermined calculation result performed by the control device 106 using the position and speed information when the mounting head 101 is moved. The image of the electronic component 103 is continuously formed at the same position of the image sensor 111 by operating in synchronization with the movement of the image sensor 101.

  The component mounter configured as described above is held by the mounting head 101 when the electronic component 103 is held and moved by the mounting head 101 and the electronic component 103 is mounted at a predetermined position on the electronic circuit board 105. The electronic component 103 is imaged by the component recognition camera 104, and the control device 106 recognizes the holding state of the electronic component 103 from the image signal from the component recognition camera 104 and corrects the mounting operation of the mounting head 101. Further, when the moving electronic component 103 is imaged, the correction lens 109 is operated in synchronization with the movement of the mounting head 101 so that the image of the component is continuously formed at the same position of the image sensor 111.

  2A, 2 </ b> B, and 2 </ b> C are diagrams for explaining the basic operation of the correction lens 109. FIG. 2A shows an acquired image A acquired when the electronic component 103 existing on the central axis of the main lens 108 is imaged without operating the correction lens 109.

  In FIG. 2A, the image of the electronic component 103 is formed on the image sensor 111 via the main lens 108 and the correction lens 109, and the acquired image in which the electronic component 103 is projected at the center of the image in the control device 106. A is acquired.

  FIG. 2B shows an acquired image B acquired when the electronic component 103 existing at a position shifted from the central axis of the main lens 108 is imaged without operating the correction lens 109. In such a case, also in the control device 106, the acquired image B obtained by projecting the electronic component 103 at a position shifted from the center of the image is acquired.

  FIG. 2C shows an acquired image C acquired when the correction lens 109 is operated so that the electronic component 103 existing at a position shifted from the central axis of the main lens 108 is projected in the center of the image. By operating the correction lens 109 in this way, even if the electronic component 103 exists at a position shifted from the central axis of the main lens 108, the electronic component 103 exists on the central axis of the main lens 108. Such imaging can be performed.

  Therefore, in synchronization with the movement of the mounting head 101, the correction lens 109 is arranged so that a predetermined position of the component holding means (for example, the center position of the suction nozzle when the component holding means is a suction nozzle) is projected at the center of the image. The image of the moving electronic component 103 is continuously formed at the same position of the image sensor 111. By the operation of the correction lens 109, it is possible to capture an image as if the electronic component 103 is not moving, and to detect a positional shift or a tilt shift of the electronic component 103 held by the mounting head 101 from the captured image. Become.

  FIG. 3 is a schematic configuration diagram of a mechanism system of the correction lens 109. In FIG. 3, the correction lens 109 is held by the lens frame 114. The lens frame 114 is connected to the inner frame 116 by a Y direction driving device 115 and has a structure that can move in the Y direction. Further, the inner frame 116 is connected to the outer frame 118 by the X-direction drive device 117 and has a structure that can move in the X direction. With this structure, the correction lens 109 can be moved to an arbitrary direction and an arbitrary position.

  In the first embodiment, as the configuration for holding the correction lens, the configuration of the inner frame and the outer frame is used to enable the movement in both XY directions, but the moving direction of the mounting head is always the component. When the imaging visual field of the recognition camera is parallel to the X direction or the Y direction, the correction lens may be moved only in a single direction of the X direction or the Y direction.

  FIG. 4 is an operation timing chart of the component mounter according to the first embodiment. The operation timing of the mounting head 101 and the correction lens 109 will be described with reference to FIG. First, a positional relationship table f (representing the relationship between the position of the mounting head 101 and the position of the correction lens 109 for positioning the predetermined position of the component holding means at the center of the image when the mounting head 101 is in that position. x) is measured in advance.

This
Correction lens position = f (position of mounting head 101)
Thus, the operating position of the correction lens 109 can be uniquely determined according to the position of the mounting head 101.

Next, based on the illumination exposure time Te and the moving speed V of the mounting head 101, the exposure start position X1 and the exposure end position X2 on the movement axis of the mounting head 101 with the image center position as a reference.
X1 = (V × Te) / 2
X2 = -1 x X1
Ask for.

Similarly, the exposure start position LX1 and the exposure end position LX2 of the correction lens 109
LX1 = f (X1)
LX2 = f (X2)
Also ask.

