JP2006133739A - Method of manufacturing liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid crystal display device by which a pixel having a bright spot can be more surely corrected. <P>SOLUTION: The method of manufacturing the liquid crystal display device has a step for irradiation with a laser beam 20 from a side of an array substrate ARP of the liquid crystal display device LCD toward a corner part from the inner part of the surface of the pixel PIX having the bright spot and a step for disturbing alignment of the pixel PIX by using a laser beam 30 from the side of the array substrate ARP of the liquid crystal display LCD. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly to a method for manufacturing a liquid crystal display device including correction of display pixels.

Conventionally, when one of the display pixels constituting a liquid crystal display device has a defect called a bright spot that is always lit, there is a method of correcting the display pixel by irradiating the display pixel with a pulse laser beam while scanning it a plurality of times. It is known (see, for example, Patent Document 1). The method disclosed in this patent document is a liquid crystal display in which the repetition frequency is synchronized with the scanning speed so that the overlap ratio of the pulsed laser beam becomes a constant value, and the inside of a pixel having a bright spot is scanned a plurality of times in a plane. A method of manufacturing an apparatus, wherein a first scan creates bubbles in a pixel, and a second scan scans a pixel with a laser spot in the presence of bubbles generated by the scan, thereby producing a bright spot. In this method, the alignment film corresponding to the pixel having the pixel is processed to disturb the alignment of the liquid crystal material, thereby blackening the pixel.
Japanese Patent Laying-Open No. 2003-262842 (page 4-5, FIG. 5)

However, in the manufacturing method of the liquid crystal display device, even if the first laser beam scanning is performed to generate bubbles, it is difficult for the bubbles to spread to the entire pixel, specifically to the pixel corner portion.

Therefore, the liquid crystal material remaining in the corner portion of the pixel becomes an obstacle at the time of the second laser light irradiation, and the alignment film cannot be processed, and it is still visually recognized as a bright spot due to light leakage from the corner portion. .

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a liquid crystal display device that can more reliably darken a pixel having a bright spot.

In order to solve the above problems, one embodiment of the present invention provides:
A plurality of pixel electrodes are arranged in a matrix on one main surface of the substrate, an array substrate having a first alignment film on the pixel electrode, and a counter electrode on one main surface arranged to face the array substrate, A counter substrate having a second alignment film on the counter electrode, and a liquid crystal layer made of a liquid crystal material sandwiched between the array substrate and the counter substrate via the first and second alignment films, and each of the pixels A method of manufacturing a liquid crystal display device including a plurality of display pixels configured by an electrode, the liquid crystal layer corresponding to the pixel electrode, and the counter electrode,
The liquid crystal of the liquid crystal layer corresponding to the one display pixel is irradiated by irradiating one of the plurality of display pixels having a bright spot while scanning a laser beam in a plane from the inside toward the corner portion. A first step of vaporizing the material;
And a second step of processing the alignment interface in which the liquid crystal material corresponding to the one display pixel is arranged in a predetermined direction by irradiating with a laser beam.

  Further, a display pixel having a bright spot among the plurality of display pixels has a foreign substance, and a step of pulverizing the foreign substance by laser irradiation is added before the first step. It is a manufacturing method.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the liquid crystal display device which can correct the pixel which has a luminescent point more reliably can be obtained.

  Embodiments of the present invention will be described below with reference to the drawings.

Example 1
FIG. 1 is a partial schematic cross-sectional view of a transmissive liquid crystal display device according to Embodiment 1 of the present invention, and the configuration of the liquid crystal display device will be described.

  This liquid crystal display device LCD includes an array substrate ARP, a counter substrate FAP arranged to face the array substrate ARP, a liquid crystal layer LCL sandwiched between them, and a surface in contact with the liquid crystal layer LCL of the array substrate ARP and the counter substrate FAP. Is composed of polarizing plates APP and FPP respectively disposed on opposite sides. Further, the array substrate ARP and the counter substrate FAP described above sandwich a bead spacer that makes the gap between the substrates uniform although not shown.

