JP2006135008A - Hermetic sealing cabinet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To weld a lid to an insulating light cabinet and a metallic light cabinet whose upper parts are opened with a welder of usual output and to hermetically seal the cabinets. <P>SOLUTION: The light cabinet 1 whose upper part is opened and which can hermetically be sealed is provided with a fitting part 11, an opening edge 12, glass sealing leads 13, and a component arranging part 14. The unillustrated lid is hermetically bonded onto the opening edge 12 after a semiconductor component and the like are mounted on the bottom of the cabinet 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light-weight casing that can be hermetically sealed, and more particularly, to a lightweight casing for artificial satellite mounting that can hermetically seal semiconductor elements and the like.

  The size of the housing that needs to be hermetically sealed has increased, and if the housing weight has not been reduced, the possibility of becoming a housing for artificial satellite-mounted equipment has increased. If the housing is easily made of an aluminum alloy, an expensive high-power welding machine (for example, 800W class YAG laser welding machine) is introduced, and after semiconductor parts are mounted in the housing, it is hermetically sealed. There must be.

  Conventionally, for example, Patent Document 1 discloses a package for a semiconductor integrated circuit in which weight is reduced and heat dissipation is improved, and a manufacturing method thereof. Specifically, a metal seal frame having a high electrical resistance is provided at the opening edge of an aluminum casing having an open top, and a cover made of Kovar (iron cobalt nickel alloy) is welded by a discharge plasma sintering method.

JP 2002-246490 A (FIG. 1, paragraph 0010)

  However, if a high-power YAG laser welder is used, the lid and the housing can be made of aluminum, but the weldable conditions are narrow, so it is necessary to strictly control the process. In the aerospace field, it is difficult to keep the operation rate constantly high because of the form of individual order production, and it is difficult to shorten the product production period.

  On the other hand, in the aerospace field, the case has become larger, and both the lid and the case are too heavy to be mounted on an artificial satellite if a high-resistance metal such as Kovar that can be welded with a normal-power welding machine is used. .

  Further, in Patent Document 1, a seal frame must be provided at the opening edge of the casing whose upper part is open, and productivity is low.

  Accordingly, an object of the present invention is to provide an airtight sealable light weight that seals the housing by welding a lid to an insulating lightweight housing or metal lightweight housing having an open top with a normal output welding machine or the like. To provide a housing.

  In order to solve the above-described problems, the airtightly sealable lightweight casing of the present invention employs the following characteristic configuration.

  (1) A housing that hermetically seals a component, the housing body having an open top and a lid that hermetically seals the housing body, wherein the housing body and the lid are low-strained. Bonded hermetically sealed housing.

  (2) The hermetic sealed casing according to (1), wherein the casing body and the lid are joined by a discharge plasma sintering method.

  (3) The hermetic sealed casing according to (1), wherein the casing body and the lid are joined by an ultrasonic welding method.

  (4) The hermetically sealed casing according to (1), wherein the casing body and the lid are made of ceramic.

  (5) The hermetic sealing housing according to (1), wherein the housing body is made of ceramic and the lid is made of metal.

  (6) The hermetically sealed casing according to (1), wherein the casing main body is made of metal and the lid is made of ceramic.

  (7) The hermetically sealed casing according to (6), wherein the casing body is made of aluminum or aluminum alloy.

  (8) The hermetic sealing casing according to (1), wherein the casing body is made of aluminum or an aluminum alloy, and the lid is made of stainless steel, Invar, or Kovar.

  According to the present invention, by joining the lightweight casing and the lid using the discharge plasma sintering method, even if the casing is enlarged, it can be easily hermetically sealed by a normal low-power welding machine, High capital investment is not required.

  In addition, by using an aluminum alloy casing having a high thermal conductivity, mounting of a high heat generation component is facilitated in terms of thermal design.

  Hereinafter, with reference to the drawings, a suitable lightweight casing capable of being hermetically sealed will be described.

