JP2006129185A - Sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve sealing quality while maintaining a sealing state in a sealing process of a small oscillator about a sealing device by electromagnetic high frequency induction heating in a process for packaging a piezoelectric component such as a crystal oscillator. <P>SOLUTION: In a container body for housing an electronic component and a sealing device for realizing a hermetically sealed container by covering the container body with a lid and sealing by electromagnetic high frequency induction heating, the sealing device seals brazing materials applied to a metal lid constituting the piezoelectric component in a vacuum atmosphere that is not higher than one pascal or performs direct heating sealing in nitrogen atmosphere that is equal to or higher than 95% to improve sealing quality. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a sealing device using electromagnetic high-frequency induction heating, which is a process of packaging a piezoelectric component such as a crystal resonator.

    With the recent high functionality, high precision, miniaturization, and weight reduction of electronic devices, similar problems have been demanded for electronic components mounted on these electronic devices. For example, even when taking a container structure of an electronic component, the present invention has been addressed to improve the above-described requirements by developing a ceramic material instead of a conventional metal container. An airtight container using a general ceramic material is the most common from the viewpoint of airtightness, in which a ceramic material is laminated in a concave shape and a Kovar metal lid is nickel-plated and welded by seam welding. An airtight container is constructed by the method.

  The conventional method of welding a ceramic container and a metal lid by seam welding is explained by taking the most common seam welding as an example. In an airtight container, a metallized film is formed by performing tungsten metallization on the ceramic container corresponding to the welded portion. , A nickel plating process is performed thereon, a gold plating process is further performed thereon, and a Kovar ring is disposed on the gold plating by silver brazing. The Kovar ring is subjected to nickel plating (on the surface in contact with the metal lid) and gold plating thereon.

  On the other hand, the metal lid is nickel-plated on the entire surface of the Kovar material. Accordingly, in order to perform nickel plating on the entire surface of the metal lid, the metal lid must be cut (die-cut) to a predetermined size. An airtight container can be formed by welding these concave ceramic container and metal lid by seam welding.

  What is indispensable for seam welding is that when a ceramic container and a metal lid are welded by seam welding, pressurization and electric current are passed from the upper part of the metal lid by a seam welding head, and nickel plating treatment on the surface of the metal lid is performed. The contact portion with the Kovar ring is welded, and in reality, the metal lid and the ceramic container are joined by nickel plating of the metal lid and gold plating of the Kovar ring.

  In short, the welded portion forms an airtight container structure joined along the outer peripheral surface of the weld, and the current required for seam welding needs to be supplied to the entire Kovar ring arranged in the ceramic container. In addition, since recent electronic components tend to be miniaturized in outer dimensions, it is impossible with the above-described sealing method for forming an airtight container using a seam welding head.

Therefore, as an example of a small electronic component sealing technology, the sealing surface of the ceramic package is plated, a ring-shaped sealing material with gold flash plating is placed, nickel plating is applied to Kovar metal, gold A technique is employed in which a flash-plated metal lid is mounted and heat-sealed and sealed in a high-temperature furnace.
Japanese Patent Laid-Open No. 08-046075 JP 2004-103880 A Japanese Patent Application No. 2000-77965 JP 2002-246868 A In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information described above. .

  As described above, with the progress of miniaturization of recent quartz resonators, it has been improved in consideration of the simplification of the sealing process, mechanical constraints, and reliability of sealing accuracy instead of the seam welding sealing that has been widely used. An improved manufacturing method is needed. In addition, a manufacturing method called fusion sealing has been incorporated in the above-described technology, but there are many problems that are currently encountered when the miniaturization of the external dimensions of the crystal unit is developed extremely quickly. is there.

  In particular, crystal oscillators and surface acoustic wave filters, including crystal oscillators, are currently sealed using seam welding sealing and heat fusion furnaces, which are conventional techniques. Since the parts are extremely miniaturized, it is difficult to manufacture and seal them by individual pieces as in the prior art.

  As a specific item of the problems with the prior art, in the seam sealing, it is necessary to individually seal each electronic component and crystal component one by one, so that productivity is poor. Further, since the roller electrode used for seam sealing deteriorates with the frequency of use, regular maintenance work is required.