Further, based on the exposure time Te and the exposure start position LX1 and the exposure end position LX2 of the correction lens 109, the moving speed LV of the correction lens 109 is corrected.
LV = (LX1-LX2) / Te
Ask for.

In actual operation, since the acceleration time during the operation of the correction lens 109 affects the operation timing, assuming that the acceleration time is Ta and acceleration is performed at a constant acceleration, the moving distance LXA in the acceleration time is
LXA = (LV × Ta) / 2
Thus, the operation start position LXs of the correction lens 109 is LXs = LX1 + LXA
It becomes.

As a result, the operation of the correction lens 109 is performed so that the mounting head 101 moves the starting position Xs
Xs = X1 + V × Ta
If it starts when it reaches, the synchronization operation can be performed.

In a component mounter that holds a plurality of electronic components and sequentially mounts them on an electronic circuit board, assuming that the distance between the centers of the electronic components and the electronic components is Xp, the pitch between the mounting heads at the moving speed V Travel time Tp is Tp = Xp / V
And
Tp> exposure time Te × 2 + Ta × 4
It is necessary to operate so as to satisfy the condition.

  In the first embodiment, the case where the mounting head moves on the imaging field of view of the component recognition camera at a constant speed V has been described. However, information on acceleration and deceleration is given even during acceleration or deceleration. Can be implemented. Further, in the first embodiment, the operation of the correction lens is the operation in the xy plane. However, as the operation direction, a method of correcting by rotating the lens is also effective.

  As described above, according to the first embodiment, the moving electronic component can be imaged as if it is not moved by the operation of the correction lens, the exposure time is extended, and the electronic component is imaged. As a result, the mounting tact time can be shortened.

  Further, although the component recognition camera is separated from the mounting head, it can also be applied to a fly scan method. As described above, the fly scan method is provided with a component recognition camera and its movement axis (camera moving means) on the mounting head, and the electronic component is moved within the imaging field by the camera moving means while the mounting head is moving. In this method, the component recognition camera is moved so as to enter, and the electronic component is imaged, and imaging can be performed while moving the camera by the shutter camera and the high-luminance illumination.

  In the conventional fly scan method, the moving speed of the component recognition camera during imaging is higher than a certain speed by the illumination brightness, lens F value, lens magnification, imaging device imaging capability, and recognition processing capability. However, according to the first embodiment, the correction lens control device (correction lens control means) moves the correction lens in synchronization with the movement of the component recognition camera, and moves the component to the same position of the image sensor. Since the image continues to form, it is possible to further improve the moving speed of the component recognition camera during imaging, and as a result, the speed of the mounting head can be improved and the mounting tact time can be shortened. It becomes.

(Embodiment 2)
FIG. 5 is a conceptual diagram of the component mounter in the second embodiment. However, members corresponding to those described with reference to FIG.

  In the first embodiment, the correction lens is operated, but in the second embodiment, the image pickup device 111 is operated so that the image of the component continues to be formed at the same position of the image pickup device. The electronic part is imaged as if it is not moving.

  In FIG. 5, the image sensor control device (image sensor control means) 501 controls the image sensor 111 based on a predetermined calculation result performed by the control device 106 using information on the position and speed when the mounting head 101 is moved. The operation is performed in synchronization with the movement of the mounting head 101 so that the image of the electronic component 103 is continuously formed at the same position of the image sensor 111.

  Specifically, in synchronization with the movement of the mounting head 101, a predetermined position of the component holding means (for example, the center position of the suction nozzle when the component holding means is a suction nozzle) is projected at the center of the image. The image sensor 111 is operated so that the image of the electronic component 103 is continuously formed at the same position of the image sensor 111. By this operation of the image pickup device 111, it is possible to pick up an image as if the electronic component 103 is not moving, and it is possible to detect a positional shift or a tilt shift of the electronic component 103 held by the mounting head 101 from the captured image. Become. Further, the structure of the mechanism system of the image sensor 111 can be realized by making it similar to the structure of the mechanism system of the correction lens described in the first embodiment.

  Note that the present invention can also be applied to the fly scan method as in the first embodiment. When applied to the fly scan method, the image sensor is operated in synchronization with the movement of the component recognition camera so that the image of the component continues to form at the same position of the image sensor. The speed can be further improved. As a result, the speed of the mounting head can be improved, and the mounting tact can be shortened.