  The array substrate ARP is arranged in the vicinity of the glass substrate AGP, a plurality of signal lines formed on one main surface of the glass substrate AGP, a plurality of scanning lines arranged substantially orthogonal to the signal lines, and their intersections. Thin film transistor TRA, a pixel electrode (ITO: Indium Tin Oxide) AIT connected to the thin film transistor TRA, and an alignment film AAL disposed on the array substrate ARP so as to cover them. The thin film transistor TRA includes a gate electrode connected to the scanning line, a gate insulating film GIN covering the gate electrode, an amorphous silicon layer as a semiconductor layer thereon, a source electrode connected to the signal line thereon, a drain electrode, Consists of

  Note that although an amorphous silicon layer is used here as a semiconductor layer of the thin film transistor, polysilicon can also be used. Although the thin film transistor structure is described as a bottom gate structure here, a top gate structure may be used.

  The counter substrate FAP includes a glass substrate FGP, a mesh-like black matrix BM disposed on one main surface of the glass substrate FGP, and red (R) disposed in correspondence with a region partitioned by the black matrix BM. ), Green (G), and blue (B) color filters CFR, CFG, and CFB, and a counter electrode FIT made of ITO, for example, as a transparent electrode is formed on the color filter. An alignment film FAL is formed.

  The alignment films AAL and FAL are each subjected to a rubbing treatment, thereby aligning liquid crystal molecules in a predetermined direction and defining a rising direction of the liquid crystal molecules when a voltage is applied.

  Such a liquid crystal display device LCD is subjected to image inspection after completion. In the liquid crystal display device LCD, when a bright spot (also referred to as a bright spot defect) is found during image inspection, the bright spot defect is corrected as follows. In this specification, a bright spot refers to a pixel that is still in a white display state (non-black display) even in a black display state, for example.

  Then, by processing at least one of the alignment films of the pixel having the bright spot defect, the dark spot is reduced regardless of whether the voltage is applied to the pixel or not. For example, in a normally white mode liquid crystal display device, pixels that do not exhibit a black display state even when a voltage is applied, that is, white display when no voltage is applied and black display when a voltage is applied, that is, a bright display. There may be a point-defective pixel. In this case, the alignment film is processed so as to exhibit a black display state regardless of whether a voltage is applied or not, and a dark spot is formed. When the alignment film is processed, the bright spot pixel can be darkened more reliably by removing the liquid crystal material in advance beyond the corner of the target pixel.

  The manufacturing method of the present embodiment will be described in detail with reference to the drawings.

  First, the image inspection of the liquid crystal display device LCD is visually performed with a black raster display. Here, when a pixel PIX having a bright spot is confirmed in the liquid crystal display device LCD, the alignment substrate AAL and FAL of the array substrate ARP and the counter substrate FAP corresponding to the pixel PIX are respectively viewed from the array substrate ARP side. The focused laser beam 20 is irradiated while scanning.

  FIG. 2 is a schematic plan view of a target pixel according to the first embodiment of the present invention.

  When a pixel PIX having a bright spot is confirmed in the liquid crystal display device LCD, first, in the first step, the main pixel of each pixel PIX is detected from the vicinity of the center CEN of the pixel PIX to the liquid crystal display device LCD from the array substrate ARP side. The laser beam 20 condensed toward the corner portion CRN is irradiated while being scanned in four times (FIG. 2A).

  As a laser irradiation machine to be used, for example, “SL455H” manufactured by NEC Corporation may be mentioned.

  At this time, the condensed laser light 20 has a laser energy of 0.01 mJ to 0.3 mJ, more preferably 0.02 mJ to 0.12 mJ, and a condensing diameter of 2 μm to 10 μm. Used a laser energy of 0.03 mJ and a focused diameter of 6 μm.

  The converged laser beam 20 is also preferably irradiated from 2 μm to 10 μm inside the outer peripheral portion CIR of the pixel PIX, more preferably from 3 μm to 6 μm, and in this embodiment, 5 μm inside. At the end of irradiation. For example, the pixel size is 92 μm × 262 μm to 200 μm × 600 μm.

