JP2006121067A5 - - Google Patents
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- Publication number
- JP2006121067A5 JP2006121067A5 JP2005290364A JP2005290364A JP2006121067A5 JP 2006121067 A5 JP2006121067 A5 JP 2006121067A5 JP 2005290364 A JP2005290364 A JP 2005290364A JP 2005290364 A JP2005290364 A JP 2005290364A JP 2006121067 A5 JP2006121067 A5 JP 2006121067A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61537004P | 2004-10-01 | 2004-10-01 | |
| US11/239,967 US7692316B2 (en) | 2004-10-01 | 2005-09-30 | Audio amplifier assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006121067A JP2006121067A (ja) | 2006-05-11 |
| JP2006121067A5 true JP2006121067A5 (enExample) | 2008-12-18 |
Family
ID=36205467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005290364A Pending JP2006121067A (ja) | 2004-10-01 | 2005-10-03 | 可聴周波数増幅器アッセンブリ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7692316B2 (enExample) |
| JP (1) | JP2006121067A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7569927B2 (en) * | 2005-09-21 | 2009-08-04 | Microsemi Corporation | RF power transistor package |
| US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
| DE102007007142B4 (de) * | 2007-02-09 | 2008-11-13 | Infineon Technologies Ag | Nutzen, Halbleiterbauteil sowie Verfahren zu deren Herstellung |
| US7880280B2 (en) * | 2007-02-16 | 2011-02-01 | Infineon Technologies Ag | Electronic component and method for manufacturing an electronic component |
| US8710665B2 (en) | 2008-10-06 | 2014-04-29 | Infineon Technologies Ag | Electronic component, a semiconductor wafer and a method for producing an electronic component |
| US9728868B1 (en) | 2010-05-05 | 2017-08-08 | Cree Fayetteville, Inc. | Apparatus having self healing liquid phase power connects and method thereof |
| DE102014205958A1 (de) * | 2014-03-31 | 2015-10-01 | Lemförder Electronic GmbH | Halbleiterschaltelementanordnung und Steuergeräteinrichtung für ein Fahrzeug |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08124685A (ja) | 1994-10-26 | 1996-05-17 | Matsushita Electric Works Ltd | 電力増幅回路 |
| JP2002534933A (ja) | 1999-01-07 | 2002-10-15 | サーノフ コーポレイション | プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器 |
| US6624522B2 (en) * | 2000-04-04 | 2003-09-23 | International Rectifier Corporation | Chip scale surface mounted device and process of manufacture |
| JP4085563B2 (ja) | 2000-08-24 | 2008-05-14 | 富士電機ホールディングス株式会社 | パワー半導体モジュールの製造方法 |
| US6545533B2 (en) * | 2000-12-18 | 2003-04-08 | Texas Instruments Incorporated | Class D audio speaker amplifier circuit with pseudo noise modulation |
| US7119447B2 (en) * | 2001-03-28 | 2006-10-10 | International Rectifier Corporation | Direct fet device for high frequency application |
| JP4235417B2 (ja) | 2002-08-30 | 2009-03-11 | 岡谷電機産業株式会社 | 表面実装型電子部品及びその製造方法 |
| US6841865B2 (en) | 2002-11-22 | 2005-01-11 | International Rectifier Corporation | Semiconductor device having clips for connecting to external elements |
| US7095099B2 (en) * | 2003-11-12 | 2006-08-22 | International Rectifier Corporation | Low profile package having multiple die |
-
2005
- 2005-09-30 US US11/239,967 patent/US7692316B2/en not_active Expired - Fee Related
- 2005-10-03 JP JP2005290364A patent/JP2006121067A/ja active Pending