(Embodiment 3)
FIG. 6 is a conceptual diagram of the component mounter according to the third embodiment. However, members corresponding to those described with reference to FIG.

  In FIG. 6, a substrate mark 601 is attached to a predetermined position of the electronic circuit board 105 in order to know an accurate position of the electronic circuit board 105. That is, the board mark 601 compares the normal mark position (ideal position of the board mark) of the electronic circuit board 105 with the mark position (actual position of the board mark) captured by the board mark recognition camera 602 in the control device 106. Then, the position is corrected by the difference, and the electronic circuit board 105 is positioned more accurately.

  The control device (control means) 106 detects the amount of deviation of the substrate mark 601 from the ideal position from the image signal of the image captured by the substrate mark recognition camera 602 by image recognition, and based on this amount of deviation, the electronic circuit board. The position of the electronic circuit board 105 is corrected and the electronic circuit board 105 is positioned more accurately so that the electronic component is mounted at a predetermined position on the electronic circuit board 105.

  The board mark recognition camera 602 includes an illumination unit 603, a lens unit 606 having a main lens 604 and a correction lens 605, and an imaging unit 608 having an imaging element 607, similar to the component recognition camera in the first embodiment. Then, imaging is performed while moving the substrate mark 601. Further, the board mark recognition camera moving unit 609 moves the board mark recognition camera 602 so that the board mark 601 enters the imaging field of view of the board mark recognition camera 602.

  Similar to the first embodiment, the correction lens control device (correction lens control means) 610 is based on a predetermined calculation result performed by the control device 106 using the position and speed information when the substrate mark recognition camera 602 is moved. Thus, the correction lens 605 is operated in synchronization with the movement of the substrate mark recognition camera 602 so that the image of the substrate mark 601 continues to be formed at the same position of the image sensor 607.

  Specifically, in synchronization with the movement of the substrate mark recognition camera 602, the correction lens 605 is operated so that the ideal position of the substrate mark is projected at the center of the image, and the image of the substrate mark 601 is located at the same position of the image sensor 607. To continue to image. By the operation of the correction lens 605, an image can be taken as if the substrate mark recognition camera 602 is not moving, and a deviation amount of the substrate mark from the ideal position can be detected from the captured image by image recognition. The structure of the correction lens mechanism system can be realized in the same manner as the structure of the correction lens mechanism system described in the first embodiment.

  As described above, according to the third embodiment, it is possible to image as if the substrate mark recognition camera has not moved by the operation of the correction lens, extend the exposure time, and the substrate when imaging the substrate mark. The moving speed of the mark recognition camera can be further improved, and as a result, the mounting tact can be shortened. Needless to say, the method of operating the image sensor can be realized as in the second embodiment.

  The component mounter and the component mounting method according to the present invention can improve the relative moving speed of an object being imaged, and perform image recognition using a camera that can image an object moving within an imaging field of view. It is effective for the device which performs.

Conceptual diagram of component mounter in Embodiment 1 of the present invention The figure for demonstrating the basic operation | movement of the correction | amendment lens of the component mounting machine in Embodiment 1 of this invention. 1 is a schematic configuration diagram of a mechanism system of a correction lens of a component mounter in Embodiment 1 of the present invention. Operation timing diagram of component mounter in Embodiment 1 of the present invention Conceptual diagram of component mounter in Embodiment 2 of the present invention Conceptual diagram of component mounter in Embodiment 3 of the present invention Conceptual diagram of conventional component mounter

Explanation of symbols

101, 701 Mounting head 102, 702 Removal position 103, 703 Electronic component 104, 704 Component recognition camera 105, 705 Electronic circuit board 106, 706 Control device 107, 603 Illumination unit 108, 604 Main lens 109, 605 Correction lens 110, 606 Lens unit 111, 607 Imaging device 112, 608 Imaging unit 113, 610 Correction lens control device 114 Lens frame 115 Y direction driving device 116 Inner frame 117 X direction driving device 118 Outer frame 501 Imaging device control device 601 Substrate mark 602 Substrate mark recognition Camera 609 Substrate mark recognition camera moving means 707 Component recognition camera moving means

Claims (9)