  Next, the alignment film AAL corresponding to the pixel PIX is irradiated by irradiating the laser beam 30 condensed in the second step from the outside of the array substrate ARP in a zigzag manner from the outside of the array substrate ARP. FAL is processed (FIG. 2B).

  At this time, the condensed laser beam 30 has a laser energy of 0.01 mJ to 0.3 mJ, more preferably 0.02 mJ to 0.12 mJ, and a condensed diameter of 2 μm to 10 μm, as in the first step. In this example, the laser energy was set to 0.03 mJ, and the focused diameter was set to 6 μm.

  As described above, the bubble BUB generated by the laser irradiation in the first process is successfully pushed up to the corner portion of the pixel PIX, and thus exists beyond the corner portion, more specifically, the corner portion. By irradiating the two alignment films AAL and FAL of the array substrate ARP corresponding to the pixel PIX and the counter substrate FAP with the focused laser light 30, the corner portion of the pixel PIX can be processed. Even after the BUB disappears, the orientation of the liquid crystal material that will be present in the corner portion of the pixel PIX is also disturbed, so that no light leakage occurs from the corner portion of the pixel PIX.

  Further, even when the foreign matter F exists in the pixel PIX as shown in FIG. 2C, the laser beam 20 that generates bubbles extends from the pixel center portion CEN to the corner portion CRN across the foreign matter F. Therefore, bubbles can be generated in the entire pixel without hindering the generation of bubbles under the influence of foreign matter. That is, by previously dividing and irradiating the laser beam 20 that generates bubbles in a path including a foreign substance into a plurality of portions, the liquid crystal can be vaporized and the bubbles can be grown on the entire display pixel to be repaired.

  Incidentally, FIGS. 3A to 3D are views for explaining in more detail the irradiation state of the laser light at each corner portion at the time of laser light irradiation in the first step. In each figure, 20L is the laser beam at the end of each pixel PIX, and DIC indicates the distance between the pixel corner and 20L. Only in the corner portion where the transistor TRA is disposed, the irradiation position DIT at the final end indicates the distance from the transistor TRA. The irradiation position at the final end is preferably 2 μm to 10 μm inside the pixel corner, and more preferably 4.5 μm to 5 μm.

  Thereby, the liquid crystal material LCM constituting the liquid crystal layer LCL in the pixel PIX is vaporized by heat to be generated as a bubble BUB, and at the same time, the generated bubble BUB is further expanded toward the corner portion to reach the corner portion end. More specifically, it extends to a range outside a part of the pixel PIX range and not reaching an adjacent pixel. At that time, the liquid crystal material LCM tends to remain in the liquid crystal state at the corner portion of the pixel PIX only by simple scanning with the laser beam, but the laser beam 20 focused toward the corner portion is irradiated from the vicinity of the substantially central portion CEN of the pixel. By doing so, the bubble BUB is expanded beyond a part of the pixel PIX range beyond the corner portion of the pixel PIX, and thereby the bubble BUB is sized to cover the entire pixel PIX including the corner portion. it can.

  As shown in FIG. 3, in the first step, when irradiating the laser toward the corner portion of the pixel PIX, it is necessary to finish irradiation within 4.5 μm to 5 μm from the outer peripheral portion CIR of the pixel PIX. This is to prevent the bubbles from being applied to the adjacent pixels so as not to affect the wiring around the PIX and to minimize the influence on the pixels PIX1 to PIX8 adjacent to the pixel PIX.

  In addition, as shown in FIG. 4, the distance DIS2 to the center point of each of the Nth focused laser beam 200 and the (N + 1) th focused laser beam 201 is irradiated with a distance of 1 μm to 6 μm. Appropriate, but 1 to 3 μm is more preferable.

  Further, as shown in FIG. 5, the condensed laser light 30 is irradiated within a range of 4.5 μm to 5 μm inside the outer peripheral portion CIR of the pixel PIX. This is to prevent the wiring around the pixel PIX from being affected and to minimize the influence on the pixels PIX1 to PIX1 adjacent to the pixel PIX.