  FIG. 1 is a plan view of a hermetically sealable lightweight casing with an upper portion opened in the hermetically sealable lightweight casing according to the present invention. An airtight sealable lightweight housing 1 having an open top includes an attachment portion 11, an opening edge portion 12, a glass sealing lead 13, and a component placement portion 14. A semiconductor component or the like is mounted on the bottom of the housing 1. After that, a lid (not shown) is bonded onto the opening edge 12.

  FIG. 2 is a side view of an airtight sealed lightweight housing. A lid 15 is joined to the opening edge 12 with low strain.

  First, a first embodiment of the present invention will be described. In the present embodiment, when the airtightly sealable lightweight casing 1 having an open top is made of ceramic (for example, alumina), the lid 15 is made of ceramic. For joining the housing 1 and the lid 15, a low strain joining method such as an ultrasonic welding method is used.

  In the ultrasonic welding method, an ultrasonic wave is applied while pressurizing the casing 1 and the lid 15, and an airtight joint is obtained by mutual diffusion of ceramic materials by ultrasonic vibration.

  In addition, it is possible to hermetically seal electronic components printed on thick films on ceramics, and there is no need to braze individual electronic components to a metal substrate, thus realizing a housing that takes full advantage of material properties and product yield. Will improve.

  Next, a second embodiment of the present invention will be described. In this embodiment, when the lightweight casing 1 is a metal with good heat dissipation (for example, aluminum or aluminum alloy), the lid 15 is made of ceramic. For joining the housing 1 and the lid 15, a low strain joining method such as a discharge plasma sintering method or an ultrasonic welding method is used.

  Since semiconductor components are arranged at the bottom of the housing 1, heat can be efficiently radiated from the housing 1.

  A third embodiment of the present invention will be described. In the present embodiment, when the lightweight casing 1 is a metal with good heat dissipation (for example, aluminum or aluminum alloy), the lid 15 is made of metal (for example, stainless steel, invar, kovar). For joining the housing 1 and the lid 15, a low strain joining method such as a discharge plasma sintering method or an ultrasonic welding method is used.

  A semiconductor component can be disposed at the bottom of the housing 1 to efficiently dissipate heat from the lower portion of the housing 1 and the lid 15.

  The present invention has strict EMC requirements in a field where airtight sealing of a semiconductor or the like is required in the aerospace field or the like, and a weight reduction of the casing (package) is required, aerospace field, etc. Although it is necessary to reduce the weight of the package, and high heat-generating components are mounted, it is useful in fields where the weight of the casing (package) is also required as a whole.

It is a top view of the lightweight housing | casing which can be airtightly sealed in the Example of this invention. It is a top view of the airtightly sealed lightweight housing | casing in the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lightweight housing 11 which can be hermetically sealed 11 Mounting portion 12 Opening edge 13 Glass sealing lead 14 Component placement portion 15 Lid

Claims (8)

  In a case that hermetically seals components, a housing body that is open at the top and a lid that hermetically seals the housing body, and the housing body and the lid are joined with low strain A hermetically sealed housing characterized by   The hermetically sealed casing according to claim 1, wherein the casing main body and the lid are joined by a discharge plasma sintering method.   The hermetically sealed casing according to claim 1, wherein the casing main body and the lid are joined by an ultrasonic welding method.   The hermetically sealed casing according to claim 1, wherein the casing body and the lid are made of ceramic.   The hermetically sealed casing according to claim 1, wherein the casing body is made of ceramic, and the lid is made of metal.   The hermetically sealed casing according to claim 1, wherein the casing body is made of metal and the lid is made of ceramic.   The hermetically sealed casing according to claim 6, wherein the casing body is made of aluminum or aluminum alloy.   The hermetically sealed casing according to claim 1, wherein the casing main body is made of aluminum or aluminum alloy, and the lid is made of stainless steel, Invar, or Kovar.

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