A mounting head for holding and moving the component and mounting the component at a predetermined position on the substrate;
A camera for imaging a component held by the mounting head;
A correction lens control means for operating the correction lens in the camera in synchronization with the movement of the mounting head so that the image of the component continues to be formed at the same position of the image sensor in the camera;
Control means for recognizing the holding state of the component from the image signal from the camera and correcting the mounting operation of the mounting head;
A component mounting machine comprising: A mounting head for holding and moving the component and mounting the component at a predetermined position on the substrate;
A camera for imaging a component held by the mounting head;
An image sensor control means for operating the image sensor inside the camera in synchronization with the movement of the mounting head so that an image of a component is continuously formed at the same position of the image sensor;
Control means for recognizing the holding state of the component from the image signal from the camera and correcting the mounting operation of the mounting head;
A component mounting machine comprising: A mounting head for holding and moving the component and mounting the component at a predetermined position on the substrate;
A camera that is provided on the mounting head and that captures an image of a component held by the mounting head;
Camera moving means provided on the mounting head and configured to move the camera so that components held by the mounting head are within an imaging field;
A correction lens control means for operating the correction lens in the camera in synchronization with the movement of the camera so that the image of the component continues to be formed at the same position of the image sensor in the camera;
Control means for recognizing the holding state of the component from the image signal from the camera and correcting the mounting operation of the mounting head;
A component mounting machine comprising: A mounting head for holding and moving the component and mounting the component at a predetermined position on the substrate;
A camera that is provided on the mounting head and that captures an image of a component held by the mounting head;
Camera moving means provided on the mounting head and configured to move the camera so that components held by the mounting head are within an imaging field;
An image sensor control means for operating the image sensor inside the camera in synchronization with the movement of the camera so that an image of a component is continuously formed at the same position of the image sensor;
Control means for recognizing the holding state of the component from the image signal from the camera and correcting the mounting operation of the mounting head;
A component mounting machine comprising: A camera that images the board mark on the board on which the component is mounted;
Camera moving means for moving the camera so that the substrate mark falls within the imaging field;
Correction lens control means for operating the correction lens in the camera in synchronization with the movement of the camera so that the image of the substrate mark continues to be formed at the same position of the image sensor in the camera;
Control means for recognizing the amount of deviation from the ideal position of the board mark from the image signal from the camera, and based on this deviation amount, the component is mounted at a predetermined position on the board;
A component mounting machine comprising: A camera that images the board mark on the board on which the component is mounted;
Camera moving means for moving the camera so that the substrate mark falls within the imaging field;
An image sensor control means for operating the image sensor inside the camera in synchronization with the movement of the camera, so that the image of the substrate mark continues to be formed at the same position of the image sensor;
Control means for recognizing the amount of deviation from the ideal position of the board mark from the image signal from the camera, and based on this deviation amount, the component is mounted at a predetermined position on the board;
A component mounting machine comprising: When the component is held and moved by the mounting head and the component is mounted at a predetermined position on the substrate, the component held by the mounting head is imaged by the camera, and the holding state of the component is imaged from the image signal from the camera. In the component mounting method for recognizing and correcting the mounting operation of the mounting head,
When imaging the moving part, the correction lens or the image sensor inside the camera is operated in synchronization with the movement of the mounting head so that the image of the part continues to be formed at the same position of the image sensor inside the camera. A component mounting method characterized by: When the component is held and moved by the mounting head and the component is mounted at a predetermined position on the substrate, the component held by the mounting head is imaged by a camera provided on the mounting head, and the image from the camera is captured. In the component mounting method for recognizing the holding state of the component from the signal and correcting the mounting operation of the mounting head,
When imaging the component by moving the camera so that the component falls within the imaging field of view, the correction lens or the image sensor inside the camera is operated in synchronization with the movement of the camera, and the same image sensor inside the camera is used. A component mounting method, wherein an image of a component is continuously formed at a position. The board mark on the board on which the component is to be mounted is imaged by the camera, and the amount of deviation from the ideal position of the board mark is recognized from the image signal from the camera. In a component mounting method for mounting at a position,
When imaging the substrate mark by moving the camera so that the substrate mark is within the imaging field of view, the correction lens or the image sensor inside the camera is operated in synchronization with the movement of the camera, and the image sensor inside the camera A component mounting method characterized in that an image of a board mark continues to be formed at the same position.

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