  As described above, it is possible to form bubbles over the entire area of the target pixel by irradiating the laser beam while scanning the laser beam from the inside of the target pixel toward the corner portion of the pixel. Then, by processing the alignment film of the target pixel in this state, the end of the target pixel can be processed more reliably. In addition, by irradiating a laser that generates bubbles by dividing the plurality of times, it is possible to form bubbles uniformly throughout the entire target pixel even when there is a foreign substance in the pixel. Therefore, the alignment after the liquid crystal material LCM constituting the liquid crystal layer LCL of the pixel PIX returns to the original liquid crystal state after the pixel processing is disturbed without remaining in the corner portion of the pixel PIX, and light leakage is eliminated. It will be.

  In this example, the focused light is emitted from the approximate center of the pixel toward the corner in the first step. However, the collected light depends on the shape and structure of the pixel, the state of the bright spot, etc. The irradiation start position may be appropriately changed.

  The scanning of the entire pixel in the second step may be started from the short side or the long side of the pixel, but it is necessary to process in the presence of bubbles formed in the first step. It is.

  Here, the color filter used is a type formed on the counter substrate, but may be a type formed on the array substrate. In that case, in consideration of the deterioration of the color filter by the laser, it is preferable to irradiate the laser beam not from the array substrate side but from the counter substrate side.

  In this embodiment, the liquid crystal display device has been described by taking a transmission type as an example. In the case of the semi-transmissive type, processing of at least the transmissive part excluding the reflective part may be performed.

  Further, even a reflection type having no transmission part can be processed by laser irradiation from the counter substrate side.

  Further, this time, the spacers are used in the form of beads dispersed in the panel, but it goes without saying that the spacers can also be used when the spacers are of the type formed in a columnar shape.

(Example 2)
Next, a liquid crystal display device according to Embodiment 2 of the present invention will be described with reference to the drawings.

  It is smoother to irradiate the imaging laser beam with a wide spot slightly shifted from the focal position in the front-back direction of the laser beam path than the laser beam (focal point) focused by the lens system due to the state of the pixel, etc. In some cases, bubbles can be generated and expanded while suppressing unnecessary scratches on the pixels.

  As the process, as in the method of the first embodiment, the laser light is irradiated from the substantially central portion CEN of the pixel PIX to the corner of the pixel in the first process, and the entire pixel part is irradiated in the second process. In this case, the laser beam used in this process is a laser beam imaged in both steps.

From the array substrate ARP side, the imaged laser light 22 is scanned from the vicinity of the central portion CEN of the pixel PIX toward the pixel PIX corner portion from the light source installed above the pixel PIX with respect to the liquid crystal display device LCD. Irradiate (FIG. 6A).

The imaged laser light 22 irradiated at this time has an image formation size of 1 μm ² to 12 μm ² , more preferably 8 μm ² to 9 μm ² .

The laser energy is 0.01 mJ to 0.3 mJ, preferably 0.02 mJ to 0.12 mJ, and the irradiation interval is preferably 5 μm to 30 μm. Similarly, the thickness was set to 20 μm to 25 μm.

  Thereafter, the image forming laser beam 30 is irradiated to the entire pixel PIX while scanning from the array substrate ARP side in the same manner as in the first step, thereby processing both alignment films AAL and FAL corresponding to the pixel PIX (FIG. 6 ( b)).

  The imaged laser beam 31 to be used has the same image formation size and laser energy as the imaged laser beam 21.

  Note that the laser beam used to scan the whole may be a focused laser beam. In that case, scanning is performed under the same conditions as in the first embodiment.

  As described above, the method of expanding the bubbles to the pixel corner portion can be selected depending on the state of the pixel, and when scanning the entire pixel using the same laser beam, it is necessary to change the laser beam to be used. The merit of omitting can also be obtained.