  In addition, in sealing by heat fusion, the jig is heated by a heater and the brazing material is melted by the heat transmitted through it, so that it takes time to heat and because it is exposed to high temperature for a long time in the heating time, There is a possibility of deteriorating the characteristics of the quartz component itself.

In order to solve the above-mentioned problems, the present invention provides a container body for storing an electronic component, and a sealing device that covers the container body with a lid and seals it by electromagnetic high frequency induction heating to realize a sealed container. Is a sealing device characterized by directly heat-sealing a brazing material applied to a metal lid constituting a piezoelectric component in a vacuum atmosphere of 1 × 10 ⁵ Pa or less or a nitrogen atmosphere of 95% or more. .

  Therefore, by using electromagnetic high frequency induction heating for the sealing process and improving the atmosphere and conditions at the time of sealing with respect to the conventional techniques, the damage to the sealing target, for example, the crystal resonator is reduced. The deterioration of the frequency characteristics of the crystal unit itself can be reduced.

  In addition, since this device can perform the final inspection including the appearance inspection function and the characteristic inspection, the entire process time can be shortened because the manufacturing process is not limited to the sealing process but the final process. It solves the conventional problem.

  As described above, according to the present invention, the sealing process can be greatly simplified, so that the metal lid is not required to be temporarily attached before the main sealing. In addition, by using an electromagnetic high frequency induction heating device, high-speed heating and high-temperature heating are possible, improving productivity and reducing product characteristic deterioration. In addition, apparatus maintenance can be reduced by simplifying the process. As described above, since the temporary sealing step is not required, there is no splash at the time of temporary mounting, and improvement in quality, improvement in productivity, and reduction in manufacturing cost can be realized. Further, while the conventional sealing process is a single-piece process, it is possible to perform batch sealing with a sheet-like substrate in which crystal parts are arranged in a matrix.

Embodiments of the present invention will be described below with reference to the accompanying drawings. In each figure, the same numerals indicate the same objects.
FIG. 1 is a cross-sectional view of an essential part of an electronic component container 3 showing a sealing part of the present invention. FIG. 1 is a partial cross-sectional view of a ceramic container body 1 and a lid body 2 made of a ceramic material before sealing. The ceramic container body 1 has a recessed space for storing electronic components inside, and a lid body 2 is placed so as to seal the recessed portion, and the ceramic container body 1 and the lid body 2 are joined by heat fusion to be a sealed container. Get the structure.

The welding process of the ceramic container body 1 with the lid body 2 is as shown in FIG. 2, but the sealing is performed in a vacuum atmosphere of 1 × 10 ⁵ Pascal or less under the electromagnetic high-frequency heat sealing condition of the present invention. Alternatively, by sealing in a nitrogen atmosphere of 95% or more, the atmosphere inside the hermetic container with respect to the crystal parts stored in the hermetic container can be kept in a good state, so the quality is maintained by reducing frequency fluctuations due to changes over time. Can do.

  In addition, the present invention can employ a sealing method in which a plurality of crystal parts are processed in a lump in a sealing process that was difficult with the prior art. When processing, batch sealing with a sheet-like substrate in which crystal parts are arranged in a matrix can be made possible.

  In addition, since it is possible to perform a final inspection including an appearance inspection function and a characteristic inspection, it is possible to process not only the sealing process but also the final process, thereby reducing the overall work time.

It is principal part sectional drawing of the electronic component container which shows the sealing part of this invention. It is a flowchart which shows the flow of the manufacturing process of this invention.

Explanation of symbols

1 container body 2 lid body 3 electronic component container

Claims (2)

In a sealing device that realizes a sealed container by storing a container body for storing electronic components, and covering the container body with a lid body and sealing by electromagnetic high frequency induction heating,
The sealing device is characterized in that a brazing material applied to a metal lid constituting a piezoelectric component is directly heat sealed in a vacuum atmosphere of 1 × 10 ⁵ Pascal or less or a nitrogen atmosphere of 95% or more. Stop device. The sealing device according to claim 1, wherein the sealing device can perform a final inspection including an appearance inspection function and a characteristic inspection.

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