(Example 3)
In the first and second embodiments, the first step is a step of generating the bubble BUB, and at the same time, the generated bubble BUB is expanded to cover the entire pixel PIX having the bright spot. By irradiating the imaged laser beam 21 to the pixel PIX before the operation, the liquid crystal material LCM constituting the liquid crystal layer LCL of the pixel PIX can be more reliably vaporized and the bubble BUB can be generated. .

  FIG. 7 is a schematic explanatory view of the third embodiment of the present invention when viewed in plan.

  Here again, the type used is a transmissive liquid crystal display device as in the first embodiment. (FIG. 7A).

At this time, the imaged laser beam 11 preferably has an imaging size of 18 μm ² to 24 μm ^2, and in this example, 24 μm ² . The laser energy is preferably 0.02 mJ to 0.12 mJ, similar to the focused laser beam 20 of the first embodiment. The imaged laser beam 21 is applied to the substantially central portion CEN of the pixel PIX. Thereby, the liquid crystal material LCM constituting the liquid crystal layer LCL of the pixel PIX can be vaporized, and the bubble BUB can be generated more reliably.

The process after the bubble BUB is generated in the entire pixel PIX is the same as the method described in the first embodiment, and the laser light 20 condensed on the liquid crystal display device LCD from the array substrate ARP is used as the pixel PIX. Irradiation is performed while scanning toward the corner portion of the pixel PIX from the vicinity of the substantially central portion CEN of FIG.

  After that, the alignment film AAL and FAL corresponding to the pixel PIX are processed by irradiating the entire pixel PIX with the focused laser beam 30 while scanning from the array substrate ARP side as in the first step (FIG. 7C). )).

It should be noted that if the imaged laser beam 21 is irradiated at a substantially central portion of the pixel PIX, it is considered that bubbles are likely to be scattered throughout. However, the shape or configuration of the pixel or wiring, the state of the bright spot, etc. It may be changed as appropriate.

  In addition, as in the first embodiment, it is preferable that only the corner portion where the transistor TRA is located be 2 μm to 10 μm inside the pixel corner portion, and in this example 3 μm to 6 μm. The inside. Also, the irradiation by the entire scanning may be performed by scanning from the outer peripheral portion CIR of the pixel PIX by 4.5 μm to 5 μm.

  Here, for the same reason as in the second embodiment, the irradiation of the laser beam to the pixel corner portion and the irradiation of the entire pixel can be made not to the focused laser beam but to an imaged laser beam. In that case, it is good to carry out on the same conditions as Example 2.

  Further, it is also possible to perform irradiation on the entire corner portion with a focused laser beam and image formation on the whole with a focused laser beam. Also in this case, the laser light under the above-mentioned conditions is used.

  By this method, the liquid crystal material LCM constituting the liquid crystal layer LCL of the pixel PIX can be vaporized more reliably, and as a result, the correction accuracy of the pixel PIX having a bright spot can be improved.

Example 4
In the third embodiment, the imaged laser light irradiated on the substantially central portion of the pixel can be irradiated to a plurality of locations depending on the shape of the pixel PIX having a bright spot.

FIG. 8 is a schematic explanatory view of the fourth embodiment of the present invention when viewed in plan.

When there is a wiring such as a Cs line in a pixel PIX equivalent part having a bright spot, it is desirable to avoid irradiating the wiring equivalent part with a laser beam. Therefore, for example, assuming that the pixel PIX having the bright spot is conceptually divided into the pixel PIXA and the pixel PIXB with the wiring WIR as a boundary, the laser beams imaged on the respective substantially center portions CENA and CENB of the pixels PIXA and PIXB, respectively. 11A and 11B are irradiated (FIG. 8A).

In this case, as in the first embodiment, a transmission type liquid crystal display device was used, the laser beam 11A and 11B was imaged, it is preferable to the imaging size as 24 [mu] m ² respectively from 18 [mu] m ² here, In this example, it is 24 μm ² . The laser energy is preferably 0.02 mJ to 0.12 mJ, similar to the focused laser beam in Example 1, and in this example 0.045 mJ.

Further, in this case, it is desirable to avoid the portion of the wiring WIR for the irradiation toward the corner portion, and each pixel PIX is irradiated on the assumption that it is conceptually divided into PIXA and PIXB (FIG. 8B).

Subsequent scanning with the condensed laser beam 30 needs to be performed while avoiding the wiring-corresponding portion, but the other processes are the same as those in the first embodiment (FIG. 8C).

  Also in this case, the laser beam 20 focused toward the PIXA corner portion and the PIXB corner portion is irradiated from the vicinity of the substantially central portions CENA and CENB. However, the final irradiation ends of the wiring portion WIR and the corner portion are also performed. As in Example 1, it is preferable that only the corner portion where the transistor TRA is located is 3 μm to 6 μm inside from the pixel corner portion, and in this example, it is 4.5 μm to 5 μm inside. Further, the irradiation by the whole scanning may be performed by scanning from the outer peripheral portion CIR and the wiring portion WIR of the pixel PIX by 4.5 μm to 5 μm.

In this example, the irradiation positions of the imaged laser beams 11A and 11B are PIXA and PIXB, which are substantially divided from the pixel PIX, but are substantially center portions CENA and CENB. Further, it may be appropriately changed depending on the state of the bright spot. In addition, although the imaged laser light is irradiated at two locations by conceptually dividing the pixel into two in this embodiment, it may be three or more depending on the shape and configuration of the pixel.

In addition, although the irradiation start position of the focused laser beam 20 on the pixel PIX corner portion is set near the center portions CENA and CENB, it may be appropriately changed depending on the shape and configuration of the pixel, the state of the bright spot, and the like. .

By this method, even if there is a wiring in the pixel PIX equivalent part, it is possible to process a pixel having a bright spot more reliably without damaging the wiring.

(Example 5)
When a multi-gap CF having a difference in the thickness of the CF (color filter) depending on the color of the pixel is formed on the counter substrate FAP side, the generated bubble BUB is brightened due to the difference in thickness. In some cases, the pixel PIX portion having a point moves to an adjacent pixel instead of the pixel PIX portion. As a result, the pixel PIX having a bright spot cannot be corrected, and it is necessary to stay within the range covering the pixel PIX having the bright spot.

  FIG. 9 is a schematic explanatory view of the fifth embodiment of the present invention when viewed in plan.

  In the pixel PIX, a red color filter CFR is formed on the counter substrate FAP. The red color filter CFR is thicker than the blue and green color filters CFB and CFG, and has a smaller gap between the array substrate ARP and the counter substrate FAP than the other two-color pixels. Therefore, when this red pixel has a bright spot, even if a bubble BUB is generated, it is likely to move to an adjacent blue or green pixel having a larger inter-substrate gap than this red pixel.

  Therefore, when it is confirmed that the red pixel has a bright spot, first, the imaged laser beams 111 and 112 are irradiated on the vicinity of the pixel PIX1 and PIX2 adjacent to the pixel PIX, respectively (FIG. 9 (a)).

  At this time, instead of directly irradiating the imaged laser beams 111 and 112 onto the adjacent pixels PIX1 and PIX2, the pixels PIX1 and PIX2 having the bright spot are irradiated onto the adjacent pixels PIX1 and PIX2. On the other hand, it is for preventing the bad influence by irradiating a laser beam.

At this time, the imaged laser beams 111 and 112 are preferably positioned at an inner position of 2 μm to 6 μm from the outer peripheral portion CIR of the pixel, and more preferably from 4.5 μm to 5 μm. The imaging size is preferably 10 μm ² to 20 μm ² , and in this example, it is 18 μm ² .

  Then, the generated bubbles BUB1 and BUB2 are intentionally moved to the adjacent pixels PIX1 and PIX2, respectively (FIG. 9B).

When the generated bubbles BUB1 and BUB2 exist, the imaged laser beam 11 is irradiated to generate bubbles BUB in the pixel PIX having a bright spot. Then, the bubbles BUB cannot move to other adjacent pixels because the bubbles BUB1 and BUB2 become walls (FIG. 9C).

In this way, after fixing the bubble BUB on the pixel PIX, a step of irradiating the corner portion of the pixel PIX with laser light (FIG. 9D) and a step of scanning the entire pixel with the laser light (FIG. 9). (E)) is performed in the same manner as in any one of Examples 1 to 3. Irradiation to the corner portion and overall scanning can be selected as appropriate depending on the state of the pixel, whether the laser beam is focused or imaged.

By this method, even when a step with an adjacent pixel is generated by CF, the generated bubble does not move to the adjacent pixel but stays on the pixel having the bright spot, and the bubble is generated in the adjacent pixel. Since there is no adverse effect due to the occurrence, a pixel having a bright spot can be processed safely and reliably.

In this example, the red CF is the thickest and the blue and green CFs are thinner than that, but it goes without saying that any CF can be applied.

Further, in this example, the bubbles generated only on the pixels adjacent to the short side are moved, but it is also possible to generate and move only on the long side, or to generate and move on all four sides. It can be carried out under the same conditions.

In addition, when the liquid crystal display device is a transflective type, and the multi-gap type in which the gap of the transmissive part is wide and the gap of the reflective part is narrower than that of the transmissive part, if the bubble is generated in the transmissive part, the reflective part becomes a wall. Since the bubbles stay in place without escaping, subsequent processing can be easily performed.

In addition, when the liquid crystal display device is a transflective type and the multi-gap type in which the gap of the transmissive part is narrow and the gap of the reflective part is wider than that of the transmissive part, the gap between the substrates is wide when generating bubbles in the transmissive part. Air bubbles easily escape to the reflective part. Therefore, as described above, bubbles BUB1 and BUB2 for fixing bubbles are generated at the end of the transmission part. Then, the step of generating the bubble BUB in the transmission part, the step of irradiating the laser beam toward the end of the transmission part, and the step of processing the transmission part are sequentially performed.

According to the above method, even in the multi-gap type, a pixel having a bright spot can be surely processed without letting bubbles escape to adjacent pixels.

(Example 6)
10 (a), (b), (c), and (d) show Example 6 of the present invention. In addition, the part of the same code | symbol as another Example shows a similar part. In the present embodiment, laser repair processing will be described in the case where foreign matter is present between electrodes of a specific display pixel and normal alignment control cannot be performed. As shown to (a), when there exists a foreign material, normal orientation control cannot be performed in the foreign material periphery A, and the foreign material defect used as a luminescent spot at the time of black display may generate | occur | produce. In the laser repair of this embodiment, foreign matter pulverization is performed before the bubble growth and orientation disturbance process.

  First, in step (a), the foreign matter F is irradiated with laser to pulverize the foreign matter. As a result, as shown in (b), liquid crystal bubbles are generated around the foreign matter in the pixel portion during pulverization, and the crushed foreign matter is scattered in a range of the generated bubbles and adheres to both electrode surfaces of the pixel.

  Subsequently, as shown in (c), laser light is irradiated from the center of the pixel to the corner as in the first embodiment, and the liquid crystal is vaporized to generate bubbles on the entire surface of the specific pixel. In the state where the bubbles are generated, as shown in (d), the alignment film on the electrode is evaporated and the alignment is disturbed by meandering scanning in zigzag manner with the spot of the laser beam condensed on the entire pixel surface. Thereby, the scattered matter of the alignment film adheres to both electrode surfaces, and the orientation of the entire pixel surface can be lowered.

  The crushed foreign matter only needs to be equal to or smaller than the spacer that determines the thickness of the liquid crystal layer, and the pixels can be deactivated and black spots can be made with the same success rate as the repair without the foreign matter.

1 is a schematic cross-sectional view of one pixel of a liquid crystal display device showing a laser beam irradiation direction of the present invention. The schematic plan view for demonstrating each step of Example 1 of this invention. Expansion explanatory drawing of the irradiation state to a pixel corner part. Expansive explanatory drawing which shows the distance between each center point of the Nth and N + 1th of the condensed laser beam. The expanded explanatory view which shows the distance from the peripheral part of the pixel of the condensed laser beam. The schematic plan view for demonstrating each step of Example 2 of this invention. The schematic plan view for demonstrating each step of Example 3 of this invention. The schematic plan view for demonstrating each step of Example 4 of this invention. The schematic plan view for demonstrating each step of Example 5 of this invention. The schematic plan view for demonstrating each step of Example 6 of this invention.

Explanation of symbols

11 laser beam 20, 30 focused laser beam 21, 31 laser beam 111, 112 focused laser beam ARP array substrate FAP counter substrate AGP array side glass substrate FGP counter side glass substrate APP, FPP array Side, counter side polarizing plate GIN Gate insulating film AIT Pixel electrode FIT Counter electrode AAL, FAL Array side, counter side alignment film TRA Transistor LCL Liquid crystal layer LCM Liquid crystal materials CFR, CFG, CFB constituting the liquid crystal layer Color filter (red), (Green), (blue)
LCD Liquid crystal display device PIX One pixel CIR of liquid crystal display device Peripheral portion CEN of pixel Center portion of pixel CRN Corner portion of pixel CENA Center portion of conceptually divided pixel CENB Central portion of conceptually divided pixel B BUB Bubble WIR wiring PIX1-8 Pixel having a bright spot DIC adjacent to the pixel DIC Distance between the pixel outer periphery and the laser light DIT Distance between the transistor and the laser light DIS2 Nth condensed light and N + 1th condensed light Distance between center points F Foreign matter

Claims (8)

A plurality of pixel electrodes are arranged in a matrix on one main surface of the substrate, an array substrate having a first alignment film on the pixel electrode, and a counter electrode on one main surface arranged to face the array substrate, A counter substrate having a second alignment film on the counter electrode, and a liquid crystal layer made of a liquid crystal material sandwiched between the array substrate and the counter substrate via the first and second alignment films, and each of the pixels A method of manufacturing a liquid crystal display device including a plurality of display pixels configured by an electrode, the liquid crystal layer corresponding to the pixel electrode, and the counter electrode,
The liquid crystal of the liquid crystal layer corresponding to the one display pixel is irradiated by irradiating one of the plurality of display pixels having a bright spot while scanning a laser beam in a plane from the inside toward the corner portion. A first step of vaporizing the material;
And a second step of processing the alignment interface in which the liquid crystal material corresponding to the one display pixel is arranged in a predetermined direction by irradiating with a laser beam. It is a manufacturing method of the liquid crystal display device according to claim 1,
The irradiation of the laser light in the first step is a step of irradiating from the array substrate side toward the counter substrate side,
The method of manufacturing a liquid crystal display device, wherein the laser beam irradiation in the second step is a step of irradiating from the array substrate side toward the counter substrate side. A manufacturing method of a liquid crystal display device according to claim 1 or 2,
A method for manufacturing a liquid crystal display device, wherein the laser beam irradiation in the first or second step uses a focused laser beam. A method for manufacturing a liquid crystal display device according to claim 1, wherein:
A method for manufacturing a liquid crystal display device, wherein the laser beam irradiation in the first or second step uses an imaged laser beam. A method for manufacturing a liquid crystal display device according to claim 1, wherein:
A method of manufacturing a liquid crystal display device comprising a preliminary irradiation step of irradiating the one display pixel having the bright spot with a laser beam before the first step. It is a manufacturing method of the liquid crystal display device according to claim 5,
The method of manufacturing a liquid crystal display device, wherein the preliminary irradiation step is a step of irradiating the imaged laser light from the array substrate side toward the counter substrate side. It is a manufacturing method of the liquid crystal display device of any one of Claim 5 or 6, Comprising:
A method of manufacturing a liquid crystal display device, wherein the preliminary irradiation step irradiates a plurality of locations of the one display pixel having the bright spot with laser light. It is a manufacturing method of the liquid crystal display device of any one of Claim 6 or 7,
The method of manufacturing a liquid crystal display device, wherein the preliminary irradiation step includes a second preliminary irradiation step of irradiating laser light imaged in the vicinity of an end portion of the display pixel having the bright spot.

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